Substrate processing device and substrate processing system

By using the engagement structure between the arm and the locking part in the locking mechanism of the treatment container, the dust pollution problem caused by the slippage of the components is solved, and effective protection of the substrate and the airtightness maintenance of the treatment container are achieved.

CN113205990BActive Publication Date: 2025-05-13SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
CN202110119190.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-01-31
Filing Date
2021-01-28
Publication Date
2025-05-13
Estimated Expiration
2041-01-28

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Abstract

The present application relates to a substrate processing device and a substrate processing system. In a substrate processing device that processes a substrate in a processing container, dust caused by sliding of components is prevented from contaminating the substrate, and the cover is securely locked to the container body. Therefore, the substrate processing system (1) comprises: a processing container body (12); a cover (13) that can block the opening of the processing container body; a moving part (14) that allows the cover to move relative to the processing container body to open and close the opening; and a locking mechanism (16) that locks the cover to the processing container body. The locking mechanism comprises: an arm (161) that extends from one side of the processing container body and the cover to the other side, and when the cover is in a departure position away from the processing container body, it extends beyond the gap space with the processing container body to the other side; and a stopper (162) that engages with a portion of the arm that is located beyond the gap space when the cover is in the departure position, thereby limiting the displacement of the arm.
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Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate in a processing container, and in particular to a substrate processing device for processing under high pressure and a substrate processing system including the substrate processing device. Background Art

[0002] The processing steps of various substrates such as semiconductor substrates and glass substrates for display devices include the steps of processing the substrates using various processing fluids. In order to efficiently use the processing fluid and prevent the processing fluid from escaping to the outside, such processing is sometimes performed in an airtight processing container. In this case, the processing container is provided with an opening for carrying in and out the substrate, and a cover for blocking the opening to ensure the airtightness of the internal space. In particular, when the processing is performed under high pressure relative to the surrounding atmosphere, in order to maintain airtightness and prevent the cover from opening due to internal pressure, a locking mechanism is required to securely fix the processing container body and the cover.

[0003] For example, in the processing device described in Japanese Patent Publication No. 2015-039040 (Patent Document 1), the substrate (wafer) to be processed is carried into the processing container in a state of being placed on a flat bracket. Moreover, after the cover body integrated with the bracket blocks the opening of the processing container, a locking plate pressing the cover body is installed on the processing container, thereby mechanically suppressing the cover body from flying out. In addition, for example, in the substrate processing device described in Japanese Patent Publication No. 2013-033964 (Patent Document 2), a door that is freely installed on the shell body blocks the opening and engages with the pressure plate, thereby locking the door to maintain the airtightness in the shell. Summary of the invention

[0004] [Problems to be solved by the invention]

[0005] When such a processing device including a processing container is used in a process of purifying a substrate, for example, it is necessary to prevent the substrate being carried into or out of the processing container from being contaminated by dust caused by the movement of the mechanism parts. However, the locking mechanism of the prior art is a structure in which the parts near the opening of the processing container slide against each other. Therefore, the fine powder generated by the sliding between the parts is scattered as particles or adheres to the substrate conveying path or around the opening, and the fine powder may cause the substrate to be contaminated.

[0006] [Technical means to solve the problem]

[0007] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a structure which can prevent dust caused by sliding of parts from contaminating the substrate in a substrate processing apparatus for processing the substrate in a processing container, and can reliably lock a cover to a container body.

[0008] In order to achieve the above-mentioned purpose, one form of the present invention comprises: a processing container body having an internal space capable of accommodating a substrate, and an opening connected to the internal space and used to allow the substrate to pass through; a cover capable of blocking the opening; a moving part that moves the cover relative to the opening and uses the cover to open and close the opening; and a locking mechanism that locks the cover to the processing container body; and the moving part changes the relative position of the cover relative to the processing container body between a blocking position and a leaving position. Here, the blocking position is a position where the cover approaches the processing container body and blocks the opening, and the leaving position is a position where the cover moves away from the opening in a direction opposite to the internal space and is separated from the opening by a gap space for allowing the substrate to be transported to the internal space to pass through. Moreover, the locking mechanism comprises: an arm portion, which is extended from one side of the processing container body and the cover portion to the other side; and a locking portion, which engages with the arm portion when the cover portion is located at the blocking position to limit the displacement of the arm portion; when the cover portion is located at the departure position, the front end of the arm portion extends beyond the gap space to the other side, and the portion of the arm for the locking portion to engage is a portion of the arm portion that is located beyond the gap space when the cover portion is located at the departure position.

[0009] In the present invention, the "blocking position" and "leaving position" of the cover are relative positions relative to the processing container body, but in order to avoid cumbersomeness, the description of these positions as "relative positions relative to the processing container body" is sometimes omitted below. Similarly, in the following description, unless otherwise specified, the "movement" of a component refers to the "relative movement" relative to other components, and is not limited to the moving body in the actual space.

[0010] In the invention constructed as described above, the arm of the locking mechanism is engaged with the locking portion to lock the processing container body and the cover. Although dust may be generated due to the friction between the arm and the locking portion, the influence will not affect the gap space for transferring the substrate. The reason is as follows.

[0011] In the present invention, the cover moves relative to the processing container body between a blocking position for blocking the opening of the processing container body and a separation position for forming a gap space between the cover and the processing container through which the substrate can pass. The arm of the locking mechanism extends from one of the processing container body and the cover to the other side, and its front end also exceeds the gap space to reach the other side when the cover is in the separation position.

[0012] If the process of the cover moving from this state to the blocking position is considered, the distance between the processing container body and the cover gradually becomes smaller, and the gap space becomes narrower. At the same time, the portion of the arm that engages with the stopper (hereinafter referred to as the "engaging portion") gradually moves in a direction further away from the gap space. In this way, during the movement of the cover between the leaving position and the blocking position, the engaging portion of the arm is always located at a position away from the gap space. In particular, the engagement of the arm and the stopper is achieved at a position that is significantly away from the gap space or the opening of the processing container body.

[0013] In this way, during the entire movement process between the exit position and the blocking position, the arm and the stopper engage with each other at the other side of the gap space. Therefore, even if particles are generated due to the friction between the two, the probability of the particles being mixed into the substrate conveying path or the internal space of the processing container body is greatly reduced. In addition, it is also avoided that when the cover moves from the blocking position to the exit position, the particles generated at the engaging portion and attached to the surroundings thereof are transported to the gap space as the arm moves.

[0014] [Effects of the invention]

[0015] As described above, in the present invention, when the cover is located at the blocking position for blocking the opening of the processing container body, the arm of the locking mechanism and the stopper are mechanically engaged, thereby firmly combining the cover with the processing container body and thus locking it securely. Thus, the airtightness of the internal space can be maintained to prevent the contents from leaking out. In addition, even when the cover is separated from the processing container body, particles generated by the friction between the arm and the stopper can be prevented from entering the gap space, thereby preventing the substrate from being contaminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a diagram showing a schematic configuration of an embodiment of a substrate processing system according to the present invention.

[0017] Figure 2 It is an exploded perspective view showing the structure of the locking mechanism.

[0018] Figure 3 It is an exploded perspective view showing the structure of the locking mechanism.

[0019] Figure 4 It is a figure which shows the operation|movement of a locking mechanism.

[0020] Figure 5 It is a figure which shows the operation|movement of a locking mechanism.

[0021] Fig. 6A It is a top view showing a modified example of the locking mechanism.

[0022] Figure 6B It is a top view showing a modified example of the locking mechanism.

[0023] Fig. 7A It is a diagram showing another modified example of the locking mechanism.

[0024] Figure 7B It is a diagram showing another modified example of the locking mechanism. DETAILED DESCRIPTION

[0025] Figure 1 FIG. 1 is a diagram showing a schematic structure of an embodiment of a substrate processing system including a substrate processing device of the present invention. The substrate processing system 1 is a processing system for processing the surface of various substrates such as semiconductor substrates using a supercritical fluid. Figure 1 As shown in FIG. 1 , an XYZ orthogonal coordinate system is set. Here, the XY plane is a horizontal plane, and the Z direction represents a vertical direction. More specifically, the (-Z) direction represents vertically downward.

[0026] Here, as the "substrate" in this embodiment, various substrates such as semiconductor wafers, glass substrates for masks, glass substrates for liquid crystal displays, glass substrates for plasma displays, substrates for FED (Field Emission Display), substrates for optical disks, substrates for magnetic disks, and substrates for magneto-optical disks can be applied. Hereinafter, a substrate processing system mainly used for processing a disk-shaped semiconductor wafer is taken as an example, and is described with reference to the accompanying drawings. However, the processing of various substrates exemplified above is also applicable. In addition, various shapes can also be applied to the shape of the substrate.

[0027] The substrate processing system 1 includes a processing unit 10 and a transfer unit 30 disposed in a clean room 100. The processing unit 10 is a main body for executing supercritical drying processing. The transfer unit 30 receives an unprocessed substrate S transported by an external transport device (not shown) and transports it to the processing unit 10, and also transfers the processed substrate S from the processing unit 10 to the external transport device. In addition, the substrate processing system 1 includes a supply unit 50 and a control unit 90 disposed inside or outside the clean room 100. The supply unit 50 supplies the chemical substances and power required for the processing to the processing unit 10 and the transfer unit 30.

[0028] As the transfer unit 30, for example, a well-known multi-joint robot can be used. As a robot for transferring substrates between such processing units, robots of various structures are also known, and they can be appropriately selected and used. Therefore, the description of the structure of the transfer unit 30 is omitted. In addition, a fan filter unit (FFU) 40 is provided in the ceiling portion of the clean room 100, and a clean downflow is supplied from above the processing unit 10.

[0029] The control unit 90 controls each part of these devices to achieve specific processing. To achieve this purpose, the control unit 90 includes: a CPU (Central Processing Unit) 91 that executes various control programs, a memory 92 that temporarily stores processing data, a memory 93 that stores the control program executed by the CPU 91, and an interface 94 for exchanging information with a user or an external device. The CPU 91 executes the control program pre-written in the memory 93 to make each part of the device perform specific actions, thereby realizing the actions of the following devices.

[0030] The processing unit 10 has a structure in which a processing chamber 12 is installed on a supporting leg 11. The processing chamber 12 is composed of a combination of a plurality of metal blocks, and its interior is a cavity, which constitutes a processing space SP. The processing target substrate S is carried into the processing space SP to be processed. A slit-shaped opening 121 extending elongated in the X direction is formed on the (-Y) side of the processing chamber 12, and the processing space SP is connected to the external space through the opening 121.

[0031] A cover member 13 is provided on the (-Y) side of the processing chamber 12 in such a manner as to block the opening 121. The cover member 13 blocks the opening 121 of the processing chamber 12 to form a processing container, and the substrate S can be processed under high pressure in the internal processing space SP. A flat support tray 15 is installed in a horizontal position on the (+Y) side of the cover member 13. The upper surface of the support tray 15 serves as a support surface on which the substrate S can be placed. The transfer unit 30 places an unprocessed substrate S on the upper surface of the support tray 15, and also carries out a processed substrate S on the support tray 15.

[0032] The cover member 13 is supported by the support portion 14 via the arm member 161 so as to be horizontally movable in the Y direction. More specifically, the cover member 13 is mounted on the arm member 161 which is a part of the locking mechanism 16 described below, and the arm member 161 is supported by the support portion 14. The support portion 14 includes a guide rail 141 provided on the floor surface of the clean room 100 along the Y direction, and a slider 142 engaged with the guide rail 141 so as to be movable in the Y direction. The slider 142 is provided with a support leg 143, and the arm member 161 is supported by the support leg 143.

[0033] The cover member 13 can be moved forward and backward relative to the processing chamber 12 by the advance and retreat mechanism 53 provided in the supply unit 50. Specifically, the advance and retreat mechanism 53 includes a direct-acting mechanism such as a linear motor, a direct-acting guide, a ball screw mechanism, a solenoid, and a cylinder. The slider 142 of the support portion 14 is moved in the Y direction along the guide rail 141 by this direct-acting mechanism, so that the cover member 13 moves in the Y direction. The advance and retreat mechanism 53 operates according to a control instruction from the control unit 90.

[0034] By moving the cover member 13 in the (-Y) direction, as shown in FIG. Figure 1 As shown by the dotted line, the support tray 15 is pulled out from the processing space SP through the opening 121 to the outside, and the support tray 15 can be stored or taken out. That is, the substrate S can be placed on the support tray 15, and the substrate S placed on the support tray 15 can be taken out. On the other hand, by moving the cover member 13 in the (+Y) direction, as shown in FIG. Figure 1 As shown by the solid line, the support tray 15 is stored in the processing space SP. When the substrate S is placed on the support tray 15 , the substrate S is carried into the processing space SP together with the support tray 15 .

[0035] The processing space SP is sealed by moving the cover member 13 in the (+Y) direction to cover the opening 121. A sealing member 122 is provided between the (+Y) side surface of the cover member 13 and the (-Y) side surface of the processing chamber 12 to maintain the airtight state of the processing space SP. In addition, the cover member 13 is fixed to the processing chamber 12 by the locking mechanism described below. In this way, the substrate S is processed in the processing space SP while the airtight state of the processing space SP is ensured.

[0036] In this embodiment, a material fluid that can be used for supercritical processing, such as carbon dioxide, is supplied to the processing unit 10 in a gaseous or liquid state from a fluid supply unit 57 provided in the supply unit 50. Carbon dioxide becomes a supercritical state at a relatively low temperature and low pressure, and has the property of being good at dissolving organic solvents that are often used for substrate processing. In this respect, it is a chemical substance suitable for supercritical drying processing.

[0037] The fluid is filled into the processing space SP, and when the processing space SP reaches an appropriate temperature and pressure, the fluid becomes a supercritical state. In this way, the substrate S is processed in the processing chamber 12 using the supercritical fluid. The supply unit 50 is provided with a fluid recovery unit 55, and the processed fluid is recovered by the fluid recovery unit 5. The fluid supply unit 57 and the fluid recovery unit 55 are controlled by the control unit 90.

[0038] In the substrate processing system 1 having the main structure as described above, a supercritical drying process is performed on the substrate S transported in a state wetted with the processing liquid, that is, a process of drying the substrate S using a supercritical fluid is performed. In this process, the processing liquid attached to the substrate S is replaced by a supercritical liquid with extremely low surface tension, and the supercritical fluid is directly sublimated without passing through a liquid phase, thereby drying the substrate S. Therefore, in particular, in the drying of a substrate having a fine pattern formed on the surface, the pattern collapse caused by the surface tension of the liquid at the gas-liquid interface can be prevented. Since this supercritical drying process is well known, a detailed description of the processing process is omitted here.

[0039] During the process, the processing space SP in the processing chamber 12 becomes high pressure. Therefore, in order to prevent the leakage of the high pressure fluid, maintain the internal pressure appropriately, and further prevent the cover member 13 from falling off due to the internal pressure, a locking mechanism is required to firmly connect the processing chamber 12 and the cover member 13. Figures 2 to 5 The structure of the lock mechanism 16 in this embodiment will be described.

[0040] Figure 2 and Figure 3 : is an exploded perspective view showing the structure of the locking mechanism. Figure 4 and Figure 5 FIG. 2 is a diagram showing the operation of the locking mechanism. Figure 2 and Figure 3 As shown, the locking mechanism 16 in this embodiment includes an arm member 161 and a locking member 162. Figure 2 The structure of the arm member 161 will be described.

[0041] The arm member 161 is a metal member having a substantially U-shaped or horseshoe-shaped shape. Figure 2 As shown in FIG. 1 , the arm member 161 includes a pair of arms 161a and 161b extending in the Y direction, and a connection portion 161c extending in the X direction to connect the (-Y) side ends of the arms 161a and 161b. The connection portion 161c has a length greater than the X direction length of the cover member 13, and the cover member 13 is fixed to the (+Y) side surface thereof. That is, the arm member 161 and the cover member 13 are mechanically integrated.

[0042] The arms 161a and 161b extend from the connection portion 161c in the (+Y) direction on the outside in the X direction of the cover member 13. The arms 161a and 161b have notches 161d and 161e formed by partially cutting off the upper end of the arms near their respective front ends.

[0043] like Figure 3 As shown, the structure formed by integrating the cover member 13 and the arm member 161 as described above is combined with the processing chamber 12. The structure can be moved in the Y direction by the action of the advance and retreat mechanism 53. If the structure moves in the (+Y) direction, the support tray 15 mounted on the cover member 13 and the substrate S placed on the upper surface thereof enter the processing space SP inside the processing chamber 12 through the opening 121 provided on the (-Y) side of the processing chamber 12. Finally, the cover member 13 abuts against the sealing member 122 provided around the opening 121, and the structure moves to a position blocking the opening 121, thereby sealing the support tray 15 and the substrate S in the processing space SP.

[0044] On the other hand, the two arms 161a and 161b of the arm member 161 move toward the (+Y) direction by being located outside the two side surfaces on the X direction side of the processing chamber 12. The upper portion of the (+Y) side end of the processing chamber 12 is cut away, and the locking member 162 is arranged above the cutout portion 123. Figure 3 Although not described in the specification, the locking member 162 is freely raised and lowered by a lifting mechanism 54 (such as a linear motor, a direct-acting guide, a ball screw mechanism, a solenoid, or a cylinder). Figure 1 )support.

[0045] The locking member 162 is a metal rod-shaped member extending in the X direction, and its cross section is shaped to fit into the notch portions 161d and 161e of the arms 161a and 161b. When the cover member 13 is moved in and out to a position blocking the opening 121, the notch portions 161d and 161e of the arms 161a and 161b are moved in and out to a position just below the locking member 162. In other words, the configuration of the locking member 162 is determined in accordance with the lengths of the arms 161a and 161b and the positions of the notch portions 161d and 161e so as to achieve such a positional relationship.

[0046] When the locking member 162 is lowered in this state, both ends of the locking member 162 in the X direction engage with the notches 161d and 161e, respectively. As a result, the rectangular ring structure composed of the arm member 161 and the locking member 162 is arranged to surround the entire periphery of the processing chamber 12.

[0047] The locking member 162 is restricted from displacement in the (-Y) direction by abutting against the side of the notch 123 of the processing chamber 12. Therefore, the arm member 161 and the cover member 13 mounted on the arm member 161 are also restricted from displacement in the (-Y) direction. In this way, the cover member 13 is sandwiched between the processing chamber 12 and the arm member 161, and the displacement of the arm member 161 is restricted by the locking member 162, thereby maintaining the state in which the cover member 13 blocks the opening 121. In this way, the arm member 161 and the locking member 162 function as a locking mechanism 16 that firmly fixes the cover member 13.

[0048] This locked state is achieved by mechanical engagement of the components, not by active mechanisms such as motors, cylinders, clutches, etc. Therefore, no power is required to maintain the locked state. In addition, the force that attempts to push out the cover component 13 due to the internal pressure of the processing space SP acts in a direction that makes the engagement of the arm component 161 and the locking component 162 more secure. This means that the locking mechanism 16 of this embodiment has an interlocking function, that is, it functions only when the internal space is sealed, and as long as the components are not mechanically damaged, the locked state can be maintained without the aid of a driving force.

[0049] The advancing and retreating mechanism 53 moves the cover member 13 via the arm member 161. Figure 4 The "leave position" shown is the same as Figure 5 Move between the "blocking positions" shown. Figure 4 The upper figure is a top view showing the cover member 13 in the detached position, and the lower figure is a side view thereof. Figure 4 In the separated position shown, the support tray 15 on which the substrate S is mounted is entirely exposed in the gap space GS between the cover member 13 and the processing chamber 12 , and the substrate S can be carried in and out by the transfer unit 30 .

[0050] At this time, the notches 161d and 161e of the arms 161a and 161b are located on the (+Y) direction side relative to the positions of the gap space GS and the opening 121 of the processing chamber 12. In other words, the positions of the notches 161d and 161e are defined so that when the cover member 13 is located at the detached position, the notches 161d and 161e are located on the (+Y) side relative to the position of the opening 121 of the processing chamber 12. Therefore, the lengths of the arms 161a and 161b are defined so that when the cover member 13 is located at the detached position, the front ends of the arms 161a and 161b extend beyond the gap space GS to the (+Y) side.

[0051] The arm member 161 is moved in the (+Y) direction by the advance / retract mechanism 53, and the arm member 161, the cover member 13 and the support tray 15 are moved in the (+Y) direction as a whole. Figure 4 ) to the blocking position ( Figure 5 )move. Figure 5 The upper figure is a plan view showing the blocking position of the cover member 13, and the lower figure is a side view thereof.

[0052] In the blocking position, the cover member 13 blocks the opening 121 of the processing chamber 12 via the sealing member 122. At this time, the notches 161d and 161e of the arms 161a and 161b reach the notches 123 of the processing chamber 12 and the arrangement position of the locking member 162. As the locking member 162 descends, the arm member 161, the processing chamber 12, and the locking member 162 are integrally engaged. Thus, the locking action of the cover member 13 is exerted.

[0053] As can be seen from the above, during the movement of the cover member 13 between the separated position and the blocked position, the notches 161d and 161e of the arms 161a and 161b are always located on the (+Y) direction side relative to the opening 121 of the processing chamber 12, that is, located away from the gap space GS which is the path for loading and unloading the substrate S in the (+Y) direction. This is advantageous in preventing the loaded and unloaded substrate S from being contaminated. The reason is as follows.

[0054] In a processing container with a high pressure internal space, an interlocking mechanism is required to prevent the cover from falling off due to the internal pressure. In addition, in order to realize the interlocking mechanism, it is required that the strong parts are mechanically firmly engaged with each other. In this way, friction between the parts is inevitable, which may cause dust generation, that is, the scattering of fine powder generated by the grinding of the surface of the parts.

[0055] When such dust is generated near the opening 121 through which the substrate S passes or the gap space GS serving as the conveyance path thereof, fine powder may adhere to the substrate S being conveyed or in the processing space SP, which may cause the substrate S to be contaminated by the fine particles.

[0056] In this embodiment, the notches 161d and 161e provided near the front ends of the arms 161a and 161b extending in the Y direction are engaged with the locking member 162, thereby functioning as an interlocking mechanism. At this time, the engagement position of the arms 161a and 161b and the locking member 162 is far from the opening 121 of the processing chamber 12. In other words, the friction between the components that may cause dust generation occurs at a position far from the substrate S.

[0057] Furthermore, even if the generated fine powder adheres to the notches 161d and 161e or their surroundings, the fine powder can be prevented from entering the gap space GS as the arm member 161 moves. This is because even when the notches 161d and 161e are located at the most (-Y) direction side of the cover member 13, the notches 161d and 161e are located at the (+Y) side of the gap space GS.

[0058] That is, when the cover member 13 moves between the detached position and the blocked position, the notches 161d and 161e to which the fine particles may adhere do not pass through the space that becomes the gap space GS when the cover member 13 is in the detached position. The FFU 40 is used to form a downflow around the processing unit 10, which also has the effect of keeping the fine particles away from the gap space GS.

[0059] Therefore, when the substrate S is carried in and out, the substrate S can pass without coming into contact with fine powder generated by friction of the components in the locking mechanism 16. This prevents the substrate S from being contaminated by dust.

[0060] In addition, in this embodiment, a pair of arms 161a and 161b are provided in a manner that horizontally separates the gap space GS and the processing chamber 12. From the perspective of the locking mechanism alone, only one arm can function, but by providing arms on both sides of the cover member 13 and the processing chamber 12, the interlocking function can be more reliably exerted. In this case, by arranging the two arms at positions separated in the horizontal direction relative to the gap space GS, it is possible to prevent fine powder falling from the arms from entering the gap space GS.

[0061] In this embodiment, the arm member 161 is combined with the cover member 13, and the arms 161a and 161b extend from the cover member 13 side to the processing chamber 12 side. However, the structure in which the arm extends from the processing chamber 12 side to the cover member 13 side is technically equivalent. However, the following problem may occur.

[0062] Fig. 6A and Figure 6B is a top view showing a variation of the locking mechanism. More specifically, Fig. 6A 1 is a diagram showing the departure position in the processing unit 10A of this variation. Figure 6B 1 is a diagram showing a blocked position. In the processing unit 10A of this variation, a pair of arms 163a and 163b extend from both ends of the processing chamber 12A in the X direction in the (-Y) direction, that is, in the direction toward the cover member 13A. The support tray 15A supporting the substrate S is mounted on the (+Y) side end surface of the cover member 13A, which is the same as the above embodiment. The same reference numerals are given to the same components as those in the above embodiment, and their description is omitted.

[0063] In this way, if you want to form an interlocking mechanism that meets the following conditions, such as Figure 6B As shown in FIG. 1 , the locking member 162A needs to be arranged at a position far from the cover member 13A in the (-Y) direction. The condition is Fig. 6A In the separated position shown in FIG. 1 , the notches 163d and 163e at the front end of the arm are located closer to the (-Y) direction than the gap space GS, and in Figure 6B Therefore, for example, it is necessary to install a larger extension member 17A on the (-Y) side of the cover member 13A, which increases the cost or occupied area of ​​the device, which is disadvantageous in this respect.

[0064] The above embodiment has a structure in which the arms 161a and 161b extend from the cover member 13 side toward the processing chamber 12A side whose depth (length in the Y direction) is necessarily increased by enclosing the processing space SP receiving the substrate S. This structure is advantageous in that it can suppress an increase in the occupied area of ​​the apparatus.

[0065] Fig. 7A and Figure 7B 1 and 2 are diagrams showing other variations of the locking mechanism. In these variations, the structure of the locking member constituting the locking mechanism is different from that of the embodiment. However, the other structures may be basically the same as those of the embodiment. Therefore, the same symbols are marked for the structures that are the same or substantially the same as those of the embodiment, and the detailed description of the structure is omitted. In addition, these variations are variations of the processing unit 10, and there is no special change from the embodiment otherwise, so the description is omitted.

[0066] Fig. 7A In the processing unit 10B of the variation shown in the figure, instead of the locking member 162 formed as an integral part in the above embodiment, a pair of locking members 164a and 164b corresponding to the notches 161d and 161e of the two arms 161a and 161b are provided to be freely raised and lowered. Figure 7B In the processing unit 10C of the illustrated variation, a pair of locking members 165a, 165b are driven to move forward and backward in the X direction by appropriate drive mechanisms 166a, 166b such as a motor, an air cylinder, or a solenoid.

[0067] In these configurations, through holes for inserting the locking member may be provided in the arms 161a and 161b instead of the notches 161d and 161e. As shown in these variations, various structures can be applied as the structure of the lock mechanism 16, and the same effects as those of the above-described embodiment can be obtained.

[0068] As described above, in the above embodiment, the substrate processing system 1, especially the processing unit 10, corresponds to the "substrate processing device" of the present invention. Moreover, the processing chamber 12 corresponds to the "processing container body" of the present invention, the cover member 13 corresponds to the "cover portion" of the present invention, and the support tray 15 corresponds to the "substrate holding portion" of the present invention. In addition, the support portion 14 and the advancing and retreating mechanism 53 function as a "moving portion" of the present invention.

[0069] In the locking mechanism 16, the arm member 161 (particularly the arms 161a and 161b) and the locking member 162 function as the "arm portion" and the "locking portion" of the present invention, respectively. In the above-described embodiment, the transfer unit 30 functions as the "transporting device" of the present invention, and the fan filter unit 40 functions as the "air supply device" of the present invention. In addition, the processing space SP is equivalent to the "internal space" of the present invention.

[0070] In addition, the present invention is not limited to the above-described embodiment, and various changes other than the above-described contents can be made within the scope of the gist thereof. For example, in the above-described embodiment, the substrate S is carried into the processing chamber 12 while being held in a horizontal posture for processing, but the posture of the substrate is not limited thereto. For example, the substrate can also be carried in or out with its main surface facing the horizontal direction.

[0071] In the locking mechanism 16 of the above-described embodiment, a pair of arms 161a and 161b are arranged horizontally across the gap space GS through which the substrate S passes when being carried in and out. However, the number and arrangement of the arms are not limited thereto. For example, one or more than three arms may be provided, and an arm extending below the gap space may be provided.

[0072] In addition, the locking mechanism 16 of the embodiment has the following structure: the cover member 13 is locked by engaging the notch portions 161d and 161e provided on the arms 161a and 161b with the rod-shaped locking member 162. However, as a locking mechanism, it is not limited to this, and various structures such as limiting displacement by mechanical engagement can be adopted. For example, the notch portions 161d and 161e provided on the arms 161a and 161b can also be formed on the mutually opposing surfaces of the two arms in a manner that the notch portions face each other, instead of being formed on the upper part of the arm as in the embodiment. In addition, the moving mechanism for embedding the rod-shaped locking member 162 into the notch portion can be arranged on the side of the processing chamber 12, and can also be arranged on the upper surface or the lower surface. In addition, the moving mechanism can also be arranged on the (+Y) side side of the processing chamber 12.

[0073] In addition, in the above-described embodiment, the displacement of the arm member 161 is limited by the locking member 162 abutting against the side surface of the processing chamber 12 opposite to the opening 121. However, it is also possible to use a structure in which the locking member is supported by a support mechanism separate from the processing chamber. In addition, in the above-described embodiment and the variation, the locking member is locked with the arm member by moving forward and backward, but it is also possible to use a structure in which, for example, the engagement state with the arm member and the release state thereof are switched by rotating or rotating.

[0074] In addition, in the above-mentioned embodiment, the cover member 13 and the arm member 161 move forward and backward in an integrated manner relative to the fixed processing chamber 12. However, the relative movement of the two can also be achieved by fixing the cover member and moving the processing chamber. However, in general, the weight of the processing chamber is much greater than that of the cover member, and various pipes are connected to it. From the above-mentioned aspect, it is considered more practical to fix the processing chamber and move the cover member.

[0075] Furthermore, the above-described embodiment is a substrate processing system for processing a substrate using a supercritical fluid, but the present invention is not limited thereto, and the present invention can also be applied to various processes performed on a substrate in a high-pressure processing container.

[0076] As described above with reference to the specific embodiments, in the substrate processing apparatus of the present invention, for example, the arm portion may be extended to the outside of the opening in a plan view. According to this structure, even if fine powder generated by friction falls from the arm portion, it can be prevented from entering the gap space.

[0077] In addition, for example, a pair of arms may be provided with a gap space therebetween, and the locking portion may be engaged with each of the pair of arms. For example, a single locking member may be engaged with both of the pair of arms. According to this configuration, the cover portion may be surely prevented from being pushed out due to the internal pressure of the internal space, and a torsional force may be prevented from acting on the arm portion.

[0078] In addition, for example, the arm portion may be mounted on the cover portion, and the moving portion may move the cover portion and the arm portion integrally. According to this structure, the cover portion may be securely locked by locking the arm portion.

[0079] In addition, for example, the opening may be provided on the side of the processing container body, the relative movement direction of the cover with respect to the processing container body may be in the horizontal direction, and the substrate may be carried into the internal space in a horizontal posture. In addition, for example, the following configuration may be adopted: a substrate holding portion for holding the substrate in a horizontal posture may be provided, the substrate holding portion may be mounted on the cover, and may be accommodated in the internal space together with the substrate. According to this configuration, by supporting the substrate in a horizontal posture, for example, a substrate having a liquid film formed on the upper surface may be received and processed.

[0080] In this case, the substrate holding part may be configured so that when the cover part is located at the separated position, the substrate holding part is located in the gap space. According to this configuration, a substrate can be placed on the substrate holding part located in the gap space, or a substrate can be taken out from the substrate holding part.

[0081] In addition, for example, the substrate processing apparatus of the present invention may also include a fluid supply unit for supplying a supercritical processing fluid to the internal space. The locking mechanism of the present invention is also applicable to situations where the internal space becomes high pressure, for example, it can also be applied to substrate processing using a supercritical processing fluid.

[0082] [Industrial Applicability]

[0083] The present invention is applicable to all substrate processing apparatuses that process substrates under high pressure, and can be preferably applied to substrate drying processing for drying a substrate such as a semiconductor substrate using a supercritical fluid.

[0084] [Explanation of Symbols]

[0085] 1 Substrate processing system

[0086] 10 Processing unit (substrate processing device)

[0087] 12 Processing chamber (processing container body)

[0088] 13 Cover part (cover)

[0089] 14 Support part (moving part)

[0090] 15 Support tray (substrate holding portion)

[0091] 16 Locking mechanism

[0092] 30 Transfer unit (conveying device)

[0093] 40 Fan filter unit (air supply device)

[0094] 53 Advance and retreat mechanism (moving part)

[0095] 57 Fluid supply unit

[0096] 121 Opening

[0097] 161 Arm part (arm)

[0098] 161a,161b Arm

[0099] 162 locking member (locking portion)

[0100] GS Gap Space

[0101] S Substrate

[0102] SP Processing space (internal space).

Claims

1. A substrate processing device comprising: A processing container body having an inner space and an opening, wherein the inner space can accommodate a substrate, and the opening is communicated with the inner space for allowing the substrate to pass through; a cover portion, capable of blocking the opening; A moving part, which moves the cover part relative to the opening, and uses the cover part to open and close the opening; as well as A locking mechanism locks the cover to the processing container body; and The moving part changes the relative position of the cover part with respect to the processing container body between a blocking position and a separation position, wherein: The blocking position is a position where the cover is close to the processing container body and blocks the opening. The separation position is a position where the cover is separated from the opening in a direction opposite to the inner space and with a gap space between the opening and the cover for allowing the substrate to pass through when being transported to the inner space. The locking mechanism has: an arm portion extending from one of the processing container body and the cover portion toward the other; and a stopper, which engages with the arm portion when the cover portion is located at the blocking position to limit the displacement of the arm portion; and The arm portion is mounted on the cover portion, and the moving portion moves the cover portion and the arm portion integrally. The opening is provided on the side of the processing container body, the relative movement direction of the cover portion with respect to the processing container body is a horizontal direction, and the substrate is moved into the internal space in a horizontal posture. When the cover is located at the separated position, the front end of the arm exceeds the gap space and extends to the other side. The portion of the arm portion with which the locking portion engages is a portion of the arm portion that is located beyond the gap space when the cover portion is located at the separated position. 2 . The substrate processing apparatus according to claim 1 , wherein the arm portion is extended outside the opening in a plan view. 3 . The substrate processing apparatus according to claim 2 , wherein a pair of the arm portions are provided across the gap space, and the locking portion is engaged with each of the pair of the arm portions. 4 . The substrate processing apparatus according to claim 3 , wherein in the locking portion, a single locking member is engaged with both of the pair of arm portions. 5 . The substrate processing apparatus according to claim 1 , wherein a substrate holding portion that holds the substrate in a horizontal posture is attached to the cover portion, and the substrate holding portion is accommodated in the internal space together with the substrate. 6 . The substrate processing apparatus according to claim 5 , wherein when the cover portion is located at the separated position, the substrate holding portion is located in the gap space. 7 . The substrate processing apparatus according to claim 1 , further comprising a fluid supply unit configured to supply a processing fluid in a supercritical state to the internal space.

8. A substrate processing system comprising: The substrate processing device according to any one of claims 1 to 4; a transport device for transporting the substrate to the gap space; and The air supply device supplies a downflow to the gap space from above the gap space.

Citation Information

Patent Citations

  • Substrate processing apparatus and substrate processing method

    JP2013033964A

  • Processing apparatus, processing method and storage medium

    JP2015039040A

  • Substrate processing apparatus

    JP2019067863A

  • KR20190003068A