Multi-color LED lamp bead packaging structure and control system thereof

Abstract

The application discloses a multi-color LED lamp bead packaging structure and a control system thereof. The packaging structure comprises a packaging shell, a main support and at least one auxiliary support arranged in the packaging shell, a main electrode plate arranged on the main support, an auxiliary electrode plate arranged on the auxiliary support, the main electrode plate arranged at the center of the packaging shell, the auxiliary electrode plate arranged outside the main electrode plate, the main electrode plate in a circular arc shape in cross section, a driving chip and a plurality of LED light emitting chips arranged on the inner side wall of the main electrode plate, one end of the LED light emitting chip electrically connected with the driving chip, the other end of the LED light emitting chip electrically connected with the main electrode plate, the driving chip electrically connected with the main electrode plate and the auxiliary electrode plate respectively, the main electrode plate electrically connected with the main support, and the auxiliary electrode plate electrically connected with the auxiliary support. The application has the advantages of consistent light emitting color and brightness, uniform color and focusing, high production yield of the lamp bead, low production cost, long service life, and the use of two signal lines to complete the lighting of multiple LED lamp beads.

Description

TECHNICAL FIELD

[0001] The present application relates to the LED related technical field, especially to a multi-color LED lamp bead packaging structure and a control system thereof. BACKGROUND

[0002] Due to the wide application of LED, the forms of LED lamps are various, in order to reduce the volume of the lamp and improve the integration of the lamp, more and more products seal the driving chip and the LED light emitting chip together, so that the number of external leads can be solved, the cost can be reduced, and the reliability can be improved.

[0003] The structure of the commonly used driving chip and the multi-color (RGB, RGBWW, etc.) LED light emitting chip sealed together into a lamp bead on the market is as shown in the following Figure 16 、 Figure 17 .

[0004] The structure design of the LED lamp bead in the above-mentioned figure has the following deficiencies and problems:

[0005] 1. Due to the large volume of the driving chip, the support platform for placing the driving chip is relatively large, so that the support with the driving chip may exceed 50% or more, and the LED light emitting chip is concentrated on the other side, so that the mixed color deviates from the center position, resulting in inconsistent light color when viewed from different angles.

[0006] 2. The structure of the planar support is not conducive to the multi-color LED lamp bead (RGB, RGBWW, etc.), that is, there are multiple LED light emitting chips in one lamp bead, red, green, blue, white, etc., due to the deviation of the placement position and the multiple LED light emitting chips being in the same horizontal plane, the multi-color mixing is uneven, the light is relatively divergent, the aggregation degree is not enough, and the user experience and image performance effect are affected.

[0007] 3. The structure of the planar support is not conducive to the point fluorescent powder (the point fluorescent powder mainly changes the light color of the lamp), the fluorescent powder is easy to flow out, so that the fluorescent powder is easy to mix with the surrounding LED light emitting chip, resulting in incorrect color, reducing the yield of the product, and increasing the cost. SUMMARY

[0008] The present application is to overcome the above-mentioned deficiencies in the prior art, and provides a multi-color LED lamp bead packaging structure with good light consistency and good condensing effect and a control system thereof.

[0009] In order to achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0010] The application discloses a multi-color LED lamp bead packaging structure, which comprises a packaging shell, a main support and at least one auxiliary support are arranged in the packaging shell, a main electrode plate is arranged on the main support, an auxiliary electrode plate is arranged on the auxiliary support, the main electrode plate is arranged at a central position of the packaging shell, the auxiliary electrode plate is arranged on the outer side of the main electrode plate, the cross section shape of the main electrode plate is in an arc shape, a driving chip and a plurality of LED light emitting chips are arranged on the inner side wall of the main electrode plate, one end of the LED light emitting chip is electrically connected with the driving chip, the other end of the LED light emitting chip is electrically connected with the main electrode plate, the driving chip is electrically connected with the main electrode plate and the auxiliary electrode plate respectively, the main electrode plate is electrically connected with the main support, and the auxiliary electrode plate is electrically connected with the auxiliary support.

[0011] In order to solve the above problems, the main support is made into a cup-shaped structure with an arc shape in the packaging shell, the driving chip and the LED light emitting chip are arranged around the cup-shaped main electrode plate, all the LED light emitting chips and the driving chip are arranged on the main support of the main electrode plate, and the auxiliary support can be made small, so that the LED light emitting chip of the lamp bead is close to the central position of the main electrode plate as much as possible. The design solves the problem that the color and brightness of the LED lamp bead are inconsistent when viewed from different angles, and solves the problem that the central position deviates after the color mixing of the plurality of LED light emitting chips in the lamp bead, leading to uneven color and non-focusing.

[0012] Preferably, a supporting plate is arranged at the central position of the inner bottom of the main electrode plate, the cross section shape of the supporting plate is in an arc shape, an LED light emitting chip is arranged at the central position of the inner bottom of the supporting plate, the other LED light emitting chips and the driving chip are uniformly distributed on the outer side of the supporting plate, and the supporting plate and the main electrode plate are detachably connected. For the lamp bead needing to be dotted with phosphor, a small cup-shaped supporting plate is additionally made in the cup-shaped main electrode plate, which is called a 'cup-in-cup' structure, so that the phosphor cannot be leaked when being dotted, and the problem that the production yield of the lamp bead is reduced and the production cost is increased due to the outflow of the phosphor when the LED light emitting chip is dotted with the phosphor in the production process is solved.

[0013] Preferably, the auxiliary electrode plates are uniformly distributed on the outer side of the main electrode plate, and the height of the auxiliary electrode plate is lower than the height of the opening end of the main electrode plate. Through the position design of the auxiliary electrode plate, the auxiliary electrode plate is arranged below the main electrode plate, so that the area of the main electrode plate is increased, and the light emitting effect of the LED light emitting chip is better.

[0014] As preferred, the driving chip is arranged at the center position of the inner bottom of the main electrode plate, the LED light emitting chips are uniformly distributed on the inner wall of the main electrode plate, and the LED light emitting chips are arranged at the position close to the opening end of the main electrode plate. The structure design of arranging the LED light emitting chips away from the driving chip is to make the light emitted by the LED light emitting chip more act on the main electrode plate to realize the effect of light collection, and if the LED light emitting chip is too close to the driving chip, the light emitted by the LED light emitting chip will be shielded by the driving chip. On the other hand, the driving chip will generate heat when in action, so arranging the LED light emitting chip away from the driving chip can reduce the influence of the heat dissipation of the driving chip on the LED light emitting chip, thereby improving the service life of the lamp bead.

[0015] As another preferred, the driving chip and the LED light emitting chip are uniformly distributed on the inner wall of the main electrode plate, the LED light emitting chip is arranged at the position close to the center of the bottom of the main electrode plate, and the driving chip is arranged at the position close to the opening end of the main electrode plate. Through the above structure design, the LED light emitting chip is arranged close to the center position of the main electrode plate, which improves the light collection effect of the main electrode plate. The driving chip is arranged away from the position of the main electrode plate, which is to reduce the shielding of the light emitted by the LED light emitting chip by the driving chip, and to reduce the influence of the driving chip on the LED light emitting chip, thereby improving the service life of the LED light emitting chip.

[0016] As preferred, the driving chip is arranged at the position close to the support plate, and the other LED light emitting chips are arranged at the position close to the opening end of the main electrode plate. The structure design of arranging the LED light emitting chip away from the driving chip is to make the light emitted by the LED light emitting chip more act on the main electrode plate to realize the effect of light collection, and if the LED light emitting chip is too close to the support plate, the light emitted by the LED light emitting chip will be shielded by the support plate. On the other hand, the design of arranging the driving chip close to the support plate is to increase the light receiving area of the main electrode plate, and the driving chip and the center LED light emitting chip are separated by the support plate, thereby improving the service life of the LED light emitting chip.

[0017] The application further provides a multi-color LED lamp bead control system, comprising a signal modulation circuit, a detection circuit, a signal driving circuit and a microcontroller, wherein the input ends of the signal modulation circuit are connected with the VDD end of a power supply and the output end of the microcontroller respectively, the output end of the signal modulation circuit is connected with the input end of the detection circuit and the input end of the signal driving circuit respectively, the output end of the detection circuit is connected with the input end of the microcontroller, and the output end of the signal driving circuit is connected with a plurality of multi-color LED lamp beads; the microcontroller controls the on-off of the multi-color LED lamp beads; the signal modulation circuit modulates and superimposes a control signal on the VDD end of the power supply, realizes the transmission of the control signal on the power supply signal, then demodulates and decodes the signal through the driving chip inside the multi-color LED lamp bead to obtain the control signal, so as to light up the multi-color LED lamp bead; the detection circuit detects the voltage and current on the VDD end of the power supply for adjusting the control signal; and the signal driving circuit generates the voltage and current signals required by the controlled multi-color LED lamp beads for lighting.

[0018] For the multi-color LED lamp bead with two feet, the microcontroller is used as the core of control to control the on-off mode of the LED lamp bead; the signal modulation circuit mainly modulates and superimposes a control signal on the power supply signal VDD, and the modulation mode that can be adopted here is pulse width modulation (PWM), single bus, FSK, ASK and other carrier modes, only the transmission of the control signal on the power supply signal is required, then the control signal can be obtained by demodulating and decoding the signal through the internal driving chip of the LED lamp bead, so as to light up the lamp bead; the detection circuit mainly detects the voltage and current of the power supply signal for adjusting the control signal; and the signal driving circuit mainly generates the voltage, current and other signals required by the controlled lamp or lamp string for lighting.

[0019] As a preferred, the connection mode of the multi-color LED lamp bead is one or more of series connection or parallel connection, and the output end of the signal driving circuit is connected with the driving chip in the multi-color LED lamp bead. The connection mode of the multi-color LED lamp bead can be parallel connection, series connection or series-parallel hybrid connection, which can be adjusted according to the actual product.

[0020] The application further provides another multi-color LED lamp bead control system, which comprises a detection circuit, a signal driving circuit and a microcontroller, the input end of the microcontroller is connected with the VDD end of a power supply, the VSS end of the power supply and the output end of the detection circuit respectively, the output end of the microcontroller is connected with the input end of the signal driving circuit, the input end of the signal driving circuit is connected with the VDD end of the power supply, the output end of the signal driving circuit is connected with a plurality of multi-color LED lamp beads, the signal driving circuit is provided with a signal input end and a signal output end, and the multi-color LED lamp beads are arranged between the signal input end and the signal output end; the microcontroller controls the on-off of the multi-color LED lamp beads; the detection circuit detects the voltage and current on the VDD end of the power supply for adjusting the control signal; the signal driving circuit generates the voltage, current and control signal required by the controlled multi-color LED lamp beads to light up and control the multi-color LED lamp beads.

[0021] For the multi-color LED lamp bead with 3 or 4 legs, in addition to the VDD end and the VSS end of the power supply, the signal line is also provided, at this time, the signal does not need to be carried on the power line, but is directly transmitted through the signal line on the signal driving circuit, the design on the microcontroller will be simpler, but the structure design of the multi-color LED lamp bead will be increased by 1-2 signal lines for transmission, which depends on the design method of the driving chip in the LED lamp bead.

[0022] As a preferred, the connection mode of the multi-color LED lamp bead is one or more of series connection or parallel connection, and the output end of the signal driving circuit is connected with the driving chip in the multi-color LED lamp bead.

[0023] The application has the advantages that the problem of inconsistent color and brightness of the LED lamp bead when viewed from different angles is solved, the problem of color unevenness and non-focusing caused by the deviation of the center position of the color mixed by a plurality of LED light emitting chips in the lamp bead is solved, the problem of reduced production yield and increased production cost of the lamp bead caused by the outflow of the LED light emitting chip when the fluorescent powder is applied to the LED light emitting chip in the production process is solved, the service life is long, the lighting of a plurality of LED lamp beads can be completed by using 2 signal lines through the carrier mode of PWM, single bus, FSK and ASK on the power line, and the connection mode of the LED lamp beads can be series connection or parallel connection. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is the structure diagram of the two bracket three LED light emitting chips of the application;

[0025] Figure 2 、 Figure 3 is Figure 1 the distribution structure diagram of the driving chip and the LED light emitting chip in

[0026] Figure 4 is a structural schematic diagram of two-support four-LED light emitting chip of the present application;

[0027] Figure 5 is Figure 4 is a distribution structure schematic diagram of driving chip and LED light emitting chip in the present application;

[0028] Figure 6 is a structural schematic diagram of three-support four-LED light emitting chip of the present application;

[0029] Figure 7 is Figure 6 is a distribution structure schematic diagram of driving chip and LED light emitting chip in the present application;

[0030] Figure 8 is another structural schematic diagram of two-support three-LED light emitting chip of the present application;

[0031] Figure 9 is Figure 8 is a distribution structure schematic diagram of driving chip and LED light emitting chip in the present application;

[0032] Figure 10 is another structural schematic diagram of two-support four-LED light emitting chip of the present application;

[0033] Figure 11 is Figure 10 is a distribution structure schematic diagram of driving chip and LED light emitting chip in the present application;

[0034] Figure 12 is another structural schematic diagram of three-support three-LED light emitting chip of the present application;

[0035] Figure 13 is Figure 12 is a distribution structure schematic diagram of driving chip and LED light emitting chip in the present application;

[0036] Figure 14 is another structural schematic diagram of three-support four-LED light emitting chip of the present application;

[0037] Figure 15 is Figure 14 is a distribution structure schematic diagram of driving chip and LED light emitting chip in the present application;

[0038] Figure 16 、 Figure 17 is a structural schematic diagram of prior art;

[0039] Figure 18 is a structural block diagram of one kind of control system in the present application;

[0040] Figure 19 is a structural block diagram of another kind of control system in the present application.

[0041] Fig. 1. LED light-emitting chip, 2. main support, 3. auxiliary support, 4. driving chip, 5. main electrode plate, 6. auxiliary electrode plate, 7. support plate, 8. packaging shell. DETAILED DESCRIPTION

[0042] The application will be further described below in conjunction with the drawings and specific embodiments.

[0043] As Figure 1 , Figure 4 , Figure 6 The embodiment described in the above, a multi-color LED lamp bead packaging structure, comprising a packaging shell, the packaging shell is provided with a main support and at least one auxiliary support, the main support is provided with a main electrode plate, the auxiliary support is provided with an auxiliary electrode plate, the main electrode plate is arranged at the center position of the packaging shell, the auxiliary electrode plate is arranged at the outer side of the main electrode plate, the cross-sectional shape of the main electrode plate is arc-shaped, a driving chip and a plurality of LED light-emitting chips are arranged on the inner side wall of the main electrode plate, one end of the LED light-emitting chip is electrically connected with the driving chip, the other end of the LED light-emitting chip is electrically connected with the main electrode plate, the driving chip is electrically connected with the main electrode plate and the auxiliary electrode plate respectively, the main electrode plate is electrically connected with the main support, and the auxiliary electrode plate is electrically connected with the auxiliary support. The auxiliary electrode plates are uniformly distributed on the outer side of the main electrode plate, and the height of the auxiliary electrode plate is lower than the height of the opening end of the main electrode plate.

[0044] As Figure 3 , Figure 5 , Figure 7 The driving chip is arranged at the inner side bottom center position of the main electrode plate, and the LED light-emitting chips are uniformly distributed on the inner side wall of the main electrode plate, and the LED light-emitting chips are arranged at the position close to the opening end of the main electrode plate.

[0045] As Figure 2 The driving chip and the LED light-emitting chip are uniformly distributed on the inner side wall of the main electrode plate, the LED light-emitting chip is arranged at the position close to the bottom center of the main electrode plate, and the driving chip is arranged at the position close to the opening end of the main electrode plate.

[0046] As Figure 8 , Figure 10 , Figure 12 , Figure 14 The inner side bottom center position of the main electrode plate is provided with a support plate, the cross-sectional shape of the support plate is arc-shaped, an LED light-emitting chip is installed at the inner side bottom center position of the support plate, the other LED light-emitting chips and the driving chip are uniformly distributed on the outer side of the support plate, and the support plate and the main electrode plate are detachably connected. As Figure 9 , Figure 11 , Figure 13 , Figure 15As shown, the driving chip is placed at a position close to the support plate, and other LED light emitting chips are placed at positions close to the open end of the main electrode plate.

[0047] In the structure of the lamp bead, the support of the lamp bead is newly designed, one support is made large into a main support and into a cup-shaped main support with a circular arc, and the other support is made small and into a plane support, so that the cup-shaped main support can accommodate the driving chip and the LED light emitting chip, and the plane support is only used for the connection of a vice electrode plate, thereby reducing the volume and area.

[0048] In addition, a detachable small cup-shaped support plate with a circular arc is placed in the middle of the cup-shaped main support, the small cup-shaped support plate can accommodate the size of one LED light emitting chip, and the curvature thereof is adjusted according to the design requirements (for example, the amount of phosphor). This structure is named as "cup-in-cup", the small cup-shaped support plate in the middle is used for accommodating phosphor, and the purpose of applying phosphor is to adjust the color of a certain LED light emitting chip into other color light emitting body. The cup-shaped structure is designed to accommodate phosphor, mainly to prevent the phosphor from flowing out when the machine applies the phosphor. If the structure is flat, the phosphor is easy to flow out, which will cause the LED light emitting chip to be dyed with phosphor, thereby changing the color of other LED light emitting chips, and increasing the defective rate. The cup-shaped structure can perfectly solve the problem, the size and curvature of the cup-shaped structure ensure that the phosphor does not flow out, thereby improving the product yield and reducing the cost.

[0049] The curvature of the cup-shaped main support structure can be adjusted according to the actual product situation, the number of driving chips and LED light emitting chips inside can be increased or decreased according to the actual situation, and their placement positions can be adjusted according to the actual situation, mainly for the purpose of facilitating wire bonding and production. The number of supports can be different according to the different functions of the driving chip, such as 3-pin or 4-pin or 5-pin or 6-pin lamp beads. Figure 6 、 Figure 12 As shown, it is a 3-pin lamp bead structure, mainly due to the different functions of the driving chip requiring 3 pins. At the same time, the packaging form of the lamp bead can be straight insertion packaging or surface mount packaging, the present embodiment only uses straight insertion structure for illustration, and the present application also includes surface mount packaging.

[0050] The cup-in-cup structure of the application, taking the example of each LED light emitting chip in the interior emitting light at an angle of about 120 degrees, introduces the benefits of the cup body structure design. The application protects various product structures including but not limited to those described in the technical solutions, including 2-pin, 3-pin, 4-pin, 5-pin, and lamp beads with 2, 3, 4, 5, etc. LED light emitting chips in the interior, as long as multiple LED light emitting chips are combined and sealed in the lamp bead, or the structure of driving chips and multiple color LED light emitting chips are combined and sealed in the lamp bead is applicable. The driving chips here include chips with address coding and driving chips without address coding.

[0051] The traditional structure is a flat structure, resulting in no color convergence effect and more dispersion. For multi-color LED lamp beads, the color mixing effect is more important, and the effect after color mixing needs to be presented to the user. The lamp bead with the cup-in-cup structure of the application adopts the arc cup structure support, so that the light of the LED light emitting body converges towards the center, making the color mixing effect better and not dispersed.

[0052] In the traditional structure, the driving chip is placed on another support, and the relative volume is relatively large, resulting in that the LED light emitting chip is biased to the left. At this time, the color center position after mixing is offset, and when viewed from different angles, the color emitted by the lamp bead after mixing is different, which brings a bad experience to the user. The cup-in-cup structure can make the driving chip occupy a smaller position (for example, placed on a slope), and most of the LED light emitting chips are concentrated in the center position. At the same time, the circular arc cup body structure makes the color center position after mixing not offset or offset small, and the effect is better when viewed from different angles in color.

[0053] For example, Figure 18As shown, the application also provides a multi-color LED lamp bead control system, which comprises a signal modulation circuit, a detection circuit, a signal driving circuit and a microcontroller. The input end of the signal modulation circuit is connected with the VDD end of a power supply and the output end of the microcontroller respectively. The output end of the signal modulation circuit is connected with the input end of the detection circuit and the input end of the signal driving circuit respectively. The output end of the detection circuit is connected with the input end of the microcontroller. The output end of the signal driving circuit is connected with a plurality of multi-color LED lamp beads. The microcontroller controls the on-off of the multi-color LED lamp beads. The signal modulation circuit modulates and superimposes a control signal on the VDD end of the power supply, realizes the transmission of the control signal on the power supply signal, then demodulates and decodes the signal through the driving chip inside the multi-color LED lamp bead to obtain the control signal, thereby lighting the multi-color LED lamp bead. The detection circuit detects the voltage and current on the VDD end of the power supply for adjusting the control signal. The signal driving circuit generates the voltage and current signal required by the controlled multi-color LED lamp bead for lighting.

[0054] For the multi-color LED lamp bead with two feet, the microcontroller is the core of the control, which controls the on-off mode of the LED lamp bead. The signal modulation circuit mainly modulates and superimposes the control signal on the power supply signal VDD. The carrier mode that can be used here is pulse width modulation (PWM), single bus, FSK, ASK, etc. Only the transmission of the control signal on the power supply signal is needed, then the control signal can be obtained by demodulating and decoding the signal through the internal driving chip of the LED lamp bead, thereby lighting the lamp bead. The detection circuit mainly detects the voltage and current of the power supply signal for adjusting the control signal. The signal driving circuit mainly generates the voltage, current and other signals required by the controlled lamp or lamp string for lighting.

[0055] As shown in the drawings, Figure 19As shown, the application further provides another multi-color LED lamp bead control system, which comprises a detection circuit, a signal driving circuit and a microcontroller, the input end of the microcontroller is connected with the VDD end of a power supply, the VSS end of the power supply and the output end of the detection circuit respectively, the output end of the microcontroller is connected with the input end of the signal driving circuit, the input end of the signal driving circuit is connected with the VDD end of the power supply, the output end of the signal driving circuit is connected with a plurality of multi-color LED lamp beads, the signal input end and the signal output end are arranged on the signal driving circuit, and the multi-color LED lamp beads are arranged between the signal input end and the signal output end; the microcontroller controls the on-off of the multi-color LED lamp beads; the detection circuit detects the voltage and current on the VDD end of the power supply for adjusting the control signal; the signal driving circuit generates the voltage, current and control signal required by the controlled multi-color LED lamp beads for lighting and controlling the multi-color LED lamp beads. The connection mode of the multi-color LED lamp beads is one or more of series connection or parallel connection, and the output end of the signal driving circuit is connected with the driving chip in the multi-color LED lamp beads.

[0056] For the multi-color LED lamp bead with 3 or 4 pins, in addition to the power supply VDD end and the VSS end, a signal line is further provided, at this time, the signal does not need to be carried on the power line, but is directly transmitted through the signal line on the signal driving circuit. This way will be simpler in the design of the microcontroller, but will increase 1-2 signal lines as transmission in the structural design of the multi-color LED lamp bead. Which way to use depends on the design of the driving chip inside the LED lamp bead.

[0057] On the basis of the packaging structure of the multi-color LED lamp bead, through the design of the control system and the structural design of the multi-color LED lamp bead, if the driving chip with address bits is selected, the address of each lamp can be controlled through the signal line (or the signal on the power line), which can greatly reduce the use of lamp string cable, thereby reducing the overall system cost. This design can achieve very simple control, not only can realize the lighting effect of single lamp bead, but also can be connected into various lamp string structures in series-parallel mode.

Claims

1. A multi-color LED bead packaging structure, characterized in that, The package includes a housing (8), which contains a main support (2) and at least one secondary support (3). The main support (2) has a main electrode plate (5), and the secondary support (3) has a secondary electrode plate (6). The main electrode plate (5) is located at the center of the housing (8), and the secondary electrode plate (6) is located outside the main electrode plate (5). The main electrode plate (5) has an arc-shaped cross-section. The inner wall of the main electrode plate (5) has a driving chip (4) and several LED light-emitting chips (1). One end of the LED light-emitting chip (1) is electrically connected to the driving chip (4), and the other end of the LED light-emitting chip (1) is electrically connected to the main electrode plate (5). The driving chip (4) is electrically connected to the main electrode plate (5) and the secondary electrode plate (6) respectively. The plate (5) is electrically connected to the main support (2), and the secondary electrode plate (6) is electrically connected to the secondary support (3). A support plate (7) is provided at the center of the bottom inner side of the main electrode plate (5). The cross-sectional shape of the support plate (7) is arc-shaped. An LED light-emitting chip (1) is installed at the center of the bottom inner side of the support plate (7). Other LED light-emitting chips (1) and driving chips (4) are evenly distributed on the outer side of the support plate (7). The support plate (7) and the main electrode plate (5) are detachably connected. The driving chip (4) is placed near the support plate (7). Other LED light-emitting chips (1) are placed near the opening end of the main electrode plate (5). The secondary electrode plate (6) is evenly distributed on the outer side of the main electrode plate (5). The height of the secondary electrode plate (6) is lower than the height of the opening end of the main electrode plate (5).

2. The multi-color LED bead packaging structure according to claim 1, characterized in that, The driving chip (4) is placed at the center of the bottom inner side of the main electrode plate (5), and the LED light-emitting chips (1) are evenly distributed on the inner side wall of the main electrode plate (5). The LED light-emitting chips (1) are placed near the opening end of the main electrode plate (5).

3. The multi-color LED bead packaging structure according to claim 1, characterized in that, The driving chip (4) and the LED light-emitting chip (1) are evenly distributed on the inner sidewall of the main electrode plate (5). The LED light-emitting chip (1) is placed near the bottom center of the main electrode plate (5), and the driving chip (4) is placed near the opening end of the main electrode plate (5).

4. A multi-color LED bead control system, comprising the multi-color LED bead packaging structure as described in claim 1, characterized in that, The system includes a signal modulation circuit, a detection circuit, a signal driving circuit, and a microcontroller. The input terminals of the signal modulation circuit are connected to the VDD terminal of the power supply and the output terminal of the microcontroller. The output terminals of the signal modulation circuit are connected to the input terminals of the detection circuit and the signal driving circuit. The output terminal of the detection circuit is connected to the input terminal of the microcontroller. The output terminal of the signal driving circuit is connected to several multi-color LED beads. The microcontroller controls the on / off state of the multi-color LED beads. The signal modulation circuit modulates and superimposes a control signal on the VDD terminal of the power supply, enabling the control signal to be transmitted over the power supply signal. The signal is then demodulated and decoded by the driver chip inside the multi-color LED beads to obtain the control signal, thereby lighting the multi-color LED beads. The detection circuit detects the voltage and current on the VDD terminal of the power supply to adjust the control signal. The signal driving circuit generates the required voltage and current signals for the controlled multi-color LED beads to illuminate them.

5. A multi-color LED bead control system according to claim 4, characterized in that, The multi-color LED beads are connected in one or more ways, either in series or in parallel, and the output terminal of the signal driving circuit is connected to the driving chip in the multi-color LED beads.

6. A multi-color LED bead control system, comprising the multi-color LED bead packaging structure as described in claim 1, characterized in that, The system includes a detection circuit, a signal driving circuit, and a microcontroller. The input terminals of the microcontroller are connected to the VDD and VSS terminals of a power supply and the output terminal of the detection circuit, respectively. The output terminal of the microcontroller is connected to the input terminal of the signal driving circuit, which is also connected to the VDD terminal of the power supply. The output terminal of the signal driving circuit is connected to several multi-color LED beads. The signal driving circuit has a signal input terminal and a signal output terminal, with the multi-color LED beads positioned between them. The microcontroller controls the on / off state of the multi-color LED beads. The detection circuit detects the voltage and current at the VDD terminal of the power supply to adjust the control signal. The signal driving circuit generates the required voltage, current, and control signal for the controlled multi-color LED beads to illuminate and control them.

7. A multi-color LED bead control system according to claim 6, characterized in that, The multi-color LED beads are connected in one or more ways, either in series or in parallel, and the output terminal of the signal driving circuit is connected to the driving chip in the multi-color LED beads.

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