Composite electronic components

Abstract

The present disclosure provides a composite electronic component, the composite electronic component including a composite body having a multilayer ceramic capacitor and a ceramic sheet, the multilayer ceramic capacitor including a first ceramic body and a first external electrode and a second external electrode disposed on both ends of the first ceramic body, a plurality of dielectric layers and an internal electrode are stacked in the first ceramic body, the internal electrodes are disposed opposite to each other and a corresponding one of the plurality of dielectric layers is interposed between the internal electrodes; the ceramic sheet is disposed under the multilayer ceramic capacitor and includes a second ceramic body including ceramic and a first terminal electrode and a second terminal electrode disposed on both ends of the second ceramic body and connected to the first external electrode and the second external electrode, respectively. A ratio G1 / M1 of a spacing distance G1 between the first ceramic body and the second ceramic body in a thickness direction and a length M1 of an edge portion between the internal electrode and a lower surface of the first ceramic body satisfies 1.0 to 2.5.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0152177 filed on November 25, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a composite electronic component. Background Art

[0003] Multilayer ceramic capacitors (a type of electronic multilayer chip components) can be chip capacitors mounted on circuit substrates of various electronic products (such as imaging devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, personal digital assistants (PDAs), mobile phones, etc.), and can be charged or discharged.

[0004] Since a multilayer ceramic capacitor (MLCC) may be small in size, may ensure high capacitance, and may be easily mounted, such an MLCC may be used as a component of various electronic devices.

[0005] The MLCC may have a structure in which a plurality of dielectric layers may be alternately stacked and internal electrodes having different polarities may be disposed between the dielectric layers.

[0006] Since the dielectric layer has piezoelectricity and total distortion, when a DC voltage or an AC voltage is applied to the MLCC, a piezoelectric phenomenon occurs between the internal electrodes, causing vibrations to occur.

[0007] Such vibrations may be transferred through the external electrodes of the MLCC to the circuit substrate on which the MLCC is mounted, so that the entire circuit substrate may become a sound reflecting surface and may generate vibration sounds, which may be experienced as noise.

[0008] Vibration sounds may be in the audible frequency range between 20 Hz and 20,000 Hz, and such vibration sounds that cause discomfort to the listener are referred to as acoustic noise.

[0009] When electronic devices have been designed to have a slim and reduced size and have been used together with printed circuit boards in an environment where voltage is relatively high and voltage variations are relatively large, such acoustic noise may be perceived by users.

[0010] Therefore, there is a continuing need for products having reduced acoustic noise.

[0011] In order to reduce acoustic noise, research has been conducted on composite electronic components using a substrate on the lower surface of an MLCC.

[0012] However, specific research on the size of MLCC, the mounting method, the size of the ceramic sheet set in the lower part, and the degree of removal of acoustic noise according to the size of the electrode has not been properly conducted. Therefore, it is necessary to study the critical value related to the degree of influence of acoustic noise according to the distance between the MLCC and the ceramic sheet set on the lower surface and the length of the lower edge portion set in the MLCC. Summary of the invention

[0013] An aspect of the present disclosure is to provide a composite electronic component that can reduce acoustic noise.

[0014] According to one aspect of the present disclosure, a composite electronic component includes a composite body, the composite body including a multilayer ceramic capacitor and a ceramic sheet, the multilayer ceramic capacitor including a first ceramic body and a first external electrode and a second external electrode disposed on both ends of the first ceramic body, a plurality of dielectric layers and an internal electrode are stacked in the first ceramic body, the plurality of dielectric layers are disposed opposite to each other and a corresponding one of the plurality of dielectric layers is interposed between the internal electrodes; the ceramic sheet is disposed under the multilayer ceramic capacitor and includes a second ceramic body including ceramic and a first terminal electrode and a second terminal electrode disposed on both ends of the second ceramic body and connected to the first external electrode and the second external electrode, respectively. A ratio (G1 / M1) of a spacing distance (G1) between the first ceramic body and the second ceramic body in a thickness direction to a length (M1) of an edge portion between the internal electrode and a lower surface of the first ceramic body satisfies 1.0 to 2.5.

[0015] According to another aspect of the present disclosure, a composite electronic component includes a composite body, the composite body includes a multilayer ceramic capacitor and a ceramic sheet, the multilayer ceramic capacitor includes a first ceramic body and a first external electrode and a second external electrode disposed on both ends of the first ceramic body, a plurality of dielectric layers and internal electrodes are stacked in the first ceramic body, the internal electrodes are disposed opposite to each other and a corresponding one of the plurality of dielectric layers is interposed between the internal electrodes; the ceramic sheet is disposed below the multilayer ceramic capacitor and includes a second ceramic body including ceramic and a first terminal electrode and a second terminal electrode disposed on both ends of the second ceramic body and connected to the first external electrode and the second external electrode, respectively. The length (M1) of the edge portion between the internal electrode and the lower surface of the first ceramic body and the spacing distance (G1) between the first ceramic body and the second ceramic body in the thickness direction satisfy M1. <G1。 BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0017] Figure 1 is a perspective view showing a composite electronic component according to a first exemplary embodiment of the present disclosure;

[0018] Figure 2 It is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0019] Figure 3 It is along Figure 1 A cross-sectional view taken along line II-II' in FIG.

[0020] Figure 4 is an exploded perspective view showing a composite electronic component divided into a multilayer ceramic capacitor and a ceramic sheet. DETAILED DESCRIPTION

[0021] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0022] However, the present disclosure can be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. More specifically, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Therefore, for clear description, the shapes and sizes of the elements in the accompanying drawings may be exaggerated. In addition, within the scope of the same concepts represented in the accompanying drawings of each exemplary embodiment, elements with the same functions will be described using the same reference numerals.

[0023] The values ​​of parameters used to describe such as one-dimensional dimensions of an element (including but not limited to "length", "width", "thickness", "diameter", "distance", "gap" and / or "size"), two-dimensional dimensions of an element (including but not limited to "area" and / or "size"), three-dimensional dimensions of an element (including but not limited to "volume" and / or "size"), and properties of an element (including but not limited to "roughness", "density", "weight", "weight ratio" and / or "molar ratio") can be obtained by the methods and / or tools described in the present disclosure. However, the present disclosure is not limited thereto. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may also be used.

[0024] Composite electronic components

[0025] Figure 1 is a perspective view showing a composite electronic component according to a first exemplary embodiment.

[0026] Figure 2 It is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0027] Figure 3 It is along Figure 1 A cross-sectional view taken along line II-II'.

[0028] Reference Figure 1 , regarding the composite electronic component in the example embodiment, a “length direction” may be defined as an “L direction”, a “width direction” may be defined as a “W direction”, and a “thickness direction” may be defined as a “T direction”. The “thickness direction” may be the same as a “stacking direction” along which the ceramic sheets and the multilayer ceramic capacitors are stacked.

[0029] In addition, in example embodiments, the composite electronic component may have an upper surface and a lower surface opposite to each other, and a first side surface and a second side surface disposed in a length direction, and a third side surface and a fourth side surface disposed in a width direction, the first side surface and the second side surface and the third side surface and the fourth side surface connecting the upper surface and the lower surface. The shape of the composite electronic component is not limited to any specific shape, but may have a hexahedral shape as shown in the figure.

[0030] In addition, the first side surface and the second side surface of the composite electronic component arranged in the length direction may be arranged in the same direction as the first side surface and the second side surface of the multilayer ceramic capacitor and the ceramic sheet arranged in the length direction, and the third side surface and the fourth side surface of the composite electronic component arranged in the width direction may be arranged in the same direction as the third side surface and the fourth side surface of the multilayer ceramic capacitor and the ceramic sheet arranged in the width direction.

[0031] In addition, in the composite electronic component, the multilayer ceramic capacitor and the ceramic sheet may be combined with each other. When the ceramic sheet is combined with the lower portion of the multilayer ceramic capacitor, the upper surface of the composite electronic component may be defined as the upper surface of the multilayer ceramic capacitor, and the lower surface of the composite electronic component may be defined as the lower surface of the ceramic sheet.

[0032] Reference Figure 1 and Figure 2, the composite electronic component in the first exemplary embodiment may include a composite body 300, the composite body 300 includes a multilayer ceramic capacitor 100 and a ceramic sheet 200, the multilayer ceramic capacitor 100 includes a first ceramic body 110 and first and second external electrodes 131 and 132 disposed on both ends of the first ceramic body 110, a plurality of dielectric layers 111 and internal electrodes 121 and 122 disposed opposite to each other with the dielectric layer 111 interposed therebetween are stacked in the first ceramic body 110, the ceramic sheet 200 is disposed below the multilayer ceramic capacitor 100, and the ceramic sheet 200 includes a second ceramic body 210 including a ceramic and first and second terminal electrodes 231 and 232, the first and second terminal electrodes 231 and 232 are disposed on both ends of the second ceramic body 210 and are connected to the first and second external electrodes 131 and 132, respectively, and the multilayer ceramic capacitor 100 and the ceramic sheet 200 are bonded to each other at the first and second terminal electrodes 231 and 232.

[0033] The ceramic may include aluminum oxide (Al2O3).

[0034] Typically, in order to reduce vibrations of a multilayer ceramic capacitor that may be transferred to a printed circuit board, an intermediate dielectric may be inserted between the multilayer ceramic capacitor and the board.

[0035] Such an intermediate medium can be realized by the resin used to manufacture the substrate, and since the intermediate medium is formed using a material having elasticity, the intermediate medium can absorb vibration of the multilayer ceramic capacitor by its elasticity.

[0036] Unlike the general construction described above, in the first exemplary embodiment, since the second ceramic body 210 of the ceramic sheet 200 is made of ceramic including aluminum oxide (Al2O3), which does not have elastic variation and is a hard material, the printed circuit board and the multilayer ceramic capacitor 100 can be separated from each other by the ceramic sheet 200, and thus, the vibration transmitted from the multilayer ceramic capacitor 100 can be blocked.

[0037] In example embodiments, a ratio (G1 / M1) of a spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in a thickness direction to a length (M1) of an edge portion between the internal electrodes 121 and 122 and a lower surface of the first ceramic body 110 may satisfy 1.0 to 2.5. In other words, the ratio may satisfy 1.0≤G1 / M1≤2.5.

[0038] In one example, the spacing distance ( G1 ) may represent a size of a space between the first and second ceramic bodies 110 and 210 in the thickness direction T, and may be one of an average size, a maximum size, and a size measured at a center portion of the composite body 300 .

[0039] In one example, the spacing distance (G1) may be determined by defining a predetermined number (e.g., 5) of points to the left and a predetermined number (e.g., 5) of points to the right at equal intervals (optionally, or unequal intervals) from a reference center point of the space between the first ceramic body 110 and the second ceramic body 210 based on an image of a cross section cut in the LT plane scanned by, for example, a scanning electron microscope (SEM), and measuring the size of the space in the thickness direction T at equal intervals (optionally, or unequal intervals), and thereby obtaining an average value. The reference center point may have the same distance as the opposite edge in the cut cross section, or may have substantially the same distance in consideration of a measurement error. In this case, the spacing distance (G1) may be an average value. Alternatively, the spacing distance (G1) may be determined and measured in the WT plane. The length (M1) (or size) of the edge portion between the inner electrode 121 or 122 and the lower surface of the first ceramic body 110 in the thickness direction T may be defined similarly to the spacing distance (G1).

[0040] Alternatively, the spacing distance (G1) may be determined by defining a predetermined number (e.g., 5) of points to the left and a predetermined number (e.g., 5) of points to the right at equal intervals (optionally, or unequal intervals) from a reference center point of the space between the first ceramic body 110 and the second ceramic body 210 based on an image of a cross section cut in the LT plane scanned by, for example, a scanning electron microscope (SEM), measuring the size of the space at equal intervals (optionally, or unequal intervals), and thereby obtaining a maximum value. In this case, the spacing distance (G1) may be the maximum distance. Alternatively, the spacing distance (G1) may be determined and measured in the WT plane. The length (M1) (or size) of the edge portion between the inner electrode 121 or 122 and the lower surface of the first ceramic body 110 in the thickness direction T may be defined similarly to the spacing distance (G1).

[0041] Alternatively, the spacing distance (G1) may be the size of a space at a reference center point based on an image of a cross section cut in the LT plane scanned by, for example, a scanning electron microscope (SEM). The reference center point may have the same distance as the relative edges in the cut cross section, or substantially the same distance in consideration of measurement errors. Alternatively, the spacing distance (G1) may be determined and measured in the WT plane. The length (M1) (or size) of the edge portion between the inner electrode 121 or 122 and the lower surface of the first ceramic body 110 in the thickness direction T may be defined similarly to the spacing distance (G1).

[0042] In order to reduce acoustic noise, research has been conducted on composite electronic components using a substrate on the lower surface of a multilayer ceramic capacitor.

[0043] However, specific research on the size of the multilayer ceramic capacitor, the mounting method, the size of the ceramic sheet disposed in the lower part of the composite body, and the degree of removal of acoustic noise according to the size of the electrode has not been properly conducted. Therefore, it is necessary to study the critical value of the degree of influence of acoustic noise related to the distance between the multilayer ceramic capacitor and the ceramic sheet disposed on the lower surface and the length of the edge portion between the internal electrode disposed in the multilayer ceramic capacitor and the lower surface of the multilayer ceramic capacitor, and the numerical value of the critical value has been suggested in the exemplary embodiment.

[0044] While studying exemplary embodiments, it has been found that the distance between a ceramic sheet adhered to the lower surface of a multilayer ceramic capacitor to reduce acoustic noise and the multilayer ceramic capacitor, that is, the distance in the thickness direction between the second ceramic body of the ceramic sheet and the first ceramic body of the multilayer ceramic capacitor may be correlated with the acoustic noise generated by the vibration of the multilayer ceramic capacitor.

[0045] The greater the distance in the thickness direction between the first ceramic body of the multilayer ceramic capacitor and the second ceramic body of the ceramic sheet, the more the magnitude of the vibration of the multilayer ceramic capacitor transmitted to the ceramic sheet can be reduced, thereby reducing noise, and when the distance increases to a predetermined limit point or further increases, the effect of reducing noise may not increase.

[0046] Furthermore, since there may be limitations on the size of a product in design, particularly limitations on the height of a product, an appropriate distance should be determined in consideration of the effect of reducing acoustic noise.

[0047] Furthermore, in the composite electronic component in example embodiments, internal electrodes of the multilayer ceramic capacitor may be stacked perpendicularly to the mounting surface of the composite body.

[0048] In this case, the area of ​​the lower edge portion of the multilayer ceramic capacitor (i.e., the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110) where the internal electrodes are not printed can be used as an intermediate medium, which transmits the vibration generated from the area where the internal electrodes are provided to the ceramic sheet provided under the multilayer ceramic capacitor.

[0049] The transmission mechanism of vibration of the multilayer ceramic capacitor may be affected by the correlation between the length (M1) of the lower edge portion in the first ceramic body 110 of the multilayer ceramic capacitor 100 and the spacing distance (G1) in the thickness direction between the second ceramic body 210 of the ceramic sheet 200 and the first ceramic body 110 of the multilayer ceramic capacitor 100, and therefore, there may be a difference in acoustic noise.

[0050] In a first exemplary embodiment, by adjusting the ratio (G1 / M1) of the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body to satisfy 1.0 to 2.5, the acoustic noise can be significantly reduced.

[0051] In other words, when G1 and M1 satisfy G1 / M1 ≥ 1.0, the acoustic noise can be reduced, and when the ratio (G1 / M1) of the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body exceeds 2.5, that is, for example, when G1 and M1 satisfy G1 / M1 > 2.5, the effect of reducing noise is not obvious.

[0052] In addition, when the value of G1 / M1 increases, the size of the composite electronic component can also increase. Therefore, according to the first exemplary embodiment, when the ratio (G1 / M1) of the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body satisfies 1.0 to 2.5, the effect of reducing noise can be optimal.

[0053] When the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110 and the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 satisfy M1 < G1, the piezoelectric phenomenon of the multilayer ceramic capacitor can be effectively prevented, thereby improving the effect of reducing acoustic noise.

[0054] According to the first exemplary embodiment, the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 can satisfy 30 μm ≤ G1 ≤ 120 μm.

[0055] By adjusting the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to satisfy 30 μm ≤ G1 ≤ 120 μm, the acoustic noise can be reduced.

[0056] The more the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 increases, the more the acoustic noise can be reduced. However, when the spacing distance (G1) increases excessively, the size of the composite electronic component may increase. Therefore, G1 may have an upper limit value due to limitations in product height.

[0057] In other words, when the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction is less than 30 μm, the effect of reducing acoustic noise may be insufficient, and when the spacing distance (G1) exceeds 120 μm, the size of the product may increase, which may not be preferred.

[0058] More preferably, a spacing distance ( G1 ) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction may satisfy 50 μm≦G1≦100 μm.

[0059] By adjusting the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction to satisfy 50 μm≤G1≤100 μm, the effect of reducing acoustic noise may be improved.

[0060] When the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction is less than 50 μm, the effect of reducing acoustic noise may be insufficient, and when the spacing distance (G1) exceeds 100 μm, the size of the product may increase, which may not be preferred.

[0061] In the following description, the multilayer ceramic capacitor 100 and the ceramic sheet 200 included in the composite body 300 will be described in more detail.

[0062] Reference Figure 2 , the first ceramic body 110 included in the multilayer ceramic capacitor 100 may be formed by stacking a plurality of dielectric layers 111, and a plurality of internal electrodes 121 and 122 (first internal electrodes and second internal electrodes, respectively) may be disposed in the first ceramic body 110 and may be spaced apart from each other with the dielectric layer 111 interposed between the internal electrodes 121 and 122.

[0063] The plurality of dielectric layers 111 included in the first ceramic body 110 may be in a sintered state, and boundaries between adjacent dielectric layers may be integrated with each other so that the boundaries may not be noticeable.

[0064] The dielectric layer 111 may be formed by firing a ceramic green sheet including ceramic powder, an organic solvent and an organic binder. The ceramic powder may have a high dielectric constant, and barium titanate (BaTiO3)-based materials, strontium titanate (SrTiO3)-based materials, etc. may be used as the ceramic powder, but are not limited thereto.

[0065] The dielectric layer 111 forming the first ceramic body 110 may include a ferroelectric material, but example embodiments thereof are not limited thereto.

[0066] According to the first example embodiment, the internal electrodes may include a first internal electrode 121 exposed to a first side surface disposed in the length direction of the composite body 300 and a second internal electrode 122 exposed to a second side surface disposed in the length direction, but example embodiments thereof are not limited thereto.

[0067] The first and second internal electrodes 121 and 122 may be formed using a conductive paste including a conductive metal.

[0068] The conductive metal may be implemented by nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof, but the conductive metal is not limited thereto.

[0069] The first and second internal electrodes 121 and 122 may be printed on the ceramic green sheet formed as the dielectric layer 111 by a printing method such as a screen printing method or a gravure printing method using a conductive paste.

[0070] The first ceramic body 110 may be formed by alternately stacking ceramic green sheets each having an internal electrode printed thereon and firing the ceramic green sheets.

[0071] A plurality of first and second internal electrodes 121 and 122 may be vertically disposed on upper and lower surfaces of the first ceramic body 110 .

[0072] The first and second external electrodes 131 and 132 may be formed by a conductive paste including a conductive metal, and the conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or an alloy thereof, but example embodiments thereof are not limited thereto.

[0073] A nickel / tin (Ni / Sn) plating layer may be further disposed on the first and second external electrodes 131 and 132 .

[0074] According to the first example embodiment, the ceramic sheet 200 may be coupled to the multilayer ceramic capacitor 100 and disposed under the multilayer ceramic capacitor 100 .

[0075] The ceramic sheet 200 may have a shape in which first and second terminal electrodes 231 and 232 connected to the first and second external electrodes 131 and 132 are disposed on both ends of a second ceramic body 210 manufactured in a bulk form using ceramic.

[0076] Conventionally, in order to reduce vibration of a multilayer ceramic capacitor transmitted to a printed circuit board, attempts have been made to insert an intermediate dielectric between the multilayer ceramic capacitor and the board.

[0077] The intermediate medium may be implemented by the resin used to manufacture the substrate, and since the intermediate medium is formed using a material having elasticity, the intermediate medium may absorb vibration of the multilayer ceramic capacitor by its elasticity.

[0078] Unlike the above-mentioned construction, in the first exemplary embodiment, the second ceramic body 210 of the ceramic sheet 200 may be manufactured using only hard ceramic that does not undergo elastic change, so that the printed circuit board and the multilayer ceramic capacitor 100 may be separated from each other by the ceramic sheet 200, thereby preventing the transmission of vibration generated from the multilayer ceramic capacitor 100.

[0079] According to a first example embodiment, the ceramic may include aluminum oxide (Al 2 O 3 ).

[0080] Since aluminum oxide (Al2O3) does not have piezoelectric properties, aluminum oxide (Al2O3) may prevent the transmission of vibration generated from the multilayer ceramic capacitor 100, and thus, the ceramic sheet 200 including aluminum oxide (Al2O3) may be disposed under the multilayer ceramic capacitor 100 and may reduce acoustic noise.

[0081] The first terminal electrode 231 and the second terminal electrode 232 may not be limited to any specific example. For example, the first terminal electrode 231 may have a double-layer structure including a first conductive resin layer disposed inside and a first plating layer disposed outside, and the second terminal electrode 232 may have a double-layer structure including a second conductive resin layer disposed inside and a second plating layer disposed outside.

[0082] According to the first exemplary embodiment, since the first terminal electrode 231 has a double-layer structure including the first conductive resin layer disposed inside as described above and the first plating layer disposed outside, and the second terminal electrode 232 has a double-layer structure including the second conductive resin layer disposed inside as described above and the second plating layer disposed outside, when external mechanical stress is applied, the stress can be prevented from being transferred to the multilayer ceramic capacitor 100 by the conductive resin layer used for the ceramic sheet 200 and the terminal electrodes 231 and 232 of the ceramic sheet 200, thereby preventing damage caused by cracks in the multilayer ceramic capacitor.

[0083] The first conductive resin layer and the second conductive resin layer may include a conductive metal and a thermosetting resin, but example embodiments thereof are not limited thereto. For example, the first conductive resin layer and the second conductive resin layer may include silver (Ag) and an epoxy resin.

[0084] In the multilayer ceramic capacitor according to the first example embodiment, a plurality of first and second internal electrodes 121 and 122 may be vertically disposed on upper and lower surfaces of the first ceramic body 110 .

[0085] Therefore, when the composite body 300 is mounted on a printed circuit board, the first internal electrode 121 and the second internal electrode 122 may be stacked perpendicular to the mounting surface. In one example, an element being perpendicular to another element may mean that the element is completely perpendicular to another element. Alternatively, taking into account identifiable errors that may occur during manufacturing or measurement, an element being perpendicular to another element may mean that the element is substantially perpendicular to another element.

[0086] Generally, when a voltage is applied to a multilayer ceramic capacitor, the ceramic body may expand and shrink in length, width, and thickness directions by a converse piezoelectric effect of a dielectric layer.

[0087] When the displacement of the length-width surface (LW surface), width-thickness surface (WT surface) and length-thickness surface (LT surface) of the ceramic body is measured by a laser Doppler vibrometer (LDV), the displacement may appear in the order of LW surface>WT surface>LT surface.

[0088] The displacement of the LT surface may be about 42% compared to the WT surface, which may appear to be smaller than the displacement of the WT surface. This is because, even if the same level of stress may be generated on the LT surface and the WT surface, since the LT surface may have a larger area than the WT surface, a similar level of stress may be distributed throughout a larger area, so that a relatively small deformation may occur.

[0089] Therefore, in a general multilayer ceramic capacitor, the amount of displacement on the LT surface can be minimized.

[0090] According to the first exemplary embodiment, by vertically stacking the first and second internal electrodes 121 and 122 on the upper and lower surfaces of the first ceramic body 110, when the composite body 300 is mounted on a printed circuit board, the first and second internal electrodes 121 and 122 can be disposed perpendicular to the mounting surface, thereby reducing the amount of vibration of the surface in contact with the ceramic sheet 200.

[0091] Figure 4 is an exploded perspective view showing a composite electronic component divided into a multilayer ceramic capacitor and a ceramic sheet.

[0092] The composite body 300 may be formed by bonding the multilayer ceramic capacitor 100 to the ceramic sheet 200 , and a method of forming the composite body 300 may not be limited to any specific method.

[0093] The method of forming the composite body 300 may include bonding the separately manufactured multilayer ceramic capacitor 100 to the ceramic sheet 200 using solder or a conductive adhesive 213 .

[0094] The conductive adhesive 213 may be implemented by a paste including a conductive metal and an epoxy resin, but example embodiments thereof are not limited thereto.

[0095] Reference Figure 4 , when the multilayer ceramic capacitor 100 and the ceramic sheet 200 are bonded to each other using solder or a conductive adhesive 213, the solder or a conductive adhesive 213 may be applied to the upper surfaces of the first terminal electrode 231 and the second terminal electrode 232, and may be bonded to the first external electrode 131 and the second external electrode 132 of the multilayer ceramic capacitor 100.

[0096] Solder or a conductive adhesive 213 may be applied to the upper surfaces of the first terminal electrode 231 and the second terminal electrode 232, and may be fixed on the lower surface of the multilayer ceramic capacitor 100 together with the ceramic sheet 200. Therefore, vibration of only the length-width surface (LW surface) of the first ceramic body 110 may be transferred to the ceramic sheet 200.

[0097] Therefore, stress and vibration generated from the multilayer ceramic capacitor that may be transferred to the ceramic sheet may be reduced, so that acoustic noise may be reduced.

[0098] A composite electronic component according to a second exemplary embodiment may include a composite body 300 including a multilayer ceramic capacitor 100 and first and second external electrodes 131 and 132 disposed on both ends of the first ceramic body 110, in which a plurality of dielectric layers 111 and internal electrodes 121 and 122 disposed opposite to each other with the dielectric layer 111 interposed therebetween are stacked, and a ceramic sheet 200 is disposed below the multilayer ceramic capacitor 100, and the ceramic sheet 200 includes a second ceramic body 210 including a ceramic and first and second terminal electrodes 231 and 232 disposed on both ends of the second ceramic body 210 and connected to the first and second external electrodes 131 and 132, respectively, and the multilayer ceramic capacitor 100 and the ceramic sheet 200 are bonded to each other at the first and second terminal electrodes 231 and 232. In addition, the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110 and the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction may satisfy M1. <G1。

[0099] When the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body 110 and the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 satisfy M1 < G1, the piezoelectric phenomenon of the multilayer ceramic capacitor can be effectively prevented, thereby improving the effect of reducing acoustic noise.

[0100] According to the second exemplary embodiment, the ratio (G1 / M1) of the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body may satisfy 1.0 < G1 / M1 ≤ 2.5.

[0101] Since the ratio (G1 / M1) of the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body satisfies 1.0 < G1 / M1 ≤ 2.5, the effect of reducing acoustic noise can be improved.

[0102] Descriptions of the features and elements that are the same as those in the first exemplary embodiment in the second exemplary embodiment will not be repeated.

[0103] In the following description, the embodiments will be described in more detail, but the embodiments of the present disclosure are not limited thereto.

[0104] Experimental Example

[0105] The composite electronic components in the following examples and comparative examples are manufactured as follows.

[0106] In the examples and comparative examples, a ceramic sheet is disposed below the multilayer ceramic capacitor, and the composite electronic component is manufactured according to the mounting form of the inner electrodes of the multilayer ceramic capacitor, and the acoustic noise values are compared according to the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 and the ratio (G1 / M1) of the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the inner electrodes 121 and 122 and the lower surface of the first ceramic body 110.

[0107] Specifically, Table 1 indicates an example in which the internal electrodes are stacked perpendicular to the mounting surface of the substrate, and compares the acoustic noise values ​​according to the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction and the ratio (G1 / M1) of the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction to the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110.

[0108] In the experiment, it was determined that when the acoustic noise value was 30 dBA or less, there was an effect of reducing the acoustic noise, and particularly, it was determined that when the acoustic noise value was equal to or less than 25 dBA, the effect of reducing the acoustic noise was significant.

[0109]

Table 1

[0110]

[0111]

[0112] *: Comparative example

[0113] Referring to Table 1 above, regarding samples 2, 3, 4, 9, 10, 11, 17 and 18 as embodiments, the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction satisfies 30μm≤G1≤120μm, and the ratio (G1 / M1) of the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction to the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110 satisfies 1.0 to 2.5, so that the acoustic noise value is relatively low.

[0114] In particular, when the ratio (G1 / M1) of the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 in the thickness direction to the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110 satisfies G1 / M1>1.0, the effect of reducing acoustic noise is improved.

[0115] Regarding samples 1, 5, 6, 7, 8, 12, 13, 14, 15 and 16 as comparative examples, the ratio (G1 / M1) of the spacing distance (G1) in the thickness direction between the first ceramic body 110 and the second ceramic body 210 to the length (M1) of the edge portion between the internal electrodes 121 and 122 and the lower surface of the first ceramic body 110 does not satisfy the range of 1.0 to 2.5, so that the effect of reducing acoustic noise is relatively low.

[0116] In particular, for samples 1, 6, 7, 12 and 13 of the comparative examples, the spacing distance (G1) between the first ceramic body 110 and the second ceramic body 210 does not satisfy the range of 30μm≤G1≤120μm, so that the acoustic noise value is high, and therefore, the comparative examples are determined as samples 1, 6, 7, 12 and 13.

[0117] According to the aforementioned example embodiments, stress or vibration caused by the piezoelectric property of the multilayer ceramic capacitor may be alleviated by the ceramic sheet, so that acoustic noise generated from the circuit substrate may be reduced.

[0118] In addition, by optimizing the distance between the first ceramic body of the multilayer ceramic capacitor and the second ceramic body of the ceramic sheet disposed on the lower surface and the length of the edge portion between the internal electrode disposed in the multilayer ceramic capacitor and the lower surface of the first ceramic body, the effect of reducing acoustic noise can be improved.

[0119] In addition, since the internal electrodes of the multilayer ceramic capacitor are stacked in a direction perpendicular to the mounting surface and the surface intercepted in the length-width direction on which the piezoelectric displacement is relatively small is bonded to the ceramic sheet, the stress and vibration generated from the multilayer ceramic capacitor that can be transmitted to the ceramic sheet can be reduced, thereby reducing acoustic noise.

[0120] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present invention as defined by the appended claims.

Claims

1. A composite electronic component comprising: Composite subject, including: A multilayer ceramic capacitor comprising a first ceramic body and first and second external electrodes disposed on both ends of the first ceramic body, a plurality of dielectric layers and internal electrodes being stacked in the first ceramic body, the internal electrodes being disposed opposite to each other with a corresponding one of the plurality of dielectric layers interposed between the internal electrodes; and a ceramic sheet disposed under the multilayer ceramic capacitor and including a second ceramic body including ceramic, and first and second terminal electrodes disposed on both ends of the second ceramic body and connected to the first and second external electrodes, respectively, In which, the internal electrode is stacked perpendicular to the lower surface of the first ceramic body and the lower surface of the first ceramic body faces the ceramic sheet, and a ratio G1 / M1 of a spacing distance G1 between the first ceramic body and the second ceramic body in a thickness direction and a length M1 of an edge portion between the internal electrode and the lower surface of the first ceramic body satisfies 1.0 to 2.5, and G1 is 30 μm or greater.

2. The composite electronic component according to claim 1, wherein: The length M1 of the edge portion between the inner electrode and the lower surface of the first ceramic body and the spacing distance G1 between the first ceramic body and the second ceramic body in the thickness direction satisfy M1 <G1。 3. The composite electronic component according to claim 1, wherein: The spacing distance G1 between the first ceramic body and the second ceramic body in the thickness direction satisfies 30 μm≤G1≤120 μm.

4. The composite electronic component according to claim 1, wherein: The spacing distance G1 between the first ceramic body and the second ceramic body in the thickness direction satisfies 50 μm≤G1≤100 μm.

5. The composite electronic component according to claim 1, wherein: The internal electrode in the first ceramic body is perpendicular to a mounting surface of the composite body.

6. The composite electronic component according to claim 1, wherein: The ceramic sheet includes aluminum oxide.

7. The composite electronic component according to claim 1, wherein: The multilayer ceramic capacitor and the ceramic sheet are bonded to each other by solder or a conductive adhesive applied on an upper surface of the first terminal electrode and an upper surface of the second terminal electrode.

8. The composite electronic component according to claim 1, wherein: The thickness direction is a stacking direction along which the ceramic sheets and the multilayer ceramic capacitor are stacked.

9. A composite electronic component comprising: Composite subject, including: A multilayer ceramic capacitor comprising a first ceramic body and first and second external electrodes disposed on both ends of the first ceramic body, a plurality of dielectric layers and internal electrodes being stacked in the first ceramic body, the internal electrodes being disposed opposite to each other with a corresponding one of the plurality of dielectric layers interposed between the internal electrodes; and a ceramic sheet disposed under the multilayer ceramic capacitor and including a second ceramic body including ceramic, and first and second terminal electrodes disposed on both ends of the second ceramic body and connected to the first and second external electrodes, respectively, Among them, the inner electrode is stacked perpendicular to the lower surface of the first ceramic body, and the lower surface of the first ceramic body faces the ceramic sheet. The length M1 of the edge portion between the inner electrode and the lower surface of the first ceramic body and the spacing distance G1 in the thickness direction between the first ceramic body and the second ceramic body satisfy M1 < G1, and G1 is 30 μm or more.

10. The composite electronic component according to claim 9, wherein: The ratio G1 / M1 of the spacing distance G1 in the thickness direction between the first ceramic body and the second ceramic body to the length M1 of the edge portion between the inner electrode and the lower surface of the first ceramic body satisfies 1.0 < G1 / M1 ≤ 2.

5.

11. The composite electronic component according to claim 9, wherein: The spacing distance G1 in the thickness direction between the first ceramic body and the second ceramic body satisfies 30 μm ≤ G1 ≤ 120 μm.

12. The composite electronic component according to claim 9, wherein: The spacing distance G1 in the thickness direction between the first ceramic body and the second ceramic body satisfies 50 μm ≤ G1 ≤ 100 μm.

13. The composite electronic component according to claim 9, wherein: The inner electrode in the first ceramic body is perpendicular to the mounting surface of the composite body.

14. The composite electronic component according to claim 9, wherein: The ceramic sheet includes alumina.

15. The composite electronic component according to claim 9, wherein The multilayer ceramic capacitor and the ceramic sheet are bonded to each other by solder or a conductive adhesive applied to the upper surfaces of the first terminal electrode and the second terminal electrode.

16. The composite electronic component according to claim 9, wherein: The thickness direction is the stacking direction along which the ceramic sheet and the multilayer ceramic capacitor are stacked.

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