Antenna substrate and antenna module including the same

Abstract

An antenna substrate and an antenna module including the antenna substrate are provided. The antenna substrate includes: an antenna unit including a first pattern layer and a second pattern layer adjacent to each other and arranged at different heights, and a first insulating layer providing a first insulating region between the first and second pattern layers; and a feed unit including a third pattern layer and a fourth pattern layer adjacent to each other and arranged at different heights, and a second insulating layer providing a second insulating region between the third and fourth pattern layers. Each of the first and second pattern layers includes an antenna pattern, and each of the third and fourth pattern layers includes a feed pattern. The antenna unit is provided on the feed unit. The first insulating region is thicker than the second insulating region.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2019-0163278 filed on December 10, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The inventive concept relates to an antenna substrate and an antenna module including the antenna substrate. Background Art

[0003] With the application of millimeter wave bands in the field of mobile communications, the system for operating smartphones has changed. For example, a new antenna system capable of receiving high-frequency bands should be adopted, and an antenna module capable of covering the millimeter wave band is required as its component. In addition, high frequencies have strong linearity, but lack transparency and reflectivity in a manner different from short wavelengths according to the prior art. Therefore, they may be sensitive to losses and interference during signal transmission between an integrated circuit (IC) such as a radio frequency integrated circuit (RFIC) and an antenna. Summary of the Invention

[0004] An aspect of the present inventive concept is to provide an antenna substrate capable of improving antenna performance and an antenna module including the same.

[0005] Another aspect of the present inventive concept is to provide an antenna substrate that can achieve miniaturization and an antenna module including the same.

[0006] According to an aspect of the present disclosure, an antenna substrate including an antenna unit and a feeding unit is manufactured, and in this case, an insulation distance between pattern layers of the antenna unit is greater than an insulation distance between pattern layers of the feeding unit.

[0007] According to one aspect of the present inventive concept, an antenna substrate includes: an antenna unit including first and second pattern layers adjacent to each other and disposed at different heights, and a first insulating layer providing a first insulating region between the first and second pattern layers; and a feed unit including third and fourth pattern layers adjacent to each other and disposed at different heights, and a second insulating layer providing a second insulating region between the third and fourth pattern layers. Each of the first and second pattern layers includes an antenna pattern, and each of the third and fourth pattern layers includes a feed pattern. The antenna unit is disposed on the feed unit. The first insulating region is thicker than the second insulating region.

[0008] According to another aspect of the present invention, an antenna module includes an antenna substrate including an antenna unit and a feed unit, the antenna unit including first and second pattern layers adjacent to each other and disposed at different heights, and a first insulating layer providing a first insulating region between the first and second pattern layers; the feed unit including third and fourth pattern layers adjacent to each other and disposed at different heights, and a second insulating layer providing a second insulating region between the third and fourth pattern layers, the antenna unit being disposed on the feed unit; and an electronic component disposed on a side of the feed unit opposite to a side of the feed unit on which the antenna unit is disposed and connected to at least one of the third and fourth pattern layers. Each of the first and second pattern layers includes an antenna pattern, and each of the third and fourth pattern layers includes a feed pattern. The first insulating region is thicker than the second insulating region.

[0009] According to another aspect of the present invention, an antenna substrate includes: a plurality of first pattern layers, each including an antenna pattern; a plurality of first insulating layers, each separating two adjacent ones of the plurality of first pattern layers; a plurality of second pattern layers, each including a feed pattern; a plurality of second insulating layers, each separating two adjacent ones of the plurality of second pattern layers; and a third insulating layer, disposed between a bottommost one of the plurality of first pattern layers and an uppermost one of the plurality of second pattern layers. The plurality of first pattern layers and the plurality of first insulating layers are disposed on one side of the third insulating layer. The plurality of second pattern layers and the plurality of second insulating layers are disposed on the other side of the third insulating layer opposite to the one side. The thickness of each first insulating layer disposed between two adjacent ones of the plurality of first pattern layers is greater than the thickness of each second insulating layer disposed between two adjacent ones of the plurality of second pattern layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0011] Figure 1 is a block diagram schematically illustrating an example of an electronic device system;

[0012] Figure 2 is a schematic perspective view showing an example of an electronic device;

[0013] Figure 3 is a schematic cross-sectional view showing an example of an antenna module;

[0014] Figure 4is a schematic plan view of the antenna module as viewed from above;

[0015] Figure 5 is a schematic plan view of the antenna module as viewed from below;

[0016] Figure 6 Schematically shows Figure 3 Antenna bandwidth effect of the antenna module;

[0017] Figure 7 Schematically shows Figure 3 Antenna gain effect of the antenna module;

[0018] Figure 8 is a schematic cross-sectional view showing another example of the antenna substrate;

[0019] Figure 9 is a schematic cross-sectional view showing another example of the antenna substrate; and

[0020] Figure 10 is a schematic cross-sectional view showing another example of the antenna substrate. DETAILED DESCRIPTION

[0021] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0022] However, the present disclosure may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0023] Throughout this specification, it will be understood that when an element, such as a layer, region, or wafer (substrate), is referred to as being “on,” “connected to,” or “bonded to” another element, the element may be directly “on,” “connected to,” or “bonded to” another element, or there may be other elements intervening therebetween. In contrast, when an element is referred to as being “directly on,” “directly connected to,” or “directly bonded to” another element, there may be no intervening elements or layers. Throughout the text, like reference numerals refer to like elements. As used herein, the term “and / or” includes any one of the relevant listed items and all combinations of two or more items.

[0024] It will be apparent that although the terms first, second, and third, etc. may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions should not be limited by these terms. These terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Thus, a first member, component, region, layer, or portion discussed below may be referred to as a second member, component, region, layer, or portion without departing from the teachings of the exemplary embodiments.

[0025] For ease of description, spatial relational terms such as "above," "above," "below," and "below" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. It will be understood that the spatial relational terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as being "above" or "above" other elements or features would instead be oriented "below" or "below" the other elements or features. Thus, the term "above" may include both "above" and "below" orientations, depending on the particular orientation of the drawing. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relational descriptors used herein may be interpreted accordingly.

[0026] The terms used herein describe specific embodiments only, and the present disclosure is not limited thereto. As used herein, unless the context clearly indicates otherwise, the singular is intended to include the plural. It will be further understood that when the terms "comprise" and / or "include" are used in this specification, the terms "comprise" and / or "include" list the presence of the stated features, quantities, steps, operations, components, elements and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, steps, operations, components, elements and / or combinations thereof.

[0027] Hereinafter, embodiments of the present disclosure will be described with reference to schematic diagrams illustrating embodiments of the present disclosure. In the accompanying drawings, variations in the shapes shown are expected, for example, due to manufacturing techniques and / or tolerances. Therefore, the embodiments of the present disclosure should not be interpreted as being limited to the specific shapes of the regions shown herein, for example, to include variations in shape caused by manufacturing. The following embodiments may also be composed of one or a combination of these.

[0028] The contents of the present disclosure described below may have various configurations, and only required configurations may be proposed here, but are not limited thereto.

[0029] Figure 1 is a block diagram schematically illustrating an example of an electronic device system.

[0030] Reference Figure 1, the electronic device 1000 may house a motherboard 1010 therein. The motherboard 1010 may include chip-related components 1020, network-related components 1030, other components 1040, etc., which are physically or electrically connected thereto. These electronic components may be connected to other components to be described below via various signal lines 1090.

[0031] The chip-related components 1020 may include: memory chips such as volatile memory (e.g., dynamic random access memory (DRAM)), non-volatile memory (e.g., read-only memory (ROM)), flash memory, etc.; application processor chips such as central processing units (e.g., central processing units (CPUs)), graphics processors (e.g., graphics processing units (GPUs)), digital signal processors, cryptographic processors, microprocessors, microcontrollers, etc.; and logic chips such as analog-to-digital converters, application-specific integrated circuits (ASICs), etc. However, the chip-related components 1020 are not limited thereto and may include other types of chip-related electronic components. In addition, the chip-related components 1020 may be combined with each other. The chip-related components 1020 may have a package form including the above-mentioned chips or electronic components.

[0032] The network-related components 1030 may include components that implement protocols such as Wireless Fidelity (Wi-Fi) (Institute of Electrical and Electronics Engineers (IEEE) 802.11 family, etc.), Worldwide Interoperability for Microwave Access (WiMAX) (IEEE 802.16 family, etc.), IEEE 802.20, Long Term Evolution (LTE), Evolution-Data Optimized (EV-DO), High-Speed ​​Packet Access Plus (HSPA+), High-Speed ​​Downlink Packet Access Plus (HSDPA+), High-Speed ​​Uplink Packet Access Plus (HSUPA+), Enhanced Data GSM Environment (EDGE), Global System for Mobile Communications (GSM), Global Positioning System (GPS), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Bluetooth, 3G protocols, 4G protocols, and 5G protocols, as well as any other wireless protocols and wired protocols specified after the above protocols. However, the network-related components 1030 are not limited thereto, but may also include components that implement various other wireless standards or protocols or wired standards or protocols. Furthermore, the network-related components 1030 may be combined with each other along with the above-described chip-related electronic components 1020 .

[0033] Other components 1040 may include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, low-temperature co-fired ceramics (LTCC), electromagnetic interference (EMI) filters, multilayer ceramic capacitors (MLCC), etc. However, other components 1040 are not limited thereto, but may also include passive components in the form of chip components for various other purposes, etc. In addition, other components 1040 may be combined with the chip-related electronic components 1020 or the network-related electronic components 1030 described above.

[0034] Depending on the type of electronic device 1000, the electronic device 1000 includes other electronic components, which may or may not be physically or electrically connected to the mainboard 1010. As examples of other electronic components, a camera module 1050, an antenna module 1060, a display 1070, a battery 1080, and the like may be provided. However, the other electronic components are not limited thereto and may be an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a compact disc (CD), a digital versatile disk (DVD), and the like. In addition, other electronic components for various purposes may be included depending on the type of electronic device 1000.

[0035] The electronic device 1000 may be a smartphone, a personal digital assistant (PDA), a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet PC, a laptop PC, a netbook PC, a television, a video game console, a smart watch, an automotive component, etc. However, the electronic device 1000 is not limited thereto and may be any other electronic device capable of processing data.

[0036] Figure 2 is a schematic perspective view illustrating an example of an electronic device.

[0037] Reference Figure 2 , the electronic device may be, for example, a smart phone 1100. The antenna may be applied to the smart phone 1100 in the form of a substrate. In addition, in the smart phone 1100, a radio frequency integrated circuit (RFIC) may be mounted on the antenna substrate by itself, or may be mounted on the antenna substrate in the form of a semiconductor package so that the antenna module can be applied. In the smart phone 1100, the RFIC and the antenna are electrically connected, so that the radiation R' of the antenna signal can be feasible in all directions. The RFIC or the semiconductor package including the RFIC and the antenna module provided for the substrate including the antenna can be applied to an electronic device such as the smart phone 1100, and have various forms. On the other hand, the electronic device to which the antenna is applied is not limited to the smart phone 1100, and there may be other types of electronic devices as described above in addition to the smart phone 1100.

[0038] Figure 3 is a schematic cross-sectional view illustrating an example of an antenna module.

[0039] Figure 4 is a schematic plan view of the antenna module viewed from above.

[0040] Figure 5 is a schematic plan view of the antenna module viewed from below.

[0041] Reference Figure 3 、 Figure 4 and Figure 5 The antenna module 500 according to the embodiment includes an antenna substrate 100A and one or more electronic components 310, 320, and 330 disposed below a feed unit 130 of the antenna substrate 100A. The antenna substrate 100A includes a core 110, an antenna unit 120 disposed above the core 110, and a feed unit 130 disposed below the core 110. The core 110 includes a core layer 111, a core wiring layer 112 disposed on both surfaces of the core layer 111, and a via layer 115 that passes through the core layer 111 and connects the core wiring layer 112. The antenna unit 120 includes a plurality of insulating layers 121, a plurality of pattern layers 122, and a plurality of connection via layers 123. The feed unit 130 includes a plurality of insulating layers 131, a plurality of pattern layers 132, and a plurality of connection via layers 133. The antenna unit 120 includes one or more combinations of two pattern layers 122 disposed vertically adjacent to each other (each of the two pattern layers includes an antenna pattern 122A), and any one insulating layer 121 providing an insulating region between the adjacent pattern layers 122. The feed unit 130 includes one or more combinations of two pattern layers 132 disposed vertically adjacent to each other (each of the two pattern layers includes a feed pattern 132F), and any one insulating layer 131 providing an insulating region between the pattern layers 132. In this case, the thickness T1 of the insulating region of the antenna unit 120 is greater than the thickness T2 of the insulating region of the feed unit 130.

[0042] As described above, the antenna substrate 100A according to the embodiment allows the insulation distance between the pattern layers 122 of the antenna unit 120 to be relatively thicker, while also allowing the insulation distance between the pattern layers 132 of the feed unit 130 to be relatively thinner. Therefore, even when the overall thickness of the antenna substrate 100A and the antenna module 500 including the antenna substrate 100A does not change significantly, the insulation distance between the antenna patterns 122A can be increased. As a result, even under limited conditions, the performance of the antenna can be improved. For example, both the low-band and high-band bandwidths of the antenna can be increased, and both the gain of the antenna in the low-band and high-band can be increased.

[0043] In addition, the antenna applied to the antenna substrate 100A according to the embodiment may be a patch antenna. Alternatively, the antenna may be a combination of a patch antenna and a dipole antenna to improve signal transmission. In one example, as described above, as the performance of the antenna can be improved by adjusting the insulation distance, the patch antenna to be applied can be miniaturized. When the patch antenna is miniaturized, the width of the antenna substrate 100A including the patch antenna and / or the dipole antenna and the width of the antenna module 500 including the antenna substrate 100A can also be reduced. Therefore, antenna modules 500 of more diverse forms can be applied to electronic devices, and for example, the antenna module can be more easily mounted on the side surface of the electronic device. In one example, the patch antenna is introduced in the form of 1x4, but is not limited thereto, and the patch antenna can be introduced in another form such as 2x2 or 4x4.

[0044] In addition, the antenna substrate 100A according to the embodiment may have a vertically asymmetric shape based on the core 110. For example, the number of insulating layers 121 of the antenna unit 120 and the number of insulating layers 131 of the feed unit 130 may be equal to each other. In this case, the thickness of each insulating layer 121 of the antenna unit 120 may be greater than the thickness of each insulating layer 131 of the feed unit 130. Therefore, the thickness of the antenna unit 120 may be greater than the thickness of the feed unit 130. As described above, with a core-type PCB, in order to improve antenna characteristics, the insulation distance between the pattern layers 122 of the antenna unit 120 is relatively thick, while the insulation distance between the pattern layers 132 of the feed unit 130 is relatively thin. Therefore, a substrate having a vertically asymmetric shape may be provided.

[0045] In addition, in the antenna substrate 100A according to the embodiment, the core wiring layer 112 in the upper portion of the core 110 may include an antenna pattern 112A, and the core wiring layer 112 in the lower portion of the core may include a ground pattern 112G. The core wiring layer 112 in the lower portion may also include a feed pattern 112F formed in the hole region of the ground pattern 112G. In this case, the insulating layer 121 in the lowermost portion of the antenna element 120 may provide an insulating region between the pattern layer 122 in the lowermost portion of the antenna element 120 and the core wiring layer 112 in the upper portion of the core 110. Furthermore, the insulating layer 131 in the uppermost portion of the feed element 130 may provide an insulating region between the pattern layer 132 in the uppermost portion of the feed element 130 and the core wiring layer 112 in the lower portion of the core 110. In this case, the insulating region provided by the insulating layer 121 in the lowermost portion of the antenna element 120 may be thicker than the insulating region provided by the insulating layer 131 in the uppermost portion of the feed element 130. The antenna applied in the embodiment may further include the antenna pattern 112A and the ground pattern 112G included in the core wiring layer 112 of the core 110 , and due to such a difference between the insulation distances, the performance of the antenna may be more easily improved.

[0046] Hereinafter, an antenna substrate 100A and components of an antenna module 500 including the antenna substrate 100A according to an embodiment will be described in more detail with reference to the accompanying drawings.

[0047] For example, an insulating material can be used as the material of the core layer 111. In this case, the insulating material can be a thermosetting resin (such as an epoxy resin), a thermoplastic resin (such as a polyimide resin) or a material including a reinforcing material (such as glass fiber, glass cloth, glass fabric and / or an inorganic filler), for example, a copper-clad laminate (CCL) or a CCL without copper clad, etc. If necessary, the core layer 111 for improving bending control can be a metal plate or a glass plate, and can be a ceramic plate. In addition, in addition to being copper (Cu), the metal plate can also be an alloy comprising nickel (Ni) and iron (Fe), for example, a material such as Invar or Kovar. In addition, the material of the core layer 111 can be a liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE) or a derivative thereof. Among the above materials, the material of the core layer 111 can be a material with a low dielectric loss factor (Df). For the purpose of bending control, the core layer 111 may be thicker than each of the insulating layers 121 and 131, and the core layer 111 may have superior rigidity compared to each of the insulating layers 121 and 131. For example, the elastic modulus of the core layer 111 may be greater than the elastic modulus of each of the insulating layers 121 and 131.

[0048] The material of the core wiring layer 112 can be a metal material, and in this case, the metal material can be copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof. The core wiring layer 112 can be formed using a plating process (e.g., additive process (AP), semi-additive process (SAP), modified semi-additive process (MSAP), hole sealing (TT), etc.), and as a result, each core wiring layer can include a seed layer, an electroless plating layer, and an electroplated layer formed based on the seed layer. The core wiring layer 112 can perform various functions according to the design of the corresponding layer. For example, the core wiring layer may include an antenna pattern 112A, a ground pattern 112G, a power pattern, a signal pattern, etc. Here, the signal pattern may include patterns for various signals in addition to the antenna pattern 112A, the ground pattern 112G, and the power pattern, such as a feed pattern 112F. Each pattern in the core wiring layer 112 may include a line pattern, a plane pattern, and / or a pad pattern.

[0049] The material of the via layer 115 can also be a metal material, such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof. The via layer 115 can also be formed using a plating process such as AP, SAP, MSAP, TT, etc., and as a result, each via layer can include a seed layer, an electroless plating layer, and an electroplated layer formed based on the seed layer. The via layer 115 can perform various functions depending on its design. For example, the via layer can include via holes for antenna connection, via holes for signal connection, via holes for ground connection, via holes for power connection, etc. Here, the via holes for signal connection can include via holes for various signal connections in addition to the via holes for antenna connection, via holes for ground connection, and via holes for power connection, such as via holes for power feeding. The via hole can be completely filled with metal material, or the metal material can be formed along the wall of the via hole. Furthermore, the via hole may have various shapes, such as a cylindrical shape, an hourglass shape, and the like.

[0050] Insulating layers 121 and 131 may provide insulating regions for forming a multilayer pattern on both sides of core layer 111. The material of insulating layers 121 and 131 may be an insulating material. In this case, each insulating material may be a thermosetting resin (such as an epoxy resin), a thermoplastic resin (such as a polyimide resin), or a material including a reinforcing material (such as glass fiber and / or an inorganic filler having glass fiber), for example, a prepreg, ABF (Ajinomoto build-up film), etc. In addition, the material of insulating layers 121 and 131 may include at least one of liquid crystal polymer (LCP), polyimide (PI), cycloolefin polymer (COP), polyphenylene ether (PPE), polyetheretherketone (PEEK), and polytetrafluoroethylene (PTFE) or its derivatives. Among the above materials, each of insulating layers 121 and 131 may be a material having a low dielectric loss factor (Df). The materials of insulating layers 121 and 131 may be the same as or different from each other. The boundary between the respective insulating layers 121 and 131 adjacent to each other may be clear or unclear. As a non-limiting example, the dielectric constant (Dk) of each of the insulating layers 121 may be greater than the dielectric constant (Dk) of each of the insulating layers 131 .

[0051] The material of pattern layers 122 and 132 can also be a metal material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. Each of pattern layers 122 and 132 can also be formed using a plating process such as AP, SAP, MSAP, TT, etc., and as a result, each via layer can include a seed layer, an electroless plating layer, and an electroplated layer formed based on the seed layer. Pattern layers 122 and 132 can perform various functions depending on the design of their corresponding layers. For example, pattern layer 122 can include antenna pattern 122A, power pattern, signal pattern, etc., and pattern layer 132 can include ground pattern 132G, power pattern, signal pattern, etc. Here, the signal pattern may include patterns for various signals in addition to antenna pattern 122A, ground pattern 132G, and power pattern, such as feed pattern 132F. Each pattern in pattern layers 122 and 132 can include a line pattern, a plane pattern, and / or a pad pattern.

[0052] The material of the connection via layers 123 and 133 can also be a metal material, such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. Each of the connection via layers 123 and 133 can also be formed using a plating process such as AP, SAP, MSAP, TT, etc., and as a result, each connection via layer can include a seed layer, an electroless plating layer, and an electroplated layer formed based on the seed layer. The connection via layers 123 and 133 can perform various functions depending on their design. For example, the connection via layers can include connection vias for antenna connection, connection vias for signal connection, connection vias for ground connection, connection vias for power supply connection, etc. Here, the connection vias for signal connection can include connection vias for various signal connections in addition to the connection vias for antenna connection, connection vias for ground connection, and connection vias for power supply connection, such as connection vias for power supply. The connection vias can be completely filled with metal material, or the metal material can be formed along the walls of the vias. In addition, the connection via may have various shapes such as a tapered shape, etc.

[0053] The antenna pattern 122A of the antenna unit 120 may include a patch pattern 122A1. The antenna pattern 112A of the core 110 may also include a patch pattern 112A1. The patch patterns 112A1 and 122A1 may receive RF signals from the feed pattern 112F of the core 110 and the feed pattern 132F of the feed unit 130, transmit RF signals in the thickness direction (Z direction), and transmit RF signals received in the thickness direction to the feed pattern 112F of the core 110 and the feed pattern 132F of the feed unit 130. The patch patterns 112A1 and 122A1 may have a natural resonant frequency (e.g., 28 GHz, 39 GHz, etc.), which depends on inherent factors such as the shape, size, height, and dielectric constant of the insulating layer. For example, the patch patterns 122A1 and 112A1 can be electrically connected to the feeding pattern 112F of the core 110 and the feeding pattern 132F of the feeding unit 130 through a via hole for feeding the via hole layer 115 of the core 110, a connection via hole for feeding the connection via layer 133 of the feeding unit 130, etc., and thus the patch patterns 122A1 and 112A1 can transmit and receive horizontal polarity RF signals and vertical polarity RF signals polarized to each other.

[0054] Antenna pattern 122A of antenna unit 120 may include a first coupling pattern 122A2. For example, first coupling pattern 122A2 may be positioned above patch patterns 122A1 and 112A1 in the thickness direction. By electromagnetically coupling patch patterns 122A1 and 112A1 with first coupling pattern 122A2 and patch patterns 122A1 and 112A1, the antenna applied to antenna substrate 100A may have an additional resonant frequency adjacent to the natural resonant frequency described above, thereby resulting in a wider bandwidth. First coupling patterns 122A2 of antenna unit 120, which are adjacent to each other and disposed at different heights, may also be electromagnetically coupled to each other, and the antenna applied to antenna substrate 100A may have a wider bandwidth.

[0055] The antenna pattern 122A of the antenna unit 120 may further include a second coupling pattern 122A3. The second coupling pattern 122A3 of the antenna unit 120 may surround at least a portion of each of the patch pattern 122A1 and the first coupling pattern 122A2 of the antenna unit 120, and thus, as a result, the second coupling pattern 122A3 of the antenna unit 120 may be electromagnetically coupled with each of the patch pattern 122A1 and the first coupling pattern 122A2 of the antenna unit 120. The antenna pattern 112A of the core 110 may further include a coupling pattern 112A2. The coupling pattern 112A2 of the core 110 may surround at least a portion of the patch pattern 112A1 of the core 110, and thus, as a result, the coupling pattern 112A2 of the core 110 may be electromagnetically coupled with the patch pattern 112A1 of the core 110. The second coupling patterns 122A3 of the antenna unit 120, which are adjacent to each other and arranged at different heights, can be electromagnetically coupled to each other and to the coupling pattern 112A2 of the core 110. This coupling can provide balanced coupling. In this regard, the bandwidth of the antenna applied to the antenna substrate 100A can be wider than that of an antenna of the same size.

[0056] When the optimal connection point between patch patterns 122A1 and 112A1 and the connection via and / or via is located near the edge of each of patch patterns 122A1 and 112A1 in a first direction (e.g., 0 degrees), surface current flowing through patch patterns 122A1 and 112A1 can flow to each of patch patterns 122A1 and 112A1 in a third direction (e.g., 180 degrees) according to RF signal transmission and reception. In this case, the surface current can be distributed in a second direction (e.g., 90 degrees) and a fourth direction (e.g., 270 degrees), and second coupling pattern 122A3 and coupling pattern 112A2 can guide RF signals in the direction of the upper surface, which would otherwise leak to the side surfaces due to the distribution of the surface current in the second and fourth directions. Consequently, the radiation patterns of patch patterns 122A1 and 112A1 can be concentrated in the direction of the upper surface, thereby improving antenna performance. For example, the second coupling patterns 122A3 and the coupling patterns 112A2 may be repeatedly arranged, with each of the second coupling patterns 122A3 and the coupling patterns 112A2 having substantially the same shape. Thus, the plurality of second coupling patterns 122A3 and the plurality of coupling patterns 112A2 may have electromagnetic bandgap characteristics and may have a negative refractive index for RF signals in a specific frequency band. Consequently, the second coupling patterns 122A3 and the coupling patterns 112A2 may further guide the path of the RF signal of the patch patterns 122A1 and 112A1 in the thickness direction.

[0057] Each of second coupling pattern 122A3 and coupling pattern 112A2 can be electrically isolated from ground pattern 112G. In this regard, since more adaptive characteristics can be provided for RF signals having frequencies adjacent to the frequency bands of patch patterns 122A1 and 112A1, the bandwidth of the antenna used in antenna substrate 100A can be further broadened. Patch patterns 122A1 and 112A1, first coupling pattern 122A2, second coupling pattern 122A3, and coupling pattern 112A2 can be electrically isolated from one another. Therefore, since the equivalent capacitance and equivalent inductance of the antenna used in antenna substrate 100A can be distributed in a balanced manner, multiple resonant frequencies of the antenna used in antenna substrate 100A can be efficiently designed, and the bandwidth can be more easily broadened.

[0058] The core 110 may include a ground pattern 112G. The ground pattern 112G may provide a boundary condition for the antenna applied to the antenna substrate 100A. For example, it may reflect RF signals emitted from the antenna. As a result, the antenna may be more concentrated in the thickness direction, further improving the gain and / or directivity of the antenna. The ground pattern 112G may substantially block the antenna and the feed unit 130, thereby improving the electromagnetic isolation between the antenna and the feed unit 130. As a result, noise flowing during RF signal transmission between the antenna and the RFIC 330, which will be described later, may be reduced.

[0059] Feed unit 130 may include a feed pattern 132F. Feed pattern 132F may be disposed below ground pattern 112G. RF signals may flow through feed pattern 132F in the horizontal direction (x and / or y). Thus, multiple antennas may be effectively arranged above ground pattern 112G. Feed pattern 132F may be electrically connected to patch patterns 122A1 and 112A1.

[0060] The passivation layers 140 and 150 are additional components that can protect the internal structure of the antenna substrate 100A according to the embodiment from external physical and chemical damage. Each of the passivation layers 140 and 150 may include a thermosetting resin. For example, each of the passivation layers 140 and 150 may be ABF. However, it is not limited to this, and each of the passivation layers 140 and 150 may be a known solder resist (SR) layer. In addition, if necessary, PID may be included therein. In addition, if necessary, a high-rigidity material such as a prepreg may be used to improve warpage. The second passivation layer 150 may have a plurality of openings 150h, and the plurality of openings 150h may expose at least a portion of the pattern layer 132 in the lowermost portion from the second passivation layer 150. In addition, a surface treatment layer may be formed on the exposed surface of the pattern layer 132 in the lowermost portion. The surface finish layer can be formed using, for example, electroplating gold, electroless gold plating, organic solderability preservative (OSP), electroless tin, electroless silver, electroless nickel / displacement plating, direct immersion gold (DIG) plating, hot air solder leveling (HASL), etc. Each of the openings 150h can be composed of a plurality of vias. An under-bump metallurgy (UBM) can be provided on each opening 150h to improve reliability.

[0061] Each of the electronic components 310, 320, and 330 can be a known active component or a passive component. Each of the electronic components 310, 320, and 330 can be provided on the second passivation layer 150 below the feed unit 130 of the antenna substrate 100A in a surface mount type via an electrical connection metal (e.g., solder) formed on a plurality of openings 150h. Each of the electronic components 310, 320, and 330 can be electrically connected to each of at least a portion of the pattern layer 132 of the feed unit 130, and can also be electrically connected to each of at least a portion of the pattern layer 122 of the antenna unit 120 depending on the function. Each of the first electronic component 310 and the third electronic component 330 can be a semiconductor chip or a semiconductor package including a semiconductor chip. The semiconductor chip can be a power management integrated circuit (PMIC) 310 and / or a radio frequency integrated circuit (RFIC) 330, but is not necessarily limited thereto. The second electronic component 320 can be a passive component in chip form, such as a chip-form capacitor, a chip-form inductor, etc. The antenna module 500 according to the embodiment may be provided by the arrangement of electronic components 310, 320, and 330. The number of electronic components 310, 320, and 330 is not particularly limited, and the electronic components 310, 320, and 330 may also include other surface mount components in addition to the types of components described above.

[0062] If necessary, the connector 400 may also be provided below the feed unit 130 of the antenna substrate 100A. The antenna module 500 may be physically and / or electrically connected to other components in the electronic device via the connector 400. For example, the antenna module may be connected to a mainboard of the electronic device via the connector, but is not limited thereto.

[0063] Figure 6 Schematically shows Figure 3 The antenna bandwidth effect of the antenna module.

[0064] Figure 7 Schematically shows Figure 3 The antenna gain effect of the antenna module.

[0065] The accompanying drawings illustrate simulation results for the gain and antenna bandwidth of an antenna module 500 employing the structure of the antenna substrate 100A according to the embodiment described above. Furthermore, a comparative example illustrates simulation results for the gain and antenna bandwidth of an antenna module employing an antenna substrate 100A according to the embodiment, wherein the thicknesses of the insulating layer 121 of the antenna element 120 and the insulating layer 131 of the feed element 130 are equal. The thicknesses of the antenna modules according to the embodiment and the comparative example are equal, and the pattern designs and component types employed are also identical.

[0066] Referring to the accompanying drawings, compared to the structure according to the comparative example, in the structure according to the example, the bandwidth (BW) at the low frequency of approximately 27.5 GHz to approximately 28.35 GHz increased by approximately 6.6% from approximately 1.06 GHz to approximately 1.13 GHz. In addition, the bandwidth at the high frequency of approximately 37 GHz to 40 GHz increased from approximately 3.45 GHz to approximately 3.77 GHz. In this case, it can be seen that the bandwidth increased by approximately 9%. In addition, it can be seen that the gain at the low frequency increased by approximately 7% from approximately 3.75 dBi to approximately 4.02 dBi, while the gain at the high frequency increased by approximately 7% from approximately 4.59 dBi to approximately 4.91 dBi.

[0067] Figure 8 is a schematic cross-sectional view showing another example of the antenna substrate.

[0068] Reference Figure 8 In the antenna substrate 100B according to another embodiment, the thickness t1 of the core wiring layer 112 of the core portion 110 is greater than the thickness t2 of each pattern layer 122 of the antenna unit 120 and / or the thickness t3 of each pattern layer 132 of the feed unit 130. In this regard, the proportion of metal having excellent rigidity is increased, and thus a warpage improvement effect can be provided.

[0069] The antenna substrate 100B according to another embodiment is also applied to the antenna module 500 according to the embodiment.

[0070] The other descriptions are substantially the same as the above descriptions of the antenna substrate 100A and the antenna module 500 including the antenna substrate 100A according to the above embodiment, and thus detailed descriptions thereof will be omitted.

[0071] Figure 9 is a schematic cross-sectional view showing another example of the antenna substrate.

[0072] Reference Figure 9 According to another embodiment, an antenna substrate 100C is a rigid-flexible substrate having a rigid portion R and a flexible portion F. The flexible portion F refers to a region having superior bending properties (or greater flexibility) compared to the rigid portion R. The rigid portion R includes the core 110, antenna unit 120, feed unit 130, and passivation layers 140 and 150 described above. The flexible portion F extends from the feed unit 130 of the rigid portion R. Electronic components 310, 320, and 330 may be disposed on the rigid portion R.

[0073] The antenna unit 120 includes a plurality of relatively flexible first insulating layers 121a and a plurality of relatively rigid second insulating layers 121b. The feed unit 130 also includes a plurality of relatively flexible first insulating layers 131a and a plurality of relatively rigid second insulating layers 131b. Relatively flexible refers to a relatively more flexible property. Relatively rigid refers to a relatively greater rigidity. For example, each of the first insulating layers 121a and 131a may have an elastic modulus smaller than that of each of the second insulating layers 121b and 131b. Each of the first insulating layers 121a and 131a includes a flexible copper clad laminate (FCCL) material such as PI. The flexible portion F may include the first insulating layer 131a of the feed unit 130 and a pattern layer 132 formed on each of the first insulating layers 131, but is not limited thereto.

[0074] The antenna substrate 100C according to another embodiment is also applied to the antenna module 500 according to the embodiment.

[0075] The other descriptions are substantially the same as those of the antenna substrate 100A and the antenna module 500 including the antenna substrate 100A according to the above embodiment, and thus their detailed descriptions will be omitted. In addition, the characteristics of the antenna substrate 100B according to another embodiment may also be applied to the antenna substrate 100C according to another embodiment.

[0076] Figure 10 is a schematic cross-sectional view showing another example of the antenna substrate.

[0077] Reference Figure 10According to another embodiment, the antenna substrate 100D may be a coreless PCB. For example, the antenna unit 120 and the feed unit 130 may be in direct contact with each other. For example, the antenna unit 120 may further include an insulating layer 121 in the lowermost portion, which is in contact with the insulating layer 131 in the uppermost portion of the feed unit 130. The pattern layer 122 may be provided on both surfaces of the insulating layer 121 in the lowermost portion of the antenna unit 120. The pattern layer 122 provided on the upper surface of the insulating layer 121 in the lowermost portion of the antenna unit 120 may include an antenna pattern 122A, for example, a feed pattern 122A1. The pattern layer 122 provided on the lower surface of the insulating layer 121 in the lowermost portion of the antenna unit 120 may include a ground pattern 122G. The pattern layer 122 provided on the lower surface of the insulating layer 121 in the lowermost portion of the antenna unit 120 may also include a feed pattern 122F formed in the hole region of the ground pattern 122G. The thickness of the insulating region provided by the insulating layer 121 in the lowermost portion of the antenna unit 120 may be greater than the thickness of the insulating region provided by the insulating layer 131 in the uppermost portion of the feeding unit 130 .

[0078] The connection via layer 123 in the lowermost portion of the insulating layer 121 in the lowermost portion of the antenna unit 120 may be a metal bump layer or a metal paste layer. For example, each of the antenna unit 120 and the feed unit 130, except for the insulating layer 121 in the lowermost portion and the connection via layer 123 in the lowermost portion, is formed. Then, the insulating layer 121 in the lowermost portion and the connection via layer 123 in the lowermost portion are disposed between the antenna unit 120 and the feed unit 130, and the antenna substrate 100D according to another embodiment is manufactured using a batch lamination method. The boundaries between each of the metal bump layer or the metal paste layer and the plating layers of the pattern layers 122 and 132 are distinguishable.

[0079] The plurality of connection via layers 133 that respectively pass through the plurality of insulating layers 131 of the feed unit 130 may also be metal bump layers or metal paste layers. For example, the antenna unit 120 is formed without forming the insulating layer 121 in the lowermost portion and the connection via layer 123 in the lowermost portion. Then, the antenna substrate 100D according to another embodiment is manufactured using a batch lamination method for forming the antenna unit 120, the insulating layer 121 in the lowermost portion, the connection via layer 123 in the lowermost portion, and the feed unit 130. The boundaries between each of the metal bump layers or metal paste layers and the plating layers of the pattern layers 122 and 132 are distinguishable.

[0080] The antenna substrate 100D according to another embodiment is also applied to the antenna module 500 according to the embodiment.

[0081] The remaining description is substantially the same as that of the antenna substrate 100A and the antenna module 500 including the antenna substrate 100A according to the above embodiment, and thus a detailed description thereof will be omitted. Furthermore, the characteristics of each of the antenna substrates 100B and 100C according to another embodiment may also be applied, alone or in combination, to the antenna substrate 100D according to another embodiment.

[0082] As described above, according to example embodiments of the inventive concept, an antenna substrate capable of improving antenna performance and an antenna module including the antenna substrate are provided.

[0083] Furthermore, an antenna substrate capable of achieving miniaturization and an antenna module including the antenna substrate are provided.

[0084] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. An antenna substrate, comprising: an antenna unit comprising a first pattern layer and a second pattern layer disposed at different heights and a plurality of insulating layers including a first insulating layer providing a first insulating region between the first pattern layer and the second pattern layer; as well as The feeding unit includes a third pattern layer and a fourth pattern layer arranged at different heights and a second insulating layer providing a second insulating region between the third pattern layer and the fourth pattern layer. wherein each of the first pattern layer and the second pattern layer comprises an antenna pattern, Each of the third pattern layer and the fourth pattern layer includes a feed pattern, The antenna unit is arranged on the feeding unit, The first insulating region is thicker than the second insulating region, The first insulating layer is a single layer and contacts the first pattern layer and the second pattern layer, and The plurality of insulating layers of the antenna unit include a third insulating layer contacting the first insulating layer and one of the first pattern layer and the second pattern layer.

2. The antenna substrate according to claim 1, wherein The thickness of the antenna unit is greater than the thickness of the feeding unit.

3. The antenna substrate according to claim 1, further comprising: The core portion includes a core layer and a first core pattern layer and a second core pattern layer, wherein the first core pattern layer and the second core pattern layer are adjacent to each other, the core layer is interposed between the first core pattern layer and the second core pattern layer, and the first core pattern layer and the second core pattern layer are arranged at different heights. Wherein, the core is arranged between the antenna unit and the feeding unit.

4. The antenna substrate according to claim 3, wherein: The antenna unit further includes the third insulating layer providing a third insulating region between the first pattern layer and the first core pattern layer, The feed unit further includes a fourth insulating layer providing a fourth insulating region between the third pattern layer and the second core pattern layer. In the stacking direction of the feed unit, the core portion, and the antenna unit, the second pattern layer, the first pattern layer, the first core pattern layer, the second core pattern layer, the third pattern layer, and the fourth pattern layer are arranged in this order or in the reverse order and are arranged at different heights. The first core pattern layer includes an antenna pattern, The second core pattern layer includes a ground pattern, and The third insulating region is thicker than the fourth insulating region.

5. The antenna substrate according to claim 3, wherein The number of insulating layers included in the antenna unit is the same as the number of insulating layers included in the feeding unit. The antenna substrate according to claim 3 , wherein: At least one of the first core pattern layer and the second core pattern layer is thicker than at least one of the first pattern layer, the second pattern layer, the third pattern layer, and the fourth pattern layer.

7. The antenna substrate according to claim 1, wherein The antenna unit further includes a fifth pattern layer and a third insulating layer providing a third insulating region between the second pattern layer and the fifth pattern layer. The feed unit further includes a sixth pattern layer and a fourth insulating layer providing a fourth insulating region between the fourth pattern layer and the sixth pattern layer. In the stacking direction of the feeding unit and the antenna unit, the fifth pattern layer, the second pattern layer, the first pattern layer, the third pattern layer, the fourth pattern layer and the sixth pattern layer are arranged in this order or in the reverse order. The fifth pattern layer includes an antenna pattern, The sixth pattern layer includes a feeding pattern, The first insulating region is thicker than each of the second insulating region and the fourth insulating region, and The third insulating region is thicker than each of the second insulating region and the fourth insulating region.

8. The antenna substrate according to claim 7, wherein: The antenna substrate is a rigid-flexible substrate having a rigid portion and a flexible portion, the rigid portion including the antenna unit and the feeding unit, and the flexible portion extending from the feeding unit.

9. The antenna substrate according to claim 8, wherein: The elastic modulus of the first insulating layer is smaller than the elastic modulus of the third insulating layer, The elastic modulus of the second insulating layer is smaller than the elastic modulus of the fourth insulating layer, The flexible portion includes the second insulating layer and the third and fourth pattern layers.

10. The antenna substrate according to claim 1, wherein The antenna unit and the feeding unit are in direct contact with each other. The antenna substrate according to claim 10 , wherein: The antenna unit further includes fifth and sixth pattern layers and the third insulating layer providing a third insulating region between the fifth and sixth pattern layers. The feed unit further includes a fourth insulating layer providing a fourth insulating region between the third pattern layer and the sixth pattern layer. In the stacking direction of the feeding unit and the antenna unit, the second pattern layer, the first pattern layer, the fifth pattern layer, the sixth pattern layer, the third pattern layer and the fourth pattern layer are arranged in this order or in the reverse order. The fifth pattern layer includes an antenna pattern, The sixth pattern layer includes a ground pattern, The first insulating region is thicker than each of the second insulating region and the fourth insulating region, and The third insulating region is thicker than each of the second insulating region and the fourth insulating region.

12. The antenna substrate according to claim 11, wherein The antenna unit further includes a first connection via layer embedded in the third insulating layer and connecting the fifth pattern layer and the sixth pattern layer, and The first connection via layer is a metal bump layer or a metal paste layer.

13. The antenna substrate according to claim 12, wherein: The feed unit further includes a second connection via layer embedded in the fourth insulating layer and connecting the third pattern layer and the sixth pattern layer, and The second connection via layer is a metal bump layer or a metal paste layer.

14. An antenna module, comprising: An antenna substrate, comprising an antenna unit and a feeding unit, wherein the antenna unit comprises a first pattern layer and a second pattern layer arranged at different heights and a plurality of insulating layers including a first insulating layer providing a first insulating region between the first pattern layer and the second pattern layer; the feeding unit comprises a third pattern layer and a fourth pattern layer arranged at different heights and a second insulating layer providing a second insulating region between the third pattern layer and the fourth pattern layer; and the antenna unit is disposed on the feeding unit; as well as an electronic component provided on a side of the feed unit opposite to a side of the feed unit on which the antenna unit is provided, and connected to at least one of the third pattern layer and the fourth pattern layer, wherein each of the first pattern layer and the second pattern layer comprises an antenna pattern, Each of the third pattern layer and the fourth pattern layer includes a feed pattern, The first insulating region is thicker than the second insulating region, The first insulating layer is a single layer and contacts the first pattern layer and the second pattern layer, and The plurality of insulating layers include a third insulating layer contacting the first insulating layer and one of the first and second pattern layers.

15. The antenna module according to claim 14, wherein: The electronic components include at least one of a radio frequency integrated circuit, a power management integrated circuit, and a passive component.

16. An antenna substrate, comprising: a plurality of first insulating layers; a plurality of first pattern layers, each including an antenna pattern and disposed directly on or in a corresponding one of the plurality of first insulating layers; a plurality of second insulating layers; as well as a plurality of second pattern layers, each including a feed pattern and disposed directly on or in a corresponding one of the plurality of second insulating layers; wherein the thickness of each of the plurality of first insulating layers is greater than the thickness of each of the plurality of second insulating layers; and A first insulating layer among the plurality of first insulating layers is in direct contact with a second insulating layer among the plurality of second insulating layers.

17. The antenna substrate according to claim 16, wherein: The sum of the thicknesses of the plurality of first pattern layers and the plurality of first insulating layers is greater than the sum of the thicknesses of the plurality of second pattern layers and the plurality of second insulating layers.

18. The antenna substrate according to claim 16, wherein The thickness of the one of the plurality of first insulation layers that is in direct contact with the one of the plurality of second insulation layers is substantially the same as the thickness of another first insulation layer of the plurality of first insulation layers that is disposed between two adjacent ones of the plurality of first pattern layers.

19. The antenna substrate according to claim 16, wherein The thickness of the one of the plurality of first insulation layers that is in direct contact with the one of the plurality of second insulation layers is greater than the thickness of another first insulation layer of the plurality of first insulation layers that is disposed between two adjacent ones of the plurality of first pattern layers.

20. The antenna substrate according to claim 16, further comprising: The flexible portion extends from at least one of the plurality of second insulating layers and one of the plurality of second pattern layers.

Images