Display panel, manufacturing method thereof and display device

Abstract

The present disclosure relates to the technical field of display, and proposes a display panel, a manufacturing method thereof and a display device. The display panel comprises an array substrate, a composite functional layer, a first bonding layer and a cover plate. The composite functional layer is located on the side of the light-emitting layer away from the substrate. The array substrate and the composite functional layer are provided with a through hole penetrating through the composite functional layer and the array substrate. The array substrate comprises a non-display area surrounding the through hole. The composite functional layer comprises a first light shielding layer, and the first light shielding layer is located in the non-display area of the array substrate in orthographic projection. The first bonding layer is located on the side of the composite functional layer away from the substrate. The cover plate is located on the side of the first bonding layer away from the substrate. The display panel has a small frame width.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display panel, a manufacturing method thereof, and a display device. BACKGROUND

[0002] In the under-screen camera technology, the non-display area around the camera through hole is usually shielded by the ink coated on the cover plate to avoid light leakage. However, due to the bonding error when the cover plate is bonded, a larger frame width needs to be reserved around the camera through hole.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art.

[0004] DISCLOSURE

[0005] According to one aspect of the present disclosure, a display panel is provided, wherein the display panel comprises: an array substrate, a composite functional layer, a first bonding layer, a cover plate, the array substrate comprises a substrate and a light emitting layer; the composite functional layer is located on the side of the light emitting layer away from the substrate; a through hole is formed on the array substrate and the composite functional layer, penetrating through the composite functional layer and the array substrate; wherein the array substrate comprises a non-display area surrounding the through hole, the composite functional layer comprises a first light shielding layer, the first light shielding layer is located in the non-display area of the array substrate in the orthographic projection of the array substrate; the first bonding layer is located on the side of the composite functional layer away from the substrate; the cover plate is located on the side of the first bonding layer away from the substrate.

[0006] In an exemplary embodiment of the present disclosure, the orthographic projection of the first light shielding layer coincides with the non-display area of the array substrate.

[0007] In an exemplary embodiment of the present disclosure, the opening of the through hole is circular, and the non-display area is circular ring-shaped.

[0008] In an exemplary embodiment of the present disclosure, the array substrate further comprises: an encapsulation layer, a touch functional layer, the encapsulation layer is located on the side of the light emitting layer away from the substrate; the touch functional layer is located on the side of the encapsulation layer away from the substrate; the first light shielding layer is located on the side of the touch functional layer away from the substrate.

[0009] In an exemplary embodiment of the present disclosure, the composite functional layer further comprises: a second bonding layer, a polarizer, the second bonding layer is located on the side of the first light shielding layer away from the substrate; the polarizer is located on the side of the second bonding layer away from the substrate.

[0010] In an example embodiment of the present disclosure, the composite functional layer further comprises: a third adhesive layer located on a side of the polarizer away from the substrate; and the display panel further comprises: a privacy film located between the first adhesive layer and the third adhesive layer.

[0011] In an example embodiment of the present disclosure, the light-emitting layer comprises a plurality of light-emitting units, and the composite functional layer further comprises: a color film layer comprising a plurality of color filter portions and a light-shielding portion located between the plurality of color filter portions, the plurality of color filter portions are arranged one-to-one corresponding to the plurality of light-emitting units, and the color filter portion and the light-emitting unit corresponding thereto are at least partially overlapped in orthographic projection on the substrate.

[0012] In an example embodiment of the present disclosure, the thickness of the first light-shielding layer is greater than the thickness of the light-shielding portion.

[0013] In an example embodiment of the present disclosure, the thickness of the first light-shielding layer is 4-10 microns.

[0014] In an example embodiment of the present disclosure, the composite functional layer further comprises: a fourth adhesive layer located on a side of the color film layer away from the substrate; and the display panel further comprises: a privacy film located between the first adhesive layer and the fourth adhesive layer.

[0015] In an example embodiment of the present disclosure, the display panel further comprises: a second light-shielding layer located between the first adhesive layer and the cover plate, the second light-shielding layer comprises an inner ring portion and an outer ring portion surrounding the inner ring portion, the outer ring portion covers the non-display area in orthographic projection on the array substrate, and the through-hole sidewall surrounds the inner ring portion in orthographic projection on the plane where the array substrate is located.

[0016] In an example embodiment of the present disclosure, the material of the first light-shielding layer is a light-shielding photoresist material or ink; and the material of the second light-shielding layer is a light-shielding photoresist material or ink.

[0017] In an example embodiment of the present disclosure, the display panel is a flexible display panel.

[0018] According to an aspect of the present disclosure, a display device is provided, comprising: the display panel and an image pickup device; at least part of the image pickup device is located in the through hole of the display panel.

[0019] According to one aspect of the present disclosure, a display panel manufacturing method is provided, comprising:

[0020] providing an array substrate to be opened, the array substrate to be opened comprising a substrate and a light-emitting layer, and further comprising an opening area to be opened and a non-display area surrounding the opening area to be opened;

[0021] forming a composite functional layer to be opened on a side of the light-emitting layer away from the substrate, the composite functional layer to be opened comprising a first light-shielding material layer;

[0022] forming a through hole in the opening area to be opened of the array substrate to be opened, the through hole penetrating the array substrate and the composite functional layer, wherein the first light-shielding material layer after opening is located in the non-display area of the array substrate in orthographic projection;

[0023] bonding a cover plate on a side of the composite functional layer away from the substrate through a first bonding layer.

[0024] In an exemplary embodiment of the present disclosure, the first light-shielding layer is coincident with the non-display area of the array substrate in orthographic projection.

[0025] In an exemplary embodiment of the present disclosure, the opening of the through hole is circular, and the non-display area is annular.

[0026] In an exemplary embodiment of the present disclosure, the array substrate to be opened further comprises:

[0027] an encapsulation layer on a side of the light-emitting layer away from the substrate;

[0028] a touch functional layer on a side of the encapsulation layer away from the substrate;

[0029] the first light-shielding layer is on a side of the touch functional layer away from the substrate.

[0030] In an exemplary embodiment of the present disclosure, forming a composite functional layer to be opened on a side of the light-emitting layer away from the substrate to be opened comprises:

[0031] forming a first light-shielding material layer on a side of the light-emitting layer away from the substrate to be opened through a photolithography process;

[0032] wherein the first light-shielding material layer comprises a first light-shielding portion and a second light-shielding portion surrounding the first light-shielding portion, the first light-shielding portion is coincident with the opening area to be opened in orthographic projection of the array substrate, and the second light-shielding portion surrounds the opening area to be opened in orthographic projection of the array substrate and is located in the non-display area of the array substrate.

[0033] In an example embodiment of the present disclosure, the composite functional layer to be opened is formed on the side of the light-emitting layer away from the substrate to be opened, and further comprises:

[0034] A second adhesive layer is formed on the side of the first light-blocking layer away from the substrate;

[0035] A polarizer is formed on the side of the second adhesive layer away from the substrate.

[0036] In an example embodiment of the present disclosure, the composite functional layer to be opened is formed on the side of the light-emitting layer away from the substrate to be opened, and further comprises:

[0037] A third adhesive layer is formed on the side of the polarizer away from the substrate;

[0038] The manufacturing method further comprises:

[0039] A privacy film is formed between the first adhesive layer and the third adhesive layer.

[0040] In an example embodiment of the present disclosure, the light-emitting layer comprises a plurality of light-emitting units, and the composite functional layer to be opened is formed on the side of the light-emitting layer away from the substrate, and comprises:

[0041] A color film layer is formed on the side of the light-emitting layer away from the substrate to be opened, the color film layer comprises a plurality of color filter portions and a light-blocking portion between the plurality of color filter portions, the plurality of color filter portions are arranged one-to-one corresponding to the plurality of light-emitting units, and the color filter portion and the light-emitting unit corresponding thereto at least partially overlap in the orthographic projection of the substrate.

[0042] The light-blocking portion of the color film layer is formed in the same layer as the first light-blocking material layer.

[0043] In an example embodiment of the present disclosure, the composite functional layer to be opened is formed on the side of the light-emitting layer away from the substrate, and further comprises:

[0044] The thickness of the first light-blocking material layer is thickened by at least one coating process.

[0045] In an example embodiment of the present disclosure, the composite functional layer to be opened is formed on the side of the light-emitting layer away from the substrate, and further comprises:

[0046] A fourth adhesive layer is formed on the side of the color film layer away from the substrate;

[0047] The manufacturing method further comprises:

[0048] A privacy film is formed between the first bonding layer and the fourth bonding layer.

[0049] In an example embodiment of the present disclosure, a composite functional layer to be opened is formed on a side of the light-emitting layer away from the substrate to be opened, including:

[0050] A first light-blocking material layer is formed on the side of the light-emitting layer away from the substrate to be opened by a photolithography process, the first light-blocking material layer being coincident with the non-display area of the array substrate in orthographic projection.

[0051] In an example embodiment of the present disclosure, the display panel manufacturing method further includes:

[0052] A second light-blocking layer is formed on a side of the cover plate to be bonded to the first bonding layer, the second light-blocking layer including an inner ring portion and an outer ring portion surrounding the inner ring portion.

[0053] Wherein, after the cover plate is bonded to the composite functional layer, the outer ring portion covers the non-display area of the array substrate in orthographic projection, and the through-hole sidewall surrounds the inner ring portion in orthographic projection on the plane of the array substrate.

[0054] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0055] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure. It is clear that the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art without creative labor based on these drawings.

[0056] Figure 1 A structural schematic diagram of a display panel in the related art;

[0057] Figures 2-8 A process flow diagram in an example embodiment of a display panel manufacturing method of the present disclosure;

[0058] Figures 9-18 A process flow diagram in an example embodiment of a display panel manufacturing method of the present disclosure;

[0059] Figure 19 A structural schematic diagram in an example embodiment of a display panel of the present disclosure;

[0060] Figure 20FIG. 1 shows a schematic view of a structure in an exemplary embodiment of a display panel of the present disclosure;

[0061] Figure 21 FIG. 1 shows a schematic view of a structure in an exemplary embodiment of a display panel of the present disclosure; Figure 20 FIG. 1 shows a schematic view of a structure in an exemplary embodiment of a display panel of the present disclosure;

[0062] Figure 22 FIG. 1 shows a schematic view of a structure in an exemplary embodiment of a display panel of the present disclosure;

[0063] Figure 23 FIG. 1 shows a schematic view of a structure in an exemplary embodiment of a display panel of the present disclosure. DETAILED DESCRIPTION

[0064] Example embodiments now will be described more fully hereinafter with reference to the accompanying drawings. Example embodiments, however, can be implemented in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of example embodiments to those skilled in the art. Like reference numerals refer to like elements throughout the several views of the drawings, and description of the same elements will be omitted from description of the several views.

[0065] Although relative terms such as "upper", "lower", etc. are used herein to describe one component's relationship to another component as illustrated in the figures, such terminology is used for convenience only and is merely an aid to the understanding of the disclosure. It is to be understood that the connections of the devices of the figures can be flipped over such that the components described as "upper" would then be "lower". Other relative terms such as "high", "low", "top", "bottom", "left", "right", etc. are to be construed in a like fashion. When a structure is "on" another structure, it can mean that the structure is formed integrally with the other structure, or that the structure is "directly" on the other structure, or that the structure is "indirectly" on the other structure via another structure.

[0066] The terms "a", "an", "the" are used to mean one or more than one, unless otherwise indicated by the context of the description. The terms "includes" and "having" should be construed as open terms meaning that there can be additional elements / parts / etc. other than those listed.

[0067] As Figure 1As shown in the structural schematic diagram of a display panel in the related art, the display panel can include a light-emitting layer 01, an encapsulation layer 02, a touch function layer 03, a pressure-sensitive adhesive layer 04, a polarizer 05, an optical adhesive layer 06, and a cover plate 07. The light-emitting layer 01, the encapsulation layer 02, the touch function layer 03, the pressure-sensitive adhesive layer 04, the polarizer 05, and the optical adhesive layer 06 are formed with a through hole 09. The through hole 09 can be used to set a camera and other peripheral devices. The display panel needs to set a non-display area around the through hole 09, and the non-display area can be used to integrate signal lines and encapsulation structures. In the related art, as shown in the figure, Figure 1 The side of the cover plate 07 bonded with the optical adhesive layer 06 can be formed with an annular ink layer 08, which is arranged around the through hole 09. The annular ink layer 08 can be used to shield the light leakage of the above-mentioned non-display area. In the related art, due to process limitations, the minimum width of the annular ink layer 08 is A, and due to the bonding error B when the cover plate is bonded, the frame width of the display panel is A+B, and the display panel has a relatively wide frame. In addition, due to the relatively large thickness of the polarizer 05 and the touch function layer 03, for example, the thickness of the polarizer 05 can reach 136 um, and the thickness of the touch function layer 03 can reach 48 um, part of the light emitted by the light-emitting layer 01 (such as the arrow shown) will be refracted in the touch function layer 03 and the polarizer 05, and then emitted through the area where the through hole 09 is located, thereby causing light leakage in the area of the through hole 09. Figure 1

[0068] Based on this, the present exemplary embodiment first provides a display panel manufacturing method, which can include:

[0069] Step S1: providing an array substrate to be opened, the array substrate to be opened including a substrate and a light-emitting layer, and the array substrate to be opened further including a to-be-opened area and a non-display area surrounding the to-be-opened area;

[0070] Step S2: forming a to-be-opened composite functional layer on the side of the light-emitting layer away from the substrate, the to-be-opened composite functional layer including a first light-shielding material layer;

[0071] Step S3: forming a through hole in the to-be-opened area of the array substrate to be opened, the through hole penetrating the array substrate and the composite functional layer, wherein the first light-shielding material layer after opening can be located in the non-display area of the array substrate in the orthographic projection of the array substrate;

[0072] Step S4: bonding a cover plate on the side of the composite functional layer away from the substrate through a first bonding layer.

[0073] ​On the one hand, compared with related technologies, in the display panel manufactured by the display panel manufacturing method of this exemplary embodiment, the first light-shielding material layer and the light-emitting layer have a smaller spacing in the stacking direction, thereby the first light-shielding material layer in the display panel has a better light-shielding effect. On the other hand, the first light-shielding material layer in this exemplary embodiment can be formed by photolithography, which has high precision and can make the orthographic projection of the first light-shielding material layer after the opening coincide with the non-display area of ​​the array substrate, thereby avoiding the problem of a large non-display area width caused by cover plate bonding error.

[0074] The following exemplary embodiment will provide a detailed description of the above steps:

[0075] like Figures 2-8 The diagram shown is a process flow chart of an exemplary embodiment of the display panel manufacturing method of this disclosure. Figure 2 , 3 As shown, Figure 2 A top view of a substrate to be drilled array is shown in an exemplary embodiment. Figure 3 A partial cross-sectional view of the display panel is shown, the cutting lines of which can be seen from the view. Figure 2 The location of the dashed line AA. In step S1, an array substrate 1 to be opened is provided. The array substrate 1 to be opened may include a substrate 11, a circuit layer 12, a light-emitting layer 13, an encapsulation layer 14, and a touch function layer 15 stacked sequentially. The light-emitting layer 13 may include a hole injection layer, a light-emitting material layer, an electron injection layer, etc., and may include multiple light-emitting units, including R light-emitting unit R, G light-emitting unit G, and B light-emitting unit B. The circuit layer 12 may include a pixel driving circuit, which can be used to provide driving current to the light-emitting units in the light-emitting layer. The encapsulation layer 14 can be used to encapsulate the light-emitting layer 13 to isolate it from external water and oxygen. The touch function layer 15 may include sensing signal lines and excitation signal lines located on different conductive layers and arranged crosswise, and a protective layer located on the side of the sensing signal lines and excitation signal lines away from the substrate 11. This protective layer may be an organic layer. The conductive layer containing the sensing signal line can be formed by stacking titanium, aluminum, and titanium layers. Similarly, the conductive layer containing the excitation signal line can also be formed by stacking titanium, aluminum, and titanium layers. An insulating layer can isolate the conductive layers containing the sensing signal line and the excitation signal line. The touch function layer 15 can determine the touch location on the display panel based on the capacitance change between the sensing signal line and the excitation signal line. Figure 2 , 3As shown, the array substrate 1 to be drilled can also include a to-be-drilled region A2 and a non-display region A1 surrounding the to-be-drilled region A2, and a display region A3 surrounding the non-display region A1. The to-be-drilled region A2 can not be provided with effective pixel units, i.e., the to-be-drilled region A2 is not used for displaying images. The non-display region A1 can be used for integrating signal lines (e.g., gate lines, data lines, etc.) and packaging structures (e.g., blocking dams in a packaging layer). As shown in FIGS. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, and 15, the to-be-drilled region A2 can be provided with a touch function layer 15, and the touch function layer 15 can be provided with a plurality of touch electrodes 151. Figure 2 As shown, the to-be-drilled region A2 can be circular, and the non-display region A1 can be a circular ring concentric with the to-be-drilled region A2.

[0076] It should be understood that in other exemplary embodiments, the array substrate 1 to be drilled can also have other structures, for example, the array substrate 1 to be drilled can not be provided with the touch function layer 15, or the touch function layer 15 is provided at other positions. The to-be-drilled region A2 can be other shapes, for example, the to-be-drilled region A2 can be elliptical, rectangular, etc., and correspondingly, the non-display region A1 can be a ring shape identical to the shape of the to-be-drilled region A2, i.e., the inner ring shape and the outer ring shape of the non-display region A1 are identical to the shape of the to-be-drilled region A2.

[0077] As shown in FIGS. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, and 15, Figure 2 , 3 , 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, and 15, Figure 4A top view of the first light-shielding material layer in an example embodiment is shown. In step S2, the composite functional layer 2 to be opened is formed on the side of the light-emitting layer 13 away from the substrate substrate 11. The composite functional layer 2 to be opened can include, in order from the side of the touch functional layer 15 away from the substrate substrate, a first light-shielding material layer 21, a second adhesive layer 22, a polarizer 23, and a third adhesive layer 24. That is, the composite functional layer 2 to be opened can include, in order from top to bottom, the first light-shielding material layer 21, the second adhesive layer 22, the polarizer 23, and the third adhesive layer 24. The second adhesive layer 22 can be a pressure-sensitive adhesive layer, and the third adhesive layer 24 can be an optical adhesive layer. The second adhesive layer 22 can fill the thickness difference caused by the first light-shielding material layer 21. The first light-shielding material layer 21 can include a first light-shielding portion 211 and a second light-shielding portion 212 surrounding the first light-shielding portion 211. The first light-shielding portion 211 can coincide with the to-be-opened area A2 in the orthographic projection of the array substrate 1 to be opened, and the second light-shielding portion 212 can coincide with the non-display area A1 of the array substrate in the orthographic projection of the array substrate 1 to be opened. The material of the first light-shielding material layer 21 can be a light-shielding photoresist material, such as black photoresist material. The first light-shielding material layer 21 can be formed by a photolithography process. Since the photolithography process has high precision, the second light-shielding portion 212 can completely coincide with the non-display area A1 in the orthographic projection of the array substrate 1 to be opened. Therefore, the display panel produced by this method does not need to reserve a fitting error in the frame area, so that the display panel produced has a smaller frame width.

[0078] It should be understood that in other example embodiments, the first light-shielding material layer 21 can also be located at other positions, and the first light-shielding material layer 21 can also be formed by other materials and by other methods. For example, the first light-shielding material layer 21 can be located between the polarizer 23 and the third adhesive layer 24. The material of the first light-shielding material layer 21 can be ink, and the first light-shielding material layer 21 can be formed by ink transfer printing, mask coating, or the like. In addition, the first light-shielding material layer 21 can also have other shapes, for example, as shown in Figure 5 、 6 , Figure 5 A cross-sectional view of the array substrate to be opened and the composite functional layer to be opened after being bonded in another example embodiment is shown. Figure 6 A top view of the first light-shielding material layer 21 in another example embodiment is shown. In this example embodiment, when the first light-shielding material layer 21 is formed by a photolithography process, the first light-shielding material layer 21 can be directly formed in the shape of the second light-shielding portion 212, so that the first light-shielding material layer 21 does not need to be cut when the through hole is opened. Figure 4

[0079] As shown in Figure 7 ​As shown, in step S3, the display panel manufacturing method may further include: forming a through hole 3 in the area to be opened A2, wherein the through hole 3 can penetrate the array substrate 1 to be opened and the composite functional layer 2 to be opened. Specifically, the through hole 3 can be formed by laser cutting. After forming the through hole 3, the first light-shielding portion 211 of the first light-shielding material layer 21 is removed, leaving only the second light-shielding portion 212 of the first light-shielding material layer 21.

[0080] In this exemplary embodiment, as Figure 8 As shown, in step S4, the manufacturing method may further include: bonding a cover plate 6 to the side of the composite functional layer 2 facing away from the substrate 11 after the opening is achieved through the first adhesive layer 5. Figure 8 As shown, the manufacturing method may further include forming a privacy film 4 between the first adhesive layer 5 and the third adhesive layer 24. The venetian blind structure of the privacy film 4 can block most of the light from a 45°-90° viewing angle, thereby further reducing light leakage in the through-hole 3. The first adhesive layer 5 can be an optical adhesive layer.

[0081] In other exemplary embodiments, the composite functional layer 2 to be perforated may also have other structures, such as Figures 9-18 The diagram shown is a process flow chart of an exemplary embodiment of the display panel manufacturing method of this disclosure. Figure 9 As shown, in step S2, forming a composite functional layer with an opening to be made on the side of the light-emitting layer opposite to the substrate can include: forming a color filter layer 25 on the side of the touch functional layer 15 opposite to the substrate 11 with the opening to be made. The color filter layer 25 can include a plurality of color filter portions 251 and light-shielding portions 252 located between the plurality of color filter portions 251. The plurality of color filter portions 251 are correspondingly arranged with the plurality of light-emitting units R, G, B, and the orthographic projection of the color filter portion 251 on the substrate 11 with the opening to be made can at least partially overlap with the orthographic projection of the corresponding light-emitting unit on the substrate 11. For example, the orthographic projection of the color filter portion 251 on the substrate 11 can cover the orthographic projection of the corresponding light-emitting unit on the substrate 11. The light-shielding portion 252 of the color filter layer 25 can be formed in the same layer as the first light-shielding material layer 21, that is, the light-shielding portion 252 can be formed with the first light-shielding material layer 21 in a single patterning process. The color filter layer 25 can replace the polarizer to prevent reflections from the display panel. The first light-shielding material layer 21 may also include a first light-shielding part 211 and a second light-shielding part 212 surrounding the first light-shielding part 211.

[0082] In this exemplary embodiment, the specific manner in which the color filter layer 25 is formed may include: as follows Figure 10As shown, a light-shielding photoresist layer is formed on the side of the touch functional layer 15 opposite to the substrate 11, and this photoresist layer is etched and developed using a photolithography process to form the first light-shielding material layer 21 and the light-shielding portion 252 of the color filter layer. This light-shielding photoresist layer can be a black photoresist layer. Then, as... Figure 11 , 12 As shown in Figure 13, the red filter 251 corresponding to the R light-emitting unit, the green filter 251 corresponding to the G light-emitting unit, and the blue filter 251 corresponding to the B light-emitting unit can be formed sequentially through multiple masking processes. Figures 10-13 As shown, the thickness of the color filter section 251 can be greater than the thickness of the light-shielding section 252, so that the color filter section 251 can filter the light emitted by the light-emitting unit at a larger viewing angle.

[0083] In this exemplary embodiment, in order to further reduce the transmittance of the first light-shielding material layer and increase the light-shielding effect of the first light-shielding material layer 21, such as... Figure 14 As shown, forming a composite functional layer for the opening on the side of the touch functional layer 15 opposite to the substrate 11 to which the opening is to be formed may further include: increasing the thickness of the first light-shielding material layer 21 through one or more coating processes. It should be understood that in other exemplary embodiments, forming a thicker first light-shielding material layer 21 can also be achieved in other ways. For example, a thicker light-shielding resist layer can be formed on the side of the touch functional layer 15 opposite to the substrate 11, and this resist layer can be photolithographically formed using a halftone mask process, thereby forming a thicker first light-shielding material layer 21 and a thinner light-shielding portion 252. The thickness of the first light-shielding layer can be 4-10 micrometers, for example, 4 micrometers, 6 micrometers, 8 micrometers, 10 micrometers, etc.

[0084] In this exemplary embodiment, as Figure 15 As shown, a composite functional layer for creating an opening is formed on the side of the light-emitting layer opposite to the substrate 11 to which the opening is to be made. The method may further include forming a fourth adhesive layer 26 on the side of the color filter layer 25 opposite to the substrate 11. Similarly, the display panel manufacturing method further includes forming a through-hole 3 in the opening area A2 of the array substrate 1 to which the opening is to be made. The through-hole 3 can penetrate both the array substrate 1 to which the opening is to be made and the composite functional layer 2 to which the opening is to be made. The fourth adhesive layer 26 may be an optical adhesive layer.

[0085] like Figure 16 As shown, the method for manufacturing the display panel may further include: bonding a cover plate 6 to the side of the composite functional layer 2 facing away from the substrate 11 via a first adhesive layer 5. Figure 16As shown, the manufacturing method can further include forming a privacy film 4 between the first adhesive layer 5 and the fourth adhesive layer 26. The louver structure of the privacy film 4 can shield most of the light in the 45°-90° viewing angle, thereby further reducing the amount of light leakage in the through hole 3.

[0086] As shown, Figure 17 , 18 As shown, Figure 18 As shown, the manufacturing method can further include forming a second light shielding layer 8 on the side of the cover plate to be attached to the first adhesive layer 8, which can include an inner ring portion 81 and an outer ring portion 82 surrounding the inner ring portion 81. After the cover plate 6 is attached to the composite functional layer 2, the outer ring portion 82 can cover at least part of the non-display area A1 of the array substrate 1 in the orthographic projection of the array substrate 1, and the through hole 3 sidewall in the orthographic projection of the array substrate 1 can surround the inner ring portion 81 in the orthographic projection of the array substrate 1. The orthographic projection of the circular ring-shaped second light shielding layer 8 in the array substrate plane can be concentric with the orthographic projection of the through hole 3 in the array substrate plane. The material of the second light shielding layer 8 can be ink, and the formation of the second light shielding layer 8 on the side of the cover plate to be attached to the first adhesive layer 8 can be formed by ink transfer printing process or coating process. As shown, Figure 17 As shown, the light indicated by the arrow can be transmitted into the through hole 3 by multiple refractions, and the second light shielding layer 8 can further shield the light in the through hole 3.

[0087] The present example embodiment also provides a display panel, which can be made by the above-mentioned display panel manufacturing method, as shown, Figure 19 As shown, the display panel can include an array substrate 1, a composite functional layer 2, a first adhesive layer 5, a cover plate 6, the array substrate 1 can include a substrate 11 and a light emitting layer 13; the composite functional layer 2 can be located on the side of the light emitting layer 13 away from the substrate 11, and the array substrate 1 and the composite functional layer 2 can be formed with a through hole 3 penetrating the composite functional layer 2 and the array substrate 1; wherein the array substrate 1 can include a non-display area A1 surrounding the through hole 3, the composite functional layer 2 can include a first light shielding layer 212, the orthographic projection of the first light shielding layer 212 in the array substrate 1 can be located in the non-display area A1 of the array substrate 1, wherein the orthographic projection of the first light shielding layer 212 in the array substrate 1 can coincide with the non-display area A1 of the array substrate 1. The first adhesive layer 5 can be located on the side of the composite functional layer 2 away from the substrate 11; the cover plate 6 can be located on the side of the first adhesive layer 5 away from the substrate 11.

[0088] In the example embodiment, the opening of the through hole 3 can be circular, and the non-display area A1 can be a circular ring. In other example embodiments, the opening of the through hole 3 can also be other shapes, for example, the opening of the through hole 3 can be oval, rectangular, etc., and accordingly, the non-display area A1 can be a ring shape identical to the opening shape of the through hole 3, that is, the inner and outer ring shapes of the non-display area A1 are identical to the opening shape of the through hole 3.

[0089] In the example embodiment, the array substrate can further include an encapsulation layer 14, a touch function layer 15, and a circuit layer 12, the circuit layer 12 can be located between the light-emitting layer 13 and the substrate substrate 11, the encapsulation layer 14 can be located on the side of the light-emitting layer 13 away from the substrate substrate 11, the touch function layer 15 can be located on the side of the encapsulation layer 14 away from the substrate substrate 11, and the first light-blocking layer 212 can be located on the side of the touch function layer 15 away from the substrate substrate 11.

[0090] In the example embodiment, the composite function layer 2 can further include a second adhesive layer 22 and a polarizer 23, the second adhesive layer 22 is located on the side of the first light-blocking layer 212 away from the substrate substrate 11, and the polarizer 23 is located on the side of the second adhesive layer 22 away from the substrate substrate 11.

[0091] In the example embodiment, the composite function layer 2 can further include a third adhesive layer 24, the third adhesive layer 24 is located on the side of the polarizer 23 away from the substrate substrate 11. The display panel can further include a privacy film 4, the privacy film 4 can be located between the first adhesive layer 5 and the third adhesive layer 24.

[0092] In the example embodiment, as shown in FIG. 4, the display panel can further include a second light-blocking layer 213, the second light-blocking layer 213 can be located on the side of the first light-blocking layer 212 away from the substrate substrate 11. Figure 20 、 21 As shown in FIG. 5, it is a structure schematic diagram of another example embodiment of the display panel of the present disclosure. Figure 21 Figure 20 ​A top view of the color filter layer and the first light shielding layer. The light emitting layer includes a plurality of light emitting units R, G, B. The composite functional layer 2 can further include a color filter layer 25. The color filter layer 25 can include a plurality of color filter portions 251 and a light shielding portion 252 located between the plurality of color filter portions 251. The plurality of color filter portions 251 are arranged one-to-one corresponding to the plurality of light emitting units R, G, B. The color filter portion 251 in the orthographic projection of the substrate substrate 11 and the light emitting unit arranged corresponding thereto in the orthographic projection of the substrate substrate 11 at least partially overlap, for example, the color filter portion 251 in the orthographic projection of the substrate substrate 11 can cover the light emitting unit arranged corresponding thereto in the orthographic projection of the substrate substrate 11. Wherein the color filter layer 25 and the first light shielding layer 212 are formed on the same structure layer of the array substrate 1, for example, the color filter layer 25 and the first light shielding layer 212 can be formed on the touch function layer 15 of the array substrate 1. The color filter layer 25 in the orthographic projection of the substrate substrate 11 can surround the first light shielding layer 212 in the orthographic projection of the array substrate 1. As shown in Figure 21 、 22 The distribution structure of the color filter portion 251 on the color filter layer 25 can be the same as the distribution structure of the light emitting unit on the light emitting layer, wherein the distribution structure of the light emitting unit on the light emitting layer can be true RGB structure, RGGB structure, etc.

[0093] In the present exemplary embodiment, the thickness of the first light shielding layer 212 can be greater than the thickness of the light shielding portion 252. The thickness of the first light shielding layer can be 4-10 microns, for example, 4 microns, 6 microns, 8 microns, 10 microns.

[0094] In the present exemplary embodiment, the composite functional layer 2 can further include a fourth adhesive layer 26 located on the side of the color filter layer 25 away from the substrate substrate 11. The display panel further includes a privacy film 4 located between the first adhesive layer and the fourth adhesive layer.

[0095] In the present exemplary embodiment, as Figure 22As shown, the display panel can be a flexible display panel.

[0096] In the present example embodiment, Figures 19-22 The display panel shown can be a flexible display panel.

[0097] The present example embodiment also provides a display device, such as Figure 23 As shown, the display device can include the display panel described above and the camera 9, at least part of the camera 9 can be located in the through hole 3 of the display panel. Wherein, the display device can be a mobile phone, a tablet computer or the like.

[0098] Other embodiments of the present disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the content of the present disclosure. This application is intended to cover any variations, uses or adaptive changes of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or conventional techniques in the art not disclosed by the present disclosure. The specification and examples are only considered as exemplary, and the true scope and spirit of the present disclosure are indicated by the claims.

[0099] It should be understood that the present disclosure is not limited to the precise structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.

Claims

1. A display panel, wherein, The display panel comprises: an array substrate comprising a substrate and a light-emitting layer; a composite functional layer located on a side of the light-emitting layer away from the substrate, the array substrate and the composite functional layer being formed with a through hole penetrating through the composite functional layer and the array substrate; wherein the array substrate comprises a non-display area surrounding the through hole, and the composite functional layer comprises a first light-shielding layer, a projection of the first light-shielding layer on the array substrate being located in the non-display area of the array substrate; a first bonding layer located on a side of the composite functional layer away from the substrate; a cover plate located on a side of the first bonding layer away from the substrate; the light-emitting layer comprises a plurality of light-emitting units, and the composite functional layer further comprises: a color filter layer comprising a plurality of color filter portions and a light-shielding portion located between the plurality of color filter portions, the plurality of color filter portions being arranged one-to-one with the plurality of light-emitting units, and a projection of the color filter portion on the substrate and a projection of the light-emitting unit corresponding thereto on the substrate at least partially overlapping; wherein the light-shielding portion and the first light-shielding layer are formed on the same structural layer of the array substrate, and the light-shielding portion and the first light-shielding layer are formed of the same material, and a projection of the color filter layer on the substrate surrounds at least part of a projection of the first light-shielding layer on the array substrate; a thickness of the color filter portion is greater than a thickness of the light-shielding portion, and a thickness of the first light-shielding layer is greater than a thickness of the light-shielding portion; the display panel further comprises: a second light-shielding layer located between the first bonding layer and the cover plate, the second light-shielding layer comprising an inner ring portion and an outer ring portion surrounding the inner ring portion, a projection of the outer ring portion on the array substrate covering the non-display area, and a projection of a sidewall of the through hole on a plane of the array substrate surrounding a projection of the inner ring portion on the plane of the array substrate.

2. The display panel of claim 1, wherein, A projection of the first light-shielding layer on the array substrate coincides with the non-display area of the array substrate.

3. The display panel of claim 1, wherein, An opening of the through hole is circular, and the non-display area is annular.

4. The display panel of claim 1, wherein, The array substrate further comprises: an encapsulation layer located on a side of the light-emitting layer away from the substrate; a touch functional layer located on a side of the encapsulation layer away from the substrate; the first light-shielding layer is located on a side of the touch functional layer away from the substrate.

5. The display panel according to any one of claims 1-4, wherein, The composite functional layer further comprises: a second bonding layer located on a side of the first light-shielding layer away from the substrate; a polarizer located on a side of the second bonding layer away from the substrate.

6. The display panel of claim 5, wherein, The composite functional layer further comprises: a third bonding layer located on a side of the polarizer away from the substrate; The display panel further comprises: an anti-peep film located between the first bonding layer and the third bonding layer.

7. The display panel of claim 1, wherein, A thickness of the first light-shielding layer is 4-10 microns.

8. The display panel of claim 1, wherein, The composite functional layer further comprises: a fourth bonding layer located on a side of the color filter layer away from the substrate; The display panel further comprises: an anti-peep film located between the first bonding layer and the fourth bonding layer.

9. The display panel of claim 1, wherein, The material of the first light-shielding layer is a light-shielding photoresist material or ink; and the material of the second light-shielding layer is a light-shielding photoresist material or ink.

10. A display device, wherein, The display device comprises: The display panel according to any one of claims 1-9; The camera device is at least partially located in the through hole of the display panel.

11. A method of manufacturing a display panel, wherein, Comprise: Providing an array substrate to be drilled, the array substrate to be drilled comprising a substrate and a light-emitting layer, and further comprising a to-be-drilled region and a non-display region surrounding the to-be-drilled region; A to-be-drilled composite functional layer is formed on the side of the light-emitting layer away from the substrate, and the to-be-drilled composite functional layer comprises a first light-shielding material layer; A through hole is formed in the to-be-drilled region of the array substrate to be drilled, and the through hole penetrates through the array substrate and the composite functional layer, wherein the orthographic projection of the first light-shielding material layer after drilling on the array substrate is located in the non-display region of the array substrate; A cover plate is bonded on the side of the composite functional layer away from the substrate through a first bonding layer; The light-emitting layer comprises a plurality of light-emitting units, a to-be-drilled composite functional layer is formed on the side of the light-emitting layer away from the substrate, comprising: A first light-shielding material layer is formed on the side of the light-emitting layer away from the to-be-drilled substrate by a photoetching process; The first light-shielding material layer comprises a first light-shielding part and a second light-shielding part surrounding the first light-shielding part, the orthographic projection of the first light-shielding part on the array substrate coincides with the to-be-drilled region, and the orthographic projection of the second light-shielding part on the array substrate surrounds the to-be-drilled region and is located in the non-display region of the array substrate; A color filter layer is formed on the side of the light-emitting layer away from the to-be-drilled substrate, the color filter layer comprises a plurality of color filter parts and a light-shielding part between the plurality of color filter parts, the plurality of color filter parts are arranged one-to-one corresponding to the plurality of light-emitting units, and the orthographic projection of the color filter part on the substrate and the orthographic projection of the light-emitting unit arranged corresponding thereto on the substrate at least partially coincide; The light-shielding part of the color filter layer is formed in the same layer as the first light-shielding material layer, and the thickness of the color filter part is greater than the thickness of the light-shielding part; A to-be-drilled composite functional layer is formed on the side of the light-emitting layer away from the substrate, further comprising: The thickness of the first light-shielding material layer is thickened by at least one coating process, so that the thickness of the first light-shielding material layer is greater than the thickness of the light-shielding part; The display panel manufacturing method further comprises: A second light-shielding layer is formed on the side of the cover plate to be attached to the first bonding layer, and the second light-shielding layer comprises an inner ring part and an outer ring part surrounding the inner ring part; After the cover plate is attached to the composite functional layer, the orthographic projection of the outer ring part on the array substrate covers the non-display region of the array substrate, and the orthographic projection of the sidewall of the through hole on the plane of the array substrate surrounds the orthographic projection of the inner ring part on the plane of the array substrate.

12. The display panel manufacturing method according to claim 11, wherein The orthographic projection of the first light-shielding material layer after drilling on the array substrate coincides with the non-display region of the array substrate.

13. The display panel manufacturing method of claim 11, wherein, Forming a composite functional layer to be opened on a side of the light-emitting layer away from the substrate to be opened, comprising: Forming a first light-shielding material layer on a side of the light-emitting layer away from the substrate to be opened by a photoetching process; Wherein the first light-shielding material layer comprises a first light-shielding part and a second light-shielding part surrounding the first light-shielding part, the first light-shielding part coincides with the non-display area of the array substrate in the orthographic projection of the array substrate, and the second light-shielding part surrounds the non-display area of the array substrate in the orthographic projection of the array substrate and is located in the non-display area of the array substrate. Forming a second adhesive layer on a side of the first light-shielding material layer away from the substrate. Forming a polarizing sheet on a side of the second adhesive layer away from the substrate. Forming a third adhesive layer on a side of the polarizing sheet away from the substrate. The manufacturing method further comprises: After forming a through hole in the to-be-opened area of the array substrate to be opened, forming an anti-peep film between the first adhesive layer and the third adhesive layer.

14. The display panel manufacturing method of claim 11, wherein, Forming a composite functional layer to be opened on a side of the light-emitting layer away from the substrate to be opened, comprising: Forming a first light-shielding material layer on a side of the light-emitting layer away from the substrate to be opened by a photoetching process, the first light-shielding material layer coincides with the non-display area of the array substrate in the orthographic projection of the array substrate.

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