Vapor chamber and manufacturing method thereof

Abstract

The invention discloses a vapor chamber and a manufacturing method thereof. The vapor chamber comprises an upper cover, a lower cover and a metal foil, the lower cover is connected with the upper cover, a containing cavity is formed between the lower cover and the upper cover, and a cooling medium is contained in the containing cavity; the metal foil is arranged in the containing cavity, a condensation cavity is formed between the metal foil and the upper cover, an evaporation cavity is formed between the metal foil and the lower cover, and a plurality of capillary holes are distributed in the metal foil and communicated with the condensation cavity and the evaporation cavity. According to the vapor chamber, the metal foil is arranged between the upper cover and the lower cover, backflow of a liquefied cold area medium in the condensation cavity into the evaporation cavity is achieved through the capillary holes formed in the metal foil, and the overall thickness of the whole vapor chamber can be set to be smaller due to the arrangement of the metal foil.

Description

Technical Field

[0001] The present invention relates to the technical field of heat pipes, and particularly relates to a heat pipe and a manufacturing method thereof. Background Art

[0002] With the improvement of the integration and thinness of electronic products such as mobile phones and tablet computers, in addition to expecting the products to have a thinner and lighter appearance, people also hope that the products have higher computing speeds and better multimedia performance to meet the requirements of high-speed, portable, mobile work or mobile entertainment. Under the strong guidance of the market demand side, electronic devices are continuously developing in the direction of high frequency, high speed, and the densification and miniaturization of integrated circuits, resulting in a sharp increase in the power consumption of electronic devices per unit volume, bringing the problem of a rapid increase in heat generation. Correspondingly, while ensuring its own heat dissipation effect, the heat pipe also needs to be further miniaturized.

[0003] In the related art, the heat pipe includes an upper cover, a lower cover, and a wick structure. A receiving cavity is formed between the upper cover and the lower cover, the wick structure is disposed in the receiving cavity, a cooling medium is provided in the receiving cavity. When the heat pipe is in use, the lower cover abuts against a heat source, the cooling medium absorbs heat and vaporizes at the lower cover to form steam, the steam dissipates heat and liquefies at the upper cover, and the liquefied cooling medium returns to the lower cover under the capillary force of the capillary channels inside the wick structure to absorb heat and vaporize again, so as to dissipate heat from the heat source.

[0004] However, in order to ensure that the wick can normally guide the liquefied cooling medium from the upper cover back to the lower cover, the thickness of the wick has certain requirements. Restricted by the thickness dimension of the wick itself, the thickness of the existing heat pipe is relatively large. Summary of the Invention

[0005] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art. The first aspect of the present invention provides a heat pipe with a smaller thickness. The second aspect of the present invention provides a manufacturing method of a heat pipe.

[0006] According to the heat pipe provided by the embodiment of the present invention, it includes an upper cover, a lower cover, and a metal foil; the lower cover is connected to the upper cover, a receiving cavity is formed between the lower cover and the upper cover, and a cooling medium is received in the receiving cavity; the metal foil is disposed in the receiving cavity, a condensation cavity is formed between the metal foil and the upper cover, an evaporation cavity is formed between the metal foil and the lower cover, and a plurality of capillary holes are distributed on the metal foil, and the capillary holes communicate the condensation cavity and the evaporation cavity.

[0007] The heat pipe described in the present invention has at least the following beneficial effects: When the heat pipe of the present application is in use, the lower cover is in contact with the heat source. The cooling medium in the accommodation cavity absorbs heat and vaporizes after contacting the lower cover. The vaporized cooling medium moves from the evaporation cavity to the condensation cavity, releases heat and liquefies after contacting the upper cover. The liquefied cooling medium returns from the condensation cavity to the evaporation cavity through the capillary pores in the metal foil to absorb heat from the lower cover again. In the heat pipe of the present application, by arranging a metal foil between the upper cover and the lower cover, the liquefied cooling medium in the condensation cavity can flow back to the evaporation cavity through the capillary pores opened on the metal foil. The arrangement of the metal foil enables the overall thickness of the entire heat pipe to be set thinner.

[0008] According to the heat pipe described in the embodiment of the present invention, the evaporation cavity includes an evaporation area, a condensation area, a first communication area, and a second communication area. The condensation area, the first communication area, the evaporation area, and the second communication area are annularly distributed and are connected in sequence at the head and tail. A capillary structure is provided on the side of the lower cover close to the evaporation cavity, and the capillary structure is used to guide the cooling medium to circulate through the condensation area, the first communication area, the evaporation area, and the second communication area.

[0009] According to the heat pipe described in the embodiment of the present invention, the capillary structure includes a first sub-capillary structure, a second sub-capillary structure, a third sub-capillary structure, and a fourth sub-capillary structure. The first sub-capillary structure is arranged in the condensation area, and the first sub-capillary structure is cylindrical. The second sub-capillary structure is arranged in the first communication area, and the second sub-capillary structure is a solid linear shape extending along the extending direction of the first communication area. The third sub-capillary structure is arranged in the evaporation area, and the third sub-capillary structure is cylindrical. The fourth sub-capillary structure is arranged in the second communication area, and the fourth sub-capillary structure is an arrow shape pointing to the condensation area.

[0010] According to the heat pipe described in the embodiment of the present invention, the capillary structure further includes a fifth sub-capillary structure and a sixth sub-capillary structure. The fifth sub-capillary structure is arranged at the junction of the first communication area and the evaporation area, and the fifth sub-capillary structure is a dotted linear shape extending from the first communication area to the evaporation area. The sixth sub-capillary structure is arranged at the junction of the evaporation area and the second communication area, and the sixth sub-capillary structure is a solid linear shape extending from the evaporation area to the second communication area.

[0011] According to the heat pipe described in the embodiment of the present invention, it further includes a first metal mesh. The first metal mesh is arranged between the metal foil and the upper cover. In the horizontal projection plane, the orthographic projection of the first metal mesh covers the condensation area, the evaporation area, and the first communication area.

[0012] According to the heat pipe described in the embodiment of the present invention, it further includes a second metal mesh. The second metal mesh is arranged between the first metal mesh and the upper cover. In the horizontal projection plane, the orthographic projection of the second metal mesh covers the evaporation area.

[0013] According to the heat pipe described in the embodiments of the present invention, on one side of the upper cover close to the condensation cavity, there are a plurality of first support columns and a plurality of second support columns. The first support columns are in contact with the first metal mesh, and the second support columns are in contact with the metal foil.

[0014] According to the manufacturing method of the heat pipe provided in the second aspect of the present invention, it includes the following steps:

[0015] Process the upper cover, the lower cover and the metal foil respectively;

[0016] Place the metal foil between the upper cover and the lower cover, and weld the upper cover and the lower cover to form a heat pipe;

[0017] Perform a hydrophilic treatment on the heat pipe to improve the hydrophilicity of the heat pipe;

[0018] Introduce a cooling medium into the accommodation cavity between the upper cover and the lower cover;

[0019] Perform a vacuum pumping treatment on the accommodation cavity to remove the gas in the accommodation cavity.

[0020] According to the manufacturing method of the heat pipe described in the second aspect of the present invention, the hydrophilic treatment of the heat pipe includes the following steps:

[0021] Perform a temperature-raising sintering on the heat pipe to initially improve the hydrophilicity of the heat pipe;

[0022] Perform a passivation treatment on the heat pipe to further improve the hydrophilicity of the heat pipe.

[0023] According to the manufacturing method of the heat pipe described in the second aspect of the present invention, before introducing the cooling medium into the accommodation cavity between the upper cover and the lower cover, it further includes the following steps:

[0024] Perform a dry oxidation treatment on the heat pipe to generate an oxide film on the surfaces of the upper cover, the lower cover and the metal foil respectively.

[0025] The additional aspects and advantages of the present invention will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below in conjunction with the drawings and embodiments;

[0027] Figure 1 is an exploded schematic view of the heat pipe according to an embodiment of the present invention;

[0028] Figure 2 is Figure 1 a schematic structural view of the lower cover of the heat pipe shown;

[0029] Figure 3Schematic diagram of the first sub-capillary structure according to an embodiment of the present invention;

[0030] Figure 4 Schematic diagram of the second sub-capillary structure according to an embodiment of the present invention;

[0031] Figure 5 Schematic diagram of the third sub-capillary structure according to an embodiment of the present invention;

[0032] Figure 6 Schematic diagram of the fourth sub-capillary structure according to an embodiment of the present invention;

[0033] Figure 7 Schematic diagram of the fifth sub-capillary structure according to an embodiment of the present invention;

[0034] Figure 8 Schematic diagram of the sixth sub-capillary structure according to an embodiment of the present invention;

[0035] Figure 9 is Figure 1 Schematic diagram of the upper cover of the heat pipe shown;

[0036] Figure 10 Flow chart of the manufacturing method of the heat pipe according to an embodiment of the present invention;

[0037] Figure 11 Flow chart of the hydrophilic treatment of the heat pipe according to an embodiment of the present invention.

[0038] Reference numerals:

[0039] Upper cover 100; First support column 110; Second support column 120;

[0040] Lower cover 200; Condensation area 201; First communication area 202; Evaporation area 203; Second communication area 204; First sub-capillary structure 210; Second sub-capillary structure 220; Third sub-capillary structure 230; Fourth sub-capillary structure 240; Fifth sub-capillary structure 250; Sixth sub-capillary structure 260;

[0041] Metal foil 300;

[0042] First metal mesh 400;

[0043] Second metal mesh 500. Detailed description of the specific implementation

[0044] This part will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the drawings. The role of the drawings is to supplement the description of the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it should not be construed as a limitation on the protection scope of the present invention.

[0045] In the description of the present invention, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., it is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0046] In the description of the present invention, the meaning of several is one or more, the meaning of multiple is more than two, greater than, less than, exceeding, etc. are understood not to include the original number, and above, below, within, etc. are understood to include the original number. If the first and second are described, it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0047] In the description of the present invention, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above words in the present invention in combination with the specific content of the technical solution.

[0048] Next, reference is made to Figures 1 to 9 for a detailed description of the heat pipe of the first aspect of the present application.

[0049] Reference is made to Figure 1 , the heat pipe according to an embodiment of the present invention includes an upper cover 100, a lower cover 200, and a metal foil 300; the lower cover 200 is connected to the upper cover 100, and a receiving cavity is formed between the lower cover 200 and the upper cover 100, and a cooling medium is received in the receiving cavity; the metal foil 300 is disposed in the receiving cavity, a condensation cavity is formed between the metal foil 300 and the upper cover 100, an evaporation cavity is formed between the metal foil 300 and the lower cover 200, and a plurality of capillary pores are distributed on the metal foil 300, and the capillary pores communicate with the condensation cavity and the evaporation cavity.

[0050] For example, as Figure 1 shown, the heat pipe includes an upper cover 100, a lower cover 200, and a metal foil 300. The upper cover 100 is disposed on the upper side of the lower cover 200, and the upper cover 100 and the lower cover 200 jointly define a receiving cavity. The metal foil 300 is disposed in the receiving cavity, an evaporation cavity is formed between the metal foil 300 and the lower cover 200, a condensation cavity is formed between the metal foil 300 and the upper cover 100, capillary pores are distributed on the metal foil 300, the upper end of the capillary pores communicates with the condensation cavity, the lower end of the capillary pores communicates with the evaporation cavity, and a cooling medium is received in the receiving cavity.

[0051] When the heat pipe in this embodiment is in use, the lower cover 200 of the heat pipe is attached to the electronic device, and the upper cover 100 of the heat pipe is exposed to the air. The liquid cooling medium absorbs heat and vaporizes after contacting the lower cover 200. The vaporized cooling medium enters the condensation chamber from the evaporation chamber. The vaporized cooling medium in the condensation chamber releases heat and liquefies after contacting the upper cover 100. The liquefied cooling medium falls on the metal foil 300 and returns to the evaporation chamber from the condensation chamber under the capillary action of the pores on the metal foil 300.

[0052] It can be understood that by setting the metal foil 300, while ensuring that the liquefied cooling medium in the condensation chamber can quickly flow back to the evaporation chamber to enable the heat pipe to have a normal heat dissipation effect, since the thickness of the metal foil 300 can be set smaller, reaching 0.006 mm, the thickness of the entire heat pipe can be set smaller.

[0053] In some embodiments of the present invention, referring to Figure 2 , the evaporation chamber includes an evaporation zone 203, a condensation zone 201, a first communication zone 202, and a second communication zone 204. The condensation zone 201, the first communication zone 202, the evaporation zone 203, and the second communication zone 204 are annularly distributed and are connected in sequence at the head and tail. The side of the lower cover 200 close to the evaporation chamber is provided with a capillary structure for guiding the cooling medium to circulate through the condensation zone 201, the first communication zone 202, the evaporation zone 203, and the second communication zone 204.

[0054] Furthermore, when the heat pipe of the present application is in use, the position of the lower cover 200 close to the evaporation zone 203 abuts against the electronic device. The liquid cooling medium evaporates into a gas in the evaporation zone 203 and then enters the condensation chamber. The gaseous cooling medium flows in the condensation zone 201 to flow from directly above the evaporation zone 203 to directly above the condensation zone 201. During this process, the gaseous cooling medium continuously releases heat in the condensation chamber and then liquefies. The liquefied cooling medium enters the condensation zone 201 through the pores on the metal foil 300. Then, the liquefied cooling medium enters the evaporation zone 203 from the condensation zone 201 through the first communication zone 202 to absorb heat and vaporize again; the cooling medium that fails to evaporate in the evaporation zone 203 flows to the condensation zone 201 through the second communication zone 204 and flows to the evaporation zone 203 again through the first communication zone 202 together with other liquefied cooling media in the condensation zone 201 to absorb heat and vaporize again.

[0055] It can be understood that by providing a capillary structure on the lower cover 200, the cooling medium in the evaporation chamber can continuously circulate through the condensation zone 201, the first communication zone 202, the evaporation zone 203, and the second communication zone 204, thereby ensuring the efficient flow of the cooling medium in the accommodation chamber to fully complete the heat dissipation of the electronic device.

[0056] In a further embodiment of the present invention, reference is made to Figures 3 to 6 , the capillary structure includes a first sub-capillary structure 210, a second sub-capillary structure 220, a third sub-capillary structure 230, and a fourth sub-capillary structure 240. The first sub-capillary structure 210 is disposed in the condensation region 201, and the first sub-capillary structure 210 is cylindrical. The second sub-capillary structure 220 is disposed in the first communication region 202, and the second sub-capillary structure 220 is a solid linear shape extending along the extending direction of the first communication region 202. The third sub-capillary structure 230 is disposed in the evaporation region 203, and the third sub-capillary structure 230 is cylindrical. The fourth sub-capillary structure 240 is disposed in the second communication region 204, and the fourth sub-capillary structure 240 is an arrow shape pointing to the condensation region 201.

[0057] It can be understood that since the condensation region 201 needs to receive the liquefied cooling medium from the condensation cavity and the cooling medium output from the second communication region 204, a large amount of cooling medium exists in the condensation region 201. Correspondingly, there is more cooling medium in the condensation region 201. By setting the first sub-capillary structure 210 to be cylindrical, the flow rate of the cooling medium in the condensation region 201 can be reduced so that the flow rate of the cooling medium flowing from the condensation region 201 to the first communication region 202 can be maintained within a certain range. Since the cooling medium in the first communication region 202 absorbs heat after flowing to the evaporation region 203, causing part of the cooling medium to vaporize, the first communication region 202 needs to quickly supplement the cooling medium into the evaporation region 203. By setting the second sub-capillary structure 220 to be a solid linear shape, the cooling medium can quickly flow from the first communication region 202 to the evaporation region 203 to ensure the supply of the cooling medium in the evaporation region 203. Since the cooling medium in the evaporation region 203 needs to absorb heat and vaporize, in order to enable the cooling medium to fully absorb heat in the evaporation region 203, it is necessary to make the cooling medium stay in the evaporation region 203 for a long time. By setting the third sub-capillary structure 230 to be cylindrical, the speed of the cooling medium flowing from the evaporation region 203 to the second communication region 204 can be reduced so that the cooling medium can have enough time to stay in the evaporation region 203 to fully absorb heat and vaporize. Since most of the cooling medium in the evaporation region 203 has vaporized and entered the condensation cavity, the amount of cooling medium entering the second communication region 204 from the evaporation region 203 is small. Due to the small amount of cooling medium in the second communication region 204, the transportation capacity of the cooling medium in the second communication region 204 is insufficient, and it is difficult for the cooling medium in the second communication region 204 to quickly flow back to the condensation region 201. By setting the fourth sub-capillary structure 240 to be an arrow shape pointing to the condensation region 201, the cooling medium in the second communication region 204 can quickly flow back to the condensation region 201 under the capillary action of the fourth sub-capillary structure 240 to ensure the smooth circulation of the cooling medium in the entire accommodation cavity.

[0058] In some embodiments of the present invention, reference is made toFigure 7 and Figure 8 The capillary structure further includes a fifth sub-capillary structure 250 and a sixth sub-capillary structure 260. The fifth sub-capillary structure 250 is disposed at the junction of the first communication region 202 and the evaporation region 203, and the fifth sub-capillary structure 250 is in a dotted line shape extending from the first communication region 202 to the evaporation region 203. The sixth sub-capillary structure 260 is disposed at the junction of the evaporation region 203 and the second communication region 204, and the sixth sub-capillary structure 260 is in a solid line shape extending from the evaporation region 203 to the second communication region 204.

[0059] It can be understood that the flow rate of the cooling medium in the first communication region 202 is relatively fast. In order to ensure that the cooling medium has sufficient residence time in the evaporation region 203, the flow rate of the cooling medium in the evaporation region 203 needs to be slower. Correspondingly, by providing the fifth sub-capillary structure 250 at the junction of the first communication region 202 and the evaporation region 203, and the fifth sub-capillary structure 250 is in a dotted line shape extending from the first communication region 202 to the evaporation region 203, the cooling medium can gradually decelerate at the junction of the first communication region 202 and the evaporation region 203, so as to avoid the initial flow rate of the cooling medium entering the evaporation region 203 from being too fast and ensure that the flow rate of the cooling medium in the evaporation region 203 can be smoothly reduced to the preset flow rate. Since the flow rate of the cooling medium in the evaporation region 203 is slower, and the flow rate of the cooling medium in the second communication region 204 needs to be faster, by providing the sixth sub-capillary structure 260 at the junction of the evaporation region 203 and the second communication region 204, and the sixth sub-capillary structure 260 is in a solid line shape extending from the evaporation region 203 to the second communication region 204, the cooling medium can gradually accelerate at the junction of the evaporation region 203 and the second communication region 204, so that the flow rate of the cooling medium entering the second communication region 204 can be rapidly increased.

[0060] It should be noted that the capillary structure on the lower cover 200 can be formed by an etching process or a stamping process.

[0061] In some embodiments of the present invention, referring to Figure 1 , the heat pipe further includes a first metal mesh 400. The first metal mesh 400 is disposed between the metal foil 300 and the upper cover 100. In the horizontal projection plane, the orthographic projection of the first metal mesh 400 covers the condensation region 201, the evaporation region 203, and the first communication region 202.

[0062] It can be understood that by providing the first metal mesh 400 between the metal foil 300 and the upper cover 100, and in the horizontal projection plane, the orthographic projection of the first metal mesh 400 covers the condensation area 201, the evaporation area 203, and the first communication area 202, so that there is sufficient space in the condensation chamber above the second communication area 204 for the vaporized cooling medium to liquefy, thereby improving the liquefaction efficiency of the cooling medium in the condensation chamber.

[0063] In a further embodiment of the present invention, referring to Figure 1 , the heat pipe further includes a second metal mesh 500, the second metal mesh 500 is disposed between the first metal mesh 400 and the upper cover 100, and in the horizontal projection plane, the orthographic projection of the second metal mesh 500 covers the evaporation area 203.

[0064] It can be understood that by providing the second metal mesh 500 between the first metal mesh 400 and the upper cover 100, and in the horizontal projection plane, the orthographic projection of the second metal mesh 500 covers the evaporation area 203, so that the space in the condensation chamber above the evaporation area 203 is smaller, thereby reducing the probability of liquefaction of the vaporized cooling medium above the evaporation area 203. Correspondingly, the setting of the second metal mesh 500 further increases the space in the condensation chamber directly above the second communication area 204, so that the vaporized cooling medium can fully dissipate heat directly above the second communication area 204.

[0065] In some embodiments of the present invention, referring to Figure 9 , a plurality of first support columns 110 and a plurality of second support columns 120 are provided on the side of the upper cover 100 close to the condensation chamber. The first support columns 110 are in contact with the first metal mesh 400, and the second support columns 120 are in contact with the metal foil 300.

[0066] It can be understood that by providing the first support columns 110 and the second support columns 120, the overall strength of the heat pipe in this embodiment can be improved, so as to reduce the probability of the problem of indentation occurring in the upper cover 100 and / or the lower cover 200.

[0067] Next, referring to Figure 10 and Figure 11 a detailed description will be given of the manufacturing method of the heat pipe according to the second aspect embodiment of the present invention.

[0068] According to the manufacturing method of the heat pipe provided by the second aspect embodiment of the present invention, referring to Figure 10 , it includes but is not limited to the following steps:

[0069] Step S100, respectively process the upper cover 100, the lower cover 200, and the metal foil 300;

[0070] Step S200: Place the metal foil 300 between the upper cover 100 and the lower cover 200, and weld the upper cover 100 and the lower cover 200 together to form a heat pipe;

[0071] It can be understood that laser welding can be used between the upper cover 100 and the lower cover 200.

[0072] Step S300: Perform a hydrophilic treatment on the heat pipe to improve the hydrophilicity of the heat pipe;

[0073] It can be understood that by improving the hydrophilicity of the heat pipe, it is more conducive to the flow of the cooling medium in the accommodation cavity, so as to improve the heat dissipation effect of the heat pipe.

[0074] Step S500: Introduce a cooling medium into the accommodation cavity between the upper cover 100 and the lower cover 200;

[0075] Step S600: Perform a vacuum pumping treatment on the accommodation cavity to remove the gas in the accommodation cavity.

[0076] It can be understood that by removing the gas in the accommodation cavity, the fluidity of the cooling medium flowing in the accommodation cavity can be improved.

[0077] It should be noted that when performing the vacuum pumping treatment on the accommodation cavity, the vacuum pumping of the accommodation cavity can be carried out in multiple times to gradually remove the gas in the accommodation cavity.

[0078] In a further embodiment of the present invention, refer to Figure 11 , in step S300, it includes but is not limited to the following steps:

[0079] Step S310: Perform a temperature-raising sintering on the heat pipe to preliminarily improve the hydrophilicity of the heat pipe;

[0080] It should be noted that when performing the temperature-raising sintering on the heat pipe, the temperature is raised to 850 °C and the time is 6 hours.

[0081] Step S320: Perform a passivation treatment on the heat pipe to further improve the hydrophilicity of the heat pipe.

[0082] It should be noted that when performing the passivation treatment on the heat pipe, the heat pipe is placed in pure water at 100 °C for 2 hours.

[0083] In some embodiments of the present invention, refer to Figure 10 , before step S500, it further includes but is not limited to the following steps:

[0084] Step S400: Perform a drying oxidation treatment on the heat pipe to generate an oxide film on the surfaces of the upper cover 100, the lower cover 200, and the metal foil 300 respectively.

[0085] It should be noted that when the vapor chamber is subjected to drying oxidation treatment, the temperature is 200 °C and the treatment time is 2 hours.

[0086] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A vapor chamber, characterized in that, Comprising: Upper cover; Lower cover, connected to the upper cover, an accommodation cavity is formed between the lower cover and the upper cover, and a cooling medium is accommodated in the accommodation cavity; Metal foil, disposed in the accommodation cavity, a condensation cavity is formed between the metal foil and the upper cover, an evaporation cavity is formed between the metal foil and the lower cover, a plurality of capillary pores are distributed on the metal foil, and the capillary pores communicate the condensation cavity and the evaporation cavity.

2. The heat pipe according to claim 1, wherein The evaporation cavity includes an evaporation zone, a condensation zone, a first communication zone and a second communication zone. The condensation zone, the first communication zone, the evaporation zone and the second communication zone are annularly distributed and are connected in sequence at the head and tail. A capillary structure is provided on one side of the lower cover close to the evaporation cavity, and the capillary structure is used to guide the cooling medium to circulate through the condensation zone, the first communication zone, the evaporation zone and the second communication zone.

3. A vapor chamber according to claim 2, characterized in that, The capillary structure includes a first sub-capillary structure, a second sub-capillary structure, a third sub-capillary structure and a fourth sub-capillary structure. The first sub-capillary structure is disposed in the condensation zone and is cylindrical. The second sub-capillary structure is disposed in the first communication zone and is a solid linear shape extending along the extending direction of the first communication zone. The third sub-capillary structure is disposed in the evaporation zone and is cylindrical. The fourth sub-capillary structure is disposed in the second communication zone and is an arrow shape pointing to the condensation zone.

4. The heat pipe according to claim 3, wherein, The capillary structure further includes a fifth sub-capillary structure and a sixth sub-capillary structure. The fifth sub-capillary structure is disposed at the junction of the first communication zone and the evaporation zone and is a dotted line shape extending from the first communication zone to the evaporation zone. The sixth sub-capillary structure is disposed at the junction of the evaporation zone and the second communication zone and is a solid linear shape extending from the evaporation zone to the second communication zone.

5. A vapor chamber according to claim 2, characterized in that, Further included is a first metal mesh, the first metal mesh is disposed between the metal foil and the upper cover, and in the horizontal projection plane, the orthographic projection of the first metal mesh covers the condensation zone, the evaporation zone and the first communication zone.

6. A vapor chamber according to claim 5, characterized in that, Further included is a second metal mesh, the second metal mesh is disposed between the first metal mesh and the upper cover, and in the horizontal projection plane, the orthographic projection of the second metal mesh covers the evaporation zone.

7. A heat pipe according to claim 6, characterized in that, On one side of the upper cover close to the condensation cavity, a plurality of first support columns and a plurality of second support columns are provided. The first support columns are in contact with the first metal mesh, and the second support columns are in contact with the metal foil.

8. A manufacturing method of a heat pipe, characterized in that, Including the following steps: Process the upper cover, the lower cover and the metal foil respectively; Place the metal foil between the upper cover and the lower cover, and weld the upper cover and the lower cover to form a heat pipe; Perform a hydrophilic treatment on the heat pipe to improve the hydrophilicity of the heat pipe; Inject a cooling medium into the accommodation cavity between the upper cover and the lower cover; Perform a vacuum treatment on the accommodation cavity to remove the gas in the accommodation cavity.

9. The manufacturing method of a heat pipe according to claim 8, characterized in that, The hydrophilic treatment of the heat pipe includes the following steps: The heat spreader is heated and sintered to preliminarily improve the hydrophilicity of the heat spreader; The heat spreader is passivated to further improve the hydrophilicity of the heat spreader.

10. A manufacturing method of a vapor chamber according to claim 8, characterized in that Before introducing a cooling medium into the accommodation cavity between the upper cover and the lower cover, the following steps are further included: The heat spreader is subjected to dry oxidation treatment to respectively form an oxide film on the surfaces of the upper cover, the lower cover and the metal foil.

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