A circuit board and a manufacturing method thereof, a packaging structure and a manufacturing method thereof

Abstract

The application discloses a circuit board and a preparation method thereof, a packaging structure and a preparation method thereof. The circuit board comprises a substrate and a plastic dam. The substrate has opposite first and second surfaces, and a holding portion is arranged on the substrate. The plastic dam is arranged on the first surface of the substrate, and the holding portion is connected to the plastic dam to increase the adhesion of the plastic dam on the substrate. The structure and method can increase the adhesion of the plastic dam on the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor circuit board manufacturing, in particular to a circuit board and a preparation method thereof, a packaging structure and a preparation method thereof. BACKGROUND

[0002] At present, the dam for packaging the substrate can be roughly divided into three types, 1, ceramic dam, 2, metal dam, 3, plastic dam. Among them, the ceramic dam is generally sintered by LTCC (Low Temperature co-fired ceramic) technology to form, so that the resolution of the ceramic dam circuit is not high, and the cost is high by high temperature sintering. The manufacturing method of the metal dam is generally divided into three types, the first type is that the metal dam is formed by stamping a single metal or alloy, and then the metal dam is bonded on the ceramic substrate. In this way, the metal dam and the ceramic substrate are organically connected, and the air tightness is poor; the second type is that the metal dam is welded on the ceramic substrate by a metal Kovar ring. This method requires high welding process, resulting in low product yield and high cost; the third type is to manufacture the dam on the ceramic substrate by electroplating. The width of the dam is limited, and the process is complex.

[0003] Compared with the ceramic dam and the metal dam, the plastic dam has the advantages of simple manufacturing method, low manufacturing cost, small environmental pollution and environmental protection, and gradually becomes the main choice in the industry.

[0004] However, for the sensors, crystal oscillators, resonators, power semiconductors, lasers and other optoelectronic devices with high packaging air tightness, the traditional plastic dam structure of the circuit board is directly fixed on the surface of the substrate by adhesion or other methods, and the stability is not strong when subjected to external force. The air tightness of the packaging structure is easily affected. It is of great significance to develop a reliable and cost-effective circuit board and packaging structure manufacturing technology for semiconductor packaging. SUMMARY

[0005] The purpose of the present application is to provide a preparation method of a circuit board and a preparation method of a packaging structure, and the adhesion of the plastic dam on the circuit board to the substrate is strong.

[0006] The purpose of the present application is achieved by adopting the following technical solutions:

[0007] A circuit board comprises:

[0008] The substrate has opposite first and second surfaces, and the substrate is provided with a holding portion;

[0009] A plastic dam is arranged on the first surface of the substrate, and the holding portion is connected to the plastic dam to increase the adhesion of the plastic dam to the substrate.

[0010] Preferably, the substrate is provided with at least one accommodating portion, and the holding portion is a first holding piece arranged in the accommodating portion, and the first holding piece is connected to the bottom surface and / or the side surface of the plastic dam.

[0011] Preferably, the accommodating portion is a through hole penetrating the first surface and the second surface of the substrate, and / or a groove arranged on the first surface of the substrate.

[0012] Preferably, the through hole is a straight hole and / or a special-shaped hole, and the groove is a straight groove and / or a special-shaped groove.

[0013] Preferably, when the through hole is a special-shaped hole, the diameter of the through hole near the second surface is greater than the diameter of the through hole near the first surface, and when the groove is a special-shaped groove, the groove has a tapered opening.

[0014] Preferably, the special-shaped hole is one or more of a trapezoidal hole, a horn hole, or a convex hole, and the special-shaped groove is a reverse V-shaped groove and / or a dovetail groove.

[0015] Preferably, the first holding piece is made of plastic material and integrally connected to the plastic dam, and the shape of the first holding piece matches the shape of the accommodating portion.

[0016] Preferably, the material of the plastic dam is a thermoplastic material or a thermosetting material.

[0017] Preferably, the material of the plastic dam is a soft silicone material.

[0018] Preferably, the diameter of the through hole ranges from 30 μm to 5000 μm.

[0019] Preferably, the holding portion includes a second holding piece, and the second holding piece is at least one protrusion fixed on the first surface of the substrate.

[0020] Preferably, the plastic dam covers one or more outer surfaces of the protrusion.

[0021] Preferably, the plastic dam covers the protrusion, and the cross-sectional shape of the protrusion in the height direction is T-shaped, H-shaped, or inverted trapezoidal.

[0022] Preferably, at least one glue injection hole and / or at least one glue injection groove is arranged on the protrusion, and a part of the plastic dam is accommodated in the glue injection hole and / or the glue injection groove on the protrusion.

[0023] Preferably, the protrusion is a metal block.

[0024] Preferably, the circuit board further comprises a metal dam, the plastic dam is sleeved in the metal dam and forms a stepped structure, or the metal dam is sleeved in the plastic dam and forms a stepped structure, or a part of the plastic dam is arranged on the top surface of the metal dam and forms a stepped structure, or the metal dam is arranged on the top surface of the plastic dam and forms a stepped structure.

[0025] Preferably, the substrate is a ceramic substrate.

[0026] Preferably, the circuit board further comprises a circuit layer arranged on the substrate.

[0027] A method for manufacturing a circuit board, comprising:

[0028] Providing a substrate, the substrate having opposite first and second surfaces, the substrate being provided with a holding part;

[0029] Providing a plastic dam, the plastic dam being arranged on the first surface of the substrate, the holding part being connected with the plastic dam to increase the adhesion of the plastic dam on the substrate.

[0030] Preferably, at least one accommodating part is arranged on the substrate, the holding part is a first holding member arranged in the accommodating part, and the first holding member is connected with the bottom surface and / or the side surface of the plastic dam.

[0031] Preferably, the method for arranging the accommodating part on the substrate comprises arranging a through hole penetrating the first and second surfaces of the substrate on the substrate; the first holding member is made of plastic, and the method for arranging the first holding member and the plastic dam on the substrate comprises arranging a mold for manufacturing the plastic dam on the first surface of the substrate, injecting plastic into the through hole on the second surface of the substrate, and causing the plastic to flow into the through hole and the mold to form the first holding member and the plastic dam integrally connected.

[0032] Preferably, the method for arranging the accommodating part on the substrate comprises arranging a groove on the first surface of the substrate, the first holding member is made of plastic, and the method for arranging the first holding member and the plastic dam on the substrate comprises arranging a mold for manufacturing the plastic dam on the first surface of the substrate, injecting plastic into the mold and the groove on the first surface of the substrate, and forming the first holding member and the plastic dam integrally connected.

[0033] Preferably, the through hole is a straight hole and / or a special-shaped hole, and the groove is a straight groove and / or a special-shaped groove.

[0034] Preferably, when the through hole is a profiled hole, the diameter of the through hole near the second surface is larger than the diameter of the through hole near the first surface, and when the groove is a profiled groove, the groove has a tapered opening.

[0035] Preferably, the profiled hole is one or more of a trapezoidal hole, a trumpet hole, or a convex hole, and the profiled groove is a reverse V-shaped groove and / or a dovetail groove.

[0036] Preferably, the diameter of the through hole is in the range of 30 μm-5000 μm.

[0037] Preferably, the first holding member is made of plastic, and the method for disposing the first holding member and the plastic dam on the substrate includes: disposing a mold for making the plastic dam on the first surface of the substrate, injecting plastic into the mold and the accommodating portion, and forming the first holding member and the plastic dam integrally connected.

[0038] Preferably, the plastic dam is made of thermoplastic material or thermosetting material.

[0039] Preferably, the plastic dam is made of soft silicone material.

[0040] Preferably, the holding portion includes a second holding member, and the second holding member is at least one bump fixed on the first surface of the substrate.

[0041] Preferably, the method for disposing the second holding member on the first surface of the substrate includes any one of the following:

[0042] adhering the second holding member to the first surface of the substrate;

[0043] adopting vacuum plating to make the second holding member on the first surface of the substrate;

[0044] adopting vacuum plating first and then electroplating to make the second holding member on the first surface of the substrate.

[0045] Preferably, the method for disposing the second holding member and the plastic dam on the substrate includes any one of the following:

[0046] adopting injection molding to make the plastic dam on the first surface of the substrate by taking the second holding member as part of a mold for making the plastic dam;

[0047] embedding the second holding member in a mold for making the plastic dam, adopting injection molding to make the plastic dam and the second holding member integrally connected, and disposing the plastic dam and the second holding member integrally connected on the first surface of the substrate.

[0048] Preferably, the plastic dam covers the protrusion, and the protrusion has a cross-sectional shape in the height direction of T, I or inverted trapezoid.

[0049] Preferably, the protrusion is provided with at least one glue injection hole and / or at least one glue injection groove, and a part of the plastic dam is accommodated in the glue injection hole and / or the glue injection groove on the protrusion.

[0050] Preferably, the protrusion is a metal block.

[0051] Preferably, the preparation method further comprises providing a metal dam;

[0052] The plastic dam is sleeved in the metal dam and forms a stepped structure, or the metal dam is sleeved in the plastic dam and forms a stepped structure, or a part of the plastic dam is arranged on the top surface of the metal dam and forms a stepped structure, or the metal dam is arranged on the top surface of the plastic dam and forms a stepped structure.

[0053] Preferably, the method for arranging the plastic dam on the first surface of the substrate comprises any one of the following:

[0054] The metal dam is used as a part of a mold for manufacturing the plastic dam, and the plastic dam is manufactured on the first surface of the substrate by injection molding;

[0055] The metal dam is embedded in a mold for manufacturing the plastic dam, and the metal dam and the plastic dam are integrally connected and arranged on the first surface of the substrate by injection molding.

[0056] Preferably, the circuit board further comprises a circuit layer arranged on the substrate.

[0057] A packaging structure comprises a circuit board, an electronic component and a packaging body, the electronic component is arranged on the first surface of the substrate, the packaging body cooperates with the plastic dam to package the electronic component, and the circuit board is any one of the circuit boards described above.

[0058] A preparation method of a packaging structure comprises any one of the preparation methods of the circuit board described above, and the preparation method of the packaging structure further comprises:

[0059] The substrate has a through hole penetrating the first surface and the second surface;

[0060] A conductive body is formed in the through hole of the substrate, a first conductive layer is arranged on the first surface of the substrate, and a second conductive layer is arranged on the second surface of the substrate, and the first conductive layer and the second conductive layer are conductive through the conductive body.

[0061] providing an electronic component, disposing the electronic component on the first surface of the substrate and electrically connecting the first conductive layer;

[0062] providing a package cooperating with the plastic dam to encapsulate the electronic component.

[0063] Compared with the prior art, the application has at least the following beneficial effects: by providing the holding portion on the surface of the substrate, the adhesion of the plastic dam on the surface of the substrate is enhanced, and the stability of the plastic dam under external force is stronger. BRIEF DESCRIPTION OF DRAWINGS

[0064] The application will be further described below in conjunction with the drawings and examples.

[0065] Figure 1 is a schematic diagram of a preparation method of a circuit board provided by Example 1 of the application;

[0066] Figure 2 is a schematic diagram of a cross section of a substrate of Example 1 of the application;

[0067] Figure 3 is a schematic diagram of a cross section of another substrate of Example 1 of the application;

[0068] Figure 4 is a schematic diagram of a cross section of a circuit board of Example 1 of the application;

[0069] Figure 5 is a schematic diagram of a cross section of another circuit board of Example 1 of the application;

[0070] Figure 6 is a schematic diagram of another preparation method of a circuit board provided by Example 1 of the application;

[0071] Figure 7 is a schematic diagram of a preparation method of a circuit board provided by Example 2 of the application;

[0072] Figure 8 is a schematic diagram of a cross section of a circuit board of Example 2 of the application;

[0073] Figure 9 is a schematic diagram of a cross section of another circuit board of Example 2 of the application;

[0074] Figure 10 is a schematic diagram of a cross section of still another circuit board of Example 2 of the application;

[0075] Figure 11 is a schematic diagram of a cross section of still another circuit board of Example 2 of the application;

[0076] Figure 12is a cross-sectional schematic view of another circuit board of Embodiment 2 of the present application;

[0077] Figure 13 is a flowchart of a method for manufacturing a circuit board according to Embodiment 3 of the present application;

[0078] Figure 14 is a perspective schematic view of a circuit board according to Embodiment 3 of the present application;

[0079] Figure 15 is a cross-sectional schematic view of another circuit board according to Embodiment 3 of the present application;

[0080] Figure 16 is a cross-sectional schematic view of another circuit board according to Embodiment 3 of the present application;

[0081] Figure 17 is a cross-sectional schematic view of another circuit board according to Embodiment 3 of the present application;

[0082] Figure 18 is a cross-sectional schematic view of another circuit board according to Embodiment 3 of the present application;

[0083] Figure 19 is a flowchart of a method for manufacturing a packaging structure according to Embodiment 5 of the present application;

[0084] Figure 20 is a cross-sectional schematic view of a packaging structure according to Embodiment 5 of the present application.

[0085] In the figure: 10, substrate; 11, first surface; 12, second surface; 13, accommodating portion; 14, first conductive layer; 15, second conductive layer; 16, conductive body; 20, retaining portion; 21, first retaining member; 22, second retaining member; 30, plastic dam; 31, metal dam; 32, glue injection hole; 33, through hole; 40, electronic component; 50, packaging body. DETAILED DESCRIPTION

[0086] Hereinafter, the present application will be further described in conjunction with the accompanying drawings and specific embodiments, and it should be noted that the following described embodiments or technical features can be combined in any manner to form new embodiments without conflict.

[0087] The words expressing position and direction in the present application, such as "upper" and "lower", are described with reference to the accompanying drawings, but changes can also be made as needed, and the changes are included in the protection scope of the present application. The accompanying drawings of the present application are only used to show the relative positional relationship, and the layer thickness of some parts is exaggerated in the drawing to facilitate understanding, and the layer thickness in the drawings does not represent the proportional relationship of the actual layer thickness.

[0088] Embodiment 1

[0089] The embodiment of the present application provides a circuit board and a preparation method thereof.

[0090] With reference to Figures 1 to 6 The preparation method of the circuit board provided by the embodiment of the present application comprises steps S1 and S2.

[0091] Step S1: providing a substrate 10, wherein the substrate 10 has opposite first and second surfaces 11 and 12, and the substrate 10 is provided with a holding part 20;

[0092] Preferably, the substrate 10 is a ceramic substrate. The ceramic substrate has a mature manufacturing process, high cost performance, wide application, and good high-temperature resistance, corrosion resistance, high thermal conductivity, high mechanical strength, and thermal expansion coefficient matching with the material of a chip. The substrate 10 can also be made of other materials, such as glass or glass ceramic, which are not limited in the present application.

[0093] In a specific implementation, the first and second surfaces 11 and 12 of the substrate 10 are, for example, the upper and lower surfaces of the substrate 10, respectively.

[0094] Step S2: disposing a plastic dam 30 on the first surface 11 of the substrate 10, and connecting the holding part 20 and the plastic dam 30 to increase the adhesion of the plastic dam 30 on the substrate 10.

[0095] The plastic dam 30 is disposed on the first surface 11 of the substrate 10, and the plastic dam 30 can be annular or frame-shaped as a whole. According to needs, the plastic dam 30 can also be disposed in other shapes.

[0096] In a specific implementation, as shown in Figure 2 and Figure 5 In step S1, at least one accommodating part 13 is disposed on the substrate 10, the holding part 20 is disposed in the accommodating part 13 as a first holding part 21, and the first holding part 21 is connected to the bottom surface and / or side surface of the plastic dam 30.

[0097] The accommodating part 13 can comprise any one or a combination of the following two:

[0098] The first mode, as shown in Figure 2 The accommodating part 13 is a through hole penetrating through the first and second surfaces 11 and 12 of the substrate 10, and preferably, the aperture of the through hole ranges from 30 μm to 5000 μm. Specifically, the through hole can be formed on the substrate 10 by laser drilling or drilling.

[0099] The second mode, as shown in Figure 3 The accommodating part 13 is a groove disposed on the first surface 11 of the substrate 10, and specifically, the groove can be formed on the substrate 10 by laser or blade cutting.

[0100] The through hole can be a straight hole and / or a special-shaped hole, and the groove can be a straight groove and / or a special-shaped groove.

[0101] When the through hole is a special-shaped hole, the diameter of the through hole near the second surface 12 is larger than the diameter of the through hole near the first surface 11. The special-shaped hole can be one or more of a trapezoidal hole, a trumpet hole, or a convex hole. When the holding part 20 is subjected to an upward pulling force, the constricted opening provides a greater longitudinal resistance force, which can be locked and held in the through hole. In addition, the special-shaped hole with a trapezoidal hole, a trumpet hole, or a convex hole structure can also be conveniently injection molded through the opening of the special-shaped hole at the second surface 12 of the substrate 10 to obtain the holding part 20 and the plastic dam 30.

[0102] When the groove is a special-shaped groove, the groove has a constricted opening. In specific implementation, the special-shaped groove can be a reverse V-shaped groove and / or a dovetail groove. When the holding part 20 is subjected to an upward pulling force, the constricted opening provides a greater longitudinal resistance force, which can be locked and held in the holding part.

[0103] In step S2, the first holding part 21 is preferably made of plastic, and the method for setting the first holding part 21 and the plastic dam 30 on the substrate 10 includes:

[0104] S21: A mold for making the plastic dam 30 is set on the first surface 11 of the substrate 10, plastic is injected into the mold and the holding part 20 in the accommodating part 13 to form the first holding part 21 and the plastic dam 30 integrally connected.

[0105] Compared with the plastic dam 30 which is fixed on the substrate 10 by external processing and then adhered by glue, the above-mentioned method has stronger adhesion of the plastic dam 30 made by injection molding on the substrate 10.

[0106] Compared with the plastic dam 30 which is directly injection molded on the surface of the substrate 10, the holding part 20 and the plastic dam 30 integrally formed by injection molding in the accommodating part 13 have better connection strength and adhesion.

[0107] Compared with the single metal dam 31 adhered to the first surface 11 of the substrate 10 or the dam made on the first surface 11 of the substrate 10 by vacuum plating or the dam made on the first surface 11 of the substrate 10 by vacuum plating and then by electroplating, the plastic dam 30 made by the above-mentioned method has strong adhesion, simple process, low cost, and is easy to popularize.

[0108] The material of the plastic dam 30 can be thermoplastic or thermosetting material, preferably thermosetting material, which has the performance of not softening when the circuit board is heated and not dissolving in solvent, and stronger stability. Preferably, the material of the plastic dam 30 is soft silicone material, which has good fluidity when injection molding, and can be injection molded from the first surface 11 of the substrate 10, or can be injection molded from the second surface 12 of the substrate 10 through the opening of the accommodation portion 13. Figure 2 When the accommodation portion 13 is a through hole, the opening below the through hole can be used as an inlet, and the plastic such as thermoplastic or thermosetting material is injection molded from the second surface 12 of the substrate 10 to the opposite first surface 11 to form the plastic dam 30 and the first retaining member 21. After the injection molding is completed, the injection port will be formed on the lower surface of the first retaining member 21. This injection molding method is more conducive to the flow and filling of the plastic material in the mold and the accommodation portion 13, and can improve the quality and efficiency of plastic molding, and the connection strength between the first retaining member 21 and the plastic dam 30 is high.

[0109] In the present application, when the accommodation portion 13 is a groove, the method for setting the first retaining member 21 and the plastic dam 30 on the substrate 10 includes: setting a mold for making the plastic dam 30 on the first surface 11 of the substrate 10, and injecting plastic into the mold and the groove on the first surface 11 of the substrate 10 to form the first retaining member 21 and the plastic dam 30 integrally connected. This injection molding method will make the plastic material fill the groove first and then fill the mold. After the injection molding is completed, the injection port will be formed on the dam 30, and the connection strength between the first retaining member 21 and the plastic dam 30 is high.

[0110] Compared with several prior arts, the circuit board and the preparation method thereof provided in the embodiments of the present application have better technical effects, which are as follows:

[0111] Compared with the plastic dam 30 which is fixed on the substrate 10 by externally processing and then adhering with glue, the retaining portion 20 can provide additional stability. Compared with the plastic dam 30 which is directly injection molded on the surface of the substrate 10, the retaining portion 20 and the plastic dam 30 in the accommodation portion 13 are integrally injection molded, which has better firmness and adhesion. Compared with the single metal dam 31, the plastic dam 30 with the retaining portion 20 has lower cost of plastic material, simple manufacturing method, low manufacturing cost, and small environmental pollution, and is more environmentally friendly.

[0112] Embodiment 2

[0113] ReferenceFigures 7 to 12 The embodiment of the present application provides a circuit board and a preparation method thereof. On the basis of the circuit board and the preparation method thereof in the embodiment 1, the preparation method of the circuit board in the embodiment further comprises a step S3. In the circuit board, the holding part 20 comprises a second holding piece 22, and the second holding piece 22 is at least one bump fixed on the first surface 11 of the substrate 10.

[0114] Step S3: at least one bump is arranged on the first surface 11 of the substrate 10, and the bump is preferably a metal bump.

[0115] In the specific implementation, the method for arranging the second holding piece 22 on the first surface 11 of the substrate 10 can comprise any one of the following: the second holding piece 22 is adhered on the first surface 11 of the substrate 10; the second holding piece 22 is made on the first surface 11 of the substrate 10 by using a vacuum plating method; the second holding piece 22 is made on the first surface 11 of the substrate 10 by using a vacuum plating method first and then using an electroplating method. The bump can be made by machining and then adhered, or made on the substrate 10 by using a vacuum plating method, or made on the substrate 10 by using a vacuum plating and electroplating method. Therefore, a suitable manufacturing process can be selected according to the requirements in actual application.

[0116] In the specific implementation, Figure 9 In the specific implementation, the plastic dam 30 can partially cover or coat the second holding piece 22. When the plastic dam 30 partially covers or coats the second holding piece 22, the second holding piece 22 can be used as part of a mold for manufacturing the plastic dam 30, and the plastic dam 30 is made on the first surface 11 of the substrate 10 by using an injection molding method. Therefore, the second holding piece 22 can be firmly combined with the plastic dam 30 in the injection molding process, and the two materials are combined without using an adhesive, thereby improving the stability of the packaging structure and the air tightness of the packaging structure.

[0117] In the specific implementation, Figure 10 In the specific implementation, the plastic dam 30 can completely cover or coat the second holding piece 22. The method for arranging the second holding piece 22 and the plastic dam 30 on the substrate 10 can be that the second holding piece 22 is embedded in a mold for manufacturing the plastic dam 30, the plastic dam 30 and the second holding piece 22 are integrally connected by using an injection molding method, and the integrally connected plastic dam 30 and second holding piece 22 are arranged on the first surface 11 of the substrate 10.

[0118] The second holding member 22 can be embedded or inserted in the injection molding process, which can firmly combine the second holding member 22 and the plastic dam 30, and does not need to use adhesive to combine the two materials, thereby improving the stability of the packaging structure.

[0119] In a specific implementation, the plastic dam 30 covers the second holding member 22, and the cross-sectional shape of the height direction of the protrusion can be T-shaped, I-shaped, or inverted trapezoidal. Compared with the conventional protrusion shape, the mutual combination between the plastic dam 30 and the second holding member 22 having the above structure is more firm.

[0120] In a specific implementation, Figure 11 In the specific implementation, at least one glue injection hole 32 can be arranged on the protrusion, and the plastic dam 30 can be directly injection molded to the first surface 11 of the substrate 10 and injected into the glue injection hole 32 of the protrusion. A part of the plastic dam 30 is accommodated in the glue injection hole 32 on the protrusion. Compared with the way that the plastic dam 30 is fixed on the substrate 10 by externally processing and then adhering with glue, the holding part 20 can provide additional stability. Compared with the way that the plastic dam 30 is directly injection molded on the surface of the substrate 10, the holding part 20 in the accommodating part 13 and the plastic dam 30 are integrally injection molded, which has better firmness and adhesion. Compared with the single metal dam 31, the plastic dam 30 integrated with the holding part 20 is not only more firm, but also has lower cost of plastic material, simple manufacturing method, low manufacturing cost, small environmental pollution, and is more environmentally friendly.

[0121] In a specific implementation, Figure 12 In the specific implementation, at least one glue injection groove can be arranged on the protrusion, and the plastic dam 30 can be directly injection molded to the first surface 11 of the substrate 10 and injected into the glue injection groove of the protrusion. A part of the plastic dam 30 is accommodated in the glue injection groove on the protrusion. Compared with the way that the plastic dam 30 is fixed on the substrate 10 by externally processing and then adhering with glue, the holding part 20 can provide additional stability. Compared with the way that the plastic dam 30 is directly injection molded on the surface of the substrate 10, the holding part 20 in the accommodating part 13 and the plastic dam 30 are integrally injection molded, which has better firmness and adhesion. Compared with the single metal dam 31, the plastic dam 30 integrated with the holding part 20 is not only more firm, but also has lower cost of plastic material, simple manufacturing method, low manufacturing cost, small environmental pollution, and is more environmentally friendly.

[0122] Embodiment 3

[0123] Referring to Figures 13 to 18 , the application provides a circuit board and a preparation method thereof. On the basis of the circuit board and the preparation method thereof in Embodiment 1, the preparation method of the circuit board in the present embodiment further includes step S4.

[0124] S4: a metal dam 31 is provided and combined with the plastic dam 30.

[0125] In specific implementations, the positional relationship between the metal dam 31 and the plastic dam 30 can be one of the following:

[0126] Figure 15 In a specific implementation, the metal dam 31 can be sleeved outside the plastic dam 30 and form a stepped structure;

[0127] Figure 14 and Figure 16 In a specific implementation, the metal dam 31 can be sleeved inside the plastic dam 30 and form a stepped structure;

[0128] Figure 17 In a specific implementation, a part of the plastic dam 30 can be arranged on the top surface of the metal dam 31 and form a stepped structure;

[0129] Figure 18 In a specific implementation, the metal dam 31 can be arranged on the top surface of the plastic dam 30 and form a stepped structure.

[0130] When the plastic dam 30 and the metal dam 31 are combined together, the structural strength of the plastic dam 30 is enhanced relative to the plastic dam alone, and the stability of the entire packaging structure is improved. In addition, by dividing the dam into a plastic dam 30 and a metal dam 31, the dam can be manufactured in two parts using the concept of modular design. Users can independently manufacture plastic dams 30 and metal dams 31 of various sizes using the same or different processes according to the needs of actual applications, and form the entire dam by adhering the plastic dam 30 to the metal dam 31 or by manufacturing the metal dam 31 and the plastic dam 30 in sequence. This makes the dam manufacturing process more flexible and widely applicable. The metal dam 31 can be manufactured using existing methods, which will not be described here.

[0131] In specific implementations, the plastic dam 30 and the metal dam 31 can be combined in one of the following ways:

[0132] The metal dam 31 is used as part of the mold for manufacturing the plastic dam 30, and the plastic dam 30 is manufactured on the first surface 11 of the substrate 10 using injection molding;

[0133] The metal dam 31 is embedded in the mold for manufacturing the plastic dam 30, and the metal dam 31 and the plastic dam 30 are integrally connected by injection molding, and the integrally connected metal dam 31 and plastic dam 30 are arranged on the first surface 11 of the substrate 10.

[0134] Compared with the plastic dam 30 fixed on the substrate 10 by means of external processing and adhesion of glue, the metal dam 31 combined with the plastic dam 30 has additional stability and adhesion. Compared with the plastic dam 30 directly injection molded on the surface of the substrate 10, the holding portion 20 in the accommodating portion 13 and the plastic dam 30 can be integrally formed by injection molding, having better firmness and adhesion. Compared with the single metal dam 31, the plastic dam 30 combined with the holding portion 20 is not only more firm, but also has lower cost of plastic material, simple manufacturing method, low manufacturing cost, and less environmental pollution, and is more environmentally friendly.

[0135] Embodiment 4

[0136] The embodiment of the present application provides a preparation method of a circuit board. On the basis of the circuit board and the preparation method thereof in Embodiment 1, the preparation method of the circuit board in the embodiment further comprises disposing a circuit layer on the substrate 10.

[0137] The ceramic substrate can be subjected to a metalization pretreatment, and then a circuit layer is made on the thin-film metalized ceramic substrate by using an image transfer method by means of a technology combining a thin-film circuit and an electroplating process. The circuit layer can be made by using an existing method, which is not described herein.

[0138] The embodiment of the present application further provides a circuit board obtained according to any one of the preparation methods of the circuit board.

[0139] Embodiment 5

[0140] Referring to Figures 19 to 20 , the embodiment of the present application provides a packaging structure and a preparation method thereof. On the basis of the circuit board and the preparation method thereof in Embodiment 1, the preparation method of the packaging structure in the embodiment further comprises disposing a circuit layer on the substrate 10.

[0141] S51: providing a substrate 10 described in the present application, and disposing a via hole 32 having a through hole penetrating through the first surface 11 and the second surface 12 on the substrate 10;

[0142] S52: forming a conductive body 16 in the via hole 32 of the substrate 10, disposing a first conductive layer 14 on the first surface 11 of the substrate 10, and disposing a second conductive layer 15 on the second surface 12 of the substrate 10, the first conductive layer 14 and the second conductive layer 15 being conductive through the conductive body 16;

[0143] S53: providing an electronic element 40, and disposing the electronic element 40 on the first surface 11 of the substrate 10 and electrically connecting the first conductive layer 14;

[0144] S54: providing a packaging body 50, and cooperating the packaging body 50 with the plastic dam 30 to package the electronic element.

[0145] On one hand, different electronic components can be used in the packaging structure according to the requirements in actual applications, and various electronic devices such as image sensors and LEDs can be manufactured, and the application range is wide; on the other hand, the adhesion of the plastic dam 30 in the packaging structure is stronger, and the stability of the packaging structure is better using the structure of the circuit board as described above.

[0146] The packaging body 50 can be a cover body or a packaging glue. In a specific implementation, the metal dam 31 can be arranged on the top surface of the plastic dam 30 to form a stepped structure, and the metal dam 31 provides a better mounting condition for the cover body. The cover body can be mounted on the plastic dam 30, and the movement of the outer side surface of the cover body in the direction parallel to the top surface of the plastic dam 30 is limited by the metal dam 31. Therefore, the cover body is not easy to move relative to the plastic dam 30. The stepped combination of the plastic dam 30 and the metal dam 31 makes the connection between the cover body and the plastic dam 30 more stable, can resist greater impact, improves the stability and service life of the packaging structure, and has good airtightness.

[0147] The packaging structure is obtained according to the preparation method of the packaging structure.

[0148] The application is described from the viewpoints of use, efficiency, progress and novelty, and meets the functional improvement and use requirements emphasized by the Patent Law. The above description and drawings are only preferred embodiments of the application, and do not limit the application. Therefore, all similar, identical, equivalent, modified and other similar applications within the scope of the application are also included in the patent application protection range of the application.

Claims

1. A wiring board, characterized by, The application relates to a circuit board, comprising: a substrate with opposite first and second surfaces, wherein a holding part is arranged on the substrate; a plastic dam arranged on the first surface of the substrate, and the holding part is connected to the plastic dam to increase the adhesion of the plastic dam on the substrate; the holding part comprises a first holding member arranged on the substrate and a second holding member fixed on the substrate; the first holding member is integrally connected with the plastic dam; the second holding member is formed on the first surface of the substrate by vacuum plating and electroplating, and the plastic dam partially covers the second holding member, and the second holding member is part of a mold for manufacturing the plastic dam; at least one accommodating part is arranged on the substrate, the first holding member is arranged in the accommodating part, and the first holding member is connected to the bottom surface and / or the side surface of the plastic dam; and the second holding member is a metal block. The accommodating part is a through hole penetrating through the first and second surfaces of the substrate, and / or a groove arranged on the first surface of the substrate. The through hole is a straight hole and / or a special-shaped hole, and the groove is a straight groove and / or a special-shaped groove. When the through hole is a special-shaped hole, the diameter of the through hole close to the second surface is larger than the diameter close to the first surface, and when the groove is a special-shaped groove, the groove has a contracted opening. The special-shaped hole is one or more of a trapezoidal hole, a horn hole or a convex letter-shaped hole, and the special-shaped groove is a reversed V-shaped groove and / or a dovetail groove. The first holding member is made of plastic, and the shape of the first holding member matches the shape of the accommodating part.

2. The circuit board according to claim 1, characterized by The material of the plastic dam is thermoplastic material or thermosetting material.

3. The circuit board according to claim 2, wherein The material of the plastic dam is soft silica gel material.

4. The circuit board according to claim 3, wherein The aperture range of the through hole is 30-5000 mu m.

5. The circuit board according to claim 4, wherein The second holding member is at least one protrusion fixed on the first surface of the substrate.

6. The circuit board of claim 1, wherein The plastic dam covers one or more outer surfaces of the protrusion.

7. The circuit board of claim 1, wherein The cross-sectional shape of the protrusion in the height direction is T-shaped, H-shaped or inverted trapezoidal.

8. The circuit board according to claim 7, characterized by At least one glue injection hole and / or at least one glue injection groove are arranged on the protrusion, and a part of the plastic dam is accommodated in the glue injection hole and / or the glue injection groove on the protrusion.

9. The circuit board of claim 2, wherein The application relates to a circuit board, comprising: a substrate with opposite first and second surfaces, wherein a holding part is arranged on the substrate; a plastic dam arranged on the first surface of the substrate, and the holding part is connected to the plastic dam to increase the adhesion of the plastic dam on the substrate; the holding part comprises a first holding member arranged on the substrate and a second holding member fixed on the substrate; the first holding member is integrally connected with the plastic dam; the second holding member is formed on the first surface of the substrate by vacuum plating and electroplating, and the plastic dam partially covers the second holding member, and the second holding member is part of a mold for manufacturing the plastic dam; at least one accommodating part is arranged on the substrate, the first holding member is arranged in the accommodating part, and the first holding member is connected to the bottom surface and / or the side surface of the plastic dam; and the second holding member is a metal block.

10. The circuit board of claim 1, wherein The substrate is a ceramic substrate.

11. The circuit board according to claim 10, wherein ​ 12. The circuit board of claim 10, wherein, ​ 13. The circuit board of claim 10, wherein, ​ 14. A wiring board, characterized by comprising: ​ ​ ​ ​ ​ ​ 15. The circuit board of claim 14, wherein, ​ 16. The circuit board of claim 14, wherein, The circuit board further comprises a circuit layer disposed on the substrate.

17. A method of manufacturing a wiring board, characterized by, The method comprises the following steps: A substrate is provided, which has opposite first and second surfaces, and a holding part is disposed on the substrate; A plastic dam is provided on the first surface of the substrate, and the holding part is connected to the plastic dam to increase the adhesion of the plastic dam on the substrate; The holding part comprises a first holding member disposed on the substrate and a second holding member fixed on the substrate; the first holding member is integrally connected with the plastic dam; the second holding member is formed on the first surface of the substrate by vacuum plating and then electroplating, and the plastic dam partially covers the second holding member, which is used as a part of a mold for manufacturing the plastic dam; The substrate is provided with at least one accommodating part, and the first holding member is disposed in the accommodating part and connected to the bottom surface and / or side surface of the plastic dam; The second holding member is a metal block.

18. The method for manufacturing a circuit board according to claim 17, wherein The method for disposing the accommodating part on the substrate comprises disposing a through hole penetrating through the first and second surfaces of the substrate; The first holding member is made of plastic, and the method for disposing the first holding member and the plastic dam on the substrate comprises disposing a mold for manufacturing the plastic dam on the first surface of the substrate, and injecting plastic into the through hole on the second surface of the substrate, so that the plastic flows into the through hole and the mold to form the integrally connected first holding member and plastic dam.

19. The method for producing a circuit board according to Claim 17, wherein The method for disposing the accommodating part on the substrate comprises disposing a groove on the first surface of the substrate, and the first holding member is made of plastic, and the method for disposing the first holding member and the plastic dam on the substrate comprises disposing a mold for manufacturing the plastic dam on the first surface of the substrate, and injecting plastic into the mold and the groove on the first surface of the substrate to form the integrally connected first holding member and plastic dam.

20. The method for producing a circuit board according to Claim 17, wherein The second holding member is at least one protrusion fixed on the first surface of the substrate.

21. The method for producing a circuit board according to claim 20, wherein The method for disposing the second holding member and the plastic dam on the substrate comprises: The plastic dam is manufactured on the first surface of the substrate by injection molding.

22. The method for producing a circuit board according to claim 20, wherein At least one injection hole and / or at least one injection groove is disposed on the protrusion, and a part of the plastic dam is accommodated in the injection hole and / or the injection groove on the protrusion.

23. A method of manufacturing a wiring board, characterized by, The method comprises the following steps: A substrate is provided, which has opposite first and second surfaces, and a holding part is disposed on the substrate; A plastic dam is provided on the first surface of the substrate, and the holding part is connected to the plastic dam to increase the adhesion of the plastic dam on the substrate; The holding part comprises a first holding member disposed on the substrate; the first holding member is integrally connected with the plastic dam; The substrate is provided with at least one accommodating part, and the first holding member is disposed in the accommodating part and connected to the bottom surface and / or side surface of the plastic dam; The preparation method further comprises providing a metal dam; The plastic dam is sleeved in the metal dam and forms a stepped structure, or the metal dam is sleeved in the plastic dam and forms a stepped structure, or a part of the plastic dam is arranged on the top surface of the metal dam and forms a stepped structure.

24. The method for producing a circuit board according to Claim 23, wherein The method for arranging the plastic dam on the first surface of the substrate comprises: The metal dam is used as a part of a mold for manufacturing the plastic dam, and the plastic dam is manufactured on the first surface of the substrate by injection molding.

25. The method of manufacturing a circuit board according to Claim 23, wherein The circuit board further comprises a circuit layer arranged on the substrate.

26. A packaging structure comprising a circuit board, an electronic component disposed on a first surface of the circuit board, and a package cooperating with the plastic dam to encapsulate the electronic component, wherein, The circuit board is the circuit board according to any one of claims 1-16.

27. A method for preparing a packaging structure, characterized in that, The method for manufacturing the circuit board according to any one of claims 17-25, the method for manufacturing the packaging structure further comprises: The substrate has a through hole penetrating the first surface and the second surface; A conductive body is formed in the through hole of the substrate, a first conductive layer is arranged on the first surface of the substrate, and a second conductive layer is arranged on the second surface of the substrate, the first conductive layer and the second conductive layer being connected through the conductive body; An electronic element is provided, and the electronic element is arranged on the first surface of the substrate and electrically connected to the first conductive layer; A packaging body is provided, and the packaging body cooperates with the plastic dam to package the electronic element.

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