System and method for semiconductor process

Abstract

This document provides systems and methods for semiconductor manufacturing processes, wherein the amount or concentration of a chemical in a chemical mixture contained in a water tank is automatically controlled based on sensed properties of the chemical mixture. In some embodiments, the semiconductor manufacturing system includes a processing water tank configured to contain a chemical mixture. A chemical sensor is configured to sense one or more properties of the chemical mixture. The system further includes an electrically controlled valve configured to adjust the amount of a first chemical in the chemical mixture based on one or more sensed properties of the chemical mixture.

Description

Technical Field

[0001] The present disclosure relates to a system and method for semiconductor manufacturing process. Background Art

[0002] Wet chemical processing tanks are used in various semiconductor manufacturing processes. For example, chemical processing tanks are used to etch semiconductor wafers or structures, remove etch residues, and remove photoresist from semiconductor wafers or structures. The wet chemicals contained in the processing tanks often include a mixture of two or more chemicals. Summary of the invention

[0003] According to some embodiments of the present disclosure, a semiconductor process system includes a process tank, a chemical sensor, and an electronically controlled valve. The process tank is configured to contain a chemical mixture, the chemical mixture including a first chemical. The chemical sensor is configured to sense one or more properties of the chemical mixture. The electronically controlled valve is configured to adjust an amount of the first chemical in the chemical mixture based on the sensed one or more properties of the chemical mixture.

[0004] According to some embodiments of the present disclosure, a method for semiconductor manufacturing includes the following steps: sensing one or more properties of a chemical mixture in a process water tank by a chemical sensor; and controlling the amount of a first chemical in the chemical mixture by selectively operating an electric control valve based on the sensed one or more properties of the chemical mixture by a control circuit system.

[0005] According to some embodiments of the present disclosure, a system for semiconductor processing includes a plurality of process tanks, a chemical sensor, a plurality of first inlet valves, and a control circuit system. The process tanks are configured to contain a chemical mixture. The chemical sensor is configured to sense one or more properties of the chemical mixture in each of the process tanks. Each of the first inlet valves is coupled between a supplier of a first liquid and an interior of a respective process tank of the process tanks. The control circuit system is communicatively coupled to the chemical sensor and the first inlet valves, and the control circuit system is configured to automatically adjust an amount of the first liquid in the chemical mixture by selectively operating the first inlet valves based on the sensed one or more properties of the chemical mixture. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The aspects of the present disclosure can be better understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard industry practice, various features are not drawn to scale. In fact, the size of each feature may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1 is a schematic diagram illustrating an automatic concentration control system according to some embodiments;

[0008] Figure 2 is a schematic diagram illustrating another automatic concentration control system according to some embodiments;

[0009] Figure 3 is a schematic diagram illustrating yet another automatic concentration control system according to some embodiments;

[0010] Figure 4 FIG. 1 is a schematic diagram illustrating further details of a control circuit system according to some embodiments. The control circuit system may include Figures 1 to 3 In any of the automatic concentration control systems;

[0011] Figure 5 A flow chart illustrating a method of automatically controlling chemical amounts of a chemical mixture in a process tank according to some embodiments.

[0012]

Explanation of symbols

[0013] 10: Automatic concentration control system

[0014] 12:Sink

[0015] 13: Bottom wall

[0016] 14: Outer wall

[0017] 15: Inner wall

[0018] 16: Inside the sink

[0019] 17: Overflow Space

[0020] 20: Chemical mixture

[0021] 21: First inlet conduit

[0022] 22: Second inlet conduit

[0023] 23: First inlet valve

[0024] 24: Second inlet valve

[0025] 25: First liquid supplier

[0026] 26: Second liquid supplier

[0027] 30: Circulation loop

[0028] 31: outlet conduit

[0029] 32: Pump

[0030] 33: Third inlet conduit

[0031] 34: Heater

[0032] 36: Filter

[0033] 38: Chemical Sensors

[0034] 43: Outlet valve

[0035] 44: Third inlet valve

[0036] 46: Discharge valve

[0037] 51: Circulation loop catheter

[0038] 52: Circulation loop catheter

[0039] 53: Circulation loop catheter

[0040] 54: Circulation loop catheter

[0041] 55: discharge duct

[0042] 60: Control circuit system

[0043] 62: Controller

[0044] 64: Communication Center

[0045] 66: Circuit System

[0046] 71: Output signal

[0047] 72: Valve control signal

[0048] 73: Status information signal

[0049] 101: First supply valve

[0050] 102: Second supply valve

[0051] 110: System

[0052] 112a:Sink

[0053] 112b:Sink

[0054] 112c: sink

[0055] 112d: sink

[0056] 121: First inlet conduit

[0057] 122: Second inlet conduit

[0058] 123a: First inlet valve

[0059] 123b: First inlet valve

[0060] 123c: First inlet valve

[0061] 123d: First inlet valve

[0062] 124a: Second inlet valve

[0063] 124b: Second inlet valve

[0064] 124c: Second inlet valve

[0065] 124d: Second inlet valve

[0066] 125: first liquid supplier

[0067] 126: Second liquid supplier

[0068] 130: Circulation loop

[0069] 131:Export duct

[0070] 133: Third inlet conduit

[0071] 143a: outlet valve

[0072] 143b: outlet valve

[0073] 143c: outlet valve

[0074] 143d: outlet valve

[0075] 144a: Third inlet valve

[0076] 144b: Third inlet valve

[0077] 144c: Third inlet valve

[0078] 144d: Third inlet valve

[0079] 146: Discharge valve

[0080] 155: discharge duct

[0081] 210: Automatic concentration control system

[0082] 237a: Chemical sensing channel

[0083] 237b: Chemical sensing channel

[0084] 237c: Chemical sensing channel

[0085] 237d: Chemical sensing channel

[0086] 238:Chemical Sensors

[0087] 410: Electric control valve

[0088] 500:Flowchart

[0089] 502: Operation

[0090] 504: Operation DETAILED DESCRIPTION

[0091] The following disclosure provides many different embodiments or examples to achieve the different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these examples are only examples and are not intended to be restrictive. For example, the formation of a first feature above or on a second feature in the subsequent description may include an embodiment in which the first and second features are formed as direct contacts, and may also include an embodiment in which additional features may be formed between the first and second features so that the first and second features may not be in direct contact. In addition, the present disclosure may repeat component symbols and / or letters in each example. This repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or configurations discussed.

[0092] Additionally, spatially relative terms, such as "below," "beneath," "lower," "above," "upper," and the like, may be used herein for convenience in describing the relationship of one element or feature to another element(s) or feature(s) illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the element in use or operation in addition to the orientation depicted in the figures. The device may be oriented differently (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted similarly accordingly.

[0093] The present application relates to a semiconductor process system and method having an electronically controlled valve for automatically adjusting the amount or concentration of a chemical (such as water) in a chemical mixture in a processing tank.

[0094] In some wet chemical processing systems, one or more valves (such as chemical concentration valves, etc.) are included that allow the amount of chemical flowing into the chemical mixture contained in the processing water tank to be adjusted. The moisture or water content of the chemical mixture in the semiconductor process water tank is usually adjusted by manually operating a valve that controls the water content in the mixture. Generally speaking, the operator manually checks the chemical concentration through a chemical concentration meter (such as a chemical concentration meter purchased from Horiba Semiconductor). When adjusting the valve, the moisture or water content is monitored to determine whether the adjustment is correct or appropriate. Once the operator finds that the concentration is unacceptable (for example, tending upward or downward), the operator manually adjusts the valve to regulate the flow of chemicals into the processing water tank. In terms of manpower, this is expensive and time-intensive.

[0095] In various embodiments, the present disclosure provides systems and methods in which a chemical sensor senses one or more properties of a chemical (e.g., water or moisture) in a chemical mixture within a process tank, and an electronically controlled valve is included and utilized to automatically adjust the amount of a chemical in a chemical mixture based on the properties of the chemical sensed in the chemical mixture.

[0096] In some embodiments, the chemical mixture in the treatment tank is an etch residue remover or photoresist stripper for removing residue or photoresist, and the chemical sensor senses the amount or concentration of water or moisture in the chemical mixture. Due to the water content monitoring and automatic concentration adjustment facilitated by the embodiments of the present disclosure, the amount of moisture or water in the chemical mixture is precisely controlled.

[0097] Figure 1 A schematic diagram of an automatic concentration control system 10 (hereinafter referred to as system 10 ) for use, for example, in a semiconductor manufacturing process is shown according to one or more embodiments of the present disclosure. Figure 1 The automatic concentration control system 10 shown in the figure can be used or combined with any semiconductor process tool, such as a cleaning tool, a photoresist removal tool, an etching-related semiconductor process tool, such as a wet etching tool, or the like, for example; however, the embodiments of the present disclosure are not limited thereto. In various embodiments, the automatic concentration control system 10 can be any system having one or more tanks containing a chemical mixture, wherein the concentration of the chemical mixture is controlled using automatic concentration control.

[0098] The automatic concentration control system 10 includes a water tank 12. The water tank 12 includes a bottom wall 13 and an outer side wall 14 extending upward from the bottom wall 13. In some embodiments, the water tank 12 includes an inner side wall 15 extending upward from the bottom wall 13 and laterally spaced inward relative to the outer side wall 14. In some embodiments, the inner side wall 15 defines a water tank interior 16 configured to hold a chemical mixture 20. The water tank 12 is Figure 1 However, the embodiments are not limited thereto. In various embodiments, the tank 12 may have any shape suitable for containing or retaining a large amount of chemical mixture 20, including, for example, a cylindrical shape, or any other shape.

[0099] The chemical mixture 20 may be any chemical mixture, for example, any liquid chemical mixture that can be used in semiconductor processes, such as for cleaning or removing photoresist from semiconductor wafers. In some embodiments, the water tank 12 contains or is configured to contain a liquid chemical mixture 20 for removing photoresist. In some embodiments, the chemical mixture 20 is an etch residue remover and a positive photoresist stripper, which may be an amine-based liquid chemical mixture, a hydrofluoric (HF) acid-based liquid chemical mixture, or any other liquid chemical mixture suitable for use in semiconductor processes.

[0100] In some embodiments, the sink 12 includes an overflow space 17 between the inner sidewall 15 and the outer sidewall 14. When some chemical mixture 20 will overflow the sink interior 16, the overflow space 17 contains the chemical mixture 20, thereby preventing the chemical mixture 20 from overflowing outside the sink 12.

[0101] The system 10 includes a first inlet conduit 21 and a second inlet conduit 22. The first liquid is introduced into the water tank interior 16 via the first inlet conduit 21, and the second liquid is introduced into the water tank interior 16 via the second inlet conduit 22. A first inlet valve 23 is communicatively coupled between a first liquid supplier 25 and the first inlet conduit 21, and a second inlet valve 24 is communicatively coupled between a second liquid supplier 26 and the second inlet conduit 22. One or more pumps (not shown) are included in the system 10 for conveying and supplying the flow rates of the first liquid and the second liquid into the water tank 12.

[0102] Each of the first liquid and the second liquid may be a constituent liquid of the chemical mixture 20, and in some embodiments, the chemical mixture 20 is composed of a homogeneous mixture of the first liquid and the second liquid. In some embodiments, the first liquid comprises a liquid chemistry for removing photoresist. In some embodiments, the first liquid comprises an etch residue remover or a positive photoresist stripper liquid chemistry, which may be an amine-based liquid chemical mixture, a hydrofluoric (HF) acid-based liquid chemical mixture, or any other liquid chemistry suitable for use in semiconductor processes. In some embodiments, the second liquid is water or deionized (DI) water.

[0103] The end of the first inlet conduit 21 is positioned within the tank interior 16, and in some embodiments, the end of the first inlet conduit 21 is positioned adjacent to the bottom wall 13 of the tank 12. Similarly, the end of the second inlet conduit 22 is positioned within the tank interior 16, and in some embodiments, the end of the second inlet conduit 22 is positioned adjacent to the bottom wall 13 of the tank 12.

[0104] The system 10 further includes a circulation loop 30 through which the chemical mixture 20 can pass from an outlet conduit 31 communicatively coupled to the interior of the tank 16 via a third inlet conduit 33. In some embodiments, an end of the outlet conduit 31 is positioned adjacent to the bottom wall 13 of the tank 12. In some embodiments, the circulation loop 30 mixes the chemical mixture 20, for example by recirculating and mixing the first and second liquids of the chemical mixture 20 through the circulation loop 30.

[0105] In some embodiments, the circulation loop 30 includes a pump 32, a heater 34, and a filter 36 communicatively coupled between the outlet conduit 31 and the third inlet conduit 33. In addition, the circulation loop 30 may include an outlet valve 43 and a third inlet valve 44. A plurality of circulation loop conduits 51, 52, 53, 54 are included in the circulation loop 30 and communicatively couple the components of the circulation loop 30 to each other, such as Figure 1 Picture.

[0106] In some embodiments, the pump 32 is communicatively coupled to the outlet valve 43 via a first circulation loop conduit 51, and the heater 34 is communicatively coupled to the outlet of the pump 32 via a second circulation loop conduit 52. In some embodiments, the filter 36 is communicatively coupled to the outlet of the heater 34 via a third circulation loop conduit 53, and the outlet of the filter 36 is communicatively coupled to the third inlet valve 44 via a fourth circulation loop conduit 54.

[0107] In operation, the pump 32 conveys a flow of the chemical mixture 20 from the water tank interior 16 through the outlet conduit 31, the pump 32, the heater 34, the filter 36, the plurality of circulation loop conduits 51, 52, 53, 54, and back to the water tank interior 16 through the third inlet conduit 33. In this way, the liquid components of the chemical mixture 20 (e.g., the first and second liquids) that are separately added to the water tank interior 16 through the first and second inlet conduits 21, 22 are thoroughly mixed via the circulation loop 30 to provide a substantially homogeneous liquid chemical mixture 20.

[0108] In some embodiments, filter 36 is operable to filter out contaminants, unwanted particles, or the like that may be present in chemical mixture 20 as it is conveyed out via circulation loop 30. Filter 36 may be any suitable filter for filtering such contaminants or unwanted particles from chemical mixture 20, and the filter characteristic curve may be variously selected based on, for example, the size, type, chemical composition, characteristics, or the like of the contaminants or particles being filtered out or otherwise removed from chemical mixture 20.

[0109] In some embodiments, heater 34 heats chemical mixture 20 to a selected temperature as chemical mixture 20 is transported through circulation loop 30. Heater 34 may be any suitable heater for heating chemical mixture 20 and may heat chemical mixture 20 to any selected temperature.

[0110] In some embodiments, the system 10 includes a bleed valve 46 communicatively coupled between the circulation loop 30 (eg, the second circulation loop conduit 52) ​​and the bleed conduit 55. The bleed valve 46 is operable to selectively bleed some of the chemical mixture 20 flowing through the circulation loop 30.

[0111] The system 10 further includes a chemical sensor 38 and a control circuit system 60 electrically coupled to the chemical sensor 38. The chemical sensor 38 may be any sensor operable to sense one or more properties of the chemical mixture 20. In some embodiments, the chemical sensor 38 is a chemical concentration monitor operable to sense the concentration of one or both of the first and second liquid chemicals in the chemical mixture 20. In some embodiments, the second liquid is water, and the chemical sensor 38 is a chemical concentration monitor operable to sense the concentration of water in the chemical mixture 20. In some embodiments, the chemical sensor 38 is a chemical concentration monitor that uses ultraviolet (UV) and near infrared (NIR) absorption spectroscopy to measure multiple components of the chemical mixture 20 in real time.

[0112] In some embodiments, the chemical sensor 38 may be configured to sense any marker associated with water or moisture in the chemical mixture 20. In some embodiments, the chemical sensor 38 may be a water concentration sensor, a water resistance sensor, etc. In some embodiments, the chemical sensor 38 senses the amount or concentration of water or moisture in the chemical mixture 20 by sensing or detecting the electrical properties (e.g., conductivity, resistance, etc.) of the chemical mixture 20. The electrical properties of the chemical mixture 20 may be associated with the amount of water or moisture in the chemical mixture 20 so that the amount or concentration of water or moisture in the chemical mixture 20 may be determined or estimated based on the electrical properties of the chemical mixture.

[0113] Control circuitry 60 receives an output signal from chemical sensor 38 that is indicative of a sensed property of chemical mixture 20. For example, in some embodiments, the output signal received from chemical sensor 38 is indicative of a concentration of a second liquid (eg, water) present in chemical mixture 20.

[0114] In some embodiments, at least one of the first inlet valve 23, the second inlet valve 24, the third inlet valve 44, the outlet valve 43, or the exhaust valve 46 is an electrically controlled valve operable to selectively control or adjust the flow of fluid in the system 10. The control circuit system 60 is electrically coupled or communicatively coupled to at least one of the first inlet valve 23, the second inlet valve 24, the third inlet valve 44, the outlet valve 43, or the exhaust valve 46, and the control circuit system 60 is operable to control actuation of these valves based on an output signal from the chemical sensor 38 indicating a sensed property of the chemical mixture 20.

[0115] For example, in some embodiments, the first inlet valve 23 is an electrically controlled valve that is controllable based on a control signal output by the control circuit system 60, and the control circuit system 60 can control the amount of the first liquid flowing through the first inlet valve 23 based on a sensed property of the chemical mixture 20 (e.g., based on the concentration of the first liquid or the second liquid in the chemical mixture 20). Thus, operation of the first inlet valve 23 can adjust one or more properties of the chemical mixture 20, such as by adjusting the concentration of the first liquid in the chemical mixture 20.

[0116] In some embodiments, the second inlet valve 24 is an electrically controlled valve that is controllable based on a control signal output by the control circuit system 60, and the control circuit system 60 can control the amount of the second liquid flowing through the second inlet valve 24 based on a sensed property of the chemical mixture 20 (e.g., based on the concentration of the second liquid in the chemical mixture 20). In some embodiments, the second liquid is water or DI water, and the control circuit system 60 controls the amount of DI water flowing through the second inlet valve 24 and into the water tank 12 based on the sensed concentration of water in the chemical mixture 20. Thus, operation of the second inlet valve 24 can adjust one or more properties of the chemical mixture 20, such as by adjusting the concentration of the second liquid in the chemical mixture 20. For example, by selectively opening the second inlet valve 24, a desired amount of DI water can be introduced into the chemical mixture 20, thereby increasing the concentration of DI water in the chemical mixture 20.

[0117] Similarly, the third inlet valve 44, the outlet valve 43, and the drain valve 46 may be electrically controlled valves that may be controlled based on control signals output by the control circuit system 60. The control circuit system 60 may control the amount of the chemical mixture 20 that is recirculated back into the water tank 12, for example, by selectively controlling the operation of the third inlet valve 44. The control circuit system 60 may control the amount of the chemical mixture 20 that flows into the circulation loop 30, for example, by selectively controlling the operation of the outlet valve 43. The control circuit system 60 may control the amount of the chemical mixture 20 that is discharged from the system 10, for example, by selectively controlling the operation of the drain valve 46.

[0118] In some embodiments, the control circuit system 60 automatically controls the operation of one or more of the first inlet valve 23, the second inlet valve 24, the third inlet valve 44, the outlet valve 43, or the exhaust valve 46 based on the output signal of the chemical sensor 38 indicating the sensed property of the chemical mixture 20.

[0119] The first inlet valve 23, the second inlet valve 24, the third inlet valve 44, the outlet valve 43, and the exhaust valve 46 can be selectively controlled to have any position between and including the fully open position and the fully closed position. Thus, based on one or more sensed properties of the chemical mixture 20, the amount of flow through any of the first inlet valve 23, the second inlet valve 24, the third inlet valve 44, the outlet valve 43, and the exhaust valve 46 is precisely controlled through automatic control provided by the self-control circuit system 60.

[0120] By selectively and automatically controlling one or more of the first inlet valve 23, the second inlet valve 24, the third inlet valve 44, the outlet valve 43, and the exhaust valve 46, the chemical mixture 20 can be precisely controlled to have a uniform and consistent chemical composition as needed, for example based on the method used for a specific semiconductor process performed using the chemical mixture 20.

[0121] In some embodiments, the chemical mixture 20 includes some amount of water or moisture, such as DI water, which can be a second liquid in the chemical mixture 20. In some embodiments, the amount of DI water in the chemical mixture 20 is precisely controlled so that the DI water makes up a desired percentage of the chemical mixture 20. The amount of DI water in the chemical mixture 20 can be selected as desired, for example, depending on the specific semiconductor process to be performed by the chemical mixture 20. In some embodiments, the amount of the second liquid (e.g., DI water) is maintained at a level within 1% deviation of a threshold level by automatically controlling one or more of the first inlet valve 23, the second inlet valve 24, the third inlet valve 44, the outlet valve 43, and the drain valve 46. The threshold level can be determined based on the specific semiconductor process to be performed by the chemical mixture 20 or by a method used for the semiconductor process to be performed.

[0122] In some embodiments, the amount of the second liquid (e.g., DI water) is maintained at a level within 0.5% of a threshold level. In some embodiments, the amount of the second liquid (e.g., DI water) is maintained at a level within 0.1% of a threshold level. The maintenance of the amount of the second liquid in the chemical mixture 20 is automatically controlled through the operation of the various valves in the system 10 based on feedback provided from the chemical sensor 38 to the control circuit system 60.

[0123] In some embodiments, the first liquid includes an etch residue remover or a positive photoresist stripper liquid chemistry, which may be an amine-based liquid chemical mixture, a hydrofluoric (HF) acid-based liquid chemical mixture, or any other liquid chemistry suitable for use in semiconductor processes. In some embodiments, the second liquid is water or deionized (DI) water.

[0124] Later in this article, for example, Figure 4 Further details of the control circuitry 60 are described.

[0125] Figure 2 A schematic diagram of an automatic concentration control system 110 for use in, for example, a semiconductor manufacturing process is shown according to one or more embodiments of the present disclosure. Figure 2 The automatic concentration control system 110 shown in the figure can be used or combined with any semiconductor process tool, such as a cleaning tool, a photoresist removal tool, an etching-related semiconductor process tool, such as a wet etching tool, or the like, for example; however, the embodiments of the present disclosure are not limited thereto. In various embodiments, the automatic concentration control system 110 can be any system having one or more tanks containing a chemical mixture, wherein the concentration of the chemical mixture is controlled using automatic concentration control.

[0126] Figure 2 The automatic concentration control system 110 shown in Figure 1 The automatic concentration control system 10 shown and described is substantially the same; however, one difference is Figure 2 The system 110 includes a plurality of tanks 112a - 112d containing a chemical mixture 20 .

[0127] For example, Figure 2 As shown, in some embodiments, the system 110 may include four or more tanks 112a, 112b, 112c, 112d. Each tank may hold a large amount of chemical mixture 20, such as a liquid chemical mixture that can be used in semiconductor processes (such as for cleaning or removing photoresist from semiconductor wafers). In some embodiments, the tanks 112a-112d contain or are configured to contain a liquid chemical mixture for removing photoresist. In some embodiments, the tanks 112a-112d contain an etch residue remover and a positive photoresist stripper, which may be an amine-based liquid chemical mixture, a hydrofluoric (HF) acid-based liquid chemical mixture, or any other liquid chemical mixture suitable for use in semiconductor processes.

[0128] The tanks 112a-112d of the system 110 may be associated with Figure 1The tanks 12 shown and described are substantially the same, and the tanks 112a-112d may include any of the features and functionality described above with respect to the tanks 12. While the tanks 112a-112d are shown as cylindrical tanks, in various embodiments, the tanks 112a-112d may have any shape suitable for holding a large volume of fluid, such as the chemical mixture 20.

[0129] The system 110 includes a first inlet conduit 121 and a second inlet conduit 122. The first liquid is introduced into the interior of the water tanks 112a-112d via the first inlet conduit 121, and the second liquid is introduced into the interior of the water tanks 112a-112d via the second inlet conduit 122. The first supply valve 101 is communicatively coupled between a first liquid supplier 125 and the first inlet conduit 121, and the second supply valve 102 is communicatively coupled between a second liquid supplier 126 and the second inlet conduit 122.

[0130] The system 110 includes a plurality of first inlet valves 123a-123d, and each of the first inlet valves 123a-123d is communicatively coupled between the first inlet conduit 121 and the interior of the respective water tank 112a-112d. The system 110 further includes a plurality of second inlet valves 124a-124d, and each of the second inlet valves 124a-124d is communicatively coupled between the second inlet conduit 122 and the interior of the respective water tank 112a-112d.

[0131] Each of the first and second liquids may be a constituent liquid of the chemical mixture 20, which may be the same as previously described herein. Figure 1 The same as described above. In some embodiments, the first liquid includes a liquid chemical for removing photoresist. In some embodiments, the first liquid includes an etch residue remover or a positive photoresist stripper liquid chemical, which can be an amine-based liquid chemical mixture, a hydrofluoric (HF) acid-based liquid chemical mixture, or any other liquid chemical suitable for use in semiconductor processes. In some embodiments, the second liquid is water or deionized (DI) water.

[0132] The system 110 further includes a circulation loop 130 through which the chemical mixture 20 can pass from an outlet conduit 131 back to the interior of the water tanks 112a-112d via a third inlet conduit 133. The outlet conduit 131 is communicatively coupled to the interior of the water tanks 112a-112d. The circulation loop 130 can be connected to the water tanks 112a-112d. Figure 1 The circulation loop 30 shown and described is substantially the same, and the circulation loop 130 may include any of the features and functionality previously described herein with respect to the circulation loop 30 .

[0133] like Figure 2 As shown, the circulation loop 130 includes a pump 32 and a sensor 38, which are previously described herein. Figure 1In some embodiments, the circulation loop 130 may further include a heater and a filter, for example, as described with respect to Figure 1 Show and describe.

[0134] The system 110 includes a plurality of outlet valves 143a-143d, each of which is communicatively coupled between the respective tanks 112a-112d and the outlet conduit 131. In addition, the circulation loop 130 may include a plurality of third inlet valves 144a-144d, each of which is communicatively coupled between the third inlet conduit 133 and the interior of the respective tanks 112a-112d.

[0135] The pump 32 may be the same as previously described herein. Figure 1 The pump 32 described is substantially the same. In operation, the pump 32 conveys a flow of the chemical mixture 20 from the interior of the tanks 112a-112d through the outlet conduit 131, through the pump 32, and back through the third inlet conduit 133 to the interior of the tanks 112a-112d. In this way, the liquid components of the chemical mixture 20 (e.g., the first and second liquids) that are separately added to the tanks 112a-112d through the first and second inlet conduits 121, 122 are thoroughly mixed via the circulation loop 130 to provide a substantially homogenous liquid chemical mixture 20.

[0136] Although not shown in Figure 2 However, in some embodiments, the system 110 may include additional components, such as Figure 1 For example, the heater and filter may be included in the circulation loop 130 and may be communicatively coupled to the pump 32 to transport the chemical mixture 20 through the heater and filter during operation.

[0137] In some embodiments, the system 110 includes a drain valve 146 communicatively coupled between the circulation loop 130 (eg, the outlet conduit 131) and the drain conduit 155. The drain valve 146 may be coupled to a Figure 1 The drain valve 46 described is substantially the same, and the drain valve 146 is operable to selectively drain some of the chemical mixture 20 flowing through the circulation loop 130. In some embodiments, a plurality of drain valves 146 may be included in the system 110, for example, wherein each drain valve 146 is communicatively coupled between an outlet of a respective tank 112a-112d and a drain conduit 155. In such an embodiment, the individual draining of each of the tanks 112a-112d may be controlled, for example, by selectively actuating the drain valve 146.

[0138] The system 110 further includes a chemical sensor 38 and a control circuit system 60 electrically coupled to the chemical sensor 38. The chemical sensor 38 may be connected to the control circuit system 60 described previously. Figure 1The chemical sensor 38 is the same as described above, and the chemical sensor 38 is any sensor operable to sense one or more properties of the chemical mixture 20. In some embodiments, the chemical sensor 38 is a chemical concentration monitor operable to sense the concentration of one or both of the first and second liquid chemicals in the chemical mixture 20. In some embodiments, the second liquid is water, and the chemical sensor 38 is a chemical concentration monitor operable to sense the concentration of water in the chemical mixture 20. In some embodiments, the chemical sensor 38 is a chemical concentration monitor that uses ultraviolet (UV) and near infrared (NIR) absorption spectroscopy to measure multiple components of the chemical mixture 20 in real time.

[0139] The control circuit system 60 can be used in conjunction with the previously described Figure 1 The control circuitry 60 described is substantially the same, and the control circuitry 60 receives an output signal from the chemical sensor 38 that is indicative of a sensed property of the chemical mixture 20. For example, in some embodiments, the output signal received from the chemical sensor 38 is indicative of a concentration of a second liquid (e.g., water) present in the chemical mixture 20.

[0140] In some embodiments, at least one of the first supply valve 101, the second supply valve 102, the first inlet valves 123a-123d, the second inlet valves 124a-124d, the third inlet valves 144a-144d, the outlet valve 143, or the exhaust valve 146 is an electrically controlled valve that is operable to selectively control or adjust the flow of fluid in the system 10. The control circuit system 60 is electrically coupled or communicatively coupled to at least one of the first supply valve 101, the second supply valve 102, the first inlet valves 123a-123d, the second inlet valves 124a-124d, the third inlet valves 144a-144d, the outlet valve 143, or the exhaust valve 146, and the control circuit system 60 is operable to control actuation of these valves based on an output signal from the chemical sensor 38 indicating a sensed property of the chemical mixture 20.

[0141] In some embodiments, the control circuit system 60 automatically controls the operation of one or more of the first supply valve 101, the second supply valve 102, the first inlet valve 123a-123d, the second inlet valve 124a-124d, the third inlet valve 144a-144d, the outlet valve 143, or the exhaust valve 146 based on the output signal of the chemical sensor 38 indicating the sensed property of the chemical mixture 20.

[0142] The first supply valve 101, the second supply valve 102, the first inlet valves 123a-123d, the second inlet valves 124a-124d, the third inlet valves 144a-144d, the outlet valve 143, or the exhaust valve 146 can be selectively controlled to have any position between and including the fully open position and the fully closed position. Therefore, based on the sensed properties of the chemical mixture 20, the amount of flow through one or more of the first supply valve 101, the second supply valve 102, the first inlet valves 123a-123d, the second inlet valves 124a-124d, the third inlet valves 144a-144d, the outlet valve 143, or the exhaust valve 146 is precisely controlled through automatic control provided by the control circuit system 60.

[0143] By selectively and automatically controlling one or more of the first supply valve 101, the second supply valve 102, the first inlet valve 123a-123d, the second inlet valve 124a-124d, the third inlet valve 144a-144d, the outlet valve 143, and the exhaust valve 146, the chemical mixture 20 is precisely controlled to have a uniform and consistent chemical composition as may be desired, for example based on the method of a specific semiconductor process performed utilizing the chemical mixture 20.

[0144] Figure 3 A schematic diagram of an automatic concentration control system 210 for use, for example, in a semiconductor manufacturing process is shown according to one or more embodiments of the present disclosure. Figure 3 The automatic concentration control system 210 shown in the figure can be used or combined with any semiconductor process tool, such as a cleaning tool, a photoresist removal tool, an etching-related semiconductor process tool, such as a wet etching tool, or the like, for example; however, the embodiments of the present disclosure are not limited thereto. In various embodiments, the automatic concentration control system 310 can be any system having one or more tanks containing a chemical mixture, wherein the concentration of the chemical mixture is controlled using automatic concentration control.

[0145] Figure 3 The automatic concentration control system 210 shown in Figure 2 The automatic concentration control system 110 shown and described is substantially the same and may include any of the features and functionality of the automatic concentration control system 110 . Figure 3 The system 210 shown in FIG. Figure 2The difference between the system 110 shown in is that the system 210 includes a chemical sensor 238 that is individually communicatively coupled to each of the water tanks 112a-112d. For example, the chemical sensor 238 can be communicatively coupled to the interior of each of the water tanks 112a-112d via respective chemical sensing channels 237a-237d. The chemical sensing channels 237a-237d thus provide the flow of the respective chemical mixture in each of the water tanks 112a-112d to the chemical sensor 238. In some embodiments, the chemical sensor 238 has a plurality of channels through which chemicals can be individually received and analyzed. In this way, the chemical mixture 20 in each of the water tanks 112a-112d can be individually analyzed by the chemical sensor 238, and the control circuit system 60 can receive an output signal associated with each of the plurality of channels of the chemical sensor 238, and each output signal can indicate the sensed property of the chemical mixture 20 in a particular one of the water tanks 112a-112d.

[0146] The sensor output conduit 231 can be communicatively coupled between the outlet of the chemical sensor 238 and the outlet conduit, so that the chemical mixture 20 received by the chemical sensor 238 (e.g., via the chemical sensing channels 237a-237d) can be returned to the circulation loop 130 after being analyzed by the chemical sensor 238.

[0147] Thus, the control circuit system 60 can automatically and independently control the various valves of the system 210 based on one or more sensed properties of the chemical mixture 20 (e.g., as sensed by multiple channels of the chemical sensor 238). Figure 2 ).

[0148] Figure 4 FIG. 6 is a schematic diagram illustrating further details of control circuitry 60 in accordance with one or more embodiments of the present disclosure.

[0149] like Figure 4 As shown, the control circuit system 60 may include a controller 62 , a communication center 64 , and a data acquisition (DAQ) circuit system 66 .

[0150] The controller 62 may include or be executed by a computer processor, microprocessor, microcontroller, etc., which is configured to perform the various functions and operations described herein with respect to the controller. For example, the controller 62 may be a computer processor selectively activated or reconfigured by a stored computer program, or include such a computer processor, or may be a special computing platform for performing the features and operations described herein. In some embodiments, the controller 62 may be configured to execute software instructions stored in any computer-readable storage medium, including, for example, read-only memory (ROM), random access memory (RAM), flash memory, hard disk drive, optical storage device, magnetic storage device, electrically erasable programmable read-only memory (EEPROM), organic storage media, etc.

[0151] The controller 62 is communicatively coupled to the chemical sensor 38. The chemical sensor 38 may be any chemical sensor previously described herein. In some embodiments, the chemical sensor 38 may be configured to sense multiple channels of a chemical mixture, for example, as described with respect to Figure 2 describe.

[0152] The controller 62 receives output signals 71 from the chemical sensors 38, and these output signals indicate sensed properties of the chemical mixture 20. For example, in some embodiments, the output signals 71 indicate the concentration of a chemical, such as a second liquid (e.g., water), present in the chemical mixture 20. The controller 62 controls the operation of the electronically controlled valve based on the sensed properties of the chemical mixture 20.

[0153] Based on the sensed properties of the chemical mixture 20, the controller 62 determines the adjustment of one or more of the electrically controlled valves 410. The one or more electrically controlled valves 410 may include any valve previously described herein, such as the first inlet valve 23, the second inlet valve 24, the third inlet valve 44, the outlet valve 43, or the exhaust valve 46 (see Figure 1 ), or the first supply valve 101, the second supply valve 102, the first inlet valves 123a-123d, the second inlet valves 124a-124d, the third inlet valves 144a-144d, the outlet valve 143, and the discharge valve 146 (see Figure 2 )

[0154] In some embodiments, the controller 62 outputs one or more valve control signals 72 that control the opening or closing of the electric-controlled valve 410, and the valve control signal 72 is based on the output signal 71 received from the chemical sensor 38. The valve control signal 72 can be generated and output separately for controlling any one of the electric-controlled valves 410. In some embodiments, the controller 62 outputs one or more valve control signals 72 that refer to the opening or closing time count of opening or closing the electric-controlled valve 410, as well as the valve control signal 72.

[0155] In some embodiments, the communication hub 64 receives the valve control signal 72 and provides the valve control signal 72 to the DAQ circuit system 66. The communication hub 64 can be or include any suitable circuit system for receiving the valve control signal 72 and providing the valve control signal 72 to the DAQ circuit system 66. In some embodiments, the communication hub 64 includes a circuit system configured to read information associated with the valve control signal 72, the signal 72 indicating a specific one of the electronically controlled valves 410 to be adjusted, and transmit a portion of the valve control signal 72 for controlling the specific electronically controlled valve 410 to the appropriate channel of the DAQ circuit system 66, which is used to control the specific electronically controlled valve 410.

[0156] The DAQ circuit system 66 may be or include any suitable circuit system for receiving the valve control signal 72 from the communication center 64 and controlling the electronically controlled valve 410 based on the received valve control signal 72. In some embodiments, the DAQ circuit system 66 transmits the valve control signal 72 received from the communication center 64 to the appropriate electronically controlled valve 410, thereby controlling the operation of the electronically controlled valve 410.

[0157] In some embodiments, one or both of the communication center 64 and the DAQ circuit system 66 include electrical or communication components for processing the valve control signal 72 received from the controller 62 and transmitting the processed control signal to the electronically controlled valve 410. In some embodiments, the electronically controlled valve 410 can be a solenoid valve, or any other type of valve that can be controlled based on the received electrical control signal.

[0158] The electronically controlled valve 410 outputs a state information signal 73 indicating an operational parameter of the electronically controlled valve. For example, in some embodiments, the state information signal 73 indicates the state or condition of the electronically controlled valve (e.g., open or closed). In some embodiments, the state information signal 73 indicates the amount or degree of opening of the electronically controlled valve (e.g., opening percentage, etc.).

[0159] The status information signal 73 is received by the circuit control system 60. In some embodiments, the status information signal 73 is output to the communication center 64, which can process the status information signal 73 or otherwise communicate the status information signal 73 to the controller 62.

[0160] In some embodiments, the controller 62 determines which of the plurality of electronically controlled valves 410 is opened or closed based on the output signal 71 from the chemical sensor 38 and the status information signal 73 indicating the current status of the electronically controlled valve 410. For example, if the output signal 71 from the chemical sensor 38 indicates that the water tanks 112a-112d (see Figure 3 ) is below a target range or target threshold, the controller 62 may determine that additional DI water should be provided, for example, by increasing the amount of DI water flowing through the associated second inlet valve 124a-124d. To achieve the correct flow rate of DI water, the controller 62 may determine the current opening amount of the associated second inlet valve 124a-124d based on the status information signal 73, and then determine the further opening amount of the valve to provide the calculated or determined flow rate of DI water so as to increase the amount of DI water in the chemical mixture 20 to the target range or threshold amount. When it is determined that the amount of DI water in the chemical mixture 20 is within the target range or threshold amount (e.g., based on sensing by the chemical sensor 38), the controller 62 may control the valve to close.

[0161] Communications between the chemical sensor 38, controller 62, communication center 64, DAQ circuit system 66, and electronically controlled valve 410 may be provided via any suitable communication link or communication protocol, including, for example, via one or more local area networks, wireless networks, dedicated lines, intranets, international networks, etc.

[0162] In some embodiments, chemical sensor 38 communicates with controller 62 via RS232, which is a serial communication standard. In some embodiments, controller 62 communicates with communication hub 64 via an Ethernet connection, and communication hub 64 communicates with DAQ circuitry 66 via an Ethernet connection.

[0163] In some embodiments, the electronically controlled valves 410 are controlled to open or close until a certain amount of water or moisture is reached within the chemical mixture 20. For example, a specific water content or moisture amount may be specified by a process recipe, etc. The specific water content or moisture amount may be monitored by the chemical sensor 38, and when the specific amount is reached, one or more of the electronically controlled valves 410 may be closed.

[0164] Figure 5 A flow chart 500 is shown for illustrating a method for automatically controlling the amount of chemicals in a chemical mixture in a treatment tank according to one or more embodiments of the present disclosure.

[0165] At operation 502, the method includes the step of sensing one or more properties of the chemical mixture 20 in the process tank 12. For example, the sensing step is performed by the chemical sensor 38. The chemical mixture 20 can be any chemical mixture as previously described herein. In some embodiments, the sensed one or more properties of the chemical mixture 20 include an amount or concentration of a first chemical in the chemical mixture 20.

[0166] At operation 504, the method includes the steps of controlling, by the control circuit system 60, the amount of the first chemical in the chemical mixture 20 by selectively operating the electronically controlled valve 410 based on the sensed one or more properties of the chemical mixture 20. In some embodiments, the control circuit system 60 determines an operable state of the electronically controlled valve 410, and selectively operates the electronically controlled valve 410 based on the determined operable state of the electronically controlled valve 410.

[0167] Embodiments of the present disclosure provide several advantages. For example, embodiments provided herein can reduce or eliminate manual operation of valves in order to adjust the water content or moisture content in a chemical mixture. This saves significant time and labor costs associated with manual operation. In addition, embodiments of the present disclosure promote more stable flow of appropriate water content into a chemical mixture, such as by automatically operating an electrically controlled valve to continuously monitor and adjust the water content and moisture content. Due to monitoring and automatically adjusting the electrically controlled valve, the concentration and control of water or moisture in a chemical mixture are also stable and easy to control. Because the monitoring operation is automatically performed by the system of the present disclosure, the monitor frequency can be precisely and easily adjusted through the system. In addition, because each treatment tank can have one or more associated electrically controlled valves, these valves can be operated separately to adjust or optimize the chemical mixture in each treatment tank, so cross contamination between treatment tanks is reduced.

[0168] Embodiments of the present disclosure further reduce defects in semiconductor structures (e.g., semiconductor wafers) processed in a processing tank. Some precision in chemical concentration is very important in the manufacturing process. As long as the critical concentration changes slightly, peeling or pitting (dropping) defects can occur on the wafer and lead to production scrap conditions. For example, the water content or moisture content in a chemical mixture (e.g., in an etch residue remover and / or a photoresist stripper) can damage the semiconductor wafer if it is not precisely controlled. For example, water content or moisture content outside of an acceptable range (which may depend on a specific processing method, etc.) can cause peeling or pitting defects on the wafer, which can cause the wafer to be scrapped. This advantageously increases the cost of producing semiconductor devices. However, because the water content or moisture content in the chemical mixture can be precisely monitored and automatically controlled, embodiments of the present disclosure reduce such defects.

[0169] In various embodiments, the present disclosure provides semiconductor processing systems and methods having electronically controlled valves that can be automatically controlled to adjust the amount or concentration of a chemical (such as water) in a chemical mixture in a process tank.

[0170] The system saves space and is easier to operate.

[0171] According to one embodiment, a semiconductor process system is provided, including a process configured to include a chemical mixture (including a first chemical). The chemical sensor is configured to sense one or more properties of the chemical mixture. The system further includes an electrically controlled valve, which is configured to adjust the amount of the first chemical in the chemical mixture based on the sensed one or more properties of the chemical mixture. The sensed one or more properties of the chemical mixture include a concentration of the first chemical in the chemical mixture. The first chemical may be water. The system further includes a control circuit system communicatively coupled to the chemical sensor, the control circuit system being configured to control the electrically controlled valve based on the sensed one or more properties of the chemical mixture. The control circuit system is communicatively coupled to the electrically controlled valve and is configured to receive a state information signal indicating a state of the electrically controlled valve, and the control circuit system is further configured to control the electrically controlled valve based on the state information signal. The control circuit system is configured to automatically control the electrically controlled valve to maintain a concentration of the first chemical in the chemical mixture within a selected range, and the electrically controlled valve is configured to adjust an amount of the first chemical flowing into the chemical mixture. The control circuit system is configured to automatically control the electronically controlled valve to maintain a concentration of the first chemical in the chemical mixture within a 1% deviation of a threshold concentration. The system further includes a first inlet valve, which is communicatively coupled between a supplier of a first liquid and an interior of the treatment tank. The system further includes a second inlet valve, which is communicatively coupled between a supplier of a second liquid and an interior of the treatment tank. The system further includes a circulation loop, the circulation loop includes an outlet valve, which is communicatively coupled to the interior of the treatment tank, and the circulation loop includes a third inlet valve, which is communicatively coupled to the interior of the treatment tank. The circulation loop includes a pump, which is communicatively coupled between the outlet valve and the third inlet valve, and the pump is configured to transport a flow of the chemical mixture from the interior of the treatment tank through the outlet valve and back to the interior of the treatment tank through the third inlet valve. The chemical sensor is communicatively coupled between the outlet valve and the third inlet valve. The circulation loop further includes a heater, which is communicatively coupled between the outlet valve and the third inlet valve, and the heater is configured to heat the flow of the chemical mixture. The circulation loop further includes a filter coupled between the outlet valve and the third inlet valve, the filter being configured to filter the flow of the chemical mixture. The first liquid includes at least one of an etching residue remover or a photoresist stripper, and the second liquid may be water.

[0172] According to another embodiment, a method for semiconductor process is provided, comprising the following steps: sensing one or more properties of a chemical mixture in a process tank by a chemical sensor. The method further comprises the following steps: controlling the amount of a first chemical in the chemical mixture by selectively operating an electrically controlled valve based on the sensed one or more properties of the chemical mixture by a control circuit system. The method further comprises determining an operable state of the electrically controlled valve by a control circuit system, wherein selectively operating the electrically controlled valve comprises selectively operating the electrically controlled valve based on the determined operable state of the electrically controlled valve. Controlling the amount of the first chemical in the chemical mixture comprises maintaining a concentration of the first chemical in the chemical mixture within a selected range, and the electrically controlled valve is configured to adjust an amount of the first chemical flowing into the chemical mixture. Controlling the amount of the first chemical in the chemical mixture comprises maintaining a concentration of the first chemical in the chemical mixture within a 1% deviation of a threshold concentration. Selectively operating the electrically controlled valve includes selectively operating at least one of: a first inlet valve, which is communicatively coupled between a supplier of a first liquid and the interior of a treatment tank; a second inlet valve, which is communicatively coupled between a supplier of a second liquid and the interior of the treatment tank; an outlet valve, which is communicatively coupled to the interior of the treatment tank; a third inlet valve, which is communicatively coupled to the interior of the treatment tank; or a discharge valve, which is communicatively coupled between the interior of the treatment tank and a discharge conduit.

[0173] According to another embodiment, a system for a semiconductor process is provided, comprising a plurality of process tanks configured to contain a chemical mixture. A chemical sensor is configured to sense one or more properties of the chemical mixture in each of the plurality of process tanks. A plurality of first inlet valves are included in the system, and each of the plurality of first inlet valves is coupled between a supplier of a first liquid and the interior of a respective process tank. A control circuit system is communicatively coupled to the chemical sensor and these first inlet valves, and the control circuit system is configured to automatically adjust the amount of the first liquid in the chemical mixture by selectively operating these first inlet valves based on the sensed one or more properties of the chemical mixture. The system further comprises a plurality of second inlet valves, each of the plurality of second inlet valves being coupled between a supplier of a second liquid and the interior of a respective process tank of the plurality of process tanks. The system further includes a circulation loop, the circulation loop including a plurality of outlet valves, each of the plurality of outlet valves coupled to the interior of a respective one of the plurality of treatment tanks, the circulation loop including a plurality of third inlet valves, each of the plurality of third inlet valves coupled to the interior of a respective one of the plurality of treatment tanks, the circulation loop including a pump communicatively coupled between the plurality of outlet valves and the plurality of third inlet valves, the pump being configured to deliver a flow of the chemical mixture from the interior of the plurality of treatment tanks through the plurality of outlet valves and back to the interior of the plurality of treatment tanks through the plurality of third inlet valves. The first liquid is water, and the second liquid includes at least one of an etching residue remover or a photoresist stripper. The control circuit system is configured to automatically control the plurality of first inlet valves to maintain a concentration of a first chemical in the chemical mixture within a selected range.

[0174] The features of several embodiments are summarized above so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should understand that the present disclosure can be easily used as a basis for designing or modifying other processes and structures to implement the same purposes and / or achieve the same advantages of the embodiments described herein. Those skilled in the art should also recognize that such equivalent structures do not depart from the spirit and scope of the present disclosure, and various changes, substitutions and modifications herein can be made without departing from the spirit and scope of the present disclosure.

[0175] The various embodiments described above can be combined to provide further embodiments. These and other changes can be made to the embodiments in light of the above detailed description. Generally, in the claims, the terms used should not be interpreted as limiting the scope of the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted as including all possible embodiments and the full range of equivalents to these claims. Therefore, the scope of the claims is not limited to the present disclosure.

Claims

1. A system for semiconductor manufacturing process, characterized in that: include: A plurality of treatment tanks configured to contain a chemical mixture including a first chemical, the plurality of treatment tanks being communicatively coupled to a circulation loop; a chemical sensor communicatively coupled to the circulation loop and configured to sense one or more properties of the chemical mixture; an electronically controlled valve configured to adjust an amount of the first chemical in the chemical mixture based on the sensed one or more properties of the chemical mixture; Each of the plurality of inlet valves and the plurality of outlet valves is communicatively coupled to the circulation loop, one of the plurality of inlet valves is communicatively coupled to an inlet of a respective one of the plurality of treatment tanks, and one of the plurality of outlet valves is communicatively coupled to an outlet of a respective one of the plurality of treatment tanks; a pump communicatively coupled between the plurality of inlet valves and the plurality of outlet valves, the pump being configured to deliver a flow of the chemical mixture from the interior of the plurality of treatment tanks through the plurality of outlet valves, through the chemical sensor, and back into the interior of the plurality of treatment tanks through the plurality of inlet valves; and A control circuit system is communicatively coupled to the chemical sensor, the plurality of inlet valves, and the plurality of outlet valves, the control circuit system being configured to automatically adjust an amount of the first chemical in the chemical mixture by selectively operating the plurality of inlet valves based on the sensed one or more properties of the chemical mixture, and to maintain the chemical mixture flowing through the plurality of process tanks until the chemical mixture in each of the plurality of process tanks is homogeneous with the chemical mixture in the other plurality of process tanks.

2. The system according to claim 1, characterized in that The sensed one or more properties of the chemical mixture include a concentration of the first chemical in the chemical mixture.

3. The system according to claim 2, characterized in that The first chemical is water.

4. The system according to claim 1, characterized in that The control circuitry is configured to control the electronically controlled valve based on the sensed one or more properties of the chemical mixture.

5. The system according to claim 4, characterized in that The control circuit system is communicatively coupled to the electronically controlled valve and is configured to receive a status information signal indicating a status of the electronically controlled valve. The control circuit system is further configured to control the electronically controlled valve based on the status information signal.

6. The system according to claim 4, characterized in that The control circuit system is configured to automatically control the electronically controlled valve to maintain a concentration of the first chemical in the chemical mixture within a selected range, and the electronically controlled valve is configured to adjust an amount of the first chemical flowing into the chemical mixture.

7. The system according to claim 4, characterized in that The control circuit system is configured to automatically control the electronically controlled valve to maintain a concentration of the first chemical in the chemical mixture within a 1% deviation of a threshold concentration.

8. The system according to claim 1, characterized in that The electric control valve includes: a first inlet valve communicatively coupled between a supplier of a first liquid and an interior of one of the plurality of treatment tanks; and A second inlet valve is communicatively coupled between a supplier of a second liquid and an interior of one of the plurality of treatment tanks.

9. The system according to claim 8, characterized in that The chemical sensor is communicatively coupled between the plurality of outlet valves and the plurality of inlet valves.

10. The system according to claim 8, characterized in that The circulation loop further comprises: a heater communicatively coupled between the plurality of outlet valves and the plurality of inlet valves, the heater being configured to heat the flow of the chemical mixture; and A filter is coupled between the plurality of outlet valves and the plurality of inlet valves, the filter being configured to filter the flow of the chemical mixture.

11. The system according to claim 8, characterized in that The first liquid includes at least one of an etching residue remover or a photoresist stripper, and the second liquid is water.

12. A method for semiconductor manufacturing, characterized in that: include: forming a chemical mixture including a first chemical in each of the plurality of process tanks by introducing a first chemical into the plurality of process tanks; flowing the chemical mixture from each of the plurality of treatment tanks to a circulation loop by communicatively coupling a respective outlet valve of a respective treatment tank of the plurality of treatment tanks; sensing one or more properties of the chemical mixture flowing through the circulation loop via a chemical sensor communicatively coupled to the circulation loop; controlling, by control circuitry, an amount of the first chemical in the chemical mixture by selectively operating an electronically controlled valve based on the sensed one or more properties of the chemical mixture; flowing the chemical mixture from the chemical sensor through the circulation loop; delivering the chemical mixture back to each of the plurality of treatment tanks by communicatively coupling a respective one of the plurality of treatment tanks to a respective inlet valve of the circulation loop; and The chemical mixture is homogenized by maintaining the flow of the chemical mixture through the plurality of process tanks and the circulation loop.

13. The method according to claim 12, characterized in that Further including: The operable state of the electrically controlled valve is determined by the control circuit system, wherein the selectively operating the electrically controlled valve includes: selectively operating the electrically controlled valve based on the determined operable state of the electrically controlled valve.

14. The method according to claim 12, characterized in that Controlling the amount of the first chemical in the chemical mixture includes maintaining a concentration of the first chemical in the chemical mixture within a selected range, and the electronically controlled valve is configured to adjust an amount of the first chemical flowing into the chemical mixture.

15. The method according to claim 12, characterized in that Controlling the amount of the first chemical in the chemical mixture includes maintaining a concentration of the first chemical in the chemical mixture within a 1% deviation of a threshold concentration.

16. The method according to claim 12, characterized in that Selectively operating the electrically controlled valve includes selectively operating at least one of the following: a respective first inlet valve, communicatively coupled between a supplier of a first liquid and the interior of a respective one of the multiple treatment tanks; a respective second inlet valve, communicatively coupled between a supplier of a second liquid and the interior of a respective one of the multiple treatment tanks; the respective outlet valve, communicatively coupled to the interior of a respective one of the multiple treatment tanks; the respective inlet valve, which is communicatively coupled to the interior of a respective one of the treatment tanks; or a discharge valve, communicatively coupled between the interior of a respective one of the multiple treatment tanks and a discharge conduit.

17. A system for semiconductor manufacturing process, characterized in that: include: a plurality of treatment tanks configured to contain a chemical mixture; a circulation loop, communicatively coupled to each of the plurality of treatment tanks; a chemical sensor communicatively coupled to the circulation loop and configured to sense one or more properties of the chemical mixture in each of the plurality of treatment tanks; a plurality of first inlet valves, each of the plurality of first inlet valves being coupled between a supplier of a first liquid and an interior of a respective treatment tank of the plurality of treatment tanks; and a plurality of outlet valves, each of the plurality of outlet valves being coupled between the chemical sensor and a respective one of the plurality of treatment tanks, the plurality of outlet valves being communicatively coupled to the circulation loop; a pump communicatively coupled between the plurality of inlet valves and the plurality of outlet valves, the pump being configured to deliver a flow of the chemical mixture from the interior of the plurality of treatment tanks through the plurality of outlet valves, through the chemical sensor, and back into the interior of the plurality of treatment tanks through the plurality of inlet valves; and a control circuit system communicatively coupled to the chemical sensor and the plurality of first inlet valves, the control circuit system being configured to automatically adjust an amount of the first liquid in the chemical mixture based on the sensed one or more properties of the chemical mixture by selectively operating the plurality of first inlet valves, and to maintain the chemical mixture flowing through the plurality of process tanks until the chemical mixture in each of the plurality of process tanks is homogeneous with the chemical mixture in the other plurality of process tanks.

18. The system according to claim 17, characterized in that Further including: A plurality of second inlet valves, each of the plurality of second inlet valves is coupled between a supplier of a second liquid and the interior of a respective treatment tank of the plurality of treatment tanks.

19. The system according to claim 18, characterized in that The first liquid is water, and the second liquid includes at least one of an etching residue remover or a photoresist stripper.

20. The system according to claim 17, characterized in that The control circuit system is configured to automatically control the plurality of first inlet valves to maintain a concentration of a first chemical in the chemical mixture within a selected range.

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