Method and system for layered imaging detector

Abstract

The present invention is entitled "Methods and Systems for Layered Imaging Detectors". The present invention provides various methods and systems for imaging detector arrays. In one example, a detector module of the array has an X-ray sensor assembly and at least one integrated circuit, the X-ray sensor assembly coupled to an upper surface of a conductive block, the at least one integrated circuit positioned in a recessed portion of the conductive block below the X-ray sensor assembly. The detector module may also include a radiation barrier positioned between the X-ray sensor assembly and the at least one integrated circuit.

Description

Technical Field

[0001] Embodiments of the subject matter disclosed herein relate to non-invasive diagnostic imaging and non-destructive testing, and more particularly to computed tomography (CT) detectors and methods for achieving uniform heat distribution across a CT detector. Background Art

[0002] Non-invasive imaging techniques allow images of the internal structures of a patient or object to be obtained without performing an invasive procedure on the patient or object. Specifically, techniques such as computed tomography (CT) use various physical principles (such as differential transmission of x-rays through a target volume) to acquire image data and construct a tomographic image (e.g., a three-dimensional representation of the interior of the human body or other imaged structure).

[0003] The non-attenuated x-rays that pass through the target volume can be collected by a CT detector. The CT detector may include an array of detector modules that are configured to emit light when interacting with the x-rays. The emitted light can be converted into electrical signals and used to generate a tomographic image. The detector modules can each be a separate circuit coupled to a common computing device. Based on the signals received from the array of detector modules, digital reconstruction can occur at the computing device. Summary of the invention

[0004] In one embodiment, an imaging system includes one or more detector modules, each having a plurality of layers, each detector module including an X-ray sensor assembly oriented perpendicular to a vertical axis of the detector module and positioned above a conductive block; a radiation barrier positioned between the X-ray sensor assembly and the conductive block, the radiation barrier being configured to block radiation from penetrating into the conductive block; and at least one integrated circuit positioned along a side of the conductive block and configured to be shielded from radiation by the radiation barrier. In this way, degradation of the integration caused by exposure to radiation is mitigated, thereby increasing the life and performance of the detector module.

[0005] It should be understood that the above brief description is provided to introduce in a simplified form selected concepts that are further described in the detailed description. It is not meant to identify key or essential features of the claimed subject matter, the scope of which is solely defined by the claims that follow the detailed description. Furthermore, the claimed subject matter is not limited to implementations that solve any disadvantages noted above or in any part of this disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The present invention will be better understood by reading the following description of non-limiting embodiments with reference to the accompanying drawings, in which:

[0007] Figure 1 shows a pictorial view of an imaging system according to one embodiment;

[0008] Figure 2 shows a block schematic diagram of an exemplary imaging system according to one embodiment;

[0009] Figure 3 showing a first example of a detector module coupled to a flexible cable from a first view according to one embodiment;

[0010] Figure 4 Shows no flexible cable, from the second view Figure 3 A detector module;

[0011] Figure 5 A second example of a detector module adapted with a thermal insulation layer according to an embodiment is shown;

[0012] Figure 6 Shows Figure 5 An expanded view of a section of a detector module;

[0013] Figure 7 A third example of a detector module according to an embodiment is shown;

[0014] Figure 8 A fourth example of a detector module according to an embodiment is shown;

[0015] Fig.9A shows a fifth example of a detector module configured to block scattered radiation using a radiation shield according to an embodiment;

[0016] Fig. 9B Shows Fig.9A a detector module wherein the radiation shield is positioned in an alternative position;

[0017] Fig.10 shows a first alternative example of a conductive block of a detector module according to one embodiment;

[0018] Fig.11 shows a second alternative example of a conductive block of a detector module according to one embodiment;

[0019] Fig.12 A sixth example of a detector module adapted with a multi-layer radiation barrier is shown according to an embodiment.

[0020] Figures 3 to 12 Shown approximately to scale. DETAILED DESCRIPTION

[0021] The following description relates to various embodiments of a CT detector. The CT detector may be included in an imaging system (such as shown in a pictorial view and as a schematic diagram in FIG. Figure 1 and Figure 2 ) in the imaging system shown in . A plurality of detector modules may form a CT detector, each detector module including at least one application specific integrated circuit (ASIC), one or more photodiodes, and at least one conductive block. The detector modules may also include a radiation blocking layer (e.g., a radiation blocking member) and a thermal insulation layer to shield the ASIC from exposure to radiation and to mitigate undesirable heating of the photodiodes disposed above the ASIC. An example of a detector module adapted with a radiation blocking member and a first type of thermal insulation layer is shown in Figure 3 and Figure 4 An example of an alternative thermal insulation layer is depicted in Figure 5 and the expansion diagram of the insulation layer is Figure 6 Additional examples of detector modules with different structural variants for shielding the ASIC from radiation are provided in Figure 7 and Figure 8 As shown in Fig.9A and Fig. 9B As shown, the detector module may also be adapted with an optional radiation barrier to further shield the ASIC from scattered radiation. Variations in the material and configuration of the conductive blocks of the detector module are Fig.10 and Fig.11 An example of a multi-layer radiation barrier is shown in Fig.12 Shown in.

[0022] CT imaging can be used to obtain three-dimensional (3D) x-ray images, where an image can be generated by combining x-ray measurements taken from different angles. The x-ray measurements produce cross-sectional images of the target imaging area, which can be digitally stacked to form a 3D image. Images produced by CT imaging can provide more detailed information than conventional two-dimensional x-ray imaging.

[0023] The CT scanner may include a motorized x-ray source configured to rotate around a patient, thereby emitting an x-ray beam from the x-ray source through the patient. The x-ray beam that is not attenuated by the patient is received at a detector positioned relative to the x-ray source. The detector may be formed by an array of detector modules, each module including an x-ray sensor assembly, such as a photodiode configured to convert light into an electrical signal, or a direct conversion detector configured to convert x-rays directly into an electrical signal. The electrical signal may be transmitted to a circuit board by an ASIC coupled to the detector module. During the collection and transmission of the signal, the ASIC may generate heat, resulting in an increase in the temperature of the detector module. Exposure of the photodiode to high temperatures may result in degradation of the photodiode and poor and / or inconsistent performance of the detector.

[0024] Furthermore, while the ASIC may be positioned below the photodiode, away from direct exposure to the x-ray beams, penetration and scattering of these beams may still expose the ASIC to radiation. The electronic components of the ASIC may be sensitive to radiation and susceptible to degradation upon exposure. Therefore, configuring the detector module with a system that thermally insulates the photodiode and shields the ASIC from radiation may increase the performance and life of the detector.

[0025] The inventors herein have recognized these problems. In one example, the above problems can be at least partially solved by adapting a layered detector module with a thermal insulation layer and an x-ray radiation blocking layer. The thermal insulation layer can prevent heat from being conducted from the integrated circuit of the detector module to one or more photodiodes, and the radiation blocking layer can block the penetration of the x-ray beam, thereby reducing exposure of the integrated circuit. The detector module can also be configured to have optional structural variations to enhance x-ray beam attenuation and increase thermal and radiation shielding of the photodiodes and integrated circuits, respectively. Details of systems and methods for layered detector modules are described below with reference to Figures 3 to 12 supply.

[0026] Now go to Figure 1 , depicts an exemplary CT system 100 configured for CT imaging. Specifically, the CT system 100 is configured to image a subject 112 (such as a patient, an inanimate object, one or more manufactured parts) and / or a foreign object (such as a dental implant, a stent, and / or a contrast agent present within the body). In one embodiment, the CT system 100 includes a gantry 102, which in turn may also include at least one x-ray source 104, which is configured to project an x-ray radiation beam 106 for imaging the subject 112. Specifically, the x-ray source 104 is configured to project the x-rays 106 toward a detector array 108 positioned on an opposite side of the gantry 102. Although Figure 1 Only a single x-ray source 104 is shown, but in some embodiments, multiple x-ray radiation sources and detectors may be employed to project multiple x-rays 106 so as to acquire projection data at different energy levels corresponding to the patient. In some embodiments, the x-ray source 104 may implement dual energy gem spectrum imaging (GSI) by fast peak kilovolt (kVp) switching. In some embodiments, the x-ray detector employed is a photon counting detector capable of distinguishing x-ray photons of different energies. In other embodiments, two sets of x-ray tube detectors are used to generate dual energy projections, where one set of x-ray tubes is set to low kVp and the other set to high kVp. It should therefore be understood that the methods described herein may be implemented with single energy acquisition techniques as well as dual energy acquisition techniques.

[0027] In some CT imaging system configurations, a radiation source projects a cone beam that is collimated to lie in the XYZ plane of a Cartesian coordinate system and is often referred to as the "imaging plane". The radiation beam passes through an object being imaged, such as a patient or subject 112. The beam, after being attenuated by the object, impinges upon an array of radiation detectors. The intensity of the attenuated radiation beam received at the detector array depends on the attenuation of the radiation beam by the object. Each detector element of the array produces a separate electrical signal that is a measure of the attenuation of the beam at the detector location. Attenuation measurements from all detector elements are acquired individually to produce a transmission profile.

[0028] In some CT systems, a gantry is used to rotate the radiation source and detector array around the object to be imaged in the imaging plane so that the angle at which the radiation beam intersects the object is constantly changing. A set of radiation attenuation measurements (e.g., projection data) from the detector array at one gantry angle is called a "view". A "scan" of an object includes a set of views made at different gantry angles or viewing angles during one rotation of the radiation source and detector. It is conceivable that the benefits of the methods described herein derive from medical imaging modalities other than CT, so as used herein, the term "view" is not limited to the use described above with respect to projection data from one gantry angle. The term "view" is used to mean a data acquisition whenever there are multiple data acquisitions from different angles (whether from CT, positron emission tomography (PET) or single photon emission CT (SPECT) acquisitions), and / or any other modality (including modalities yet to be developed) and their combination in fusion embodiments.

[0029] In certain embodiments, the CT system 100 further includes an image processor unit 110 configured to reconstruct an image of a target volume of a subject 112 using an iterative or analytical image reconstruction method. As used herein, the phrase "reconstructing an image" is not intended to exclude embodiments of the present invention in which data representing an image is generated rather than a visible image. Thus, as used herein, the term "image" broadly refers to both a visible image and data representing a visible image. However, many embodiments generate (or are configured to generate) at least one visible image.

[0030] Figure 2 Shows something like Figure 1 1. An exemplary imaging system 200 of the CT system 100 of FIG. According to aspects of the present disclosure, the imaging system 200 is configured to image a subject 204 (eg, Figure 1 In one embodiment, the imaging system 200 includes a detector array 108 (see Figure 1). The detector array 108 also includes a plurality of detector elements 202 that together sense the x-ray beam 106 that passes through a subject 204 (such as a patient) (see Figure 1 ) to collect corresponding projection data. Therefore, in one embodiment, the detector array 108 is manufactured in a multi-slice configuration including multiple rows of cells or detector elements 202. In such a configuration, one or more additional rows of detector elements 202 are arranged in a parallel configuration for collecting projection data.

[0031] In some embodiments, the imaging system 200 is configured to traverse different angular positions around the subject 204 to acquire the desired projection data. Thus, the gantry 102 and components mounted thereon can be configured to rotate about the rotation center 206 to acquire, for example, projection data at different energy levels. Alternatively, in embodiments where the projection angle relative to the subject 204 varies over time, the mounted components can be configured to move along a general arc rather than along a section of a circle.

[0032] Thus, as the x-ray source 104 and the detector array 108 rotate, the detector array 108 collects data of the attenuated x-ray beam. The data collected by the detector array 108 then undergoes pre-processing and calibration to condition the data to represent the line integral of the attenuation coefficient of the scanned subject 204. The processed data is often referred to as a projection.

[0033] In some examples, individual detectors or detector elements 202 in detector array 108 may include photon counting detectors that register interactions of individual photons into one or more energy bins. It should be appreciated that the methods described herein may also be implemented using energy integrating detectors.

[0034] The acquired projection data sets may be used for base material decomposition (BMD). During BMD, the measured projections are converted into a set of material density projections. The material density projections may be reconstructed to form a pair or set of material density maps or images for each corresponding base material (such as bone, soft tissue, and / or contrast agent maps). The density maps or images may then be correlated to form a volume rendering of the base material (e.g., bone, soft tissue, and / or contrast agent) in the imaging volume.

[0035] In one embodiment, the imaging system 200 includes a control mechanism 208 to control the movement of components, such as the rotation of the gantry 102 and the operation of the x-ray source 104. In certain embodiments, the control mechanism 208 also includes an x-ray controller 210 configured to provide power and timing signals to the x-ray source 104. Additionally, the control mechanism 208 includes a gantry motor controller 212 configured to control the rotational speed and / or position of the gantry 102 based on imaging requirements.

[0036] In certain embodiments, the control mechanism 208 also includes a data acquisition system (DAS) 214 that is configured to sample analog data received from the detector elements 202 and convert the analog data into digital signals for subsequent processing. The DAS 214 may also be configured to selectively aggregate analog data from a subset of the detector elements 202 into a so-called macro-detector, as further described herein. The data sampled and digitized by the DAS 214 is transmitted to a computer or computing device 216, which may be a processor or a processor. Figure 1 The image processor unit 110. In one example, the computing device 216 stores data in a storage device or mass storage device 218. For example, the storage device 218 may include a hard drive, a floppy disk drive, a compact disk-read / write (CD-R / W) drive, a digital versatile disk (DVD) drive, a flash drive, and / or a solid-state storage drive.

[0037] In addition, the computing device 216 provides commands and parameters to one or more of the DAS 214, the x-ray controller 210, and the gantry motor controller 212 to control system operations, such as data acquisition and / or processing. In certain embodiments, the computing device 216 controls system operations based on operator input. The computing device 216 receives operator input, which includes, for example, commands and / or scan parameters, via an operator console 220 operatively coupled to the computing device 216. The operator console 220 may include a keyboard (not shown) or a touch screen to allow an operator to specify commands and / or scan parameters.

[0038] In one embodiment, for example, the imaging system 200 includes or is coupled to a picture archiving and communication system (PACS) 224. In an exemplary embodiment, the PACS 224 is further coupled to a remote system (such as a radiology department information system, a hospital information system) and / or to an internal or external network (not shown) to allow operators at different locations to supply commands and parameters and / or gain access to image data.

[0039] The computing device 216 uses operator-supplied and / or system-defined commands and parameters to operate a table motor controller 226, which in turn can control a table 228, which can be a motorized table. Specifically, the table motor controller 226 can move the table 228 to properly position the subject 204 in the gantry 102 to acquire projection data corresponding to a target volume of the subject 204.

[0040] As previously described, the DAS 214 samples and digitizes the projection data collected by the detector elements 202. Subsequently, the image reconstructor 230 uses the sampled and digitized x-ray data to perform high-speed reconstruction. In one embodiment, the image reconstructor 230 stores the reconstructed image in the storage device 218. Alternatively, the image reconstructor 230 may transmit the reconstructed image to the computing device 216 to generate usable patient information for diagnosis and evaluation. In certain embodiments, the computing device 216 may transmit the reconstructed image and / or patient information to a display or display device 232 that is communicatively coupled to the computing device 216 and / or the image reconstructor 230. In some embodiments, the reconstructed image may be transmitted from the computing device 216 or the image reconstructor 230 to the storage device 218 for short-term or long-term storage.

[0041] Various methods and processes further described herein may be stored as executable instructions in a non-transitory memory on a computing device (or controller) in the imaging system 200. In one embodiment, the image reconstructor 230 may include such executable instructions in a non-transitory memory and may apply the methods described herein to reconstruct an image from the scan data. In another embodiment, the computing device 216 may include instructions in a non-transitory memory and may apply the methods described herein, at least in part, to the reconstructed image after receiving the reconstructed image from the image reconstructor 230. In another embodiment, the methods and processes described herein may be distributed on the image reconstructor 230 and the computing device 216.

[0042] In one embodiment, the display 232 allows the operator to assess the imaged anatomy. The display 232 may also allow the operator to select a volume of interest (VOI) and / or request patient information, such as via a graphical user interface (GUI), for subsequent scanning or processing.

[0043] As described above, a detector array may include a plurality of detector elements (e.g., Figure 2The detector array may be implemented in a variety of imaging systems. Each of the plurality of detector elements may be incorporated into a detector module formed of a plurality of components, such as one or more X-ray sensor assemblies, one or more ASICs, circuit boards, electrical connectors, heat sinks, etc. In an example where the detector array is used in an X-ray imaging system, the X-ray sensor assemblies may be photodiodes or direct conversion detectors. In a computed tomography system, such as Figure 1 and Figure 2 As shown in and described herein, the x-ray sensor assembly can be a photodiode with a scintillator positioned on top of the photodiode. During the transmission of the electrical signal from the photodiode to the circuit board, heat can be generated at the ASIC. Conducting heat through the detector module can cause undesirable heating of the photodiode and degrade the performance of the photodiode. In addition, the penetration and scattering of the x-ray beam can subject the ASIC to irradiation, which can adversely affect the transmission of the electrical signal.

[0044] To mitigate exposure of the ASIC in the detector module to x-ray radiation, the detector module may be configured with a layer that blocks x-ray beams from penetrating into the detector module. Figure 3 300, a first example of a detector module 302 can be equipped with a radiation barrier 304. A set of reference axes 301 is provided for comparison between views, indicating the y-axis, x-axis, and z-axis. The radiation barrier 304 can be positioned below the photodiode 306 relative to the y-axis.

[0045] The detector module 302 may be a block formed of various layers and components including a photodiode 306, a radiation barrier 304, a conductive block 308, one or more ASICs 310, and a flexible cable 312. The flexible cable 312 is coupled to an upper surface of the photodiode 306 relative to the y-axis, thereby forming a layer between the photodiode 306 and the radiation barrier where the photodiode 306 is stacked above the radiation barrier 304. The photodiode 306 may be coupled to the flexible cable 312 by an adhesive layer, and the flexible cable 312 may also be coupled to the radiation barrier 304 by an adhesive layer.

[0046] Radiation blocking member 304 is stacked above conductive block 308 along the y-axis and is connected to conductive block 308 via thermal insulation layer 303 (eg, Figure 4 ) is coupled to the conductive block 308, and the thermal insulation layer 303 is further described below. Figure 6 and Figure 7As shown, a scintillator may also be included in the detector module 302, which is positioned on top of the photodiode 306 and is configured to convert x-ray photons into light. The light may be transmitted to the photodiode 306, which converts the light energy into an electrical signal that may be collected by the ASIC 310 and transmitted to the circuit board via the flexible cable 312.

[0047] Figure 4 4 shows a second perspective view 400 of the detector module 302, depicting the detector module 302 with the flexible cable 312 removed. The detector module 302 may be Figure 4 Two ASICs 310 are shown, but other numbers of ASICs may be included in other examples, such as one or three. Similarly, other examples may include more than one photodiode 306 positioned above the conductive block 308.

[0048] The detector module 302 can also be Figure 4 The adapter is shown with a thermal insulation layer 303 to prevent heat from being conducted from the ASIC 310 to the photodiode 306. The thermal insulation layer 303 can be disposed between the radiation barrier 304 and the conductive block 308, and is implemented such that the bonding of the thermal insulation layer 303 does not include the use of any metal connection devices, such as bolts, screws, etc. Figure 5 and Figure 6 The thermal insulation layer is described in further detail.

[0049] like Figure 3 and Figure 4 As shown, the photodiode 306 can be a flat planar layer aligned with the xz plane. The thickness of the photodiode 306 defined along the y-axis can be less than the thickness 314 of the radiation barrier 304. The radiation barrier 304 can have a width 316 and a length 318 similar to the photodiode 306 and the conductive block 308, and can be formed of a material that absorbs energy and / or attenuates the x-ray beam. In addition, the radiation barrier 304 may include one or more layers having one or more material types. For example, the radiation barrier 304 can be formed of a high atomic number (e.g., high Z) element such as molybdenum (Mo), tungsten (W), lead (Pb), tin (Sn) or a mixture and alloy of these metals. A single layer with one type of material (such as a Mo layer) can be used, or multiple layers with one type of material (e.g., more than one layer with Mo or another material), or multiple layers formed of different materials. By positioning radiation block 304 directly below photodiode 306 , x-ray beams penetrating photodiode 306 may be effectively absorbed or completely attenuated before the radiation reaches ASIC 310 .

[0050] ASIC 310 may be located in a recess 311 in side surface 313 at the rear side of conductive block 308. As such, the plane of rearward-facing face 317 of ASIC 310 may be oriented at an angle between 0-90 degrees relative to the plane of photodiode 306, where photodiode 306 is coplanar with the xz plane. Recess 311 may be an area along side surface 313 where width 316 of conductive block 308 is reduced. Positioning ASIC 310 within recess 311 allows ASIC 310 to be completely tucked under radiation block 304 relative to the y-axis. As such, ASIC 310 does not protrude beyond rearward-facing edge 321 of radiation block 304 along the y-axis, thereby reducing exposure of ASIC 310 to x-ray photons propagating along side surface 313 of conductive block 308.

[0051] For example, the rearward-facing face 317 of the ASIC 310 does not extend relative to the y-axis beyond the outermost plane 319 of the rearward-facing edge 321 of the radiation block 304, which is aligned with the yz plane. Instead, placing the ASIC 310 in the recess 311 positions the ASIC spaced apart from the outermost plane 319. In some examples, when the width 316 and length 318 of the radiation block 304 and the conductive block 308 are similar, the outermost plane 319 of the rearward-facing edge 321 of the radiation block 304 may also be the outermost plane 319 of the shoulder 315 of the conductive block 308. In addition, positioning the ASIC 310 in the recess 311 enables the detector modules of the detector array to be tightly packed together with minimal gaps between the detector modules, thereby reducing the footprint of the detector array and promoting reliable and consistent detector performance.

[0052] The radiation barrier 304 can be combined with the thermal insulation layer 303 to provide a dual shielding effect, for example, heat shielding and radiation shielding. Figure 4 As shown, the thermal insulation layer 303 can be a thinner layer of insulating material than the radiation barrier 304, and the insulating material is such as an adhesive or a combination of adhesive and air, for example, air and adhesive together as an insulating layer to attach the radiation barrier 304 to the flexible cable 312. The adhesive can be, for example, an epoxy resin or a curable adhesive. Figure 5 An example of how the thermal insulation layer 303 may be configured is shown in a second example of a detector module 502. Figure 5 5 , for example, a side of a detector module 502 coupled to an ASIC 504 is shown in a rear view 500 .

[0053] Detector module 502 has a radiation barrier 506 disposed on top of a conductive block 508, which in one example may be Figure 3 and Figure 4 The radiation barrier 304 is similar to Figure 3 and Figure 4 Conductive block 308. Similar to Figure 4 The thermal insulation layer 510 is positioned between the radiation barrier 506 and the conductive block 508, above the ASIC 504. The thermal insulation layer 510 can be one or more slots 512 that are longitudinally aligned with the xz plane and aligned with the photodiode (e.g., Figure 3 and Figure 4 Each of the slots 512 may extend partially across the length 515 of the detector module 502, such as along the z-axis, and completely across the width of the detector module 502, such as along the x-axis. However, in other examples, the detector module 502 may have a width 515 that is coplanar with the photodiode 306. Figure 5 A different number of slots 512 are shown, and the slots 512 may alternatively extend completely across the length 514 and partially across the width. For example, the detector module 502 may have a single slot that extends completely across the length 515 and only through a portion of the width of the detector module 502. Other examples may include three or four slots having the same or different lengths, widths, and heights (height defined along the y-axis).

[0054] The slots 512 may be gaps or channels disposed above each ASIC 504 relative to the y-axis. As shown in the dashed rectangle, an expanded view 600 of one of the slots 512 is shown in FIG. Figure 6 Shown in. Figure 6 The slot 512 shown may be a groove in the upper surface 602 of the conductive block 508. The length 606 of the slot 512 (as well as the width of the slot defined along the x-axis) may vary depending on the desired bond line of the non-thermally conductive adhesive applied to the slot 512. When the radiant barrier 506 is coupled to the upper surface 602 of the conductive block 508, the slot 512 is formed, thereby providing an interruption in the transfer of heat between the conductive block 508 and the radiant barrier 506. In other words, the conductivity of the adhesive in the slot 512 may be less than the conductivity of the material of the conductive block, thereby preventing heat from being transferred upward from the conductive block 508 into the radiant barrier 506.

[0055] like Figure 6As shown, the slot 512 may include slots 604 at the extreme ends of the slot 512 along the z-axis. The slots 604 may be areas in the slot 512 where the recesses in the upper surface 602 of the conductive block 508 become deeper, resulting in a greater depth defined along the y-axis at the slots 604 than the areas of the slot 512 between the slots 604. The slots 604 may be configured to receive an overflow of an adhesive used to couple the radiation barrier 506 to the conductive block 508. For example, an adhesive layer may be applied to the upper surface 602 of the conductive block 508 (or to the bottom surface of the radiation barrier 506) between the slots 604. When the radiation barrier 506 is pressed against the conductive block 508, excess adhesive may seep into the slots 604, thereby providing a reservoir for the adhesive overflow.

[0056] return Figure 5 , the radiation barrier 506 may be adapted to provide an overhang 514 where the radiation barrier 506 protrudes further outwardly along the y-axis than, for example, a surface of the recess 516 in which the ASIC 504 is located. Figure 4 31 and the rearwardly facing edge 321 of the radiation barrier 304. The overhang 514 may extend along the xy plane and along the yz plane. Along the yz plane, the overhang 514 may protrude beyond the plane of the outer surface of the ASIC 504 along the x direction, as shown in FIG. Figure 4 Overhang 514 can ensure that ASIC 504 remains completely below radiation block 506 relative to the y-axis. In some examples, such as Figure 4 As shown, the conductive block 508 may have a structure similar to Figure 4 The shoulder 518 of the shoulder 315 protrudes in the x-direction by a similar amount as the overhang 514 .

[0057] By positioning the slot 512 between the radiation barrier 506 and the conductive block 508, undesirable heating of the photodiodes of the detector module 502 may be mitigated. Figure 4 , the heat generated by ASIC 310 can be blocked by thermal insulation layer 303 from flowing upward through conductive block 308 and into radiation barrier 304. As described above, thermal insulation layer 303 can be a non-conductive adhesive or a combination of adhesive and air. As shown by arrow 402, the heat can be forced to flow downward, through conductive block 308 and into a heat sink (not shown) disposed below conductive block 308. For example, the heat sink can be aligned with conductive block 308 via alignment pins 404 of the conductive block so that the heat sink is in direct contact with conductive block 308. The heat sink can be formed of a thermally conductive material that draws heat from conductive block 308 into the heat sink.

[0058] Positioning a thermal barrier between the ASIC and the photodiode of the detector module can reduce heat conduction to the photodiode, while positioning a radiation barrier between the photodiode and the ASIC can reduce the exposure of the ASIC to x-ray radiation. The orientation of the ASIC within the detector module can also help reduce radiation exposure to the ASIC. Examples of different ASIC configurations are shown in FIG. Figure 7 and Figure 8 Shown in.

[0059] A second example of the detector module 702 is Figure 7 700, for example, along the xy plane. A section of an adjacent detector module 736 is shown to the right of the detector module 702. The detector module 702 includes a scintillator 704 stacked on top of at least one photodiode 706 along the y-axis. Figure 3 and Figure 4 In a first example of a detector module 302, a radiation barrier 708 may be positioned below a photodiode 706, and a conductive block 712 may be positioned below the photodiode 706 with a thermal insulation layer 710 disposed therebetween. A flexible cable 714 contacts the photodiode 706, wraps along a back side 716 of the detector module 702, and extends downward to a circuit board (not shown).

[0060] The flexible cable 714 is coupled to an ASIC 718 that is positioned along a back side 716 of the detector module 702. The ASIC 718 is shown as being substantially aligned with the yz plane, but may be tilted to a greater extent relative to the y-axis in other examples, as further described below. It should be understood that in this document, descriptions of components being substantially aligned with an axis refer to alignment that is tilted at most 10 degrees relative to the axis. The ASIC 718 may be located in a recess 720 in a side surface 722 of the detector module and spaced from the side surface 722 by a thermal interface 724. The recess 720 may be similar to Figure 4 The thermal interface 724 may be in direct contact with both the ASIC 718 and the side surface 722 of the detector module 702, sandwiched therebetween, and have similar dimensions (such as length, width, and thickness) to the ASIC 718.

[0061] Thermal interface 724 may be a pad formed of a thermally conductive material, such as a silicone-based matrix with a ceramic or thermally conductive adhesive (e.g., filled with silver particles). The placement of thermal interface 724 may facilitate the conduction of heat from ASIC 718 to conductive block 712, thereby allowing heat generated by ASIC 718 to be conducted through conductive block 712 and to a heat sink coupled to conductive block 712.

[0062] ASIC 718 is positioned completely below radiation block 708, within recess 720. ASIC 718 and surface 750 of recess 720 may be tilted relative to the y-axis to reduce the likelihood that radiation penetrating a small space or gap 734 between detector module 702 and an adjacent detector module 736, as indicated by arrow 732, will not strike a lower portion of ASIC 718. For example, ASIC 718 and surface 750 of recess 720 may be tilted at angle α, such that bottom end 726 of ASIC 718 (and bottom end of recess 720) may be closer to centerline 728 of detector module 702 and further away from outermost plane 740 than upper end 730 of ASIC 718 (and upper end of recess 720), which will be further described below. Angle α may be, for example, an angle between 5-10 degrees, and may depend on the configuration of components of detector module 702. In other examples, angle α may be any angle between 0-90 degrees. The thermal interface 724 and the side surface 722 of the detector module 702 may also be included within the recess 720 at an angle α.

[0063] Through Figure 7 718 is tilted as shown, the ASIC 718 is tucked more below the edge of the radiation block 708 than if aligned parallel to the y-axis. For example, the ASIC 718 can be spaced apart from an outermost plane 740 toward a centerline 728 of the detector module 702 that defines a farthest protrusion along the x-axis of a rearward-facing edge 742 of the radiation block 708. Thus, the likelihood of an x-ray beam passing along the rear side 716 of the detector module 702 striking the bottom end 726 of the ASIC 718 is reduced. Adjusting the tilt of the ASIC 718 enables radiation mitigation without inhibiting or adversely affecting the coupling of the ASIC 718 to the side surface 722 of the detector module 702.

[0064] It should be understood that in other examples, the conductive block 712 may have a similar Figure 4 The shoulder of conductive block 712 may also protrude along the x-axis to the outermost plane 740. Regardless of the presence of the conductive block shoulder, upper end 730 of ASIC 718 may be spaced apart from radiation barrier 708 along the y-axis such that ASIC 718 does not contact radiation barrier 708.

[0065] Alternatively, instead of Figure 7 The ASIC of the tilt detector module shown can be further inserted below the radiation blocking block. Figure 8800 from a profile view 800. The detector module 802 has a scintillator 804 stacked above a photodiode 806. A radiation barrier 808 is positioned below the photodiode 806, and a conductive block 810 is stacked below the radiation barrier 808, wherein a thermal insulation layer 812 is disposed between the conductive block and the radiation barrier. A flexible cable 814 extends along a back side 816 of the detector module 802, and an ASIC 818 is coupled to the flexible cable 814 on one side and to a thermal interface 820 on an opposite side of the ASIC 818. The ASIC 818 and the thermal interface 820 are located in a recess 822 in the back side 816 of the detector module 802.

[0066] Along the back side 816, the detector module 802 has an insert 824 that extends along a portion of the height 826 of the detector module 802. For example, the insert 824 can begin at a midpoint along the height of the radiation barrier 808, which is defined along the y-axis and depicted as the cutout region of the radiation barrier 808, and continue down the back side 816 of the radiation barrier 808 to the bottom 828 of the detector module 802. Due to the presence of the insert 824, the recessed portion 822 can be larger than Figure 7 The recessed portion 720 of the radiation blocking block 808 is offset further toward the centerline 830 of the detector module 802. As such, the ASIC 818 is offset further away from (e.g., closer to the centerline 830) an outermost plane 840 that is aligned with the yz plane and defined by the protrusion of the outer edge 832 of the radiation blocking block 808 along the x-axis. The outer edge 832 provides an overhang that shields the ASIC 818 from penetrating the space between the detector module 802 and an adjacent detector module positioned to the right of the detector module 802 (e.g., Figure 7 Thus, ASIC 818 may be less likely to be exposed to radiation.

[0067] In some examples, the detector module can be used Figure 7 and Figure 8 For example, one or more ASICs may be placed in a recess in a side surface of the detector module, and the ASICs may be as shown in FIG. Figure 7 In addition, as shown in FIG. Figure 8 As shown, the detector module can also have an insert, wherein the inclined ASIC is positioned in a recess which is further recessed into the detector module due to the insert.

[0068] The detector module may also be adapted to have an additional shielding layer to block scattered x-ray beams. Fig.9AAs shown in cross-sectional view 900, a first detector module 902 is positioned adjacent to a second detector module 904, the detector modules being separated by a gap 906. The gap 906 may be nominal, e.g., very small compared to the width of the detector modules, where the width is defined along the x-axis, but may still allow x-ray photons to penetrate between the first detector module 902 and the first radiation block 903 of the second detector module 904 as indicated by arrow 908. The penetrating x-ray photons may be deflected and scattered in any direction by interacting with the materials of the components of the detector modules, such as by the metal forming the conductive block 912 of the second detector module 904, as indicated by arrow 909.

[0069] For example, a radiation shield 914 may be coupled to a surface of the flexible cable 910 that faces the second detector module 904. The radiation shield 914 may be a section of a tape formed of a radiation blocking material, such as tungsten, copper, lead, or a tungsten-doped coating, etc. By positioning the radiation shield 914 between the ASIC 916 and the second detector module 904, x-ray photons scattered in a direction from the conductive block 912 of the second detector module 904 toward the ASIC 916, as indicated by arrow 909, may be blocked from reaching the ASIC 916.

[0070] Fig.9A The radiation shield 914 shown may be a non-limiting example of a radiation shield. In other examples, the radiation shield 914 may have a length 918 that extends upward into the gap 906 between the conductive blocks 912 of the first detector module 902 and the second detector module 904. For example, the radiation shield 914 may extend up to the photodiode 920 of the detector module. For another example, Fig. 9B As shown, the radiation shield 914 can be positioned along the surface of the conductive block 912 of the second detector module 904 in proximity to the first detector module 902. In yet another example, the radiation shield 914 can alternatively be configured as a heavy metal doped coating on the flexible cable 910 or integrated into the material of the flexible cable. Alternatively, the gap 906 can be filled with a radiation blocking filler, such as a heavy metal doped flexible polymer. The filler can be inserted into the gap 906 between the scintillator 922 of the first detector module 902 and the second detector module 904, and / or in the gap between the photodiode 920 of the detector module and the conductive block 912.

[0071] Various combinations of the above options for shielding the ASIC from radiation and blocking heat conduction to the photodiode can be implemented in the detector module. For example, the detector module can have a radiation barrier just below the photodiode, wherein the thermally insulating adhesive layer is positioned between the radiation barrier and a conductive block disposed below the radiation barrier. The detector module can also include a radiation shield coupled to an outwardly facing surface of the ASIC. In another example, the detector module can have a thermally insulating adhesive between the radiation barrier and the conductive block, and the ASIC can be tilted relative to the vertical axis of the detector module (e.g., Figure 7 ) and include radiation blocking fillers that occupy the space between the detector modules and adjacent modules. It should be understood that many combinations have been contemplated without departing from the scope of the present disclosure.

[0072] The configuration and composition of the detector module may also be varied to provide radiation blocking properties and to modify the manufacturing process of the detector module. Fig.10 . For simplicity, the detector module 1000 is shown without a photodiode, an ASIC, or a flexible cable. The detector module 1000 includes a radiation barrier 1002 stacked on top of a conductive block. A thermal insulation layer 1006 may be disposed in the upper surface of the conductive block 1004, configured as at least one slot filled with a non-thermally conductive adhesive.

[0073] In one example, the radiation block 1002 can be formed from tungsten, which can allow the radiation block 1002 to have a reduced thickness 1008. For example, Figure 3 and Figure 4 The radiation barrier 304 of the detector module 302 shown may be formed of molybdenum and when Figure 3 and Figure 4 The detector module 302 and Fig.10 The detector modules 1000 are shown to be of equal height, where the height is defined along the y-axis, and the thickness 314 of the radiation blocking member 304 may be greater than Fig.10 Radiation barrier 1002 is shown having a thickness 1008 .

[0074] Tungsten may have a higher x-ray photon absorption capability relative to molybdenum, thus requiring less material to meet a target minimum shielding threshold. Thus, the detector module 1000 may be lighter than a detector module having a radiation barrier formed of a different material (e.g., molybdenum), and the coefficient of thermal expansion (CTE) of tungsten may be well matched to the CTE of a detector photodiode, which may be formed of silicon. However, a tungsten-based radiation barrier 1002 may be incompatible with thermally insulating adhesives used with molybdenum radiation barriers.

[0075] A second alternative example of the detector module 1100 is Fig.11 1. The detector module 1100 can be formed by overmolding a tungsten-doped polymer cap into an aluminum base 1102, where the detector module 1100 is extruded and processed as a single continuous unit. For example, the lower portion of the aluminum base 1102 can be a conductive block 1104 of the detector module 1100. The upper portion 1106 can interface with a photodiode, for example, the photodiode can be coupled to a surface of the upper portion 1106.

[0076] The aluminum base 1102 can be manufactured with cavities 1108 extending from the sides 1110 of the aluminum base 1102 toward a central region 1112 of the aluminum base 1102, but not through the central region 1112. A tungsten-doped polymer can be overmolded into the cavity 1108 to form a radiation barrier divided into three sections. Two of the sections are formed by the filled cavities 1108, and the third section can be formed by filling a centrally located slot 1116 with the tungsten-doped polymer. The slot 1116 can be positioned between the cavities 1108 along the x-axis.

[0077] By forming the detector module 1100 as a single overmolded, continuous unit, no adhesives or fasteners are required to couple the radiation barrier 1102 to the conductive block 1104. In addition, the detector module 1100 can also be easily scaled to accommodate a variety of detector sizes. However, the CTE of aluminum can be different than the CTE of silicon-based photodiodes, and the structural stability of the detector module 1100 can be lower than a detector module having a molybdenum radiation barrier coupled to a separate conductive base.

[0078] Further optional variations of the detector module may include forming the radiation barrier from more than one layer having at least two different types of materials. Fig.12 As shown, the detector module 1200 can have a radiation barrier 1202 positioned relative to the y-axis below both the scintillator 1204 and the photodiode 1201 and above the conductive block 1206. The radiation barrier 1202 is depicted as having a first layer 1208 and a second layer 1210, the first layer 1208 being stacked directly above the second layer 1210 but being spaced apart from the second layer 1210 by an adhesive coupling the layers to each other.

[0079] The layers of radiation blocking member 1202 can be formed by materials that provide radiation shielding, heat resistance and k-edge emission blocking together. Each layer can have different characteristics. For example, the first layer 1208 can block x-ray photons, while the second layer 1210 can hinder the heat conduction from the conductive block 1206 to the photodiode 1201, and also block the k-edge emission and backscattering from the first layer 1208. In other examples, the radiation blocking member 1202 can be formed by more than two layers (such as three layers or four layers) and include two or more types of materials. Each type of material can have different characteristics. More than two layers may include alternating layers with two materials or may be different materials.

[0080] The materials used to form the radiation barrier 1202 can be selected based on compatibility with each other and with adjacent components of the radiation barrier 1202, in addition to the desired shielding and resistance properties. For example, the CTE of the material of the radiation barrier 1202 can be similar to the CTE of the photodiode 1201, for example, similar to the CTE of silicon. In some examples, each layer of the radiation barrier 1202 can be coupled to one or more adjacent layers by an adhesive. The adhesive can be, for example, a heat-resistant adhesive formed from a non-thermally conductive material, such as an adhesive used to form a thermal insulation layer between the radiation barrier and the conductive block of the detector module, as described above. Incorporating one or more adhesive layers can further prevent heat from being transferred from one or more ASICs to the photodiode 1201.

[0081] In one example, the first layer 1208 of the radiation barrier 1202 can be formed of tin. The tin can reduce the possibility of blurring at the photodiode 1201 and block k-edge emission. The second layer 1210 can be formed of leads that can provide effective radiation shielding for at least one ASIC 1212, but can also emit k-edge x-ray photons in multiple directions away from the conductive block 1206, such as backscatter. The first layer 1208 can compensate for the k-edge emission at the second layer 1210 by absorbing and / or completely attenuating the emitted photons. In some examples, it may be necessary to add a third tin layer below the second lead layer 1210 to block any backscatter that can penetrate toward the conductive block 1206.

[0082] For example, first thickness 1214 of first layer 1208 can be similar to second thickness 1216 of second layer 1210. Fig.12As shown. However, in other examples, the first thickness 1214 may be greater than or less than the second thickness 1216. In addition, the total thickness of the radiation barrier 1202 (e.g., the sum of the first thickness 1214 and the second thickness 1216) may vary relative to the height 1218 of the conductive block 1206. The first thickness 1214 and the second thickness 1216 may be adjusted based on the type of material used. For example, a material with a higher x-ray photon shielding capability may have a reduced thickness relative to a material that is less effective in blocking x-ray photons. As another example, it may be desirable to use thinner layers when the layers of the radiation barrier 1202 are formed of a heavier material. For example, a lead layer that is thinner than a molybdenum layer may be used.

[0083] In this way, a detector for an imaging system can be configured to provide consistent and reliable performance and an extended service life. The detector module of the detector can be adapted to have a layered structure to minimize the exposure of the radiation-sensitive integrated circuit and reduce the heating of the temperature-sensitive photodiode. A radiation barrier can be implemented in the detector module, below the photodiode, to block x-ray photons from penetrating the photodiode and further entering the detector module. The exposure of the integrated circuit in the recessed portion in the side surface of the detector module below the photodiode to x-ray irradiation can be avoided by positioning the integrated circuit completely under the radiation barrier. The detector module may also have a thermal insulation layer, which may be a heat-resistant adhesive layer positioned between the photodiode and the integrated circuit to block heat conduction from the integrated circuit to the photodiode. The combination of the radiation barrier and the thermal insulation layer can reduce the adverse exposure of both the photodiode and the integrated circuit, thereby reducing the need for replacement or maintenance of the photodiode and the integrated circuit.

[0084] The technical effect of configuring the detector modules with radiation barriers and thermal insulation is to reduce the exposure of the integrated circuits to x-ray photons while suppressing heating of the photodiodes.

[0085] Figures 1 to 12An example configuration with relative positioning of various components is shown. In at least one example, if it is shown as directly contacting or directly coupling each other, such elements may be referred to as directly contacting or directly coupling, respectively. Similarly, in at least one example, elements adjacent to or adjacent to each other may be adjacent to or adjacent to each other, respectively. For example, components arranged to coplanarly contact each other may be referred to as coplanar contact. For another example, in at least one example, elements positioned to be spaced apart from each other and having only space therebetween without other components may be described and referenced as such. For another example, elements shown to be located above / below each other, located on opposite sides of each other, or located between the left / right sides of each other may be described and referenced as such relative to each other. In addition, as shown in the figure, in at least one example, the topmost element or point of an element may be referred to as the "top" of a component, and the bottommost element or point of an element may be referred to as the "bottom" of a component. As used herein, top / bottom, upper / lower, upper / lower may be relative to the vertical axis of the figure, and may be used to describe the positioning of elements relative to each other in the figure. Thus, in one example, an element shown to be located above other elements is vertically positioned above other elements. As another example, the shapes of elements shown in the figures may be referred to as having these shapes (e.g., such as being rounded, straight, planar, curved, rounded, chamfered, angled, etc.). In addition, in at least one example, elements shown as intersecting each other may be referred to as intersecting elements or intersecting each other. In addition, in one example, an element shown as being within another element or shown as being outside another element may be described and referred to as such.

[0086] As used herein, the elements or steps listed in the singular and beginning with the word "one" or "a kind of" should be understood as not excluding a plurality of the elements or steps, unless such exclusion is explicitly stated. In addition, the reference to "an embodiment" of the present invention is not intended to be interpreted as excluding the existence of additional embodiments that also include the cited features. In addition, unless explicitly stated to the contrary, the embodiment of "including", "comprising" or "having" an element or multiple elements with a specific characteristic may include additional such elements without the characteristic. The terms "including" and "in..." are used as the concise language equivalents of the corresponding terms "including" and "wherein". In addition, the terms "first", "second" and "third" etc. are only used as marks, and are not intended to impose numerical requirements or specific positional order on their objects.

[0087] In one embodiment, an imaging system includes one or more detector modules, each having a plurality of layers, each detector module including an X-ray sensor assembly oriented perpendicular to the vertical axis of the detector module and positioned above a conductive block; a radiation barrier positioned between the X-ray sensor assembly and the conductive block, the radiation barrier being configured to block radiation from penetrating into the conductive block; and at least one integrated circuit positioned along one side of the conductive block and configured to be shielded from radiation by the radiation barrier. In a first example of the system, a thermal insulation layer is disposed between the radiation barrier and the conductive block, the thermal insulation layer being configured to inhibit heat conduction from the at least one integrated circuit to the X-ray sensor assembly. A second example of the system optionally includes the first example, and further includes wherein the thermal insulation layer is an adhesive layer, and wherein the adhesive is at least one of an epoxy resin and a UV curable adhesive. The third example of the system optionally includes one or more of the first and second examples, and also includes wherein the thermal insulation layer is formed by one or more slots filled with adhesive, each slot being oriented coplanar with the X-ray sensor assembly and positioned above the integrated circuit of the at least one integrated circuit along the vertical axis of the detector module. The fourth example of the system optionally includes one or more of the first to third examples, and also includes wherein the one or more slots filled with adhesive are recessed portions in the upper surface of the conductive block, and wherein the one or more slots filled with adhesive have grooves at the extreme ends of each slot, which are configured to collect excess adhesive coupling the radiation barrier to the conductive block. The fifth example of the system optionally includes one or more of the first to fourth examples, and also includes wherein the radiation barrier is a layer formed of a material that completely covers the upper surface of the conductive block and the lower surface of the X-ray sensor assembly and is formed of a material that absorbs and / or attenuates x-ray photons. A sixth example of the system optionally includes one or more of the first to fifth examples, and further includes wherein the edge of the radiation barrier protrudes beyond the outward surface of the at least one integrated circuit in a direction perpendicular to the vertical axis, and wherein the protrusion of the radiation barrier is configured to provide an overhang to shield the at least one integrated circuit from irradiation. A seventh example of the system optionally includes one or more of the first to sixth examples, and further includes wherein the outward surface of the at least one integrated circuit is spaced apart from an outermost plane that is aligned with the vertical axis and is defined by the protrusion of the edge of the radiation barrier.An eighth example of the system optionally includes one or more of the first to seventh examples, and also includes wherein the at least one integrated circuit is positioned in a recess along a side of the conductive block, and a surface of the recess is inclined relative to the vertical axis, wherein the inclination positions a bottom end of the recess farther from the outermost plane than an upper end of the recess.

[0088] In another embodiment, a detector includes at least one detector module having a layered structure, wherein the layered structure includes an X-ray sensor assembly; a radiation barrier positioned between the X-ray sensor assembly and a conductive block, the radiation barrier being configured to block radiation from penetrating the X-ray sensor assembly; one or more integrated circuits positioned along a side of the conductive block, below the X-ray sensor assembly and electrically coupled to the X-ray sensor assembly; and a thermal insulation layer disposed between the radiation barrier and the conductive block, configured to inhibit heat transfer from the one or more integrated circuits to the X-ray sensor assembly. In a first example of the detector, the one or more integrated circuits are positioned below the radiation barrier relative to a vertical axis of the at least one detector module and spaced apart from an outermost plane, the outermost plane being aligned with the vertical axis, the outermost plane being defined by a protrusion of an edge of the radiation barrier along a direction perpendicular to the vertical axis. The second example of the detector optionally includes the first example, and further includes wherein the one or more integrated circuits are tilted, wherein the bottom end of each of the one or more integrated circuits is further away from the outermost plane of the radiation blocking member than the upper end of each of the one or more integrated circuits. The third example of the detector optionally includes one or more of the first and second examples, and further includes wherein the one or more integrated circuits are aligned parallel to the vertical axis and positioned in an insert extending from a midpoint along the height of the radiation blocking member to the bottom end of the at least one detector module, the height being defined along the vertical axis. The fourth example of the detector optionally includes one or more of the first to third examples, and further includes a shield formed of a radiation blocking material and configured to be coupled to at least one of a surface of a cable coupled to the one or more integrated circuits and extending along one side of the conductive block and a surface of an adjacent detector module, and wherein the shield is configured to shield the one or more integrated circuits from scattered radiation. A fifth example of the detector optionally includes one or more of the first to fourth examples, and also includes wherein the shield extends along at least a length of the one or more integrated circuits, the length being defined along the vertical axis, and wherein the shield is positioned between the one or more integrated circuits and the adjacent detector module.The sixth example of the detector optionally includes one or more of the first to fifth examples, and also includes a shield formed of a radiation blocking material and coupled to a cable, the cable being coupled to the one or more integrated circuits by at least one coating, the coating being applied to a surface of the cable extending at least along a length of the one or more integrated circuits, the length being defined along the vertical axis, and the radiation blocking material being incorporated into the material of the cable, and wherein the shield is configured to shield the one or more integrated circuits from scattered radiation. The seventh example of the detector optionally includes one or more of the first to sixth examples, and also includes wherein the radiation blocking member includes one or more layers having one or more types of radiation blocking materials, the one or more layers being stacked along the vertical axis, and wherein at least one type of radiation blocking material of the one or more types of radiation blocking materials is configured to have at least one of heat resistance and k-edge emission blocking properties.

[0089] In yet another embodiment, a detector module includes a radiation barrier aligned perpendicular to the vertical axis of the detector module and positioned below an X-ray sensor assembly and above a first surface of a conductive block, the first surface also aligned perpendicular to the vertical axis; at least one integrated circuit coupled to a cable and positioned at a second surface of the conductive block, the second surface being different from the first surface and substantially aligned with the vertical axis; and a thermal insulation layer coupled to a bottom surface of the radiation barrier and the first surface of the conductive block. In a first example of the detector module, a thermal cross-over pad is positioned between the at least one integrated circuit and the second surface of the conductive block, the thermal cross-over pad being configured to conduct heat from the at least one integrated circuit to the conductive block. A second example of the detector module optionally includes a first detector module and further includes a heat sink positioned below the conductive block and configured to draw heat from the at least one integrated circuit away from the X-ray sensor assembly through the conductive block.

[0090] This written description uses examples to disclose the invention, including the best mode, and also to enable a person of ordinary skill in the relevant art to practice the invention, including making and using any devices or systems and performing any included methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to a person of ordinary skill in the art. Such other examples are intended to fall within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with minor differences from the literal language of the claims.

Claims

1. An imaging system, comprising: One or more detector modules, each detector module having a plurality of layers, each detector module comprising: an X-ray sensor assembly oriented perpendicular to a vertical axis of the detector module and positioned above a conductive block; a radiation barrier positioned between the X-ray sensor assembly and the conductive block, the radiation barrier being configured to block radiation from penetrating into the conductive block; and at least one integrated circuit positioned along a side of the conductive block and configured to be shielded from radiation by the radiation barrier, Wherein the at least one integrated circuit is located in a recess in a side surface of the conductive block.

2. The imaging system of claim 1 , further comprising a thermal insulation layer disposed between the radiation blocking member and the conductive block, the thermal insulation layer being configured to inhibit heat conduction from the at least one integrated circuit to the X-ray sensor assembly.

3. The imaging system of claim 2, wherein the thermal insulation layer is an adhesive layer, and wherein the adhesive is at least one of an epoxy resin and a UV curable adhesive.

4. The imaging system of claim 2 , wherein the thermal insulation layer is formed by one or more adhesive-filled slots, each slot being oriented coplanar with the X-ray sensor assembly and positioned above an integrated circuit in the at least one integrated circuit along the vertical axis of the detector module.

5. The imaging system of claim 3 , wherein the one or more adhesive-filled slots are recessed portions in the upper surface of the conductive block, and wherein the one or more adhesive-filled slots have grooves at extreme ends of each slot, the grooves being configured to collect excess adhesive coupling the radiation barrier to the conductive block.

6. The imaging system of claim 1, wherein the radiation barrier is a layer that completely covers an upper surface of the conductive block and a lower surface of the X-ray sensor assembly, and the layer is formed of a material that absorbs and / or attenuates x-ray photons.

7. An imaging system according to claim 1, wherein an edge of the radiation blocking member protrudes beyond the outward surface of the at least one integrated circuit in a direction perpendicular to the vertical axis, and wherein the protrusion of the radiation blocking member is configured to provide an overhang to shield the at least one integrated circuit from exposure.

8. The imaging system of claim 7, wherein the outwardly facing surface of the at least one integrated circuit is spaced apart from an outermost plane aligned with the vertical axis and defined by the protrusion of the edge of the radiation block. 9 . The imaging system of claim 8 , wherein a surface of the recessed portion is inclined relative to the vertical axis, wherein the inclination positions a bottom end of the recessed portion further from the outermost plane than an upper end of the recessed portion.

10. A detector for an imaging system, comprising: At least one detector module, the at least one detector module having a layered structure, wherein the layered structure comprises: X-ray sensor assembly; a radiation barrier positioned between the X-ray sensor assembly and a conductive block, the radiation barrier being configured to block radiation from penetrating the X-ray sensor assembly; one or more integrated circuits positioned below the x-ray sensor assembly along a side of the conductive block and electrically coupled to the x-ray sensor assembly; and a thermal insulation layer disposed between the radiation barrier and the conductive block, the thermal insulation layer being configured to inhibit heat transfer from the one or more integrated circuits to the X-ray sensor assembly, The one or more integrated circuits are located in recesses in the side surfaces of the conductive blocks.

11. A detector according to claim 10, wherein the one or more integrated circuits are positioned below the radiation blocking member relative to the vertical axis of the at least one detector module and are separated from an outermost plane, the outermost plane is aligned with the vertical axis, and the outermost plane is defined by the protrusion of the edge of the radiation blocking member along a direction perpendicular to the vertical axis.

12. The detector of claim 11, wherein the one or more integrated circuits are tilted, wherein a bottom end of each of the one or more integrated circuits is further away from the outermost plane of the radiation blocking member than an upper end of each of the one or more integrated circuits.

13. A detector according to claim 11, wherein the one or more integrated circuits are aligned parallel to the vertical axis and positioned in an insert, which extends from a midpoint along the height of the radiation barrier to a bottom end of the at least one detector module, and the height is defined along the vertical axis.

14. The detector of claim 10, further comprising a shield formed of a radiation blocking material and configured to be coupled to at least one of a surface of a cable coupled to the one or more integrated circuits and a surface of an adjacent detector module, the cable being coupled to the one or more integrated circuits and extending along a side of the conductive block, and wherein the shield is configured to shield the one or more integrated circuits from scattered radiation.

15. The detector of claim 14, wherein the shield extends along at least a length of the one or more integrated circuits, the length being defined along a vertical axis of the at least one detector module, and wherein the shield is positioned between the one or more integrated circuits and the adjacent detector module.

16. The detector of claim 10, further comprising a shield formed of a radiation blocking material and coupled to a cable, the cable coupled to the one or more integrated circuits by at least one coating, the coating applied to a surface of the cable extending at least along a length of the one or more integrated circuits, the length being defined along a vertical axis of the at least one detector module, and the radiation blocking material being incorporated into the material of the cable, and wherein the shield is configured to shield the one or more integrated circuits from scattered radiation.

17. A detector according to claim 10, wherein the radiation blocking member comprises one or more layers having one or more types of radiation blocking materials, the one or more layers being stacked along a vertical axis of the at least one detector module, and wherein at least one type of radiation blocking material among the one or more types of radiation blocking materials is configured to have at least one of heat resistance and k-edge emission blocking properties.

18. A detector module, comprising: a radiation barrier aligned perpendicular to a vertical axis of the detector module and positioned below the X-ray sensor assembly and above a first surface of a conductive block, the first surface also aligned perpendicular to the vertical axis; at least one integrated circuit coupled to the cable and positioned at a second surface of the conductive block, the second surface being different from the first surface and substantially aligned with the vertical axis; and a thermal insulation layer coupled to a bottom surface of the radiation barrier and the first surface of the conductive block, Wherein the at least one integrated circuit is located in a recess in the second surface of the conductive block.

19. The detector module of claim 18, further comprising a thermal interfacing pad positioned between the at least one integrated circuit and the second surface of the conductive block, the thermal interfacing pad configured to conduct heat from the at least one integrated circuit to the conductive block.

20. The detector module of claim 18, further comprising a heat sink positioned below the conductive block and configured to draw heat from the at least one integrated circuit through the conductive block and away from the x-ray sensor assembly.

Images