A feeding device for electroplating chip resistors

Abstract

The present invention discloses a feeding device for electroplating of chip resistors, which comprises a base, a feeding trough is arranged on the base, the feeding trough comprises side baffles arranged on both sides and a feeding opening at the front end; a rotary barrel rack is connected to the top end of the rear portion of the feeding trough through a hinge seat; a plating barrel rack that has been electroplated is arranged on the rotary barrel rack, and a plating barrel is arranged in the plating barrel rack; a medicine flushing device is arranged above the rear portion of the feeding trough; a material flushing device is arranged on one side of the feeding trough; an upper baffle is arranged above the feeding opening; the present invention can efficiently and quickly discharge the plating barrel material that has been electroplated, and the whole process can be more convenient and reliable than the traditional process.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip resistor electroplating devices, and in particular relates to a material feeding device for chip resistor electroplating. Background Art

[0002] In the current electroplating process of chip resistors, the plated barrel rack is directly unloaded into the water washing tank after the electroplating is completed. This has the defect that the material in the plating barrel floats, resulting in low unloading efficiency. At the same time, due to the structural limitations of the water washing tank itself, it is very inconvenient to operate in the tank when unloading. Therefore, the unloading tank needs to be separated and designed more specifically, so as to achieve rapid unloading while further reducing material loss and ensuring that the material is clean. Summary of the invention

[0003] The purpose of the present invention is to solve the above problems and provide a material unloading device for chip resistor electroplating, which can efficiently and quickly unload the electroplated plating barrel materials, and the whole process can be more convenient and reliable than the traditional process.

[0004] To achieve the above purpose, the technical solution adopted by the present invention is: a feeding device for electroplating of chip resistors, which includes a base, a feeding trough is arranged on the base, and the feeding trough includes side baffles arranged on both sides and a feeding port at the front end; a hinged seat is arranged at the top end of the rear part of the feeding trough, and the hinged seat is connected to a rotating barrel rack through a rotating arm; a plating barrel rack that has been electroplated is placed on the rotating barrel rack, and a plating barrel is arranged between the vertical seats below the plating barrel rack; a medicine flushing device is arranged above the rear part of the feeding trough; and a flushing device is arranged on one side of the feeding trough.

[0005] Furthermore, a cover plate is provided at the opening of the outer wall of the plating barrel; fixed wing plates are provided on both sides of the cover plate; a stepped groove is opened on the fixed wing plate, and a fastening strip for fixing the cover plate is provided between the stepped grooves of the two fixed wing plates, and the fastening strip is connected to the cover plate by fastening bolts.

[0006] Furthermore, the articulated seat includes a rotating arm, and a limiting block 1 is arranged on the surface of the rotating arm at one side of the plating barrel rack.

[0007] Furthermore, the rotating barrel rack includes a support plate, and the support plates are connected by a connecting rod; a second limiting block is arranged at the front end of the support plate; and a movable clamping block is arranged on one side of the upper part of the plating barrel rack.

[0008] Furthermore, the medicine-injecting device includes a medicine-injecting air nozzle arranged just above the rotary barrel rack that has not been flipped over to the discharge chute.

[0009] Furthermore, the jetting direction of the medicine flushing air nozzle is vertically downward or inclined inwardly downward.

[0010] Furthermore, the punching device includes a water pump arranged on one side of the base, the water pump is connected to a nozzle through a pipeline, and the nozzle can be extended to various places of the feed chute through the pipeline.

[0011] Furthermore, the side baffle is inclined inward near the discharge port.

[0012] Beneficial effects of the present invention:

[0013] 1. The device of the present invention separates the material discharge trough from the entire electroplating process, making the entire material discharge process more convenient and efficient; at the same time, in conjunction with the medicine flushing device and the material flushing device, the medicine in the plating barrel can be quickly discharged and the electroplated material can be flushed out. Each link of the entire material discharge process is gradual and closely coordinated; therefore, the material discharge can be completed in a short time.

[0014] 2. In the device of the present invention, a stepped groove is arranged on the fixed wing plate of the plating barrel, which is completely different from the ordinary groove in the prior art and can fix the fastening strip at the same time; it avoids the fastening strip sliding left and right during the electroplating flipping process of the plating barrel, and at the same time ensures the sealing and convenience of opening and closing of the plating barrel.

[0015] 3. The front end of the side baffle of the lower chute in the device of the present invention is inclined and provided with an upper baffle, which can more efficiently collect the flushed materials and avoid the waste of materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of a half-sectioned three-dimensional structure of the device of the present invention.

[0017] Figure 2 It is a right side schematic diagram of the device of the present invention.

[0018] Figure 3 It is a rear view schematic diagram of the device of the present invention.

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the plating barrel 6 in the device of the present invention.

[0020] In the figure: 1. base; 2. discharge chute; 3. hinged seat; 4. rotating barrel rack; 5. plating barrel rack; 6. plating barrel; 7. medicine flushing device; 8. material flushing device; 201. side baffle; 202. upper baffle; 203. discharge port; 301. rotating arm; 302. limit block 1; 401. movable block; 402. connecting rod; 403. support plate; 501. stand; 601. fixed wing plate; 602. cover plate; 603. fastening strip; 604. fastening bolt; 605. stepped groove; 701. medicine flushing air nozzle; 801. water pump; 802. pipeline; 803. nozzle. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings. The description in this part is only exemplary and explanatory and should not have any limiting effect on the protection scope of the present invention.

[0022] like Figure 1-Figure 4 As shown, the specific structure of the present invention is: a feeding device for electroplating chip resistors, which includes a base, a feeding trough 2 is arranged on the base 1, and the feeding trough 2 includes side baffles 201 arranged on both sides and a feeding port 203 at the front end; a hinged seat 3 is arranged at the top end of the rear part of the feeding trough 2, and the hinged seat 3 is connected to a rotating barrel rack 4 through a rotating arm 301; a plating barrel rack 5 that has been electroplated is placed on the rotating barrel rack 4, and a plating barrel 6 is arranged between the upright seats 501 below the plating barrel rack 5; a medicine flushing device 7 is arranged on the upper rear part of the feeding trough 2; and a flushing device 8 is arranged on one side of the feeding trough 2.

[0023] In order to ensure the sealing and opening and closing convenience of the plating barrel, a cover plate 602 is provided at the opening of the outer wall of the plating barrel 6; fixed wing plates 601 are provided on both sides of the cover plate 602; a stepped groove 605 is provided on the fixed wing plate 601, and a fastening strip 603 for fixing the cover plate 602 is provided between the stepped grooves 605 of the two fixed wing plates 601, and the fastening strip 603 is connected to the cover plate 602 by a fastening bolt 604.

[0024] In order to make the plating barrel rack 5 more stable when flipping, the articulated seat 3 includes a rotating arm 301, and a limiting block 302 is arranged on the surface of the rotating arm 301 at one side of the plating barrel rack 5.

[0025] In order to make the plating barrel rack 5 more stable when flipping, the rotating barrel rack 4 includes a support plate 403, and the support plates 403 are connected by a connecting rod 402; a limiting block 2 is set at the front end of the support plate 403; the limiting block 2 is provided with a movable clamping block 401 on one side of the upper part of the plating barrel rack 5.

[0026] In order to quickly blow out the medicine in the plating barrel 6, the medicine flushing device 7 includes a medicine flushing air nozzle 701 arranged just above the rotating barrel frame 4 that has not been flipped over to the discharge chute 2.

[0027] Preferably, the air jet direction of the medicine-injecting air nozzle 701 is vertically downward or inclined inwardly downward.

[0028] In order to increase the material discharge speed of the plating barrel 6, the punching device 8 includes a water pump 801 arranged on one side of the base. The water pump 801 is connected to a nozzle 803 through a pipe 802. The nozzle 803 can extend to various places of the material discharge trough 2 through the pipe 802.

[0029] Preferably, the side baffle 201 is inclined inward near the discharge port 203 .

[0030] When the device is working, the electroplated barrel rack is placed on the support plate of the rotating barrel rack, and then the hinged seat is rotated to drive the plating barrel rack to flip to the side of the lower material trough. During the flipping process, the medicine flushing device will break the water diaphragm of the mesh cloth on the surface of the plating barrel through the medicine flushing air nozzle, destroying the air pressure inside the plating barrel, so that the medicine solution flows out faster; when the plating barrel rack is completely flipped to the inside of the lower material trough, the cover plate is opened by removing the fastening block, so that the plating barrel opening is tilted downward, and at the same time, the nozzle of the flushing device is used to flush out the material in the plating barrel with water to complete the entire unloading process.

[0031] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0032] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. The above is only a preferred implementation of the present invention. It should be pointed out that due to the limitations of textual expression and the objective existence of infinite specific structures, ordinary technicians in this technical field can make several improvements, modifications or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, should be regarded as the protection scope of the present invention.

Claims

1. A feeding device for electroplating chip resistors, comprising a base, characterized in that: The base (1) is provided with a material discharge chute (2), the material discharge chute (2) comprising side baffles (201) arranged on both sides and a material discharge port (203) at the front end; a hinge seat (3) is provided at the top end of the rear portion of the material discharge chute (2), the hinge seat (3) comprising a rotating arm (301), a limiting block (302) being provided on the surface of the rotating arm (301) at one side of the plating barrel rack (5), the hinge seat (3) being connected to a rotating barrel rack (4) via the rotating arm (301), the rotating barrel rack (4) comprising a support plate (40 3), and the support plates (403) are connected by connecting rods (402); a second limiting block is provided at the front end of the support plate (403); a movable clamping block (401) is provided at one side of the upper part of the plating barrel rack (5); a plating barrel rack (5) that has been electroplated is placed on the rotating barrel rack (4), and a plating barrel (6) is provided between the stands (501) below the plating barrel rack (5); a medicine flushing device (7) is provided at the upper rear part of the material discharge chute (2); and a material flushing device (8) is provided at one side of the material discharge chute (2).

2. A material feeding device for chip resistor electroplating according to claim 1, characterized in that: A cover plate (602) is provided at the opening of the outer wall of the plating barrel (6); fixed wing plates (601) are provided on both sides of the cover plate (602); a stepped groove (605) is provided on the fixed wing plate (601), and a fastening strip (603) for fixing the cover plate (602) is provided between the stepped grooves (605) of the two fixed wing plates (601); the fastening strip (603) is connected to the cover plate (602) via a fastening bolt (604).

3. A material feeding device for chip resistor electroplating according to claim 1, characterized in that: The medicine dispensing device (7) comprises a medicine dispensing air nozzle (701) arranged directly above the rotating barrel frame (4) that has not been turned over to the discharge chute (2).

4. A material feeding device for chip resistor electroplating according to claim 3, characterized in that: The spray direction of the medicine-injecting air nozzle (701) is vertically downward or inclined inwardly downward.

5. A material feeding device for chip resistor electroplating according to claim 1, characterized in that: The punching device (8) comprises a water pump (801) arranged on one side of the base, the water pump (801) being connected to a nozzle (803) via a pipeline (802), and the nozzle (803) extending to various locations of the feed trough (2) via the pipeline (802).

6. A material feeding device for chip resistor electroplating according to claim 1, characterized in that: The side baffle (201) is inclined inward near the discharge opening (203).

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