An optical module

Abstract

The optical module provided by the present application includes: a circuit board; an optical receiving component disposed on the circuit board for receiving signal light from outside the optical module; the optical receiving component includes: an optical receiving chip disposed on the circuit board and electrically connected to the circuit board; a fourth housing disposed on the circuit board and covering the optical receiving chip; a reflecting prism disposed on the fourth housing, including a reflecting surface, and the projection of the reflecting surface on the circuit board covers the optical receiving chip; a third converging lens disposed on the transmission optical path from the reflecting prism to the corresponding optical receiving chip. In the optical module provided by the present application, a single third converging lens is disposed on the transmission optical path from the reflecting prism to the optical receiving chip. Furthermore, the third converging lens converges the multiple received signal lights whose transmission directions are changed by the reflecting prism one by one and transmits them to the photosensitive surface of the optical receiving chip, enabling the optical receiving chip to efficiently receive the multiple received signal lights reflected by the reflecting prism correspondingly.

Description

Technical Field

[0001] This application relates to the field of optical fiber communication technology, and particularly to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology have become increasingly important. In optical communication technology, an optical module is a tool for realizing the mutual conversion of optical and electrical signals, and is one of the key components in optical communication devices. Moreover, with the development requirements of optical communication technology, the transmission rate of optical modules is continuously increasing.

[0003] Generally, to improve the transmission rate of an optical module, the number of transmission channels in the optical module can be increased. For example, an optical module that traditionally includes a group of optical emission sub-modules (emitting light of one wavelength) and a group of optical reception sub-modules (receiving light of one wavelength) is improved to include two groups of optical emission sub-modules (each group emitting light of one wavelength) and two groups of optical reception sub-modules (each group receiving light of one wavelength). In this way, the occupied volume of the optical emission sub-modules and optical reception sub-modules in the optical module will continuously increase, which is not conducive to the further development of the optical module. Summary of the Invention

[0004] An embodiment of this application provides an optical module for improving the signal light reception efficiency of an optical received signal.

[0005] An optical module provided by this application includes:

[0006] A circuit board;

[0007] An optical reception component, disposed on the circuit board, for receiving signal light from outside the optical module;

[0008] The optical reception component includes:

[0009] An optical reception chip, disposed on the circuit board and electrically connected to the circuit board;

[0010] A fourth housing, disposed on the circuit board and covering the optical reception chip;

[0011] A reflection prism, disposed on the fourth housing, including a reflection surface, and the projection of the reflection surface on the circuit board covers the optical reception chip;

[0012] A third converging lens, disposed on the transmission optical path from the reflection prism to the corresponding optical reception chip.

[0013] The optical module provided by the present application includes a circuit board and an optical receiving component. The optical receiving component includes an optical receiving chip, a reflection prism, and a third converging lens. The reflection prism is covered above the optical receiving chip through a fourth housing, and the third converging lens is disposed on the transmission optical path from the reflection prism to the corresponding optical receiving chip. In the optical module provided by the present application, a single third converging lens is disposed on the transmission optical path from the reflection prism to the optical receiving chip, so that the third converging lens can correspond to the optical receiving chip one by one. Furthermore, the third converging lens converges the multiple received signal lights whose transmission directions are changed by the reflection prism one by one and transmits them to the photosensitive surface of the optical receiving chip, enabling the optical receiving chip to efficiently receive the multiple received signal lights reflected by the reflection prism correspondingly. Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0015] Figure 1 Schematic diagram of the connection relationship of the optical communication terminal;

[0016] Figure 2 Schematic diagram of the optical network unit structure;

[0017] Figure 3 Schematic diagram of an optical module structure provided by an embodiment of the present application;

[0018] Figure 4 Schematic diagram of the exploded structure of an optical module provided by an embodiment of the present application;

[0019] Figure 5 Schematic diagram of the assembly of the optical transceiver sub-module and the circuit board in an optical module provided by an embodiment of the present application;

[0020] Figure 6 Schematic diagram of the partial decomposition of the optical transceiver sub-module and the circuit board in an optical module provided by an embodiment of the present application;

[0021] Figure 7 For Figure 6 Partial decomposition schematic diagram after flipping the perspective;

[0022] Figure 8 Partial schematic diagram of the optical transceiver sub-module in an optical module provided by an embodiment of the present application Figure 1 ;

[0023] Figure 9 Schematic diagram of the structure of the second housing in an optical module provided by an embodiment of the present application;

[0024] Figure 10 Another perspective structural diagram of the second housing in an optical module provided by an embodiment of the present application;

[0025] Figure 11 Assembly sectional view of the first optical fiber adapter and the second housing in an optical module provided by an embodiment of the present application;

[0026] Figure 12 Assembly sectional view of the second optical fiber adapter and the second housing in an optical module provided by an embodiment of the present application;

[0027] Figure 13 Partial exploded view of the first housing and the circuit board in an optical module provided by an embodiment of the present application;

[0028] Figure 14 Schematic diagram of the distribution of optical devices in the first housing of an optical module provided by an embodiment of the present application;

[0029] Figure 15 Schematic diagram of the emission optical path in an optical module provided by an embodiment of the present application;

[0030] Figure 16 Structural schematic of the protective cover in an optical module provided by an embodiment of the present application;

[0031] Figure 17 Another perspective structural diagram of the protective cover in an optical module provided by an embodiment of the present application;

[0032] Figure 18 Partial exploded view of the circuit board and the optical receiving component in an optical module provided by an embodiment of the present application;

[0033] Figure 19 Partial enlarged view of the optical receiving component in the optical module provided by an embodiment of the present application;

[0034] Figure 20 Schematic diagram of the receiving optical path in an optical module provided by an embodiment of the present application;

[0035] Figure 21 Another perspective schematic diagram of the receiving optical path in an optical module provided by an embodiment of the present application;

[0036] Figure 22 Structural schematic of the first housing in an optical module provided by an embodiment of the present application;

[0037] Figure 23 Assembly exploded view of the first housing and the circuit board in an optical module provided by an embodiment of the present application;

[0038] Figure 24Another perspective assembly schematic diagram of the first housing and the circuit board in the optical module provided by the embodiment of the present application;

[0039] Figure 25 An assembly cross-sectional view of the first housing and the third housing in the optical module provided by the embodiment of the present application;

[0040] Figure 26 A structural schematic diagram of the local optical receiving component assembled onto the circuit board in the optical module provided by the embodiment of the present application;

[0041] Figure 27 A structural schematic of the fourth housing in the optical module provided by the embodiment of the present application Figure 1 ;

[0042] Figure 28 A structural schematic of the fourth housing in the optical module provided by the embodiment of the present application Figure 2 ;

[0043] Figure 29 An exploded view of the fourth housing, the lens array, and the reflecting prism in the optical module provided by the embodiment of the present application. Detailed implementation manners

[0044] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0045] One of the core links in optical fiber communication is the mutual conversion between optical and electrical signals. Optical fiber communication uses optical signals carrying information to transmit in information transmission devices such as optical fibers / optical waveguides. The passive transmission characteristics of light in optical fibers / optical waveguides can be used to achieve low-cost and low-loss information transmission; while information processing devices such as computers use electrical signals. In order to establish an information connection between information transmission devices such as optical fibers / optical waveguides and information processing devices such as computers, it is necessary to achieve the mutual conversion between electrical signals and optical signals.

[0046] The optical module realizes the above-mentioned mutual conversion function between optical and electrical signals in the field of optical fiber communication technology. The mutual conversion between optical and electrical signals is the core function of the optical module. The optical module realizes the electrical connection with the external host computer through the gold fingers on its internal circuit board. The main electrical connections include power supply, I2C signal, data signal, and grounding, etc.; The electrical connection method using gold fingers has become the mainstream connection method in the optical module industry. Based on this, the definitions of the pins on the gold fingers have formed a variety of industry protocols / specifications.

[0047] Figure 1 It is a schematic diagram of the connection relationship of an optical communication terminal. As Figure 1 shown, the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

[0048] One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection of the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network terminal 100 with the optical module 200.

[0049] The optical port of the optical module 200 is externally connected to the optical fiber 101 to establish a two-way optical signal connection with the optical fiber 101; the electrical port of the optical module 200 is externally connected to the optical network terminal 100 to establish a two-way electrical signal connection with the optical network terminal 100; the mutual conversion between the optical signal and the electrical signal is realized inside the optical module, so as to realize the establishment of an information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.

[0050] The optical network terminal has an optical module interface 102 for accessing the optical module 200 to establish a two-way electrical signal connection with the optical module 200; the optical network terminal has a network cable interface 104 for accessing the network cable 103 to establish a two-way electrical signal connection with the network cable 103; the connection between the optical module 200 and the network cable 103 is established through the optical network terminal 100. Specifically, the optical network terminal transmits the signal from the optical module to the network cable and transmits the signal from the network cable to the optical module. The optical network terminal monitors the operation of the optical module as the upper computer of the optical module.

[0051] So far, a two-way signal transmission channel has been established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

[0052] Common information processing devices include routers, switches, electronic computers, etc.; the optical network terminal is the upper computer of the optical module, provides data signals to the optical module, and receives data signals from the optical module. Common upper computers of the optical module also include optical line terminals, etc.

[0053] Figure 2 It is a schematic diagram of the structure of the optical network terminal. As Figure 2 shown, there is a circuit board 105 in the optical network terminal 100, and a cage 106 is arranged on the surface of the circuit board 105; an electrical connector is arranged inside the cage 106 for accessing the electrical port of the optical module such as the gold finger; a radiator 107 is arranged on the cage 106, and the radiator 107 has convex parts such as fins for increasing the heat dissipation area.

[0054] The optical module 200 is inserted into the optical network terminal. Specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

[0055] The cage 106 is located on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that there is an electrical connector inside the cage; the optical module is inserted into the cage, and the cage fixes the optical module. The heat generated by the optical module is conducted to the cage 106 and then diffused through the radiator 107 on the cage.

[0056] Figure 3 It is a schematic structural diagram of an optical module provided by an embodiment of the present application. Figure 4 It is a schematic exploded structural diagram of the optical module provided by an embodiment of the present application. As Figure 3 、 Figure 4 shown, the optical module 200 provided by the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, an optical transceiver sub-module 400, a first optical fiber adapter 500, and a second optical fiber adapter 600.

[0057] The upper housing 201 covers the lower housing 202 to form a wrapped cavity with two openings; the outer contour of the wrapped cavity generally presents a square body. Specifically, the lower housing includes a main board and two side boards located on both sides of the main board and perpendicular to the main board; the upper housing includes a third housing, and the third housing covers the two side boards of the upper housing to form a wrapped cavity; the upper housing may further include two side walls located on both sides of the third housing and perpendicular to the third housing. The two side walls are combined with the two side boards to realize the upper housing covering the lower housing.

[0058] The two openings may specifically be two openings at both ends in the same direction (204, 205), or two openings in different directions; one of the openings is an electrical port 204, and the gold fingers of the circuit board extend out from the electrical port 204 and are inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect to the optical transceiver sub-module 400 inside the optical module; optoelectronic components such as the circuit board 300 and the optical transceiver sub-module 400 are located in the wrapped cavity.

[0059] Adopting the assembly method of combining the upper housing and the lower housing is convenient for installing devices such as the circuit board 300 and the optical transceiver sub-module 400 into the housing, and the upper housing and the lower housing form the outermost encapsulation protection housing of the optical module; the upper housing and the lower housing generally adopt metal materials, which is conducive to achieving electromagnetic shielding and heat dissipation; generally, the housing of the optical module is not made into an integral part, so that when assembling devices such as the circuit board, positioning components, heat dissipation, and electromagnetic shielding components cannot be installed, and it is not conducive to production automation.

[0060] The unlocking component 203 is located on the outer wall of the package cavity / lower housing 202 and is used to achieve a fixed connection between the optical module and the host computer, or to release the fixed connection between the optical module and the host computer.

[0061] The unlocking component 203 has a latching component that matches the host computer cage; pulling the end of the unlocking component can cause the unlocking component to move relatively on the surface of the outer wall; when the optical module is inserted into the host computer cage, the optical module is fixed in the host computer cage by the latching component of the unlocking component; by pulling the unlocking component, the latching component of the unlocking component moves accordingly, thereby changing the connection relationship between the latching component and the host computer to release the latching relationship between the optical module and the host computer, so that the optical module can be withdrawn from the host computer cage.

[0062] On the circuit board 300, there are circuit traces, electronic components (such as capacitors, resistors, transistors, MOS transistors), and chips (such as MCU, laser driver chips, limiting amplifier chips, clock data recovery CDR, power management chips, data processing chips DSP), etc.

[0063] The circuit board connects the electrical components in the optical module together according to the circuit design through the circuit traces to achieve electrical functions such as power supply, electrical signal transmission, and grounding.

[0064] The chips on the circuit board 300 can be multi-functional integrated chips. For example, the laser driver chip and the MCU chip can be integrated into one chip, or the laser driver chip, the limiting amplifier chip, and the MCU can be integrated into one chip. The chip is an integration of circuits, but the functions of each circuit do not disappear because of the integration. Only the form of the circuit presentation changes, and the circuit form still exists in the chip. Therefore, when there are three independent chips of MCU, laser driver chip, and limiting amplifier chip on the circuit board, it is equivalent to the solution of setting a single three-functional integrated chip on the circuit board 300.

[0065] The circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a bearing function. For example, the rigid circuit board can stably bear the chips; when the optical transceiver device is located on the circuit board, the rigid circuit board can also provide a stable bearing; the rigid circuit board can also be inserted into the electrical connector in the host computer cage. Specifically, metal pins / gold fingers are formed on the surface of one end of the rigid circuit board for connection with the electrical connector; these are not easily achieved by flexible circuit boards.

[0066] Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards; flexible circuit boards are generally used in cooperation with rigid circuit boards. For example, a flexible circuit board can be used to connect between the rigid circuit board and the optical transceiver device.

[0067] Figure 5The figure is an assembly schematic diagram of an optical transceiver sub-module 400 and a circuit board 300 provided by an embodiment of the present application. As Figure 5 shown, the optical module provided by the embodiment of the present application integrates an optical emission component and an optical reception component into an optical transceiver sub-module 400, and the optical transceiver sub-module 400 is located at the edge of the circuit board 300. The optical transceiver sub-module 400 includes a first housing 410, a second housing 420, and a third housing 430. The upper end of the first housing 410 is open, the lower end of the second housing 420 is open, and the lower end of the third housing 430 is open. The second housing 420 and the third housing 430 are both disposed above the first housing 410, so as to form a receiving cavity composed of the first housing 410, the second housing 420, and the third housing 430. The optical emission component and the optical reception component are both disposed in the receiving cavity. And an opening is provided on one side of the receiving cavity, and the circuit board 300 is inserted into the receiving cavity through the opening to facilitate the electrical connection between the optical emission component, the optical reception component, and the circuit board 300.

[0068] Figure 5 The left-right direction and the front-back direction of the optical module are defined, as shown by the arrow directions in Figure 5 In the embodiment of the present application, a first fiber optic adapter 500 and a second fiber optic adapter 600 are provided on the side of the optical transceiver sub-module 400 away from the circuit board 300. The first fiber optic adapter 500 and the second fiber optic adapter 600 are arranged side by side, that is, the first fiber optic adapter 500 and the second fiber optic adapter 600 are at the same height and are arranged side by side in the front-back direction ( Figure 5 arranged side by side in the front-back direction shown) on the end face of the housing of the optical transceiver sub-module 400, and both the first fiber optic adapter 500 and the second fiber optic adapter 600 are inserted into the receiving cavity. The first fiber optic adapter 500 and the second fiber optic adapter 600 are respectively used to connect with fiber optic connectors outside the optical module, and the fiber optic connectors outside the optical module are industry-standard components. The shape and size of the external fiber optic connectors limit the positions of the two fiber optic adapters inside the optical module, so the first fiber optic adapter 500 and the second fiber optic adapter 600 are arranged at the same height in the product.

[0069] After the first fiber optic adapter 500 is inserted into the receiving cavity, it corresponds to the optical emission component in the receiving cavity and is used to transmit the signal light generated by the optical emission component to the external optical fiber to realize the emission of light. After the second fiber optic adapter 600 is inserted into the receiving cavity, it corresponds to the optical reception component in the receiving cavity and is used to transmit the signal light transmitted by the external optical fiber into the optical reception component to realize the reception of light.

[0070] In the embodiments of the present application, the optical devices of the optical emission component need to ensure high-precision optical paths. However, the surface precision of the circuit board is not very high. If the optical devices of the optical emission component are arranged on the circuit board 300, it may lead to a relatively low optical path alignment precision among the optical devices of the optical emission component. To avoid this situation, some of the optical devices of the optical emission component are supported by a metal plate and arranged in a manner separated from the circuit board 300, and electrical connection is achieved through wire bonding.

[0071] Figure 6 FIG. is a partial exploded view of the optical transceiver sub-module 400 and the circuit board 300 in the optical module provided by the embodiments of the present application. Figure 7 For Figure 6 The perspective of is the partial exploded view after being flipped. As Figure 6 、 Figure 7 shown, in the optical module provided by the embodiments of the present application, the optical emission component includes devices related to optical emission such as a laser driver chip, a laser chip, and a lens. One end of the accommodating cavity is connected to the first fiber optic adapter 500. The laser driver chip drives the laser chip to work. The light beam generated by the laser chip is coupled to the first fiber optic adapter 500 through devices such as a lens, and the light beam is transmitted out through the first fiber optic adapter 500. The optical reception component includes devices related to optical reception such as a lens, a photoreceiver chip, and a transimpedance amplifier. One end of the accommodating cavity is connected to the second fiber optic adapter 600. The signal light from outside the optical module is received through the second fiber optic adapter 600, and the received signal light is transmitted to the photoreceiver chip through optical devices such as a lens arranged in the accommodating cavity, and the photoreceiver chip realizes photoelectric conversion.

[0072] In the embodiments of the present application, to improve the transmission rate of the optical module, the number of transmission channels in the optical module is increased, that is, the optical module includes multiple laser chips (each laser chip emits light of one wavelength) and multiple photoreceiver chips (each receives light of one wavelength). Specifically, in the optical module provided by the embodiments of the present application, multiple laser chips are arranged in the accommodating cavity to emit multiple light beams. The multiple light beams are multiplexed into one light beam and finally convergently coupled to the first fiber optic adapter 500 to realize the emission of multiple lights through one optical fiber. Multiple photoreceiver chips are arranged in the accommodating cavity. The one light beam transmitted by the second fiber optic adapter 600 is demultiplexed into multiple light beams, and the multiple light beams are respectively transmitted to the multiple photoreceiver chips to realize the reception of multiple lights by one optical fiber.

[0073] The optical emission component includes multiple laser chips 450, multiple collimating lenses 470, an optical multiplexer 4205, and a first displacement prism 4204. The multiple laser chips 450 are used to emit multiple beams with different wavelengths. In the embodiment of the present application, the optical emission component includes 4 laser chips 450. Each laser chip 450 emits a beam. Each collimating lens 470 is disposed in the outgoing light direction of each laser chip 450 and is used to convert the beam emitted by the laser chip 450 into a collimated beam. The optical multiplexer 4205 is disposed in the outgoing light direction of the collimating lens 470 and is used to multiplex the multiple beams with different wavelengths into a composite beam. The first displacement prism 4204 is disposed in the outgoing light direction of the optical multiplexer 4205 and is used to couple the composite beam emitted by the optical multiplexer 4205 into the first fiber optic adapter 500 after refraction and reflection, thereby realizing the emission of light.

[0074] In the embodiment of the present application, the multiple laser chips 450 and the multiple collimating lenses 470 are both disposed in the cavity of the first housing 410. The optical multiplexer 4205 and the first displacement prism 4204 are both disposed in the cavity of the second housing 420 and are installed according to the optical path emission direction. When the second housing 420 covers the first housing 410, the laser chips 450, the collimating lenses 470, the optical multiplexer 4205, the first displacement prism 4204, and the first fiber optic adapter 500 are sequentially arranged along the light emission direction.

[0075] The optical reception component includes a second displacement prism 4206, an optical demultiplexer 4207, and multiple optical receiving chips. The second displacement prism 4206 is used to transmit a beam transmitted by the second fiber optic adapter 600 to the optical demultiplexer 4207. The optical demultiplexer 4207 is used to demultiplex a beam into multiple beams. The multiple optical receiving chips are used to receive the multiple beams respectively, thereby realizing the reception of light.

[0076] In the embodiment of the present application, the second displacement prism 4206 and the optical demultiplexer 4207 are both disposed in the cavity of the second housing 420. The optical receiving chips are disposed on the circuit board 300 inserted into the accommodating cavity. When the second housing 420 and the third housing 430 cover the first housing 410, the second displacement prism 4206, the optical demultiplexer 4207, and the optical receiving chips are sequentially arranged along the light reception direction.

[0077] Figure 8 This is an assembly schematic diagram of the first housing 410, the laser chips 450, and the circuit board 300 in the optical module provided by the embodiment of the present application. As Figure 8As shown in the figure, the first housing 410 includes a first bottom plate 4110, a first side plate 4120, and a second side plate 4130. The bottom surface of the first bottom plate 4110 is connected to the lower housing 202. The bottom surface of the first side plate 4120 is connected to the first bottom plate 4110. The bottom surface of the second side plate 4130 is connected to the first bottom plate 4110. The first side plate 4120 and the second side plate 4130 are disposed opposite to each other. Thus, the first housing 410 is a housing with openings on the left side, right side, and upper side formed by the first bottom plate 4110, the first side plate 4120, and the second side plate 4130. A plurality of laser chips 450 and a plurality of collimating lenses 470 are both carried by the first bottom plate 4110. The left opening of the first housing 410 faces the first optical fiber adapter 500 and the second optical fiber adapter 600. The right opening of the first housing 410 faces the circuit board 300, and the circuit board 300 is inserted into the interior of the first housing 410 through the right opening. The upper opening of the first housing 410 faces the upper housing 201, and the second housing 420 and the third housing 430 are covered at the upper opening, so that the first housing 410, the second housing 420, and the third housing 430 form an accommodation cavity.

[0078] Figure 9 This is a partial assembly schematic diagram of the first housing 410 and the laser chip 450 in the optical module according to the embodiment of the present application. As Figure 9 shown in the figure, the laser chip 450 is disposed near the right opening of the first bottom plate 4110 and is electrically connected to the circuit board 300. The circuit board 300 supplies power to the laser chip 450 to drive the laser chip 450 to generate a laser beam. To facilitate fixing the laser chip 450 on the first bottom plate 4110 of the first housing 410, a thermoelectric cooler 490 is disposed near the right opening of the first bottom plate 4110. The bottom surface of the thermoelectric cooler 490 is adhered to the first bottom plate 4110. A substrate 4901 is disposed on the top surface of the thermoelectric cooler 490 away from the lower housing 202. The laser chip 450 is adhered to the substrate 4901. Thus, the heat generated by the operation of the laser chip 450 can be transferred to the thermoelectric cooler 490 through the substrate 4901, and heat exchange is performed through the thermoelectric cooler 490 to reduce the operating temperature of the laser chip 450 and ensure the life of the laser chip 450. In the embodiment of the present application, the substrate 4901 is generally a plate made of aluminum nitride or silicon.

[0079] The laser beam generated by the laser chip 450 is transmitted along the left-right direction. The laser beam generated by the laser chip 450 is a divergent beam. Therefore, a first converging lens 460 is provided in the light emission direction of the laser chip 450. The first converging lens 460 is adhered to the semiconductor cooler 490. The first converging lens 460 is used to convert the divergent beam generated by the laser chip 450 into a parallel beam. In the embodiment of the present application, the optical emission component includes 4 laser chips 450 and 4 first converging lenses 460. These 4 laser chips 450 are arranged side by side in the front-rear direction on the semiconductor cooler 490. Each first converging lens 460 is arranged in the emission direction of each laser chip 450, and is used to convert the divergent beam generated by each laser chip 450 into a parallel beam.

[0080] A plurality of collimating lenses 470 are further provided on the first bottom plate 4110. Each collimating lens 470 is arranged in the emission direction of each laser chip 450, and the laser chip 450, the first converging lens 460 and the collimating lens 470 are arranged in sequence along the light emission direction. Since the outer surface of the collimating lens 470 is a curved surface, in order to fix the collimating lens 470 on the first bottom plate 4110, a plurality of glass blocks 480 are provided on the first bottom plate 4110. The bottom surface of each glass block 480 is adhered to the first bottom plate 4110, and the right side surface of each collimating lens 470 is adhered to the left side surface of each glass block 480, so as to fix the collimating lens 470 on the first bottom plate 4110 through the glass block 480.

[0081] In the embodiment of the present application, the glass block 480 is not only used to fix the collimating lens 470. The laser beam generated by the laser chip 450 is converted into a parallel beam by the first converging lens 460. The parallel beam enters the collimating lens 470 through the glass block 480. The glass block 480 will not perform displacement conversion on the parallel beam, and the beam will directly pass through the glass block 480.

[0082] Figure 10 It is a partial structural schematic diagram of the optical transceiver sub-module 400 in the optical module provided by the embodiment of the present application. As Figure 10As shown in the figure, a first cavity 4201 and a second cavity 4202 are provided in the second housing 420 of the optical module provided by the embodiment of the present application. The first cavity 4201 and the second cavity 4202 are arranged side by side in the front and rear. A partition 4203 is provided between the first cavity 4201 and the second cavity 4202. The first displacement prism 4204 and the optical multiplexer 4205 of the optical emission component are both located in the first cavity 4201. The first optical fiber adapter 500 is inserted into the first cavity 4201 of the second housing 420. The optical multiplexer 4205 is pasted on the bottom surface of the first cavity 4201. The first displacement prism 4204 is located between the first optical fiber adapter 500 and the optical multiplexer 4205. The first displacement prism 4204 is pasted on the bottom surface of the first cavity 4201, and the light input surface of the first displacement prism 4204 is pasted on the light output surface of the optical multiplexer 4205, so that a composite light beam output by the optical multiplexer 4205 is input into the first displacement prism 4204. This composite light beam is coupled into the first optical fiber adapter 500 through the reflection and refraction of the first displacement prism 4204.

[0083] The second displacement prism 4206 and the optical demultiplexer 4207 of the optical receiving component are both located in the second cavity 4202. The second optical fiber adapter 600 is inserted into the second cavity 4202 of the second housing 420. The optical demultiplexer 4207 is pasted on the bottom surface of the second cavity 4202. The second displacement prism 4206 is located between the second optical fiber adapter 600 and the optical demultiplexer 4207. The second displacement prism 4206 is pasted on the bottom surface of the second cavity 4202, so that a composite light beam transmitted by the second optical fiber adapter 600 is coupled into the optical demultiplexer 4207 through the reflection and refraction of the second displacement prism 4206. The optical demultiplexer 4207 demultiplexes the composite light beam into multiple light beams with different wavelengths.

[0084] Figure 11 It is a schematic structural diagram of the second housing 420 in the optical module provided by the embodiment of the present application. As Figure 11, the second housing 420 includes a second bottom plate 4210, a third side plate 4220, and a fourth side plate 4230. The second bottom plate 4210 is connected to the upper housing 201. The third side plate 4220 faces the first optical fiber adapter 500 and the second optical fiber adapter 600. The top surface of the third side plate 4220 is fixedly connected to the second bottom plate 4210, and a first through hole 4208 and a second through hole 4209 are provided on the third side plate 4220. The first optical fiber adapter 500 is fixed to the third side plate 4220 through the first through hole 4208, and the second optical fiber adapter 600 is fixed to the third side plate 4220 through the second through hole 4209. The top surface of the fourth side plate 4230 is fixedly connected to the second bottom plate 4210, and the left side surface (the side surface facing the optical fiber adapter) of the fourth side plate 4230 is fixedly connected to the right side surface of the third side plate 4220. Thus, the second housing 420 is a housing with openings on the right side surface, front side surface, and lower side surface formed by the second bottom plate 4210, the third side plate 4220, and the fourth side plate 4230.

[0085] A first cavity 4201 is formed between the front side opening end surface of the second housing 420 and the partition plate 4203. A first protrusion 4211 is provided at a position on the second bottom plate 4210 close to the first through hole 4208. The right side surface of the first protrusion 4211 is a plane. The bottom surface of the optical multiplexer 4205 is pasted on the second bottom plate 4210, the rear side surface is pasted on one side surface of the partition plate 4203, and the left side surface is pasted on the right side surface of the first protrusion 4211, thereby fixing the optical multiplexer 4205 on the second bottom plate 4210. An optical output port is provided on the left side surface of the optical multiplexer 4205. The right side surface of the first displacement prism 4204 is pasted on the left side surface of the optical multiplexer 4205 and corresponds to the optical output port to receive a composite optical beam output by the optical multiplexer 4205. The left side surface (optical output surface) of the first displacement prism 4204 corresponds to the first through hole 4208, and the composite optical beam is refracted and reflected by the first displacement prism 4204 and then enters the first optical fiber adapter 500 in the first through hole 4208.

[0086] A second cavity 4202 is formed between the other side surface of the partition plate 4203 and the side surface of the fourth side plate 4230. The bottom surface of the optical demultiplexer 4207 is adhered to the second bottom plate 4210, the rear side surface is adhered to the side surface of the fourth side plate 4230, and the front side surface is adhered to the side surface of the partition plate 4203, thereby fixing the optical demultiplexer 4207 on the second bottom plate 4210. A second protrusion 4212 is provided at a position of the second bottom plate 4210 close to the second through hole 4209. The rear side surface of the second protrusion 4212 is a flat surface. The bottom surface of the second displacement prism 4206 is adhered to the second bottom plate 4210, the front side surface is adhered to the rear side surface of the second protrusion 4212, the left side surface (light incident surface) corresponds to the second through hole 4209, and the right side surface (light output surface) corresponds to the light incident port of the optical demultiplexer 4207. A path of signal light transmitted by the second optical fiber adapter 600 enters the optical demultiplexer 4207 after being refracted and reflected by the second displacement prism 4206, and the optical demultiplexer 4207 demultiplexes the path of signal light into multiple beams of different wavelengths.

[0087] Figure 12 It is a schematic structural diagram of another angle of the second housing 420 in the optical module provided by the embodiment of the present application. As Figure 12 shown, the top surface of the first cavity 4201 in the second housing 420 may have a different height from the top surface of the second cavity 4202. For example, the second cavity 4202 is recessed in the first cavity 4201, and the second housing 420 covers the upper part of the first housing 410. The second bottom plate 4210 of the second housing 420 faces the upper housing 201. In this way, the optical demultiplexer 4207 in the second cavity 4202 is higher than the optical multiplexer 4205 in the first cavity 4201, which can facilitate the transmission of multiple beams output by the optical demultiplexer 4207 to the optical receiving chip and prevent the optical emission beam from causing crosstalk to the optical receiving beam.

[0088] In addition, the optical receiving chip receives the beam through the top light incident surface. Therefore, there is a height difference between the optical path of the beam output by the optical demultiplexer 4207 and the optical path of the beam received by the optical receiving chip; while the laser chip emits the beam through the side light emitting surface. Therefore, the optical path of the beam output by the laser chip and the optical path of the beam received by the optical multiplexer 4205 are at the same height. Therefore, in order to realize the emission and reception of light, the top surface of the second cavity 4202 for fixing the optical demultiplexer 4207 is recessed from the top surface of the first cavity 4201 for fixing the optical multiplexer 4205.

[0089] In the embodiment of the present application, the first displacement prism 4204 and the optical multiplexer 4205 of the optical emission component, and the second displacement prism 4206 and the optical demultiplexer 4207 of the optical reception component are all placed on the second housing 420. Then, the second housing 420 on which the first displacement prism 4204, the optical multiplexer 4205, the second displacement prism 4206, and the optical demultiplexer 4207 are fixed is installed on the first housing 410, so that the optical transceiver sub-module 400 can be installed from multiple angles, with a large operating space, which is beneficial to improving the assembly efficiency of the optical transceiver sub-module 400.

[0090] Figure 13 FIG. is a cross-sectional view of the first optical fiber adapter 500 and the second housing 420 in the optical module provided by the embodiment of the present application. As Figure 13 shown, when a composite beam of light enters the first optical fiber adapter 500 through the first displacement prism 4204, the light beam is likely to be reflected on the end face of the fiber ferrule of the first optical fiber adapter 500. The reflected light beam enters the optical multiplexer 4205 through the first displacement prism 4204, which is likely to interfere with the emitted light beam. Therefore, an isolator 510 is embedded in the first through hole 4208. The isolator 510 is located between the first displacement prism 4204 and the end face of the fiber ferrule, and can be used to eliminate the light beam reflected by the end face of the fiber ferrule to avoid crosstalk of the reflected light beam to the emitted light beam.

[0091] To facilitate coupling the composite light beam output by the first displacement prism 4204 into the first optical fiber adapter 500, a second converging lens 520 is also embedded in the first through hole 4208. The second converging lens 520 is disposed between the isolator 510 and the end face of the fiber ferrule, and is used to couple the composite light beam passing through the isolator 510 to the end face of the fiber ferrule of the first optical fiber adapter 500, so as to realize the emission of light through the first optical fiber adapter 500.

[0092] Figure 14 FIG. is a cross-sectional view of the second optical fiber adapter 600 and the second housing 420 in the optical module provided by the embodiment of the present application. As Figure 14 shown, when the signal light transmitted by the second optical fiber adapter 600 enters the optical demultiplexer 4207, the signal light transmitted by the second optical fiber adapter 600 is a divergent light beam. To facilitate injecting the emitted light beam into the optical demultiplexer 4207 through the second displacement prism 4206, a second lens 610 is embedded in the second through hole 4209. The second lens 610 is located between the second displacement prism 4206 and the end face of the fiber ferrule of the second optical fiber adapter 600, and is used to convert the light beam transmitted in the second optical fiber adapter 600 into parallel light. The parallel light is refracted and reflected by the second displacement prism 4206 and then enters the optical demultiplexer 4207. The optical demultiplexer 4207 demultiplexes one path of parallel light into multiple light beams of different wavelengths.

[0093] Figure 15 This is a schematic diagram of the optical emission optical path in the optical module provided by the embodiment of the present application. As Figure 15 shown, a laser chip 450, a first converging lens 460, a glass block 480, a collimating lens 470, an optical multiplexer 4205, a first displacement prism 4204, an isolator 510, and a first fiber optic adapter 500 are sequentially arranged along the optical emission direction. The laser beam generated by the laser chip 450 is converted into a parallel beam by the first converging lens 460. The parallel beam passes through the glass block 480 and then enters the collimating lens 470, and is converted into a collimated beam by the collimating lens 470. The collimated beam enters the light input port of the optical multiplexer 4205. The optical multiplexer 4205 multiplexes multiple collimated beams into a composite beam. The composite beam enters the first displacement prism 4204 through the light output port of the optical multiplexer 4205. After refraction and reflection by the first displacement prism 4204, the composite beam passes through the isolator 510. The composite beam passing through the isolator 510 is coupled to the first fiber optic adapter 500 through a second converging lens 520, realizing the emission of light.

[0094] In the embodiment of the present application, the optical emission assembly includes 4 laser chips 450, 4 first converging lenses 460, 4 glass blocks 480, and 4 collimating lenses 470. Each collimating lens 470 is fixed on each glass block 480. Each glass block 480 corresponds to each first converging lens 460, and each first converging lens 460 corresponds to each laser chip 450. The right side surface of the optical multiplexer 4205 is provided with 4 light input ports. The 4 collimated beams output by the 4 collimating lenses 470 are respectively incident into the 4 light input ports to inject the 4 collimated beams into the optical multiplexer 4205. The left side surface of the optical multiplexer 4205 is provided with 1 light output port. The 4 collimated beams are combined into a composite beam after reflection in the optical multiplexer 4205, and the composite beam is emitted through the light output port to enter the first displacement prism 4204.

[0095] A laser driver chip 310 is provided on the surface where the circuit board 300 is inserted into the first housing 410. After the laser chip 450 is pasted on the substrate 4901, it needs to be electrically connected to the laser driver chip 310 by wire bonding (gold wire), so that the laser driver chip 310 drives the laser chip 450 to generate a laser beam. Specifically, the laser driver chip 310 is electrically connected to the circuit board 300 by wire bonding (gold wire), the circuit board 300 is electrically connected to the substrate 4901 by wire bonding (gold wire), and the substrate 4901 is electrically connected to the laser chip 450 by wire bonding (gold wire). Thus, the laser driver chip 310 is electrically connected to the laser chip 450 through wire bonding, the circuit board 30, wire bonding, the substrate 4901, and wire bonding.

[0096] After the electrical connection between the laser-driven chip 310 and the laser chip 450 is achieved through wire bonding, when installing other components of the optical module, the wire bonding may be touched, causing damage to the wire bonding. In the embodiments of the present application, in order to prevent damage to the wire bonding on the circuit board 300, the laser chip 450, and the substrate 4901, a protective cover 440 is provided above the laser chip 450, the substrate 4901, and the circuit board 300. The wire bonding is isolated from external components through the protective cover 440 to avoid damage to the wire bonding caused by external components.

[0097] Figure 16 It is a schematic structural diagram of the protective cover 440 in the optical module provided by the embodiments of the present application. Figure 17 It is another perspective structural diagram of the protective cover 440 in the optical module provided by the embodiments of the present application. As Figure 16 、 Figure 17 shown, the protective cover 440 includes a top plate 4401, a first support plate 4402, and a second support plate 4403. The first support plate 4402 is connected to the rear side surface of the top plate 4401, and the second support plate 4403 is connected to the front side surface of the top plate 4401. In this way, the protective cover 440 is a U-shaped cover body composed of the top plate 4401, the first support plate 4402, and the second support plate 4403, so as to cover the laser chip 450, the substrate 4901, and the laser-driven chip 310 below the U-shaped cover body.

[0098] In the embodiments of the present application, the length dimensions of the first support plate 4402 and the second support plate 4403 are smaller than the length dimension of the top plate 4401, that is, the first support plate 4402 and the second support plate 4403 are connected to the right side portion of the top plate 4401. The bottom surfaces of the first support plate 4402 and the second support plate 4403 are both adhered to the surface of the circuit board 300, and the left side of the top plate 4401 is fixed to the glass block 480, thereby fixing the protective cover 440 above the circuit board 300 and the first housing 410.

[0099] In order to further support the top plate 4401, the protective cover 440 further includes a plurality of support columns 4405. One end of the support column 4405 is connected to the inner side surface of the top plate 4401, and the other end is adhered to the surface of the circuit board 300. Moreover, the support column 4405 is disposed at the middle position of the top plate 4401, which can support the middle part of the top plate 4401 and prevent the left end of the top plate 4401 from touching the gold wire or other optical devices.

[0100] In an embodiment of the present application, a notch 4404 is provided at the rear side of the top plate 4401. The notch 4404 extends along the length direction (left - right direction) of the top plate 4401, and the dimension of the notch 4404 in the left - right direction is smaller than the dimension of the top plate 4401 in the left - right direction; the notch 4404 extends along the width direction (front - back direction) of the top plate 4401, and the dimension of the notch 4404 in the front - back direction is smaller than the dimension of the top plate 4401 in the front - back direction. The notch 4404 faces the optical receiving component and is used to avoid the area where the optical receiving chip of the optical receiving component is located.

[0101] The left side surface of the first support plate 4402 is flush with the right side surface of the notch 4404, the right side surface of the second support plate 4403 is flush with the right side surface of the top plate 4401, and the dimension of the second support plate 4403 in the left - right direction is the same as the dimension of the first support plate 4402 in the left - right direction.

[0102] The top plate 4401 covers the laser chip 450, the first converging lens 460, the substrate 4901, and the laser driving chip 310 on the circuit board 300 through the first support plate 4402 and the second support plate 4403 and the support column 4405, and is used to protect the gold wires from the laser driving chip 310 to the circuit board 300, the gold wires from the circuit board 300 to the substrate 4901, and the gold wires from the laser chip 450 to the substrate 4901. At the same time, it protects fragile devices such as the laser driving chip 310, the laser chip 450, and the first converging lens 460.

[0103] In an embodiment of the present application, the top plate 4401 of the protective cover 440 can be a plastic plate or a metal plate, but generally it is necessary to prevent contact with the circuits on the circuit board 300. Using a transparent plastic material for the top plate 4401 can also facilitate observing whether the gold wires and vulnerable devices under the protective cover 440 are damaged.

[0104] Figure 18 This is a partial exploded view of the circuit board 300 and the optical receiving component in the optical module provided by the embodiment of the present application. As Figure 18 shown, a plurality of optical receiving chips 740 are arranged on the circuit board 300 along the optical receiving direction. The optical receiving chips 740 are PDs (photodetectors), such as APDs (avalanche diodes), PIN - PDs (photodiodes), and are used to convert the received signal light into photocurrent. Optionally, the plurality of optical receiving chips 740 in the optical receiving component are respectively arranged on the circuit board 300.

[0105] Further, the optical receiving component further includes a transimpedance amplifier 750, which is mounted on the circuit board 300, and multiple optical receiving chips 740 are all connected to the transimpedance amplifier 750, and are used to receive the current signal generated by the optical receiving chip 740 and convert the received current signal into a voltage signal. Optionally, the transimpedance amplifier 750 is wire-bonded to the optical receiving chip 740, such as by semiconductor bonding wires.

[0106] In the embodiment of the present application, 4 optical receiving chips 740 are arranged on the circuit board 300, and the 4 optical receiving chips 740 are wire-bonded to the transimpedance amplifier 750. However, the longer the wire-bonding length is, the greater the inductance generated by the wire-bonding is, and the greater the signal mismatch will be. And the signal output by the optical receiving chip 740 is a small signal, which will further cause the signal quality to decline. Therefore, the optical receiving chip 740 and the transimpedance amplifier 750 are as close as possible to reduce the wire-bonding length and ensure the signal transmission quality. Furthermore, the transimpedance amplifier 750 is arranged on one side of the optical receiving chip 740, and the transimpedance amplifier 750 is as close as possible to the optical receiving chip 740. Optionally, the electrodes of the optical receiving chip 740 and the pins on the transimpedance amplifier 750 are on the same plane to ensure that the wire-bonding between the optical receiving chip 740 and the transimpedance amplifier 750 is the shortest.

[0107] The optical axes of the multiple signal lights output by the optical demultiplexer 4207 of the optical receiving component are parallel to the surface of the circuit board 300, and at the same time, the photosensitive surfaces of the multiple optical receiving chips 740 are also parallel to the surface of the circuit board 300. However, the optical axes of the multiple signal lights output by the optical demultiplexer 4207 are higher than the photosensitive surfaces of the optical receiving chips 740. Therefore, in order to ensure that the optical receiving chips 740 can normally receive the signal light, the optical receiving component further includes a reflection prism 720, which is arranged above the optical receiving chips 740 and is used to cover the 4 optical receiving chips 740. The optical axis direction of the received light beam is changed through the reflection surface of the reflection prism 720, so that the optical axis of the received light beam is converted from being parallel to the surface of the circuit board 300 to being perpendicular to the surface of the circuit board 300, and further the received light beam is perpendicular to the photosensitive surface of the corresponding optical receiving chip 740 as set.

[0108] In the embodiment of the present application, the reflection prism 720 is a prism including a reflection surface, and the reflection surface covers the optical receiving chips 740 arranged on the circuit board 300 and is used to change the transmission direction of the received light beam, that is, to reflect the received light beam to the optical receiving chip 740. Optionally, the reflection surface of the reflection prism 720 is a 40-45° reflection surface; taking a 45° reflection prism as an example, the reflection prism 720 includes a 45° reflection surface, and the 45° reflection surface covers the 4 optical receiving chips 740 arranged on the circuit board 300.

[0109] To converge the four received light beams onto the reflection prism 720, the optical receiving component further includes a lens array 710, which is disposed on the light incident surface side of the reflection prism 720; optionally, one side of the lens array 710 is adhered to the light incident surface of the reflection prism 720. The lens array 710 may include a plurality of converging lenses, each converging lens corresponding to each light outlet of the optical demultiplexer 4207, for converging each received light beam output from the light outlet of the optical demultiplexer 4207 into the reflection prism 720 respectively, and converting the received light beam parallel to the surface of the circuit board 300 through the reflection prism 720 into a received light beam perpendicular to the surface of the circuit board 300.

[0110] Further, to facilitate the assembly of the lens array 710 and the optical path coupling, the lens array 710 is a long strip integrated structure. A plurality of protrusions are provided on the side of the lens array 710 close to the reflection prism 720, each protrusion corresponding to each light outlet of the optical demultiplexer 4207 and serving as a converging lens for converging each received light beam output from the light outlet of the optical demultiplexer 4207 into the reflection prism 720 respectively, and converting the received light beam parallel to the surface of the circuit board 300 through the reflection prism 720 into a received light beam perpendicular to the surface of the circuit board 300. Using the integrated lens array 710, when performing optical path coupling, the received light beams output from the light outlets of the optical demultiplexer 4207 can be adjusted as a whole. Compared with using a lens array 720 composed of single converging lenses, the optical path coupling efficiency is high and the assembly efficiency is high.

[0111] In the embodiment of the present application, to facilitate the fixation of the lens array 710 and the reflection prism 720 and the adjustment of the coupling optical path between the lens array 710 and the reflection prism 720, the optical receiving component further includes a fourth housing 700, which is a housing with an open bottom. The fourth housing 700 covers the optical receiving chip 740 and the transimpedance amplifier 750 on the circuit board 300, and the lens array 710 and the reflection prism 720 are fixed to the inner wall of the fourth housing 700, such as the top surfaces of the lens array 710 and the reflection prism 720 are adhered to the inner top surface of the fourth housing 700. The received light beam output from the light outlet of the optical demultiplexer 4207 is transmitted to the lens array 710 and the reflection prism 720 through one end of the fourth housing 700.

[0112] The lens array 710 and the reflection prism 720 can adjust their heights according to the distance between the fourth housing 700 and the surface of the circuit board 300, so that the multiplexed signal light beams output by the optical demultiplexer 4207 can accurately enter the lens array 710 and the reflection prism 720. Additionally, when optical path coupling for reception is required, first fixedly assemble the lens array 710 and the reflection prism 720 onto the fourth housing 700, and then move the lens array 710 and the reflection prism 720 by clamping the fourth housing 700, which facilitates the clamping and movement of the lens array 710 and the reflection prism 720, thereby improving the optical path coupling efficiency. At the same time, since the lens array 710 and the reflection prism 720 are usually made of materials such as silicon, directly clamping the lens array 710 and the reflection prism 720 is likely to cause scratches on them. Therefore, the fourth housing 700 can prevent damage such as scratches and pinches caused by clamping the lens array 710 and the reflection prism 720. Fixing the lens array 710 and the reflection prism 720 through the fourth housing 700 facilitates simplifying the process of coupling and installing the lens array 710 and the reflection prism 720.

[0113] To adjust the distance between the top surface of the fourth housing 700 and the surface of the circuit board 300, a first adjusting plate 760 and a second adjusting plate 770 are provided on the circuit board 300. The first adjusting plate 760 and the second adjusting plate 770 are respectively located on both sides of the optical receiving chip 740, and the first adjusting plate 760 is in contact with the bottom surface on the left side of the fourth housing 700, and the second adjusting plate 770 abuts against the bottom surface on the right side of the fourth housing, so as to support and fix the fourth housing 700 through the first adjusting plate 760 and the second adjusting plate 770, increasing the distance between the top surface of the fourth housing 700 and the circuit board 300. Optionally, the first adjusting plate 760 and the second adjusting plate 770 are arranged along the length direction of the circuit board 300 on both sides of the optical receiving chip 740. In this way, when coupling and adjusting the positions of the lens array 710 and the reflection prism 720 in the optical path of the received light beam, the fourth housing 700 moves on the first adjusting plate 760 and the second adjusting plate 770, which can effectively prevent the fourth housing 700 from touching devices such as the optical receiving chip 740 and causing damage to devices such as the optical receiving chip 740. The first adjusting plate 760 and the second adjusting plate 770 facilitate ensuring the installation flatness of the fourth housing 700, thereby improving the accuracy and flatness of the mounting positions of the lens array 710 and the reflection prism 720, reducing the error of the receiving optical path, and increasing the optical path stability.

[0114] In the embodiment of the present application, the optical demultiplexer 4207 is fixed in the second cavity 4202 of the second housing 420. After the optical receiving chip 740 is pasted on the surface of the circuit board 300, the distance between the top surface of the fourth housing 700 and the surface of the circuit board 300 is adjusted by the first adjusting plate 760 and the second adjusting plate 770, so as to adjust the distance between the lens array 710 and the reflection prism 720 from the surface of the circuit board 300, so that the multiple signal light beams output by the optical demultiplexer 4207 are transmitted to the lens array 710, and the multiple signal light beams are coupled to the reflection prism 720 through the lens array 710. The signal light beam parallel to the surface of the circuit board 300 is converted into a signal light beam perpendicular to the surface of the circuit board 300 through the reflection prism 720, so as to reflect the multiple signal light beams to the corresponding optical receiving chips 740 respectively.

[0115] The signal light beam reflected by the reflection prism 720 emits divergently. In order to transmit the reflected signal light beam into the optical receiving chip 740, a plurality of third converging lenses 730 are arranged between the reflection prism 720 and the optical receiving chip 740 in the present application. Each third converging lens 730 is located above each optical receiving chip 740. In this way, the signal light beam perpendicular to the surface of the circuit board 300 reflected by the reflection prism 720 is coupled to the optical receiving chip 740 through the third converging lens 730, so that the reflected light beam can accurately enter the optical receiving chip 740, improving the receiving efficiency of the optical receiving chip 740. Usually in a high-speed optical module, the photosensitive surface of the optical receiving chip is smaller than that of the optical receiving chip used in a traditional low-speed optical module. Statistics show that the photosensitive surface of the high-speed optical receiving chip is nearly one-fourth smaller than that of the low-speed optical receiving chip in area. Therefore, by arranging the third converging lenses 730, it is convenient to ensure the receiving efficiency of the optical receiving chip 740, and at the same time, it is beneficial to shorten the distance between the optical receiving chip 740 and the reflection prism 720, reduce the space between the optical receiving chip 740 and the reflection prism 720, and further facilitate saving the occupied volume of the optical receiving component inside the optical module.

[0116] In the embodiment of the present application, the optical receiving chip 740 is a single optical receiving chip. The mounting tolerance of the single optical receiving chip is increased relative to that of an integrated optical receiving chip array, and thus the coupling difficulty from the reflection prism 720 to the optical receiving chip 740 is relatively large. Therefore, by making the third converging lens 730 an independent single converging lens, it is convenient to realize the optical path coupling from the reflection prism 720 to the optical receiving chip 740; at the same time, the coupling tolerance is increased, which is convenient to reduce the difficulty of the assembly process of the optical receiving component.

[0117] Furthermore, in order to facilitate the installation of the third converging lens 730, a cushion block 780 is arranged on the circuit board 300. Figure 19 It is a partial enlarged view of the optical receiving component in the optical module provided by the embodiment of the present application. As Figure 19As shown, the spacer 780 is disposed on one side of the optical receiving chip 740. One end of the third converging lens 730 is disposed on the spacer 780, and the other end is located above the optical receiving chip 740. The signal light whose transmission direction is changed by the reflection prism 720 is converged by the third converging lens 730 and transmitted to the photosensitive surface of the optical receiving chip 740. By providing the spacer 780 on the circuit board 300 to fixedly mount the third converging lens 730, the height of the spacer 780 can be adjusted according to the installation height requirement of the third converging lens 730, thereby facilitating the installation of each third converging lens 730 to the accurate position and ensuring the optical receiving efficiency of the optical receiving chip 740.

[0118] Figure 20 It is a schematic diagram of the optical receiving circuit in the optical module provided by the embodiment of the present application. Figure 21 It is a side view of the optical receiving circuit in the optical module provided by the embodiment of the present application. As Figure 20 、 Figure 21 As shown, the second fiber optic adapter 600, the second displacement prism 4206, the optical demultiplexer 4207, the lens array 710, the reflection prism 720, the third converging lens 730, and the optical receiving chip 740 are arranged in sequence along the optical receiving direction. The signal light beam transmitted by the second fiber optic adapter 600 is transmitted to the second displacement prism 4206. After being refracted and reflected by the second displacement prism 4206, one signal light beam is injected into the optical demultiplexer 4207. The optical demultiplexer 4207 demultiplexes one signal light beam into multiple signal light beams. The multiple signal light beams are coupled to the reflection prism 720 via the lens array 710. The reflection prism 720 converts the multiple signal light beams parallel to the surface of the circuit board 300 into multiple signal light beams perpendicular to the surface of the circuit board 300. The reflected signal light beams are converged and coupled to the corresponding optical receiving chip 740 via the third converging lens 730, realizing the reception and photoelectric conversion of the signal light.

[0119] In the embodiment of the present application, since the received signal light beam is converted from a parallel beam to a vertical beam by the reflection prism 720, the height of the optical receiving chip 740 from the surface of the circuit board 300 is lower than the height of the optical demultiplexer 4207 from the surface of the circuit board 300. In the present application, the second cavity 4202 on the second housing 420 is recessed into the first cavity 4201 to increase the fixed height of the optical demultiplexer 4207 on the second housing 420.

[0120] Figure 22 It is a schematic diagram of the structure of the first housing 410 in the optical module provided by the embodiment of the present application. Figure 23 It is an assembly schematic diagram of the first housing 410 and the circuit board 300 in the optical module provided by the embodiment of the present application. As Figure 11 、 Figure 23As shown in the figure, the first housing 410 is a housing with openings on the left, right, and upper sides, which is composed of a first bottom plate 4110, a first side plate 4120, and a second side plate 4130. At the right opening of the first bottom plate 4110, a third bottom plate 4140 is provided. The third bottom plate 4140 is recessed from the first bottom plate 4110, such that there is a stepped surface between the third bottom plate 4140 and the first bottom plate 4110.

[0121] The left side surface of the circuit board 300 inserted into the first housing 410 abuts against the left side surface of the third bottom plate 4140, thereby positioning the circuit board 300. That is, after the circuit board 300 is inserted into the first housing 410, it moves along the surface of the first bottom plate 4110 of the first housing 410 from right to left by rubbing until the side surface of the circuit board 300 corresponding to the light emitting part abuts against the side surface of the third bottom plate 4140 for positioning. Then, the lower surface of the circuit board 300 is bonded to the third bottom plate 4140 with glue to fix the circuit board 300 to the first housing 410.

[0122] When the first housing 410 is fixedly connected to the second housing 420, the third side plate 4220 of the second housing 420 corresponds to the left opening of the first housing 410. The third side plate 4220 and the left side surfaces of the first side plate 4120 and the second side plate 4130 of the first housing 410 can be bonded together with glue to block the left opening of the first housing 410 through the third side plate 4220, thereby realizing the fixation of the first housing 410 and the second housing 420.

[0123] Electronic devices such as capacitors, resistors, triodes, MOS transistors, clock data recovery CDR, power management chips, and data processing chips DSP are provided on the circuit board 300. To ensure that there is sufficient space on the circuit board 300 to accommodate the electronic devices, a protrusion 320 is provided on the circuit board 300. The protrusion 320 extends along the left-right direction of the circuit board 300, that is, the left side of the protrusion 320 is close to the left opening of the first housing 410, and the right side is connected to the circuit board 300 as a whole. The size of the protrusion 320 in the front-back direction is smaller than the size of the circuit board 300 in the front-back direction, such that there is a gap between the right side surface of the protrusion 320 and the right side surface of the circuit board 300. This gap corresponds to the optical emission assembly and is used to avoid the semiconductor cooler 490, the substrate 4901, the laser chip 450, the first converging lens 460, the glass block 480, the collimating lens 470, the optical multiplexer 4205, and the first displacement prism 4204 of the optical emission assembly.

[0124] In the embodiment of the present application, the protrusion 320 is located below the second displacement prism 4206 and the optical demultiplexer 4207 of the optical receiving component. That is, after the second housing 420 is installed above the first housing 410, there is a gap between the bottom surfaces of the second displacement prism 4206 and the optical demultiplexer 4207 in the second housing 420 and the first bottom plate 4110 of the first housing 410. The protrusion 320 of the circuit board 300 is embedded in this gap to increase the area for arranging electronic devices on the circuit board 300.

[0125] Figure 24 This is another perspective assembly schematic diagram of the first housing 410 and the circuit board 300 in the optical module provided by the embodiment of the present application. As Figure 24 shown, since electronic devices 330 are provided on the protrusion 320 of the circuit board 300, in order to avoid the electronic devices 330 on the protrusion 320, an avoidance hole 4150 is provided on the first bottom plate 4110 of the first housing 410. The avoidance hole 4150 corresponds to the electronic devices 330 on the protrusion 320, so that a part of the area on the protrusion 320 can be exposed, facilitating the arrangement of electronic devices 330 on the exposed surface of the protrusion 320, thereby making full use of the narrow space of the optical module and ensuring the connection strength between the circuit board 300 and the first housing 410 and the rationality of the layout of the electronic devices on the circuit board 300.

[0126] The laser chip 450, the first converging lens 460, the substrate 4901, the semiconductor refrigerator 490, the glass block 480 and the collimating lens 470 of the optical transmitting component are fixed on the first bottom plate 4110 of the first housing 410. The first displacement prism 4204 and the optical multiplexer 4205 of the optical transmitting component and the second displacement prism 4206 and the optical demultiplexer 4207 of the optical receiving component are fixed on the second bottom plate 4210 of the second housing 420. After one side of the circuit board 300 is fixed inside the first housing 410 and the third converging lens 730, the optical receiving chip 740, the transimpedance amplifier 750 and the fourth housing equipped with the lens array 710 and the reflection prism 720 are fixed on the circuit board 300, the first housing 410 and the second housing 420 are bonded together, and then the third housing 430 and the first housing 410 are fixed together, thereby assembling the optical transceiver sub-module 400 and realizing the electrical connection between the optical transceiver sub-module 400 and the circuit board 300.

[0127] Figure 25 This is an assembly cross-sectional view of the first housing 410 and the third housing 430 in the optical module provided by the embodiment of the present application. As Figure 22 、 Figure 25As shown, a support platform 4160 is provided on the first bottom plate 4110. The left side surface of the support platform 4160 abuts against the right side surface of the first side plate 4120, and the right side surface is flush with the left side surface of the third bottom plate 4140. The support platform 4160 is used to place the semiconductor cooler 490 and the glass block 480, that is, the bottom surfaces of the semiconductor cooler 490 and the glass block 480 are adhered to the support platform 4160. In addition, the rear side surface of the support platform 4160 abuts against the front side surface of the protrusion 320 of the circuit board 300 to position the protrusion 320.

[0128] The third housing 430 is a housing formed by assembling a top plate and two opposite side plates. The top plate faces the upper housing 201, and the two opposite side plates are respectively connected to the first side plate 4120 and the second side plate 4130 of the first housing 410. Specifically, a first boss 4170 is provided on the support platform 4160 of the first bottom plate 4110. The front side surface of the first boss 4170 abuts against the inner wall of one side plate of the third housing 430, and the contact part is fixed by laser welding; a second boss 4180 is provided on the second side plate 4130 of the first housing 410. The second boss 4180 is arranged opposite to the first boss 4170, and the rear side surface of the second boss 4180 abuts against the inner wall of the other side plate of the third housing 430, and the contact part is fixed by laser welding, thereby realizing the fixed connection between the first housing 410 and the third housing 430.

[0129] In the optical module provided by the embodiment of the present application, a receiving cavity is formed by assembling a first housing, a second housing and a third housing. An optical transmitting component and an optical receiving component are arranged in the receiving cavity. A plurality of laser chips, a plurality of first converging lenses and a plurality of collimating lenses of the optical transmitting component are fixed in the cavity of the first housing. An optical multiplexer and a first displacement prism of the optical transmitting component are fixed in the cavity of the second housing. When the second housing covers the upper part of the first housing, the plurality of laser chips, the plurality of first converging lenses, the plurality of collimating lenses, the optical multiplexer, the first displacement prism and the first optical fiber adapter are located in the same optical transmitting direction, realizing the transmission of multiple transmitting light beams through one optical fiber. The second displacement prism and the optical demultiplexer of the optical receiving component are fixed in the cavity of the second housing. The lens array and the reflection prism of the optical receiving component are fixed in the cavity of the fourth housing. A plurality of optical receiving chips and a transimpedance amplifier of the optical receiving component are fixed on the surface of a circuit board inserted into the first housing. When the second housing covers the upper part of the first housing and the fourth housing covers the upper parts of the optical receiving chips and the transimpedance amplifier, the second optical fiber adapter, the second displacement prism, the optical demultiplexer, the lens array, the reflection prism, the plurality of optical receiving chips and the transimpedance amplifier are located in the same optical receiving direction, realizing the reception of multiple receiving light beams through one optical fiber. The present application belongs to the field of optical device structure design and assembly of optical communication devices, such as 100G products, 400G FR4, etc. Fixing the optical transmitting component and the optical receiving component in the first housing, the second housing and the fourth housing respectively improves the integration of the optical transceiver sub-module and is beneficial to the miniaturization development of the optical module.

[0130] Figure 26 It is a schematic structural diagram of the local optical receiving component assembled to the circuit board in the optical module provided by the embodiment of the present application. As Figure 26 shown, the fourth housing 700 covers the circuit board 300; wherein, a lens array 710 and a reflection prism 720 are arranged inside the fourth housing 700. One end of the fourth housing 700 is connected to a first adjustment plate 760 and the other end is connected to a second adjustment plate 770. Further, the fourth housing 700 covers the reflection prism 720 above the optical receiving chip 740.

[0131] Figure 27 It is a schematic structural diagram of the fourth housing in the optical module provided by the embodiment of the present application Figure 1 , Figure 28 It is a schematic structural diagram of the fourth housing in the optical module provided by the embodiment of the present application Figure 2 , Figure 29 It is an exploded view of the fourth housing, the lens array and the reflection prism in the optical module provided by the embodiment of the present application. As Figures 27 - 29As shown, the fourth housing 700 provided by the embodiment of the present application includes a fourth bottom plate 701, a fifth side plate 702 and a sixth side plate 703 arranged on both sides. The fourth bottom plate 701 is used to fixedly install the lens array 710 and the reflection prism 720. The fifth side plate 702 and the sixth side plate 703 are used to support the fourth bottom plate 701 so that the fourth bottom plate 701 floats above devices such as the optical receiving chip 740. At the same time, the fifth side plate 702 and the sixth side plate 703 are also used for limiting the lens array 710 and the reflection prism 720. In this way, it is convenient to simplify the process of coupling and installing the lens array 710 and the reflection prism 720. Generally, the distance between the fifth side plate 702 and the sixth side plate 703 is greater than the length of the lens array 710 and the reflection prism 720, which is convenient for installing the lens array 710 and the reflection prism 720. Optionally, the ends of the lens array 710 and the reflection prism 720 abut against the fifth side plate 702 or the sixth side plate 703.

[0132] To facilitate the installation of the lens array 710 and the reflection prism 720, a first slot 704 is provided on the fifth side plate 702, and a second slot 705 is provided on the sixth side plate 703. The first slot 704 and the second slot 705 are symmetrically arranged on the fourth housing 700. The lens array 710 and the reflection prism 720 enter and exit the fourth housing 700 through the first slot 704 and the second slot 705. Further, the depths of the first slot 704 and the second slot 705 are less than the heights of the fifth side plate 702 and the sixth side plate 703. In this way, when the lens array 710 and the reflection prism 720 are assembled to the fourth housing 700, the ends of the lens array 710 and the reflection prism 720 abut against the fifth side plate 702 or the sixth side plate 703 at the bottom of the first slot 704 or the second slot 705.

[0133] To facilitate the precise installation of the lens array 710 and the reflection prism 720 on the fourth housing 700, positioning posts are provided on the fourth bottom plate 701. The positioning posts can be used to position the lens array 710 or the reflection prism 720, that is, the positioning posts are close to positioning the lens array 710 or the reflection prism 720. Taking the positioning of the reflection prism 720 by the positioning posts as an example, the positioning post 706 is arranged on one side of the reflection prism 720, and the cylindrical surface connecting its reflection surface on the reflection prism 720 is adhesively connected to the positioning post 706. In this way, when the reflection prism 720 is installed on the fourth housing 700, the fifth side plate 702 or the sixth side plate 703 positions the reflection prism 720 in the width direction of the fourth housing 700, and the positioning post 706 positions the reflection prism 720 in the length direction of the fourth housing 700. Furthermore, it is convenient to achieve the precise installation of the reflection prism 720 on the fourth housing 700. The lens array 710 is mounted on one side of the reflection prism 720, which further facilitates the precise installation of the lens array 710 on the fourth housing 700 and helps to ensure the accuracy and flatness of the mounting position of the lens array 710 on the reflection prism 720.

[0134] When an arc appears at the connection between the fifth side plate 702 and the sixth side plate 703 and the fourth bottom plate 701 due to poor right-angle machining, it may interfere with the installation of the lens array 710 and the reflection prism 720. To avoid the appearance of an arc at the connection between the fifth side plate 702 and the sixth side plate 703 and the fourth bottom plate 701 due to poor right-angle machining, a counterbore can be provided at the connection between the fifth side plate 702 and the sixth side plate 703 and the fourth bottom plate 701. For example, a counterbore 707 is provided at the connection between the fifth side plate 702 and the fourth bottom plate 701. The counterbore 707 can effectively prevent an arc from appearing at the connection between the fifth side plate 702 and the fourth bottom plate 701 and interfering with the installation of the lens array 710 and the reflection prism 720, and improve the stability of the receiving optical path. When one end of the lens array 710 and the reflection prism 720 abuts against the fifth side plate 702, the counterbore 707 can be provided only at the connection between the fifth side plate 702 and the fourth bottom plate 701. Of course, counterbores can be provided at the connections between the fifth side plate 702 and the sixth side plate 703 and the fourth bottom plate 701. According to specific usage requirements, one end of the lens array 710 and the reflection prism 720 can abut against the fifth side plate 702 or the sixth side plate 703.

[0135] To facilitate the installation of the fourth housing 700, an identification round hole 708 is provided on the fourth bottom plate 701, and the identification round hole 708 penetrates the fourth bottom plate 701. When the fourth housing 700 is coupled and fixed to the circuit board 300, the positioning and identification of the fourth housing 700 are performed through the identification round hole 708.

[0136] The fourth housing 700 can be made of a metal material, which is convenient for the coupling and installation of the lens array 710 and the reflection prism 720, and can reduce the influence of the emitted signal light on the light reception and shield the electromagnetic interference of the electrical components in the light reception component. Optionally, the fourth housing 700 is made of kovar alloy. Furthermore, the expansion coefficient of the fourth housing 700 is close to the expansion coefficients of the lens array 710 and the reflection prism 720, which is convenient for ensuring the stability of the optical path during the high and low temperature deformation of the fourth housing 700.

[0137] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, characterized in that, Comprising: A circuit board; A second optical fiber adapter, located at the optical port of the optical module, for inputting optical signal lights of multiple wavelengths through wavelength division multiplexing; A second housing, formed with a first cavity and a second cavity; The second cavity communicates with the second optical fiber adapter; An optical receiving component, arranged on the circuit board, for receiving the optical signal light input through the second optical fiber adapter; An optical transmitting component, including an optical multiplexer; the optical multiplexer is located in the first cavity; Wherein, the optical receiving component includes: An optical demultiplexer, located in the second cavity, for demultiplexing the optical signal output by the second optical fiber adapter and outputting multiple paths of optical signal lights; An optical receiving chip, arranged on the circuit board and located outside the second cavity, and electrically connected to the circuit board; A fourth housing, including a fourth bottom plate and a fifth side plate and a sixth side plate arranged on both sides of the fourth bottom plate, the fourth bottom plate, the fifth side plate and the sixth side plate form an opening, the opening faces the optical demultiplexer; the fourth bottom plate is located above the optical receiving chip; the bottoms of the fifth side plate and the sixth side plate are connected to the circuit board; A reflecting prism, connected to the fourth housing and located on the output optical path of the optical demultiplexer; the reflecting mirror includes a reflecting surface, the reflecting surface projects on the circuit board to cover the optical receiving chip, and the reflecting surface reflects and transmits the multiple paths of optical signal lights output by the optical demultiplexer to the optical receiving chip; A third converging lens, the third converging lens is arranged on the transmission optical path from the reflecting prism to the optical receiving chip to transmit the optical signal light reflected by the reflecting surface to the optical receiving chip.

2. The optical module according to claim 1, wherein, The optical receiving component further includes a spacer, the spacer is arranged on the circuit board, one end of the third converging lens is connected and arranged on the spacer, and one end of the third converging lens provided with a converging protrusion is suspended above the optical receiving chip.

3. The optical module according to claim 1, characterized in that The top of the reflecting prism is connected to the fourth bottom plate, and one end of the reflecting prism abuts against the fifth side plate or the sixth side plate; A first slot is arranged on the fifth side plate, and one end of the reflecting prism abuts against and is connected to the bottom of the first slot on the fifth side plate; And / or, a second slot is arranged on the sixth side plate, and the other end of the reflecting prism abuts against and is connected to the bottom of the second slot on the sixth side plate.

4. The optical module according to claim 3, wherein The optical module further includes a first adjusting plate and a second adjusting plate, the first adjusting plate and the second adjusting plate are arranged on the circuit board and the first adjusting plate is located on one side of the optical receiving chip, the second adjusting plate is located on the other side of the optical receiving chip; The first adjusting plate supports and connects one end of the fifth side plate and one end of the sixth side plate, and the second adjusting plate supports and connects the other end of the fifth side plate and the other end of the sixth side plate.

5. The optical module according to claim 3, characterized in that, Positioning posts are arranged on the fourth bottom plate, and the side surfaces of the positioning posts are connected to the column surfaces of the reflecting prism close to the reflecting surface.

6. The optical module according to claim 3, wherein A sink is arranged on the fourth bottom plate, the sink is arranged at the connection between the fifth side plate and the fourth bottom plate, and one end of the reflecting prism straddles the sink.

7. The optical module according to claim 1, wherein The optical receiving component further includes a lens array, and the lens array is arranged on the cylindrical surface of the reflecting prism away from the reflecting surface; protrusions are arranged on the side surface of the lens array close to the cylindrical surface.

8. The optical module according to claim 3, characterized in that, An identification round hole is arranged on the fourth bottom plate, and the identification round hole penetrates through the fourth bottom plate.

9. The optical module according to claim 1, wherein The optical module further includes a first housing, a third housing, an optical transmitting component and a protective cover; The third housing is located at one end of the second housing away from the second optical fiber adapter. The first housing covers the second housing and the third housing to form a receiving cavity. Both the optical transmitting component and the optical receiving component are placed in the receiving cavity, and one end of the circuit board extends into the receiving cavity; One side of the first housing is provided with an opening, the circuit board is inserted into the first housing through the opening, and the optical transmitting component is electrically connected to the circuit board inserted into the first housing by wire bonding; The second housing includes a second bottom plate, a third side plate and a fourth side plate. The bottom surfaces of the third side plate and the fourth side plate are respectively connected to the second bottom plate, and the side surface of the fourth side plate is connected to the third side plate; A second through hole is arranged on the third side plate, and the second optical fiber adapter is connected to the second through hole; The protective cover is arranged between the third housing and the circuit board and covers the optical transmitting component, and is used to protect the optical transmitting component and the gold wire connecting the optical transmitting component and the circuit board; a notch is arranged on one side of the protective cover, and the notch is used to avoid the optical receiving component.

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