Electronic Devices

Abstract

The present invention relates to an electronic device, which includes: a communication circuit; a memory; a plurality of pressure valves; and a processor connected to the communication circuit, the memory and the plurality of pressure valves, the processor receiving information indicating that a wafer is loaded on a chuck worktable through the communication circuit, obtaining information related to a process flow through the communication circuit, the processor identifying a current process from the information related to the process flow, the processor controlling the plurality of pressure valves to adjust the positions of a plurality of cups from an initial position to a position corresponding to the current process, the plurality of cups being used to recover chemicals ejected during the process, and if the current process is completed, the processor may control the plurality of pressure valves to adjust the positions of the plurality of cups from a position corresponding to the current process to the initial position. Other embodiments are also possible.

Description

Technical Field

[0001] Various embodiments of the present invention relate to a semiconductor manufacturing apparatus including a cup and an operating method thereof. Background Art

[0002] The plurality of patterns formed on the semiconductor substrate can generally be formed using a photolithography process, which may include a photoresist coating process, an exposure process, a development process, and a cleaning process.

[0003] Typically, the cleaning process can be performed by a single cleaning device, which may include: a spin chuck that holds the wafer; a chemical nozzle that supplies chemicals to the wafer; and a cup (or processing cup) that surrounds the spin chuck and contacts a waste liquid channel and an exhaust pipe at the bottom.

[0004] The background technology of the present invention is disclosed in Korean Patent Publication No. 2019-0007198 (published on January 22, 2019, semiconductor manufacturing apparatus including a processing cup). Summary of the invention

[0005] Technical issues to be solved

[0006] The inflow portion of the cup is located on the upper side of the wafer and is used to recover the chemical substances sprayed for processing the wafer. Therefore, when the processing process of the wafer is changed, the chemical substances based on the processing process are scattered and mixed with the chemical substances used in other processing processes, so the cost for processing the chemical substances increases. Therefore, a solution for preventing the mixing of different chemical substances in the semiconductor manufacturing process may be required.

[0007] Various embodiments of the present invention relate to and disclose a method and apparatus for preventing mixing of different chemical substances in a semiconductor manufacturing process.

[0008] Solutions to technical problems

[0009] The electronic device of various embodiments of the present invention includes: a communication circuit; a memory; a plurality of pressure valves; and a processor connected to the communication circuit, the memory and the plurality of pressure valves, the processor receiving information indicating that a wafer is loaded on a chuck worktable through the communication circuit, obtaining information related to a process flow through the communication circuit, the processor identifying a current process from the information related to the process flow, the processor controlling the plurality of pressure valves to adjust the positions of a plurality of cups from an initial position to a position corresponding to the current process, the plurality of cups being used to recover chemicals sprayed during the process, and if the current process is completed, the processor may control the plurality of pressure valves to adjust the positions of the plurality of cups from a position corresponding to the current process to the initial position.

[0010] According to various embodiments, the present invention further comprises a plurality of hydraulic cylinders connected to the plurality of cups, wherein the plurality of hydraulic cylinders are respectively connected to two pressure valves, and based on the hydraulic pressure provided by the two pressure valves, the stroke of each of the plurality of hydraulic cylinders can be fixed at a specified position.

[0011] According to various embodiments, the plurality of cups include: a first cup; a second cup; and a third cup, the inlet of the first cup being located above the inlet of the second cup, and the inlet of the second cup being located above the inlet of the third cup.

[0012] According to various embodiments, in a case where the current process is a first-stage process of recovering chemicals through the first cup, the processor adjusts the strokes of the multiple hydraulic cylinders connected to the first cup through at least a portion of the multiple hydraulic valves so that the inlet of the first cup is located at a specified height from the upper side of the wafer, the processor adjusts the strokes of the multiple hydraulic cylinders connected to the second cup through at least a portion of the multiple hydraulic valves so that the inlet of the second cup is located at a first standby position corresponding to the first-stage process, the processor adjusts the strokes of the multiple hydraulic cylinders connected to the third cup through at least a portion of the multiple hydraulic valves so that the inlet of the third cup is located at a second standby position corresponding to the first-stage process, the first standby position includes a position lower than the lower side of the wafer, and the second standby position may include a position lower than the first standby position.

[0013] According to various embodiments, when the current process is a second-stage process of recovering chemicals through the second cup, the processor adjusts the strokes of the multiple hydraulic cylinders connected to the first cup through at least a portion of the multiple hydraulic valves so that the inlet of the first cup is located at a collision avoidance position corresponding to the second-stage process, the processor adjusts the strokes of the multiple hydraulic cylinders connected to the second cup through at least a portion of the multiple hydraulic valves so that the inlet of the second cup is located at a specified height from the upper side of the wafer, and the processor adjusts the strokes of the multiple hydraulic cylinders connected to the third cup through at least a portion of the multiple hydraulic valves so that the inlet of the third cup is located at a standby position corresponding to the second-stage process, the collision avoidance position includes a position higher than the specified height, and the standby position may include a position lower than the lower side of the wafer.

[0014] According to various embodiments, in a case where the current process is a third-stage process of recovering chemicals through the third cup, the processor adjusts the strokes of the multiple hydraulic cylinders connected to the first cup through at least a portion of the multiple hydraulic valves so that the inlet of the first cup is located at a first collision avoidance position corresponding to the third-stage process, the processor adjusts the strokes of the multiple hydraulic cylinders connected to the second cup through at least a portion of the multiple hydraulic valves so that the inlet of the second cup is located at a second collision avoidance position corresponding to the third-stage process, the processor adjusts the strokes of the multiple hydraulic cylinders connected to the third cup through at least a portion of the multiple hydraulic valves so that the inlet of the third cup is located at a specified height from the upper side of the wafer, the first collision avoidance position includes a position higher than the second collision avoidance position, and the second collision avoidance position may be higher than the position at the specified height.

[0015] According to various embodiments, the processor receives a control instruction for cleaning one of the multiple cups through the communication circuit, and in response to receiving the control instruction, the processor adjusts the stroke of multiple hydraulic cylinders connected to the one cup through at least a portion of the multiple hydraulic valves to position the one cup at a position where cleaning can be performed, and the position where cleaning can be performed may include a position lower than a position where the chemical can be recovered.

[0016] According to various embodiments, when the position of at least one cup among the plurality of cups is not adjusted from the initial position to the position corresponding to the current process, the processor may send a reminder through the communication circuit.

[0017] Effects of the Invention

[0018] In a semiconductor manufacturing process, various embodiments of the present invention can individually adjust the positions of multiple cups used to recover chemicals sprayed for processing wafers to prevent different chemicals from mixing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a block diagram of an electronic device according to various embodiments.

[0020] Figure 2 The diagram is an example diagram for explaining a method of controlling a hydraulic cylinder in an electronic device according to various embodiments.

[0021] Figure 3 The diagram is an example diagram for explaining a method for adjusting the height of a cup in an electronic device according to various embodiments.

[0022] Figure 4 The flowchart is used to illustrate a method for adjusting the height of a cup according to a semiconductor manufacturing process in an electronic device according to various embodiments. DETAILED DESCRIPTION

[0023] Hereinafter, various embodiments of this specification will be described with reference to the accompanying drawings. It should be understood that the embodiments and the terms used therefor are not intended to limit the implementation methods of the technology described in the specific present specification, but include various changes, equivalents and / or substitutes of the corresponding embodiments. With respect to the description of the accompanying drawings, similar reference numerals may be used for similar structural elements. Unless otherwise clearly indicated in the context, a singular expression may include a plural expression. In this specification, expressions such as "A or B" or "at least one of A and / or B" may include all possible combinations of multiple items listed at the same time. Expressions such as "first", "second", "first" or "second" may modify the corresponding structural elements, regardless of their order or importance, and are only used to distinguish one structural element from another structural element, without limiting the corresponding structural elements. When referring to a certain (e.g., first) structural element and another (e.g., second) structural element "(functionally or communicatively) connected" or "connected", the certain structural element may be directly connected to the above-mentioned other structural element, or connected through other structural elements (e.g., third structural element).

[0024] In this specification, "configured to" may be used interchangeably with "suitable for", "capable of", "changed to", "made to", "capable of doing", or "designed to" in hardware or software, depending on the situation. In some cases, the expression "a device configured to" may mean that the above-mentioned device "can" "do" together with other devices or components at the same time. For example, the sentence "the processor is configured to perform A, B, C" may mean a dedicated processor (e.g., an embedded processor) for performing the corresponding actions, or a general-purpose processor (e.g., a CPU or an application processor) that can perform the corresponding actions by executing one or more software programs stored in a memory device.

[0025] Figure 1 is a block diagram of an electronic device according to various embodiments.

[0026] Reference Figure 1 , the electronic device 100 may include a processor 120, a memory 130, a pressure valve 150, a sensor module 160, and a communication circuit 170. However, it is not limited thereto. For example, the electronic device 100 may also include: a hydraulic cylinder for adjusting the position of the cup, an input device for receiving input, and / or an output device for outputting information.

[0027] According to various embodiments, the processor 120 may drive the operating system or application, thereby controlling a plurality of hardware or software structural elements connected to the processor 120, and performing various data processing and operations. According to one embodiment, the processor 120 may be implemented as a system on chip (SoC). The processor 120 may load instructions or data received from at least one of the other structural elements into the memory 130 for processing, and may store various data in the memory 130.

[0028] According to various embodiments, if the wafer is loaded on a chuck table device (not shown), the processor 120 may identify information related to the process flow from the memory 130. For example, in the case where information indicating that the wafer is loaded on the chuck table device is received through the communication circuit 170, the processor 120 may identify the current process as a first stage process of recovering chemicals through a first cup among a plurality of cups based on the information related to the process flow. As another example, in the case where information indicating that the wafer is loaded on the chuck table device is received through the communication circuit 170, the processor 120 may identify the current process as a second stage process of recovering chemicals through a second cup among a plurality of cups based on the information related to the process flow. As another example, in the case where information indicating that the wafer is loaded on the chuck table device is received through the communication circuit 170, the processor 120 may identify the current process as a third stage process of recovering chemicals through a third cup among a plurality of cups based on the information related to the process flow. According to one embodiment, the information related to the process flow may be received through the communication circuit 170 and / or an input device (not shown) and stored in the memory 130. According to one embodiment, when a wafer is loaded on a chuck table device, the positions of a plurality of cups (e.g., the first to third cups) for recovering the chemical substances sprayed to process the wafer fixed to the chuck table device may be located at a home position (or initial position) lower than the wafer. According to one embodiment, the inlet of the first cup is located on the upper side of the inlet of the second cup, and the inlet of the second cup may be located on the upper side of the inlet of the third cup. According to one embodiment, the plurality of cups each have a shape surrounding the chuck table device, and may be configured to be concentric with the chuck table device.

[0029] According to various embodiments, the processor 120 may control the pressure valve 150 based on information related to the process flow to adjust the positions of the plurality of cups. For example, in the case where the current process is a first-stage process of recovering chemicals through the first cup among the plurality of cups, the processor 120 may control the pressure valve 150 so that the inlet of the first cup among the plurality of cups is located at a specified height (e.g., 20 mm) from the upper side of the wafer, and the second cup and the third cup are located at the following positions: the size of the inflow path of the chemical formed by the inlet of the first cup, the inlet of the second cup, and the inlet of the third cup can form a position of a fixed size. As another example, in the case where the current process is a second-stage process of recovering chemicals through the second cup among the plurality of cups, the processor 120 may control the pressure valve 150 so that the inlet of the second cup among the plurality of cups is located at a specified height from the upper side of the wafer, the inlet of the first cup is located above the inlet of the second cup, and the third cup is located at a position where the size of the inflow path of the chemical formed by the inlet of the second cup and the inlet of the third cup can form a specified size. As another example, when the current process is a third-stage process of recovering chemicals through a third cup among a plurality of cups, the processor 120 may control the pressure valve 150 so that the inlet of the third cup among the plurality of cups is located at a specified height from the upper side of the wafer, and the inlet of the first cup and the inlet of the second cup are located on the upper side of the third cup. According to one embodiment, during the control of the pressure valve 150, the processor 120 identifies the position of the load of the hydraulic cylinder connected to the pressure valve 150 through the sensor module 160, and may determine whether the height of the cup adjusted by the pressure valve 150 reaches the target position based on the identified position.

[0030] If the process flow is completed after the positions of the plurality of cups are adjusted based on the information related to the process flow, the processor 120 may control the pressure valve 150 so that the positions of the plurality of cups are located at home positions.

[0031] According to various embodiments, in the case of receiving a control instruction to clean at least one of the multiple cups through the communication circuit 170 and / or the input device (not shown), the processor 120 may control the pressure valve 150 to adjust the position of at least one of the multiple cups. For example, in the case of receiving a control instruction to clean the first cup of the multiple cups, the processor 120 may control the pressure valve 150 to adjust the position of the first cup to a position where cleaning can be performed (for example: the inlet of the cup is 15 mm or 10 mm higher than the upper side of the wafer). As another example, in the case of receiving a control instruction to clean the second cup of the multiple cups, the processor 120 may control the pressure valve 150 to adjust the position of the second cup to a position where cleaning can be performed. In this case, in order to prevent the inlet of the first cup from colliding with the inlet of the second cup, the processor 120 may adjust the position of the first cup together so that the inlet of the first cup is located on the upper side of the inlet of the second cup. As another example, when receiving a control instruction to wash the third cup among the multiple cups, the processor 120 may control the pressure valve 150 to adjust the position of the third cup to a position where washing can be performed. In this case, in order to prevent the inlets of the multiple cups from colliding, the processor 120 may adjust the positions of the first cup and the second cup together, so that the inlet of the second cup is located above the inlet of the third cup, and the inlet of the first cup is located above the inlet of the second cup.

[0032] According to various embodiments, when the positions of at least a portion of the plurality of cups are not adjusted to the positions corresponding to the current process, the processor 120 may send a reminder signal to an external device through the communication circuit 170. For example, when the positions of the plurality of cups are not adjusted to the positions corresponding to the current process within a specified time, the processor 120 may send a reminder signal to an external electronic device through the communication circuit 170 so that the user of the electronic device 100 can recognize it.

[0033] According to various embodiments, the pressure valve 150 can adjust the positions of multiple cups. For example, the pressure valve 150 (or pressure vacuum valve) is connected to multiple hydraulic cylinders, and the hydraulic pressure supplied to the multiple hydraulic cylinders is adjusted according to the control of the processor 120, so that the positions of the cups connected to each hydraulic cylinder can be adjusted.

[0034] According to various embodiments, the sensor modules 160 are respectively provided at the plurality of hydraulic cylinders, detect positions of the loads of the respective hydraulic cylinders, and may provide information related to the detected positions of the loads to the processor 120 .

[0035] According to various embodiments, the communication circuit 170 forms a wired communication channel and / or a wireless communication channel between the electronic device 100 and an external electronic device, and can perform data communication through the formed communication channel. According to one embodiment, the communication circuit 170 can receive information related to a process flow from the external electronic device.

[0036] In the above description, it is assumed that there are three cups (e.g., the first cup, the second cup, and the third cup) used in the semiconductor manufacturing process, but the present invention is not limited thereto. For example, the number of cups used in the semiconductor manufacturing process may be more than three or less than three, and even in each case, the position of the cup may be adjusted by the same or similar method.

[0037] Figure 2 The diagram is an example diagram for explaining a method of controlling a hydraulic cylinder in an electronic device according to various embodiments.

[0038] Reference Figure 2 , electronic devices (e.g. Figure 1 The processor 201 of the electronic device 100 (for example: Figure 1 The processor 120 of the electronic device is electrically connected to the plurality of pressure valves 250-1 to 250-12. In order to increase or decrease the load of the plurality of hydraulic cylinders 280-1 to 280-6 connected to the plurality of pressure valves 250-1 to 250-12, a control signal (e.g., a voltage of 0V to 10V) may be output to the plurality of pressure valves 250-1 to 250-12 respectively. According to one embodiment, the control signal for increasing or decreasing the load of the plurality of hydraulic cylinders 280-1 to 280-6 to a specific position may be obtained through a test process. After the test is completed, the control signal may be stored in a memory of the electronic device (e.g., Figure 1 Memory 130).

[0039] According to various embodiments, the plurality of hydraulic cylinders 280-1 to 280-6 receive hydraulic pressures from two pressure valves, respectively, so that the load of the hydraulic cylinder can be fixed (or stopped) at a specific position. For example. The first hydraulic cylinder 280-1 can fix the load at a specific position using the first hydraulic pressure provided by the first pressure valve 250-1 and the second hydraulic pressure provided by the second pressure valve 250-2. Therefore, the position of the cup connected to the load of each of the plurality of hydraulic cylinders 280-1 to 280-6 can be adjusted. According to one embodiment, one cup can be connected to two hydraulic cylinders. For example, the first cup is connected to the first hydraulic cylinder 280-1 and the sixth hydraulic cylinder 280-6, the second cup is connected to the second hydraulic cylinder 280-2 and the fifth hydraulic cylinder 280-5, and the third cup can be connected to the third hydraulic cylinder 280-3 and the fourth hydraulic cylinder 280-4.

[0040] According to various embodiments, a plurality of sensor modules 260-1 to 260-6 are respectively provided at a plurality of hydraulic cylinders 280-1 to 280-6, detect the position of the load of each hydraulic cylinder, and can provide information (or signals (e.g., current signals of 4 mA to 20 mA)) related to the detected position of the load to the processor 201. The processor 201 identifies the position of the load of each of the plurality of hydraulic cylinders 280-1 to 280-6 based on the information provided by the plurality of sensor modules 260-1 to 260-6, compares the identified position of the load with the target position of the load corresponding to the current process, and adjusts the plurality of pressure valves 250-1 to 250-12 respectively based on the comparison result, so that the positions of the plurality of cups can be adjusted to positions suitable for the current process.

[0041] Figure 3 The diagram is an example diagram for explaining a method for adjusting the height of a cup in an electronic device according to various embodiments.

[0042] According to various embodiments, Figure 3 As shown, after the process starts or the process is completed, the electronic device (for example: Figure 1 The electronic device 100 can adjust (for example, adjust the stroke to 1 mm) the strokes of the multiple hydraulic cylinders connected to each cup so that the first cup 301, the second cup 303, and the third cup 305 are located at the home position (or the initial position). According to one embodiment, when the first cup 301, the second cup 303, and the third cup 305 are located at the home position, the inlet of the cup can be located at a position lower than the wafer.

[0043] According to various embodiments, Figure 3 As shown, when the current process is a first-stage process of recovering chemicals through the first cup 301, the electronic device 100 adjusts (for example: adjusts the stroke to 40 mm) the strokes of the multiple hydraulic cylinders connected to the first cup 301 so that the inlet of the first cup 301 is located at a specified height h (for example: 20 mm) from the upper side of the chip, and the electronic device 100 adjusts the strokes of the multiple hydraulic cylinders connected to the second cup 303 so that the inlet of the second cup 303 is located at the first standby position corresponding to the first-stage process (or the previous position of the first cup 301), and the electronic device 100 can adjust the strokes of the multiple hydraulic cylinders connected to the third cup 305 so that the inlet of the third cup 305 is located at the second standby position corresponding to the first-stage process (or the previous position of the second cup 301).

[0044] According to various embodiments, Figure 3As shown, when the current process is a second-stage process of recovering chemicals through the second cup 303, the electronic device 100 adjusts (for example, adjusts the stroke to 44 mm) the strokes of the multiple hydraulic cylinders connected to the first cup 301 so that the inlet of the first cup 301 is located at a collision avoidance position corresponding to the second-stage process, and the electronic device 100 adjusts (for example, adjusts the stroke to 40 mm) the strokes of the multiple hydraulic cylinders connected to the second cup 303 so that the inlet of the second cup 303 is located at a specified height h (for example, 20 mm) from the upper side of the chip, and the electronic device 100 can adjust the strokes of the multiple hydraulic cylinders connected to the third cup 305 so that the inlet of the third cup 305 is located at a standby position corresponding to the second-stage process (or the previous position of the second cup 303).

[0045] According to various embodiments, Figure 3 As shown, when the current process is a third-stage process of recovering chemicals through the third cup 305, the electronic device 100 adjusts (for example, adjusts the stroke to 48 mm) the strokes of the multiple hydraulic cylinders connected to the first cup 301 so that the inlet of the first cup 301 is located at a first collision avoidance position corresponding to the third-stage process, and the electronic device 100 adjusts (for example, adjusts the stroke to 44 mm) the strokes of the multiple hydraulic cylinders connected to the second cup 303 so that the inlet of the second cup 303 is located at a second collision avoidance position corresponding to the third-stage process, and the electronic device 100 can adjust the strokes of the multiple hydraulic cylinders connected to the third cup 305 so that the inlet of the third cup 305 is located at a specified height h (for example, 20 mm) from the upper side of the chip.

[0046] As described above, in the semiconductor manufacturing process, the electronic device 100 considers current process information to individually adjust the positions of multiple cups for recovering chemicals sprayed for processing wafers, and keeps the intervals between the inlet ports for the inflow chemicals at a fixed size, thereby preventing different chemicals from mixing.

[0047] Figure 4 The flowchart is used to illustrate a method for adjusting the height of a cup according to a semiconductor manufacturing process in an electronic device according to various embodiments.

[0048] Reference Figure 4 In action 401, an electronic device (e.g., Figure 1 The processor of the electronic device 100 (for example: Figure 1 The processor 120 or Figure 2 The processor 201 of the embodiment can identify that the wafer is loaded on the chuck worktable. For example, the processor 120 can receive information indicating that the wafer is loaded on the chuck worktable through the communication circuit 170, thereby identifying that the wafer is loaded on the chuck worktable.

[0049] In action 403, the processor 120 may determine the positions of the plurality of cups based on the working mode of the electronic device 100 in response to recognizing that the wafer is loaded on the chuck table. For example, the processor 120 obtains information related to the process flow from the memory 130, and controls the pressure valve 150 to adjust the positions of the plurality of cups based on the obtained process flow. Specifically, the processor 120 recognizes that the current process is a first stage process of recovering chemicals through the first cup of the plurality of cups based on the information related to the process flow obtained from the memory 130, and may control the pressure valve 150 in response to the recognition so that the first cup (e.g.: Figure 3 The inlet of the first cup 301 is located at a specified height h (e.g., 20 mm) from the upper side of the wafer, so that the second cup (e.g., Figure 3 The inlet of the second cup 303) is located at the first standby position corresponding to the first stage process (or the previous position of the first cup), so that the inlet of the third cup (for example: the third cup 305) is located at the second standby position corresponding to the first stage process (or the previous position of the second cup). According to one embodiment, various stage processes can be performed sequentially in the semiconductor process, so the positions of multiple cups can be adjusted from the position corresponding to the previous process to the position corresponding to the current process. For example, in the case where the second stage process is performed after the first stage process, the positions of multiple cups are moved from the initial position to the position corresponding to the first stage process during the execution of the first stage process. If the first stage process is completed, the positions of the multiple cups can be adjusted from the position corresponding to the first stage process to the position corresponding to the second stage process. According to one embodiment, if the processor 120 recognizes that the current process is over based on information related to the process flow, the pressure valve 150 can be controlled so that the positions of the multiple cups are located at the home position (or the initial position).

[0050] In action 405, the processor 120 may identify that the wafer is unloaded from the chuck table. For example, after the current process is completed, the processor 120 receives information indicating that the wafer is unloaded from the chuck table through the communication circuit 170, thereby identifying that the wafer is unloaded from the chuck table.

[0051] As described above, in the semiconductor manufacturing process, the electronic device 100 considers current process information to individually adjust the positions of multiple cups for recovering chemicals sprayed for processing wafers, and keeps the intervals between the inlet ports for the inflow chemicals at a specified size, thereby preventing different chemicals from mixing.

[0052] The term "module" used in this specification may include a unit implemented as hardware, software or firmware, and may be used interchangeably with terms such as logic, logic block, component or circuit. A module may be a minimum unit or a part of a component that is configured as an integral part or performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0053] Various embodiments of the present specification may be implemented as including storage on a machine (e.g.: Figure 1 A storage medium (storage medium) (for example: Figure 1 For example, a device (e.g., Figure 1 A processor of the electronic device 100 (for example: Figure 1 The processor 120 of the device calls at least one of the one or more instructions stored in the storage medium, and can execute the above instructions. This can enable the device to operate in a manner that performs at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium that can be read by the device can be provided in the form of a non-transitory storage medium. Among them, "non-transitory" only means that the storage medium is a tangible device and does not contain a signal (for example, an electromagnetic wave). The term does not distinguish between the case where data is semi-permanently stored in the storage medium and the case where data is temporarily stored in the storage medium.

[0054] According to various embodiments, each structural element (e.g., module or program) of the structural elements described above may include singular or plural entities. According to various embodiments, one or more structural elements or actions in the above-mentioned corresponding structural elements may be omitted, or one or more other structural elements or actions may be added. Alternatively or additionally, multiple structural elements (e.g., module or program) may be integrated into one structural element. In such a case, the integrated structural element may perform one or more functions of each structural element of the above-mentioned multiple structural elements in the same or similar manner as the functions performed by the corresponding structural elements in the above-mentioned multiple structural elements before the above-mentioned integration. According to various embodiments, the actions performed by modules, programs or other structural elements may be performed sequentially, in parallel, repeatedly or heuristically, or one or more of the above-mentioned multiple actions may be performed or omitted in other orders, or one or more other actions may be added.

Claims

1. An electronic device, comprising: Communication circuits; Memory; Multiple pressure valves; as well as a processor connected to the communication circuit, the memory and the plurality of pressure valves, The processor acquires information related to the process flow through the communication circuit in response to receiving information indicating that a wafer is loaded on the chuck table through the communication circuit, The processor identifies a current process according to information related to the process flow, The processor controls the plurality of pressure valves to adjust positions of a plurality of cups to positions corresponding to the current process, the plurality of cups being used to recover chemicals injected during the process, The electronic device further includes a plurality of hydraulic cylinders connected to the plurality of cups, and the pressure valve adjusts hydraulic pressures respectively supplied to the plurality of hydraulic cylinders according to the control of the processor to adjust positions of the cups connected to the respective hydraulic cylinders.

2. The electronic device according to claim 1, wherein: The multiple hydraulic cylinders are connected to two pressure valves respectively. Based on the hydraulic pressure supplied from the two pressure valves, the strokes of the respective hydraulic cylinders are fixed at designated positions.

3. The electronic device according to claim 1, wherein: The plurality of cups include a first cup, a second cup, and a third cup, The inlet of the first cup is located above the inlet of the second cup, The inlet of the second cup is located on the upper side of the inlet of the third cup.

4. The electronic device according to claim 3, wherein: In the case where the current process is a first-stage process of recovering chemicals through the first cup, The processor adjusts the strokes of a plurality of hydraulic cylinders connected to the first cup through at least one hydraulic valve among a plurality of hydraulic valves so that the inlet of the first cup is located at a specified height from the upper side of the wafer, The processor adjusts the strokes of the plurality of hydraulic cylinders connected to the second cup through at least one of the plurality of hydraulic valves so that the inlet of the second cup is located at a first standby position corresponding to the first stage process. The processor adjusts the strokes of the plurality of hydraulic cylinders connected to the third cup through at least one of the plurality of hydraulic valves so that the inlet of the third cup is located at a second standby position corresponding to the first stage process, The first standby position includes a position lower than the lower side of the wafer, The second standby position includes a position lower than the first standby position.

5. The electronic device according to claim 3, wherein: In the case where the current process is a second stage process of recovering chemicals through the second cup, The processor adjusts the strokes of a plurality of hydraulic cylinders connected to the first cup through at least one hydraulic valve among a plurality of hydraulic valves so that the inlet of the first cup is located at a collision avoidance position corresponding to the second stage process, The processor adjusts the strokes of the plurality of hydraulic cylinders connected to the second cup through at least one of the plurality of hydraulic valves so that the inlet of the second cup is located at a specified height from the upper side of the wafer, The processor adjusts the strokes of the plurality of hydraulic cylinders connected to the third cup through at least one of the plurality of hydraulic valves so that the inlet of the third cup is located at a standby position corresponding to the second stage process, The collision avoidance position includes a position higher than the specified height, The standby position includes a position lower than a lower side of the wafer.

6. The electronic device according to claim 3, wherein: In the case where the current process is a third stage process of recovering chemicals through the third cup, The processor adjusts the strokes of multiple hydraulic cylinders connected to the first cup through at least one hydraulic valve among multiple hydraulic valves so that the inlet of the first cup is located at a first collision avoidance position corresponding to the third stage process, The processor adjusts the strokes of the plurality of hydraulic cylinders connected to the second cup through at least one of the plurality of hydraulic valves so that the inlet of the second cup is located at a second collision avoidance position corresponding to the third stage process, The processor adjusts the strokes of the plurality of hydraulic cylinders connected to the third cup through at least one of the plurality of hydraulic valves so that the inlet of the third cup is located at a specified height from the upper side of the wafer, the first collision avoidance position comprises a position higher than the second collision avoidance position, The second collision avoiding position is higher than the position at the designated height.

7. The electronic device according to claim 1, wherein: The processor receives a control instruction to clean one of the plurality of cups through the communication circuit, In response to receiving the control instruction, the processor adjusts the strokes of multiple hydraulic cylinders connected to the one cup through at least one hydraulic valve among multiple hydraulic valves so that the one cup is located at a position where cleaning can be performed. The position where cleaning can be performed includes a position lower than a position where the chemical substances can be recovered.

8. The electronic device according to claim 1, wherein: In a case where the position of at least one cup among the plurality of cups is not adjusted to a position corresponding to the current process, the processor sends a reminder through the communication circuit.

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