Overmolded electronic components for transaction cards and methods of making the same

Abstract

A method for manufacturing a transaction card, the method comprising: forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material around the electronic component. The transaction card includes the molded electronic component.

Description

[0001] This application is related to and claims the benefit of priority from U.S. non-provisional application No. 16 / 164,322, filed on October 18, 2018, entitled OVERMOLDED ELECTRONIC COMPONENTSFOR TRANSACTION CARDS AND METHODS OF MAKING THEREOF, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0002] The present invention relates to a transaction card having electronic components and a method for manufacturing the transaction card. Background Art

[0003] Metal payment cards face unique challenges when including electronic components such as inductively coupled payment modules, RF electronics, and separate electronic inlays. To accommodate these components, the metal is machined into various geometries, and then the components are placed in the cavity and exposed or hidden beneath a printed plastic sheet or other decorative element. The decorative element can be secured to the card by various methods such as platen lamination, contact adhesives, curable adhesives, or "push fit" or any joining method known in the art. RF shielding is often required in the cavity, which further complicates card assembly while maintaining the desired aesthetics of the card.

[0004] Some of these required machining geometries remove significant amounts of metal or leave slits or holes through the card, which weaken the card and are aesthetically undesirable. In order to strengthen the card and provide a desired surface, overmolding and insert molding techniques have been developed to encapsulate electronic inlays within the card and enhance the card geometry. In addition, such developments have improved RF performance over existing designs because such developments have enabled more metal to be removed in critical RF transmission and reception areas while maintaining structural rigidity and a desired appearance. Summary of the invention

[0005] Aspects of the present invention relate to transaction cards, methods for manufacturing transaction cards, and transaction cards produced according to the disclosed methods.

[0006] According to one aspect, the present invention provides a method for manufacturing a transaction card and a transaction card produced thereby. The method includes: forming an opening in a card body of the transaction card for receiving an electronic component; inserting the electronic component into the opening; and molding a molding material around the electronic component.

[0007] In another aspect, the present invention provides a transaction card. The transaction card includes a molded electronic component.

[0008] It is to be understood that both the foregoing general description and the following detailed description are exemplary and not restrictive descriptions of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present invention is best understood from the following detailed description when read in conjunction with the accompanying drawings, in which like elements have like reference numerals. When there are multiple similar elements, a single reference numeral may be assigned to the multiple similar elements, with lower case reference numerals referring to specific elements. When referring to elements collectively or to non-specific one or more elements, the lower case reference numerals may be deleted. This emphasizes that, according to convention, the various features of the drawings are not drawn to scale unless otherwise indicated. Instead, the sizes of the various features may be expanded or reduced for clarity. The following figures are included in the drawings:

[0010] Figure 1 is a flow chart of selected steps of a process for manufacturing a transaction card according to aspects of the present invention;

[0011] Figure 2A is a photograph depicting an electronic component prior to overmolding according to aspects of the present invention;

[0012] Figure 2B are photographs depicting an electronic component after overmolding according to aspects of the present invention;

[0013] Figure 3A is a schematic diagram of the front side of a transaction card prior to insert molding according to aspects of the present invention;

[0014] Figure 3B is a schematic diagram of the back side of a transaction card prior to insert molding according to aspects of the present invention;

[0015] Figure 3C is a schematic diagram of the front side of a transaction card after insert molding according to aspects of the present invention; and

[0016] Figure 3D is a schematic diagram of the back side of a transaction card after insert molding according to aspects of the present invention.

[0017] Figure 4A and Figure 4B is a schematic diagram of selected steps of an overmolding process for making a transaction card in accordance with aspects of the present invention.

[0018] Figure 5A is an image depicting the front side of an exemplary card having a packaged antenna surrounding a payment module.

[0019] Figure 5B It is a depiction Figure 5A An image of the back side of an exemplary card.

[0020] Figure 5C is a perspective view of an exemplary packaged antenna module isolated prior to inserting a payment module therein. DETAILED DESCRIPTION

[0021] Aspects of the present invention relate to transaction cards, methods for manufacturing transaction cards, and transaction cards produced according to the disclosed methods.

[0022] exist Figure 1 , a flow chart depicting selected steps of a method 100 for producing a transaction card according to aspects of the present invention is shown. It should be noted that with respect to the methods described herein, it will be understood from the description herein that one or more steps may be omitted and / or performed out of the order of the described process while still achieving the desired results.

[0023] In step 110, an opening is formed in a card body of a transaction card. The opening may be sized to receive one or more molded electronic components. The opening may extend partially through the card body (thereby forming, for example, a recess) or completely through the card body (thereby forming a hole). In some embodiments, the hole formed through the card body may then be completely or partially covered on one side, for example, with an applied material, such as an adhesively bonded plastic material, such as Figure 3D Element 307c shown in FIG. Figure 3D As depicted in , element 307c overlaps the area surrounding the hole to form a recess that is defined by the edge of the hole in the card body and by the applied material 307c at the bottom. The applied material can be the same or compatible with the molding material that will later be filled in the recess. In some embodiments, such as Figure 3D As shown, the applied material 307c overlapping the area surrounding the hole in the card body may have a through hole 308 that is smaller in area than the hole in the card body so as to provide a "flange" 309 of applied material inside the periphery of the hole in the card body.

[0024] The card body of the present invention can be made of any suitable material including any suitable metal, such as stainless steel, bronze, copper, titanium, tungsten carbide, nickel, palladium, silver, gold, platinum, aluminum or any alloy that provides the body (structure) and most of the weight of the card to the card. Additionally or alternatively, the card body described herein can be made of any suitable polymer (e.g., polycarbonate, polyester) or inorganic (e.g., glass, ceramic) material or any combination of any of the foregoing materials.

[0025] In step 120, the electronic component is inserted into the opening of the card body.

[0026] In step 130, a molding material is molded around the electronic component. It should be noted that the order of step 120 and step 130 may vary depending on the specific application.

[0027] In one embodiment, step 130 includes an overmolding process. During the overmolding process, a molding material is molded around (and typically over) the electronic component so that the molding material covers at least a portion of the surface of the electronic component. Overmolding of electronic components can be performed using conventional and commercially available equipment such as ENGLE Insert (Engel Austria GmbH, Australia) and Cavest MoldMan TM (Reno, NV) to complete.

[0028] shows the process before overmolding (in Figure 2A during) and after (in Figure 2B Although the overmolded component 200 is depicted as having the molded material 205 completely covering the electronic component 201, one of ordinary skill in the art will appreciate that varying degrees of overmolding may achieve the desired structural rigidity, functionality, and aesthetics of the transaction card. Specifically, Figure 2A and Figure 2B As shown, the electrical contacts connected to the component 200 in the form of wires 210 and 220 each have an unencapsulated end that protrudes from the overmold to allow electrical connection to the component. Figure 2A and Figure 2B , but the electrical contacts or other unpackaged portions not limited to the electrical contacts may take any shape or form. It should also be understood that in some embodiments, such as embodiments where the degree of coupling between the unpackaged components and the packaged components can be achieved by the packaging layer, the components may be fully packaged.

[0029] Back to Figure 1 In the case where an overmolding process is used, step 130 may be performed before step 120. That is, the electronic component may be overmolded separately before the electronic component is inserted into the opening of the card body. Before the overmolded electronic component is inserted, the overmolded component may also be machined to remove excess molding material and / or to create features in the molding material that can be used to secure the overmolded electronic component to the opening of the card body. For example, referring to Figure 2B , a lip may be machined into the molding material 205 so that the overmolded component 200 may be secured in the opening of the card body.

[0030] Alternatively, the overmolding in step 130 can be performed after performing step 120. In this embodiment, the electronic component is inserted into the opening of the card body. Subsequently, the molding material is forced to flow into the opening of the card body and formed above one or more exposed surfaces of the electronic component including at least the top surface. Those of ordinary skill in the art will understand that when the molding material flows into the opening of the card body, the card body material can be selected to withstand the pressure and heat associated with the overmolding without being substantially deformed.

[0031] In the case of an insert molding process, step 130 may be performed before performing step 120. A conventional insert molding process includes inserting an electronic component into a mold; and then injecting a molding material into the mold cavity to form a molded electronic component. After the insert molding process, the molded electronic component may be fully or partially encapsulated by the molding material.

[0032] Go to FIG. 3A to FIG. 3D , depicts a schematic diagram of selected steps of an insert molding process for manufacturing transaction cards according to aspects of the present invention. In the accompanying drawings, FIG. 3A to FIG. 3D Areas 305 and 308 in FIG. 3 represent holes through the card. Figure 3A Regions 307a, b and Figure 3B and Figure 3D Area 307c in FIG. 3 represents a partially covered hole (recess) in the card body for engaging and tightening the molding material. Figure 3B A completed molded card is depicted wherein the insert molded material of the molded component 310 is visible. Although the insert molded material is shown contrasting with the background card material for purposes of illustration, the molded component is not limited to any particular contrast in coloring or shading relative to the background card, and the molded component may include the same material as the front side of the card, or the molded component may include a material selected to have a coloring or shading selected to match the coloring or shading of the front side of the card to minimize visibility of the coloring or shading in the completed card. For example, in a card body that includes a material different from the molded material (e.g., a metal or ceramic body and a thermoplastic resin molded material), the coloring of the molded material may be selected to have a color and hue that matches the material of the body as closely as possible, including using the same or similar ingredients in the molded material as the card body material (e.g., including a powdered metal in the molded material that is the same metal as the body). In other embodiments, a molded material that contrasts with the body of the card may be used. Figure 3A The front side of the transaction card 300 is depicted including an opening 305 that extends completely through the card body 302. A plurality of securing features 307a, b provide areas to which the molding material may adhere or otherwise engage. In the depicted embodiment, the securing features 307a, b are blind holes (e.g., recesses). Figure 3B A similar set of securing components 307c is found on the opposite back side of the transaction card 300 in FIG. The geometry of the opening 305 and the securing components 307a, b, 307c are selected to improve the RF performance of the metal transaction card 300. The securing components 307a, b, 307c may comprise a material that is the same as or otherwise compatible with the molding material and different from the card body material such that the molding material and the material of the securing components are melted or otherwise connected together with an adhesive that is relatively stronger than any bond created between the molding material and the card body.

[0033] Figure 3C The front side of the transaction card 300 is depicted after the insert molded electronic component 310 has been placed in the opening 305. In the depicted embodiment, the molded electronic component 310 will be visible on the transaction card 300. The geometry of the molded electronic component 310 allows the molded electronic component 310 to be secured to the transaction card 300 by the biasing action created by the securing components 307a, b, 307c. Alternatively or additionally, the molded electronic component 310 can be adhered to the opening 305 of the transaction card 300 using epoxies such as bisphenol, novolac, aliphatic, and diglycidylamine.

[0034] Excess molding material may be removed from the molded electronic component 310 (eg, by milling or machining) to incorporate additional electronic components or other desired components.

[0035] Figure 4A An exemplary overmolding process is depicted in which a recess 403 is machined into the card body 402 for receiving an electronic component 405. In the depicted embodiment, the electronic component 405 is a printed circuit board (PCB), specifically an RFID module. Although the recess 403 is depicted as traversing a large portion of the back side of the card body 402, it will be appreciated by those of ordinary skill in the art that smaller openings of different geometries may be appropriate depending on the electronic component to be incorporated.

[0036] The recess 403 may be sized to receive and secure the electronic component 405 in place, or the recess 403 may be sized to allow for excess molding material between the inner lip of the recess 403 and the outer edge of the electronic component 405. The electronic component 405 may additionally or alternatively be adhered to the recess 403 using an epoxy as described above.

[0037] The overmolded panel 410 creates the back side of the transaction card 400. The overmolded panel 410 may fully or partially encapsulate the electronic components 405. The overmolded panel 410 may be prepared separately and then attached to the recess 403 (using, for example, a suitable epoxy as described above), or the panel 410 may be formed by overmolding a layer of molding material directly into the recess 403.

[0038] In an exemplary embodiment, the molding material used in the overmolded panel is a plastic material that can enhance RF transmissions where the transaction card 400 is constructed of metal or other RF interfering materials.

[0039] As is known in the art, a transaction card having an RFID chip module for inductively coupling with a card reader of a point of sale (POS) terminal typically also has an embedded enhanced antenna structure configured to inductively couple the embedded antenna to the RFID chip module, wherein the coupled antenna, RFID module and card reader form a circuit for transmitting information from the card to the card reader. Thus, in exemplary embodiments where the RFID module is a packaged or partially packaged component (or one of a plurality of electronic components processed as described herein), the antenna structure may be provided in any number of ways. In one embodiment, the antenna structure may be embedded in a layer applied to the card after the molding process described herein. The antenna orientation layer may be laminated to the card using a non-heating process (e.g., with an adhesive), a heat lamination process performed at a temperature, pressure and duration that will not re-melt, deform or otherwise adversely interfere with the molding over the electronic components, or a backing plate (comprising metal or some other material not affected by heat lamination) may be provided during such a heat lamination step to prevent any re-melting or deformation of the molding from protruding from the opposing surface while the lamination step is being performed.

[0040] In another embodiment, the molding step may include an overmolding step that covers not only the electronic components as described herein, but also at least the portion of the antenna structure that will be disposed therein later on the card surface. For example, an overflow overmolding step may be performed that, in addition to encapsulating or partially encapsulating the RFID module, may also cover at least one complete surface (usually the back side, but may also be the front side or replace the front side) of the card in a layer having a desired thickness. Then, the antenna may be embedded in the overmolding layer, for example, using ultrasonic treatment known in the art. Anything to be printed on the surface of the card may also be printed on the overmolding layer surface, or an additional printed layer may be attached, for example, via an adhesive or lamination. In other embodiments, the antenna may be printed on the molded surface, or applied as part of another layer attached, for example, with an adhesive or by lamination, above the molded surface. The foregoing is a non-limiting example, and it should be understood that there are infinite possibilities for downstream processing of the resulting product of the process described herein for providing molded electronic components in the card, and certain aspects of the present invention are not limited in any way to post-process steps.

[0041] In another embodiment, FIG. 5A to FIG. 5C As shown in FIG. 5 , the booster antenna 502 for inductively coupling with the antenna of the payment module may take the form of a ring-shaped metal frame that nearly surrounds the payment module (eg, a dual interface (DI) RFID chip). FIG. 5A to FIG. 5C , the antenna has a discontinuity or slot 506 extending from the inner edge of the loop antenna to the outer edge. Such antennas have been generally described and characterized as "amplifiers" in U.S. Patent No. 8,608,082 to Le Garrec et al. (the '082 patent) and as "coupling frames" in U.S. Patent No. 9,812,782 to Finn et al. (and others), which are incorporated herein by reference. As described in the aforementioned U.S. patent application Ser. No. 15 / 928,813, filed on Mar. 22, 2018, and entitled DI CAPACITIVE EMBEDDED METAL CARD, assigned to a common assignee of the present invention and incorporated herein by reference, the metal card body itself can be used as such an antenna or amplifier, wherein the slots (e.g., as Figure 5A and Figure 5B The slits (504) extend from the periphery of the card to the recess in which the payment module is mounted. The slits may have any geometric shape, including but not limited to Figure 5A and Figure 5B , any geometric shape described in the '813 application and related applications, or any geometric shape disclosed in the aforementioned references.

[0042] like Figure 5CAs shown, the metal antenna 502 is surrounded by the encapsulation material to form an outer enclosure 520 and an inner region 522, and the encapsulant also fills the slot 506 connecting the inner region to the outer enclosure. Figure 5C , depicts the following antenna, which has no packaging material covering it in the Z direction, so that the antenna remains visible in the depiction. In embodiments in which the metal body 500 of the card is also used for signal amplification, the packaging material can also fill the slit 504 in the metal body. However, it should be understood that the slit 504 may not be present in all embodiments. It should also be understood that the card body can have more than one slit. Exemplary alternative additional slit positions 554, 564, 574 are depicted in the form of dotted lines. For example, in one embodiment, the combination of slits 504 and 554 that intersect the chip recess can form a bisection along the entire length of the card, or the combination of slits 564 and 574 that intersect the chip recess can form a bisection along the entire width of the card together. It should be noted here that the term "bisection" is intended to mean that the line divides the card into two parts, but these parts are not necessarily equal in size. Although the combined slots are depicted as being generally centered on the antenna aligned with the same line on opposite sides of the antenna, the combined slots can have any relationship to the antenna and to each other relative to the combined slots, including: a relationship in which the slots on different sides of the antenna are located on parallel or non-parallel lines; a relationship in which the slots are adjacently connected without connecting to opposite sides of the antenna; a relationship in which the slots are non-parallel to the edge of the card; or a relationship in which one or both of the slots are non-linear. For embodiments in which the card is bisected, the remainder of the card can be joined together by overmolding or other non-conductive adhesives or fillers. Although preferred embodiments include only a single bisection of the card body into two discrete portions, multiple body slots can divide the card into more than two discrete portions. The bisection arrangement can generally minimize eddy currents.

[0043] Therefore, if Figure 5CThe antenna 502 depicted as being encapsulated defines a metal-containing plug 550 that can be manufactured in one piece and then inserted into an opening in the card body, or the plug can be manufactured in situ in the opening in the card body, for example, by overmolding. After the plug is inserted into the recess or molded in situ, a recess can be created in the inner area 522 of the plug (e.g., by milling or any method known in the art) to receive the payment module. One of the advantages of such a design is that the metal card body can be formed with a through hole for receiving the plug 550. Preferably, the through hole can be formed by methods other than milling, such as stamping, etching, laser cutting, etc. Alternatively, the card body may be initially formed with a through hole, which may be particularly advantageous for a card body of ceramic, cast metal, or metal-doped epoxy resin (e.g., as described in U.S. Provisional Application Serial No. 67 / 730,282, filed on September 12, 2018, entitled METAL-DOPED EPOXY RESIN TRANSACTION CARD AND PROCESS FOR MANUFACTURE, assigned to the common assignee of the present invention and incorporated herein by reference). Then, only the milling step for making the recess for receiving the payment module needs to be performed in the non-metallic encapsulating material, which is easier and takes less time for milling than in metal. As is known in the art, the recess for receiving the payment module may be a stepped hole having a first relatively larger area on the front surface of the card and a second relatively smaller area on the back surface of the card. By enlarging the area of ​​the recess into which the payment module is inserted into the card body, the total length of the slit 504 that must be cut into the metal card body (in embodiments where the slit exists) can be minimized, also saving manufacturing time. The aforementioned improvements promote increased output and efficiency.

[0044] In some embodiments, it may not be necessary or desirable for the card body to be used as part of the enhanced antenna. In such embodiments, the opening in the card body may be relatively larger than, for example, FIG. 5A to FIG. 5C As depicted in , the outer surround 520 has a width W that separates the metal of the antenna 502 in the plug 550 from the card body, which is operable to acceptably minimize electrical / magnetic interference from the card body. In such an embodiment, the geometry of the plug 550 can be more rectangular, with the innermost edge 560 of the plug located closer to the center of the card body 500 to direct some of the RF signal toward the center of the card, while the location of the DI payment module remains substantially unchanged as depicted to comply with relevant standards for the location of the contact.

[0045] Although described herein in conjunction with a metal card body, similar geometries may be employed in non-metallic cards. In addition to the methods described herein for the manufacture of a card body of any material (although particularly advantageous for metal, ceramic, and ceramic-coated metal bodies), the antenna 502 may be deployed in a plastic (e.g., PVC) card body, for example, by ultrasonically (or otherwise) embedding a metal component into the plastic as an inlay within the card, thereby replacing a copper conductor or etched antenna inlay. The antenna geometry 502 as depicted may be described as a flat annular member having an almost closed periphery, wherein a slit 506 connects the inner periphery of the annulus to the outer periphery. Although depicted as a single member in an exemplary embodiment, the antenna structure is not limited thereto and may include more than one member. In contrast, a copper conductor or etched antenna inlay typically produces a spiral pattern of wires or conductors having spaces that radially separate the spiral threads.

[0046] One of ordinary skill in the art will appreciate that suitable molding materials will depend on the type of molding process used in step 130. For example, where insert or overmolding is employed, a molding material such as Thermoplastic materials of fusible adhesives (Henkel) and thermosetting materials such as glass fiber reinforced polyester, polyurethane, phenolic plastics, duroplasts, melamine, diallyl phthalate and polyimide, the thermoplastic materials may include: one or more of the group including: EVA, metallocene polyalphaolefins, polyolefins including random polyalphaolefins, block copolymers, polyurethane hot melts and polyamides. Those skilled in the art will understand that other materials that can become flowable during the overmolding process or the insert molding process may also be used, these other materials include but are not limited to powdered metals such as rhodium, aluminum, titanium, magnesium, copper, brass, nickel, monel, Inconel, steel and alloys thereof.

[0047] In another embodiment, the molding material used in the overmolding process or the insert molding process is a plastic material having a molding temperature range of about 150°C to 300°C.

[0048] Although the invention is shown and described herein with reference to particular embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.

Claims

1. A method for manufacturing a transaction card, comprising the steps of: (a) forming an opening in a card body of the transaction card; (b) molding a molding material around the electronic component; and (c) inserting and fixing the electronic component into the opening in the card body; in, The electronic component includes an antenna configured to be coupled to a payment module, the antenna comprising a planar metallic ring-shaped member.

2. The method according to claim 1, wherein: The ring-shaped member has an antenna interruption portion connecting an inner region defined by the ring-shaped member to an outer region surrounding the ring-shaped member.

3. The method according to claim 2, wherein: The molding step places a molding material in the antenna interruption, the inner region, and the outer region.

4. The method according to claim 1, wherein: The molding step includes: inserting the electronic component into the opening; and then filling the opening with the molding material.

5. The method according to claim 1, wherein: The molding step includes: placing the electronic component in a mold; and injecting the molding material into the mold, and then inserting and fixing the molded electronic component into the opening of the card body.

6. The method according to any one of claims 1 to 5, wherein: Step (a) includes forming one or more fixing features in the card body to fix the molding material to the card body.

7. The method according to claim 6, wherein: The one or more fixing parts include: at least a first fixing part, which is a blind hole recess only opening to the first side of the card body; and at least a second fixing part, which is a blind hole recess only opening to the second side of the card body.

8. The method according to any one of claims 1 to 5, wherein: The opening extends completely through the card body.

9. The method according to any one of claims 1 to 5, wherein: The opening extends only partially through the card body.

10. The method according to any one of claims 1 to 5, wherein: The molding material is one or more of: EVA, metallocene polyalphaolefin, polyolefin including random polyalphaolefin, block copolymer, polyurethane hot melt, polyamide, glass fiber reinforced polyester, polyurethane, phenolic plastic, duroplast, melamine, diallyl phthalate and polyimide.

11. The method according to claim 10, wherein: The molding material is plastic having a molding temperature range of 150°C to 300°C.

12. The method according to any one of claims 1 to 5, further comprising: After the molding step, a step of removing excess molding material from the molded electronic component is performed.

13. The method according to claim 3, further comprising: After the antenna is arranged in the card body, an opening is made in the molding material of the inner area defined by the annular member, and the payment module is fixed in the opening.

14. The method according to claim 13, further comprising: At least one body interruption is made from the outer periphery of the card body to the opening in the card body.

15. The method according to claim 14, wherein: The at least one body interruption extends parallel to the outer periphery of the card body.

16. The method according to claim 14, wherein: Producing the at least one body interruption includes producing at least two body interruptions, wherein the at least two body interruptions and the opening together bisect the card body into at least two discrete portions.

17. The method according to claim 16, wherein: Producing the at least one body interruption includes producing at least two body interruptions, wherein one of the at least two body interruptions extends along a first path and another of the at least two body interruptions extends along a second path.

18. The method according to claim 17, wherein: The first path and the second path extend along a side of the antenna.

19. The method according to claim 17, wherein: The first path extends along one side of the antenna; and the second path extends along an opposite side of the antenna.

20. The method according to any one of claims 17 to 19, wherein: The first path is parallel with respect to the second path.

21. The method according to any one of claims 17 to 19, wherein: The first path is non-parallel relative to the second path.

22. The method according to any one of claims 14 to 19, wherein: The at least one body interruption has a non-linear geometry.

23. The method according to any one of claims 1 to 5 and 13 to 19, wherein The molding material includes a resin containing a powdered metal.

24. The method according to claim 23, wherein: The powdered metal is selected from the group consisting of rhodium, aluminum, titanium, magnesium, copper, brass, nickel, monel, Inconel, steel, alloys of the foregoing, and combinations of the foregoing.

25. The method according to claim 24, wherein: The card body includes metal, and the method further includes selecting the powdered metal contained in the resin to provide a color and hue of the molding material to match a color and hue of the card body.

26. The method according to claim 25, wherein: The powdered metal contained in the resin and the metal of the card body include the same type of metal or an alloy thereof.

27. The method according to any one of claims 1 to 5 and 13 to 19, wherein The card body has a material of a different configuration than the molded material, and the method further includes customizing a coloration of the molded material to match a coloration of the card body.

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