Method and apparatus for trimming a temperature sensor
By introducing temperature sensors and calibrators into the multi-chip module, and combining them with calibration equipment for calibration and adjustment operations, the problem of inaccurate integrated circuit die temperature measurement was solved, and accurate measurement of the temperature of each integrated circuit die in the multi-chip module was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TEXAS INSTRUMENTS INC
- Filing Date
- 2020-12-22
- Publication Date
- 2026-06-30
AI Technical Summary
In multi-chip modules, calibrating and trimming temperature sensors on integrated circuit dies presents challenges, especially for materials such as GaN, where it is difficult to directly incorporate sufficiently accurate temperature sensors onto the integrated circuit die, leading to inaccurate temperature measurements.
The accuracy of the temperature sensors is improved by introducing first and second temperature sensors into the multi-chip module and using a calibrator and a switch controller in conjunction with calibration equipment to perform calibration and trimming operations during the testing phase of the multi-chip module.
It enables accurate measurement of the temperature of each integrated circuit die in a multi-chip module, improves the calibration accuracy of the temperature sensor, and meets the accuracy threshold requirements.
Smart Images
Figure CN113125031B_ABST