Magnetron with controller for monitoring and control

Abstract

A magnetron structure for a sputtering device is described herein. The magnetron structure comprises a magnetron (100, 200, 300, 401) and a controller (106, 206, 301, 402) rigidly connected to the magnetron (100, 200, 300, 401). The controller (106, 206, 301, 402) is adapted to at least partially control the conditions and / or functions of the sputtering unit.

Description

Technical Field

[0001] The present invention relates to a sputtering unit for sputtering material from a target to cover a substrate. More particularly, the present invention relates to a magnetron structure or a sputtering unit comprising such a magnetron structure, which allows monitoring and controlling the function or condition of the sputtering unit. Background Art

[0002] Sputtering of material from a target to coat a substrate has become customary practice in a wide range of technical fields such as integrated circuit manufacturing, large area glass coating and now increasingly for flat panel display coating. This sputtering is carried out in a reduced pressure atmosphere, in which a sputtering or reactive gas or a mixture of both is introduced in a controlled manner. Free electrons jumping in a magnetic confinement racetrack ionize gas atoms or molecules near the target surface. These ions are then accelerated towards the negatively biased target, thereby knocking out target atoms and giving them enough kinetic energy to reach the substrate and coat the substrate. The shape of the racetrack is defined by a static magnetic array, close to the target surface opposite to the surface being sputtered. Due to the presence of the magnetic array, this deposition process is often called "magnetron sputtering".

[0003] A large number of devices have been developed, designed and built with specific applications in mind. The first smaller magnetron sputtering units used stationary planar targets, initially generally circular (i.e., like the silicon wafer on which sputtering was performed). Later, elongated rectangular shapes for coating larger substrates passing under the target also became available (e.g., as described in U.S. Patent No. 3,878,085). Such elongated planar targets are now commonly used in dedicated "display coaters" for manufacturing flat panel displays such as liquid crystal displays (LCDs) and plasma screens. These planar targets are usually mounted on the entrance door of the equipment; the target surface is easily accessible (with the door open) and extends across the width of the substrate, or even across the width of the substrate. In the display coater, the substrate to be coated is held below at a certain tilt angle (7 to 15°) relative to the vertical direction and rests on a conveying system. Because the target must be parallel to the substrate in order to obtain a uniform coating, the target must be mounted at substantially the same angle.

[0004] Stationary targets are easy to cool and energize (because they are static relative to the device), but they have the disadvantage that the target material can only be eroded away below the racetrack. Therefore, the useful life of the target is limited to the point in time before the target is first pierced. The problem of uneven erosion can be solved by introducing a magnet array that rotates relative to the target surface (e.g., as introduced in U.S. Patent No. 4,995,958 for circular planar magnetrons) or translates relative to the target surface (e.g., as described in U.S. Patent No. 6,322,679 for elongated planar magnetrons). This configuration, while largely alleviating the problem of uneven erosion, makes the system more complex.

[0005] Large area coaters used for applying stacks of various functional coatings, for example to window glass, are often equipped with rotating cylindrical sputtering targets. In this application, the economic drivers are low material costs and good quality production capacity. Rotating cylindrical targets are ideal for this because they can span a large width and can be used for a long time. The trade-off is that the target itself rotates relative to the equipment, so complex and space-consuming "end blocks" are required to carry, rotate, excite, cool and isolate (coolant, air and electricity) the rotating target, while keeping the magnet array inside, either fixed or possibly rotating. There are several types of arrangements, such as dual right-angle end blocks, single straight-through end blocks or single-angle end blocks.

[0006] Double right angle end blocks, such as those in U.S. Pat. No. 5,096,562 ( Figure 2 , FIG6 ) and US2003 / 0136672A1 , where the components for bearing, rotation, excitation, cooling and isolation (air, coolant and electricity) are divided into two blocks, located at either end of the target. Right angles mean that the end blocks are mounted on a wall parallel to the axis of rotation of the target. These end blocks are usually mounted on the bottom of a top box containing auxiliary equipment. The top box with the end blocks and the mounted target can be lifted out of the large area coater as a whole to facilitate the replacement and maintenance of the target.

[0007] In patents such as U.S. Pat. No. 5,200,049 ( Figure 1 ) discloses a single straight-through end block in which the components for bearing, rotation, excitation, cooling and isolation are all incorporated into one end block, and the target is held in a cantilevered manner within a large area coater. By "straight-through" is meant that the axis of rotation of the target is perpendicular to the wall on which the end block is mounted. A "semi-cantilever" arrangement is also described (U.S. Pat. No. 5,620,577), in which the end of the target farthest from the end block is held by a mechanical support (without any other functions incorporated into the support).

[0008] The control of the different functions provided by the magnetron (for planar or cylindrical targets) or, more generally, of the different functions of the present sputtering unit is usually performed using a controller external to the sputtering unit. The control is therefore performed by transmitting control signals from the controller external to the sputtering unit to the magnetron in the vacuum via a signal transmission cable.

[0009] Furthermore, although the use of sensors to sense properties of sputtering cells is known, there is still room for improvement in the monitoring of sputtering cells. Summary of the invention

[0010] It is an object of embodiments of the present invention to provide a magnetron structure, and / or to provide a sputtering unit comprising such a magnetron structure, allowing for good monitoring and / or control of the function and / or status of the sputtering unit or of a sputtering process performed by such a unit.

[0011] An advantage of embodiments of the present invention is that a magnetron structure and / or a sputtering unit comprising such a magnetron structure is provided, which allows easy installation, because when the magnetron is installed, at least part of the monitoring and / or control functions in the sputtering unit are automatically installed.

[0012] An advantage of embodiments of the present invention is that a magnetron structure and / or a sputtering unit comprising such a magnetron structure is provided, which allows easier modification of the magnetron structure during maintenance, since information about operation, including deviations from normal operation, can be obtained from the magnetron structure, even when disassembled from the sputtering unit. In this way, erroneous operation can, for example, be detected more easily.

[0013] An advantage of embodiments of the invention is that error states of magnetron components can be easily detected, for example during modification of the magnetron. Modification of the magnetron can advantageously be performed in embodiments where monitoring data of the function and / or condition of the magnetron or sputtering unit over time is available. In embodiments of the invention, such data can advantageously be obtained in the magnetron itself, so that these data can be easily accessed during modification of the magnetron. Since the actual usage time of the components can be monitored, this allows proactive replacement of components, or allows components to remain operational for longer.

[0014] In a first aspect, a magnetron structure for a sputtering device is provided. The magnetron structure includes a magnetron and a controller, which can be implemented as an integrated circuit, and the controller is rigidly connected to the magnetron. The controller, which can be implemented as an integrated circuit, is configured (e.g., programmed) to at least partially control the condition and / or function of the sputtering device. The controller can be a microcontroller. In some embodiments, the controller can be a low-voltage microcontroller. An advantage of an embodiment of the present invention is that the controller can actually perform data processing so that the condition or function of the sputtering device can be controlled by the controller.

[0015] The controller may additionally be adapted to further at least partially perform a monitoring of the condition and / or function of the sputtering device.

[0016] An advantage of embodiments of the present invention is that at least part of the data processing can be integrated within the magnetron.An advantage of embodiments of the present invention is that no human interaction is required to process the data.

[0017] In some embodiments of the present invention, a controller (eg, an integrated circuit) of the magnetron structure includes a data processor for processing a signal into data, or processing data into a signal.

[0018] In some embodiments of the present invention, the controller (eg, an integrated circuit) further comprises a data storage device for storing data related to at least partial monitoring and / or control of the condition and / or function of the sputtering apparatus.

[0019] An advantage of an embodiment is that data regarding the monitoring and / or control of the condition and / or function of the sputtering device over time can be stored locally. An advantage of an embodiment of the present invention is that information regarding the condition or function of the sputtering device is stored in the magnetron so that the condition or function of the sputtering device can be assessed during modifications or in the event of a malfunction. An advantage of an embodiment of the present invention is that data can be stored and compared with data obtained at different times, thereby obtaining dynamic monitoring of the condition of the sputtering device, allowing long-term tracking and early detection of deteriorating conditions (e.g. seal aging).

[0020] In some embodiments of the present invention, the magnetron is an end block adapted to support a tubular (eg, cylindrical) magnetic rod and a sputtering target.

[0021] In some embodiments, the magnetron may be adapted to mount and sputter from a planar target.

[0022] In some embodiments of the present invention, the magnetron structure further comprises a sensor for sensing a sensor signal related to the sputtering device or the sputtering process. The controller (eg, an integrated circuit) is adapted to receive and process the signal from the sensor.

[0023] One advantage of embodiments of the present invention is that the status of the process, the target, or any other subsystem (eg, bearings or cooling systems) may be monitored in situ and during use of the sputtering apparatus.

[0024] In some embodiments of the present invention, the controller (e.g., an integrated circuit) further comprises a communication component for exchanging data with a controller outside the vacuum portion of the sputtering apparatus. In some specific embodiments, the communication component is adapted to perform wireless communication (using any of WIFI communication, Bluetooth communication, optical communication, or any other type of EM radiation) or to perform wired communication (using any of optical fiber communication or electrical communication).

[0025] The communication component may include a connector for exchanging data between the external non-vacuum portion of the sputtering apparatus and a controller (eg, an integrated circuit).

[0026] An advantage of embodiments of the present invention is that a reader and / or command input for reading data or activating an alarm may be used in combination with a magnetron.

[0027] In some embodiments of the present invention, the magnetron further comprises a controller for controlling at least one actuator for adjusting a parameter associated with a sputtering process in the sputtering apparatus.

[0028] One advantage of embodiments of the present invention is that automation of the process may be achieved.

[0029] Furthermore, the controller may be adapted to control at least one actuator within a desired window for adjusting the parameter.

[0030] One advantage of the embodiments of the present invention is that the processor can automatically control parameters within a certain range and reduce the need for human interaction, thereby achieving a high degree of independence from the outside.

[0031] In some embodiments of the present invention, the magnetron structure further comprises a power source for powering the controller (eg, an integrated circuit). The power source may be a battery, or a power extractor adapted to obtain power from the cooling fluid flow or the power supply of the target tube.

[0032] In some embodiments of the invention, powering of the controller (eg, integrated circuit) is based on a wired connection from an external, non-vacuum portion of the sputtering apparatus.

[0033] An advantage of some embodiments of the present invention is that the use of batteries is avoided and therefore less maintenance is required.

[0034] In some embodiments of the invention, the magnetron comprises a top portion for holding a target and a bottom portion attachable to the top portion.A controller (eg, an integrated circuit) may be rigidly connected to the bottom portion.

[0035] One advantage of embodiments of the present invention is that the controller (eg, integrated circuit) is easily accessible from outside the unit, facilitating installation and maintenance.

[0036] In some embodiments of the invention, the magnetron structure includes a wireless connector including an antenna for transmitting data external to the system.

[0037] One advantage of embodiments of the present invention is that no wired connection to an external control system (eg, a computer) is required, thereby achieving a highly compact end block without the need for additional wires for data transmission, either inside or outside the unit.

[0038] One advantage of embodiments of the present invention is that a single connection (e.g., a single wired connection, or even a single wireless connection) can be used to power a controller (e.g., an integrated circuit) and exchange data to and from a controller (e.g., an integrated circuit), thereby simplifying the end block system by reducing connections to external control and / or power supplies. Alternatively, different connections or multi-wire connections can be used.

[0039] In some embodiments of the present invention, the data is any one or a combination of coolant related information, sputtering power related information, magnetics related information, magnetron condition related information or target drive related information.

[0040] Information related to the coolant may be any one or a combination of coolant input temperature, coolant output temperature, coolant pressure, coolant flow rate, or coolant resistivity, but is not limited thereto. Information related to the sputtering power may be any one or a combination of voltage toward the target, voltage on a specific part, such as through induction, current through the system, spectral content, or impedance, but is not limited thereto. Information related to magnetism may be any one or a combination of the type of magnet configuration, the positioning of the magnet configuration (such as global positioning such as translational or rotational position or movement speed), or local positioning, temperature, or magnetic strength, but is not limited thereto. Information related to the magnetron condition may be any one or a combination of temperature near the target, temperature of a specific part of the magnetron, pressure inside the system, humidity, or coolant, but is not limited thereto. Information related to the target drive may be any one or a combination of rotational or movement speed, operating life, drive unit current, or torque level that varies over time or temperature, but is not limited thereto.

[0041] A controller (eg, an integrated circuit) may provide information to facilitate maintenance while in use, giving information about its status and the estimated time when preventive maintenance is required.

[0042] A controller (eg, an integrated circuit) may provide maintenance-friendly information when modified to understand historical data to facilitate appropriate modification and maintenance.

[0043] In a second aspect, a sputtering apparatus is provided, the apparatus comprising a magnetron structure and a magnet arrangement according to any embodiment of the first aspect.

[0044] In a third aspect, there is provided use of a controller (eg an integrated circuit) in a magnetron arrangement for at least partially controlling the condition and / or function of a sputtering apparatus. The controller may also be configured to at least partially monitor the condition and / or function of the sputtering apparatus.

[0045] An advantage of embodiments of the present invention is that a circuit with processing capabilities can be used in combination with a magnetron. This allows for easy control and / or readout interfacing by reducing setup barriers, such as software installation, connection between an external computing system and multiple connectors of sensors from a sputtering unit, etc. A highly compact and "intelligent" magnetron can be obtained.

[0046] Particular and preferred aspects of the invention are set out in the accompanying independent and dependent claims. Features of the dependent claims may be combined with features of the independent claims as appropriate as well as features of other dependent claims and not merely as explicitly set out in the claims.

[0047] These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 The structure of a magnetron according to an embodiment of the present invention is shown in an exploded view, including a motor.

[0049] Figure 2 The structure of a magnetron according to an embodiment of the present invention is shown in an exploded view, including a cooling (sub)system.

[0050] Figure 3 A front view of an end block with an integrated circuit is shown, looking toward a ring to which a target may be attached, in accordance with an embodiment of the present invention.

[0051] Figure 4 A perspective view of an end block according to an embodiment of the present invention is shown with a section removed for better visualization, illustrating an exemplary placement of an integrated module including integrated circuits.

[0052] The accompanying drawings are schematic and non-limiting. In the accompanying drawings, the size of some elements may be exaggerated and not drawn on scale for illustrative purposes.

[0053] Any reference signs in the claims should not be construed as limiting the scope.

[0054] The same reference numbers in different drawings identify the same or similar elements. DETAILED DESCRIPTION

[0055] The invention will be described with reference to particular embodiments and with reference to certain drawings but the invention is not limited thereto but only by the claims.The dimensions and relative dimensions do not correspond to actual reductions to practicing the invention.

[0056] In addition, the terms first, second, etc. in the specification and claims are used to distinguish similar elements and are not necessarily used to describe a sequence in time, space, level or any other manner. It should be understood that the terms so used are interchangeable under appropriate circumstances, and the embodiments of the invention described herein are capable of operating in other sequences than those described or shown herein.

[0057] Furthermore, the terms top, below, etc. in the description and claims are used for descriptive purposes and not necessarily for describing relative positions. It is to be understood that the terms so used are interchangeable under appropriate circumstances, and that the embodiments of the invention described herein are capable of operation in other orientations than described or illustrated herein.

[0058] It should be noted that the term "comprising" used in the claims should not be interpreted as being limited to the components listed thereafter; it does not exclude other elements or steps. It will therefore be interpreted as stipulating the presence of the recited features, integers, steps or components mentioned, but not excluding the presence or addition of one or more other features, integers, steps or components or groups thereof. Therefore, the term "comprising" covers the case where only the recited features are present as well as the case where these features and one or more other features are present. Therefore, the scope of the expression "a device comprising component A and component B" should not be interpreted as being limited to a device consisting only of component A and component B. This means that for the purposes of the present invention, the only relevant components of the device are A and B.

[0059] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" throughout this specification do not necessarily all refer to the same embodiment, but may refer to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner, as will be apparent to one of ordinary skill in the art from this disclosure.

[0060] Similarly, it should be understood that in the description of exemplary embodiments of the present invention, various features of the present invention are sometimes combined in a single embodiment, figure, or description thereof for the purpose of simplifying the disclosure and aiding in the understanding of one or more of the various inventive aspects. However, this disclosure method should not be interpreted as reflecting the intention that the claimed invention requires more features than those explicitly stated in each claim. On the contrary, as reflected in the following claims, inventive aspects lie in less than all the features of a single aforementioned disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, with each claim independently serving as a separate embodiment of the present invention.

[0061] In addition, although some embodiments described herein include some features but do not include other features included in other embodiments, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments, as will be understood by those skilled in the art. For example, in the following claims, any of the claimed embodiments may be used in any combination.

[0062] In the description provided herein, many specific details are set forth. However, it should be understood that embodiments of the present invention may be implemented without these specific details. In other cases, well-known methods, structures, and techniques are not shown in detail in order not to obscure the understanding of this specification.

[0063] In embodiments of the present invention, reference is made to a magnetron structure, a magnetron and a controller (e.g., an integrated circuit) rigidly connected thereto. The integrated circuit may be located inside the magnetron, or may be attached to the magnetron, a specific portion thereof, or its housing. The magnetron may include a top portion for mounting a target thereon, a housing, and a bottom portion for mounting the magnetron to the rest of the sputtering unit. The controller (e.g., an integrated circuit) may be rigidly attached to the top portion, the housing, or the bottom portion, or may be located inside any of these components.

[0064] Furthermore, when referring to a magnetron structure, one may refer to a system for a planar target and a system for a cylindrical target. In the latter case, the magnetron structure may also be referred to as an end block structure and the magnetron may be referred to as an end block. In some specific embodiments, the top portion may correspond to an end block head for mounting a cylindrical target and / or a corresponding magnetic rod. In such embodiments, the bottom portion may also correspond to a base plate, which is typically used to mount the end block to the rest of the sputtering apparatus.

[0065] The top part of the magnetron structure may be exposed to the harsh environment of the plasma (e.g., heating, bombardment, ...) and may contain all the critical parts of the magnetron structure that require regular inspection or maintenance; for example, containing wear parts (e.g., dynamic seals, brushes for transferring signals or power, sliding and rolling parts, ...) or parts that require cleaning or lubrication, or any other intervention. The top part may consist of or include subassemblies that can be easily removed or replaced for modification and quick replacement. This minimizes the downtime of the sputtering equipment, while modifications or updates of the subassemblies can be performed separately (outside the factory, or in an area not necessarily related to the sputtering equipment) without affecting the functionality of the sputtering equipment.

[0066] The bottom portion may be more rigidly connected to the sputtering apparatus; for example, bolted to a wall, cover, lid, or portion of the sputtering apparatus, such as a portion of a vacuum chamber. The bottom portion may be less sensitive to aging, may be less exposed to harsh environments, and may preferably not require any periodic inspection or modification. It may be a portion that forms an interface with the top portion, used to allow the sputtering process to work, but in most cases is considered to belong to the sputtering apparatus. Thus, the magnetron structure may consist of a single large construction, or of multiple constructions as described herein, with a top portion and a bottom portion.

[0067] In the embodiments of the present invention, a sputtering unit is mentioned, referring to a system including a magnetron structure and a magnet configuration (i.e., a magnetic rod in the case of a cylindrical target system). The sputtering unit can generally be located in a vacuum chamber, thereby forming part of a sputtering device. Other components in such a sputtering device can be a vacuum pumping system, a substrate holder, etc. and are well known to those skilled in the art.

[0068] In the embodiments of the present invention, reference to signal processing or data processing may refer to changing, modifying, calculating signals or data, applying a predetermined algorithm to signals or data, etc. When reference is made to communication in the embodiments, this may include sending, storing, retrieving, etc.

[0069] In a first aspect, the present invention relates to a magnetron structure for a sputtering device. The magnetron structure includes a magnetron and a controller, which can be implemented as an integrated circuit and is rigidly connected to the magnetron. The controller is configured to control the condition and / or function of the sputtering device. In some embodiments, the controller can also be configured to at least partially monitor the condition and / or function of the sputtering device. In some specific embodiments, the controller may include a data processor for processing signals into data or processing data into signals. Such data can be stored and / or used for monitoring or controlling the sputtering device. The controller can be a microcontroller, such as a low-voltage microcontroller.

[0070] It should be noted that magnetron structures according to embodiments of the present invention can be used for flat targets as well as cylindrical targets. In the following, reference will often be made to magnetron structures for use with cylindrical targets (in this case, by reference to end block structures and end blocks) because this illustrates some additional issues in terms of movement of targets used in vacuum systems under vacuum conditions, where monitoring and control according to embodiments of the present invention can be advantageously used. However, similar teachings can be applied mutatis mutandis to structures for flat targets and are therefore also contemplated.

[0071] The end block is preferably mountable on the sputtering device as a single unit, although wall-integrated end blocks are also conceivable. Parts that can be removed with the target tube or removable magnetic bar assemblies may sometimes be considered not to belong to the end block. The main function of the end block is to carry the target. It can also be configured to rotate the target around an axis of rotation. Since sputtering is carried out at low gas pressure, the end block must always ensure gas tightness when rotating. Since the sputtering of the target generates a lot of heat on the target surface, the target must be cooled, which is usually done with water or another suitable coolant or cooling fluid. This coolant must be fed and emptied through the end block. In addition, an electric current must be fed to the target in order to maintain the target above a certain potential. Likewise, the electric current must pass through the end block. In order to incorporate all these functions, the end block can include different components.

[0072] A.) A drive member (e.g., a driver) for rotating the target, such as a worm gear system, or a cylindrical gear-gear system, or a conical gear-gear cross-axis system, or a pulley-belt system, or any other member known in the art for rotating the target.

[0073] B.) Electrical contact means for supplying the target with current (e.g. rotatable contacts, connectors). This can be achieved by an electrical commutator equipped with brushes which are in sliding contact with the commutator ring. Instead of a brush ring arrangement, two rings sliding against each other can also be used, or a connection of the conductive strip type can be used, for example a metal strip. The latter solution conveniently combines the drive means in the radial direction of the electrical contact means.

[0074] C.) Bearing member, such as a bearing. Depending on the weight of the target, more than one bearing may be required. A person skilled in the art will easily select a suitable bearing type from the known different types, such as a ball bearing, a roller bearing, a plain bearing, an axial bearing or any other type known in the art.

[0075] D.) At least one coolant seal, for example a rotatable coolant seal. These coolant seals ensure that coolant does not leak into the end block or, worse, into the vacuum equipment or the sputtering chamber when the fixed part and the rotatable part of the end block rotate relative to each other. In order to reduce this risk, a number of coolant seals are introduced in a cascade manner. Usually lip seals are used as coolant seals, as they are well known in the art. However, other types of seals, such as mechanical end face seals or labyrinth seals, are not excluded, but this is not exhaustive.

[0076] E.) Finally, at least one vacuum seal may be included, for example a rotatable vacuum seal. These vacuum seals ensure the integrity of the vacuum when the fixed and rotating parts of the end block rotate relative to each other. To reduce the risk of vacuum leaks, a cascade of vacuum seals is preferred - the vacuum is protected step by step. Again, different seals are known, with lip seals being the most popular, although of course other types of seals may also be used, such as ferrofluid seals.

[0077] As indicated above, the magnetron may include a magnetron top portion that typically hosts the various components described above, a magnetron bottom portion for mounting the magnetron into a system and for making connections between the vacuum and non-vacuum sides of the sputtering apparatus.

[0078] According to embodiments of the invention, the controller (e.g., an integrated circuit) is rigidly attached to the magnetron, i.e., to the top portion, the bottom portion, or the housing. In some embodiments, the controller may be located inside the top portion of the magnetron or the bottom portion of the magnetron. According to at least some embodiments of the invention, at least part of the processing from signal to data or from data to signal is performed in the controller.

[0079] In some embodiments of the invention, a signal, such as a signal from a sensor (sensor signal) can be received in a controller and processed into data for monitoring or controlling the state of the sputtering device or its components or the state of the sputtering process. The data can be further used, stored or transmitted to another device, such as a device outside the vacuum chamber. The magnetron structure can therefore also include data storage components and / or data communication components.

[0080] In some embodiments of the present invention, control data optionally originating from outside the vacuum portion of the sputtering device may also be transferred to a controller and processed in the controller to generate control signals in a magnetron for controlling the magnetron or components of the sputtering device. For example, control signals may be received and processed from an input command console (e.g., outside the vacuum portion of the sputtering device). These may also be stored. The controller may use control data associated with the state of the control unit or sputtering process to control an actuator within the vacuum portion of the sputtering device (e.g., a magnetron).

[0081] In some embodiments, both monitoring data and control data may be handled by a controller of the magnetron.

[0082] In some embodiments, the controller can receive signals from the sensors, provide processed monitoring data, and use this information to generate control data, which can be used to control, adjust or fine-tune the sputtering device or sputtering process by sending these control data to the actuators without much human interaction. Thus, an automated sputtering process can be provided, whereby little or no communication with the space outside the vacuum chamber is required.

[0083] By way of illustration, embodiments of the invention are not limited thereto and standard and optional features will now be further described with reference to the accompanying drawings. Reference is again made to the magnetron structure for a cylindrical target, but these features can be applied mutatis mutandis to the magnetron structure for a planar target.

[0084] Figure 1 and Figure 2 Two exploded views of different types of magnetron structures 100, 200 are shown, which include a top part 101, 201 and a bottom part 102, 202. The top part 101, 201 is used to mount the target, while the bottom part serves as a connection between the top part and external subsystems (usually located outside the vacuum system) such as motors, cooling systems, etc. Figure 1 The magnetron 100 is a magnetron that provides a driving function and can drive a cylindrical target. Figure 2The magnetron 200 provides cooling and power supply functions for introducing a cooling fluid to cool the target and putting the target at a sputtering voltage. However, the present invention is not limited to these types of magnetrons. All functions as described above can be concentrated in a single magnetron, or distributed differently on different magnetrons. In addition, the bottom part and the top part can be an integral piece.

[0085] Figure 1 The magnetron shown comprises a top part 101 which can be attached to a bottom part 102, for example by screwing a threaded neck 103 of the top part 101 onto a corresponding part 104 of the bottom part 102. Any other suitable connection system may be used. Figure 1 In the example of the present invention, the motor group 105 can be coupled to the bottom part 102, and the bottom part 102 can transmit the driving power of the motor 105 to the top part 101 of the magnetron 100. The top part 101 then rotates the rotatable target attached thereto. In some embodiments of the present invention, the motor group can also be integrated with the top part as a single piece.

[0086] According to one embodiment of the invention, the controller 106, optionally including a processor (e.g., a processing unit) may be included in the top part 101 of the magnetron (e.g., attached to the static part). However, it may also be included in the bottom part, e.g., attached to the bottom part.

[0087] exist Figure 2 In the case of a cooling circuit 203 included in the bottom portion 202, for introducing a cooling fluid (e.g., water, treated water, any other suitable liquid or gas) through the top portion 201 via an inlet 204, and for draining the spent cooling fluid via an outlet 205. In this particular example, electricity is connected to bolts 208 above the inlet and outlet, and electricity is transferred to the top portion 201 through pins of the bottom plate. A controller 206 including a processor can be attached to either the top portion or the bottom portion of the end block.

[0088] In some embodiments, the controller 206 may be located on the vacuum side of the magnetron structure, allowing any signals to be transmitted directly from inside the unit. The invention is not limited to this configuration, and integrated circuits may be placed on the atmospheric side of the magnetron structure, for example to process data related to the functioning of the cantilever magnetron.

[0089] In any case, wherever the controller is attached, it is advantageous to protect the material deposited during the sputtering process from the plasma, cooling fluids, etc.

[0090] In some embodiments of the invention, at least one sensor or actuator 207 may be included in the magnetron itself, thereby obtaining a highly integrated magnetron. For example, the sensor or actuator may be part of the magnetron controller. For example, in a sputtering process, in-situ monitoring may be obtained in a compact manner without the need for further installation or connection.

[0091] By way of illustration, the embodiments are not limited thereto, and an example of monitoring and / or controlling a specific parameter in a controller in a magnetron structure will be further described.

[0092] Monitoring example.

[0093] Power Monitoring

[0094] Signals may be provided to the controller 206, for example, from at least one sensor (not shown), which may sense parameters related to the sputtering power, such as the voltage supplied to the target, the current through the system, the spectral content of the signal (e.g., changes in AC shape, frequency, etc.), impedance, etc. This may provide information about fluctuations, process stability, power delivery status, problems with the target such as arcing, etc. A sensor for generating such a signal may be included in the magnetron, for example as part of the controller. For example, the sensor may detect the status of the power delivery. For example, the status of brushes (which are used to transfer power from the static parts of the magnetron to the rotating parts of the magnetron) may be sensed to detect wear, etc. (e.g., by monitoring resistance). Additionally or alternatively, the sensor signal may be provided from outside the magnetron structure but, for example, in the vacuum system.

[0095] Sensors for sensing electrical parameters may be used, such as resistance sensors, voltmeters, current sensors, waveform detectors, etc. They may measure these parameters locally on the target or in the magnetron, or at input ports into the unit where the electrical signal is input, etc. Measuring directly on the magnetron structure, rather than on the power supply as is usually done, gives a richer signal from which more accurate information can be obtained. In existing setups, long cabling must be used to obtain measurements, which results in the signal at the power supply not reflecting the exact signal close to the target. The cabling may have impedance losses, so the actual impedance of the plasma cannot be easily measured at the power supply. In addition, high-frequency signals may be attenuated by the connecting wires. This effect makes the study of signal interference difficult. These interferences are an important source of information because they may be caused by plasma oscillations or physical limitations of the target finish or magnetron power transfer components. In some embodiments of the present invention, measurements at the target provide faster and more accurate signals without capacitive or inductive losses from the cabling and / or magnetron connection system.

[0096] The controller 206 collects the signals and provides processed data therefrom, thereby providing information relevant to the monitoring of the sputtering process (eg, stability of the power supply).

[0097] Cooling fluid monitoring.

[0098] In another example, you can Figure 2 The controller 206 provides a signal, such as a signal from at least one sensor 207, which can sense parameters related to the cooling fluid, such as the temperature of the fluid through the inlet 204, the temperature of the fluid through the outlet 205 (and the difference thereof), which can be used to assess the efficiency of the cooling process; alternatively or in addition, it can also sense parameters related to pressure or flow rate, which can be used to detect a drop in pressure fluctuations or even detect leaks. Another parameter can be the resistivity of the cooling fluid, which is useful for monitoring the amount of salt and other additives in the cooling fluid.

[0099] As previously described, controller 206 collects signals and advantageously provides processed data therefrom to provide information relevant to the monitoring of the cooling process.

[0100] Sensors may also be included in the magnetron, for example as part of a component of a cooling system present in the magnetron, for example in the top section or the bottom section. For example, flow sensors at the inlet and outlet may be used to measure the cooling fluid flow, and the controller may process and monitor the flow difference, which may allow, for example, detection of leaks. Additionally or alternatively, the sensor signal may be provided from elsewhere, for example from the portion of the target tube that receives the cooling fluid.

[0101] Monitoring magnetic configuration

[0102] In some embodiments, the controller may capture and process sensor signals to obtain information related to the magnetic configuration, such as one or more of the following non-exhaustive examples of sensor signals related to magnetism:

[0103] - Type of magnet configuration and / or positioning of the magnet configuration, such as global positioning (sensing translational or rotational position, movement speed, etc.) and / or local positioning (e.g. from optical sensors, magnetic sensors such as Hall sensors, etc.).

[0104] -The temperature of the magnetic source, as it affects the magnetic field strength, e.g. thermocouples, thermopiles, etc.

[0105] -Magnetic strength, e.g. at several points along the magnetron.

[0106] The controller collects the sensor signals and advantageously provides processed data related to the magnetic field, which can be used to monitor problems related to the plasma racetrack, ion bombardment, process efficiency, etc. and more generally related to the sputtering process or sputtering equipment.

[0107] Monitoring other sputtering equipment properties

[0108] In some embodiments, the controller 106, 206 may capture the following non-exhaustive examples of sensor signals or actuator settings related to the condition or function of the sputtering system from the rest of the sputtering apparatus (e.g., from the vacuum chamber):

[0109] - The temperature close to the target (eg, the target's backing structure).

[0110] - Temperature of specific parts of the magnetron (housing, connections, seals, etc.).

[0111] - System internal pressure; for example, some parts may be at atmospheric pressure or have a pressure difference between atmospheric pressure and the pressure inside a vacuum system and used to potentially detect gas leaks.

[0112] - A humidity sensor, particularly suitable for detecting the cooling fluid outside the cooling system or outside the target; for example, for checking and potentially detecting liquid leaks.

[0113] The controller collects the sensor signals and advantageously provides therefrom processed data relating to the state of the magnetron, which data can be used to monitor problems relating to sealing and the like.

[0114] For magnetrons used with cylindrical targets, the controller may also have information related to target drive, such as target movement speed (e.g., target rotation), accumulated rotation amount, which may be processed to provide monitoring of operating life. Note that due to the processing performed by the electronic circuitry, other properties (e.g., other properties also monitored by the controller) may be considered as weighting factors for processing operating life, such as load level, temperature, etc.

[0115] Information regarding current, torque levels and their history (eg, over time or within a revolution) as well as the temperature of the drive unit may also be monitored.

[0116] The status of the drive components in the magnetron and the status of the bearings (eg, pressure on the bearings) may also be sensed, sent to the controller, and processed into monitoring data.

[0117] In some embodiments of the present invention, the processed data can be sent outside the vacuum portion of the sputtering device, for example to a readout (screen, monitor, color-coded light panel, etc.), or to an external memory, or even to an external data processing unit for further processing, such as data analysis, etc.

[0118] For data exchange, the magnetron structure can have an interface to communicate with external equipment; this can be wireless (e.g. WIFI, Bluetooth, optical or any other type of EM radiation...) or wired, with a connector (electrical connection, optical connection...) for transferring data.

[0119] Additionally or alternatively, the processed data may be stored in a memory included in the controller. For example, a history of monitoring data may be constructed, allowing long-term monitoring and tracking of the sputtering device, which may also be identified by the controller according to an embodiment of the present invention.

[0120] Based on such historical data, deterioration of the unit (aging of seals or bearings, wear of contact brushes, higher friction or torque, increased temperature, target consumption or damage or anything else of this nature) can be detected early, before the damage spreads to other parts or deteriorates the sputtering process.

[0121] In an alternative or additional embodiment of the invention, the control data may be processed by a controller of the magnetron.

[0122] For example, a control signal can be sent to a magnetron, a controller can provide processing of the signal, and the processed control data can be used to control an actuator, which is connected to the controller. The magnetron structure or the electronic circuit therein can be adapted to control the actuator according to the control data processed by the processor. Therefore, only an input console is required to control the actuator, and processing power (computer) outside the vacuum part of the sputtering device is not required to control these actuators. The actuators can be outside the vacuum part of the sputtering device (e.g., actuators of a power supply or cooling system), or they can be in the sputtering device (e.g.: on the magnetron, or at the valve of the gas inlet, or to the drive system), or even in the magnetron (e.g.: valve for the inlet of the cooling system, or to the drive system).

[0123] As previously described, an interface may be provided for transferring control data, which interface may be of the same or different type as the interface used for transferring monitoring data.

[0124] Control Example

[0125] Examples of process control components and their corresponding process parameters that can be processed as control data by the magnetron structure are listed below, but are not exhaustive:

[0126] - Power supply: A process parameter related to the power supply is, for example, a waveform or a power level, e.g. a voltage level or a current level, which is related to the energy applied to the system. The power level is usually a global process parameter, i.e. it cannot be changed in only one location. A higher power level with other constant deposition parameters can, for example, lead to a higher thickness. In a sputtering process, the power supply is usually connected to a magnetron for powering the target. However, in parallel, an additional power supply can be provided; for example, for powering an active anode system, such as for powering an ion source.

[0127] In some embodiments of the invention, control data relating to power supplies and power levels may be processed, including controlling power to an ion source and / or a magnetron.

[0128] - Gas main supply: The process parameter related to the main gas supply is the gas flow rate. The gas distribution determines the location-dependent partial pressure in the process chamber. Gas distribution is a complex parameter because different gases may play a role, either pure or with different mixture ratios. The influence of the gas main supply may be constrained by the size of the delivery system beyond the process chamber.

[0129] - Reactive gas supply: The process parameters related to the reactive gas supply are the gas distribution and the partial pressures involved, or the gas flow rate. A higher reactive gas flow rate generally results in a lower sputtering rate. By varying the reactive gas flow rate, the thickness of the layer to be deposited can be controlled; however, its composition and properties may also be affected.

[0130] - Target (eg rotational speed). The actuator can be placed in the magnetron structure, for example by tuning the drive system or directly tuning the motor to tune the rotational speed.

[0131] -Magnetic configuration: Process parameters related to the magnetron are, for example, magnetic field strength, magnet movement or rotation speed. The magnet movement includes magnet bar orientation and magnet bar position. The magnet bar position determines the plasma density and thus the sputtering rate. If the magnet bar consists of multiple segments, the influence of the magnet bar may be local. A stronger local magnetic field produces a higher local sputtering rate.

[0132] -Anode: One process parameter related to the anode is the anode tuning level; for example, the ground resistance level.

[0133] -Heating: The process parameter associated with heating is the temperature level. Different temperatures can be applied at different locations.

[0134] - Cooling fluid: Process parameters related to the cooling fluid may be flow rate, temperature, but also conductivity, purity, amount of debris (particles in the fluid that may wear, e.g., dynamic seals). For example, the controller may also be used to operate and / or control valves mounted inside the magnetron structure for controlling (e.g., optimizing) cooling fluid properties (e.g., flow rate, etc.).

[0135] Control may be provided externally, for example, by sending a signal to a controller, which processes the signal to obtain control data. The invention is not limited thereto, and control may be provided internally. For example, control of the target and / or magnetic configuration may be accomplished internally, for example using a controller included in the magnetron structure, based on, for example, monitored data.

[0136] The control data may include any one of these listed parameters, or even a combination thereof. The parameters may be controlled by varying different actuators of different systems. For example, control data relating to the movement of the magnet may be processed in the electronic circuitry of the magnetron structure and may be used to influence said movement, such as the orientation of a rod, via an actuator coupled to a controller.

[0137] In some additional or alternative embodiments, the controller is adapted to both monitor conditions of the sputtering apparatus (or sputtering process) and to control the sputtering apparatus (or sputtering process).

[0138] In one example, a controller of a magnetron structure can receive or capture sensor signals. The signals are processed into monitoring data. In response to the monitoring data, the controller generates control data that can be used to control the sputtering process or parts of the sputtering device. Thus, a feedback loop with good self-regulation of the process or sputtering device can be established. This can provide high stability for sputtering, as well as less need for human feedback or intervention. In general, the required human interaction can be reduced, so a highly automated unit is advantageously obtained.

[0139] In this embodiment, it is not strictly necessary to connect an actuator that can be controlled from inside the controller. During the installation of the sputtering device, it is only necessary to connect the actuator and sensor to the circuit of the magnetron structure, without connecting and configuring the actuator and / or sensor to any external computer or control system. Therefore, a compact, stable and modular unit is obtained, with a small number of connections to the outside. If necessary, a connection can still be provided for introducing initial settings or external control (for example, for overriding feedback control), or for outputting monitoring data or alarm signals generated in the controller based on monitoring data. This still allows human interaction, but not so intense. For example, the sputtering device can be independent within a certain range of operating points. For example, a system with a self-sustaining magnetron structure can be provided, in which only high-level data can be transmitted to the outside. For example, maintenance is usually required during the coating process, such as when the coater is shut down. The present invention is able to solve the remaining changes internally. This enables the next coater stop to be smoothly achieved without intermediate failures.

[0140] Specific Examples of Combined Monitoring and Control

[0141] Several configurations of magnetrons may be provided, including controllers for controlling and / or monitoring the sputtering process and the status of the sputtering apparatus. Any suitable combination of monitoring data and control data may be used, for example, power control when power levels drop, cooling fluid flow increases if monitoring data indicates an increase in power levels or temperature or a combination of both, sputtering gas flow changes if the raceway becomes unstable, and other combinations.

[0142] In a specific example of this feedback configuration, a controller of the magnetron structure can monitor the sputtering process and / or power. When the monitoring data shows stable sputtering and low power, based on this information, the controller can generate control data and control the actuator of the cooling system to reduce the flow of the cooling fluid, thereby reducing fluid (e.g., water) consumption. However, the processor can be programmed to reduce the cooling fluid flow only within a predetermined range from the safe operating point. Otherwise, beyond this range (e.g., if the control data shows that the flow will be reduced below a predetermined threshold), the controller can be programmed to notify the operator for verification.

[0143] In certain applications, the magnetron may be heated, resulting in energy loss, thermal expansion and aging, which may damage vacuum seals, cooling fluid seals, etc. In some embodiments of the present invention, sensors in the housing or magnetron can detect temperature and / or thermal expansion, and the signal can be sent directly to the controller for processing. One or more sensor signals are interpreted, and if the data shows that the signal exceeds a predetermined threshold, the processed data can be used to generate control data for controlling an alarm external to the magnetron unit, or reducing power and / or frequency and / or rotation speed, or any of a number of parameters. In some specific embodiments, the sensor used to monitor the state of the magnetron structure can be part of the controller, thereby obtaining a highly compact arrangement.

[0144] In one specific example, a sensor can be included in the magnetron structure for sensing torque. A controller can capture the sensor signal (e.g., the sensor signal can be sent to the controller for processing), and a processor interprets the signal as monitoring data to monitor the torque of the target. If the torque does not fall within a predetermined range, this may mean that the target is not well attached to the magnetron, or there is too much friction, and the processor can be programmed to trigger an alarm, for example, by sending a signal to an alarm system. The monitoring data can also show periodic changes in torque, which may mean that the target has deformation (e.g., bending) and scratches some components of the sputtering equipment. The torque data can also be related to the target speed, which can be directly introduced via the data interface, or can also be sensed.

[0145] Controller Example

[0146] To provide processed data, the controller may include a processor. It may be programmed to process sensor signals (e.g., signals generated by and captured from the sensor) to provide monitoring data. In this case, the controller may include signal inputs, such as optical inputs, electronic inputs (wired or wireless inputs, such as via radio frequency RF), pressure inputs, etc. The circuit may include analog-to-digital and / or digital-to-analog converters.

[0147] Additionally or alternatively, the processor may be programmed to generate control data from commands. In this case, the input of external commands may be included. In some embodiments, it may be programmed to generate control data from monitoring data, for example from monitoring data processed by the electronic unit itself, from sensor signals. The controller may be adapted to drive and control actuators in a magnetron structure, typically actuators in a sputtering device or a subsystem associated therewith, which may be inside or even outside a vacuum portion of the sputtering device (cooling system, power supply, etc.).

[0148] The controller may include a data storage device (e.g., memory) for storing data, lookup tables, algorithms, etc., which may be accessed by the processor and / or external systems to provide long-term monitoring, etc. The stored information may relate to monitoring data (historical records, etc.), control data (for controlling actuators), or data related to monitoring and / or controlling a sputtering process or a sputtering apparatus.

[0149] The controller may be adapted to provide feedback, for example controlling the actuator in response to processed monitoring data and / or in response to a comparison of values ​​from the monitoring data with predetermined data on a memory.

[0150] The magnetron may have an interface for communicating with an external instrument and exchanging data with the external instrument; this may be wireless (e.g., WIFI, Bluetooth, optical or any other type of EM radiation...) or wired, with a connector (electrical connector, optical connector...) for transferring data to and from the controller. The interface may include a connector extending through the magnetron and / or its housing, outside the vacuum portion of the sputtering apparatus, from which it may be connected to the external instrument, e.g., via a wired connection. In some embodiments, as Figure 1 As shown, the interface 108 or its connector includes an antenna 109 for exchanging signals with external equipment.

[0151] In some specific embodiments, the interface of the magnetron is capable of transmitting and / or receiving data (monitoring data and / or control data) and also capable of receiving power for powering the controller, for example using a single connector. The number of connections, wires, etc. can be reduced. Such a dual connector for data and power signals can be wired or wireless.

[0152] The interface may be part of the controller. In other embodiments, the controller may be connected to an interface that is remote from the rest of the circuit (e.g., at a different location from the magnetron). Figure 1 As shown, the controller 106 can be in the top part 101 of the magnetron, and it can exchange data with the interface 108 in the attachable bottom part 102. The data exchange between the interface and the controller can be done via a wired connection. It can also be done wirelessly, for which both the interface 108 and the controller 106 can include a wireless data transmitter / receiver, thereby obtaining a fully modular magnetron assembly that is easy to replace and exchange. For example, different magnetron top parts can be used with the same bottom part, and only the wireless connection between them needs to be paired.

[0153] The controller may be powered by a local source such as an integrated battery. In some embodiments of the invention, the circuit may be powered by extracting energy (e.g., with a power extractor) from available sources such as cooling fluid flow (hydraulic conversion), power supply to the target tube, etc. In some embodiments, the circuit may be powered by an external connector, which does not require maintenance, such as opening the vacuum system of the sputtering device to replace batteries.

[0154] The controller may include a cooling system. For example, a cooling system of the sputtering device may provide cooling to the controller.

[0155] In some embodiments of the invention, at least the processor may be a monolithic circuit, although more components may be included as part of the controller.

[0156] In some embodiments, Figure 3 As shown, the controller is an integrated module 301, including a processor (e.g., a single-chip processor 302), and also including ADC, DAC, data connector, signal input for capturing sensor signals, drivers, and even sensors and / or actuators. Thus, a highly integrated device is obtained, which can be assembled to and customized according to the specific geometry of the magnetron 300.

[0157] Figure 4 A perspective view of a magnetron 401 is shown with a section of the magnetron 401 removed for viewing its interior. An exemplary placement of an integrated module 402 including a processor embedded within the magnetron 401 is shown. The module 402 can be attached to the static portion of the part 401, facilitating any required connections. The geometry of the module 402 can be adapted to allow for the introduction of any necessary power pins, cooling systems, etc. Figure 4 The example shown is that of a one-piece magnetron, with no separate top or bottom sections.

[0158] In a second aspect, the present invention provides a sputtering apparatus comprising at least one magnetron structure according to an embodiment of the first aspect of the present invention.

[0159] Further features and characteristics may correspond to the features of the specific embodiment of the magnetron structure as described in the first aspect of the invention.

[0160] In a third aspect, the present invention relates to the use of a controller in a magnetron structure for use in a sputtering device. The magnetron structure can be used with a rotatable magnetron sputtering source for a tubular target, but is not limited to this. The controller can be adapted (e.g., programmed) for monitoring parameters related to the sputtering process and / or the sputtering device, or for controlling its functions, or a combination of both. The controller can be suitable for processing data into signals, or processing signals into data. The controller can be fully integrated into the magnetron structure, for example integrated into the top part of the magnetron, the bottom part of the magnetron or its housing. For example, one or more circuits forming the controller can be attached or integrated in a magnetron for a cylindrical target (e.g., attached or integrated to the base plate of the magnetron or its head). Further features can correspond to the functions of the components described in the first and second aspects.

Claims

1. A magnetron structure for a sputtering device, the magnetron structure being an end block and comprising a magnetron (100, 200, 300, 401) and a controller (106, 206, 301, 402) rigidly connected to the magnetron (100, 200, 300, 401), the magnetron being used to removably support a target tube, the magnetron structure comprising no parts that can be removed with the target tube, the magnetron structure further comprising a sensor (207) for sensing a sensor signal related to the sputtering device or a sputtering process, the controller (106, 206, 301, 402) being configured to receive a signal from the sensor (207) in the magnetron structure and to process the signal into data to monitor or control the state of the sputtering device or a component of the sputtering device or the state of a sputtering process.

2. The magnetron structure according to claim 1, wherein: The controller (106, 206, 301, 402) comprises a data processor (302) for processing a signal into data, or processing data into a signal.

3. A magnetron structure according to any one of the preceding claims 1 and 2, wherein: The controller (106, 206, 301, 402) also includes a data storage device for storing data related to at least partially monitoring and / or controlling the condition and / or function of the sputtering device.

4. The magnetron structure according to any one of the preceding claims 1 and 2, wherein: The magnetron is an end block adapted to support a cylindrical magnet bar and a sputtering target.

5. The magnetron structure according to any one of the preceding claims 1 and 2, wherein: The controller (106, 206, 301, 402) also includes a communication component for exchanging data with a controller outside the vacuum section of the sputtering apparatus.

6. The magnetron structure according to claim 5, wherein: The communication component is adapted to perform wireless communication using any one of WIFI communication, Bluetooth communication, optical communication or any EM radiation, or is adapted to perform wired communication using any one of optical fiber communication or electrical communication.

7. The magnetron structure according to any one of the preceding claims 1 and 2, wherein: The magnetron (100, 200, 300, 401) also includes a controller for controlling at least one actuator to adjust a parameter related to a sputtering process in the sputtering apparatus.

8. The magnetron structure according to any one of the preceding claims 1 and 2, further comprising a power source for powering the controller, the power source being one of a battery or a power extractor adapted to obtain power from a cooling fluid flow or a power supply of a target tube.

9. The magnetron structure according to any one of claims 1 and 2, wherein: The controller is powered by a wired connection from an external non-vacuum part of the sputtering apparatus.

10. The magnetron structure according to any one of the preceding claims 1 and 2, wherein: The magnetron (200) comprises a top part (201) for holding a target and a bottom part (202) attachable to the top part (201), wherein the controller (206) is rigidly connected to the bottom part.

11. The magnetron structure according to any one of the preceding claims 1 and 2, wherein: The magnetron structure includes a wireless connector including an antenna (109) for exchanging signals with an external device.

12. The magnetron structure according to any one of the preceding claims 1 and 2, wherein: The data is any one of or a combination of information related to coolant, information related to sputtering power, information related to magnetism, information related to magnetron status, or information related to target driving.

13. The magnetron structure according to any one of the preceding claims 1 and 2, wherein: The controller (106, 206, 301, 402) provides information to facilitate maintenance while in use, giving information about its status and the estimated time when preventive maintenance is required.

14. The magnetron structure according to any one of the preceding claims 1 and 2, wherein: The controller (106, 206, 301, 402) provides information to facilitate maintenance when making modifications to understand historical data, thereby facilitating appropriate modifications and maintenance.

15. A magnetron structure according to any one of the preceding claims 1 and 2, wherein: The controller is a microcontroller.

16. The magnetron structure according to claim 15, wherein: The controller is a low voltage microcontroller.

17. A sputtering apparatus comprising a magnet arrangement and a magnetron structure according to any one of claims 1 and 2.

18. Use of a controller in a magnetron arrangement for at least partially controlling the conditions and / or functions of a sputtering device according to claim 17.

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