A thin material forming apparatus and method

Abstract

The application discloses a thin material forming device and method, relates to the field of material manufacturing, and the pressure cavity of the thin material forming device is located between a prepreg cavity and a pressure cavity pressure plate, the prepreg cavity is a hollow structure and is communicated with the outside through a prepreg cavity pipeline, and a prepreg assembly is placed in the prepreg cavity; the pressure cavity is a hollow structure and is communicated with the outside through a pressure cavity pipeline, the pressure cavity is filled with a filler to be expanded to be in contact with the pressure cavity pressure plate, so that the prepreg assembly is pressed against the forming surface of a mold when the pressure cavity is expanded and pressed against the soft prepreg cavity; the pressure cavity pressure plate is used for providing a reaction force; and the prepreg cavity is evacuated to be in vacuum for forming or curing. The thin material forming device and method provided by the application can automatically adapt to the curved surface form of a forming surface, the thin material is continuously and uniformly pressed, the pressure is controllable, and the forming quality is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of material manufacturing, in particular to a thin material forming device and method. BACKGROUND

[0002] Composite material refers to a material combined by two or more than two different substances in different ways, which can exert the advantages of various materials, overcome the defects of single material, and expand the application range of materials. Due to the characteristics of light weight, high strength, convenient processing and forming, excellent elasticity, chemical corrosion resistance and good weather resistance, composite materials have gradually replaced wood and metal alloys, and are widely used in the fields of aerospace, automobile, electronics and electrical appliances, building, fitness equipment, etc. In recent years, it has developed rapidly.

[0003] The development of modern high technology cannot be separated from composite materials, and composite materials play a very important role in the development of modern science and technology. The depth of research and the breadth of application of composite materials, as well as the speed and scale of their production development, have become one of the important symbols to measure the advanced level of science and technology of a country.

[0004] Composite materials are divided into metal and metal composite materials, non-metal and metal composite materials, and non-metal and non-metal composite materials according to their composition.

[0005] The forming methods of composite materials are different according to the different matrix materials. There are many forming methods for resin-based composite materials, such as hand lay-up forming, spray forming, fiber winding forming, mold pressing forming, pultrusion forming, resin injection (RTM) forming, autoclave forming, diaphragm forming, migration forming, reaction injection forming, soft membrane inflation forming, stamping forming, etc. The forming methods of metal-based composite materials are divided into solid phase forming method and liquid phase forming method.

[0006] In order to make the layered composite material closely adhere to the surface of the mold and be formed into the shape of the mold, an external force needs to be applied to the layered composite material. This external force is realized by hand pressure, autoclave pressure, and mold pressing in the traditional forming method. The hand pressure method is difficult to control the forming quality; the autoclave pressure method needs to buy expensive autoclaves and the operation and maintenance cost is high; the mold pressing method needs to make matching molds. These methods used in the forming method of layered composite materials all have certain deficiencies.

[0007] In these molding methods, a mold is needed. Conventional mold manufacturing has the characteristics of long cycle, high cost, and after the mold is manufactured, the shape is difficult to change. In recent years, reconfigurable mold molding method has developed rapidly, and its principle is to form a three-dimensional surface by controlling the positioning of each screw rod of the screw rod array. Using this method to shape the product saves the cost and time of manufacturing the mold; and the surface profile of the screw rod array can be changed to modify the formed surface profile conveniently and quickly; if another shape is needed, only the surface profile of the screw rod array needs to be changed. In the design of personalized products related to the human body, the surface of the face, the sole, or other parts of the human body can also be directly used as a mold.

[0008] Generally, the heating method is used to accelerate the curing process of the layered composite material, and usually needs several hours to several dozen hours of curing time. In recent years, the catalyst method has also been gradually used to accelerate curing, such as adding light initiators, microwave initiators and other additives to the resin, and using ultraviolet light or microwave methods to accelerate curing, which can shorten the curing time to several seconds or several minutes. The method of using catalysts needs to add the corresponding catalyst in the resin, and use the corresponding curing source for curing, and adjust the whole system according to the characteristics of the catalyst and the curing agent.

[0009] US20070044922 discloses a tool for compacting a composite material prepreg. Using these tools, composite material layers (such as tows or plies) can be compacted onto a manufacturing surface, such as a mold or other forming tool. The compacting tool is typically divided into a series of narrow segments, each of which can be advanced or retracted individually to conform to the surface of the composite part being formed. A pressurized fluid, such as air or hydraulic fluid, or a non-pressurized internal bladder with an incompressible fluid, is used to uniformly apply pressure to the segments to compact the material contacted by the tool and segments, helping to eliminate voids and assist in forming the composite material to the shape of the mold. The main purpose of this compacting tool is to compact the composite material, eliminate voids, and make the composite material more closely laid on the mold. However, the position of each narrow segment of the compacting tool relative to the center axis is fixed, so this compacting tool is suitable for making long-width composite materials with no radial variation. In addition, for composite materials with curved cross sections, the compacting tool forms an approximate curve by adjusting the position of each narrow segment relative to the center axis to compact the curved surface, so there is a gap between the compacting tool and the composite material, rather than a complete close fit.

[0010] Therefore, how to press the thin material to the irregular or curved molding surface to improve the material molding quality becomes a technical problem to be solved. SUMMARY

[0011] In view of the above-mentioned defects of the prior art, the technical problem to be solved by the present application is how to uniformly stress the thin material when it is pressed against an irregular or curved forming surface, so as to improve the forming quality of the thin material.

[0012] To achieve the above-mentioned object, the present application provides a forming device and method for a thin material, wherein the pressure cavity is filled with incompressible gas, liquid or solid with fluidity, and the pressure cavity drives the thin material to completely and tightly press against the forming surface under the action of external pressure, so as to obtain the curved surface shape of the forming surface.

[0013] In one aspect, the present application provides a forming device for a thin material, which is characterized by comprising: a prepreg cavity, which is a hollow structure and is configured to be capable of accommodating a prepreg assembly; a pressure cavity, which is a hollow structure and is configured to be capable of being filled with a filling material with fluidity and being capable of expanding with the filling of the filling material; and a pressure cavity pressure plate, wherein the pressure cavity is located between the prepreg cavity and the pressure cavity pressure plate, and the pressure cavity is capable of contacting the prepreg cavity and the pressure cavity pressure plate after expansion, so as to make the prepreg cavity contact the forming surface of the mold.

[0014] In some embodiments, optionally, the prepreg cavity is in communication with the outside through a prepreg cavity pipeline, the prepreg cavity is placed with a prepreg assembly, the prepreg cavity is made of a flexible and deformable material, and the prepreg cavity pipeline is used for air extraction and sealing of the prepreg cavity; the pressure cavity is in communication with the outside through a pressure cavity pipeline, the pressure cavity pipeline is used for filling the pressure cavity with the filling material so that the pressure cavity can expand to contact the pressure cavity pressure plate, and the pressure cavity can make the prepreg assembly press against the forming surface of the mold when it expands to press and contact the prepreg cavity; the pressure cavity pressure plate is located on one side of the pressure cavity, and is used for providing a reaction force when the pressure cavity expands, so as to provide a force for pressing forming when the pressure cavity presses and contacts the prepreg cavity; and the prepreg cavity pipeline is further used for air release or further vacuum extraction of the prepreg cavity after the pressure cavity is filled with the filling material, so as to perform forming or curing.

[0015] In some embodiments, optionally, the prepreg assembly comprises: a prepreg, a peel-off layer and a resin absorption layer, and the stacking order from top to bottom is: the prepreg, the peel-off layer and the resin absorption layer; or the prepreg assembly comprises: a prepreg, two peel-off layers and two resin absorption layers, and the stacking order from top to bottom is: a first resin absorption layer, a first peel-off layer, a prepreg, a second peel-off layer and a second resin absorption layer.

[0016] In some embodiments, optionally, the prepreg comprises a thermoplastic material prepreg, a thermosetting material prepreg or a composite material prepreg.

[0017] In some embodiments, the optional pre-preg cavity tube is further used to evacuate the pre-preg cavity to vacuum after the pre-preg cavity is added with the pre-preg assembly, and to release the vacuum or partial vacuum in the pre-preg cavity before the pressure cavity is filled with the filler, so that the pre-preg assembly is soft and easy to deform.

[0018] In some embodiments, the optional pressure cavity pressure plate is fixedly arranged outside the pressure cavity, and is located on the opposite side of the pre-preg cavity.

[0019] In some embodiments, the optional pressure cavity pressure plate is movably arranged on one side of the pressure cavity, and can move towards the pressure cavity after the pressure cavity is filled with the filler, so as to force the pressure cavity to press the pre-preg assembly towards the forming surface.

[0020] In some embodiments, when the light transmittance of the pre-preg is greater than or equal to a threshold value, the pre-preg is added with a photoinitiator, and a light source is arranged outside the pressure cavity pressure plate, wherein the light transmittance of the pressure cavity pressure plate, the cavity wall of the pre-preg cavity facing the light source, the release layer facing the light source, and the resin absorption layer facing the light source are all greater than or equal to a respective light transmittance threshold value or a same light transmittance threshold value, and the light source is turned on during curing.

[0021] In some embodiments, the optional filler is an incompressible liquid or gas, or a solid with fluidity.

[0022] In some embodiments, the optional forming surface includes one or more of the following surfaces: a general curved surface, a reconfigurable curved surface, and a surface of a specific part of a human body.

[0023] In another aspect, the present application also provides a method for forming a thin material, including the following steps: adding a pre-preg assembly into a pre-preg cavity, and placing the pre-preg cavity above a forming surface of a mold; placing a pressure cavity between the pre-preg cavity and a pressure cavity pressure plate; filling the pressure cavity with a filler through a pressure cavity tube; and evacuating the pre-preg cavity to vacuum for forming or curing.

[0024] In some embodiments, the optional pre-preg cavity is a hollow structure and is in communication with the outside through a pre-preg cavity tube, and the pre-preg cavity is made of a flexible and deformable material; the optional pressure cavity is a hollow structure and is in communication with the outside through a pressure cavity tube, wherein the pressure cavity is filled with a filler through the pressure cavity tube, so that the pressure cavity expands to contact the pressure cavity pressure plate and is forced by the pressure cavity pressure plate to press the pre-preg cavity, and the pre-preg assembly is pressed against the forming surface of the mold when the pressure cavity expands to press and contact the pre-preg cavity.

[0025] In some embodiments, the optional prepreg assembly comprises: a prepreg, a peel ply, and a resin absorption ply, and the prepreg assembly is stacked in the order of: the prepreg, the peel ply, and the resin absorption ply from top to bottom; or the prepreg assembly comprises: a prepreg, two peel plies, and two resin absorption plies, and the prepreg assembly is stacked in the order of: the first resin absorption ply, the first peel ply, the prepreg, the second peel ply, and the second resin absorption ply from top to bottom.

[0026] In some embodiments, the optional prepreg comprises: a thermoplastic prepreg, a thermoset prepreg, or a composite prepreg.

[0027] In some embodiments, the optional method further comprises: after the prepreg assembly is added into the prepreg cavity, the prepreg cavity is evacuated to a vacuum or a partial vacuum; and before the pressure cavity is filled with the filler, the vacuum or the partial vacuum in the prepreg cavity is released, so that the prepreg assembly is soft and easy to deform.

[0028] In some embodiments, the optional method further comprises: after the pressure cavity is filled with the filler, the pressure cavity pressure plate moves towards the pressure cavity to force the pressure cavity to press the prepreg assembly towards the forming surface, wherein the pressure cavity pressure plate is movably arranged on one side of the pressure cavity.

[0029] In some embodiments, the optional method further comprises: when the prepreg assembly is added into the prepreg cavity, a photoinitiator is added into the prepreg in the prepreg assembly; and a light source is turned on to make the prepreg form or cure, wherein the light source is arranged outside the pressure cavity pressure plate; wherein the light transmittance of the prepreg is greater than or equal to a threshold value, and the light transmittance of the pressure cavity pressure plate, the cavity wall of the prepreg cavity facing the light source, the peel ply facing the light source, and the resin absorption ply facing the light source are all greater than or equal to a respective light transmittance threshold value or a same light transmittance threshold value.

[0030] In some embodiments, the step of evacuating the prepreg cavity to a vacuum for forming or curing further comprises using one or more of the following curing methods for forming or curing: pressurization method, heating method, catalyst method.

[0031] Compared with the prior art thin material forming scheme, the thin material forming device and method described above can automatically adapt to the curved surface shape of the forming surface when the thin material is pressed against the forming surface, so that the thin material is completely in close contact with the forming surface, and the thin material is continuously and uniformly pressed with controllable pressure, which can improve the forming quality of the thin material.

[0032] The concept, specific structure and technical effects of the present application will be further described below with reference to the accompanying drawings to fully understand the purpose, features and effects of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 A schematic diagram of a thin material forming device structure according to an embodiment of the present application;

[0034] Figure 2 A schematic diagram of a cross section of a curved mold 24 according to another embodiment of the present application;

[0035] Figure 3 A schematic diagram of a cross section of a reconfigurable mold 30 according to another embodiment of the present application;

[0036] Figure 4 A schematic diagram of a cross section of a human foot mold 41 according to another embodiment of the present application;

[0037] Figure 5 A schematic diagram of a process of a thin material forming method according to an embodiment of the present application;

[0038] Figure 6 A schematic diagram of a thin material forming device structure and a curved mold combined according to another embodiment of the present application using a pressurized curing method;

[0039] Figure 7 A schematic diagram of a thin material forming device structure and a reconfigurable mold combined according to another embodiment of the present application using a pressurized curing method;

[0040] Figure 8 A schematic diagram of a thin material forming device structure and a reconfigurable mold combined according to another embodiment of the present application using a catalyst curing method;

[0041] Figure 9 A schematic diagram of a thin material forming device structure and a human foot mold combined according to another embodiment of the present application using a catalyst curing method. DETAILED DESCRIPTION

[0042] The preferred embodiments of the present application will be described herein below with reference to the accompanying drawings, in an attempt to make the technical contents of the present application more apparent and convenient for people's understanding. The present application can be embodied in many different forms and the protection scope of the present application should not be limited to the embodiments described herein.

[0043] Various specific embodiments of this application will now be described with reference to the accompanying drawings, which form part of this specification. It should be understood that although terms indicating direction, such as "front," "rear," "up," "down," "left," "right," "inner," "outer," "top," "bottom," "positive," "negative," "near," "far," "lateral," "longitudinal," "width direction," "length direction," "height direction," "axial," "radial," "clockwise," and "counterclockwise," are used herein to describe various exemplary structural parts and elements, these terms are used only for illustrative purposes and are determined based on the exemplary orientations shown in the accompanying drawings. Since the embodiments disclosed in this application can be arranged in different orientations, these terms indicating direction are illustrative only and should not be considered limiting.

[0044] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and this application does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of some components has been appropriately exaggerated in the drawings.

[0045] Ordinal numbers such as “first” and “second” used in this application are for distinction and identification only and have no other meaning. Unless otherwise specified, they do not indicate a specific order or a specific relationship. For example, the term “first component” does not imply the existence of “second component”, nor does the term “second component” imply the existence of “first component”.

[0046] The thin material forming apparatus and method are applicable to any thin or layered material, such as a single material, a mixed material or a composite material, or a thermoplastic or thermosetting material. In this embodiment, the prepreg includes thermoplastic prepreg, thermosetting prepreg or composite prepreg.

[0047] like Figure 1 The diagram shown is a schematic diagram of a thin material forming device according to an embodiment of this application. The thin material forming device includes a prepreg cavity 11, a pressure cavity 12, and a pressure plate 13. The prepreg cavity 11, the pressure cavity 12, and the pressure plate 13 can each be independent or fixed in position. When combined or fixed, the pressure cavity 12 is located between the prepreg cavity 11 and the pressure plate 13.

[0048] The pre-preg cavity 11 is made of soft and deformable material, and is a hollow structure and communicates with the outside through a pre-preg cavity pipe 14. The pre-preg cavity pipe 14 is used to perform air extraction and sealing on the pre-preg cavity 11. For example, the pre-preg cavity 11 can be extracted into a vacuum or a partial vacuum or not extracted into a vacuum through the pre-preg cavity pipe 14.

[0049] The pressure cavity 12 is a hollow structure and communicates with the outside through a pressure cavity pipe 15. The pressure cavity 12 is inflated by filling the pressure cavity pipe 15 with a filler so that the pressure cavity 12 is in contact with the pressure cavity pressure plate 13. The reaction force provided by the pressure cavity pressure plate 13 forces the pressure cavity 12 to press against the pre-preg cavity 11. When the pressure cavity 12 expands and presses against and contacts the soft pre-preg cavity 11, the pre-preg assembly is pressed against the forming surface 25 of the mold.

[0050] The pre-preg cavity 11 is placed in the cavity of the pre-preg assembly.

[0051] The pre-preg assembly includes a pre-preg, a peel layer, and a resin absorption layer. The peel layer is placed on the resin absorption layer, and the pre-preg is placed on the peel layer. In other words, the pre-preg, the peel layer, and the resin absorption layer are sequentially stacked from top to bottom, that is, the peel layer is located between the pre-preg and the resin absorption layer.

[0052] In another embodiment of the present application, the pre-preg assembly includes a pre-preg, two peel layers, and two resin absorption layers. The pre-preg is placed between the two peel layers, and a resin absorption layer is placed on the outside of each of the two peel layers. In other words, the first resin absorption layer, the first peel layer, the pre-preg, the second peel layer, and the second resin absorption layer are sequentially stacked from top to bottom.

[0053] In this embodiment, the pre-preg assembly includes a pre-preg 21, a first peel layer 22, a second peel layer 22', a first resin absorption layer 23, and a second resin absorption layer 23'. The first peel layer 22 and the second peel layer 22' can be made of the same material or different materials. The first resin absorption layer 23 and the second resin absorption layer 23' can be made of the same material or different materials.

[0054] The prepreg 21 is placed between the first release layer 22 and the second release layer 22', and the first resin absorption layer 23 and the second resin absorption layer 23' are placed outside the first release layer 22 and the second release layer 22', respectively. For example, according to the placement order, from the bottom layer, the first resin absorption layer 23, the first release layer 22, the prepreg 21, the second release layer 22', and the second resin absorption layer 23' are placed in turn, that is, the first resin absorption layer 23 is placed at the bottom layer, the first resin absorption layer 23 is covered by the first release layer 22, the first release layer 22 is covered by the prepreg 21, the prepreg 21 is covered by the second release layer 22', and finally the second release layer 22' is covered by the second resin absorption layer 23'. Conversely, the second resin absorption layer 23' can also be placed at the bottom layer, and the second release layer 22', the prepreg 21, the first release layer 22, and the first resin absorption layer 23 are placed in turn upwards.

[0055] The prepreg cavity 11 can be pre-vacuumed by the prepreg cavity pipe 14 to absorb excess resin by vacuum method, that is, after the prepreg assembly is placed inside the prepreg cavity 11, the prepreg cavity 11 is vacuumed by the prepreg cavity pipe 14 to absorb excess resin. The prepreg cavity pipe 14 can also vacuum the prepreg cavity 11 to absorb excess resin during molding or curing. If the prepreg cavity 11 is pre-vacuumed by the prepreg cavity pipe 14 to absorb excess resin, the vacuum or partial vacuum in the prepreg cavity 11 needs to be released before the pressure cavity 12 is filled with the filler, so that the prepreg assembly (i.e. the prepreg) is soft and easy to deform.

[0056] In another embodiment of the present application, the prepreg cavity 11 can be pre-vacuumed by the prepreg cavity pipe 14 to absorb excess resin by vacuum method, so that the prepreg is soft and easy to deform.

[0057] In another embodiment of the present application, the cavity wall of the pressure cavity 12 has elasticity or non-elasticity, and the pressure cavity 12 can be inflated to increase the volume when the filler is filled through the pressure cavity pipe 15. For example, the constituting material of the pressure cavity 12 can be non-deformable material such as fiber, nylon, cloth, polyethylene, polypropylene, etc. plastic, or deformable rubber, silicone, etc., or a combination of the above.

[0058] In another embodiment of the present application, the filler in the pressure cavity 12 is an incompressible liquid or gas, or a solid with fluidity, such as sand, small beads, etc. The pressure cavity 12 is filled with the filler as needed, and after the filler is filled, the pressure cavity 12 is inflated, the volume is increased, and after the filler is released, the volume of the pressure cavity 12 is reduced.

[0059] In another embodiment of the present application, the shape of the pressure cavity 12 can be designed according to the shape of the molding surface of the mold. The edge of the pressure cavity 12 can be linear or curved. The shape enclosed by the edge of the pressure cavity 12 can be square, rectangular, circular, elliptical, heart-shaped, foot-shaped, etc. The pressure cavity 12 can be a single pressure cavity, or can be divided into several pressure cavities, which are connected to each other or independent.

[0060] The pressure cavity pressure plate 13 is a plate with a hardness or rigidity greater than a threshold value, for example, a steel plate, an alloy plate, or a hardwood plate. The pressure cavity pressure plate 13 is located on the outside of the pressure cavity 12, i.e., the pressure cavity pressure plate 13 and the prepreg cavity 11 are located on the two sides of the pressure cavity 12, respectively. For example, the pressure cavity pressure plate 13 can be fixedly arranged or splitly arranged on the outside of the pressure cavity 12. The pressure cavity pressure plate 13 provides a reaction force when the pressure cavity 12 is inflated, so that the pressure cavity 12 is pressed against and contacts the prepreg cavity 11 to provide a force for compression molding.

[0061] The prepreg cavity pipe 14 is also used to evacuate the prepreg cavity 11 to a vacuum state after the pressure cavity 12 is filled with the filler, so as to perform molding or curing.

[0062] The molding surface of the mold can adopt any surface with a certain surface morphology, for example, as shown in Figures 2-4 The molding surfaces of the molds in the embodiments of the present application are different. Figure 2 A cross-sectional view of a curved mold 24 in another embodiment of the present application is shown. The curved mold 24 has a concave-convex curved molding surface 25. Figure 3 A cross-sectional view of a reconfigurable mold 30 in another embodiment of the present application is shown. The reconfigurable mold 30 includes a plurality of positioning lead screws 31 and a molding surface 32, and the curvature of the molding surface 32 is controlled by the positioning lead screws 31. In the manufacture of personalized product designs suitable for the human body, the surface morphology of a certain part of the human body can be directly used as the molding surface, for example, the sole of the human foot can be used as the molding surface, as shown in Figure 4 A cross-sectional view of a human foot mold 41 in another embodiment of the present application is shown. The human foot mold 41 includes a human foot-shaped molding surface 42, and the molding material can be directly stacked on the human foot molding surface 42.

[0063] The molding or curing method can adopt any molding or curing method, such as heating method, pressurizing method, catalyst curing method, etc. In another embodiment of the present application, the curing method can adopt one curing method, or can combine at least two curing methods simultaneously. In another embodiment of the present application, in the catalyst curing method, the catalyst includes photo initiator, thermal initiator, microwave initiator, and other chemical catalysts.

[0064] The thin material molding device of the present embodiment can be combined with different mold molding methods, and different molding or curing methods (such as ultraviolet curing, microwave curing), and has wide application.

[0065] The thin material molding device of the present embodiment can be used for any thin material, any molding surface, and any curing method, or any combination of the above.

[0066] When the thin material molding device of the above embodiment presses the thin material against the molding surface, the pressure cavity can automatically adapt to the curved surface shape of the molding surface, so that the thin material is completely attached to the molding surface, and the thin material is continuously and uniformly pressed with controllable pressure, thereby improving the molding quality.

[0067] For example, as shown in FIG. 5, it is a process flow diagram of a thin material molding method according to another embodiment of the present application. Figure 5

[0068] In step 51, a prepreg assembly is added to the prepreg cavity, and the prepreg cavity is placed above the molding surface.

[0069] The prepreg assembly includes a prepreg, a release layer, and a resin absorption layer. The release layer is placed on the resin absorption layer, and the prepreg is placed on the release layer. That is, the release layer is placed in the order of prepreg, release layer, and resin absorption layer from top to bottom, that is, the release layer is located between the prepreg and the resin absorption layer.

[0070] In another embodiment of the present application, the prepreg assembly includes a prepreg, two release layers, and two resin absorption layers. The prepreg is placed between the two release layers, and one resin absorption layer is placed on the outside of each release layer. For example, the prepreg assembly includes a prepreg, a first release layer, a second release layer, a first resin absorption layer, and a second resin absorption layer. The prepreg is placed between the first release layer and the second release layer, and the first resin absorption layer and the second resin absorption layer are placed on the outside of the first release layer and the second release layer, respectively. That is, the order of the layers from top to bottom is first resin absorption layer, first release layer, prepreg, second release layer, and second resin absorption layer.​

[0071] In another embodiment of the present application, when the light transmittance of the prepreg is greater than or equal to a threshold value, a light source is arranged outside the pressure cavity pressure plate, wherein the light transmittance of the pressure cavity pressure plate, the cavity wall of the prepreg cavity facing the light source, the second release layer facing the light source, and the second resin absorption layer facing the light source are all greater than or equal to a respective light transmittance threshold value or a same light transmittance threshold value, and a photoinitiator is added to the prepreg in the prepreg assembly when the prepreg assembly is added to the prepreg cavity.

[0072] In another embodiment of the present application, after the prepreg assembly is added to the prepreg cavity, the prepreg cavity can also be evacuated to a vacuum or a partial vacuum.

[0073] Step 52, the pressure cavity is arranged between the prepreg cavity and the pressure cavity pressure plate.

[0074] The pressure cavity is a hollow structure and is in communication with the outside through a pressure cavity pipeline, and the cavity wall of the pressure cavity has elasticity; the prepreg cavity is a hollow structure and is in communication with the outside through a prepreg cavity pipeline, and the prepreg cavity adopts a flexible and deformable material.

[0075] In another embodiment of the present application, the pressure cavity pressure plate is movably arranged on one side of the pressure cavity, and the prepreg cavity is arranged on the other side of the pressure cavity.

[0076] Step 53, the pressure cavity is filled with a filler through the pressure cavity pipeline.

[0077] The filling of the pressure cavity with the filler causes the pressure cavity to expand to contact the pressure cavity pressure plate and to be forced by the pressure cavity pressure plate to press against the prepreg cavity, and when the pressure cavity expands to press against and contact the soft prepreg cavity, the prepreg assembly is pressed against the forming surface of the mold.

[0078] In another embodiment of the present application, if the prepreg cavity is evacuated to a vacuum before the pressure cavity is filled with the filler, the vacuum or partial vacuum in the prepreg cavity needs to be released before the pressure cavity is filled with the filler, so that the prepreg assembly is soft and easy to deform.

[0079] Step 54, the prepreg cavity is evacuated to a vacuum for molding or curing.

[0080] In another embodiment of the present application, when the pressure cavity pressure plate is movably arranged on one side of the pressure cavity, the pressure cavity pressure plate can also move towards the pressure cavity, forcing the pressure cavity to press the prepreg assembly towards the forming surface.

[0081] The forming or curing method can adopt any forming or curing method, such as heating method, pressurizing method, catalyst curing method, etc. In another embodiment of the present application, the curing method can adopt one curing method, or can combine at least two curing methods simultaneously. In another embodiment of the present application, in the catalyst curing method, the catalyst includes chemical catalysts such as photo initiator, thermal initiator, microwave initiator, etc.

[0082] If the prepreg is added with photo initiator, the light source can be turned on to make the prepreg form or cure.

[0083] The thin material forming device of the present embodiment can be combined with different mold forming methods, and different forming or curing methods (such as ultraviolet curing, microwave curing), and has wide application.

[0084] The thin material forming device of the present embodiment can be used for any thin material, any forming surface, and any curing method, or any combination of the above methods.

[0085] The thin material forming method described in the above embodiments can automatically adapt to the curved surface shape of the forming surface when the thin material is pressed towards the forming surface, so that the thin material is completely attached to the forming surface. Therefore, the thin material is continuously and uniformly pressed, and the pressure is controllable, thereby improving the forming quality.

[0086] For example, as shown in Figure 6 , it is a structure schematic diagram of the combination of the thin material forming device and the curved mold using the pressurizing curing method in another embodiment of the present application. Figure 1 and Figure 6 Taking the curved mold 24 as an example, the prepreg is pressed towards the pre-formed curved mold 24, and the curing is realized by using the vacuum method. The specific process of realizing the thin material forming by using the pressurizing curing method can be as follows.

[0087] Step 601, sequentially placing the first resin absorption layer 23, the first release layer 22, the prepreg 21, the second release layer 22', and the second resin absorption layer 23' into the prepreg cavity 11, and sealing.

[0088] Optionally, the prepreg cavity 11 can also be partially vacuumed and absorb excess resin through the prepreg cavity pipeline 14, so that the prepreg is soft and easy to deform. Then the prepreg cavity pipeline 14 is closed and sealed.

[0089] In another embodiment of the present application, no vacuum is applied in step 601, and the vacuum can be applied in the subsequent step 604 of molding or curing to absorb the excess resin.

[0090] Step 602, place the pre-preg cavity 11 with the pre-preg inside above the molding surface 25 of the curved mold 24.

[0091] Step 603, place the pressure cavity 12 above the pre-preg cavity 11, and fix the pressure cavity pressure plate 13 above the pressure cavity 12.

[0092] Step 604, fill the pressure cavity 12 with the filler through the pressure cavity pipe 15 until the pre-preg assembly is pressed against the molding surface 25, i.e., the pre-preg 21 in the pre-preg assembly is pressed against the molding surface 25, and then cured.

[0093] For example, the filler is an incompressible liquid or gas, or a solid with fluidity, such as sand, small beads, etc.

[0094] Fill the pressure cavity 12 with the filler through the pressure cavity pipe 15, so that the upper part of the pressure cavity 12 is in contact with the pressure cavity pressure plate 13, and the lower part of the pressure cavity 12 is in contact with the pre-preg cavity 11, which drives the pre-preg 21 to press against the molding surface 25 until the pre-preg 21 is pressed against the molding surface 25, so that the pre-preg 21 forms the shape of the molding surface 25, and the pressure of the pressure cavity 12 is maintained or adjusted according to the situation, and the pre-preg cavity 11 is vacuumed through the pre-preg cavity pipe 14 by the vacuum method until the curing is completed. The entire molding and curing process generally takes a certain amount of time, for example, several hours to several dozen hours.

[0095] In this embodiment, the pre-preg cavity 11 can be subjected to a vacuum absorption treatment in advance, and the entire / partial vacuum of the pre-preg cavity 11 is released to allow the pre-preg to deform freely before the pressure cavity 12 is filled with the filler, for example, the pre-preg cavity pipe 14 is opened, so that the pre-preg cavity 11 is in air or partial air.

[0096] In another embodiment of the present application, after the pressure cavity 12 is filled with the filler, the pressure cavity pressure plate 13 can move towards the pressure cavity 12, forcing the pressure cavity 12 to press the pre-preg assembly (i.e., the pre-preg 21) against the molding surface 25.

[0097] In another embodiment of this application, a heating method can also be used to increase the curing rate. For example, after the prepreg 21 is in close contact with the molding surface 25, the heating source is turned on, the pressure of the pressure chamber 12 is maintained or adjusted as needed, and a vacuum method is used to draw a vacuum through the prepreg chamber pipe 14 to absorb excess resin until curing is complete.

[0098] The thin material forming apparatus described in the above embodiments uses a pressure curing method to press the thin material onto the forming surface. The pressure chamber can automatically adapt to the curved shape of the forming surface, so that the thin material is completely in close contact with the forming surface. Therefore, the thin material is continuously and uniformly pressed and the pressure is controllable, which improves the forming quality.

[0099] like Figure 7 The diagram shown is a schematic representation of a thin material molding apparatus and a reconfigurable mold using a pressure curing method in another embodiment of this application. The prepreg is pressed against the pre-formed reconfigurable mold, and curing is achieved using a vacuum method. Alternatively, a heating method can be used to increase the curing rate. After the prepreg is in close contact with the molding surface of the reconfigurable mold, the pressure in the pressure chamber is maintained or adjusted as needed. A vacuum is then created through the prepreg chamber pipes to absorb excess resin until curing is complete.

[0100] Combination Figure 1 and Figure 7 The specific process of forming thin materials using the pressure curing method can be described as follows.

[0101] Step 701: Control the displacement of each positioning screw 31 to form the required three-dimensional curved surface 32.

[0102] Step 702: The first resin absorption layer 23, the first release layer 22, the prepreg 21, the second release layer 22' and the second resin absorption layer 23' are sequentially placed into the prepreg cavity 11 and then sealed.

[0103] Optionally, the prepreg cavity 11 can be partially evacuated and excess resin absorbed through the prepreg cavity pipe 14, which can make the prepreg soft and easy to deform.

[0104] In another embodiment of this application, vacuuming may not be required in step 702. Instead, vacuuming may be performed during the molding or curing process in subsequent step 706 to absorb excess resin.

[0105] Step 703: Place the prepreg cavity 11 on the molding surface 32 formed by the array of positioning screws 31 of the reconfigurable mold 30.

[0106] Step 704: Place the pressure chamber 12 above the prepreg chamber 11.

[0107] Step 705, the pressure cavity pressure plate 13 is fixed above the pressure cavity 12.

[0108] Step 706, the pressure cavity 12 is filled with a filler to expand, until the prepreg 21 is closely attached to the forming surface 32, and then solidified.

[0109] For example, the filler is an incompressible liquid or gas, or a solid with fluidity, such as sand, small beads, etc.

[0110] For example, the pressure cavity 12 is filled with a filler to expand through the pressure cavity pipe 15, so that the upper part of the pressure cavity 12 is in contact with the pressure cavity pressure plate 13, and the lower part of the pressure cavity 12 is in contact with the prepreg cavity 11, which drives the prepreg 21 to press against the forming surface 32 formed by the reconfigurable mold 30, so that the prepreg 21 is closely attached to the forming surface 32, and the prepreg 21 forms the shape of the forming surface 32. The pressure of the pressure cavity 12 is maintained or adjusted according to the situation, and a vacuum method is used to extract a vacuum through the prepreg cavity pipe 14 to absorb excess resin until the end of solidification. The entire molding and solidification process takes a certain amount of time, for example, several hours to several dozen hours.

[0111] In this embodiment, the prepreg cavity 11 can be subjected to a vacuum extraction process to absorb excess resin in advance, and the entire vacuum / partial vacuum of the prepreg cavity 11 is released before the pressure cavity 12 is filled with a filler, so that the prepreg 21 can deform freely.

[0112] In another embodiment of the present application, after the pressure cavity 12 is filled with a filler, the pressure cavity pressure plate 13 can move towards the pressure cavity 12, forcing the pressure cavity 12 to press the prepreg assembly (i.e. the prepreg 21) against the forming surface 32.

[0113] In another embodiment of the present application, heating can also be combined to improve the solidification rate, for example, after the prepreg 21 is closely attached to the forming surface 32, the heating source is turned on, the pressure of the pressure cavity 12 is maintained or adjusted according to the situation, and a vacuum method is used to extract a vacuum through the prepreg cavity pipe 14 to absorb excess resin until the end of solidification.

[0114] The thin material molding device described in the above embodiments uses a pressurized solidification method to press the thin material against the forming surface of the reconfigurable mold. The pressure cavity can automatically adapt to the curved shape of the forming surface, so that the thin material is completely attached to the forming surface. Therefore, the thin material is continuously and uniformly pressed, and the pressure is controllable, which improves the molding quality.

[0115] For molding materials with good light transmittance (e.g., greater than or equal to the light transmittance threshold), a photoinitiator can be added to the molding material. When the prepreg is pressed into the mold through a pressure chamber, light (e.g., ultraviolet light) is used for curing. In this method, in addition to the prepreg, other devices or materials, such as the pressure chamber, prepreg chamber, resin absorber layer, and resin release layer, should all be made of materials with good light transmittance to improve curing efficiency and curing effect.

[0116] like Figure 8 The diagram shown illustrates the structure of a thin material molding apparatus and a reconfigurable mold using a catalyst curing method in another embodiment of this application. A photoinitiator is added to a prepreg material with good light transmittance (e.g., greater than or equal to a light transmittance threshold). The prepreg is pressed against a pre-formed reconfigurable mold, and curing is achieved using light (e.g., ultraviolet light). Alternatively, a heating method can be used to increase the curing rate. Furthermore, after the prepreg is in close contact with the molding surface of the reconfigurable mold, the pressure in the pressure chamber is maintained or adjusted as needed. A vacuum method is used to create a vacuum through the prepreg chamber pipes to absorb excess resin until curing is complete.

[0117] Combination Figure 1 and Figure 8 The specific process of the catalyst curing method to achieve the forming of thin materials can be described as follows.

[0118] Step 801: Control the displacement of each positioning screw 31 to form the required three-dimensional curved surface 32.

[0119] Step 802: The first resin absorption layer 23, the first release layer 22, the prepreg 21 with photoinitiator, the second release layer 22' and the second resin absorption layer 23' are sequentially placed into the prepreg cavity 11 and then sealed.

[0120] The transmittance of the cavity wall of the prepreg cavity 11 facing the light source 16, the second release layer 22' facing the light source 16, and the second resin absorption layer 23' facing the light source 16 are all greater than or equal to their respective transmittance thresholds or a common transmittance threshold. Optionally, the transmittance of the cavity wall of the prepreg cavity 11, the first resin absorption layer 23, the first release layer 22, the prepreg 21, the second release layer 22', and the second resin absorption layer 23' are all greater than or equal to their respective transmittance thresholds or a common transmittance threshold.

[0121] Optionally, the prepreg cavity 11 can be partially evacuated and excess resin absorbed through the prepreg cavity pipe 14, which can make the prepreg soft and easy to deform.

[0122] In another embodiment of the present application, the step 802 can not be vacuumed, and the vacuuming and absorption of excess resin can be performed during the molding or curing in the subsequent step 807.

[0123] Step 803, the pre-preg cavity 11 is placed on the molding surface 32 formed by the array of positioning lead screws 31 of the reconfigurable mold 30.

[0124] The light transmittance of the pre-preg cavity 11 is greater than or equal to a light transmittance threshold.

[0125] Step 804, the pressure cavity 12 is placed above the pre-preg cavity 11.

[0126] The light transmittance of the pressure cavity 12 is greater than or equal to a light transmittance threshold.

[0127] Step 805, the pressure cavity pressure plate 13 is fixedly placed above the pressure cavity 12.

[0128] The light transmittance of the pressure cavity pressure plate 13 is greater than or equal to a light transmittance threshold.

[0129] Step 806, the light source 16 is placed above the pressure cavity pressure plate 13.

[0130] For example, the light source 16 can be an ultraviolet light source.

[0131] Step 807, the pressure cavity 12 is inflated by filling the filling material, until the pre-preg 21 is closely attached to the molding surface 32, and the light source 16 is turned on for curing.

[0132] For example, the filling material can be an incompressible liquid or gas, or a solid with fluidity, such as sand, small beads, etc.

[0133] For example, the pressure cavity 12 is inflated by filling the filling material through the pressure cavity pipe 15, so that the upper part of the pressure cavity 12 contacts the pressure cavity pressure plate 13, and the lower part of the pressure cavity 12 contacts the pre-preg cavity 11, which drives the pre-preg 21 to press against the molding surface 32 formed by the reconfigurable mold 30, so that the pre-preg 21 is closely attached to the molding surface 32, and the pre-preg 21 forms the shape of the molding surface 32. The light source 16 is turned on to emit light, for example, ultraviolet light. The pressure of the pressure cavity 12 is maintained or adjusted according to the situation. The vacuum method can also be used to vacuum through the pre-preg cavity pipe 14, and the excess resin is absorbed until the curing is completed. In this embodiment, in order to emit light uniformly, the light source 16 can be a flat panel light source. The entire molding and curing process requires a certain time, for example, several minutes to tens of minutes.

[0134] In this embodiment, the prepreg cavity 11 can be pre-vacuumed to absorb excess resin, and the prepreg cavity 11 can be completely or partially evacuated before the pressure cavity 12 is filled with filler so that the prepreg 21 can be freely deformed.

[0135] In another embodiment of this application, after the pressure cavity 12 is filled with filler, the pressure plate 13 of the pressure cavity can move toward the pressure cavity 12, forcing the prepreg assembly (i.e., driving the prepreg 21) of the pressure cavity 12 to press against the molding surface 32.

[0136] In another embodiment of this application, a heating method can be combined to increase the curing rate. For example, after the prepreg 21 is in close contact with the molding surface 32, the light source 16 is turned on to emit light and the heating source is turned on. The pressure of the pressure chamber 12 is maintained or adjusted as needed. The vacuum method is used to draw a vacuum through the prepreg chamber pipe 14 to absorb excess resin until curing is complete.

[0137] The thin material forming apparatus described in the above embodiments uses a catalyst curing method to press the thin material onto the forming surface of a reconfigurable mold. The pressure chamber can automatically adapt to the curved shape of the forming surface, so that the thin material is completely in close contact with the forming surface. Therefore, the thin material is continuously and uniformly pressed and the pressure is controllable, which improves the forming quality.

[0138] like Figure 9 The diagram shown is a schematic representation of a thin material molding apparatus and a human foot mold combined using a catalyst curing method in another embodiment of this application. In this embodiment, the human foot mold is placed on the thin material molding apparatus. A photoinitiator is added to a prepreg of molding material with good light transmittance (e.g., greater than or equal to the light transmittance threshold). The prepreg is pressed against the pre-molded human foot mold, and curing is achieved using light (e.g., ultraviolet light). Alternatively, a heating method can be used to increase the curing rate. Furthermore, after the prepreg is in close contact with the molding surface of the human foot mold, the pressure in the pressure chamber is maintained or adjusted as needed. A vacuum method is used to create a vacuum through the prepreg chamber pipe to absorb excess resin until curing is complete.

[0139] The specific process of using the catalyst curing method to achieve the forming of thin materials can be described as follows.

[0140] Step 901: The second resin absorption layer 23', the second release layer 22', the prepreg 21 with photoinitiator, the first release layer 22 and the first resin absorption layer 23 are sequentially placed into the prepreg cavity 11 and then sealed.

[0141] The light transmittance of the cavity wall of the prepreg cavity 11 facing the light source 17, the second peeling layer 22' facing the light source 17, and the second resin absorption layer 23' facing the light source 17 are all greater than or equal to a respective light transmittance threshold or a same light transmittance threshold. Optionally, the light transmittance of the cavity wall of the prepreg cavity 11, the first resin absorption layer 23, the first peeling layer 22, the prepreg 21, the second peeling layer 22', and the second resin absorption layer 23' are all greater than or equal to a respective light transmittance threshold or a same light transmittance threshold.

[0142] Optionally, the prepreg cavity 11 can also be partially vacuumed and absorb excess resin through the prepreg cavity pipe 14, so as to meet the requirements of softness and easy deformation of the prepreg.

[0143] In another embodiment of the present application, the vacuuming in step 901 can be omitted, and the vacuuming and absorption of excess resin can be performed during the molding or curing in subsequent step 907.

[0144] Step 902, place the light-emitting surface of the light source 17 upward.

[0145] For example, the light source 17 can be an ultraviolet light source.

[0146] Step 903, fix the pressure cavity pressure plate 13 above the light source 17.

[0147] The light transmittance of the pressure cavity pressure plate 13 is greater than or equal to a light transmittance threshold.

[0148] Step 904, place the pressure cavity 12 above the pressure cavity pressure plate 13.

[0149] The light transmittance of the pressure cavity 12 is greater than or equal to a light transmittance threshold.

[0150] Step 905, place the prepreg cavity 11 above the pressure cavity 12.

[0151] Step 906, place the human foot bottom mold 41 above the prepreg cavity 11.

[0152] Step 907, inflate the pressure cavity 12 with a filler until the prepreg 21 closely adheres to the molding surface 32, and turn on the light source 17 for curing.

[0153] For example, the filler can be an incompressible liquid or gas, or a solid with fluidity, such as sand, small beads, etc.

[0154] In the embodiment, before the pressure cavity 12 is filled with the filler, the vacuum / partial vacuum in the prepreg cavity 11 is released, so that the prepreg is soft and easy to deform.

[0155] For example, the pressure cavity 12 is inflated by filling the filler through the pressure cavity pipe 15, so that the lower part of the pressure cavity 12 is in contact with the pressure cavity pressure plate 13, and the upper part of the pressure cavity 12 is in contact with the prepreg cavity 11, which drives the prepreg 21 to press against the forming surface 42 formed by the human foot mold 41, so that the prepreg 21 is tightly attached to the forming surface 42, and the prepreg 21 forms the shape of the forming surface 42. The light source 17 is turned on to emit light, for example, ultraviolet light, and the pressure of the pressure cavity 12 is maintained or adjusted according to the situation. Alternatively, a vacuum method can be used to draw a vacuum through the prepreg cavity pipe 14 to absorb excess resin until the curing is completed. In the embodiment, the light source 17 can be a flat panel light source to emit light uniformly. The entire molding and curing process requires a certain amount of time, for example, several minutes to tens of minutes.

[0156] In another embodiment of the present application, after the shape of the prepreg is fixed by drawing a vacuum in the prepreg cavity 11, the human foot can be removed, and then the light source 17 is turned on until the curing is completed.

[0157] In another embodiment of the present application, after the pressure cavity 12 is filled with the filler, the pressure cavity pressure plate 13 can move towards the pressure cavity 12 to force the pressure cavity 12 to press the prepreg assembly (i.e., the prepreg 21) against the forming surface 32.

[0158] In another embodiment of the present application, heating can also be combined to improve the curing rate. For example, after the prepreg 21 is closely attached to the forming surface 32, the light source 17 is turned on to emit light, and a heating source is turned on. The pressure of the pressure cavity 12 is maintained or adjusted according to the situation. A vacuum method is used to draw a vacuum through the prepreg cavity pipe 14 to absorb excess resin until the curing is completed.

[0159] The thin material molding device described in the above embodiments uses a catalyst curing method to press the thin material against the forming surface of the human foot mold. The pressure cavity can automatically adapt to the curved shape of the forming surface of the human foot mold, so that the thin material is completely attached to the forming surface of the human foot mold. Therefore, the thin material is continuously and uniformly pressed, and the pressure is controllable, which improves the molding quality.

[0160] In summary, the thin material forming device described in the above embodiments can use various curing methods (heating method, pressurization method, catalyst curing method or at least two curing methods combined simultaneously) to press the thin material against the forming surface of the mold. The pressure cavity can automatically adapt to the irregular surface morphology of the forming surface, so that the thin material is completely attached to the forming surface. Therefore, the thin material is continuously and uniformly pressed, and the pressure is controllable, thereby improving the forming quality.

[0161] The present specification discloses the present application using examples, one or more examples of which are described or illustrated in the specification and drawings. Each example is provided to explain the present application and is not intended to limit the present application. In fact, it is obvious to those skilled in the art that various modifications and variations can be made to the present application without departing from the scope or spirit of the present application. For example, the features illustrated or described as part of one embodiment can be used with another embodiment to produce a further embodiment. Therefore, it is intended that the present application encompass modifications and variations of the application within the scope of the appended claims and their equivalents.

[0162] The preferred embodiments of the present application are described in detail above. It should be understood that those of ordinary skill in the art can make various modifications and changes to the present application without departing from the concept of the present application. Therefore, any technical solutions obtained by logical analysis, reasoning or limited experiments based on the concept of the present application in the prior art should be within the protection scope defined by the claims.

Claims

1. A thin material forming apparatus characterized by comprising: The application relates to a pre-impregnated material molding device. The pre-impregnated material cavity is a hollow structure and is configured to accommodate a pre-impregnated material assembly. The pressure cavity is a hollow structure and is configured to be filled with a flowable filler and to expand as the filler is filled. The pressure cavity is located between the pre-impregnated material cavity and the pressure cavity pressure plate and is in contact with the pre-impregnated material cavity and the pressure cavity pressure plate after expansion, so that the pre-impregnated material cavity is in contact with the molding surface of a mold. The pre-impregnated material cavity is in communication with the outside through a pre-impregnated material cavity pipe, the pre-impregnated material cavity is provided with a pre-impregnated material assembly, the pre-impregnated material cavity is made of a flexible and deformable material, and the pre-impregnated material cavity pipe is used for air extraction and sealing of the pre-impregnated material cavity. The pressure cavity is in communication with the outside through a pressure cavity pipe, the pressure cavity pipe is used for filling the pressure cavity with a filler, so that the pressure cavity can be expanded to be in contact with the pressure cavity pressure plate, and when the pressure cavity is expanded and contacted with the pre-impregnated material cavity, the pre-impregnated material assembly can be pressed against the molding surface. The pressure cavity pressure plate is located on one side of the pressure cavity and provides a reaction force when the pressure cavity is expanded, so that when the pressure cavity is pressed against and contacted with the pre-impregnated material cavity, a molding force is provided. The pre-impregnated material cavity pipe is also used for air release or further vacuum extraction of the pre-impregnated material cavity after the pressure cavity is filled with the filler, so that molding or curing is performed.

2. The thin material forming apparatus according to claim 1, wherein The pre-impregnated material assembly comprises a pre-impregnated material, a peel-off layer and a resin absorption layer, and the pre-impregnated material, the peel-off layer and the resin absorption layer are sequentially stacked from top to bottom in the order of the pre-impregnated material, the peel-off layer and the resin absorption layer. The pre-impregnated material assembly comprises a pre-impregnated material, two peel-off layers and two resin absorption layers, and the pre-impregnated material, the two peel-off layers and the two resin absorption layers are sequentially stacked from top to bottom in the order of the first resin absorption layer, the first peel-off layer, the pre-impregnated material, the second peel-off layer and the second resin absorption layer.

3. The thin material forming apparatus according to claim 2, wherein The pre-impregnated material comprises a thermoplastic material pre-impregnated material, a thermosetting material pre-impregnated material or a composite material pre-impregnated material.

4. The thin material forming apparatus according to claim 1, wherein The pre-impregnated material cavity pipe is also used for vacuum extraction of the pre-impregnated material cavity after the pre-impregnated material cavity is provided with the pre-impregnated material assembly, and the vacuum or partial vacuum in the pre-impregnated material cavity is released before the pressure cavity is filled with the filler, so that the pre-impregnated material assembly is soft and easy to deform.

5. The thin material forming apparatus of claim 1, wherein The pressure cavity pressure plate is fixedly arranged on the outside of the pressure cavity and is located on the two sides of the pressure cavity together with the pre-impregnated material cavity.

6. The thin material forming apparatus of claim 1, wherein The pressure cavity pressure plate is movably arranged on one side of the pressure cavity and can move towards the pressure cavity after the pressure cavity is filled with the filler, so that the pressure cavity drives the pre-impregnated material assembly to press against the molding surface.

7. The thin material forming apparatus of claim 1, wherein When the transmittance of the prepreg is greater than or equal to a threshold value, the prepreg is added with a photoinitiator, and a light source is arranged outside the pressure cavity pressure plate, wherein the transmittance of the pressure cavity pressure plate, the cavity wall of the prepreg cavity facing the light source, the release layer facing the light source, and the resin absorption layer facing the light source are all greater than or equal to a respective transmittance threshold value or a same transmittance threshold value, and the light source is turned on during curing.

8. The thin material forming apparatus according to any one of claims 1 to 7, wherein The filler is an incompressible liquid or gas, or a solid with fluidity.

9. The thin material forming apparatus according to any one of claims 1 to 7, wherein The forming surface includes one or more of the following surfaces: a general curved surface, a reconfigurable curved surface, and a surface of a specific part of a human body.

10. A method of forming a thin material, characterized by, The method includes the following steps: adding a prepreg assembly to the prepreg cavity and placing the prepreg cavity above the forming surface of the mold; placing the pressure cavity between the prepreg cavity and the pressure cavity pressure plate; filling the pressure cavity with a filler through the pressure cavity pipeline; vacuumizing the prepreg cavity for forming or curing; vacuumizing or partially vacuumizing the prepreg cavity after adding the prepreg assembly to the prepreg cavity; and before the pressure cavity is filled with the filler, releasing the vacuum or partial vacuum in the prepreg cavity so that the prepreg assembly is soft and easy to deform.

11. The method of claim 10, wherein: the prepreg cavity is a hollow structure and is connected to the outside through a prepreg cavity pipeline, and the prepreg cavity is made of a flexible and deformable material; the pressure cavity is a hollow structure and is connected to the outside through a pressure cavity pipeline, wherein the pressure cavity is filled with a filler through the pressure cavity pipeline to expand to contact the pressure cavity pressure plate and provide a reaction force from the pressure cavity pressure plate to force the pressure cavity to press against the prepreg cavity, and the expansion of the pressure cavity to press against and contact the prepreg cavity causes the prepreg assembly to press against the forming surface of the mold.

12. The thin material forming method according to Claim 10, wherein the prepreg assembly includes a prepreg, a release layer, and a resin absorption layer, and the layers are stacked in the following order from top to bottom: prepreg, release layer, and resin absorption layer; or the prepreg assembly includes a prepreg, two release layers, and two resin absorption layers, and the layers are stacked in the following order from top to bottom: first resin absorption layer, first release layer, prepreg, second release layer, and second resin absorption layer.

13. The thin material forming method according to Claim 12, wherein the prepreg includes a thermoplastic material prepreg, a thermosetting material prepreg, or a composite material prepreg.

14. The thin material forming method according to Claim 10, wherein Further comprising: after the pressure cavity is filled with the filler, the pressure cavity pressure plate moves towards the pressure cavity to force the pressure cavity to press the prepreg assembly against the forming surface, wherein the pressure cavity pressure plate is movably arranged on one side of the pressure cavity.

15. The thin material forming method according to Claim 10, wherein Further comprising: when the prepreg assembly is added to the prepreg cavity, a photoinitiator is added to the prepreg in the prepreg assembly; and a light source is turned on to cause the prepreg to form or cure, wherein the light source is arranged outside the pressure cavity pressure plate. wherein the pre-preg has a light transmittance greater than or equal to a threshold value, and the pressure chamber pressure plate, the cavity wall of the pre-preg cavity facing the light source, the release layer facing the light source, and the resin absorption layer facing the light source each have a light transmittance greater than or equal to a respective light transmittance threshold value or a common light transmittance threshold value.

16. The thin material forming method according to any one of claims 10 to 15, wherein The step of evacuating the pre-preg cavity to a vacuum for molding or curing further comprises molding or curing using one or more of the following curing methods: pressurization, heating, catalyst.

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