A light source packaging structure and packaging process, LED bulb

Abstract

A light source packaging structure and packaging process, and an LED bulb, comprising a first light-transmitting packaging shell and a second light-transmitting packaging shell, wherein the first packaging shell and the second packaging shell are connected to form a sealed cavity A, and the sealed cavity A is filled with a heat-conducting liquid or a heat-conducting gas; a light source is arranged in the sealed cavity A, and the light source comprises a conductive pin, and the conductive pin extends from the sealed cavity A to the external space of the sealed cavity A. The inner surfaces of the first packaging shell and the second packaging shell are provided with evenly distributed grooves. The present invention provides a new packaging structure for LED lamps, which solves the problem of heat dissipation defects of LED lamps in the prior art. At the same time, the conceptual design of a light engine is adopted, which provides a basis for various applications of LED bulbs, and solves the defects of cost and light efficiency of currently common bulbs.

Description

Technical Field

[0001] The present invention belongs to the technical field of lighting, and in particular relates to a light source packaging structure and a packaging process and an LED bulb based on the packaging structure. Background Art

[0002] Light-Emitting Diode (LED) is widely used in display, general lighting and other fields due to its energy-saving, environmental protection, long life and small size. LED industry technology is becoming more and more mature, its application is becoming more and more extensive, and its market demand is large. It is gradually replacing traditional high-voltage halogen lamps, tungsten filament lamps, and even energy-saving lamps, achieving true energy conservation and emission reduction and greening the earth. At present, in order to meet the needs of different application fields, LED packaging technology is constantly improving, and the forms of LED light sources are becoming more and more diversified.

[0003] Traditional LED lamps are difficult to completely replace traditional incandescent lamps and achieve full-light distribution lighting because LED light has the characteristics of point light source and directionality.

[0004] LED filament lamps, which have been popular in recent years, can achieve a light distribution close to that of incandescent lamps. However, the conventional straight hard filaments are limited in style due to the properties of the filaments. Although flexible filaments can be made into different shapes, they have the disadvantages of low luminous flux and low light efficiency.

[0005] In order to achieve a lighting effect close to that of an incandescent lamp and improve the lighting efficiency, the heat dissipation problem is also a problem that needs to be solved. LED is a semiconductor device, and the increase in the junction temperature of its PN junction will cause the luminous efficiency to drop rapidly, or even burn the PN junction. This type of low-voltage, high-current power LED lighting, more specifically including LED filament lamps, still has a long-term problem that needs to be solved for heat dissipation. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a new packaging structure for LED lamps, which solves the heat dissipation defect problem of LED lamps in the prior art.

[0007] The present invention adopts the following technical solutions to solve the above technical problems:

[0008] A light source packaging structure comprises a first light-transmitting packaging shell and a second light-transmitting packaging shell, wherein the first packaging shell and the second packaging shell are connected to form a sealed cavity A, and the sealed cavity A is filled with a heat-conducting liquid or a heat-conducting gas; a light source is arranged in the sealed cavity A, and the light source comprises a conductive pin, and the conductive pin extends from the sealed cavity A to the external space of the sealed cavity A.

[0009] Optionally, inner surfaces of the first packaging shell and the second packaging shell have grooves or protrusions.

[0010] Optionally, the first packaging shell and the second packaging shell have protrusions on their outer surfaces.

[0011] Optionally, it further includes an intermediate ring, which is installed between the first packaging shell and the second packaging shell and is sealed and connected to the first packaging shell and the second packaging shell respectively.

[0012] Optionally, the intermediate ring further includes a conductive pin mounting structure, and the conductive pin is installed through the intermediate ring.

[0013] Optionally, the inner surfaces of the first packaging shell, the second packaging shell and the middle ring are coated with fluorescent glue.

[0014] Optionally, the first packaging shell or the second packaging shell is provided with a valve.

[0015] Optionally, the light source includes an LED bare die chip and a conductive structure connected to the LED bare die chip.

[0016] Optionally, the light source further comprises a substrate, and the LED bare crystal chip and the conductive structure connected to the LED bare crystal chip are mounted on the substrate.

[0017] Optionally, a heat-conducting structure is mounted on the substrate.

[0018] Optionally, a driving circuit is also included, and the driving circuit is connected to the conductive pin.

[0019] The present invention also provides an LED bulb, comprising at least one of the above-mentioned light source packaging structures, wherein a sealed bulb is provided outside the light source packaging structure, a sealed cavity B is formed between the bulb and the light source packaging structure, and the sealed cavity B is filled with heat-conducting gas or heat-conducting liquid.

[0020] Optionally, it also includes a stem, a lamp holder and a conductive wire, wherein the lamp holder and the stem are connected to the bulb shell, the lamp holder is used to connect to an external power supply, the conductive wire connects the lamp holder and the stem, and the conductive pins of the light source packaging structure are connected to the conductive wire.

[0021] Optionally, the light source is connected to a driving circuit, and the driving circuit is placed in the sealed cavity B;

[0022] Alternatively, the driving circuit is installed in the lamp holder.

[0023] The present invention also provides an LED light source packaging process, characterized in that it is used to manufacture the above light source packaging structure, and the process comprises the following steps:

[0024] A valve is provided in the first packaging shell or the second packaging shell;

[0025] Filling fluorescent glue on the inner surfaces of the first packaging shell and the second packaging shell and baking them dry;

[0026] The intermediate ring is placed between the first packaging shell and the second packaging shell, and the first packaging shell, the second packaging shell and the intermediate ring are sealed and fixed by a sealing process to form a sealed cavity;

[0027] The sealing cavity is evacuated through the valve and then filled with heat-conducting gas or heat-conducting liquid, and then the valve is sealed.

[0028] Optionally, the conductive pins are integrally formed into the intermediate ring by injection molding.

[0029] Optionally, the sealing process uses ultrasonic sealing, laser sealing, or glue bonding.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] The present invention removes the covering glue on the chip of the traditional LED light source, and on this basis designs two packaging shells to package the bare crystal chip, forming a new type of packaged light source. For this type of packaging, the heat dissipation design is directly carried out at the light source packaging structure, and the heat dissipation effect is greatly improved compared with the existing LED filament structure light source. The corresponding power controllable range is larger, and different products with a wider range of light effects can be produced. At the same time, based on this technical solution, a smaller structure can be achieved.

[0032] From the perspective of process control design, the traditional method of coating fluorescent glue is to coat the inner surface of the shell with fluorescent glue and place it to dry. Since fluorescent glue is a fluid substance and conventional bulb structures are all non-planar structures with arcs or other angles, during the placement process, the fluorescent glue will appear to be too thick or too thin in some areas under the action of gravity.

[0033] (The above fluorescent glue coating process is a traditional method for coating the bulb shell of the lamp. The shell referred to here is not the same concept as the packaging shell described in this technical solution.)

[0034] Since the technical solution is to package the bare crystal chip through two packaging shells and fill the packaging structure with heat-conducting gas or liquid, its volume is relatively small and has higher requirements on light efficiency. The uneven distribution of fluorescent glue on the inner surface of the packaging shell using traditional technology is more obvious.

[0035] Based on this, the technical solution processes the inner surfaces of the two packaging shells, and sets grooves or protrusions on the inner surfaces of the first packaging shell and the second packaging shell to increase the flow resistance of the fluorescent glue on the inner surface of the packaging shell, so that the fluorescent glue after drying is evenly distributed and has good light effect. The grooves and protrusions can be evenly distributed or regularly unevenly distributed.

[0036] In another implementation effect, the grooves and protrusions on the inner surface of the shell are combined with the protrusions on the outer surface to form a dome light-transmitting technology to reduce glare.

[0037] Other beneficial effects are further described in the implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a cross-sectional view of a light source packaging structure;

[0039] Figure 2 It is a schematic diagram of the middle ring;

[0040] Figure 3 It is a schematic diagram of the installation of conductive pins;

[0041] Figure 4 It is a schematic diagram of the light source circuit structure;

[0042] Figure 5 Schematic diagram of heat conduction structure installation;

[0043] Figure 6 A schematic diagram of the structure of an LED light bulb;

[0044] Figure 7 Another structural schematic diagram of an LED light bulb;

[0045] Figure 8 Another structural schematic diagram of an LED light bulb;

[0046] Fig. 9 Another structural schematic diagram of an LED light bulb. DETAILED DESCRIPTION

[0047] The present application will be further described in detail below in conjunction with the accompanying drawings and examples. It will be understood that the specific embodiments described herein are only used to explain the relevant inventions, rather than to limit the invention. It should also be noted that, for ease of description, only the parts related to the invention are shown in the accompanying drawings. The first, second, etc. terms described in the present invention are provided for the convenience of describing the technical solution of the present invention, and have no specific limiting effect. They are all general terms and do not constitute a limiting effect on the technical solution of the present invention. It should be noted that, in the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the examples.

[0048] Embodiment 1:

[0049] like Figure 1 As shown, a light source packaging structure includes a first light-transmissive packaging shell 101 and a second packaging shell 102, wherein the first packaging shell 101 and the second packaging shell 102 are connected to form a sealed cavity A, and the sealed cavity A is filled with a heat-conducting liquid or a heat-conducting gas; a light source is arranged in the sealed cavity A, and the light source includes a conductive pin 103, and the conductive pin extends from the sealed cavity A to the external space of the sealed cavity A.

[0050] The inner surfaces of the first encapsulating shell 101 and the second encapsulating shell 102 are provided with grooves 104. The outer surfaces of the first encapsulating shell 101 and the second encapsulating shell 102 are smooth surfaces. The grooves and protrusions can be evenly distributed or regularly unevenly distributed.

[0051] In other executable embodiments, the inner surfaces of the first encapsulating shell 101 and the second encapsulating shell 102 are provided with protrusions. The outer surfaces of the first encapsulating shell 101 and the second encapsulating shell 102 are smooth surfaces. Similarly, the protrusions can be evenly distributed or regularly unevenly distributed.

[0052] In another embodiment, the outer surfaces of the first encapsulating shell 101 and the second encapsulating shell 102 are provided with protrusions. The grooves or protrusions on the inner surface of the shell are combined with the protrusions on the outer surface to form a dome light transmission technology to reduce glare. Similarly, the protrusions can be evenly distributed or regularly unevenly distributed, such as fewer protrusions near the shell opening and more gradually extending toward the center of the shell.

[0053] The protrusions mentioned above are in the form of raised dots or raised round dots in this embodiment, and may be modified in various ways in other implementations while being consistent with the overall concept.

[0054] like Figure 2 : It also includes an intermediate ring 105, which is installed between the first encapsulating shell 101 and the second encapsulating shell 102 and is sealed and connected to the first encapsulating shell 101 and the second encapsulating shell 102 respectively.

[0055] The light source, the middle ring 105, the first encapsulating shell 101 and the second encapsulating shell 102 are sealed and connected to form a light engine, which can be directly used in various fields as a light source.

[0056] The conductive pins are installed through the middle ring 105. Specifically, the conductive pins are integrally formed into the middle ring 105 by injection molding.

[0057] The first packaging shell 101 or the second packaging shell 102 is provided with a valve 106, through which the sealing cavity is evacuated and then filled with heat-conducting gas or heat-conducting liquid, and then the valve is sealed.

[0058] Fluorescent glue is provided on the inner surfaces of the first encapsulating shell 101, the second encapsulating shell 102 and the middle ring 105. Specifically, the sealing process adopts ultrasonic sealing, laser sealing or glue bonding.

[0059] The light source includes an LED bare crystal chip and a conductive structure connected to the LED bare crystal chip. In this embodiment, the light source also includes a substrate 107, and the LED bare crystal chip and the conductive structure connected to the LED bare crystal chip are mounted on the substrate. The substrate may not be provided, and the conductive structure is directly connected to the conductive pin.

[0060] like Figure 3 There is a conductive pin mounting structure 103-1 on the substrate 107, and the conductive pin mounting structure 103-1 is fixed on the substrate 107. During the production process, the conductive pin is fixed to 103-1, that is, it is fixed and electrically connected to the driving circuit or LED chip on the conductive substrate 107.

[0061] In the traditional solution, the surface of the LED bare crystal chip needs to be covered with colloid for dust and corrosion prevention. The covering colloid is a glue mixed with phosphors, which specifically excites the phosphors to emit white light through the LED chip. This technical solution removes the covering colloid on the surface of the traditional light-emitting diode to reduce heat dissipation obstacles; at the same time, the LED bare crystal chip is protected by a sealing device, and the bare crystal structure is directly cooled by insulating liquid or gas.

[0062] Specifically, more than one LED bare die chips 200 are connected through the conductive structure 201 to achieve a series, parallel or mixed series and parallel combination electrical connection relationship of more than one LED bare die chips, such as Figure 4 As shown, the electrical connection relationship of more than one LED bare crystal chip in series is shown. This embodiment only shows one implementation of the light line form, and in other various implementations, it can be made into various required shape structures. This technical solution has low thermal resistance, small loss, high conversion efficiency, high light efficiency, high temperature resistance and long life.

[0063] When the number of the LED bare crystal chip is one, the two electrode lead-out portions 202 on the LED bare crystal chip are connected to a conductive structure to supply power to the LED bare crystal chip and make the LED bare crystal chip emit light.

[0064] When the number of LED bare crystal chips is two, the two LED bare crystal chips can be connected in series or in parallel, both of which are achieved through the connection of the conductive structure. When the number of LED bare crystal chips is three or more, the three LED bare crystal chips can be connected in series, in parallel, or in a combination of series and parallel electrical connections, all of which are achieved through the connection of the conductive structure.

[0065] The material, shape, and connection relationship and relative position relationship of the conductive structure with the LED bare crystal chip can be changed without restriction. It can be imagined that in actual mass production applications, an omnidirectional LED light-emitting device of this embodiment will make adaptive adjustments and changes to the above-mentioned characteristics of the conductive structure taking into account factors such as cost, product yield, stability and reliability.

[0066] The conductive structure is a metal material, which can be any one of gold, silver, copper, alloy, conductive plastic, conductive rubber, etc., and is not limited to the examples listed in this embodiment; the connection between the conductive structure and the solder pad of the LED bare crystal chip is concave, and the concave shape is achieved by etching, laser, and other processing methods; the concave shape can be various shapes such as round and square, which can be selected and determined based on the convenience of the actual packaging process, cost and other factors, and is not limited to the examples listed in this embodiment.

[0067] like Figure 5 In other embodiments, a heat-conducting structure 108 is installed on the substrate, and the heat-conducting structure 108 is exposed to the insulating liquid or gas. The shape of the heat-conducting structure 108 can be various forms such as columnar, mesh, sheet, wire, etc., and it is necessary to meet the requirement that it can be fixed in the first sealed cavity to perform heat conduction. The material can be a metal material with high thermal conductivity, a carbon rod, a graphene material, etc.

[0068] Based on the above embodiments, it is found in the application that although the heat from the light source can be circulated relatively quickly in the convection process of the insulating liquid or insulating gas, due to the different arrangements of the LED bare crystal chips, a certain temperature difference will be generated in the sealed cavity A. The through heat conducting structure 108 is arranged on the substrate, and the heat transfer can be accelerated by the heat conducting structure 108.

[0069] In other embodiments, a driving circuit is further included, and the driving circuit is connected to the conductive pin.

[0070] Embodiment 2:

[0071] An LED light source packaging process is used to manufacture the light source packaging structure described in Example 1, and the process comprises the following steps:

[0072] A valve is provided in the first packaging shell or the second packaging shell;

[0073] Filling fluorescent glue on the inner surfaces of the first packaging shell and the second packaging shell and baking them dry;

[0074] The intermediate ring 105 is placed between the first packaging shell and the second packaging shell, and the first packaging shell, the second packaging shell and the intermediate ring 105 are sealed and fixed by a sealing process to form a sealed cavity;

[0075] The sealing cavity is evacuated through the valve and then filled with heat-conducting gas or heat-conducting liquid, and then the valve is sealed.

[0076] The conductive pins are integrally formed into the intermediate ring 105 by injection molding.

[0077] Specifically, the sealing process adopts ultrasonic sealing, laser sealing, or glue bonding.

[0078] Embodiment 3:

[0079] An LED light bulb comprises at least one light source packaging structure according to Embodiment 1, wherein a sealed bulb is provided outside the light source packaging structure, a sealed cavity B is formed between the bulb and the light source packaging structure, and a heat-conducting gas or a heat-conducting liquid is filled in the sealed cavity B. The LED light bulb further comprises a stem, a lamp holder, and a conductive wire, wherein the lamp holder and the stem are connected to the bulb, the lamp holder is used to connect to an external power source, the conductive wire connects the lamp holder and the stem, and the conductive pins of the light source packaging structure are connected to the conductive wire.

[0080] In one application implementation, the sealed cavity A can be considered as a cavity for placing the light source, and the sealed cavity B formed by the bulb shell is a protective cavity or a secondary heat dissipation cavity.

[0081] like Figure 6-9 Four light source packaging structures are shown: Figure 6 As shown, a light source packaging structure is installed in the bulb and fixed to the space above the core column through conductive wires. Figure 7 As shown, three light source packaging structures of decreasing sizes are installed in the bulb and fixed in parallel in the space above the core column through conductive wires. Figure 8 As shown, three light source packaging structures of the same size are installed in the bulb and fixed in parallel in the space above the core column through conductive wires. Fig. 9 As shown, three light source packaging structures of the same size or decreasing size are installed in the bulb and are connected in series and fixed in the space above the core column through conductive wires. The specific number can be adjusted as needed and is not limited.

[0082] Specifically, the light source is connected to a driving circuit, and the driving circuit is placed in the sealed cavity B;

[0083] Alternatively, the driving circuit is installed in the lamp holder.

[0084] The middle ring, the first packaging shell and the second packaging shell (hereinafter referred to as the light engine shell) are translucent or transparent, light-transmitting sealed cavities, and the bulb shell is also a light-transmitting material. The light transmission performance of translucent and light-transmitting materials is equivalent to that of transparent materials, but the translucent material can reduce the glare defect of the light source. The bulb shell uses a fully transparent material, so that the internal light engine structure can be observed, which is aesthetically pleasing.

[0085] In this embodiment, there is a driving circuit, which is placed on the substrate. One end of the conductive pin is connected to the driving circuit, and the other end is connected to the conductive wire.

[0086] By using the driving circuit of this embodiment, the light engine can be directly connected to an external power supply. In a special implementation, the light engine is used as an independent light source to connect several structures with the light engine as an independent light source in series or in parallel through a power line to form various application modes.

[0087] In one embodiment, an insulating liquid (or inert liquid) is injected into the sealed cavity A as a heat dissipation or heat-conducting material, which needs to have the characteristics of high refractive index, thermal conductivity, insulation, and low viscosity, such as silicone and silicone oil materials. Furthermore, the insulating liquid needs to have high heat resistance to ensure that the performance and color will not deteriorate under long-term heating (lighting) state.

[0088] The sealed cavity B is filled with an inert gas, preferably helium or a helium mixed gas. Based on this, the light engine is directly exposed to the sealed cavity B, and the helium or helium mixed gas in the sealed cavity B continuously dissipates heat for the light engine.

[0089] In this embodiment, the light source, the middle ring, the first packaging shell and the second packaging shell are made of silicone or plastic materials with high light transmittance. The bulb shell is made of glass. Preferably, the middle ring, the first packaging shell and the second packaging shell are made of materials with excellent thermal conductivity or the shell thickness is designed to be thinner.

[0090] Since the sealed cavity A is filled with liquid, the fragile nature of glass materials is no longer suitable for the selection of materials for the light source, the intermediate ring, the first packaging shell and the second packaging shell. It is preferred to use non-fragile and light-transmitting materials. Since the molecules of the liquid are relatively large, the use of silicone or plastic materials will not affect the sealing. The bulb shell is made of glass. Since glass is not easily deformed and has better sealing performance, it is more suitable for the bulb shell filled with helium or helium mixed gas to form the sealed cavity B.

[0091] Based on the above structure of this embodiment, the size of the light engine can be reduced to the greatest extent, which is different from the existing LED filament structure (the actual projection area of ​​the light source inside the LED filament lamp will be very large and not beautiful). It solves the limitation and cost problem of various application deformations on the bulb shell of traditional light bulbs.

[0092] The middle ring, the first package shell, the second package shell, and the bulb shell can all be provided with fluorescent powder or diffusion powder; at the same time, the color of the shell can be transparent or colored. At the same time, the shape of the light engine can be spherical, five-pointed star, columnar, etc., and the shape of the bulb shell can also be adjusted according to actual application requirements.

[0093] Next, the advantages of liquid cooling and LED bare die chip structure application are further demonstrated through experimental data. Table 1 shows the heat and cold ratio of bare die chip in sealed cavity A filled with gas or liquid compared with conventional LED lamp filled with gas or liquid when powered on.

[0094]

[0095] In the table, OK means the data indicators are qualified, NG means the data indicators are unqualified, and Failed means the product has a dead light.

[0096] From the above data comparison, it can be seen that

[0097] 1. Compared with "bare crystal structure + gas" and "covering glue + gas", the maximum current of "bare crystal structure + gas" can be increased to 1.5 to 2.5 times or more depending on the chip size.

[0098] 2. Compared with "bare crystal structure + liquid" and "cover glue + liquid", the maximum current can be increased to 1.5 to 3.0 times or more depending on the chip size.

[0099] In other embodiments, the sealed cavity A may also be filled with insulating gas, such as helium or a helium-gas mixture; and the sealed cavity B may also be filled with insulating liquid. Different application changes are performed according to different needs.

[0100] The above-mentioned embodiment only expresses one implementation mode of the present invention, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A light source packaging structure, characterized in that: The invention comprises a light-transmissive first packaging shell, a second packaging shell and an intermediate ring, wherein the first packaging shell and the second packaging shell are connected to form a sealed cavity A, and the sealed cavity A is filled with a heat-conducting liquid or a heat-conducting gas; a light source is arranged in the sealed cavity A, and the light source comprises a conductive pin, and the conductive pin extends from the sealed cavity A to the external space of the sealed cavity A; the intermediate ring is installed between the first packaging shell and the second packaging shell, and is sealed and connected to the first packaging shell and the second packaging shell respectively; the intermediate ring also comprises a conductive pin installation structure, and the conductive pin is installed through the intermediate ring; the light source, the intermediate ring, the first packaging shell and the second packaging shell are sealed and connected to form a light-emitting engine; The conductive pins are integrally formed into the intermediate ring by injection molding.

2. The light source packaging structure according to claim 1, characterized in that: The inner surfaces of the first packaging shell and the second packaging shell are provided with grooves or protrusions.

3. A light source packaging structure according to claim 1 or 2, characterized in that: The first packaging shell and the second packaging shell have protrusions on their outer surfaces.

4. The light source packaging structure according to claim 1, characterized in that: The inner surfaces of the first packaging shell, the second packaging shell and the middle ring are provided with fluorescent glue.

5. The light source packaging structure according to claim 1, characterized in that: The first encapsulating housing or the second encapsulating housing is provided with a valve.

6. The light source packaging structure according to claim 1, characterized in that: The light source includes an LED bare crystal chip and a conductive structure connecting the LED bare crystal chip.

7. The light source packaging structure according to claim 6, characterized in that: The light source further comprises a substrate, and the LED bare crystal chip and the conductive structure connected to the LED bare crystal chip are mounted on the substrate.

8. The light source packaging structure according to claim 7, characterized in that: A heat-conducting structure is mounted on the substrate.

9. The light source packaging structure according to claim 1, characterized in that: Also included is a driving circuit, wherein the driving circuit is connected to the conductive pin.

10. An LED light bulb, characterized in that: It comprises at least one light source packaging structure according to claim 1, wherein a sealed bulb is provided outside the light source packaging structure, a sealed cavity B is formed between the bulb and the light source packaging structure, and the sealed cavity B is filled with heat-conducting gas or heat-conducting liquid.

11. The LED bulb according to claim 10, characterized in that: It also includes a stem, a lamp holder and a conductive wire, wherein the lamp holder and the stem are connected to the bulb shell, the lamp holder is used to connect to an external power supply, the conductive wire connects the lamp holder and the stem, and the conductive pins of the light source packaging structure are connected to the conductive wire.

12. The LED bulb according to claim 11, characterized in that: The light source is connected to a driving circuit, and the driving circuit is placed in the sealed cavity B; Alternatively, the driving circuit is installed in the lamp holder.

13. A LED light source packaging process, characterized in that: For manufacturing the light source packaging structure according to claim 1, the process comprises the following steps: A valve is provided in the first packaging shell or the second packaging shell; Filling fluorescent glue on the inner surfaces of the first packaging shell and the second packaging shell and baking them dry; The intermediate ring is placed between the first packaging shell and the second packaging shell, and the first packaging shell, the second packaging shell and the intermediate ring are sealed and fixed by a sealing process to form a sealed cavity; The sealing cavity is evacuated through the valve and then filled with heat-conducting gas or heat-conducting liquid, and then the valve is sealed.

14. The LED light source packaging process according to claim 13, characterized in that: The sealing process adopts ultrasonic sealing, laser sealing, or glue bonding.

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