Process Chamber of Semiconductor Process Equipment and Semiconductor Process Equipment

Abstract

The present invention provides a process chamber of a semiconductor process equipment and a semiconductor process equipment. In the process chamber, a carrier component for carrying a wafer is provided. A baffle ring assembly is provided on the carrier component. The baffle ring assembly and the carrier component cooperate to form a purge air duct capable of guiding gas to the edge of the wafer. The baffle ring assembly includes a first ring body, a second ring body and a buffer component. The first ring body is disposed around the carrier component, and there is a gap between the first ring body and the carrier component. A positioning groove is provided on the first ring body. A positioning portion is provided at the bottom of the second ring body. The positioning portion is detachably inserted into the positioning groove. The second ring body shields the gap to form a purge air duct. The buffer component is disposed between the opposite surfaces of the positioning portion and the positioning groove and is used for buffering the relative force between the positioning portion and the positioning groove. The technical solution provided by the present invention can avoid damage to the baffle ring assembly and improve the stability and safety of equipment use.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular, to a process chamber of a semiconductor process equipment and a semiconductor process equipment. Background Art

[0002] The tungsten plug (W-plug) process is a semiconductor process that fills metal tungsten into openings such as vias or trenches, and utilizes the good electrical conductivity and electromigration resistance characteristics of metal tungsten to achieve reliable electrical conduction between the front-end devices and the back-end metal. Currently, in the semiconductor industry, the blanket tungsten chemical vapor deposition (W-CVD) method is usually used for tungsten deposition. First, tungsten is deposited non-selectively on the surface of the wafer and in the openings, and then the tungsten deposited on the surface of the wafer is removed by chemical mechanical planarization (CMP), leaving only the tungsten deposited in the openings. Since the edge of the wafer has an arc chamfer (also called "beveling"), in order to avoid the tungsten deposited on the edge of the wafer not being completely removed by chemical mechanical polishing and affecting the subsequent processes, when performing the tungsten plug process, it is required that no tungsten be deposited within a width range of about 2 mm at the edge of the wafer, that is, a "bevel" should be left. The prior art usually forms a purge airway between a baffle ring assembly and a pedestal for carrying the wafer in the tungsten plug process, and uses the purge airway to divert gas to the edge of the wafer, blow air at the edge of the wafer, so that the process gas of the vapor deposition process cannot reach the edge of the wafer, and the process requirement of leaving a "bevel" on the wafer in the tungsten plug process is achieved.

[0003] An existing baffle ring assembly includes a first ring body and a second ring body. Among them, the first ring body surrounds the pedestal at an interval around the pedestal, and a positioning portion provided on the second ring body is inserted into a positioning groove of the first ring body. The second ring body is spaced from the pedestal and shields above the edge of the bearing surface for carrying the wafer. The gap between the inner peripheral wall of the first ring body and the outer peripheral wall of the pedestal, and the gap between the lower surface of the second ring body and the bearing surface together form a purge airway for guiding gas. In the tungsten plug process, the pedestal carries the wafer to a high position, and the first ring body and the second ring body are inserted. When the tungsten film in the process chamber accumulates to a certain thickness, it is necessary to use a remote plasma system (RPS) to clean the process chamber to remove the accumulated tungsten film. During the cleaning process, "high-position cleaning" is first performed, that is, the pedestal is raised to a high position, and the first ring body and the second ring body are inserted, aiming to efficiently remove the tungsten film on the inner surface of the process chamber. Then, "low-position cleaning" is performed, that is, the pedestal is lowered to a low position, and the second ring body is lapped on the step surface in the process chamber and separated from the first ring body, aiming to remove the tungsten film between the first ring body and the second ring body.

[0004] However, in the "high-position cleaning" stage, due to the bombardment of the first ring body and the second ring body by plasma, the temperatures of the first ring body and the second ring body increase sharply, resulting in the thermal expansion of the positioning part of the second ring body and the thermal contraction of the positioning groove of the first ring body, causing mutual extrusion pressure between the positioning part and the positioning groove. Therefore, when entering the "low-position cleaning" stage and during the process of the second ring body separating from the first ring body, the positioning part may be stuck in the positioning groove and broken off and drop with the first ring body and the base, resulting in the damage of the second ring body. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and provides a process chamber of a semiconductor process equipment and a semiconductor process equipment, which can avoid the damage of the baffle ring assembly, improve the use stability and safety of the process chamber, and can improve the stability and effect of the semiconductor process.

[0006] To achieve the purpose of the present invention, there is provided a process chamber of a semiconductor process equipment, in which a carrying component for carrying a wafer is arranged, a baffle ring assembly is arranged on the carrying component, and the baffle ring assembly and the carrying component cooperate to form a purge air duct capable of guiding gas to the edge of the wafer, wherein,

[0007] The baffle ring assembly includes a first ring body, a second ring body and a buffer component. The first ring body is arranged around the carrying component, and there is a gap between the first ring body and the carrying component. A positioning groove is arranged on the first ring body. A positioning part is arranged at the bottom of the second ring body. The positioning part and the positioning groove are detachably inserted. The second ring body blocks the gap to form the purge air duct. The buffer component is arranged between the opposite surfaces of the positioning part and the positioning groove for buffering the relative acting force between the positioning part and the positioning groove.

[0008] Optionally, the buffer component includes a first buffer member, and the first buffer member is arranged between the outer peripheral wall of the positioning part and the inner peripheral wall of the positioning groove.

[0009] Optionally, the number of the first buffer members is multiple, and the multiple first buffer members are spaced along the circumferential direction of the positioning part.

[0010] Optionally, the number of the first buffer members is an even number, and the multiple first buffer members are arranged in pairs opposite to each other.

[0011] Optionally, the radial dimensions of the positioning part and the positioning groove both gradually decrease from top to bottom. The multiple first buffer members are all arranged in the positioning groove, and the distance between two relatively arranged first buffer members gradually decreases from top to bottom;

[0012] The radial dimension of the top end of the positioning portion is greater than the first preset dimension, which is the distance between the top ends of two relatively arranged first buffer members. The radial dimension of the bottom end of the positioning portion is greater than the second preset dimension, which is the distance between the bottom ends of two relatively arranged first buffer members, and is less than the distance between the top ends of two relatively arranged first buffer members.

[0013] The dimension of the first buffer member in the radial direction of the positioning groove is greater than the larger one of the first preset dimension and the second preset dimension.

[0014] Optionally, the value ranges of the first preset dimension and the second preset dimension are the same, both greater than 0 mm and less than or equal to 2 mm.

[0015] Optionally, the buffer member further includes a second buffer member, and the second buffer member is arranged between the bottom surface of the positioning portion and the bottom surface of the positioning groove.

[0016] Optionally, both the first buffer member and the second buffer member include compression springs.

[0017] Optionally, the buffer member is bonded to the inner wall of the positioning groove.

[0018] The present invention further provides a semiconductor processing apparatus, including the process chamber provided by the present invention.

[0019] The present invention has the following beneficial effects:

[0020] The process chamber of the semiconductor process equipment provided by the present invention is provided with a buffer component between the surfaces of the positioning part and the positioning groove that face each other. When the positioning part expands due to heat and / or the positioning groove contracts due to heat, resulting in a relative extrusion force between the positioning part and the positioning groove, the buffer component can buffer the relative force between the positioning part and the positioning groove, avoiding the situation where the positioning part is stuck in the positioning groove due to the relative extrusion force between the positioning part and the positioning groove. To avoid the situation where the positioning part breaks in the positioning groove when the first ring body and the second ring body are separated, thereby avoiding damage to the retaining ring assembly and improving the use stability and safety of the process chamber. Moreover, if only by increasing the tolerance between the positioning part and the positioning groove to avoid the situation where the positioning part is stuck in the positioning groove, it will cause relative movement between the first ring body and the second ring body in the semiconductor process, resulting in a change in the purge air passage formed by the cooperation between the retaining ring assembly and the bearing component, affecting the semiconductor process result. However, for the process chamber of the semiconductor process equipment provided by the present invention, the buffer component buffers the relative force between the positioning part and the positioning groove, which can not only avoid the situation where the positioning part is stuck in the positioning groove, but also enable the positioning part and the positioning groove to be tightly inserted, so as to reduce the relative movement distance between the first ring body and the second ring body in the semiconductor process and reduce the degree of change in the purge air passage formed by the cooperation between the retaining ring assembly and the bearing component, thereby improving the use stability of the process chamber and being able to improve the stability and effect of the semiconductor process.

[0021] The semiconductor process equipment provided by the present invention, with the aid of the process chamber of the semiconductor process equipment provided by the present invention, can avoid damage to the retaining ring assembly, improve the use stability and safety of the process chamber, and can improve the stability and effect of the semiconductor process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic structural diagram of the process chamber of the semiconductor process equipment provided by the embodiment of the present invention and the semiconductor process equipment in the "high-level cleaning" state;

[0023] Figure 2 It is a schematic structural diagram of the process chamber of the semiconductor process equipment provided by the embodiment of the present invention and the semiconductor process equipment in the "low-level cleaning" state;

[0024] Figure 3 It is a schematic structural diagram of the positioning part and the positioning groove of the process chamber of the semiconductor process equipment provided by the embodiment of the present invention when they are inserted;

[0025] Figure 4 It is a schematic structural diagram of the positioning part and the positioning groove of the process chamber of the semiconductor process equipment provided by the embodiment of the present invention when they are separated;

[0026] Figure 5Schematic top view structure of the elastic component in the positioning groove of the process chamber of the semiconductor process equipment provided by the embodiment of the present invention;

[0027] Explanation of reference numerals:

[0028] 1 - retaining ring assembly; 11 - first ring body; 111 - positioning groove; 12 - second ring body; 121 - positioning portion; 13 - buffer component; 131 - first buffer member; 132 - second buffer member; 2 - purge air duct; 31 - top cover; 32 - upper ring body; 33 - lower ring body; 34 - support structure; 35 - exhaust port; 4 - carrier component; 41 - support convex portion; 42 - carrying surface. Detailed implementation manners

[0029] To enable those skilled in the art to better understand the technical solution of the present invention, the process chamber of the semiconductor process equipment and the semiconductor process equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0030] As Figure 1 - Figure 2 shown, this embodiment provides a process chamber of a semiconductor process equipment. A carrier component 4 for carrying a wafer is provided in the process chamber. A retaining ring assembly 1 is provided on the carrier component 4. The retaining ring assembly 1 and the carrier component 4 cooperate to form a purge air duct 2 capable of guiding gas to the edge of the wafer. Among them, the retaining ring assembly 1 includes a first ring body 11, a second ring body 12 and a buffer component 13. The first ring body 11 is arranged around the carrier component 4, and there is a gap between the first ring body 11 and the carrier component 4. A positioning groove 111 is provided on the first ring body 11. A positioning portion 121 is provided at the bottom of the second ring body 12. The positioning portion 121 is detachably inserted into the positioning groove 111. The second ring body 12 blocks the above-mentioned gap to form the purge air duct 2. The buffer component 13 is arranged between the opposite surfaces of the positioning portion 121 and the positioning groove 111 for buffering the relative acting force between the positioning portion 121 and the positioning groove 111.

[0031] The process chamber of the semiconductor process equipment provided by the embodiment of the present invention is provided with a buffer member 13 between the surfaces of the positioning portion 121 opposite to the positioning groove 111. When the positioning portion 121 expands due to heat and / or the positioning groove 111 contracts due to heat, resulting in a relative extrusion force between the positioning portion 121 and the positioning groove 111, the buffer member 13 can buffer the relative force between the positioning portion 121 and the positioning groove 111, avoiding the situation that the positioning portion 121 is stuck in the positioning groove 111 due to the relative extrusion force between the positioning portion 121 and the positioning groove 111. To avoid the situation that the positioning portion 121 breaks in the positioning groove 111 when the first ring body 11 is separated from the second ring body 12, thereby avoiding the damage of the retaining ring assembly 1 and improving the use stability and safety of the process chamber. Moreover, if only by increasing the tolerance between the positioning portion 121 and the positioning groove 111 to avoid the situation that the positioning portion 121 is stuck in the positioning groove 111, it will cause relative movement between the first ring body 11 and the second ring body 12 in the semiconductor process, resulting in a change in the purge air passage 2 formed by the cooperation between the retaining ring assembly 1 and the carrier member 4, affecting the semiconductor process result. However, for the process chamber of the semiconductor process equipment provided by the embodiment of the present invention, the buffer member 13 buffers the relative force between the positioning portion 121 and the positioning groove 111, which can not only avoid the situation that the positioning portion 121 is stuck in the positioning groove 111, but also enable a tight insertion between the positioning portion 121 and the positioning groove 111, so as to reduce the relative movement distance between the first ring body 11 and the second ring body 12 in the semiconductor process and reduce the degree of change in the purge air passage 2 formed by the cooperation between the retaining ring assembly 1 and the carrier member 4, thereby improving the use stability of the process chamber and being able to improve the stability and effect of the semiconductor process.

[0032] Such as Figure 1As shown, when performing semiconductor processes such as tungsten plug processes, the carrier member 4 for carrying the wafer ascends to a high position. At this time, the first ring body 11 surrounds the carrier member 4 and has a gap therebetween. The positioning portion 121 at the bottom of the second ring body 12 is inserted into the positioning groove 111 of the first ring body 11 to position the relative positions of the first ring body 11 and the second ring body 12 by means of the positioning portion 121 and the positioning groove 111. The second ring body 12 blocks the gap between the first ring body 11 and the carrier member 4 and simultaneously blocks the edge region of the upper surface of the carrier member 4. The buffer member 13 is located between the opposing surfaces of the positioning portion 121 and the positioning groove 111. The gap between the inner peripheral wall of the first ring body 11 and the outer peripheral wall of the carrier member 4, and the gap between the annular lower surface of the second ring body 12 and the edge region of the upper surface of the carrier member 4 together form a purge airway 2 that can divert gas to the edge of the wafer. The gas first rises in the purge airway 2 along the gap between the inner peripheral wall of the first ring body 11 and the outer peripheral wall of the carrier member 4 to the annular lower surface of the second ring body 12. Blocked by the annular lower surface of the second ring body 12, the gas then flows along the gap between the annular lower surface of the second ring body 12 and the edge region of the upper surface of the carrier member 4 to the edge of the upper surface of the carrier member 4, so that it can flow to the edge of the wafer carried on the carrier member 4, preventing process gas in semiconductor processes such as tungsten plug processes from reaching the annular edge of the wafer and avoiding the deposition of a thin layer on the arc chamfer (also known as "crimping") of the annular edge of the wafer.

[0033] As Figure 1 shown, when the deposited film layer such as a tungsten film in the process chamber of a semiconductor process such as a tungsten plug process accumulates to a certain thickness and it is necessary to clean the process chamber using a remote plasma system to remove the accumulated deposited film layer, first, "high-position cleaning" is performed, that is, the carrier member 4 ascends to a high position. At this time, the first ring body 11 surrounds the carrier member 4 and has a gap therebetween. The positioning portion 121 at the bottom of the second ring body 12 is inserted into the positioning groove 111 of the first ring body 11. The second ring body 12 blocks above the gap between the first ring body 11 and the carrier member 4. The buffer member 13 is located between the opposing surfaces of the positioning portion 121 and the positioning groove 111. The purpose of "high-position cleaning" is to efficiently remove the deposited film layer on the inner surface of the process chamber. As Figure 2 shown, after "high-position cleaning", "low-position cleaning" is performed, that is, the carrier member 4 descends to a low position. During the descent of the carrier member 4, the second ring body 12 will overlap with the support structure 34 provided in the process chamber, and the first ring body 11 will descend with the carrier member 4, which separates the first ring body 11 from the second ring body 12. The purpose of "low-position cleaning" is to remove the deposited film layer between the first ring body 11 and the second ring body 12.

[0034] As Figure 1 andFigure 2 As shown, in a preferred embodiment of the present invention, the process chamber may include a top cover 31, an upper ring body 32, a lower ring body 33, and a bottom plate (not shown in the figure). Among them, the lower ring body 33 is disposed on the bottom plate, the upper ring body 32 is disposed on the lower ring body 33, the top cover 31 is disposed on the upper ring body 32, and an exhaust port 35 for discharging process gas is formed on the lower ring body 33. The lower ring body 33 protrudes toward the interior of the process chamber relative to the upper ring body 32, and the portion of the lower ring body 33 that protrudes toward the interior of the process chamber relative to the upper ring body 32 forms a support structure 34 that can support the second ring body 12. The carrier member 4 is disposed on the bottom plate in a liftable manner. However, the structure of the process chamber is not limited thereto, and the formation manner of the support structure 34 is not limited thereto either. For example, a support structure 34 that can support the second ring body 12 may be separately disposed on the upper ring body 32, the lower ring body 33, or inside the process chamber.

[0035] As Figure 1 and Figure 2 shown, in a preferred embodiment of the present invention, support protrusions 41 may be provided around the carrier member 4, and the upper surface of the support protrusions 41 is lower than the carrier surface 42 of the carrier member 4 for carrying the wafer. The first ring body 11 may be disposed on the support protrusions 41 so that the retaining ring assembly 1 can be disposed on the carrier member 4.

[0036] Optionally, the carrier member 4 may include a base.

[0037] Optionally, the gas flowing to the edge of the wafer may include an inert gas.

[0038] As Figure 5 shown, in a preferred embodiment of the present invention, the radial cross-section of the positioning groove 111 may be circular, the radial cross-section of the positioning portion 121 may be circular, a plurality of positioning grooves 111 may be provided on the first ring body 11, and the plurality of positioning grooves 111 are spaced apart along the circumferential direction of the first ring body 11. A plurality of positioning portions 121 may be provided at the bottom of the second ring body 12, and the plurality of positioning portions 121 are spaced apart along the circumferential direction of the second ring body 12. The plurality of positioning portions 121 and the plurality of positioning grooves 111 are detachably inserted in one-to-one correspondence to position the relative positions between the first ring body 11 and the second ring body 12 by means of the plurality of positioning portions 121. However, the shape of the radial cross-section of the positioning groove 111, the shape of the radial cross-section of the positioning portion 121, the number of the positioning portions 121, and the number of the positioning grooves 111 are not limited thereto. For example, the radial cross-section of the positioning groove 111 may also be elliptical, the radial cross-section of the positioning portion 121 may also be elliptical, one positioning groove 111 may be provided on the first ring body 11, and one positioning portion 121 may be provided at the bottom of the second ring body 12.

[0039] As Figure 3 , Figure 4 ,Figure 5 As shown, in a preferred embodiment of the present invention, the buffer member 13 may include a first buffer member 131, and the first buffer member 131 is disposed between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111.

[0040] By means of the first buffer member 131, when the positioning portion 121 expands due to heat and / or the positioning groove 111 contracts due to heat, resulting in a relative extrusion force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111, the relative force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111 can be buffered, avoiding the situation where the positioning portion 121 is stuck in the positioning groove 111 due to the relative extrusion force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111. Thus, when the first ring body 11 is separated from the second ring body 12, the situation where the positioning portion 121 breaks in the positioning groove 111 is avoided, and further damage to the retaining ring assembly 1 is avoided, improving the use stability and safety of the process chamber.

[0041] As Figure 5 shown, in a preferred embodiment of the present invention, the number of the first buffer members 131 is four, and the four first buffer members 131 are circumferentially spaced apart along the positioning portion 121. However, the number of the first buffer members 131 is not limited thereto. For example, the number of the first buffer members 131 may also be two, three or more, and the multiple first buffer members 131 are circumferentially spaced apart along the positioning portion 121. Such a design can increase the number of positions where the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111 can be buffered by the first buffer member 131, thereby further avoiding the situation where the positioning portion 121 is stuck in the positioning groove 111 due to the relative extrusion force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111, further avoiding damage to the retaining ring assembly 1, improving the use stability and safety of the process chamber, and improving the stability and effect of the semiconductor process.

[0042] Optionally, the multiple first buffer members 131 are evenly circumferentially spaced apart along the positioning portion 121. This can improve the uniformity of the buffering of the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111 by the first buffer member 131, thereby further avoiding the situation where the positioning portion 121 is stuck in the positioning groove 111 due to the relative extrusion force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111, further avoiding damage to the retaining ring assembly 1, improving the use stability and safety of the process chamber, and improving the stability and effect of the semiconductor process.

[0043] In a preferred embodiment of the present invention, the number of the first buffer members 131 may be an even number, and the multiple first buffer members 131 may be arranged in pairs. As Figure 5As shown, taking the number of the first buffer members 131 as four as an example for illustration, two of the four first buffer members 131 are arranged oppositely, and the other two of the four first buffer members 131 are arranged oppositely. However, the number of the first buffer members 131 is not limited thereto. For example, the number of the first buffer members 131 may also be six. Two of the six first buffer members 131 are arranged oppositely, another two of the six first buffer members 131 are arranged oppositely, and still another two of the six first buffer members 131 are arranged oppositely.

[0044] By making the number of the first buffer members 131 an even number and arranging the multiple first buffer members 131 in pairs oppositely, when the positioning portion 121 expands due to heat and / or the positioning groove 111 contracts due to heat, resulting in a relative extrusion force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111, with the aid of the two oppositely arranged first buffer members 131, the relative acting force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111 can be buffered simultaneously from the opposite sides of the positioning portion 121, thereby improving the ability to buffer the relative acting force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111, further avoiding the situation that the positioning portion 121 is stuck in the positioning groove 111 due to the relative extrusion force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111, further avoiding the damage of the retaining ring assembly 1, improving the use stability and safety of the process chamber, and being able to improve the stability and effect of the semiconductor process.

[0045] As Figure 3 - Figure 5 shown, in a preferred embodiment of the present invention, the radial dimensions of the positioning portion 121 and the positioning groove 111 may both gradually decrease from top to bottom. The multiple first buffer members 131 may all be arranged in the positioning groove 111, and the distance between the two oppositely arranged first buffer members 131 gradually decreases from top to bottom; the radial dimension of the top end of the positioning portion 121 is greater than a first preset dimension of the distance between the top ends of the two oppositely arranged first buffer members 131, the radial dimension of the bottom end of the positioning portion 121 is greater than a second preset dimension of the distance between the bottom ends of the two oppositely arranged first buffer members 131 and less than the distance between the top ends of the two oppositely arranged first buffer members 131; the dimension of the first buffer member 131 in the radial direction of the positioning groove 111 is greater than the larger one of the first preset dimension and the second preset dimension.

[0046] As Figure 4As shown, taking the radial dimension at the top of the positioning portion 121 as a, the radial dimension at the bottom as b, the distance between the tops of two relatively arranged first buffer members 131 as d, the distance between the bottoms as e, and the dimension of the first buffer member 131 in the radial direction of the positioning groove 111 as c as an example, the radial dimension at the top of the positioning portion 121 is greater than the first preset dimension of the distance between the tops of two relatively arranged first buffer members 131, that is, dimension a = distance d + first preset dimension. The radial dimension at the bottom of the positioning portion 121 is greater than the second preset dimension of the distance between the bottoms of two relatively arranged first buffer members 131 and less than the distance between the tops of two relatively arranged first buffer members 131, that is, dimension b = distance e + second preset dimension. The dimension of the first buffer member 131 in the radial direction of the positioning groove 111 is greater than the larger one of the first preset dimension and the second preset dimension, that is, dimension c is greater than the larger one of the first preset dimension and the second preset dimension.

[0047] Since the dimension of the first buffer member 131 in the radial direction of the positioning groove 111 is greater than the larger one of the first preset dimension and the second preset dimension, such a design can, when the positioning portion 121 is inserted into the positioning groove 111, make the first buffer member 131 provided between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111 always receive the relative extrusion force between the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111, so that the first buffer member 131 is always in a compressed state, thereby generating a relative reaction force on the outer peripheral wall of the positioning portion 121 and the inner peripheral wall of the positioning groove 111 by means of the first buffer member 131, avoiding the positioning portion 121 from moving relative to the positioning groove 111 in the positioning groove 111, thereby improving the use stability of the retaining ring assembly 1, further improving the use stability of the process chamber, and being able to improve the stability and effect of the semiconductor process.

[0048] In a preferred embodiment of the present invention, the value ranges of the first preset dimension and the second preset dimension can be the same, and can both be greater than 0 mm and less than or equal to 2 mm.

[0049] Optionally, the first preset dimension and the second preset dimension can both be 1 mm. At this time, dimension a = distance d + 1 mm, dimension b = distance e + 1 mm, and dimension c is greater than 1 mm.

[0050] As Figure 3 and Figure 4 shown, in a preferred embodiment of the present invention, the buffer member 13 may further include a second buffer member 132, and the second buffer member 132 is provided between the bottom surface of the positioning portion 121 and the bottom surface of the positioning groove 111.

[0051] With the help of the second buffer member 132, when the positioning portion 121 expands due to heat and / or the positioning groove 111 contracts due to heat, resulting in a relative squeezing force between the bottom surface of the positioning portion 121 and the bottom surface of the positioning groove 111, the relative force between the bottom surface of the positioning portion 121 and the bottom of the positioning groove 111 can be buffered, avoiding the situation where the positioning portion 121 is stuck in the positioning groove 111 due to the relative squeezing force between the bottom of the positioning portion 121 and the bottom surface of the positioning groove 111. Thus, when the first ring body 11 is separated from the second ring body 12, the situation where the positioning portion 121 breaks in the positioning groove 111 can be avoided, and further, the damage of the retaining ring assembly 1 can be avoided, improving the use stability and safety of the process chamber.

[0052] In a preferred embodiment of the present invention, both the first buffer member 131 and the second buffer member 132 may include compression springs.

[0053] In a preferred embodiment of the present invention, the buffer member 13 may be bonded to the inner wall of the positioning groove 111. For example, the manufacturing material of the first ring body 11 may include ceramics, and the buffer member 13 may be bonded to the inner wall of the positioning groove 111 through ceramic glue.

[0054] As Figure 1 and Figure 2 shown, as another technical solution, an embodiment of the present invention further provides a semiconductor process equipment, including the process chamber provided by the embodiment of the present invention.

[0055] The semiconductor process equipment provided by the embodiment of the present invention, with the help of the process chamber of the semiconductor process equipment provided by the embodiment of the present invention, can avoid the damage of the retaining ring assembly 1, improve the use stability and safety of the process chamber, and can improve the stability and effect of the semiconductor process.

[0056] In summary, the process chamber and the semiconductor process equipment of the semiconductor process equipment provided by the embodiment of the present invention can avoid the damage of the retaining ring assembly 1, improve the use stability and safety of the process chamber, and can improve the stability and effect of the semiconductor process.

[0057] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present invention, and the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. A process chamber of a semiconductor process equipment, characterized in that, A carrier component for carrying a wafer is disposed in the process chamber. A baffle ring assembly is disposed on the carrier component. The baffle ring assembly and the carrier component cooperate to form a purge air passage capable of guiding gas to the edge of the wafer. Among them, the baffle ring assembly includes a first ring body, a second ring body and a buffer component. The first ring body is disposed around the carrier component, and there is a gap between the first ring body and the carrier component. A positioning groove is disposed on the first ring body. A positioning portion is disposed at the bottom of the second ring body. The positioning portion is detachably inserted into the positioning groove. The second ring body shields the gap to form the purge air passage. The buffer component is disposed between the surfaces of the positioning portion and the positioning groove facing each other, and is used to buffer the relative force between the positioning portion and the positioning groove to prevent the positioning portion from being stuck in the positioning groove due to the relative extrusion force between the positioning portion and the positioning groove.

2. The process chamber of the semiconductor process equipment according to claim 1, wherein The buffer component includes a first buffer member, and the first buffer member is disposed between the outer peripheral wall of the positioning portion and the inner peripheral wall of the positioning groove.

3. The process chamber of the semiconductor process equipment according to claim 2, characterized in that, The number of the first buffer members is multiple, and the multiple first buffer members are spaced apart along the circumferential direction of the positioning portion.

4. The process chamber of the semiconductor process equipment according to claim 3, characterized in that, The number of the first buffer members is an even number, and the multiple first buffer members are arranged in pairs.

5. The process chamber of the semiconductor process equipment according to claim 4, characterized in that, The radial dimensions of the positioning portion and the positioning groove both gradually decrease from top to bottom. The multiple first buffer members are all disposed in the positioning groove, and the distance between two relatively arranged first buffer members gradually decreases from top to bottom; the radial dimension of the top end of the positioning portion is greater than the first preset dimension of the distance between the top ends of two relatively arranged first buffer members. The radial dimension of the bottom end of the positioning portion is greater than the second preset dimension of the distance between the bottom ends of two relatively arranged first buffer members and less than the distance between the top ends of two relatively arranged first buffer members; the dimension of the first buffer member in the radial direction of the positioning groove is greater than the larger one of the first preset dimension and the second preset dimension.

6. The process chamber of the semiconductor process equipment according to claim 5, wherein, The value ranges of the first preset dimension and the second preset dimension are the same, both greater than 0 mm and less than or equal to 2 mm.

7. The process chamber of the semiconductor process equipment according to any one of claims 2-6, characterized in that, The buffer component further includes a second buffer member, and the second buffer member is disposed between the bottom surface of the positioning portion and the bottom surface of the positioning groove.

8. The process chamber of the semiconductor process equipment according to claim 7, wherein Both the first buffer member and the second buffer member include compression springs.

9. The process chamber of the semiconductor process equipment according to any one of claims 1-6, characterized in that, The buffer component is bonded to the inner wall of the positioning groove.

10. A semiconductor process equipment, characterized in that, A process chamber comprising any one of claims 1-9.

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