Multi-layer lamination positioning slow-heating buffer pads for circuit boards, manufacturing methods and manufacturing equipment thereof

Abstract

The present invention provides a multi-layer lamination positioning slow-heating buffer pad for a circuit board, comprising: at least one surface layer, at least one middle layer, and at least one positioning device. Each of the surface layers includes a first substrate and a protective layer, and the protective layer is located on the surface of the first substrate. Each of the middle layers includes a second substrate and a rubber film layer, and at least one of the second substrates and at least one of the rubber film layers are alternately stacked. A specific position of each of the surface layers has at least one first hole glue placement hole. A specific position of each of the middle layers has at least one second hole glue placement hole. When the surface layer and the middle layer overlap, the positioning device is located at the mutually aligned first hole glue placement holes and the first hole glue placement holes, and the surface layer, the middle layer, and the positioning device are combined through a vulcanization process.

Description

Technical Field

[0001] The present invention relates to a circuit board, and particularly to a field of manufacturing multi-layer printed circuit boards by lamination (PIN-LAM) Background Art

[0002] With the progress of the times and the rapid development of electronic technology, the technology of printed circuit boards has been continuously improved and developed. Circuit boards are an indispensable part of the current electronic industry. In particular, the proportion of multi-layer PCBs in use has been increasing year by year. Circuit boards have evolved from single-sided, double-sided to multi-layer. So far, the proportion of multi-layer PCBs in use has been increasing year by year, and at the same time, multi-layer PCBs are also developing towards two extremes of high, precise, dense, fine, and small. An important process in the manufacture of multi-layer PCBs is lamination, and the control of lamination quality becomes increasingly important in the manufacture of multi-layer boards. In other words, lamination quality further affects the quality of printed circuit boards.

[0003] When laminating multi-layer circuit boards, kraft paper is often used for heat transfer buffering. The kraft paper is placed between the hot plate and the steel plate of the laminator to smooth the heating curve closest to the loose materials, so as to minimize the temperature difference between the layers of multiple substrates or multi-layer boards to be laminated. The commonly used specifications are from 90 pounds to 150 pounds. However, due to the high temperature and high pressure during lamination, the fibers in the kraft paper have been broken and no longer have toughness, making it difficult to perform its function, so it must be replaced. Further, in the traditional production of circuit board lamination, kraft paper is used as a gasket material and is used only once. The large amount of kraft paper used is not conducive to environmental protection and sustainable development. In addition, there are also products on the market that use the dip coating process. Glass fiber mesh cloth is used. After being coated with glue by the dip coating method, it is air-dried or dried and then pressed. In the dip coating process, a large amount of solvent is used, increasing production costs and also being unfavorable for environmental protection. In addition, in the current production of multi-layer circuit boards, problems such as lamination displacement, skidding, delamination, resin voids, and bubble residues are likely to occur, resulting in a high rejection rate. Summary of the Invention

[0004] The main advantage of the present invention is that it provides a multi-layer lamination positioning and slow heat buffering pad for circuit boards, a manufacturing method, and a manufacturing device thereof, which can effectively solve the problems of accurate punching alignment and rapidity in the process. Further, the present invention uses special materials for positioning, enabling accurate alignment during the multi-layer lamination production of PCBs with 24 to 40 layers and above. Unlike traditional non-punched materials, which can only be pressed for two to four layers. In other words, by using the positioning method, the structure of the final product can be made more complex.

[0005] The main advantage of the present invention is that it provides a multi-layer lamination positioning slow-heating buffer pad for a circuit board, a manufacturing method thereof, and a manufacturing apparatus therefor. The multi-layer lamination positioning slow-heating buffer pad for a circuit board can adjust the number of middle layers and, according to the requirements of customers, combine the desired slow-heating and buffering performances. Moreover, the multi-layer lamination positioning slow-heating buffer pad for a circuit board can accurately perform hole punching positioning and, in subsequent production, can clean the overflow glue of the product quickly. In particular, the multi-layer lamination positioning slow-heating buffer pad for a circuit board also has the characteristic of being reusable in a cyclic manner.

[0006] The main advantage of the present invention is that it provides a multi-layer lamination positioning slow-heating buffer pad for a circuit board, a manufacturing method thereof, and a manufacturing apparatus therefor. Based on common rubber processing methods, after rubber mixing is performed, a calendering method is adopted to calender rubber films with different thicknesses. This method can produce continuously and quickly, and the process is mature and stable. In particular, the present invention solves a series of problems such as adhesion, stable heat transfer, and uniform distribution in the formula. Therefore, the present invention has advantages such as a flexible production process and a simple and controllable process.

[0007] The main advantage of the present invention is that it provides a multi-layer lamination positioning slow-heating buffer pad for a circuit board, a manufacturing method thereof, and a manufacturing apparatus therefor. The unique hole glue formula plays a positioning role in circuit board production. At the same time, under the high pressure during the manufacturing process, it plays a sealing role to effectively prevent overflow glue from overflowing from the PIN holes, and at the same time does not bond the overflow resin. After the mold is opened, the cleaning is simple and fast. Further, the protective layer of the present invention is made of Teflon and is not compatible with the resin. After cooling, it can be separated by itself, and it can be gently wiped off or blown open by an air gun to achieve the purpose of simple and fast cleaning.

[0008] The main advantage of the present invention is that it provides a multi-layer lamination positioning slow-heating buffer pad for a circuit board, a manufacturing method thereof, and a manufacturing apparatus therefor. It has precise positioning and can completely prevent lamination displacement and the situation of easy skidding during lamination production. In particular, defects such as delamination, resin space, and bubble residue can be effectively avoided after using this product. In other words, the present invention can greatly reduce the defective rate.

[0009] The main advantage of the present invention is that it provides a multi-layer lamination positioning slow-heating buffer pad for a circuit board, a manufacturing method thereof, and a manufacturing apparatus therefor. The multi-layer lamination positioning slow-heating buffer pad for a circuit board includes a protective layer, a first substrate, at least one middle layer, the first base material, and the protective layer, and is formed in a stacked manner. Holes are pre-drilled at all interlayer positions, hole glue is placed, and then it is put into a flat vulcanizing machine and vulcanized into a whole. The desired slow-heating and buffering performances can be combined according to the number of middle layers. After molding, positioning holes can be accurately made according to the requirements of customers.

[0010] The main advantage of the present invention is that it provides a multi-layer lamination positioning slow-heating buffer pad for circuit boards, a manufacturing method thereof, and a manufacturing device thereof. The positioning slow-heating buffer pad is a positioning and pressing buffer pad used in the PIN-LAMINATION production process during circuit board production. In particular, the service life of the multi-layer lamination positioning slow-heating buffer pad for circuit boards exceeds 500 cycles. Further, the product has strong tolerance, heat resistance, buffering ability, and resilience ability, all of which are above 500 cycles of life.

[0011] The main advantage of the present invention is that it provides a multi-layer lamination positioning slow-heating buffer pad for circuit boards, a manufacturing method thereof, and a manufacturing device thereof. Through the formula of the present invention, the multi-layer lamination positioning slow-heating buffer pad for circuit boards can have characteristics such as high deformation ability, small compression permanent deformation, and long service life.

[0012] The main advantage of the present invention is that it provides a multi-layer lamination positioning slow-heating buffer pad for circuit boards, a manufacturing method thereof, and a manufacturing device thereof. The final product is used as a substitute material for kraft paper in actual use, inheriting the heat resistance of paper materials and the micro-elasticity under high-pressure conditions. At the same time, it has the function of being reused multiple times. The formula and product size can be adjusted according to different customers to produce customized products for customers.

[0013] The main advantage of the present invention is that it provides a multi-layer lamination positioning slow-heating buffer pad for circuit boards, a manufacturing method thereof, and a manufacturing device thereof. The adhesive tape used for the heat-resistant and temperature-resistant elastic rubber pad adopts the method of rubber calendering film, avoiding the use of a large amount of organic solvents, which is both environmentally friendly and safe.

[0014] Other advantages and features of the present invention are fully embodied by the following detailed description and can be achieved by the combination of means and devices specifically pointed out in the appended claims.

[0015] According to the present invention, the multi-layer lamination positioning slow-heating buffer pad for circuit boards of the present invention that can achieve the foregoing and other objects and advantages includes:

[0016] At least one surface layer, wherein each said surface layer includes a first substrate and a protective layer, the protective layer is located on the surface of the first substrate, and at least one first hole glue placement hole is provided at a specific position of each said surface layer;

[0017] At least one middle layer, wherein each said middle layer includes a second substrate and a rubber film layer, at least one of said second substrates and at least one of said rubber film layers are alternately stacked, and at least one second hole glue placement hole is provided at a specific position of each said middle layer; and

[0018] At least one positioning device, wherein when the surface layer and the middle layer overlap, the positioning device is located at the first hole glue placement holes and the first hole glue placement holes that are aligned with each other, and the surface layer, the middle layer and the positioning device are combined through a vulcanization process.

[0019] According to an embodiment of the present invention, each of the positioning devices includes a positioning hole and a positioning glue wall, wherein the positioning glue wall surrounds and is formed in the hole glue placement hole, and the positioning hole is located in the middle of the positioning glue wall.

[0020] According to an embodiment of the present invention, the positioning device includes two strengthening parts respectively formed on the surfaces of the protective layer and the rubber film layer, wherein the strengthening parts respectively extend outward from both ends of the positioning glue wall to form a flange.

[0021] According to an embodiment of the present invention, the protective layer is cured on the first substrate through a spraying process.

[0022] According to an embodiment of the present invention, the first substrate of the surface layer is a plain woven alkali-free glass fiber cloth with a thickness of 0.18 mm, a basis weight of 280 grams, a warp density of 44 counts, and a weft density of 32 counts. The thickness of the protective layer is 0.02 - 0.04 mm. The protective layer includes an aqueous polytetrafluoroethylene resin PTFE aqueous system dispersion liquid, a thickening agent, a coupling agent, and water, and the mass fractions are as follows:

[0023] PTFE aqueous dispersion liquid: 100

[0024] Thickening agent: 0.15

[0025] Coupling agent: 0.08

[0026] Water: 10.

[0027] According to an embodiment of the present invention, the second substrate of the middle layer is a twill alkali-free glass fiber cloth with a special weaving method, with a thickness of 0.45 mm, a basis weight of 500 grams, a warp density of 48 counts, and a weft density of 36 counts. The material of the rubber film layer includes rubber, a reinforcing material, a crosslinking agent, a heat-resistant filler, an acid absorbent, and a processing aid, and the mass fractions are as follows:

[0028] Rubber: 100

[0029] Reinforcing material: 15 - 20

[0030] Heat-resistant filler: 15 - 30

[0031] Crosslinking agent: 3 - 6

[0032] Calcium hydroxide: 3 - 6

[0033] Magnesium oxide: 3 - 6

[0034] Processing aids: 2 - 10.

[0035] According to an embodiment of the present invention, wherein the positioning device is formed by a hole rubber, and the material of the hole rubber includes methyl vinyl silicone rubber, fumed silica, peroxide vulcanizing agent, zinc stearate, vinyltrimethoxysilane, α,ω-dihydroxypolydimethylsiloxane, cerium oxide, and the parts by mass of the hole rubber are as follows:

[0036] Methyl vinyl silicone rubber: 100

[0037] Fumed silica: 40

[0038] Peroxide vulcanizing agent: 4

[0039] Zinc stearate: 1

[0040] Vinyltrimethoxysilane: 0.1

[0041] α,ω-dihydroxypolydimethylsiloxane: 3

[0042] Cerium oxide: 0.5.

[0043] According to an embodiment of the present invention, wherein the rubber is selected from the group consisting of terpolymer fluoroelastomer, binary fluoroelastomer, and tetrapropylene fluoroelastomer.

[0044] According to an embodiment of the present invention, wherein the reinforcing agent is selected from the group consisting of carbon black and fumed silica.

[0045] According to an embodiment of the present invention, wherein the heat insulation material is selected from the group consisting of diatomaceous earth and sepiolite powder.

[0046] According to an embodiment of the present invention, wherein the processing aids are selected from the group consisting of palm wax and erucylamine.

[0047] According to an embodiment of the present invention, wherein the acid absorbent is selected from the group consisting of calcium hydroxide and magnesium oxide.

[0048] According to an embodiment of the present invention, wherein the crosslinking agent is selected from the group consisting of BIBP, triallyl isocyanurate, hexafluoroisopropyl diphenol, and benzyltriphenylphosphonium chloride.

[0049] According to an embodiment of the present invention, wherein at least one of the middle layers is disposed between the two surface layers for multi-layer vulcanization combination, and the protective layers of the surface layers are respectively located on the outer sides.

[0050] According to an embodiment of the present invention, the positioning device includes two reinforcing parts respectively formed on the surfaces of the two protective layers. The reinforcing parts extend outward from both ends of a positioning rubber wall of the positioning device to form a flange, and the flange is bonded to the surface of the surface layer.

[0051] According to the present invention, a manufacturing method of a multi-layer lamination positioning slow-heating buffer pad for a circuit board, which can achieve the foregoing objects and other objects and advantages, includes the following steps:

[0052] (A) Form a surface layer through a spraying process;

[0053] (B) Form a rubber film layer of a middle layer through a rubber refining process;

[0054] (C) Form at least one hole glue placement hole on the surface layer and the middle layer respectively;

[0055] (D) When the surface layer, a second substrate of the middle layer, and the rubber film layer are laminated, place a hole glue into the hole glue placement hole where the surface layer and the middle layer are aligned;

[0056] (E) Bond the surface layer and the middle layer through a vulcanization process; and

[0057] (F) Form the multi-layer lamination positioning slow-heating buffer pad for the circuit board having at least one positioning hole through a cutting and edge-sealing process and a punching process.

[0058] According to an embodiment of the present invention, in step (A), a protective layer is cured on a first substrate through the spraying process to form the surface layer.

[0059] According to an embodiment of the present invention, in step (B), the rubber film layer is formed through a rubber batching process, a premixed rubber preparation process, a premixed rubber vulcanization process, and a calendering film formation process.

[0060] According to an implementation method of the present invention, in the process of preparing the mixed rubber, rubber is put into a Banbury mixer with an air pressure of 0.6 - 0.8 MPa. After the dropping hammer, the material temperature is shown to rise to 80 - 90 degrees. Then, heat-resistant materials and reinforcing materials are successively put in. After the dropping hammer is pressed, after the rubber absorbs the powder, an acid absorbent and processing aids are put in. When the temperature rises to 110 degrees, the hammer is lifted to perform a cleaning action. When the temperature rises to 120 degrees, the material is discharged to an open mill to form a film. Among them, through the open mill with a roll gap of 0.5 - 1 mm, it is passed thinly three times or more and wrapped in a triangle three times or more. Then, with a roll gap of 5 - 10 mm, it is passed thickly three times or more, and the sheet thickness is about 5 - 10 mm. In the process of vulcanizing the mixed rubber, the prepared mixed rubber is put into the Banbury mixer again. When the temperature rises to 85 - 90 degrees, a cross-linking agent is put in. When the temperature rises to 95 degrees, the material is discharged. In the open mill, with a roll gap of 5 mm, after passing three times, it passes through a roll gap of 0.5 - 1 mm three times or more thinly, and then is passed thickly to form small rolls of 1 - 2 kg and is conveyed to a calender. In the process of calendering into a film, it is calendered into a film through the calender, supported by a release PE film and conveyed out, and wound into a roll. Among them, the upper, middle, and lower roll temperatures of the calender are set at 80 - 90 degrees, the width is 1350 - 1400 mm, the thickness is set according to requirements, and the thickness tolerance of the rubber film is within 0.03 mm.

[0061] According to an implementation method of the present invention, in step (D), the materials of the hole rubber include methyl vinyl silicone rubber, fumed silica, peroxide vulcanizing agent, zinc stearate, vinyltrimethoxysilane, α, ω-dihydroxypolydimethylsiloxane, and cerium oxide. The mass fractions of the hole rubber are as follows:

[0062] Methyl vinyl silicone rubber: 100

[0063] Fumed silica: 40

[0064] Peroxide vulcanizing agent: 4

[0065] Zinc stearate: 1

[0066] Vinyltrimethoxysilane 0.1

[0067] α, ω-dihydroxypolydimethylsiloxane: 3

[0068] Cerium oxide: 0.5.

[0069] According to an implementation method of the present invention, in step (E), the laminated surface layer and the middle layer are introduced into a vulcanizer for vulcanization pressing and then undergo secondary full vulcanization in an oven. The conditions of the vulcanization process S3 are: 160 degrees, a pressure of 30 - 35 kg / cm2, a vulcanization pressing time of 25 - 35 Min, a secondary vulcanization temperature of 200 degrees, and a time of 9 hours.

[0070] According to an implementation method of the present invention, in step (F), the hole glue disposed in the hole glue placement hole is punched to form the positioning hole.

[0071] According to the present invention, a manufacturing device for a multi-layer lamination positioning slow-heating buffer pad of a circuit board that can achieve the foregoing and other objectives and advantages includes:

[0072] A spraying machine that cures a protective layer on a first substrate to form a surface layer;

[0073] A rubber refining unit that forms a rubber film layer of a middle layer;

[0074] A vulcanization unit that stacks the surface layer, the rubber film layer, and the second substrate layer that have been pre-formed with at least one hole glue placement hole, places a hole glue into the hole glue placement hole, vulcanizes and forms a combined layer, and performs secondary vulcanization through an oven of the vulcanization unit;

[0075] A cutting and edge-sealing unit that cuts and deburrs and seals the edge of the combined layer to form at least one non-hole buffer pad; and

[0076] A punching machine that punches the hole glue on the non-hole buffer pad to form the multi-layer lamination positioning slow-heating buffer pad of the circuit board with at least one positioning hole.

[0077] Through the understanding of the subsequent description and the drawings, further objectives and advantages of the present invention will be fully embodied.

[0078] These and other objectives, features, and advantages of the present invention are fully embodied through the following detailed description, drawings, and claims. Description of the Drawings

[0079] Figures 1A to 1D is a schematic structural diagram of a multi-layer lamination positioning slow-heating buffer pad of a circuit board according to a preferred embodiment of the present invention.

[0080] Figure 2 is a manufacturing flow chart of a multi-layer lamination positioning slow-heating buffer pad of a circuit board according to a preferred embodiment of the present invention.

[0081] Figure 3 is a logical schematic diagram of a manufacturing flow device of a multi-layer lamination positioning slow-heating buffer pad of a circuit board according to a preferred embodiment of the present invention. Detailed Implementation Modes

[0082] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description of the present invention can be applied to other embodiments, variants, improvements, equivalent schemes, and other technical solutions without departing from the spirit and scope of the present invention.

[0083] Those skilled in the art should understand that in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on the present invention.

[0084] It can be understood that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of the element can be multiple. The term "a" should not be construed as a limitation on the quantity.

[0085] As Figure 1A shown to Figure 2 shown, there is a multi-layer lamination positioning slow-heating buffer pad for a circuit board and its manufacturing method according to the first preferred embodiment of the present invention. The multi-layer lamination positioning slow-heating buffer pad 1 for the circuit board includes at least one surface layer 10 and at least one middle layer 20. The surface layer 10 and the middle layer 20 respectively have at least one hole glue placement hole 101, 201. When the surface layer 10 and the middle layer 20 are laminated, the hole glue placement hole 101 of the surface layer 10 and the hole glue placement hole 201 of the middle layer 2 are aligned with each other. Then, a hole glue 3 is placed into the hole glue placement holes 101, 201, and then through a vulcanization process S3, a positioning device 30 is formed in the hole glue 3. Finally, the multi-layer lamination positioning slow-heating buffer pad 1 for the circuit board is formed. It is worth mentioning that the positioning device 30 includes a positioning hole 301 and a positioning glue wall 302. The positioning glue wall 302 is formed around the hole glue placement holes 101, 201, and the positioning hole 301 is located in the middle of the positioning glue wall 302. In other words, after the positioning hole 301 is formed in the hole glue 3, the hole wall of the positioning hole 301 is the positioning glue wall 302.

[0086] It can be understood that at least one first hole glue placement hole 101 is provided at a specific position of the surface layer 10, and at least one second hole glue placement hole 201 is also provided at a specific position of the middle layer 20. When the surface layer 10 and the middle layer 20 are laminated, the first hole glue placement hole 101 at the specific position is aligned with the second hole glue placement hole 201 at the specific position, and then the hole glue 3 is filled into the aligned first hole glue placement hole 101 and the second hole glue placement hole 201. Then, by means of additional punching, the positioning hole 301 is formed in the middle of the hole glue 3. As Figures 1A to 1B shown. In particular, when filling the hole glue 3, the hole glue 3 can also form a strengthening part 303 on the surface of the surface layer 10 or the middle layer 20 to strengthen the bonding strength between the hole glue 3 and the surface layer 10 or the middle layer 20, as Figure 1C and Figure 1D shown. In other words, the strengthening part 303 extends outward from both ends of the positioning glue wall 302 to form a flange, and the flange is bonded to the surface of the surface layer 10 or the middle layer 20 to form the strengthening part 303, which will further ensure the bonding strength between the positioning device 30 and the surface layer 10 and the middle layer 20.

[0087] It is worth mentioning that the middle layer 20 of the present invention can be set according to the required number of layers. In other words, the multi-layer laminated positioning slow-heating buffer pad 1 for a circuit board is composed of at least one or at least two surface layers 10 and at least one or multiple middle layers 20. That is to say, the multi-layer laminated positioning slow-heating buffer pad 1 for a circuit board can be composed of two surface layers 10 and at least one middle layer 20, and the middle layer 20 is arranged between the two surface layers 10. Or, the multi-layer laminated positioning slow-heating buffer pad 1 for a circuit board is formed by laminating and combining one surface layer 10 and at least one middle layer 20. In addition, the surface layer 10 includes a first base material 11 and a protective layer 12. The protective layer 12 is cured on the first base material 11 through a spraying process S1 to form the surface layer 10. It is worth mentioning that after the protective layer 12 is cured on the first base material 11, holes are punched in the surface layer 10 to form the first hole glue placement hole 101. The middle layer 20 includes a second base material 21 and a rubber film layer 22. According to product requirements, the middle layer 20 is composed of alternating laminations of the second base material 21 and the rubber film layer 22, and the number of layers or the thickness can be adjusted according to actual needs. It is worth mentioning that before combining the surface layer 10 and the middle layer 20, holes are respectively punched in the second base material 21 and the rubber film layer 22 of the middle layer 20 to form the second hole glue placement hole 201.

[0088] In addition, as Figure 1AAs shown, the structure of the multi-layer lamination positioning slow-heating buffer pad 1 of the circuit board is the protective layer 12, the first base material 11, the middle layer 20, the first base material 11, and the protective layer 12, where the number of layers or the thickness of the middle layer 20 is adjusted according to actual requirements. Or, as Figure 1B shown, the heat-resistant and temperature-resistant elastic rubber pad 1 can also be composed of one surface layer 10 and at least one middle layer 20, that is, combined by one protective layer 12, one first base material 11, and at least one middle layer 20, but this is not a limitation of the present invention.

[0089] In the embodiment of the first base material 11 of the surface layer 10, it is a plain woven alkali-free glass fiber cloth with a thickness of 0.18 mm, a basis weight of 280 grams, a warp density of 44 counts, and a weft density of 32 counts. In the embodiment of the second base material 21 of the middle layer 20, it is a twill alkali-free glass fiber cloth with a special weaving method, a thickness of 0.45 mm, a basis weight of 500 grams, a warp density of 48 counts, and a weft density of 36 counts. The protective layer 12 includes a water-based polytetrafluoroethylene resin PTFE water-based system dispersion liquid, a thickening agent, a coupling agent, and the mass fractions are as follows:

[0090] PTFE water-based dispersion liquid: 100

[0091] Thickening agent: 0.15

[0092] Coupling agent: 0.08

[0093] Water: 10

[0094] Furthermore, in the spraying process S1, the protective layer 12 is implemented as a water-based PTFE dispersion liquid, where the curing thickness of the protective layer 12 is 0.02 - 0.04 mm, the curing temperature of the protective layer 12 is 380 degrees, and the time is 10 - 20 minutes.

[0095] In the embodiment of the second base material 21 of the middle layer 20, it is a twill glass fiber cloth with a special weaving method, and the electronic grade alkali-free glass fiber is used. The rubber film layer 22 is formed through a rubber refining process S2. The materials for refining the rubber film layer 22 include rubber, reinforcing materials, cross-linking agents, heat-resistant materials, acid absorbents, and processing aids. Among them, the mass fractions are as follows:

[0096] Rubber: 100

[0097] Reinforcing materials: 15 - 20

[0098] Heat-resistant fillers: 15 - 30

[0099] Cross-linking agent: 3 - 6

[0100] Calcium hydroxide: 3 - 6

[0101] Magnesium oxide: 3 - 6

[0102] Processing aids: 2 - 10.

[0103] The rubber refining process S2 includes a rubber batching process S201, a premixed rubber preparation process S202, a vulcanization process S203 for the premixed rubber, and a calendaring process S204.

[0104] In the rubber batching process S201, a certain proportion of rubber is cut, and a certain proportion of reinforcing materials, crosslinking agents, heat - resistant materials, acid absorbents, and tackifiers are weighed and placed into a container corresponding to their respective names.

[0105] In the premixed rubber preparation process S202, the rubber is put into a mixer. The air pressure is 0.6 - 0.8 MPa. After the hammer drops, when the material temperature rises to 80 - 90 degrees, the heat - resistant material, reinforcing material are put in successively. After the hammer drops and presses, after the rubber absorbs the powder, the acid absorbent and processing aids are put in. When the temperature rises to 110 degrees, the hammer is lifted for cleaning. When the temperature rises to 120 degrees, the material is discharged to an open mill to form a film. Further, through the open mill with a roll gap of 0.5 - 1 mm, thin - passing three times or more, triangular wrapping three times or more, then with a roll gap of 5 - 10 mm, thick - passing three times or more, and the sheet thickness is about 5 - 10 mm. After cooling for 24 hours, it is ready for use. In other words, the water temperature of the open mill is not more than 30 degrees, the roll temperature does not exceed 80 degrees, the roll gap is 0.5 - 1 mm, thin - passing three times or more, triangular wrapping three times or more, the roll gap is 5 - 10 mm, thick - passing three times or more, the sheet thickness is about 5 - 10 mm, and it is parked for 24 hours and then ready for use, where the film is a thick film.

[0106] In the vulcanization process S203 for the premixed rubber, the premixed rubber that has been prepared is put into the mixer again. When the temperature rises to 85 - 90 degrees, the crosslinking agent is put in. When the temperature rises to 95 degrees, the material is discharged. In the open mill, the roll gap is 5 mm. After passing through three times, through a roll gap of 0.5 - 1 mm, thin - passing three times or more, and then thick - passing to form small rolls of 1 - 2 kg. It is then conveyed to a calender.

[0107] In the calendaring process S204, it is sent to the calender for calendaring into a film, which is supported by a release PE film and conveyed out and wound into a roll. Among them, the upper, middle, and lower roll temperatures of the calender are set at 80 - 90 degrees, the width is 1350 - 1400 mm, the thickness is set according to requirements, and the thickness tolerance of the rubber film is within 0.03 mm.

[0108] In the vulcanization process S3, first, the surface layer 10 and the middle layer 20 are respectively punched according to customer requirements to form the hole glue placement holes 101 and 201, then the hole glue 30 is placed, and a vulcanizer is introduced for vulcanization pressing. After being fully vulcanized twice in an oven and cooled, it undergoes a slitting and edge-sealing process by a cutting machine, and then the hole positions are punched by a punching machine, that is, the hole glue 30 is punched to form the positioning holes 301, and finally, the multi-layer laminated positioning slow-heating buffer pad 1 for the circuit board is formed. The conditions of the vulcanization process S3 are: 160 degrees, pressure 30 - 35 kg / cm2, vulcanization pressing time 25 - 35 Min, secondary vulcanization temperature 200 degrees, and time 9 hours.

[0109] The components used for the hole glue 30 include: methyl vinyl silicone rubber, fumed silica, peroxide vulcanizing agent, zinc stearate, vinyltrimethoxysilane, α,ω-dihydroxypolydimethylsiloxane, and cerium oxide.

[0110] The hole glue is in parts by mass: methyl vinyl silicone rubber: 100, fumed silica: 40, peroxide vulcanizing agent: 4, zinc stearate: 1, vinyltrimethoxysilane: 0.1, α,ω-dihydroxypolydimethylsiloxane: 3, cerium oxide: 0.5.

[0111] In the rubber refining process S2, the rubber is fluororubber, further a group consisting of terpolymer fluororubber, binary fluororubber, and tetrapropylene fluororubber. The reinforcing agent is a group consisting of carbon black and fumed silica. The heat-resistant material is a group consisting of diatomite and sepiolite powder. The processing aid is a group consisting of palm wax. The acid absorbent is a group consisting of calcium hydroxide and magnesium oxide. The crosslinking agent is a group consisting of BIBP, triallyl isocyanurate, hexafluoroisopropyl diphenol, and benzyltriphenylphosphonium chloride.

[0112] The rubber mixing is in parts by mass: fluororubber 100, carbon black N990 8, fumed silica 10, diatomite 12, calcium hydroxide 6, magnesium oxide 3, palm wax 1.5, hexafluoroisopropyl diphenol 1.5, benzyltriphenylphosphonium chloride 0.5.

[0113] As Figure 2 shown, the present invention also provides a manufacturing method for the multi-layer laminated positioning slow-heating buffer pad 1 for the circuit board, which includes the following steps:

[0114] (A) Form a surface layer 10 through a spraying process S1;

[0115] (B) Form a rubber film layer 22 of a middle layer 20 through a rubber refining process S2;

[0116] (C) Form at least one hole glue placement hole 101 and 201 on the surface layer 10 and the middle layer 20 respectively;

[0117] (D) When the surface layer 10 is laminated with a second base material 21 of the middle layer 20 and the rubber film layer 22, a hole glue 3 is placed into the hole glue placement holes 101, 201 where the surface layer 10 and the middle layer 20 are aligned;

[0118] (E) Bond the surface layer 10 and the middle layer 20 through a vulcanization process S3; and

[0119] (F) Form the multi-layer laminated positioning slow-heating and buffering pad 1 of the circuit board with at least one positioning hole 301 through a cutting and edge-sealing process S4 and a punching process S5.

[0120] In step (A), the protective layer 12 is cured on the first base material 11 through the spraying process S1.

[0121] The protective layer 12 is implemented as an aqueous PTFE dispersion. The cured thickness of the protective layer 12 is 0.02 - 0.04 mm, the curing temperature of the protective layer 12 is 380 degrees, and the time is 10 - 20 minutes.

[0122] In step (B), the rubber refining process S2 includes a rubber batching process S201, a premixed rubber preparation process S202, a vulcanized rubber addition process S203, and a calendering and film-forming process S204.

[0123] In the rubber batching process S201, a certain proportion of rubber is cut, and a certain proportion of reinforcing materials, cross-linking agents, heat-resistant materials, acid absorbents, and tackifiers are weighed and placed into a container with the corresponding product names.

[0124] In the premixed rubber preparation process S202, the rubber is put into a kneader, the air pressure is 0.6 - 0.8 MPa. After the drop hammer, when the material temperature rises to 80 - 90 degrees, the heat-resistant material and the reinforcing material are successively put in, and the drop hammer is pressurized. After the rubber absorbs the powder, the acid absorbent and processing aids are put in. When the temperature rises to 110 degrees, the hammer is lifted for cleaning. When the temperature rises to 120 degrees, the material is unloaded to an open mill to form a rubber sheet. Further, through the open mill with a roll gap of 0.5 - 1 mm, thin pass three times or more, triangle wrap three times or more, then with a roll gap of 5 - 10 mm, thick pass three times or more, and the sheet thickness is about 5 - 10 mm. After cooling for 24 hours, it is ready for use. In other words, the water temperature of the open mill is not more than 30 degrees, the roll temperature does not exceed 80 degrees, the roll gap is 0.5 - 1 mm, thin pass three times or more, triangle wrap three times or more, the roll gap is 5 - 10 mm, thick pass three times or more, the sheet thickness is about 5 - 10 mm, and it is parked for 24 hours and then ready for use, where the rubber sheet is a thick sheet.

[0125] In the vulcanization process S203 of the mixed rubber, the prepared mixed rubber is put into the internal mixer again. When the temperature rises to 85 - 90 °C, a crosslinking agent is added. When the temperature rises to 95 °C, the material is discharged. In the open mill, the roll gap is 5 mm. After passing through three times, it passes through a roll gap of 0.5 - 1 mm, and is passed thinly three times or more, and then thickly passed to form small rolls of 1 - 2 kg. It is then transported to a calender.

[0126] In the calendering and film - forming process S204, it is sent to the calender to be calendered into a film, which is supported by a release PE film and conveyed out and wound into a roll. Among them, the upper, middle, and lower roll temperatures of the calender are set at 80 - 90 °C, the width is 1350 - 1400 mm, the thickness is set according to requirements, and the thickness tolerance of the rubber film is within 0.03 mm.

[0127] In step (D), the components used in the hole rubber 30 include: methyl vinyl silicone rubber, fumed silica, peroxide vulcanizing agent, zinc stearate, vinyltrimethoxysilane, α,ω - dihydroxypolydimethylsiloxane, and cerium oxide.

[0128] For the hole rubber by mass fraction: methyl vinyl silicone rubber: 100, fumed silica: 40, peroxide vulcanizing agent: 4, zinc stearate: 1, vinyltrimethoxysilane: 0.1, α,ω - dihydroxypolydimethylsiloxane: 3, cerium oxide: 0.5.

[0129] In step (E), in the vulcanization process S3, the laminated surface layer 10 and middle layer 20 are introduced into a vulcanizer 931 for vulcanization pressing, and then passed through an oven 932 for secondary full vulcanization. The conditions of the vulcanization process S3 are: 160 °C, pressure 30 - 35 kg / cm², vulcanization pressing time 25 - 35 min, secondary vulcanization temperature 200 °C, and time 9 hours.

[0130] In step (F), in the punching process S5, the hole rubber 3 arranged in the hole rubber placement holes 101, 201 is punched to form the positioning holes 301. It can be understood that in the punching process S5, at least one positioning device 30 is formed on at least one of the hole rubbers 3 of the multi - layer laminated positioning slow - heat buffer pad 1 of the circuit board. Each positioning device 30 includes a positioning hole 301 and a positioning rubber wall 302. The positioning rubber wall 302 is formed by surrounding, and the positioning hole 301 is located in the middle of the positioning rubber wall 302. In other words, the positioning rubber wall 302 is the structure after the hole rubber 3 removes the positioning hole 301.

[0131] As Figure 3 shown, the present invention also provides a manufacturing device for the multi - layer laminated positioning slow - heat buffer pad 1 of the circuit board.

[0132] The manufacturing equipment 90 of the multi-layer lamination positioning slow-heating buffer pad 1 for the circuit board includes a spraying machine 91, a rubber refining unit 92, a vulcanizing unit 93, a cutting and edge-sealing unit 94, and a punching machine 95.

[0133] A surface layer 10 is formed by the spraying machine 91. The rubber refining unit 92 includes a Banbury mixer 921, an open mill 922, and a calender 923 to form a rubber film layer 22 of a middle layer 20. After rubber, heat-resistant materials, reinforcing materials are subjected to drop hammer pressing and the rubber absorbs powder, an acid absorbent and processing aids are added and mixed in a Banbury mixer 921 and then sent to an open mill 922 to form a rubber sheet, and the rubber sheet is conveyed to a calender 923 to form the rubber film layer 22 of the middle layer 20.

[0134] The vulcanizing unit 93 includes a vulcanizer 931 and an oven 932. The surface layer 10 and the middle layer 20 provided with the hole rubber 3 are introduced into the vulcanizer 931 to be vulcanized and pressed to form a bonding layer 4, and then are fully vulcanized for a second time through the oven 932. The cutting and edge-sealing unit 94 includes a cutting machine 941 and an edge-sealing machine 942. The vulcanized bonding layer 4 is cut by the cutting machine 941 and edge-sealed by the edge-sealing machine 942 to form at least one non-porous buffer pad 5. The punching machine 95 punches on the hole rubber 3 of the non-porous buffer pad so that the multi-layer lamination positioning slow-heating buffer pad 1 for the circuit board has at least one positioning hole 301.

[0135] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention.

[0136] The object of the present invention has been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments. Without departing from the above principles, the embodiments of the present invention can be deformed or modified in any way.

Claims

1. A multi-layer lamination positioning slow-heating buffer pad for a circuit board, characterized in that, Comprising: At least one surface layer, wherein each said surface layer includes a first substrate and a protective layer, the protective layer being located on the surface of the first substrate, and at least one first hole glue placement hole being provided at a specific position of each said surface layer; At least one middle layer, wherein each said middle layer includes a second substrate and a rubber film layer, at least one of said second substrates and at least one of said rubber film layers being alternately stacked, and at least one second hole glue placement hole being provided at a specific position of each said middle layer; And At least one positioning device, wherein when the surface layer and the middle layer overlap, the positioning device is located at the mutually aligned first hole glue placement holes and the second hole glue placement holes, and the surface layer, the middle layer and the positioning device are combined through a vulcanization process; Wherein each said positioning device includes a positioning hole and a positioning glue wall, the positioning glue wall being formed around the hole glue placement hole, and the positioning hole being located in the middle of the positioning glue wall; Wherein the positioning device includes two strengthening parts respectively formed on the surfaces of the protective layer and the rubber film layer, and the strengthening parts extend outward from both ends of the positioning glue wall to form a flange; Wherein at least one of said middle layers is disposed between two said surface layers for multi-layer vulcanization combination, and the protective layers of the surface layers are respectively located on the outer sides; Wherein the positioning device includes two strengthening parts respectively formed on the surfaces of two said protective layers, the strengthening parts extend outward from both ends of a positioning glue wall of the positioning device to form a flange, and the flange is combined with the surface of the surface layer; Wherein the positioning device is formed by a hole glue, and the material of the hole glue includes methyl vinyl silicone rubber, fumed silica, peroxide vulcanizing agent, zinc stearate, vinyl methoxysilane, α, ω-dihydroxy polydimethylsiloxane, cerium oxide, and the mass parts of the hole glue are as follows: Methyl vinyl silicone rubber: 100 Fumed silica: 40 Peroxide vulcanizing agent: 4 Zinc stearate: 1 Vinyl methoxysilane: 0.1 α, ω-dihydroxy polydimethylsiloxane: 3 Cerium oxide: 0.5; The number of layers of the multi-layer lamination positioning slow heat buffer pad for a circuit board is 24 to 40 layers.

2. The multi-layer lamination positioning slow heat buffer pad for a circuit board according to claim 1, wherein the protective layer is cured on the first substrate through a spraying process.

3. The multi-layer lamination positioning slow heat buffer pad for a circuit board according to claim 1, wherein the first substrate of the surface layer is an example of a plain woven alkali-free glass fiber cloth with a thickness of 0.18 mm, a basis weight of 280 grams, a warp density of 44 counts, and a weft density of 32 counts, and the thickness of the protective layer is 0.02 - 0.04 mm. The protective layer includes an aqueous polytetrafluoroethylene resin PTFE aqueous system dispersion liquid, a thickening agent, a coupling agent, and water, and the mass parts are as follows: PTFE aqueous dispersion liquid: 100 Thickening agent: 0.15 Coupling agent: 0.08 Water:

10.

4. The multi-layer lamination positioning slow-heating buffer pad for a circuit board according to claim 1, wherein the second substrate of the middle layer is a twill non-alkali fiberglass cloth with a special weaving method, having a thickness of 0.45 mm, a basis weight of 500 grams, a warp density of 48 counts, and a weft density of 36 counts. The material of the rubber film layer includes rubber, reinforcing material, cross-linking agent, heat-resistant material, acid absorbent, and processing aids, and the mass parts are as follows: Rubber: 100 Reinforcing material: 15 - 20 Heat-resistant material: 15 - 30 Cross-linking agent: 3 - 6 Calcium hydroxide: 3 - 6 Magnesium oxide: 3 - 6 Processing aids: 2 - 10.

5. The multi-layer lamination positioning slow-heating buffer pad for a circuit board according to claim 4, wherein the rubber is selected from the group consisting of terpolymer fluoroelastomer, binary fluoroelastomer, and tetrapropylene fluoroelastomer.

6. The multi-layer lamination positioning slow-heating buffer pad for a circuit board according to claim 4, wherein the reinforcing material is selected from the group consisting of carbon black and fumed silica.

7. The multi-layer lamination positioning slow-heating buffer pad for a circuit board according to claim 4, wherein the heat-resistant material is selected from the group consisting of diatomaceous earth and sepiolite powder.

8. The multi-layer lamination positioning slow-heating buffer pad for a circuit board according to claim 4, wherein the processing aids are selected from the group consisting of palm wax and erucyl amine.

9. The multi-layer lamination positioning slow-heating buffer pad for a circuit board according to claim 4, wherein the acid absorbent is selected from the group consisting of calcium hydroxide and magnesium oxide.

10. The multi-layer lamination positioning slow-heating buffer pad for a circuit board according to claim 4, wherein the cross-linking agent is selected from the group consisting of BIBP, triallyl isocyanurate, hexafluoroisopropyl diphenol, and benzyl triphenyl phosphonium chloride.

11. A manufacturing method of a multi-layer pressing positioning slow-heating buffer pad for a circuit board, characterized in that, It includes the following steps: (A) Form a surface layer through a spraying process; (B) Form a rubber film layer of the middle layer through a rubber refining process; (C) Form at least one hole rubber placement hole on the surface layer and the middle layer respectively; (D) When the surface layer, the second substrate of the middle layer, and the rubber film layer are laminated, place a hole rubber into the hole rubber placement hole where the surface layer and the middle layer are aligned; (E) Combine the surface layer and the middle layer through a vulcanization process; and (F) Form the multi-layer lamination positioning slow-heating buffer pad for the circuit board with at least one positioning hole through a cutting and edge-sealing process and a punching process; wherein in step (D), the material of the hole rubber includes methyl vinyl silicone rubber, fumed silica, peroxide vulcanizing agent, zinc stearate, vinyl methoxysilane, α,ω-dihydroxy polydimethylsiloxane, and cerium oxide, and the mass parts of the hole rubber are as follows: Methyl vinyl silicone rubber: 100 Fumed silica: 40 Peroxide vulcanizing agent: 4 Zinc stearate: 1 Vinyl methoxysilane: 0.1 α,ω-dihydroxy polydimethylsiloxane: 3 Cerium oxide: 0.5; Among them, in step (E), the surface layer and the middle layer of the laminate are introduced into a vulcanizer for vulcanization pressing, and then passed through an oven for secondary full vulcanization. The conditions of the vulcanization process S3 are: 160 degrees, pressure 30 - 35 kg / cm 2 , the vulcanization pressing time is 25 - 35 minutes, the secondary vulcanization temperature is 200 degrees, and the time is 9 hours; wherein in step (F), the hole rubber disposed in the hole rubber placement hole is punched to form the positioning hole.

12. The manufacturing method of the multi-layer lamination positioning slow-heating buffer pad for a circuit board according to claim 11, wherein in step (A), a protective layer is cured on a first substrate through the spraying process to form the surface layer.

13. The manufacturing method of the multi-layer lamination positioning slow-heating buffer pad for a circuit board according to claim 12, wherein in step (B), the rubber film layer is formed through a rubber compounding process, a prefabrication process of the mixed rubber, a vulcanization process of the mixed rubber, and a calendering process.

14. The manufacturing method of the multi-layer lamination positioning slow-heating buffer pad for a circuit board according to claim 13, wherein in the prefabrication process of the mixed rubber, rubber is put into a kneader, the air pressure is 0.6 - 0.8 MPa, after the drop hammer, when the material temperature rises to 80 - 90 degrees, heat-resistant materials and reinforcing materials are sequentially put in, and after the drop hammer is pressurized and the rubber absorbs the powder, an acid absorbent and processing aids are put in. When the temperature rises to 110 degrees, the hammer is lifted for cleaning, and when the temperature rises to 120 degrees, the material is discharged to an open mill to form a rubber sheet. Through the open mill, the roll gap is 0.5 - 1 mm, thin pass is carried out three times or more, and triangular wrapping is carried out three times or more. Then, the roll gap is 5 - 10 mm, and thick pass is carried out three times or more, and the sheet thickness is 5 - 10 mm. In the vulcanization process of the mixed rubber, the prepared mixed rubber is put into the kneader again. When the temperature rises to 85 - 90 degrees, a cross-linking agent is put in, and when the temperature rises to 95 degrees, the material is discharged. In the open mill, the roll gap is 5 mm, after passing through three times, it passes through a roll gap of 0.5 - 1 mm, and thin pass is carried out three times or more. Then, it is thick passed into small rolls of 1 - 2 kg and conveyed to a calender. In the calendering process, it is calendered into a film by the calender, supported by a release PE film and conveyed out, and wound into a roll. The upper, middle, and lower roll temperatures of the calender are set at 80 - 90 degrees, the width is 1350 - 1400 mm, the thickness is set according to requirements, and the thickness tolerance of the rubber film is within 0.03 mm.

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