Rapid heat dissipation device of evaporator

Abstract

A rapid heat dissipation device for an evaporator comprises at least one heat dissipation element, which is assembled from an outer wall panel and an inner wall panel: the outer wall panel has a first evaporation area which is half open inside; the inner wall panel has a second evaporation area which is half open inside, and a notch is concavely provided on the inner wall panel; the inner wall panel is attached to one side of the outer wall panel to form a heat dissipation element, and the first evaporation area and the second evaporation area are connected at the notch to form a gas concentration area together, and a plurality of the heat dissipation elements are continuously arranged, combined or integrated into a heat dissipation module in the same direction, and are sealed in an outer shell to be used as a heat dissipation structure of the evaporator.

Description

Technical Field

[0001] The present invention relates to a rapid heat dissipation device for an evaporator, which is a heat dissipation structure used for converting water into liquid and gas inside to achieve heat dissipation effect. Background Art

[0002] In recent years, the heat generated by electronic components has continued to increase rapidly with the advancement of semiconductor technology. How to improve the heat dissipation capacity of electronic components and maintain the normal operation of components has become a very important engineering issue.

[0003] In the existing technology, the widely used direct air cooling technology can no longer meet the heat dissipation needs of many electronic components with high heat flux. In addition to air cooling technology, there is a method of utilizing the liquid-gas conversion of water to achieve the heat dissipation effect. This technology provides two sets of heat spreaders and two sets of connected pipes. One set of heat spreaders is used to evaporate to take away the absorbed heat, and the other set of heat spreaders is used to condense to cool down and return the output cooling water to the heat dissipation cycle. The pressures in the two sets of heat spreaders are different, so the water can be automatically transported back and forth. However, the heat spreaders are mostly designed with simple fins or flow channels to allow water to circulate therein, and the liquid-gas conversion efficiency of the water inside is limited.

[0004] Therefore, the design and improvement of the internal flow channel structure increase the space for water evaporation and gas concentration, thereby improving the liquid-gas conversion efficiency. At the same time, the structural composition is also improved, and multi-piece parts are assembled to reduce the difficulty of part structure manufacturing, thereby improving the convenience of assembly operations and production efficiency. This is a solution for the rapid heat dissipation device of the evaporator of the present invention. Summary of the invention

[0005] The rapid heat dissipation device of the evaporator of the present invention comprises at least one heat dissipation element, which is assembled by an outer wall panel and an inner wall panel: the outer wall panel is divided into a first panel surface, a second panel surface and a third panel surface, the second panel surface is located on one side of the first panel surface, and the third panel surface is located on the other side of the first panel surface, and the second panel surface and the third panel surface respectively have a predetermined angle with the first panel surface, so that a semi-open first evaporation area is formed inside the outer wall panel; the inner wall panel is provided with a fourth panel surface, a fifth panel surface and a sixth panel surface, the fifth panel surface is located on one side of the fourth panel surface, and the sixth panel surface is located on the other side of the fourth panel surface. It is located on the other side of the fourth plate surface, and the fifth plate surface and the sixth plate surface have a predetermined angle with the fourth plate surface respectively, so that a semi-open second evaporation area is formed inside the inner wall panel, and a notch is concavely provided in the middle position of the fifth plate surface and the fourth plate surface close to the inner side; the inner wall panel is attached to one side of the outer wall panel and then assembled into a heat dissipation element, and the first evaporation area and the second evaporation area are connected at the notch to form a gas concentration area together, and multiple heat dissipation elements are continuously arranged, combined or integrated into a heat dissipation module in the same direction, and are installed in a shell and sealed to be used as a heat dissipation structure of the evaporator.

[0006] In a preferred embodiment, the exterior wall panel is formed by the first panel surface, the second panel surface and the third panel surface being integrally formed or mutually fixed, and the interior wall panel is formed by the fourth panel surface, the fifth panel surface and the sixth panel surface being integrally formed or mutually fixed.

[0007] In a preferred embodiment, a groove is respectively formed at the two ends of the second board surface close to the outside, and the notch enables the fifth board surface and the fourth board surface to form a convex portion at the two ends close to the outside, and each convex portion is installed in each groove to facilitate the inner wall panel to be tightly attached to one side of the outer wall panel.

[0008] In a preferred embodiment, the outer wall panel thickness of the outer wall panel is the same as the inner wall panel thickness of the inner wall panel.

[0009] In a preferred embodiment, the evaporation zone widths of the first evaporation zone and the second evaporation zone are 1 to 5 times the thickness of the siding of the siding.

[0010] In a preferred embodiment, the lowest height of the notch on the inner wall panel is equivalent to 0.1-0.8 times the total height of the outer wall panel.

[0011] In a preferred embodiment, a large number of first protrusions and second protrusions are formed at the upper end of the notch, the first protrusions are formed by extending a predetermined length from the upper end of the inner wall panel toward the side, and the second protrusions are formed by extending a predetermined length from the upper end of the inner wall panel toward the other side. The first protrusions and the second protrusions are staggered with each other so that the upper end of the inner wall panel forms a continuous bow shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional exploded schematic diagram of the heat dissipation module of the heat dissipation device of the present invention.

[0013] Figure 2 It is a three-dimensional exploded schematic diagram of the heat dissipation element of the heat dissipation device of the present invention.

[0014] Figure 3 It is a cross-sectional schematic diagram of the heat dissipation element of the heat dissipation device of the present invention.

[0015] Figure 4 It is a cross-sectional schematic diagram of the heat dissipation module of the heat dissipation device of the present invention.

[0016] Figure 5 It is a three-dimensional schematic diagram of the use of the heat dissipation module of the heat dissipation device of the present invention in combination with a condenser.

[0017] Figure 6 It is a cross-sectional schematic diagram of heat dissipation implemented by the heat dissipation module of the heat dissipation device of the present invention.

[0018] Figure 7 It is a partial cross-sectional schematic diagram of heat dissipation implemented by the heat dissipation module of the heat dissipation device of the present invention.

[0019] Figure 8 It is a three-dimensional schematic diagram of a heat dissipation element of a second embodiment of the heat dissipation device of the present invention.

[0020] Fig. 9 It is a plan view of a heat dissipation element of a second embodiment of the heat dissipation device of the present invention.

[0021] Fig.10 It is a partial cross-sectional schematic diagram of heat dissipation implemented by a heat dissipation module of a second embodiment of the heat dissipation device of the present invention.

[0022] Description of Reference Numerals

[0023] 1. Cooling element

[0024] 10. Heat dissipation device

[0025] 11. External wall panels

[0026] 111 First Board

[0027] 112 Second board

[0028] 113 Third Board

[0029] 114 First Evaporation Zone

[0030] 115 Groove

[0031] 12 Interior wall panels

[0032] 121 Fourth Board

[0033] 122 Fifth Board

[0034] 123 Sixth Board

[0035] 124 Second Evaporation Zone

[0036] 125 Gap

[0037] 126 convex part

[0038] 127 First Bump

[0039] 128 Second bump

[0040] 13 Gas Concentration Area

[0041] 2. Housing

[0042] 3 Heat Source

[0043] 4 cooling fins

[0044] 5 pipe

[0045] 6 Condenser

[0046] T1 Thickness of exterior wall panels

[0047] T2 Interior wall thickness

[0048] T3 Evaporation zone width

[0049] H1 Overall height

[0050] H2 Minimum altitude. DETAILED DESCRIPTION

[0051] Other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the accompanying drawings.

[0052] See also Figures 1 to 4 , are respectively a three-dimensional schematic diagram of the rapid heat dissipation device of the evaporator of the present invention and a cross-sectional schematic diagram of the internal structure. As shown in the figure, it includes at least a heat dissipation element 1, which is assembled from an outer wall panel 11 and an inner wall panel 12;

[0053] The exterior wall panel 11 is formed by a first panel surface 111, a second panel surface 112 and a third panel surface 113 which are integrally formed or fixed to each other. The second panel surface 112 is located on one side of the first panel surface 111, and the third panel surface 113 is located on the other side of the first panel surface 111. The second panel surface 112 and the third panel surface 113 are respectively at an angle of 90° with the first panel surface 111 (the angle can be set to 60°~120°), so that a semi-open first evaporation zone 114 is formed inside the exterior wall panel 11, and a groove 115 is respectively formed at both ends of the second panel surface 112 close to the outer side.

[0054] The inner wall panel 12 is formed by a fourth panel surface 121, a fifth panel surface 122 and a sixth panel surface 123 which are integrally formed or fixed to each other. The fifth panel surface 122 is located on one side of the fourth panel surface 121, and the sixth panel surface 123 is located on the other side of the fourth panel surface 121. The fifth panel surface 122 and the sixth panel surface 123 respectively form an angle of 90° with the fourth panel surface 121 (the angle can be set to 60°~120°), so that a semi-open second evaporation zone 124 is formed inside the inner wall panel 12, and a notch 125 is concavely provided at the middle position of the fifth panel surface 122 and the fourth panel surface 121 near the inner side. The notch 125 forms a convex portion 126 at both ends of the fifth panel surface 122 and the fourth panel surface 121 near the outer side.

[0055] Each protrusion 126 is installed in each groove 115, so that the inner wall plate 12 can be attached to one side of the outer wall plate 11, and then assembled into a heat dissipation element 1, and the first evaporation area 114 and the second evaporation area 124 are connected at the notch 125 to form a gas concentration area 13;

[0056] A plurality of the heat dissipation elements 1 can be arranged in a plurality of pieces in the same direction, combined or integrated into a heat dissipation module 10, and the heat dissipation module 10 is sealed and installed in a housing 2 to be used as a heat dissipation structure of an evaporator that can be matched with a condenser.

[0057] See also Figures 5 to 7When in use, a predetermined amount of water in the heat dissipation module 10 is respectively located in the first evaporation zone 114 and the second evaporation zone 124. The rear section of the bottom surface of the shell 2 can lock a heat source 3 (such as: CPU and other electronic products). The shell 2 can be equipped with a heat dissipation fin 4 and a through pipe 5. The through pipe 5 is connected to a condenser 6. When the heat source 3 generates heat, the heat energy generated by the heat source 3 can be introduced into the shell 2 to the heat dissipation module 10, so that the water in the first evaporation zone 114 and the second evaporation zone 124 evaporates after being heated. The high-temperature gas evaporated into gas will be concentrated in the gas concentration zone 13, and then enter the condenser 6 through the through pipe 5 under the influence of negative pressure. Conversely, the high-temperature gas enters the condenser 6 and cools down and then becomes water again, and flows back to the heat dissipation module 10 through the through pipe 5.

[0058] See also Figure 2 and Figure 3 In this embodiment, the outer wall panel 11 and the inner wall panel 12 are configured with a predetermined size ratio, wherein the outer wall panel thickness T1 of the outer wall panel 11 is set as a reference (the thickness of the first panel surface 111, the second panel surface 112 and the third panel surface 113 are all the same, that is, the outer wall panel thickness T1), the inner wall panel thickness T2 of the inner wall panel 12 is equal to the outer wall panel thickness T1 (similarly, the thickness of the fourth panel surface 121, the fifth panel surface 122 and the sixth panel surface 123 are equal to the thickness of the outer wall panel 11). The widths T3 of the evaporation zones 114 and 124 are the same, which is the thickness T2 of the inner wall panel); the evaporation zone widths T3 of the first evaporation zone 114 and the second evaporation zone 124 are 1 to 5 times the thickness T1 of the outer wall panel; and taking the total height H1 of the outer wall panel 11 as a reference, the lowest height H2 of the inner wall panel 12 where the notch 125 is recessed is equivalent to 0.1 to 0.8 times (including 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7 and 0.8) of the total height H1.

[0059] The rapid heat dissipation device of the evaporator of the present invention is shown in FIG. Figure 8 and Fig. 9 , is a second embodiment, a large number of first protrusions 127 and second protrusions 128 are respectively formed at the upper end of the inner wall panel 12 where the notch 125 is recessed, the first protrusions 127 are formed by the upper end of the inner wall panel 12 extending toward the side by a predetermined length, and the second protrusions 128 are formed by the upper end of the inner wall panel 12 extending toward the other side by a predetermined length, and the first protrusions 127 and the second protrusions 128 are staggered with each other, so that the top surface of the inner wall panel 12 forms a continuous bow shape, whereby the shielding of the first protrusions 127 and the second protrusions 128 can effectively increase the pressure when the water is converted into gas in the first evaporation area 114 and the second evaporation area 124, so that the gas can flow to the gas concentration area 13 more quickly, thereby improving the flow efficiency.

[0060] Compared with other prior arts, the rapid heat dissipation device for evaporator provided by the present invention has the following advantages:

[0061] 1. The heat dissipation element is divided into the outer wall panel and the inner wall panel, so that the heat dissipation module has more space and contact area for water evaporation, so that the heat energy in the heat dissipation module can be conducted to the water body more quickly, thereby improving the heat conduction efficiency of the heat dissipation module.

[0062] 2. The water is diverted into each of the first evaporation zone or the second evaporation zone, and the individual heating can also make the water evaporate more quickly, thereby improving the efficiency of evaporation.

[0063] 3. The evaporated gas will first be concentrated in each gas concentration area, which is easy to form a higher pressure. Therefore, when the gas is sent out, it can be sent out more quickly to the condenser with lower pressure, thereby improving the efficiency of gas and water circulation.

[0064] 4. The heat dissipation element is divided into the outer wall panel and the inner wall panel. The multi-piece assembly can reduce the complexity of the structure itself, further reduce the difficulty in manufacturing, and the incidence of manufacturing defects, thereby improving the convenience of assembly operations and production efficiency, and reducing the technical cost of developing molds.

[0065] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

Claims

1. A rapid heat dissipation device for an evaporator, characterized in that: It includes at least one heat dissipation element, which is assembled from an outer wall panel and an inner wall panel: The exterior wall panel is divided into a first panel surface, a second panel surface and a third panel surface, wherein the second panel surface is located on one side of the first panel surface, and the third panel surface is located on the other side of the first panel surface, and a predetermined angle is formed between the second panel surface and the third panel surface and the first panel surface, so that a semi-open first evaporation zone is formed inside the exterior wall panel; The inner wall panel is provided with a fourth panel surface, a fifth panel surface and a sixth panel surface, wherein the fifth panel surface is located on one side of the fourth panel surface, and the sixth panel surface is located on the other side of the fourth panel surface, and the fifth panel surface and the sixth panel surface respectively have a predetermined angle with the fourth panel surface, so that a semi-open second evaporation zone is formed inside the inner wall panel, and a notch is concavely provided at a middle position of the fifth panel surface and the fourth panel surface close to the inner side; The inner wall panel is attached to one side of the outer wall panel and then assembled into a heat dissipation element, and the first evaporation area and the second evaporation area are connected at the notch to form a gas concentration area together. Multiple heat dissipation elements are continuously arranged, combined or integrated into a heat dissipation module in the same direction, and the heat dissipation module is installed in a shell and sealed to form a heat dissipation structure of the evaporator.

2. The rapid heat dissipation device for an evaporator according to claim 1, characterized in that: The exterior wall panel is formed by integrally forming the first panel surface, the second panel surface and the third panel surface or by mutually fixing them.

3. The rapid heat dissipation device for an evaporator according to claim 1, characterized in that: The inner wall panel is formed by integrally forming the fourth panel surface, the fifth panel surface and the sixth panel surface or by mutually fixing them.

4. The rapid heat dissipation device for an evaporator according to claim 1, characterized in that: The second panel surface is provided with a groove at both ends close to the outside, and the notch forms a convex portion at both ends of the fifth panel surface and the fourth panel surface close to the outside, and each convex portion is installed in each groove so that the inner wall panel can be tightly attached to one side of the outer wall panel.

5. The rapid heat dissipation device for an evaporator according to claim 1, characterized in that: The outer wall panel thickness of the outer wall panel is the same as the inner wall panel thickness of the inner wall panel.

6. The rapid heat dissipation device for an evaporator according to claim 1, characterized in that: The evaporation zone widths of the first evaporation zone and the second evaporation zone are 1 to 5 times the thickness of the exterior wall board of the exterior wall board.

7. The rapid heat dissipation device for an evaporator according to claim 1, characterized in that: The lowest height of the notch on the inner wall panel is equivalent to 0.1 to 0.8 times the total height of the outer wall panel.

8. The rapid heat dissipation device for an evaporator as claimed in claim 1, characterized in that: The upper end of the inner wall panel is respectively formed with a large number of first protrusions and second protrusions. The first protrusions are formed by extending the upper end of the inner wall panel toward the side by a predetermined length, and the second protrusions are formed by extending the upper end of the inner wall panel toward the other side by a predetermined length.

9. The rapid heat dissipation device of the evaporator according to claim 8, characterized in that: The first protrusions and the second protrusions are staggered with each other, so that the upper end of the inner wall panel forms a continuous bow shape.

10. The rapid heat dissipation device of the evaporator according to claim 8, characterized in that: Each first protrusion and each second protrusion are formed at the upper end of the inner wall plate where the notch is recessed.

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