LED light source

Abstract

The present invention discloses an LED light source, which relates to the technical field of LED light sources, and includes an insulating substrate and an LED chipset, a light emitting cavity is installed on the insulating substrate, the light emitting cavity has a cavity inside and a light emitting port on the top, the LED chipset is fixed at the bottom of the light emitting cavity, the area of ​​the light emitting port is equal to or less than the area of ​​the bottom of the light emitting cavity, the orthographic projection of the light emitting port is arranged at the bottom of the light emitting cavity, the light emitting cavity on the upper part of the LED chipset is filled with a mixture of silica gel and phosphor, and the LED chipset is electrically connected to a pad on a substrate arranged outside the light emitting cavity. It has high optical brightness, the chip is a chip combination of multiple luminous colors, the silica gel contains phosphor, the white light emitted by the LED has red, yellow, green and blue spectral components, and the light emitted by the LED of the present invention has a strong green light spectrum and a red light spectrum relative to ordinary LEDs, which can meet the color requirements of traffic lights.

Description

Technical Field

[0001] The present invention relates to the technical field of LEDs, and more particularly to an LED light source. Background Art

[0002] Currently, many companies develop LEDs with the purpose of improving the luminous flux of LEDs. The inner surface of the light-emitting cavity is generally a trumpet-shaped structure that is larger at the top and smaller at the bottom. In this structure, the chip is generally located at the bottom of the light-emitting cavity, and the light-emitting surface is located above the trumpet mouth. The area of ​​the light-emitting surface is larger than that of the bottom surface.

[0003] Although this structure can improve the luminous flux of the LED, because the area of ​​its light-emitting surface is larger than that of the bottom surface, under the same amount of light output, the brightness of its light outlet is lower than that of the light outlet of the cavity structure where the cavity surface is perpendicular to the bottom surface. In addition, the green and red components of most existing LEDs are very low in the spectrum, resulting in obvious omissions in the LED spectrum, poor color rendering of LEDs, and failure to meet the color requirements of traffic lights. Summary of the invention

[0004] In order to solve the above-mentioned problems existing in current LEDs, the present invention provides an LED light source having higher optical brightness. The chip is a combination of chips with multiple luminous colors. The silica gel contains fluorescent powder. The spectrum of the white light emitted by the LED has red, yellow, green and blue spectral components. Compared with ordinary LEDs, the light emitted by the LED of the present invention has stronger green light spectrum and red light spectrum, which can meet the color requirements of traffic lights.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] An LED light source comprises an insulating substrate and an LED chipset, wherein a light emitting cavity is mounted on the insulating substrate, the light emitting cavity has a cavity inside and a light emitting port at the top, the LED chipset is fixed at the bottom of the light emitting cavity, the area of ​​the light emitting port is equal to or smaller than the area of ​​the bottom of the light emitting cavity, the orthographic projection of the light emitting port is arranged at the bottom of the light emitting cavity, a mixture of silica gel and phosphor is filled in the light emitting cavity above the LED chipset, and the LED chipset is electrically connected to a pad on the substrate arranged outside the light emitting cavity.

[0007] In the present invention, we have designed and developed an LED structure with a light-emitting cavity, and the area of ​​the light outlet of the light-emitting cavity is equal to or less than the area of ​​the bottom of the light-emitting cavity. In such a structure, since the light-emitting surface and the bottom surface of the light-emitting cavity have the same area size, the light-emitting surface has a higher optical brightness. In practice, in order to improve the brightness of the light-emitting surface, the area of ​​the light-emitting surface of the light-emitting cavity can also be designed to be smaller than the bottom surface. Such a method can also improve the brightness of the light-emitting surface, but such a method has certain difficulties in the LED packaging process. In the present invention, the chip is a combination of chips with multiple luminous colors, and there is fluorescent powder in the silica gel. The white light emitted by the LED has red, yellow, green and blue spectral components. Compared with ordinary LEDs, the light emitted by the LED of the present invention has a stronger green light spectrum and red light spectrum, which can meet the color requirements of traffic lights.

[0008] Furthermore, the insulating substrate is a ceramic substrate, the bottom of the light output cavity is open, an upper circuit layer internal area is provided on the upper surface of the ceramic substrate at the bottom of the light output cavity, the LED chipset is connected to the upper circuit layer internal area, an upper circuit layer external area is provided on the upper surface of the ceramic substrate outside the light output cavity, and a lower circuit layer is provided on the lower surface of the ceramic substrate, each LED chipset corresponds to at least two independent upper circuit layer external areas, two independent lower circuit layers and four independent via metal wires arranged on the ceramic substrate, one end of each lower circuit layer is connected to the upper circuit layer external area through a via metal wire, and the other end of the lower circuit layer is connected to the upper circuit layer internal area through a via metal wire.

[0009] Furthermore, the side wall of the light emitting cavity is perpendicular to the insulating substrate, and a reflective baffle arranged perpendicular to the insulating substrate is provided in the middle of the light emitting cavity. The reflective baffle divides the light emitting cavity into two independent sub-light emitting cavities, and each sub-light emitting cavity is respectively provided with an LED chips group, and the sub-light emitting cavity above the LED chips group is filled with a mixture of silica gel and phosphor.

[0010] Furthermore, the light output cavity is composed of an aluminum plate, a stainless steel plate or an aluminum alloy plate; the reflective baffle is composed of an aluminum plate, a stainless steel plate or an aluminum alloy plate; the light output cavity and the reflective baffle are connected by welding or integral molding.

[0011] Furthermore, the length and width of each sub-light-emitting cavity do not exceed 9 mm; and the distance between the center points of two sub-light-emitting cavities does not exceed 6 mm.

[0012] Furthermore, an insulating pad is fixedly provided at the lower part of the ceramic substrate.

[0013] Furthermore, the insulating substrate is provided with a first light-transmitting hole at a position opposite to each sub-light-emitting cavity, and the insulating pad is provided with a second light-transmitting hole at a position opposite to the first light-transmitting hole.

[0014] Furthermore, the LED chipset includes a red chipset and a blue chipset, wherein the red chipset is concentrated together and located in the middle of the LED chipset, and the blue chipsets are located on both sides of the red chipset.

[0015] Furthermore, the LED chipset includes a red chipset and a blue chipset, wherein the red chipset is concentrated together and located on one side of the LED chipset, and the blue chipset is concentrated together and located on the other side of the LED chipset.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The present invention has a novel structure and strong practicality. The area of ​​the light outlet of the light outlet cavity of the LED light source provided by the present invention is equal to or smaller than the area of ​​the bottom of the light outlet cavity. In such a structure, since the light outlet surface and the bottom surface of the light outlet cavity have the same area, the light outlet surface has a higher optical brightness.

[0018] 2. The LED chipset of the present invention includes a red chipset and a blue chipset, wherein the red chipset is concentrated together and located in the middle of the LED chipset, and the blue chipsets are located on both sides of the red chipset. The silica gel contains phosphors, and the light emitted by the red chipset and the blue chipset and the light emitted after conversion by the phosphors are mixed into white light. After the various mixed lights are reflected by the metal inner cavity perpendicular to the surface of the substrate, a light-emitting surface with color and brightness that can meet the requirements of the traffic light can be formed on the upper surface of the light-emitting cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a cross-sectional view of an LED light source of the present invention;

[0020] Figure 2 It is a top view of an LED light source of the present invention.

[0021] Markings in the figure: 1-ceramic substrate, 2-LED chipset, 3-metal wire, 4-metal aluminum frame, 5-mixture of silicone and phosphor, 1.1-inner area of ​​upper circuit layer, 1.2-via metal wire, 1.3-lower circuit layer, 1.4-outer area of ​​upper circuit layer, 1.5-insulating pad, 1.5.1~1.5.4-soldering pad, 1.6-first light transmission hole, 10.6-second light transmission hole, 4.1-reflective partition, 6-screw, 1.7-fixing hole. DETAILED DESCRIPTION

[0022] The present invention is further described below in conjunction with embodiments, which are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, other embodiments obtained by ordinary technicians in the field without creative work are all within the scope of protection of the present invention.

[0023] Embodiment:

[0024] like Figure 1 and 2 As shown, an LED light source includes an insulating substrate and an LED chipset 2, a light emitting cavity is mounted on the insulating substrate, the light emitting cavity has a cavity inside and a light emitting port on the top, the LED chipset 2 is fixed at the bottom of the light emitting cavity, the area of ​​the light emitting port is equal to or smaller than the area of ​​the bottom of the light emitting cavity, the orthographic projection of the light emitting port is arranged at the bottom of the light emitting cavity, the light emitting cavity above the LED chipset 2 is filled with a mixture 5 of silica gel and phosphor, and the LED chipset 2 is electrically connected to pads 1.5.1 to 1.5.4 arranged on the substrate outside the light emitting cavity.

[0025] In the present invention, we have designed and developed an LED light source structure, in which the area of ​​the light outlet of the light emitting cavity is equal to or less than the area of ​​the bottom of the light emitting cavity. In such a structure, since the light emitting surface and the bottom surface of the light emitting cavity have the same area size, the light emitting surface has a higher optical brightness. In practice, in order to improve the brightness of the light emitting surface, the area of ​​the light emitting surface of the light emitting cavity can also be designed to be smaller than the bottom surface. Such a method can also improve the brightness of the light emitting surface, but such a method has certain difficulties in the LED packaging process. In the present invention, the chip is a combination of chips with multiple luminous colors, and there is fluorescent powder in the silica gel. The white light emitted by the LED has a spectrum with red, yellow, green and blue spectral components. Compared with ordinary LEDs, the light emitted by the LED of the present invention has a stronger green light spectrum and red light spectrum, which can meet the color requirements of traffic lights.

[0026] In this embodiment, the insulating substrate is a ceramic substrate 1, the bottom of the light emitting cavity is open, an upper circuit layer inner region 1.1 is provided on the upper surface of the ceramic substrate at the bottom of the light emitting cavity, the LED chipset 2 is connected to the upper circuit layer inner region 1.1, an upper circuit layer outer region 1.4 is provided on the upper surface of the ceramic substrate 1 outside the light emitting cavity, and a lower circuit layer 1.3 is provided on the lower surface of the ceramic substrate 1, each LED chipset 2 corresponds to at least two independent upper circuit layer outer regions 1.4, two independent lower circuit layers 1.3 and four independent via metal wires 1.2 arranged on the ceramic substrate, usually, each LED chipset 2 corresponds to two independent upper circuit layer outer regions 1.4 and two independent lower circuit layers 1.3, and the number of independent via metal wires 1.2 arranged on the ceramic substrate can be more than 4, and the via metal wires 1.2 can also be used for connecting the chips in the LED chipset 2.

[0027] One end of each lower circuit layer 1.3 is connected to the outer region 1.4 of the upper circuit layer through a via metal line 1.2, and the other end of the lower circuit layer 1.3 is connected to the inner region 1.1 of the upper circuit layer through a via metal line 1.2.

[0028] The light emitting cavity is composed of an aluminum plate, a stainless steel plate or an aluminum alloy plate; the reflective baffle 4.1 is composed of an aluminum plate, a stainless steel plate or an aluminum alloy plate; the light emitting cavity and the reflective baffle 4.1 are connected by welding or integral molding. In this embodiment, the circuit layers are set on the upper and lower sides of the ceramic substrate 1 because the light emitting cavity is composed of an aluminum plate, a stainless steel plate or an aluminum alloy plate with a high reflectivity on the inner surface, in order to avoid short circuit and damage to the LED. In this embodiment, the pads 1.5.1 to 1.5.4 are the outer area 1.4 of the upper circuit layer. A voltage is loaded on every two pads 1.5.1 to 1.5.4 to control one light-emitting unit. And as shown in the attached Figure 1 As shown, the lower circuit layer 1.3 of this embodiment is continuously arranged at one end of the via metal line 1.2. The advantage of this is that it can be connected to the PCB board through the lower circuit layer to supply electricity.

[0029] In this embodiment, the side wall of the light emitting cavity is perpendicular to the insulating substrate, and a reflective baffle 4.1 is provided in the middle of the light emitting cavity and is arranged perpendicular to the insulating substrate. The reflective baffle 4.1 divides the light emitting cavity into two independent sub-light emitting cavities, and the reflective baffle 4.1 can prevent the light of one sub-light emitting cavity from entering the other sub-light emitting cavity. An LED chipset 2 is provided in each sub-light emitting cavity, and a mixture 5 of silica gel and phosphor is filled in the sub-light emitting cavity above the LED chipset 2. An insulating pad 1.5 is fixedly provided at the lower part of the ceramic substrate. The function of the insulating pad 1.5 is to prevent the lower circuit layer 1.3 on the lower surface of the insulating substrate from contacting the conductor on the mounting surface when the LED lamp is installed, resulting in a short circuit. The insulating pad 1.5 mainly plays a role of insulation protection. The insulating pad 1.5 is a ceramic pad. The LED chipset 2 in each sub-light-emitting cavity corresponds to at least two independent upper circuit layer external regions 1.4, two independent lower circuit layers 1.3 and four independent via metal wires 1.2 arranged on the ceramic substrate. Usually, each LED chipset 2 corresponds to two independent upper circuit layer external regions 1.4 and two independent lower circuit layers 1.3, and the number of independent via metal wires 1.2 arranged on the ceramic substrate can be more than 4, and the via metal wires 1.2 can also be used to connect the chips in the LED chipset 2. In such a structure, the LED chipsets 2 in the two sub-light-emitting cavities can be independently switched on and off.

[0030] In this embodiment, the mixture 5 of silica gel and phosphor powder is specifically: the usage ratio of silica gel A glue: silica gel B glue: fluorescent yellow powder: fluorescent red powder is: 0.122: 0.122: 0.01716: 0.00143. The specific usage can also be fine-tuned according to the actual situation. After mixing evenly, the silica gel is cured by thermal curing. The mixture 5 of silica gel and phosphor powder made in this ratio can make the light emitted by the red chipset and the blue chipset and the light emitted after the phosphor conversion be mixed into white light. After the various mixed lights are reflected by the metal inner cavity perpendicular to the surface of the substrate, a light-emitting surface with color and brightness that can meet the requirements of the traffic light can be formed on the upper surface of the light-emitting cavity.

[0031] In this embodiment, the length and width of each sub-light-emitting cavity do not exceed 9 mm; and the distance between the center points of two sub-light-emitting cavities does not exceed 6 mm.

[0032] In this embodiment, the insulating substrate is provided with a first light-transmitting hole 1.6 at a position opposite to the LED chipset 2 in each sub-light-emitting cavity, and the insulating pad 1.5 is provided with a second light-transmitting hole 10.6 at a position opposite to the first light-transmitting hole 1.6. The advantage of this is that when the LED lamp with two sub-light-emitting cavities is working, the LED chipset 2 in one of the sub-light-emitting cavities emits light, and the light generated by it can be transmitted through the back of the insulating substrate through the first light-transmitting hole 1.6 and the second light-transmitting hole 10.6. A brightness sensor can be set on the back of the insulating substrate to detect the relative intensity of the light emitted by the front LED chipset 2. In our invention, each of the two LED chipsets 2 has a corresponding first light-transmitting hole 1.6 and a second light-transmitting hole 10.6. For the first light-transmitting hole 1.6 and the second light-transmitting hole 10.6, the light emitted by the two LED chipsets 2 is independent of each other, that is, the light emitted by one LED chipset will not affect the detector detecting the light emitted by another LED chipset through the first light-transmitting hole 1.6 and the second light-transmitting hole 10.6. When the brightness sensor detects that the intensity of light emitted by the current LED chipset is weakened or disappears, the LED chipset in another sub-light-emitting cavity is controlled by an external circuit to emit light, thereby meeting the lighting requirements for seamless docking.

[0033] In this embodiment, the LED chipset 2 includes a red chipset and a blue chipset, wherein the red chipset is concentrated together and located in the middle of the LED chipset 2, and the blue chipsets are located on both sides of the red chipset. The electrical connection between the chips and between the chips and the internal area 1.1 of the upper circuit layer of the ceramic substrate 1 is connected through a metal wire 3; the electrical connection between the internal area 1.1 of the upper circuit layer of the ceramic substrate 1, the external area 1.4 of the upper circuit layer of the ceramic substrate 1 and the lower circuit layer 1.3 of the ceramic substrate 1 is connected through a via metal wire 1.2, and the metal wire 3 is a gold wire, a silver wire, or a copper wire. If a flip chip is used, the electrical connection between the chip and the ceramic substrate 1 can be achieved by metal solder. The light emitted by the LED chipset 2 can be partially absorbed by the phosphor in the mixture 5 of silica gel and phosphor, and then part of the light emitted by the optical chip can be converted into light of other wavelengths.

[0034] The LED light source of this structure has strong red, yellow, green and blue spectral components in its spectrum. The brightness of the light-emitting unit surface is high, and the light emitted by the two light-emitting unit LED chipsets 2 is independent of each other. The light-emitting unit here refers to the combined unit formed by the mixture 5 of silica gel and phosphor and the LED chipset. Through the fixing holes 1.7 of the ceramic substrate 1 and the ceramic pad, the LED and the ceramic pad can be fixed on the heat sink by screws 6.

[0035] Of course, the red chipset and the blue chipset of the LED chipset 2 can also be arranged in another arrangement, that is, the red chipset is concentrated together and located on one side of the LED chipset, and the blue chipset is concentrated together and located on the other side of the LED chipset. In this structural arrangement, the brightness of the light-emitting unit surface is not as good as the structure in which the red chipset is arranged in the middle.

[0036] The specific production steps of the LED of the present invention are as follows:

[0037] On the inner area 1.1 of the upper circuit layer, the LED chipset 2 is fixed on the inner area 1.1 of the upper circuit layer by means of crystal bonding, and then the chips are electrically connected to each other and to the inner area 1.1 of the upper circuit layer by means of wire bonding. Then, a metal aluminum frame 4 is fixed between the inner area 1.1 of the upper circuit layer and the outer area 1.4 of the upper circuit layer. The metal aluminum frame 4 can be fixed on the ceramic substrate 1 by means of glue bonding or welding. After the metal aluminum frame 4 is fixed, a certain amount of a mixture 5 of silica gel and phosphor is injected into the two sub-light emitting cavities of the metal aluminum frame 4 respectively, and then the silica gel is cured by means of thermal curing.

[0038] After the silicone is completely cured, a ceramic pad with the same size as the ceramic substrate 1 can be made. The ceramic substrate 1 is provided with a first light-transmitting hole 1.6, and a second light-transmitting hole 10.6 is provided at the corresponding position of the ceramic pad. The ceramic substrate 1 and the ceramic pad can be locked on the heat sink by screws 6. The front of the ceramic substrate 1 has four pads 1.5.1 to 1.5.4, namely pads 1.5.1, 1.5.2, 1.5.3 and 1.5.4. By applying a voltage to pads 1.5.1 and 1.5.2, one LED chip group can be lit, and by applying a voltage to pads 1.5.3 and 1.5.4, another LED chip group can be lit. The light emitted by each LED chip group 2 can be transmitted to the back of the substrate through the first light-transmitting hole 1.6 and the second light-transmitting hole 10.6.

[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED light source, comprising an insulating substrate and an LED chipset, characterized in that: A light-emitting cavity is installed on an insulating substrate, the light-emitting cavity has a cavity inside and a light-emitting port on the top, an LED chipset is fixed at the bottom of the light-emitting cavity, the area of ​​the light-emitting port is equal to or smaller than the area of ​​the bottom of the light-emitting cavity, and the orthographic projection of the light-emitting port is arranged at the bottom of the light-emitting cavity, a mixture of silica gel and phosphor is filled in the light-emitting cavity above the LED chipset, and the LED chipset is electrically connected to a pad on the substrate arranged outside the light-emitting cavity; The insulating substrate is a ceramic substrate, the bottom of the light emitting cavity is open, an upper circuit layer inner region is provided on the upper surface of the ceramic substrate at the bottom of the light emitting cavity, the LED chipset is connected to the upper circuit layer inner region, an upper circuit layer outer region is provided on the upper surface of the ceramic substrate outside the light emitting cavity, a lower circuit layer is provided on the lower surface of the ceramic substrate, each LED chipset corresponds to at least two mutually independent upper circuit layer outer regions, two mutually independent lower circuit layers and four mutually independent via metal wires provided on the ceramic substrate, one end of each lower circuit layer is connected to the upper circuit layer outer region through a via metal wire, and the other end of the lower circuit layer is connected to the upper circuit layer inner region through a via metal wire; An insulating pad is fixedly arranged at the lower part of the ceramic substrate; a first light-transmitting hole is formed on the insulating substrate at a position opposite to each sub-light-emitting cavity, and a second light-transmitting hole is formed on the insulating pad at a position opposite to the first light-transmitting hole; The LED chipset includes a red chipset and a blue chipset, wherein the red chipset is concentrated together and located in the middle of the LED chipset, and the blue chipsets are located on both sides of the red chipset.

2. The LED light source according to claim 1, characterized in that: The side wall of the light emitting cavity is perpendicular to the insulating substrate, and a reflective baffle arranged perpendicular to the insulating substrate is provided in the middle of the light emitting cavity. The reflective baffle divides the light emitting cavity into two independent sub-light emitting cavities, and each sub-light emitting cavity is respectively provided with an LED chipset, and a mixture of silica gel and phosphor is filled in the sub-light emitting cavity above the LED chipset.

3. The LED light source according to claim 2, characterized in that: The light-emitting cavity is composed of an aluminum plate, a stainless steel plate or an aluminum alloy plate; the reflective baffle is composed of an aluminum plate, a stainless steel plate or an aluminum alloy plate; the light-emitting cavity and the reflective baffle are connected by welding or integral molding.

4. The LED light source according to claim 3, characterized in that: The length and width of each sub-light emitting cavity shall not exceed 9 mm; and the distance between the center points of two sub-light emitting cavities shall not exceed 6 mm.

5. The LED light source according to claim 3, characterized in that: The LED chipset includes a red chipset and a blue chipset, wherein the red chipset is concentrated together and located on one side of the LED chipset, and the blue chipset is concentrated together and located on the other side of the LED chipset.

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