Microfluidic Actuator Device

Abstract

A microfluidic actuator device comprises a carrier plate, a microfluidic actuator, a microfluidic actuator, an electrode pad and an electrostatic protection circuit. The microfluidic actuator is arranged on the carrier plate to transport fluid. The microcontroller is used to control the opening or closing of the microfluidic actuator. The electrode pad is arranged on the carrier plate and is electrically connected to the microfluidic actuator. The electrostatic protection circuit is electrically connected to the electrode pad.

Description

[Technical field]

[0001] The present invention relates to a microfluidic actuator device, and more particularly to a microfluidic actuator device having an electrostatic protection circuit. [Background technology]

[0002] At present, in various fields, whether it is medicine, computer technology, printing, energy and other industries, products are developing in the direction of refinement and miniaturization, among which the microfluidic actuator contained in micro pump products is its key technology.

[0003] With the rapid development of technology, the application of fluid delivery structures is becoming more and more diversified, including industrial applications, biomedical applications, healthcare, electronic cooling, daily electronic products, etc., and even the recently popular mobile wearable devices can also see its shadow. It can be seen that traditional fluid actuators have gradually tended towards device miniaturization and flow maximization.

[0004] In the prior art, a variety of microfluidic actuators manufactured by micro-electromechanical semiconductor processes have been developed. However, the operating frequency of the miniaturized microfluidic actuator reaches above 100KHZ. Due to the high operating frequency, the microfluidic actuator continuously rubs against the transported fluid during operation, causing static electricity to continuously accumulate on the microfluidic actuator. Therefore, how to avoid static electricity accumulation, enable the microfluidic actuator device to be used normally and for a long time, and protect the microfluidic actuator device from the influence of static electricity is one of the problems that urgently need to be solved. [Summary of the invention]

[0005] The main purpose of this case is to provide a microfluidic actuator device with an electrostatic protection circuit.

[0006] A general implementation of the present invention is a microfluidic actuator device, comprising: a carrier board, at least one microfluidic actuator, at least one microcontroller, at least one electrode pad, and at least one electrostatic protection circuit. The microfluidic actuator is disposed on the carrier board to transport fluid. The microcontroller is used to control the opening or closing of the microfluidic actuator. The electrode pad is disposed on the carrier board and is electrically connected to the microfluidic actuator. The electrostatic protection circuit is electrically connected to the electrode pad.

Brief Description of the Drawings

[0007] Figure 1A Schematic diagram of the microfluidic actuator in this case.

[0008] Figures 1B to 1D Schematic diagram of the operation of the microfluidic actuator in this case.

[0009] Figure 2A FIG. 4 is a schematic diagram of a first embodiment of the microfluidic actuator device of the present invention.

[0010] Figure 2BFIG. 4 is a schematic diagram of a second embodiment of the microfluidic actuator device of the present invention.

[0011] FIG. 3A to FIG. 3D Schematic diagram of different positions of the microcontroller of the microfluidic actuator device of this case.

[0012] Figure 4A FIG. 4 is a circuit diagram of a first embodiment of an electrostatic protection circuit of a microfluidic actuator device of the present invention.

[0013] Figure 4B FIG. 4 is a circuit diagram of a second embodiment of an electrostatic protection circuit of the microfluidic actuator device of the present invention.

[0014] Figure 5A and Figure 5B Schematic diagram of different electrostatic protection circuit states of the first embodiment of the microfluidic actuator device of the present invention.

[0015] Fig. 6A FIG. 4 is a circuit diagram of a first embodiment of an electrostatic protection circuit of a microfluidic actuator element of the present invention.

[0016] Figure 6B FIG. 4 is a circuit diagram of a second embodiment of an electrostatic protection circuit of a microfluidic actuator element of the present invention.

[0017] Fig. 7A and Figure 7B Schematic diagram of different electrostatic protection circuit states of the second embodiment of the microfluidic actuator device of the present invention. [Specific implementation method]

[0018] The embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different aspects without departing from the scope of the present invention, and the descriptions and illustrations therein are essentially for illustrative purposes rather than for limiting the present invention.

[0019] In the description of the embodiments of the present case, it should be understood that the "and" mentioned has the same meaning as the general logical operator "AND" or "∧", for example, electrode pad A and electrode pad B refer to both electrode pad A and electrode pad B at the same time; the "or" mentioned has the same meaning as the general logical operator "OR" or "∨", for example, electrode pad A or electrode pad B includes both electrode pad A and electrode pad B, single electrode pad A, and single electrode pad B.

[0020] Please refer to the schematic diagram of the microfluidic actuator of the microfluidic actuator device in this case. Figure 1AAs shown, the microfluidic actuator 110 is made by a micro-electromechanical process. The microfluidic actuator 110 includes a first substrate 1 provided with a first oxide layer 3, a second substrate 2, and a third substrate 4 provided with a second oxide layer 5, which are stacked in sequence. In this embodiment, the number of fluid inlets 11 on the first substrate 1 is 2, but it is not limited thereto. When the first substrate 1 and the second substrate 2 are combined, the second lower surface 23 of the second substrate 2 is connected to the first oxide layer 3 located on the first substrate 1. The position and number of the fluid flow channels 31 of the first oxide layer 3 correspond to the fluid inlet 11 of the first substrate 1. In the embodiment of this case, there are also 2 fluid flow channels 31, and one end of the two fluid flow channels 31 is connected to the two fluid inlets 11 respectively. The other ends of the two fluid flow channels 31 are connected to the confluence chamber 32, so that the fluid can enter through the two fluid inlets 11 respectively, and can pass through the corresponding fluid flow channels 31 and gather in the confluence chamber 32, and the through hole 21 of the second substrate 2 is connected to the confluence chamber 32 for fluid passage. When the third substrate 4 is bonded to the second substrate 2, the second oxide layer 5 is adjacent to the second upper surface 22 of the second substrate 2, and the fluid chamber 51 of the second oxide layer 5 is respectively communicated with the through hole 21 of the second substrate 2 and the fluid channel 41 of the third substrate 4, so that the fluid can enter the fluid chamber 51 through the through hole 21 and then be discharged from the fluid channel 41.

[0021] As mentioned above, the fluid channel 41 of the third substrate 4 divides the third substrate 4 into three parts, namely, the vibration part 44, the peripheral part 45 and the connecting part 46. The peripheral part 45 is arranged around the vibration part 44, the fluid channel 41 is formed between the peripheral part 45 and the vibration part 44, and the connecting part 46 is elastically connected between the vibration part 44 and the peripheral part 45. Among them, the area of ​​the vibration part 44 corresponds to the fluid chamber 51 of the second oxide layer 5. In addition, the microfluidic actuator 110 further sets a piezoelectric component 6 on the third substrate 4, and the piezoelectric component 6 is located in the area of ​​the vibration part 44, so that when the piezoelectric component 6 drives the vibration part 44 to vibrate and displace, the volume of the fluid chamber 51 can be compressed or expanded to make the fluid flow.

[0022] In addition, the peripheral area of ​​the through hole 21 of the second substrate 2 is a resonance portion 24, and the fixed portion 25 is located outside the resonance portion 24. The resonance portion 24 corresponds to the confluence chamber 32 of the first oxide layer 3 and the fluid chamber 51 of the second oxide layer 5, so that the resonance portion 24 can vibrate and displace between the confluence chamber 32 and the fluid chamber 51.

[0023] Please refer to the schematic diagram of the operation of the microfluidic actuator of the microfluidic actuator device in this case. Figures 1B to 1DWhen the lower electrode layer 61 and the upper electrode layer 64 of the piezoelectric component 6 receive the driving voltage and driving signal (not shown) transmitted from the outside, the lower electrode layer 61 and the upper electrode layer 64 transmit the received driving voltage and driving signal to the piezoelectric layer 62. At this time, after the piezoelectric layer 62 receives the driving voltage and driving signal, it begins to deform due to the influence of the piezoelectric effect, and the change amount and frequency of the deformation are controlled by the driving voltage and driving signal. When the piezoelectric layer 62 begins to deform due to the driving voltage and driving signal, it drives the vibration part 44 of the third substrate 4 to start displacement, and the piezoelectric component 6 drives the vibration part 44 to vibrate and displace in a first direction to increase the distance between the second oxide layer 5, wherein the first direction is the vibration direction of the vibration part 44 away from the second oxide layer 5. Thus, the volume of the fluid chamber 51 of the second oxide layer 5 is increased, so that negative pressure is formed in the fluid chamber 51 , so that the fluid outside the microfluidic actuator 110 can be sucked into it through the fluid inlet 11 and introduced into the confluence chamber 32 of the first oxide layer 3 .

[0024] Please continue reading Figure 1C When the vibration part 44 is displaced by the piezoelectric component 6, the resonance part 24 of the second substrate 2 will be displaced toward the first direction due to the resonance principle. When the resonance part 24 is displaced toward the first direction, the space of the fluid chamber 51 is compressed, and the gas in the fluid chamber 51 is pushed to move toward the fluid channel 41 of the third substrate 4, so that the fluid can be discharged through the fluid channel 41. At the same time, when the resonance part 24 is displaced toward the first direction and compresses the fluid chamber 51, the volume of the confluence chamber 32 is increased due to the displacement of the resonance part 24, so that a negative pressure is formed inside the confluence chamber 32, so that the fluid outside the microfluidic actuator 110 can be continuously sucked into it through the fluid inlet 11.

[0025] Finally, please refer to Figure 1D As shown, the piezoelectric component 6 drives the vibration part 44 of the third substrate 4 to vibrate and displace in a second direction, wherein the second direction is the vibration direction of the vibration part 44 toward the second oxide layer 5, and the first direction and the second direction are two opposite directions, whereby the resonance part 24 of the second substrate 2 is also driven by the vibration part 44 to displace in the second direction, and the fluid in the confluence chamber 32 is synchronously compressed to move toward the fluid chamber 51 through its through hole 21, and the fluid outside the microfluidic actuator 110 temporarily enters from the fluid inlet 11, and the fluid in the fluid chamber 51 is pushed into the fluid channel 41 of the third substrate 4, so that the fluid in the fluid channel 41 is discharged from the microfluidic actuator 110. The resonance part 24 of the second substrate 2 is also driven by the vibration part 44 to displace in the second direction, and the fluid in the confluence chamber 32 is synchronously compressed to move toward the fluid chamber 51 through its through hole 21. When the piezoelectric component 6 subsequently recovers and drives the vibration part 44 to move toward the first direction, the volume of the fluid chamber 51 will be greatly increased, and a higher suction force will be generated to suck the fluid into the fluid chamber 51 (eg Figure 1BRepeat this process. Figures 1B to 1D The operation action can continuously drive the vibration part 44 to vibrate and displace through the piezoelectric component 6, and synchronously link the resonance part 24 to vibrate and displace, so as to change the internal pressure of the microfluidic actuator 110, so that it can continuously absorb and discharge gas to complete the fluid transmission action of the microfluidic actuator 110.

[0026] See also Figure 2A In the first embodiment of the present case, the microfluidic actuator device 200A is composed of a carrier board 100, at least one microfluidic actuator 110, at least one microcontroller 120, at least one electrode pad A, at least one electrode pad B, at least one electrode pad C, at least one electrode pad D and at least one electrostatic protection circuit 140 (ESD, Electro Static Discharge).

[0027] It is worth noting that in the first embodiment of the present case, the microfluidic actuator 110 is disposed on the carrier plate 100 for conveying fluid, and the microfluidic actuator 110 is manufactured by a micro-electromechanical process, but is not limited thereto. In other embodiments, the manufacturing method of the microfluidic actuator 110 can also be adjusted according to design requirements (for example: semiconductor process, micro-electromechanical process, etc.).

[0028] It is worth noting that in the first embodiment of the present case, the microcontroller 120 is disposed on the carrier 100 to control the opening or closing of the microfluidic actuator 110, but the present invention is not limited thereto. In other embodiments, the microcontroller 120 is not disposed on the carrier 100, but is electrically connected to the carrier 100 to control the opening or closing of the microfluidic actuator 110, but the present invention is not limited thereto. In addition, in the first embodiment of the present case, the number of the microcontroller 120 is one, but the present invention is not limited thereto. In other embodiments of the present case, the number of the microcontroller 120 can be adjusted to two or more.

[0029] It is worth noting that in the first embodiment of the present case, the upper electrode layer 64 of the microfluidic actuator 110 is electrically connected to the electrode pad A on the carrier plate 100, and the lower electrode layer 61 of the microfluidic actuator 110 is electrically connected to the electrode pad B on the carrier plate 100; for the convenience of explanation, in the first embodiment of the present case, the microfluidic actuator 110 and the entirety electrically connected to the electrode pad A and the electrode pad B are defined as a microfluidic actuator element 130.

[0030] It is also worth noting that in the first embodiment of the present invention, the electrostatic protection circuit 140 is not disposed on the carrier board 100. Figure 2AAs shown, electrode pad A and electrode pad B are disposed on the carrier board 100, and the electrostatic protection circuit 140 is electrically connected to the electrode pad A and electrode pad B via a wire, but this is not limited to this. In other implementations, the location and quantity of the electrostatic protection circuit 140 can be adjusted according to design requirements.

[0031] See also Figure 2B In the second embodiment of the present case, the microfluidic actuator device 200B is composed of a carrier board 100, at least one microfluidic actuator 110, at least one microcontroller 120, at least one electrode pad C' and at least one electrode pad D' and at least one electrostatic protection circuit 140.

[0032] It is worth noting that in the second embodiment of the present case, the microfluidic actuator 110 is disposed on the carrier 100 to transport the fluid, and the microfluidic actuator 110 is manufactured by a micro-electromechanical process, but is not limited thereto. In other embodiments, the manufacturing method of the microfluidic actuator 110 can also be adjusted according to design requirements (for example: semiconductor process, micro-electromechanical process, etc.).

[0033] It is worth noting that in the second embodiment of the present case, the microcontroller 120 is disposed on the carrier board 100 to control the opening or closing of the microfluidic actuator 110, but the present invention is not limited thereto. In other embodiments, the microcontroller 120 is not disposed on the carrier board 100, but is electrically connected to the carrier board 100 to control the opening or closing of the microfluidic actuator 110, but the present invention is not limited thereto. In addition, in the second embodiment of the present case, the number of the microcontroller 120 is one, but the present invention is not limited thereto. In other embodiments of the present case, the number of the microcontroller 120 can be adjusted to two or more.

[0034] It is worth noting that in the second embodiment of the present case, the upper electrode layer 64 of the microfluidic actuator 110 is electrically connected to the electrostatic protection circuit 140 on the carrier board 100, and the electrostatic protection circuit 140 is further electrically connected to the electrode pad C'; the lower electrode layer 61 of the microfluidic actuator 110 is electrically connected to another electrostatic protection circuit 140 on the carrier board 100, and the other electrostatic protection circuit 140 is further electrically connected to the electrode pad D'; for the convenience of explanation, in the second embodiment of the present case, the upper electrode layer 64 and the lower electrode layer 61 of the microfluidic actuator 110 are respectively electrically connected to two groups of electrostatic protection circuits 140, and the two groups of electrostatic protection circuits 140 after electrical connection are then electrically connected to the electrode pad C' and the electrode pad D', respectively, and are defined as a microfluidic actuator element 150 together with the microfluidic actuator 110 as a whole.

[0035] It is also worth noting that in the second embodiment of the present case, the electrostatic protection circuit 140 is disposed on the carrier board 100, and is electrically connected to one of the electrode pads C' or the electrode pads D' on the carrier board 100, and is electrically connected to the microfluidic actuator 110, but this is not limited to this. In other embodiments, the location and quantity of the electrostatic protection circuit 140 can be adjusted according to design requirements.

[0036] See also Figure 3A , Figure 3A The first embodiment of the present invention shows a first aspect of the microcontroller 120. The microcontroller 120 of the microfluidic actuator device 300A is one and is disposed on the carrier 100. The microcontroller 120 is electrically connected to the carrier 100 to control the opening or closing of the plurality of microfluidic actuators 110. However, the present invention is not limited thereto. In other embodiments of the present invention, the number of the microcontroller 120 can be adjusted to two or more.

[0037] See also Figure 3B , Figure 3B The second embodiment of the microcontroller 120 of the first embodiment of the present invention is shown. The number of the microcontroller 120A and the microcontroller 120B of the microfluidic actuator device 300B is two, and they are respectively disposed at the upper end and the lower end of the carrier board 100, and are electrically connected to the carrier board 100 to control the opening or closing of the plurality of microfluidic actuators 110, but this is not limited to this. In other embodiments of the present invention, the positions of the microcontroller 120A and the microcontroller 120B can be adjusted according to design requirements.

[0038] See also Figure 3C , Figure 3C The third embodiment of the microcontroller 120 of the first embodiment of the present invention is shown. The number of microcontrollers 120A and 120B of the microfluidic actuator device 300C is two, and they are respectively disposed at the left and right ends of the carrier board 100, and are electrically connected to the carrier board 100 to control the opening or closing of the plurality of microfluidic actuators 110, but this is not limited to this. In other embodiments of the present invention, the positions of the microcontrollers 120A and 120B can be adjusted according to design requirements.

[0039] See also Figure 3D , Figure 3DThe fourth state of the microcontroller 120 of the first embodiment of the present invention is shown. The number of microcontrollers 120 of the microfluidic actuator device 300D is one, which is not disposed on the carrier board 100, but is electrically connected to the carrier board 100 to control the opening or closing of the plurality of microfluidic actuators 110, but is not limited thereto. In other embodiments of the present invention, the position of the microcontroller 120 can be adjusted according to design requirements. It is also worth noting that the above four different states of the microcontroller 120 can also be combined in the second embodiment.

[0040] See also Figure 4A , Figure 4A The first state of the electrostatic protection circuit 140 of the first embodiment of the present case is shown. The electrostatic protection circuit 140A includes a first potential V1, a first diode D1, a second diode D2 and a reference potential V0. The first potential V1 is provided by a system power supply (not shown), and the system power supply can be a DC power supply, a sine wave, a square wave, a sawtooth wave, a pulse wave, but is not limited to this. In other embodiments, the system power supply can also be changed according to design requirements. The cathode of the first diode D1 is electrically connected to the first potential V1. The cathode of the second diode D2 is electrically connected to the anode of the first diode D1. The reference potential V0 is provided by the system power supply, which is also the reference potential of the power supply system, and is electrically connected to the anode of the second diode D2.

[0041] See also Figure 4B , Figure 4BThe second state of the electrostatic protection circuit 140 of the first embodiment of the present case is shown. The electrostatic protection circuit 140B includes a second potential V2, a third diode D3, a fourth diode D4, a resistor R, a reference potential V0, a ​​third potential V3, a fifth diode D5 and a sixth diode D6. The second potential V2 is provided by a system power supply (not shown), and the system power supply can be a DC power supply, a sine wave, a square wave, a sawtooth wave, a pulse wave, but is not limited to this. In other embodiments, the system power supply can also be changed according to design requirements. The cathode of the third diode D3 is electrically connected to the second potential V2. The cathode of the fourth diode D4 is electrically connected to the anode of the third diode D3. The resistor R is between 25Ω and 5000Ω, and one end of the resistor R is electrically connected to the cathode of the fourth diode D4 and the anode of the third diode D3. The reference potential V0 is provided by the system power supply, which is also the reference potential of the power system, and is electrically connected to the anode of the fourth diode D4. The third potential V3 is provided by the system power supply, and the system power supply can be a DC power supply, a sine wave, a square wave, a sawtooth wave, a pulse wave, but is not limited thereto. In other embodiments, the system power supply can also be changed according to design requirements. The cathode of the fifth diode D5 is electrically connected to the third potential V3. The cathode of the sixth diode D6, the anode of the fifth diode D5 and the other end of the resistor R are electrically connected. Finally, the reference potential V0 is electrically connected to the anode of the sixth diode D6.

[0042] See also Figure 5A In the first embodiment of the present case, the microfluidic actuator device 400A is a schematic diagram of a first state of the electrostatic protection circuit 140. It is worth noting that the electrostatic protection circuit 140A is not arranged on the carrier board 100, but is electrically connected to the electrode pad A or the electrode pad B on the carrier board 100, but is not limited to this. In other embodiments of the present case, the electrode pad A of the microfluidic actuator element 130 may be connected to only one set of electrostatic protection circuits 140A, while the electrode pad B of the microfluidic actuator element 130 is not connected to the electrostatic protection circuit 140A; or, the electrode pad A of the microfluidic actuator element 130 is not connected to the electrostatic protection circuit, while the electrode pad B of the microfluidic actuator element 130 is connected to only one set of electrostatic protection circuits 140A; or, one of the electrode pads A or electrode pads B of multiple sets of microfluidic actuator elements 130 is connected to only one set of electrostatic protection circuits 140A; or, the electrode pads A of multiple sets of microfluidic actuator elements 130 and the electrode pads B of multiple sets of microfluidic actuator elements 130 are connected to only one set of electrostatic protection circuits 140A.

[0043] See also Figure 5BIn the first embodiment of the present case, the microfluidic actuator device 400B is a schematic diagram of the second state of the electrostatic protection circuit 140. It is worth noting that the electrostatic protection circuit 140B is not arranged on the carrier board 100, but is electrically connected to the electrode pad A or the electrode pad B on the carrier board 100, but is not limited to this. In other embodiments of the present case, the electrode pad A of the microfluidic actuator element 130 may be connected to only one set of electrostatic protection circuits 140B, while the electrode pad B of the microfluidic actuator element 130 is not connected to the electrostatic protection circuit 140B; or, the electrode pad A of the microfluidic actuator element 130 is not connected to the electrostatic protection circuit, while the electrode pad B of the microfluidic actuator element 130 is connected to only one set of electrostatic protection circuits 140B; or, the electrode pads A or electrode pads B of multiple sets of microfluidic actuator elements 130 are only connected to one set of electrostatic protection circuits 140B in common; or, the electrode pads A of multiple sets of microfluidic actuator elements 130 and the electrode pads B of multiple sets of microfluidic actuator elements 130 are only connected to one set of electrostatic protection circuits 140B in common.

[0044] See also Fig. 6A , the electrostatic protection circuit 140 of the microfluidic actuator element 150A in the second embodiment of the present case is presented as a first-state electrostatic protection circuit 140A. The microfluidic actuator element 150A includes a microfluidic actuator 110, two sets of electrostatic protection circuits 140A, electrode pads C' and electrode pads D'. It is worth noting that the first-state electrostatic protection circuit 140A in the second embodiment of the present case is the same as the first state of the electrostatic protection circuit 140 in the first embodiment, so it will not be described in detail. It is also worth noting that in the second embodiment of the present case, the microfluidic actuator 110, the two sets of electrostatic protection circuits 140A, and the electrode pads C' and the electrode pads D' are modularized into a microfluidic actuator element 150A, that is, a microfluidic actuator 110 with an electrostatic protection function.

[0045] When an abnormal voltage appears in the upper electrode layer 64 or the lower electrode layer 61 of the microfluidic actuator 110, the first diode D1 will be turned on to introduce the abnormal voltage into the power system, so that the microfluidic actuator 110 is not damaged by the surge voltage; and when the upper electrode layer 64 or the lower electrode layer 61 of the microfluidic actuator 110 appears lower than the power system voltage, the second diode D2 will be turned on to introduce the normal power reference voltage from the power system into the microfluidic actuator 110, so that the microfluidic actuator 110 is not damaged by the unstable voltage. In this way, the electrostatic protection circuit 140 can protect the microfluidic actuator 110 from being damaged by static electricity when it is operated at high frequency and high speed, and can also enable the microfluidic actuator 110 to operate under a stable working power supply. It is also worth noting that in other embodiments of the present case, the number of the first-state electrostatic protection circuit 140A of the electrostatic protection circuit 140 can be adjusted according to design requirements.

[0046] See also Figure 6B , the electrostatic protection circuit 140 of the microfluidic actuator element 150B of the second embodiment of the present case is presented as a second-state electrostatic protection circuit 140B. The microfluidic actuator element 150B includes a microfluidic actuator 110, two sets of electrostatic protection circuits 140B, electrode pads C' and electrode pads D'. It is worth noting that the second-state electrostatic protection circuit 140B in the second embodiment of the present case is the same as the second state of the electrostatic protection circuit 140 of the first embodiment, so it will not be described in detail. It is also worth noting that in the second embodiment of the present case, the microfluidic actuator 110, the two sets of electrostatic protection circuits 140B, and the electrode pads C' and the electrode pads D' are modularized into a microfluidic actuator element 150B, that is, it is a microfluidic actuator 110 with an electrostatic protection function.

[0047] When an abnormal voltage appears in the upper electrode layer 64 or the lower electrode layer 61 of the microfluidic actuator 110, the fifth diode D5 will be turned on to introduce the abnormal voltage into the power system, so that the microfluidic actuator 110 is not damaged by the surge voltage; and when the upper electrode layer 64 or the lower electrode layer 61 of the microfluidic actuator 110 appears lower than the power system voltage, the sixth diode D6 will be turned on to introduce the normal power reference voltage from the power system into the microfluidic actuator 110, so that the microfluidic actuator 110 is not damaged by the unstable voltage. Such an electrostatic protection circuit 140 can protect the microfluidic actuator 110 from damage caused by static electricity when it is operated at high frequency and high speed, and can also enable the microfluidic actuator 110 to operate under a stable working power supply. It is also worth noting that the number of the second state electrostatic protection circuit 140B of the electrostatic protection circuit 140 in other embodiments of the present case can be adjusted according to the requirements.

[0048] In addition, the second state electrostatic protection circuit 140B further has a resistor R, which is used to isolate internal static electricity from external static electricity. Among them, internal static electricity refers to the static electricity generated by the friction between the fluid and the microfluidic actuator 110 during fluid transportation when the microfluidic actuator 110 is actuated through high-speed and high-frequency actuation. In other words, the internal static electricity emphasizes the static electricity generated when the microfluidic actuator 110 is actuated. By setting the fifth diode D5 and the sixth diode D6, the influence of internal static electricity can be reduced. However, external static electricity refers to static electricity generated by charges accumulated by human touch or normal physical phenomena. In other words, external static electricity emphasizes the internal static electricity generated when the non-microfluidic actuator 110 is actuated. External static electricity can be derived from the external static electricity by the third diode D3 and the fourth diode D4. And a resistor R is used to isolate internal static electricity from external static electricity, so as to improve the damage caused by static electricity to the microfluidic actuator 110.

[0049] See also Fig. 7AIn the second embodiment of the present invention, the microfluidic actuator device 500A is a schematic diagram of a modular microfluidic actuator element 150A. It is worth noting that the microfluidic actuator element 150A adopts the first state of the electrostatic protection circuit 140 (e.g., Fig. 6A As shown in FIG. 1 , the electrostatic protection circuit 140A is disposed on the carrier 100 and is electrically connected to the electrode pad C' or the electrode pad D' on the carrier 100, and the microfluidic actuator 110 is also disposed on the same carrier 100. It is worth noting that the arrangement of the microfluidic actuator element 150A can be single, single row, single column, multiple, multiple rows, multiple columns, arrays, etc., but is not limited thereto. The arrangement of the microfluidic actuator element 150A can be changed according to design requirements. It is also worth noting that in other embodiments of the present case, the number of microcontrollers 120 can be adjusted to two or more.

[0050] See also Figure 7B In the second embodiment of the present case, the microfluidic actuator device 500B is a schematic diagram of a modular microfluidic actuator element 150B. It is worth noting that the microfluidic actuator element 150B adopts the second state of the electrostatic protection circuit 140 (e.g. Figure 6B As shown in FIG. 1 , the electrostatic protection circuit 140B is disposed on the carrier board 100 and is electrically connected to the electrode pad C' or the electrode pad D' on the carrier board 100, and the microfluidic actuator 110 is also disposed on the same carrier board 100. It is worth noting that the arrangement of the microfluidic actuator element 150B can be single, single row, single column, multiple, multiple rows, multiple columns, arrays, etc., but is not limited thereto. The arrangement of the microfluidic actuator element 150B can be changed according to design requirements. It is also worth noting that in other embodiments of the present case, the number of microcontrollers 120 can be adjusted to two or more.

[0051] This case provides a microfluidic actuator device that uses a micro-electromechanical semiconductor process and has an electrostatic protection circuit. The microfluidic actuator device achieves the purpose of fluid transportation through the control of a microcontroller, which has great industrial utilization value, and an application is filed in accordance with the law.

[0052] This case can be modified in various ways by those familiar with this technology, but all of them will not deviate from the scope of protection sought by the attached patent application.

[0053]

Explanation of symbols

[0054] 110: Microfluidic Actuators

[0055] 1: First substrate

[0056] 11: Fluid inlet

[0057] 2: Second substrate

[0058] 21: Perforation

[0059] 22: Second upper surface

[0060] 23: Second lower surface

[0061] 24: Resonance

[0062] 25: Fixed part

[0063] 3: The first oxide layer

[0064] 31: Fluid flow channel

[0065] 32: Confluence chamber

[0066] 4: The third substrate

[0067] 41: Fluid channel

[0068] 44: Vibration Department

[0069] 45: Peripheral part

[0070] 46: Connection

[0071] 5: Second oxide layer

[0072] 51: Fluid chamber

[0073] 6: Piezoelectric components

[0074] 61: Lower electrode layer

[0075] 62: Piezoelectric layer

[0076] 63: Insulation layer

[0077] 64: Upper electrode layer

[0078] 200A, 200B, 300A, 300B, 300C, 300D, 400A, 400B, 500A, 500B: Microfluidic actuator device

[0079] 100: Loading plate

[0080] 120, 120A, 120B: Microcontroller

[0081] 130, 150, 150A, 150B: Microfluidic actuator elements

[0082] 140, 140A, 140B: Electrostatic protection circuit

[0083] A, B, C, C', D, D': electrode pads

[0084] D1: The first diode

[0085] D2: Second diode

[0086] D3: The third diode

[0087] D4: The fourth diode

[0088] D5: The fifth diode

[0089] D6: The sixth diode

[0090] R: Resistance

[0091] V0: reference potential

[0092] V1: first potential

[0093] V2: Second potential

[0094] V3: The third potential

Claims

1. A microfluidic actuator device, characterized in that: Include: a load-bearing plate; At least one microfluidic actuator, disposed on the carrier plate, for conveying fluid; At least one electrode pad is disposed on the carrier plate and electrically connected to the microfluidic actuator; and At least one electrostatic protection circuit is electrically connected to the at least one electrode pad; Wherein, the electrostatic protection circuit comprises: a second potential provided by a power supply system; a third diode, a cathode of the third diode being electrically connected to the second potential; a fourth diode, a cathode of the fourth diode being electrically connected to an anode of the third diode; a resistor, one end of which is electrically connected to the cathode of the fourth diode and the anode of the third diode; a third potential provided by the power supply system; a fifth diode, a cathode of the fifth diode being electrically connected to the third potential; a sixth diode, a cathode of the sixth diode, an anode of the fifth diode and the other end of the resistor being electrically connected; and A reference potential is provided by the power system and is electrically connected to the anode of the fourth diode and the anode of the sixth diode.

2. The microfluidic actuator device according to claim 1, characterized in that The microfluidic actuator is manufactured by micro-electromechanical process. 3 . The microfluidic actuator device as claimed in claim 1 , further comprising at least one microcontroller, wherein the microcontroller is electrically connected to the carrier board to control the opening or closing of the microfluidic actuator.

4. The microfluidic actuator device according to claim 3, characterized in that: The microcontroller is arranged on the carrying board.

5. The microfluidic actuator device according to claim 3, characterized in that: The number of the microcontroller is one.

6. The microfluidic actuator device according to claim 3, characterized in that: The number of the microcontrollers is two or more.

7. The microfluidic actuator device according to claim 1, characterized in that: The electrostatic protection circuit is arranged on the carrying board.

8. The microfluidic actuator device according to claim 1, characterized in that: The electrostatic protection circuit is electrically connected to the at least one electrode pad on the carrier board.

Images