Device and method for producing a layer on an optoelectronic lighting device from a material provided in a flowable state

Abstract

The present invention relates to a device for producing a layer on an optoelectronic light-emitting device from a material provided in a flowable state, the device comprising a limiting means, in particular a plate-shaped limiting means, and a holding means, the holding means being used to hold the limiting means at a specific distance above the light-emitting device in order to construct the layer between the limiting means and the light-emitting device.

Description

Technical Field

[0001] This patent application claims the priority of German application DE 10 2018 122 572.5, the disclosure content of which is hereby incorporated by reference.

[0002] The invention relates to a device and a method for producing a layer on an optoelectronic lighting device from a material provided in a flowable state. Background Art

[0003] For an optoelectronic lighting device, provision can be made, in particular for forming a layer, to apply a material provided in a flowable state to at least one specific region of a surface of the optoelectronic lighting device. Summary of the invention

[0004] It is therefore an object of the present invention to provide a possibility with which a layer consisting of a material provided in a flowable state can be formed in a simple manner on the surface of an optoelectronic lighting device.

[0005] This object is achieved by a device having the features according to the invention. Preferred embodiments and developments of the invention are described in the preferred exemplary embodiment.

[0006] A device according to the invention for producing a layer on an optoelectronic light-emitting device from a material provided in a flowable state comprises a limiting means, in particular a plate-shaped limiting means, and a holding means, which is used to hold the limiting means at a specific distance above the light-emitting device in order to construct the layer between the limiting means and the light-emitting device.

[0007] The layer to be produced can be formed in the spatial region between the surface of the light-emitting device and the limiting means arranged thereon from a flowable material, such as silicone or epoxy resin, which is introduced into the spatial region from above. The limiting means can be removed again after the material has hardened. It is also possible to cure using the limiting means, for example, for dimensional stabilization. The age hardening can be carried out without any limiting means.

[0008] Since the limiting means can be arranged at a fixed distance from the surface of the light-emitting device, a precisely defined layer thickness is at least partially produced. As will be explained below, a structure on the upper side of the layer can also be realized. The limiting means is preferably designed in the form of a plate. It can be regarded as a kind of upper base plate, on the underside of which, for example, limiting elements can also be arranged, which form walls and can serve as lateral limits for the layer to be formed.

[0009] The point-by-point contact between the limiting means and the lighting device or the upper side of the support can also be achieved by means of a holding means.

[0010] As mentioned, the formed layer can have a defined height or thickness at least in one region, which corresponds to the distance of the limiting means relative to the surface of the light-emitting device when the device is arranged on the light-emitting device in accordance with regulations for the production of the layer. Thus, for example, a specific pouring height for the originally flowable material can be achieved with the aid of the device according to the invention. By means of the device according to the invention, in particular, a layer on the optoelectronic semiconductor component of the light-emitting device can be achieved, which layer has a specific thickness or has a specific structure on its upper side. Such a layer can actively influence the emission characteristics of the semiconductor component, for example with respect to the color coordinate distribution. If the layer is formed, for example, by the emission surface of the optoelectronic semiconductor component, its height can be determined quite accurately. Thus, for example, a relatively narrow color coordinate distribution can be ensured when manufacturing white LEDs.

[0011] The delimiting means can have at least one opening which passes through from its upper side to its lower side and which serves in particular to introduce material into the spatial region between the delimiting means and the lighting device.

[0012] The holding device can have at least one spacer. Preferably, the spacer is arranged on the limiting device and / or the end of the spacer facing away from the limiting device can be in contact with the lighting device.

[0013] The lower side of the limiting means facing the lighting device can have a structuring at least in the region of its lower side when the limiting means is arranged at a distance above the lighting device, the structuring being particularly used to construct a structure complementary to the structuring on the upper side of the layer of flowable material.

[0014] The lower side and / or another surface side of the limiting means can have an anti-adhesion coating. Thus, the limiting means can be removed relatively easily.

[0015] If the limiting means is arranged at a distance above the light-emitting device, the region of the bottom side is preferably located above the light-emitting region of the optoelectronic semiconductor component and the structuring is also designed such that an optical element can be formed in a layer above the light-emitting region. The optical element can be a lens.

[0016] When the limiting means is arranged above the light-emitting device at a prescribed spacing, the lower side of the limiting means facing the light-emitting device can have a first region having a first spacing relative to the upper side of the light-emitting device and at least one second region having a second spacing relative to the upper side of the light-emitting device, the second spacing being different from the first spacing. As a result, layers can be formed from the flowable material, which layers have different heights in different regions. This is advantageous, for example, if potting layers of different thicknesses are to be constructed on adjacent optoelectronic semiconductor components, such as LEDs. As a result, for example, different conversion degrees or color coordinates can be achieved with a converter volume potting (Konverter-Volumenverguss). For example, adjacent LEDs can be coated with grout so that "cold" white light is emitted on one LED and "warm" white light is emitted on another LED.

[0017] In a variant, deposition can be performed after the volumetric casting. The deposition can occur naturally or, for example, in a centrifuge. Due to the different initial filling levels on the chip, different thicknesses of the deposited phosphorus layer also occur. By means of a subsequent grinding process in silicone as a debonding component on the deposited phosphorus, a uniform component thickness can be achieved on the substrate. Other materials, such as epoxy resins, can also be used as debonding components.

[0018] It can be provided that the flowable material does not cover a first region of the light-emitting device, in particular a first region of the upper side of the support of the light-emitting device, and covers a second region of the light-emitting device adjoining the first region. The limiting means can be dimensioned in such a way that it at least substantially covers at least the second region. The entire second region can thus be provided with layers, which can have a defined height or can have different defined heights in different regions and / or can have a defined structure in the region of its upper side.

[0019] The device can have a limiting element with a lower side and at least one lateral surface, wherein, in particular to protect the first area from flowable material, the limiting element is constructed and can be temporarily arranged on the lighting device, in particular on the upper side of the support, so that the lower side of the limiting element is in contact with the first area and the lateral surface and / or the edge between the lower side and the lateral surface separates the first area from the second area.

[0020] The device according to the invention can thus also have a limiting element, which can be placed with a lower side on the surface of the light-emitting device, in particular the upper side of the support. The lower side can be placed on the surface and the size of the limiting device can be designed in such a way that the lateral surface and / or the edge separates the first area from the second area. The flowable material can then be applied to the second area, wherein the limiting device prevents: for example, due to the so-called "bleeding" effect, the flowable material from reaching the first area from the second area and thus wetting the first area unintentionally. After the material has hardened, the limiting device can be removed. The limiting device can thus be used as a kind of dam, which protects the first area of ​​the surface of the light-emitting device from the material. However, the "dam" is only temporarily provided, because the limiting device is to be removed after hardening.

[0021] The limiting element is arranged or can be arranged on the limiting means, in particular on its underside. The limiting element can in particular be fixedly connected to the limiting means.

[0022] The edge can have a course that corresponds at least approximately to the boundary between the first region and the second region. As a result, the first region can be separated relatively precisely from the second region and, in particular, even slight wetting of the first region can be avoided.

[0023] The lateral surfaces of the limiting element are preferably closed along a peripheral direction extending in particular parallel to the lower side. Thus, the lateral surfaces can form a closed partition that is continuous all around.

[0024] The lower side and / or edge of the limiting element can contact the luminous device, especially the upper side of its support, over its entire length. Thus, it is possible to prevent material from flowing from the second area to the first area along the entire boundary between the first area and the second area.

[0025] The underside and / or the edge and / or the lateral surface of the delimiting element can have a coating, in particular in order to prevent or limit a flow of material along the delimiting element itself.

[0026] The lateral surface can have a stop mechanism. The stop mechanism on the lateral surface can define a maximum filling height for the material.

[0027] The limiting element can be formed at least partially from a deformable and / or elastic material. The limiting element can thus be pressed onto the surface of the light-emitting device in an improved manner. In this way, an improved sealing effect is produced between the two areas on the surface of the light-emitting device or on the upper side of the support.

[0028] The lateral surface of the limiting element can extend in a straight line at an angle of at least about 90 degrees relative to the lower side or extend upward and outward away from the lower side. The lateral surface can also extend upward and outward in a curved manner, in particular concavely or convexly. When viewed in a plane perpendicular to the lower side, the limiting element can have a rectangular, square or triangular cross-section. Other cross-sectional shapes are also possible. The edge between the lower side and the lateral surface can be constructed as a rounded structure. The shape and direction of the lateral surface are reflected in the shape and direction of the side of the layer formed by the flowable material, which is constructed on the lateral surface.

[0029] The limiting element can be designed in the form of a frame-like structure which surrounds the inner region, wherein the inner region is preferably dimensioned such that at least one optoelectronic semiconductor component, in particular an LED chip, can be accommodated therein, wherein the lateral surface is preferably also a surface side of the frame-like structure which faces toward the inner region or faces away from the inner region. The limiting device thus allows a layer to be formed around the semiconductor component from the originally flowable material. Depending on the size of the limiting device, the layer can be spaced apart from the semiconductor component or can adjoin it flushly.

[0030] The limiting element can be designed in particular in the form of a punch, the bottom side of which has at least approximately the size and / or shape of the first area. As a result, the first area on the surface of the lighting device can be covered with the limiting element, so that the surroundings of the covered first area can be covered with the flowable material without wetting the first area.

[0031] Components that are temporarily used, such as, in particular, limiting elements or limiting means, can have a poorly adhesive surface or an anti-adhesive coating. Subsequent demoulding can thereby be facilitated.

[0032] The invention also relates to a method for producing at least one layer on an optoelectronic light-emitting device, the method comprising the following steps:

[0033] Providing a support, on the upper side of which at least one optoelectronic semiconductor component, in particular an LED chip, is arranged; temporarily arranging the device according to the invention on the support so that the limiting means are arranged above the upper side of the support at a specific distance for forming a layer between the limiting means and the upper side of the support;

[0034] applying a flowable material to the support in a spatial region between the support and the limiting means; and

[0035] The device is removed after the flowable material has hardened.

[0036] The device can be fastened, in particular clamped or pressed, on a support. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The embodiments of the present invention are explained in detail below with reference to the accompanying drawings. The accompanying drawings schematically show:

[0038] Figures 1 to 3 A variant of a temporary limiting device or a respective cross-sectional view of an optoelectronic lighting device is shown, wherein the application of a flowable material is illustrated;

[0039] Figures 4 to 6 A further variant of a temporary limiting device or a respective cross-sectional view of an optoelectronic lighting device is shown, wherein the application of a flowable material is illustrated;

[0040] Figures 7 to 9 A further variant of a temporary limiting device or a respective cross-sectional view of an optoelectronic lighting device is also shown, in which the application of a flowable material is illustrated;

[0041] Figures 10 to 12 A further variant of a temporary limiting device or a respective cross-sectional view of an optoelectronic lighting device is also shown, in which the application of a flowable material is illustrated and in which different variants of the limiting means are additionally shown; and

[0042] Figures 13 to 15 A further variant of a temporary delimiting device or a respective cross-sectional view of an optoelectronic lighting device having a carrier is shown, in which the application of a flowable material is illustrated and in which a further variant of a delimiting means for forming a material layer is additionally shown. DETAILED DESCRIPTION

[0043] exist Figures 1 to 3 The device 21 shown in the drawing comprises a limiting element 23 having a lower side 25 and at least one lateral surface 27. The limiting element 23 has a cross section that is at least approximately rectangular and is preferably constructed of a soft, deformable material. Along a peripheral direction U extending perpendicular to the plane of the drawing, the limiting element 23 is fully closed. The limiting element 23 thus forms a frame along its peripheral direction U, which can be constructed, for example, as a rectangle or a square or can also be constructed as a ring. The lateral surface 27 is also completely closed along the peripheral direction U. The lateral surface 27 thus forms a wall that surrounds an inner area 29 enclosed by the frame-shaped limiting element 23.

[0044] Furthermore, the limiting device 21 has an upper rigid limiting mechanism 51, which is designed in the form of a base plate, on the underside of which the limiting element 23 is arranged. The base plate 51 has at least one opening extending from its upper side to its underside, through which the inner region 29 can be accessed. As a result, at least one flowable material 55 can be applied, in particular in the form of a layer, to the plate-shaped support 33 of the optoelectronic lighting device 31.

[0045] The support 33 comprises a substrate 39 and a metallization layer 37. This metallization layer can be divided into individual sub-regions which are electrically separated from one another. Thus, the layer 37 can also not be arranged on the entire upper side 35 of the support 33, but only on a sub-region and thus have, for example, individual contact regions separated from one another for electrical contacting.

[0046] Furthermore, at least one optoelectronic semiconductor component 41, which can be, for example, an LED chip, is arranged on the upper side 35 of the support 33. A light-emitting region is formed on the upper side of the semiconductor component 41, which is covered in particular by an optional, in particular transparent material layer 43. The semiconductor component 41 can be electrically connected to the metallization layer 37 via at least one bonding wire 45.

[0047] For the lighting device 31, it is provided that at least one layer of at least one material 55 processed in a flowable state is applied to the upper side 35 of the support 33. In this case, the material 55 should not cover the first area 47 on the support upper side 35 and should cover the second area 49 on the support surface 35 adjacent to the first area 47. The term "support upper side" or "support surface" is to be understood broadly and in particular also includes surface areas of elements or means arranged on the support 33. In order to distinguish the first area 47 from the second area 49, the first area 47 is to be covered by the material 55. Figure 1 In the figure, a vertically extending dotted line is drawn in. In addition, the boundary line G between the two regions 47, 49 extends in the plane of the upper side 35 of the support.

[0048] The material 55 is processed in a flowable state and applied, in particular, to the support upper side 35. It then hardens, for example, in a thermal process. The limiting device 21 is used to apply the material 55 in a flowable state to the upper side 35 of the support 33. The limiting device is temporarily arranged on the upper side 35 and is removed again after hardening or curing. For this purpose, the lateral surface 27 can be produced, for example, from a poorly adhesive or poorly wettable material.

[0049] For the limiting device 21, the lower side 23 and / or the lateral surface 25 and / or the possibly rounded edge 61 between the lower side 23 and the lateral surface 25 are constructed and designed in such a way that the limiting device 21 limits the first area 47 relative to the second area 49 when the lower side 23 is placed on the support surface 35.

[0050] In particular, the edge 61 extending between the lower side 25 and the lateral surface 27 has a course along the peripheral direction U, which, when the lower side 25 is placed on the support surface 35, corresponds at least approximately to the boundary line G between the first area 47 and the second area 49. The edge 61 can be in contact with the support upper side 35 over its entire course along the boundary line G. The edge 61 and the lateral surface 27 can thus form a lateral boundary for the material 55 applied to the second area 49 by means of the coating device 53, as in particular Figure 2 The coating device 53 can act like a glue spreader, which outputs the flowable material 55 via a nozzle pointing downward, so that the flowable material 55 can be applied to the surface 35 from above (see Figure 2 ).

[0051] The limiting device 21 similar to a punch can be temporarily arranged on the support surface 35 or used in Figure 2 The force F depicted in FIG. 2 is pressed onto the support surface 35. Therefore, the limiting device 21 can also be regarded as a punch tool. The force F can be generated, for example, in that the limiting device 21 is tensioned onto the support surface 35 or pressed onto the support surface 35 by means of a corresponding device.

[0052] By pressing the limiting device 21, the area between the edge 61 and the surface 35 can be sealed particularly well and thus prevent the material 55 from flowing over the boundary line G and onto the first area 47. The sealing effect can be further improved by forming the limiting element 23 from a soft, deformable material. In addition, a coating can be provided on the lateral surface 27, the bottom side 25 and / or the edge 61, which coating brings about an even better sealing effect.

[0053] In addition, Figure 2As shown, the material 55 can be filled to the desired level laterally beside the wall formed by the lateral surface 27 of the limiting element 23. For this purpose, a stop mechanism 57 can be arranged on the lateral surface 27. The stop mechanism can include a plurality of stop elements, which protrude from the lateral surface 27 at a specific distance relative to the lower side 25 and offset relative to each other as seen in the peripheral direction U. As an alternative, the stop mechanism 57 can also be configured as a circumferential flange that protrudes from the lateral surface 27. The stop mechanism 57 can prevent the material applied by means of the coating device 53 from exceeding the height level of the stop mechanism 57 (see FIG. 2 ). Figure 2 ). Thus, at least in the region of the lateral surface 27, a maximum filling height for the flowable material 55 can be achieved or ensured by means of the stop means 57. The stop means 57 can have a surface made of a material with a weak adhesion. This makes it easier to remove the limiting means 21.

[0054] After the material 55 has hardened, the limiting device 21 can be removed. Figure 3 As shown. Curing can also be carried out with the limiting device 21, for example for dimensional stabilization, while the material 55 can harden without the limiting device 21. A sharp boundary is produced between the uncovered first area 47 and the second area 49 covered with the material 55. Thus, a flow of the still flowable material 55 into the first area 47, also known as "seepage", can be avoided by the use of the limiting device 21. A permanently arranged dam, which would also make it possible to prevent such "seepage", can be omitted.

[0055] and Figure 1 and 2 The limiting device is different, refer to Figures 4 to 6 The described limiting device 21 has a continuous base plate 51, and the limiting element 23 has a triangular cross section. In addition, the lateral surface 27 is on the outside. Figures 4 to 6 For the device 21 , it is therefore provided that the limiting element 23 covers a first region 47 of the support upper side 35 when its lower side 25 comes into contact with the upper side 35 of the support 33 and thereby separates it from an adjacent outer second region 49 .

[0056] Due to the triangular cross-sectional shape of the limiting element 23, the lower side 25 coincides with an edge 61 that circumferentially extends in the circumferential direction U. The edge 61 rests on the upper side 35 or, as described above, is pressed against the upper side 35 with a force F. As a result, an effective seal can be achieved and "leaking" of the flowable material 55 can be avoided. A coating can further improve the sealing effect.

[0057] The semiconductor component 41 can be a light-emitting chip which has a light exit region on its lateral surface. The chip can be, in particular, an LED designed as a volume emitter.

[0058] The flowable material 55 can in turn be applied to the second region 49 by means of the coating device 53. Figure 2 By means of the lateral surface 27 which is inclined upward and extends outward, a corresponding chamfer 59 is produced on the surface side of the layer formed by the material 55 which faces the semiconductor component 41 (see Figure 6 ). Due to this bevel 59, the material 55 has a defined shape of the side edge opposite the light exit region. This side edge can lead to improved beam shaping and thus to improved coupling-out efficiency. This is particularly important in Figure 6 This is illustrated by arrows P which, by way of example, show the beam path of light emitted by the semiconductor component 41 .

[0059] Reference Figures 7 to 9 The described limiting device 21 has a limiting element 23 which is arranged on a base plate 51 and which, in contrast to the previously described limiting elements, does not have a frame-like structure but is designed at least approximately in the form of an elliptical, spherical or oval structure.

[0060] The lower side 25 of the limiting element 23 can be as follows Figure 8 The lower side 25 is applied to the upper side of the material layer 43 as shown. The lower side 25 is dimensioned in such a way that it at least approximately covers the emission surface of the semiconductor component 41 and can thereby protect the defined first region 47 on the upper side 35 of the support 33 from the material applied in a flowable state. The emission surface can be delimited by the material layers 55a, 55b formed on the adjacent second region 49. As a result, an improved contrast can be achieved in the light emitted by the semiconductor component 41.

[0061] The bottom side 25 with the edge 61 extending in the circumferential direction U can again be pressed against the first region 47 as described above with a force F. This makes it possible to achieve an effective seal and avoid "seepage" of flowable material onto the first region 47. A coating can further improve the sealing effect.

[0062] As already mentioned, Figures 7 to 9For the lighting device 31 of the embodiment of the present invention, it is provided that two layers 55a, 55b consisting of different materials applied in a flowable state by means of a device 53 are applied to the second region 49 of the upper side 35. The lateral surface 27 of the limiting element 23 forms a limiting wall for the material layers 55a, 55b that surrounds the limiting element 23 in the peripheral direction U. The material layers can be constructed up to this limiting wall. By its shape, as Fig. 9 As shown, a recess can be formed laterally above the material layer 43 of the material layers 55 a , 55 b , in particular with a sufficiently high potting height. The recess can improve the beam quality of the light emitted by the semiconductor component 41 .

[0063] Figure 7 and 8 The limiting device 21 can again be regarded as a punch which is temporarily arranged on the upper side of the layer 43 for forming the layers 55a, 55b and for protecting the first region 47. The limiting device 21 can also be used in screen-printed layers.

[0064] Figures 10 to 12 A temporary limiting device 21 or an optoelectronic light-emitting device 31 is shown. The device 21 is also suitable for producing at least one defined layer from a material 55 provided in a flowable state. For this purpose, the device 21 has a limiting means in the form of a limiting plate 51 and a holding means 63, which is used to hold the limiting plate 51 above the upper side 35 of the support 33 at a specific distance A when the device 21 is placed on the upper side 35 as required. The holding means 63 can be constructed in the form of one or more, for example, rod-shaped spacers, which are arranged on the limiting plate 51 and the ends of the spacers facing away from the limiting plate 51 are located below the limiting plate 51 at a distance A. The holding means 63 is preferably constructed as a rigid structure so that it can collide with the upper side 35 when the device 21 is pressed onto the upper side 35.

[0065] Furthermore, as already mentioned, the limiting element 23 is arranged on the underside of the limiting plate 51. However, in order to use the device for producing at least one layer 55 of a certain height, the limiting element is therefore to be regarded as merely an optional means.

[0066] The limiting plate 51 has an opening 73 which passes through from its upper side 65 to its lower side 67 and is provided in particular for introducing material for forming the material layer 55 between the limiting plate 51 and the support upper side 35 .

[0067] As in Fig.11 As shown in FIG. , the device 21 can be brought into contact with the upper side 35 of the support 33 . Fig.11Two different designs of the limiting plate 51 are shown here. Fig.11 In the upper part of (refer to Fig.11 a), the limiting plate 51 is formed with a flat upper side 65 and a flat lower side 67. Thus, a layer 55 can be formed from the material provided in a flowable state, applied by the application device 53 and through one of the openings 73, which layer has a defined height H relative to the support upper side 35 or a defined height h1 relative to the upper side of the semiconductor component 41, which can be, for example, an LED chip.

[0068] By following Fig.11 a) The use of a limiting plate 51 for manufacturing a layer 55 to limit the height h1 above the semiconductor component 51, see Fig.12 This allows the thickness of the material layer on the emitting component to be adjusted precisely. This makes it possible to reduce deviations in the color coordinate distribution.

[0069] exist Fig.11 In the following part (refer to Fig.11 b), the limiting plate 51 is also formed with a flat upper side 65. However, the lower side 67 has a structured portion 69, which is provided for forming a complementary structure 71 on the upper side 75 of the layer 55, such as Fig.12 b. In particular, an optical element 77 , in particular a lens, can be formed in each case above the light-emitting region of the semiconductor component 41 .

[0070] So external Fig.10 As illustrated by way of example in FIG. 8 , the underside 67 of the limiting means 51 can also be formed by a region having a structuring 69 and by a flat region.

[0071] In reference Figures 13 to 15 In the example described, a device 21 is used, in which the lower side 67 of the limiting plate 51 is designed as a stepped structure. The lower side 67 thus has at least one first region 79 and a second region 81, wherein the first region has a first spacing h1 relative to the upper side of one of the semiconductor components 41 when the device 21 is arranged on the support surface 35, and the second region has a second spacing h2 relative to the upper side of the adjacent second semiconductor component 41. Fig.14 and 15 As illustrated, a material layer 55 can be formed for which the layer heights h1, h2 above adjacent semiconductor components 41 are different. Different color coordinates can thus be achieved on the semiconductor components 41. This can be used, for example, to achieve multiple color coordinate positions in a "package".

[0072] List of reference numerals:

[0073] 21 Restraining device

[0074] 23 Limiting elements

[0075] 25 Lower side

[0076] 27 Lateral surface

[0077] 29Inner Area

[0078] 31 Lighting Device

[0079] 33 support

[0080] 35 upper side

[0081] 37 metallization layer

[0082] 39 substrate

[0083] 41Semiconductor components

[0084] 43 Material Layers

[0085] 45 bonding wires

[0086] 47 First Area

[0087] 49 Second Area

[0088] 51 board, restriction mechanism

[0089] 53 coating mechanism

[0090] 55 Materials, Layers

[0091] 55a Material layer

[0092] 55b material layer

[0093] 57 Suspension of institutions

[0094] 59 Bevel cutting section

[0095] 61 Edge

[0096] 63 Holding mechanism

[0097] 65 upper side

[0098] 67 lower side

[0099] 69 Structural Department

[0100] 71 Structure

[0101] 73 Opening

[0102] 75 upper side

[0103] 77 Optical Elements

[0104] 79 First Area

[0105] 81 Second Area

[0106] U surrounding institutions

[0107] P Arrow

[0108] F-Force

[0109] G-Line

[0110] A Spacing

[0111] Height

[0112] h1 height, first spacing

[0113] h2 second spacing.

Claims

1. A device for producing a layer on an optoelectronic light-emitting device (31) from a material (55) provided in a flowable state, the device comprising: Restriction Agency (51), A holding means (63) for holding a limiting means (51) at a specific distance (A) above a lighting device (31) for constructing the layer between the limiting means (51) and the lighting device (31), and a limiting element (23) having a lower side (25) and at least one lateral surface (27), wherein the limiting element (23) is constructed and can be temporarily arranged on a support upper side (35) of the lighting device (31) in such a way that the lower side (25) of the limiting element (23) contacts a first area (47) of the support upper side (35), and the lateral surface (27) and / or an edge (61) between the lower side (25) and the lateral surface (27) separates the first area (47) from a second area (49) of the support upper side (35) adjacent to the first area (47), wherein the lower side (67) of the limiting means (51) facing the light-emitting device (31) comprises, at least in the region of its lower side (67) when the limiting means (51) is arranged at a distance above the light-emitting device (31), a structured portion (69) for forming a structure (71) complementary to the structured portion (69) on the upper side (75) of the layer to be produced from the flowable material (55), The retaining mechanism (63) has at least one rigid spacer, wherein the spacer is arranged on the limiting mechanism (51) and the end of the spacer away from the limiting mechanism (51) is capable of abutting against the light-emitting device (31), and wherein the limiting element (23) is at least partially constructed of a deformable and / or elastic material.

2. The device according to claim 1, It is characterized in that The limiting means (51) has at least one opening (73) extending from its upper side (65) to its lower side (67).

3. The device according to claim 1 or 2, It is characterized in that If the limiting means (51) is arranged above the light-emitting device (31), the region of the lower side (67) is located above the light-emitting region of the optoelectronic semiconductor component (41) and the structured portion (69) is constructed in such a way that an optical element (77) can be constructed in a layer to be manufactured above the light-emitting region.

4. The device according to claim 1 or 2, It is characterized in that When the limiting mechanism (51) is arranged above the light-emitting device (31), the lower side (67) of the limiting mechanism (51) facing the light-emitting device (31) has at least one first area having a first distance (h1) relative to the upper side (35) of the light-emitting device (31) and at least one second area having a second distance (h2) relative to the upper side (35) of the light-emitting device (31), the second distance being different from the first distance (h1).

5. The device according to claim 1 or 2, It is characterized in that The material (55) does not cover the first region (47) of the light-emitting device (31) and covers the second region (49) of the light-emitting device (31) adjacent to the first region (47), and The limiting means (51) is dimensioned in such a way that it covers at least the second region (49).

6. The device according to claim 1, It is characterized in that The limiting element (23) is arranged or can be arranged on the limiting mechanism (51).

7. The device according to claim 1, It is characterized in that The edge (61) has a course which corresponds at least to a boundary line (G) between the first region (47) and the second region (49).

8. The device according to claim 1, It is characterized in that The lateral surface (27) of the limiting element (23) is closed along the circumferential direction (U).

9. The device according to claim 1, It is characterized in that The underside (25) and / or the edge (61) of the limiting element (23) can be in contact with the lighting device (21) over its entire length.

10. The device according to claim 1, It is characterized in that The underside (25) and / or the edge (61) and / or the lateral surface (27) of the limiting element (23) has a coating and / or at least one stop means (57).

11. The device according to claim 1, It is characterized in that The limiting element (23) is at least partially formed from a poorly wettable material.

12. The device according to claim 1, It is characterized in that The lateral surface (27) of the limiting element (23) extends at an angle of at least 90 degrees relative to the bottom side (25) or extends upward and outward away from the bottom side (25).

13. The device according to claim 1, It is characterized in that The limiting element (23) has a rectangular, square, triangular, polygonal or circular cross section, viewed in a plane perpendicular to the bottom side (25).

14. The device according to claim 1, It is characterized in that The limiting element (23) is designed in the form of a frame-like structure which surrounds an inner region (29).

15. The device according to claim 1, characterized in that The limiting mechanism is plate-shaped.

16. The device according to claim 2, characterized in that The opening is used to feed material into the space region between the limiting mechanism (51) and the lighting device (31).

17. The device according to claim 1, characterized in that It is provided that the material (55) does not cover the first region of the upper side (35) of the support of the lighting device (31).

18. The device according to claim 1, characterized in that The limiting element (23) is arranged or can be arranged on the underside (67) of the limiting means (51).

19. The device according to claim 1, characterized in that The lateral surface (27) of the limiting element (23) is closed along a peripheral direction (U) extending parallel to the lower side (25) of the limiting element (23).

20. The device according to claim 1, characterized in that The lower side (25) and / or the edge (61) of the limiting element (23) can be in contact with the upper side (35) of the support of the lighting device (21) over the entire length thereof.

21. The device according to claim 1, characterized in that The underside (25) and / or the edge (61) and / or the lateral surface (27) of the limiting element (23) has a coating and / or stop lines or stop elements in order to prevent or limit the flow of material.

22. The device according to claim 1, characterized in that The lateral surface (27) of the limiting element (23) extends linearly at an angle of at least 90 degrees relative to the bottom side (25) or extends upward and outward away from the bottom side (25).

23. The device according to claim 14, characterized in that The inner region (29) is dimensioned in such a way that at least one optoelectronic semiconductor component (41) can be accommodated therein.

24. The device according to claim 23, characterized in that The semiconductor component is an LED chip.

25. The device according to claim 14, characterized in that Furthermore, the lateral surface (27) is the surface side of the frame-like structure that faces toward the inner region (29) or faces away from the inner region (29).

26. A method for producing at least one layer on an optoelectronic light-emitting device (31), comprising the following steps: Providing a support (33) on the upper side (35) of which at least one optoelectronic semiconductor component (41) is arranged; Temporarily arranging the device according to any of the preceding claims on the support (33) in such a way that the limiting means (51) is arranged at a certain distance above the upper side (35) of the support (33) for forming a layer between the limiting means (35) and the upper side (35) of the support (31); applying a flowable material to the support (33) in at least a portion of the spatial region between the support (33) and the limiting means (51); and After the flowable material has hardened, the device (21) is removed.

27. The method according to claim 26, characterized in that The semiconductor component is an LED chip.

Images