A circuit board assembly, camera module and electronic device

Abstract

The application relates to the technical field of imaging devices, and discloses a circuit board assembly, a camera module and electronic equipment, the circuit board assembly comprising: a first circuit board, a second circuit board and a plurality of flexible connecting belts; the first circuit board has opposite first and second surfaces; the second circuit board has opposite third and fourth surfaces and an outer circumferential surface connecting the third and fourth surfaces, the third surface has the same orientation as the first surface, the fourth surface has the same orientation as the second surface, and the third and fourth surfaces are both rectangular so as to be adapted to the shape of an image sensor; a reference surface is a plane where the first surface is located; the flexible connecting belt is a flexible circuit board and has at least one bending structure, has a certain redundancy, can reduce deformation resistance, and the first end of the flexible connecting belt is connected to the first circuit board through an ACF process or an integrated connection, and the second end is connected to the second circuit board through an ACF process or an integrated connection.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of imaging devices, in particular to a circuit board assembly, a camera module and an electronic device. BACKGROUND

[0002] The camera module generally includes a lens and an image sensor, the lens is located on the imaging surface side of the image sensor, the light entering from the lens reaches the imaging surface of the image sensor, and imaging is formed on the imaging surface.

[0003] The image sensor is mounted on a movable circuit board, and the movable circuit board moves transversely (perpendicular to the direction of the optical axis) relative to a fixed circuit board to achieve the effect of chip anti-shake. The movable circuit board and the fixed circuit board are connected through a flexible board, in order to ensure sufficient wire width, at present, the width of the flexible board is designed to be relatively large, which will bring certain resistance when the movable circuit board moves transversely, which is not conducive to improving the response speed of the module and reducing the overall transverse size. How to reduce the resistance of the movable circuit board and realize the miniaturization of the module under the premise of maintaining electrical connection has become a problem to be solved at present. SUMMARY

[0004] The present application discloses a circuit board assembly, a camera module and an electronic device, which are used to reduce the resistance of the second circuit board when moving transversely without increasing the transverse size.

[0005] In order to achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] In a first aspect, a circuit board assembly is provided, comprising: a first circuit board, a second circuit board, and a plurality of flexible connection strips; the first circuit board has opposite first and second surfaces; the second circuit board has opposite third and fourth surfaces, and a peripheral surface connecting the third and fourth surfaces, the third surface has the same orientation as the first surface, the fourth surface has the same orientation as the second surface, the third and fourth surfaces are both rectangular, first, when the circuit board assembly is assembled with an image sensor, it is convenient to adapt to the shape of the image sensor, second, when the second circuit board is formed in a cutting mode, only the mother board needs to be cut along the trajectories of two perpendicular directions, which is advantageous for reducing the cutting difficulty compared with cutting along a curved or irregular trajectory, third, when the second circuit board is cut, the utilization rate of the mother board is high, and less scrap is generated; and the third surface is provided with an electrical connection structure for fixing and electrically connecting with the image sensor, so as to fix and electrically connect the image sensor to the third surface through the electrical connection structure; the second circuit board is located within the outer contour of the first circuit board on the reference surface, so as to avoid the second circuit board occupying additional space in the direction parallel to the reference surface, and reduce the size of the circuit board assembly in the direction perpendicular to the optical axis, wherein the reference surface is the plane in which the first surface is located; the flexible connection strip is a flexible circuit board and has at least one bending structure, and the first end of the flexible connection strip is connected to the first circuit board by anisotropic conductive adhesive film process or integral connection, and the second end is connected to the second circuit board by anisotropic conductive adhesive film process or integral connection, so as to achieve flexible connection and electrical connection between the first circuit board and the second circuit board, wherein the flexible connection strip is in the form of a strip, when the second circuit board moves laterally relative to the first circuit board, the flexible connection strip only needs to overcome a small material stress when deformed, and because the flexible connection strip has a bending structure, a certain redundancy is generated, which can increase the overall length of the flexible connection strip without increasing the lateral size, reduce the deformation amount per unit size, and further reduce the resistance when the flexible connection strip is deformed; when the flexible connection strip is selected as a flexible circuit board, the flexible circuit board functions to flexibly connect and electrically connect the first circuit board and the second circuit board, and has substantially no elasticity, when the size of the image sensor changes, for example, increases, the size of the second circuit board can be directly increased, and even if the size of the flexible circuit board is reduced accordingly, it will not substantially affect the elastic restoring force of the second circuit board, therefore, the overall size of the circuit board assembly can be substantially maintained, even if it is integrated with the size of the optical anti-shake motor, the size of the optical anti-shake motor can also be substantially maintained, so that the size change of the image sensor does not easily cause the size change of other components, and the adaptation is more flexible.

[0007] The flexible connecting band can be connected to the first circuit board and the second circuit board in various ways. In a specific embodiment, the first circuit board has a first hollow part in the middle; the outer circumferential surface of the second circuit board is at least partially arranged opposite to the inner circumferential surface of the first hollow part in the direction parallel to the reference surface, and there is an annular gap between the orthographic projection of the first circuit board and the second circuit board on the reference surface; by hiding the second circuit board at least partially in the first hollow part, the space occupied by the circuit board assembly in the direction perpendicular to the reference surface can be reduced.

[0008] In a specific embodiment, the first hollow part is rectangular to match the shape of the second circuit board, improve the space utilization of the first hollow part, and only need to be cut along two mutually perpendicular straight lines when processing the first hollow part, reducing the cutting difficulty; the inner circumferential surface of the first hollow part has a first sub-side surface corresponding to each side of the first surface; the first end of the flexible connecting band is connected to one of the first sub-side surfaces, so that the stress on the flexible connecting band is distributed in two directions parallel to the reference surface and perpendicular to each other.

[0009] In a specific embodiment, the first end of each flexible connecting band is formed with a first corner structure bent from the extension direction of the flexible connecting band to the first circuit board, to facilitate flexible arrangement of the connection position of the first end of the flexible connecting band and the first sub-side surface.

[0010] In a specific embodiment, the orthographic projection of each flexible connecting band on the reference surface is located in the annular gap; the second end of each flexible connecting band is connected to the outer circumferential surface to reduce the space occupied by the flexible connecting band in the direction perpendicular to the reference surface.

[0011] In a more specific embodiment, the outer circumferential surface has a second sub-side surface corresponding to each side of the first surface; each of the two opposite second sub-side surfaces is connected to at least two flexible connecting bands to increase the number of lines out of the two opposite second sub-side surfaces, thereby increasing the bonding strength of the second sub-side surface and the flexible connecting band; and the two second sub-side surfaces with increased number of lines are opposite, which can improve the stress balance of the second circuit board.

[0012] In the two opposite second sub-side surfaces, the flexible connecting bands connected to the two second sub-side surfaces are symmetric about the symmetry axis of the two second sub-side surfaces, so that the second circuit board can be further balanced in stress.

[0013] In one specific implementation, the second end of each of the flexible connecting bands is formed with a second corner structure bent from the extending direction of the flexible connecting band towards the second circuit board, so as to flexibly set the connection position of the second end of the flexible connecting band and the second sub-side.

[0014] Optionally, along the normal direction of the reference plane, the second surface is located on the side of the fourth surface away from the third surface; along the normal direction of the reference plane, the flexible connecting band is located on the side of the fourth surface away from the third surface, the orthogonal projection of the plurality of bending structures of each of the flexible connecting bands on the reference plane at least partially overlaps the orthogonal projection of the fourth surface on the reference plane, and the first end is connected to the inner circumferential surface surrounding the first hollow part and the second end is connected to the fourth surface, so as to increase the size of the second circuit board without changing the overall size of the circuit board assembly, and facilitate the setting of a larger size image sensor.

[0015] Optionally, along the normal direction of the reference plane, the thickness of the flexible connecting band is less than the thickness of the first circuit board, the flexible connecting band is located between the second surface and the fourth surface, and does not additionally occupy additional space in the normal direction of the reference plane; and the first end is connected to the inner circumferential surface, and the minimum distance from the first end to the second surface is less than the minimum distance from the first end to the first surface, so as to reserve a wider size between the first end and the first surface on the inner circumferential surface to be arranged opposite to the outer circumferential surface of the first hollow part, which is beneficial to reduce the thickness of the circuit board assembly, and ensures the flexibility.

[0016] Optionally, the third surface is higher than the first surface; along the normal direction of the reference plane, the flexible connecting band is located on the side of the first surface away from the second surface, the second end of each of the flexible connecting bands is connected to the outer circumferential surface, and the orthogonal projection of the plurality of bending structures of the flexible connecting band on the reference plane at least partially overlaps the first surface and is connected to the first surface through the first end. So as to increase the size of the second circuit board without changing the overall size of the circuit board assembly, and facilitate the setting of a larger size image sensor.

[0017] Optionally, along the normal direction of the reference surface, the thickness of the flexible connecting band is less than the thickness of the second circuit board, and the flexible connecting band is between the first surface and the third surface without occupying additional space in the normal direction of the reference surface; and the second end is connected to the outer peripheral surface, and the minimum distance from the second end to the third surface is less than the minimum distance from the second end to the fourth surface. In order to reserve a wider size between the second end and the fourth surface on the outer peripheral surface to be arranged opposite to the inner peripheral surface of the first hollow part, which is conducive to reducing the thickness of the circuit board assembly, and ensuring the flexibility of the flexible connecting band.

[0018] Optionally, the plane where the first surface is located is arranged opposite to the plane where the fourth surface is located; the first end of each flexible connecting band is connected to the first surface, the second end is connected to the fourth surface, and the orthogonal projection of the plurality of bending structures of the flexible connecting band on the reference surface at least partially overlaps the orthogonal projection of the fourth surface on the reference surface. The first circuit board can be avoided to be opened, the structural stability of the first circuit board is improved, the process difficulty is reduced, and the second circuit board directly plays a sealing role, so that the reinforcing plate on the second surface side of the first circuit board can be omitted.

[0019] Optionally, a second hollow part extending along the extension direction of the flexible connecting band is arranged in the middle of each flexible connecting band, so that the width of the flexible connecting band in the direction parallel to the reference surface is reduced, the flexibility of the flexible connecting band is improved, and the resistance required to be overcome when the flexible connecting band is deformed is reduced.

[0020] In a specific implementation, each flexible connecting band extends in a direction parallel to the reference surface, so that more wires can be arranged on the surface of the flexible connecting band parallel to the reference surface, and the wires are not prone to breakage due to twisting compared to wires arranged on a surface perpendicular to the reference surface.

[0021] In a specific implementation, each flexible connecting band spirally extends around the central axis of the second circuit board, the central axis is perpendicular to the third surface and passes through the geometric center of the third surface; and the projection of each flexible connecting band in the width direction overlaps the projection of another flexible connecting band in the width direction, wherein the width direction refers to a direction parallel to the reference surface and perpendicular to the extension direction of the flexible connecting band. This is conducive to increasing the length of the flexible connecting band, thereby reducing the deformation amount of each cross section when the flexible connecting band is deformed, and thus reducing the resistance when the flexible connecting band is deformed.

[0022] In one specific implementation, the first end and the second end of each of the flexible connection bands respectively form an angle between 90° and 180° with a line connecting the center axis, wherein the line is parallel to the reference surface. This ensures that two adjacent flexible connection bands can overlap in the width direction, and do not overlap with the third flexible connection band in the width direction, thereby avoiding excessive increase in the size of the camera flexible connection band in the direction of the reference surface.

[0023] In a second aspect, a camera module is provided, which includes a lens, an image sensor, a driving assembly, and the circuit board assembly according to any one of the technical solutions described above, wherein the image sensor is arranged on the third surface and is electrically connected to the second circuit board through the electrical connection structure, and the lens is arranged on the side of the image sensor away from the second circuit board; the driving assembly is used to support the second circuit board on the side of the lens close to the image sensor, and is used to drive the second circuit board to move relative to the first circuit board in a direction parallel to the reference surface, so as to realize an anti-shake function.

[0024] In the camera module described above, the driving assembly supports the second circuit board on the lens, so that the second circuit board has flexibility in lateral movement, and can be driven to move in a direction parallel to the reference surface, thereby realizing an anti-shake function; the image sensor is electrically connected to the second circuit board through the electrical connection structure, and light entering through the lens can be incident on the image sensor to form an image.

[0025] Optionally, the driving assembly includes a support component and a lateral driving component, the lateral driving component is connected to the side of the lens close to the image sensor, and is used to move the support component relative to the first circuit board in a direction parallel to the reference surface, and the support component is used to support the second circuit board on the lateral driving component, which is conducive to improving the integration level and reducing the assembly difficulty.

[0026] Optionally, the driving assembly includes a support component and a lateral driving component; wherein the support component is used to support the second circuit board on the side of the lens close to the image sensor; and the lateral driving component is used to drive the second circuit board to move relative to the first circuit board in a direction parallel to the reference surface, and the support component and the lateral driving component are independently arranged, which is conducive to separate manufacturing and reduces the cost of parts.

[0027] Optionally, the lateral driving component includes a coil and a magnet, wherein the coil is arranged on the second circuit board, and the magnet is arranged on the first circuit board; or the magnet is arranged on the second circuit board, and the coil is arranged on the first circuit board; the coil is used to attract or repel the magnet, so as to drive the second circuit board to move relative to the first circuit board in a direction parallel to the reference surface.

[0028] Optionally, the lateral drive component includes an optical image stabilization motor, which has a good image stabilization effect, and the support component includes a suspension wire, which can provide a certain degree of support and allow the movable circuit board to have a certain degree of freedom in the lateral direction.

[0029] Optionally, the camera module further includes a filter holder and an infrared cutoff filter. The infrared cutoff filter is located between the lens and the image sensor, and the filter holder supports the infrared cutoff filter on the third surface. The support component is connected between the lens and the filter holder. The support component is indirectly connected to the second circuit board via the filter holder, which helps to reduce the area occupied on the third surface.

[0030] Optionally, the camera module further includes gold wires, and the image sensor is electrically connected to the electrical connection structure through the gold wires to realize the conduction between the image sensor and the electrical connection structure.

[0031] Optionally, when the first circuit board has the first hollow portion, the camera module further includes a reinforcing plate, which is disposed on the surface of the first circuit board away from the lens, and the reinforcing plate covers the hollow structure to prevent dust from entering the camera module through the first hollow portion.

[0032] Thirdly, an electronic device is provided, which includes a housing and a camera module provided by the above-described technical solution, wherein the camera module is disposed within the housing.

[0033] Compared with the prior art, the electronic device has the same advantages as the camera module, which will not be repeated here. Attached Figure Description

[0034] Figure 1 A cross-sectional view of a first type of camera module provided in an embodiment of this application;

[0035] Figures 2a to 2c Indicate Figure 1 The diagram shows the structure of the first type of circuit board assembly in the embodiment shown.

[0036] Figure 3 Indicate Figure 1 The diagram shows the structure of the second type of circuit board assembly in the embodiment shown.

[0037] Figure 4 Indicate Figure 1 A schematic diagram of the third type of circuit board assembly in the embodiment shown;

[0038] Figures 5a to 5c Indicate Figure 1 A schematic diagram of the fourth type of circuit board assembly in the illustrated embodiment;

[0039] Figure 5d is Figure 5c a partial enlarged view at R1 in the middle;

[0040] Figure 5e is Figure 5c a partial enlarged view at R2 in the middle;

[0041] Figures 6a to 6c is Figure 1 a structure schematic view of a fifth circuit board assembly in the embodiment shown;

[0042] Figure 6d is Figure 6b a partial enlarged view at R3 in the middle;

[0043] Figure 6e is Figure 6b a partial enlarged view at R4 in the middle;

[0044] Figure 7a is Figure 1 a structure schematic view of a sixth circuit board assembly in the embodiment shown;

[0045] Figure 7b is Figure 1 a structure schematic view of a seventh circuit board assembly in the embodiment shown;

[0046] Figure 8a is a sectional view of a second camera module provided by the embodiment of the present application;

[0047] Figure 8b is Figure 8a a structure schematic view of a first circuit board assembly in the embodiment shown;

[0048] Figure 8c is Figure 8a a structure schematic view of a second circuit board assembly in the embodiment shown;

[0049] Figure 8d is Figure 8a a structure schematic view of a third circuit board assembly in the embodiment shown. DETAILED DESCRIPTION

[0050] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of protection of the present application. The orientation words such as “up”, “down”, “left” and “right” in the embodiments of the present application refer to the corresponding directions in the corresponding drawings. It should be understood that, Figure 1Only the overall frame structure of the camera module is intended to be shown, and the specific structure of the circuit board assembly is not completely consistent with the circuit board assembly structure in Figures 2a to 7b . The specific structure of the circuit board assembly is subject to the circuit board assembly structure in Figures 2a to 7b . Moreover, in the following embodiments, the orientation relationship words such as "vertical" and "parallel" are allowed to have engineering-allowed errors. In each of the drawings, the fillings in the remaining drawings, except for Figure 1 and Figure 8a , do not represent cross sections, but only represent solid structures, so as to be distinguished from hollow structures such as hatching.

[0051] The camera module provided by the embodiments of the present application will be introduced first as follows.

[0052] Reference is made to Figure 1The camera module includes a circuit board assembly, the circuit board assembly includes a first circuit board 8, a second circuit board 10 and a connecting assembly 4. The first circuit board 8 is a fixed circuit board, and a first hollow part U1 is arranged in the middle of the first circuit board 8. The second circuit board 10 is an active circuit board, and is arranged in the first hollow part U1. The image sensor 2 is bonded to the surface of the second circuit board 10 by the adhesive 1. The image sensor 2 is connected to the second circuit board 10 by the gold wire 7. Specifically, the circuit board assembly further includes an electrical connection structure arranged on the surface of the second circuit board 10 (specifically, a third surface B1 which will be described below). The electrical connection structure can be a plurality of pads distributed in a scattered manner. The gold wire 7 is connected to the pads to realize electrical connection with the second circuit board 10. However, the specific form of the electrical connection structure is not limited to the pads, and can also be other structures having an electrical connection function. The second circuit board 10 can further be provided with electronic devices 17 such as capacitors and inductors. The bottom sides of the first circuit board 8 and the second circuit board 10 are provided with a protection plate 9. The protection plate 9 has the functions of protection and module sealing. The first circuit board 8 is provided with a first bracket 12 in the form of a groove. The vertical part of the first bracket 12 extends along the edge of the first circuit board 8. The second circuit board 10 is provided with a second bracket 11 in the form of a groove. The vertical part of the second bracket 11 extends along the edge of the second circuit board 10. The first bracket 12 is provided with an opening at a position opposite to the second circuit board 10. The second bracket 11 is provided with an opening at a position opposite to the image sensor 2. The second bracket 11 is provided with an infrared cut filter 13 at the opening. The second bracket 11 extends inwardly to a position opposite to the first bracket 12. The second bracket 11 and the first bracket 12 are connected by a suspension wire 16. The suspension wire 16 serves as a support component and mainly has a support function. The second circuit board 10 is supported on the side of the lens 15 close to the image sensor 2. The support is indirect support. In addition to the suspension wire, other support structures having a support function such as spring sheets, silicon sheets and thin films can also be used. The first circuit board 8 is provided with a magnet 5 on the side (a first surface A1) of the first circuit board 8 close to the lens 15 and inside the first bracket 12. The third surface B1 of the second circuit board 10 is provided with a coil 6 on the edge. The coil 6 is arranged inside the second bracket 11. The magnet 5 and the coil 6 form at least part of the structure of a horizontal driving component. The support component and the horizontal driving component exemplarily form at least part of the structure of a driving assembly, and have horizontal driving and support functions. The second circuit board 10 is driven to move relative to the second circuit board 10 in a direction parallel to a reference surface by the Lorentz force between the magnet 5 and the coil 6. The reference surface can be the plane of the surface (the first surface A1 in the following) of the first circuit board 8 away from the protection plate 9. The magnet 5 and the coil 6 can be switched between attraction and repulsion by changing the direction of the current flowing through the coil 6.Wherein, the positions of the magnet 5 and the coil 6 can be interchanged, i.e. the coil 6 is located on the first surface A1 of the first circuit board 8, and the magnet 5 is located on the third surface B1 of the second circuit board 10, or other magnetic first driving members can be used to drive the second driving member to move laterally by magnetic force.

[0053] The first support 12 is provided with an autofocus motor 14, which can be a voice coil motor. The inside of the autofocus motor 14 is provided with a lens 15. The lens 15 of the autofocus motor 14 moves away from or approaches the image sensor 2 along the optical axis direction to adjust the image distance. The autofocus motor 14 can also be other driving devices with longitudinal driving function. The lens 15, the infrared cut filter 13 and the image sensor 2 are arranged in sequence along the optical axis direction. The light enters the lens 15 and then passes through the infrared cut filter 13 and the image sensor 2 in sequence. The infrared cut filter 13 can filter out the infrared interference in the environment. The autofocus motor 14 is directly connected with the first support 12. The suspension wire 16 supports the second support 11 on the first support 12, so that the suspension wire 16 indirectly supports the second circuit board 10 on the side of the lens 15 facing the image sensor 2. The suspension wire 16 is not directly connected with the second support 11, which can save the space on the surface (specifically the third surface B1 in the following) of the second circuit board 10, and is beneficial to arranging the remaining components on the third surface B1 or increasing the size of the image sensor 2.

[0054] In order to realize the conduction between the first circuit board 8 and the second circuit board 10, the first circuit board 8 and the second circuit board 10 are connected through the connecting assembly 4 to bear the wiring between the two circuit boards.

[0055] Wherein, the driving assembly is not limited to the above form. An optical anti-shake motor is used as a lateral driving component to replace the combination of the magnet 5 and the coil 6 in the foregoing embodiment. The optical anti-shake motor drives the second circuit board 10 to move relative to the first circuit board 8 along a direction parallel to the reference surface. The optical anti-shake motor and the suspension wire 16 are independently arranged, which is beneficial to simplifying the structure of components and reducing the cost compared with integration.

[0056] However, the suspension wire can also be integrated with the optical anti-shake motor. The optical anti-shake motor is connected (which can be indirect) to the side of the lens 15 facing the image sensor 2. The optical anti-shake motor drives the suspension wire to move parallel to the reference surface. The suspension wire is connected with the second support 11 to support the second circuit board 10 on the optical anti-shake motor. The optical anti-shake motor is connected with the first support 12. The integration of the optical anti-shake motor and the suspension wire is beneficial to improving the integration degree and reducing the assembly difficulty.

[0057] The optical image stabilization motor can also be replaced by a ceramic motor or other transverse driving components such as SMA (shape memory alloy), and the suspension wire can also be replaced by other supporting components such as elastic sheet, silicon sheet and film.

[0058] In summary, the driving assembly is used to support the second circuit board 10 on the side of the lens 15 close to the image sensor 2, and to drive the second circuit board 10 to move relative to the first circuit board 8 in the direction parallel to the reference plane.

[0059] In order to reduce the resistance of the connecting assembly 4 caused by material stress during the movement of the second circuit board 10 relative to the first circuit board 8, the possible specific forms of the connecting assembly 4 are introduced as follows.

[0060] In combination Figures 2a to 2c, the first circuit board 8 has opposite first surface A1 and second surface A2, and outer circumferential surface A4 connecting the first surface A1 and the second surface A2; and the first circuit board 8 has a first hollow portion U1 penetrating the first surface A1 and the second surface A2 in a direction perpendicular to the first surface A1, the first hollow portion U1 is rectangular, when the first hollow portion U1 is provided, by arranging the reinforcing plate 9 on the second surface A2, the reinforcing plate 9 covers the first hollow portion U1, the first hollow portion U1 can be sealed, thereby sealing the camera module, preventing dust from entering the camera module through the first hollow portion U1, avoiding dust affecting the imaging quality, and even reducing the service life of the camera module, wherein the reinforcing plate 9 can be connected with the first circuit board 8 by hot pressing, bonding or the like; the second circuit board 10 has opposite third surface B1 and fourth surface B2, and outer circumferential surface B3 connecting the third surface B1 and the fourth surface B2; the first surface A1 and the second surface A2 are both rectangular; the third surface B1 and the fourth surface B2 are both rectangular; first, when the image sensor 2 is assembled with the third surface B1, it is convenient to adapt to the shape of the image sensor 2 and save space; second, when the second circuit board 10 is formed in a cutting mode, only the mother board needs to be cut along the trajectories of two perpendicular directions, which is advantageous for reducing the cutting difficulty compared with cutting along a curved or irregular trajectory; third, when the second circuit board 10 is cut, the utilization rate of the mother board is high, and the generated corner scraps are less; the first hollow portion U1 is rectangular to adapt to the shape of the second circuit board 10, improve the space utilization rate of the first hollow portion U1, and when the first hollow portion U1 is processed, only the first circuit board 8 needs to be cut along two mutually perpendicular straight lines, which reduces the cutting difficulty; the four edges of the first surface A1 and the four edges of the second surface A2 correspondingly parallel, wherein, among the mutually perpendicular adjacent sides of the first surface A1, one side is parallel to the X axis, and the other side is perpendicular to the Y axis, the four sides of the third surface B1 and the four sides of the fourth surface B2 correspondingly parallel, and cooperate to form one second sub-surface in the outer circumferential surface B3, and the profile of the first hollow portion U1 is an inner circumferential surface A3, the inner circumferential surface A3 includes a first sub-surface corresponding to the four sides of the first surface A1; the third surface B1 has the same orientation as the first surface A1, and the fourth surface B2 has the same orientation as the second surface A2; wherein, part or all of the first circuit board 8 is placed in the first hollow portion U1 to reduce the space occupied in the optical axis direction, the four second sub-surfaces in the outer circumferential surface B3 correspondingly parallel to the four first sub-surfaces of the first hollow portion U1, and a certain gap is formed. The following describes some positional relationships with the plane where the first surface A1 is located as the reference plane (the XY axis plane, and perpendicular to the optical axis).

[0061] The orthographic projection of the second circuit board 10 on the reference plane is located within the outer contour of the orthographic projection of the first circuit board 8 on the reference plane, preventing the second circuit board 10 from having some or all of its structure located outside the first circuit board 8 in the direction of the reference plane, which is advantageous for miniaturization of the circuit board assembly in the direction of the XY plane (perpendicular to the optical axis).

[0062] Due to the gap formed between the outer peripheral surface B3 and the inner peripheral surface A3, there is an annular gap (denoted as Q) between the orthographic projections of the first circuit board 8 and the second circuit board 10 on the reference plane.

[0063] The connecting assembly 4 comprises flexible connecting bands 4e, 4f, 4g and 4h, one end of each flexible connecting band is referred to as a first end and the other end is referred to as a second end, each flexible connecting band extends spirally around a central axis L of the second circuit board, the central axis L is perpendicular to the third surface B1, and when the third surface B1 is a central symmetric figure, the central axis L passes through the geometric center of the third surface B1, but it should be understood that the third surface B1 allows a certain engineering error compared with the central symmetric figure, the first end of each flexible connecting band is connected with the inner circumferential surface A3; specifically, the first end of the flexible connecting band can be integrally connected with the inner circumferential surface A3, and the flexible connecting band and the first circuit board 8 are formed by direct molding, and no additional connecting structure is needed between the first end of the flexible connecting band and the inner circumferential surface A3, thereby reducing the space occupied in the XYZ direction and reducing the process flow, wherein "molding" means that at least part of one structure (flexible connecting band) and at least part of another structure (first circuit board 8) are formed at the same time by processes such as simultaneous injection molding, extrusion, etc., without later splicing processes such as welding, bonding, etc. For example, the insulating layer of the flexible connecting band and the insulating layer of the first circuit board 8 are formed at the same time during injection molding, and the metal conductive layer of the flexible connecting band and the metal conductive layer of the first circuit board 8 are formed by etching the same piece of metal without splicing; alternatively, the first end of the flexible connecting band and the inner circumferential surface A3 can also be connected by ACF (Anisotropic Conductive Film, anisotropic conductive film) process, wherein compared with the traditional welding process, the ACF process requires a lower welding temperature, which is beneficial to avoid the situation that the first circuit board 8 is scalded due to a higher welding temperature, or the flexible connecting band made of FPC is deformed due to heat, both of which will affect the positioning accuracy of the first circuit board 8 when connected with other devices; in addition, in the ACF process, the anisotropic conductive film not only can realize the bonding of the flexible connecting band made of FPC and the first circuit board 8, but also can realize longitudinal electrical conduction, which is beneficial to the accurate positioning of the flexible connecting band made of FPC and the first circuit board 8.Similarly, the second end is connected with the outer circumferential surface B3 by anisotropic conductive adhesive film process or integral connection, the function and effect thereof refer to the connection of the flexible connection band with the first circuit board 8, and the connection mode, function and effect of the flexible connection bands with the first circuit board 8 and the second circuit board 10 in each embodiment hereinafter can refer to the connection mode of the flexible connection band with the first circuit board 8. The flexible connection band 4e has the effect of flexibly connecting the first circuit board 8 and the second circuit board 10, allowing the second circuit board 10 to have the freedom of movement in the direction parallel to the reference plane, and the first circuit board 8 and the second circuit board 10 can be electrically connected by wiring on the flexible connection band 4e to realize conduction. The flexible connection bands 4e, 4f, 4g and 4h are located between the outer circumferential surface B3 and the four first sub-sides of the first hollow part U1, so that the projections of the flexible connection bands 4e, 4f, 4g and 4h on the reference plane are located in the above-mentioned annular gap Q to reduce the occupied space of the flexible connection bands 4e, 4f, 4g and 4h in the optical axis direction. The flexible connection bands 4e, 4f, 4g and 4h are all selected to be flexible circuit boards (FPC, Flexible Printed Circuit), which have the effect of flexibly and electrically connecting the first circuit board 8 and the second circuit board 10. Compared with the spring, the flexible circuit board basically has no elasticity. When the size of the image sensor 2 changes, such as the size of the image sensor 2 increases, the size of the second circuit board 10 can be directly increased, and even if the size of the flexible circuit board is reduced, the reset force of the second circuit board 10 will not increase. Conversely, the size of the image sensor 2 decreases, and the size of the flexible circuit board increases, and the reset force of the second circuit board 10 will not decrease. Therefore, the overall size of the circuit board assembly can basically remain unchanged. Even if it is integrated with the size of the optical anti-shake motor, the size of the optical anti-shake motor can also basically remain unchanged. Therefore, the size change of the image sensor 2 is not easy to cause the size change of other components, and the adaptation is more flexible.

[0064] Reference Figure 2aFor example, the first end of the flexible connecting band 4e forms a first corner structure V1 which is bent from the extending direction of the flexible connecting band 4e to the first circuit board 8, and the second end forms a second corner structure V2 which is bent from the extending direction of the flexible connecting band 4e to the second circuit board 10. During the extension from the first corner structure V1 to the second corner structure V2, the intermediate part of the first corner structure V1 and the second corner structure V2 is first bent to the right and then to the down to connect with the second corner structure V2. The first corner structure V1 is bent to the upper first sub-side of the inner circumferential surface A3 of the first circuit board 8 and connected with the middle part thereof. The second corner structure V2 is bent to the left to the middle part (not necessarily the middle position) of the second sub-side of the outer circumferential surface B3 of the second circuit board 10. The first corner structure V1 is beneficial for the flexible connecting band 4e to flexibly select the connection position with the corresponding first sub-side instead of extending along a straight line. Similarly, the second corner structure V2 is beneficial for the flexible connecting band 4e to flexibly select the connection position with the corresponding second sub-side. In addition, in the embodiment, the flexible connecting band 4e is bent to the first sub-side of the inner circumferential surface A3 of the first circuit board 8 and the second sub-side of the outer circumferential surface B3 of the second circuit board 10, which is beneficial for the flexible connecting band 4e to flexibly select the connection position with the corresponding first sub-side and the second sub-side. Figures 2a to 2c In the embodiment, each flexible connecting band is parallel (allowing a certain error in engineering) to the reference surface. Compared with the case of being perpendicular to the reference surface, the flexible connecting band can directly extend between the first circuit board 8 and the second circuit board 10 without twisting, which is beneficial for preventing the flexible connecting band from being broken.

[0065] The flexible connecting band 4e is rotated by 90°, 180° and 270° around the central axis L of the second circuit board 10 to obtain the flexible connecting bands 4f, 4g and 4h, respectively. In this way, the projections of each two adjacent flexible connecting bands in the width direction (perpendicular to the extending direction of the flexible connecting band and parallel to the reference surface) do not overlap, which is beneficial for preventing the adjacent flexible connecting bands from interfering with each other.

[0066] In the embodiment, the flexible connecting band 4e has a band structure and a small width, so that only a small material stress needs to be overcome during bending. The total number of the flexible connecting bands can meet the total number of the wirings. Figure 2a In the embodiment, the flexible connecting band 4e has a substantially L shape and a substantially 90° bending angle which forms a bending structure W1. No matter whether the second circuit board 10 is driven to move in the up-down direction or the left-right direction, the first end and the second end of the flexible connecting band 4e can provide a certain redundancy, which is beneficial for increasing the overall length of the flexible connecting band without increasing the transverse size, reducing the deformation amount per unit size, and preventing a large resistance from being overcome when the first circuit board 8 moves relative to the second circuit board 10 in the XY plane.

[0067] It should be understood that the flexible connecting band 4e is not necessarily in the form of an L-shape, and when the flexible connecting band 4e includes a plurality of bending structures W1 or the included angle of each bending structure is not 90°, the flexible connecting band 4e can also have the effect of reducing the resistance, but the flexible connecting band 4e is in the form of Figure 2a extending substantially along the X direction or the Y direction in the form of

[0068] The first end of the flexible connecting band 4e is connected to a first sub-side of the inner circumferential surface A3 of the first hollow portion U1, rather than being provided with a chamfer at the corner of the inner circumferential surface A3 and being connected to the chamfer position, so that the stress on the flexible connecting band 4e is distributed in two directions parallel to the reference surface and perpendicular to each other.

[0069] The connecting assembly 4 includes 4 flexible connecting bands only as an example, and can also be 3, 5 or more flexible connecting bands.

[0070] In the embodiment shown in FIG. 1, the flexible connecting band 4e is in the form of an L-shape, and the first end of the flexible connecting band 4e is connected to the inner circumferential surface A3 of the first hollow portion U1 of the first circuit board 8. Figures 2a to 2c In the corresponding embodiment, the flexible connecting band is arranged between the inner circumferential surface A3 and the outer circumferential surface B3, and the second circuit board 10 can be hidden in the first hollow portion U1 of the first circuit board 8, which is beneficial to reduce the thickness of the circuit board assembly.

[0071] Referring to FIG. 1, the first circuit board 8 and the second circuit board 10 are arranged in parallel to each other, and the first circuit board 8 and the second circuit board 10 are connected to each other through the flexible connecting band 4e. Figure 3 , the first circuit board 8 and the second circuit board 10 are arranged in parallel to each other, and the first circuit board 8 and the second circuit board 10 are connected to each other through the flexible connecting band 4e. Figures 2a to 2cThe difference is that the flexible connecting bands 4e and 4g are respectively replaced by flexible connecting bands 4e' and 4g', the flexible connecting band 4e' is symmetrical to the flexible connecting band 4f about the symmetry axis of the second circuit board 10 parallel to the X direction, the flexible connecting band 4g' is symmetrical to the flexible connecting band 4h about the symmetry axis of the second circuit board 10 parallel to the X direction, and the distribution of the connecting assembly 4 is beneficial to the symmetry of the stress distribution in each flexible connecting band and the balance. In this structure, each second sub-side of the outer circumferential surface B3 is connected with two flexible connecting bands, such as the upper side connected with the flexible connecting bands 4e' and 4h and the lower side connected with the flexible connecting bands 4f and 4g', so as to increase the wire-out quantity of the two oppositely arranged second sub-sides, and it can be known that the flexible connecting bands 4e' and 4h are respectively arranged symmetrically with the flexible connecting bands 4f and 4g' about the symmetry axis of the upper side and the lower side, which is beneficial to improving the stress balance degree of the second circuit board 10, wherein the number of the flexible connecting bands connected with the upper side and the lower side is not limited to two, and can be more than two, such as three and four, etc. This is only exemplary, as long as each second sub-side is connected with two or more flexible connecting bands in the opposite second sub-sides, that is, it is beneficial to increase the wire-out quantity of the above-mentioned second sub-side, thereby increasing the engagement strength of the second sub-side and the flexible connecting band, and the two second sub-sides with more wire-out quantity are oppositely arranged, which is beneficial to the stress balance of the second circuit board.

[0072] Reference Figure 4The difference lies in that the second end of the flexible connecting strip 4a is connected to the upper end of the second sub-side of the right side of the outer peripheral surface B3 of the second circuit board 10 via the second corner structure V2, which bends towards the right side of the first sub-side. This connection extends downwards and then to the left until the first end of the flexible connecting strip 4a connects to the lower end of the first sub-side of the left side of the inner peripheral surface A3 of the first hollow portion U1. The structure of this connecting component 4 has overlapping flexible connecting strips in the width direction between adjacent pairs. The "width direction" refers to a direction parallel to the reference plane and perpendicular to the extension direction of the flexible connecting strip. This overlap increases the length of each flexible connecting strip, reduces the deformation of a single cross-sectional area, and lowers the resistance during deformation. Flexible connecting strips 4b, 4c, and 4d have similar structures and connection methods to flexible connecting strip 4a. Flexible connecting strip 4b, 4c, and 4d can be obtained by rotating flexible connecting strip 4a by 90°, 180°, and 270° sequentially around the axis of the geometric center of the second circuit board 10. The angle between the first and second ends of each flexible connecting strip and the line connecting them to the central axis L (both lines are parallel to the reference plane) is between 90° and 180°, specifically 90°, 95°, 100°, 120°, 150°, 175° or 180°. Among them, the angle corresponding to the flexible connecting strip 4a is about 175°, to ensure that two adjacent flexible connecting strips can overlap in the width direction, but do not overlap with the third flexible connecting strip in the width direction, thus avoiding excessive increase in the size occupied by the camera flexible connecting strip in the reference plane direction.

[0073] Combination Figures 5a to 5c ,and Figures 2a to 2c The difference lies in the direction along the normal of the reference plane (i.e., the optical axis direction in this figure). The second surface A2 is located on the side of the fourth surface B2 away from the third surface B1. The fourth surface B2 is offset relative to the second surface A2 along the optical axis towards the plane where the third surface B1 is located, so that the plane where the fourth surface B2 is located is between the plane where the second surface A2 is located and the plane where the third surface B1 is located. Thus, the fourth surface B2 is concave relative to the second surface A2, which can accommodate the connecting component 4. The connecting component 4 includes flexible connecting strips 4q, 4r, 4s, and 4t. The structures of the flexible connecting strips 4q, 4r, 4s, and 4t can be referred to as the flexible connecting strips 4a, 4b, 4c, and 4d respectively. Taking the flexible connecting strips 4q and 4a as examples to illustrate the difference, the flexible connecting strip 4q is attached (only attached, not fixed by adhesive or other means) to the fourth surface B2, and the second end (refer to position J) is fixed and electrically connected to the fourth surface B2 (the following will use the flexible connecting strip 4r as an example, and combine it with...). Figure 5dThe first end (reference I position) is connected to one first sub-side of the inner circumferential surface A3, and is no longer located in the gap between the outer circumferential surface B3 and the inner circumferential surface A3, wherein at least the normal projection of the bending structure W2 of the flexible connecting band 4q on the reference surface is located within the normal projection of the fourth surface B2 on the reference surface, at this time, the gap between the outer circumferential surface B3 and the inner circumferential surface A3 can be reduced, the size of the second circuit board 10 can be increased without increasing the overall size of the circuit board assembly, a larger size image sensor 2 can be placed, thereby improving the performance of the image sensor 2; and the flexible connecting band does not have to be arranged in the annular gap between the inner circumferential surface A3 and the outer circumferential surface B3, the operation space is increased when the second end is connected to the fourth surface B2 and when the first end is connected to the inner circumferential surface A3, the process difficulty is reduced, and the yield is improved; and the size of the flexible connecting band can be set to be larger, the softness is increased, the resistance is reduced, and the second circuit board 10 is more flexible when moving laterally. When the flexible connecting band 4q has a plurality of bending structures W2, as long as the normal projection of the plurality of bending structures W2 on the reference surface at least partially overlaps the normal projection of the fourth surface B2 on the reference surface, the size of the circuit board assembly in the XY plane can be reduced. The flexible connecting bands 4r, 4s and 4t have similar deformations with respect to the flexible connecting bands 4b, 4c and 4d respectively.

[0074] In combination Figure 5c and Figure 5d Taking the flexible connecting band 4r as an example, the end surface of the first end of the flexible connecting band 4r is connected to the inner circumferential surface A3. And along the normal direction of the reference surface (here, the direction of the optical axis L), the thickness dimension of the flexible connecting band 4r is smaller than the thickness dimension of the first circuit board 8, and the flexible connecting band 4r is between the second surface A2 and the fourth surface B2, so that the flexible connecting band 4r is hidden in the accommodation space formed by the inward recess of the fourth surface B2 relative to the second surface A2 in the normal direction of the reference surface, without occupying additional space in the normal direction of the reference surface. In combination with Figure 5c and Figure 5e , the minimum distance h2 from the first end of the flexible connecting band 4r to the second surface A2 is smaller than the minimum distance h1 from the first end to the first surface A1, so as to reserve a wider size h1 between the first end and the first surface A1 on the inner circumferential surface of the first hollow part U1 to be arranged opposite to the outer circumferential surface B3, which is beneficial to reduce the overall thickness of the circuit board assembly, and to ensure the flexibility.

[0075] In combination Figure 5d and Figure 5eA connecting pad E1 is provided between the second end of the flexible connecting strip 4r and the fourth surface B2. The connecting pad E1 can be a metal sheet or metal solder, which can fix and electrically connect the second end of the flexible connecting strip 4r to the pad on the fourth surface B1. The connecting pad E1 raises the second end of the flexible connecting strip 4r so that the part between the first and second ends of the flexible connecting strip 4r can have a certain distance from the fourth surface B2, so that the flexible connecting strip 4r can deform more flexibly.

[0076] The above example only uses the 4r flexible connecting strip; other flexible connecting strips can also have similar structures and connection methods.

[0077] refer to Figures 6a to 6b ,and Figures 2a to 2c The difference lies in the fact that, along the normal direction of the reference plane (i.e., the optical axis direction in this figure), the third surface B1 is higher than the first surface A1, and the plane containing the third surface B1 is located on the side of the first surface B1 that is away from the second surface A2. Figures 6a to 6b The positional relationship between the first circuit board 8 and the second circuit board 10 Figures 5a to 5b The positional relationship is the same; specifically, the first circuit board 8 and the second circuit board 10 have the same thickness, while the second circuit board 10 moves a certain distance along the direction from the second surface A2 to the first surface A1, and this distance is less than the thickness of the first circuit board 8. The connecting assembly 4 includes flexible connecting strips 4i, 4j, 4k, and 4l, the structures of which can be referred to sequentially. Figures 2a to 2c The flexible connecting strips in the design are 4e, 4f, 4g, and 4h, but other structures are also possible.

[0078] Taking the flexible connecting strip 4i as an example, the second end of the flexible connecting strip 4i is connected to a second sub-side of the outer peripheral surface B3, which facilitates reducing the thickness in the direction perpendicular to the reference surface. Furthermore, the bent structure W3 of the flexible connecting strip 4i is attached to the first surface A1, and the first end is bonded to the first surface A1 by adhesive or other means, without needing to be connected to the inner peripheral surface A3. This provides greater operational space, reduces process difficulty, and improves yield. When the flexible connecting strip 4i has multiple bent structures W3, the orthographic projection of the multiple bent structures W3 on the reference surface only needs to at least partially overlap with the first surface A1. Alternatively, it can be as follows... Figures 5a to 5c Similarly, reduce the dimensions of the circuit board assembly in the direction parallel to the reference plane.

[0079] In this way, compared with arranging the flexible connecting band in the annular gap between the inner circumferential surface A3 and the outer circumferential surface B3, the size of the flexible connecting band can be increased, so that the softness of the flexible connecting band is further improved, the resistance is reduced, and the second circuit board is more flexible in moving in the XY plane. In addition, the fourth surface B2 is located between the first surface A1 and the second surface A2 in the normal direction of the reference surface, which is beneficial to providing a containing space on the side where the fourth surface B2 is away from the third surface B1, and some components can be arranged.

[0080] In combination with 6b and Figure 6d For example, the flexible connecting band 4k, the end surface of the second end of the flexible connecting band 4k is connected with the outer circumferential surface B3, which can be integrally formed with the second circuit board 10. In the normal direction of the reference surface (here, the direction of the optical axis L), the thickness of the flexible connecting band 4k is less than the thickness of the second circuit board 10, and the flexible connecting band 4k is located between the first surface A1 and the third surface B1, so that the flexible connecting band 4k is hidden in the containing space formed by the recess of the first surface A1 relative to the third surface B1 in the normal direction of the reference surface, without occupying additional space in the normal direction of the reference surface. In addition, the minimum distance (denoted as h3, h3=0, so it is not marked in the figure) from the second end of the flexible connecting band 4k to the third surface B1 is less than the minimum distance h4 from the second end of the flexible connecting band 4k to the fourth surface B2. In order to reserve a wider size h4 between the second end of the flexible connecting band 4k and the fourth surface B2 on the inner circumferential surface A3, which is arranged opposite to the inner circumferential surface A3 of the first hollow part U1, which is beneficial to reduce the overall thickness of the circuit board assembly, and to ensure the flexibility.

[0081] In combination with Figure 6b and Figure 6e The first end of the flexible connecting band 4k is provided with a connecting pad E2, which can be a metal sheet or a metal solder, which can fix and electrically connect the first end of the flexible connecting band 4k with the pad on the first surface A1. The connecting pad E2 raises the first end of the flexible connecting band 4k, so that the part between the first end and the second end of the flexible connecting band 4k can have a certain distance from the first surface A1, so that the flexible connecting band 4k can deform more flexibly.

[0082] The above is only an example of the flexible connecting band 4k, and the remaining flexible connecting bands can also have similar structures and connection modes.

[0083] Figures 6a to 6c In this way, the structure of the flexible connecting band can be deformed, and the reference Figure 7a The connecting assembly 4 includes flexible connecting bands 4m, 4n, 4o and 4p, and the arrangement positions and connection modes of the two ends of the flexible connecting bands 4m, 4n, 4o and 4p can be referred to Figures 6a to 6cThe flexible connecting strips 4i, 4j, 4k, and 4l are used, but their winding structures can be referenced. Figure 4 The numbers 4q, 4r, 4s, and 4t are used.

[0084] refer to Figure 7b ,exist Figure 7a Based on this, a second hollow portion U2 extending along the extension direction of the flexible connecting strip is provided in the middle of each flexible connecting strip (such as 4q). The second hollow portion U2 is distributed in strip shape in the middle position of the flexible connecting strip, which can reduce the width of the flexible connecting strip in the direction parallel to the reference plane, thereby improving the flexibility of the flexible connecting strip and reducing the resistance that needs to be overcome when it deforms.

[0085] exist Figures 1 to 7b In the corresponding embodiments, the first circuit board 8 has a first cutout portion U1, and in the normal direction of the reference surface, the second circuit board 10 extends at least partially into the first cutout portion U1, so that in the direction parallel to the reference surface, the outer peripheral surface B3 of the second circuit board 10 is at least partially opposite to the inner peripheral surface A3 that forms the first cutout portion U1, that is, in the direction parallel to the reference surface, the projection of the second circuit board 10 and the projection of the first circuit board 8 at least partially overlap.

[0086] refer to Figure 8a and Figure 8b The first circuit board 8 and the second circuit board 10 are arranged side by side along the optical axis, rather than the second circuit board 10 being partially or entirely disposed within the first cutout portion U1 of the first circuit board 8. The fourth surface B2 is located on the side of the plane containing the first surface B1 that faces away from the plane containing the second surface A2, and the plane containing the fourth surface B2 is positioned opposite to the plane containing the second surface A2. A flexible connecting strip (such as 4q) extends onto the first surface A1; a second cutout portion U2 extending along the extending direction of each flexible connecting strip (such as 4q) is provided in the middle of the strip. The second cutout portions U2 are distributed in a strip-like manner in the middle of the flexible connecting strip to improve its flexibility and reduce the resistance that needs to be overcome during deformation. Furthermore, by observing… Figure 8a When the first circuit board 8 does not have the first cutout U1, because the first circuit board 8 itself has the functions of reinforcement and sealing, the reinforcement plate on the bottom surface of the first circuit board 8 does not need to be set, simplifying the process steps. Furthermore, with... Figures 2a to 2c Compared to the previous embodiment, the flexible connecting strip offers greater operational space when connecting its two ends. Furthermore, the size of the flexible connecting strip can be further increased, which helps reduce the lateral movement resistance of the second circuit board 10. Moreover, compared to... Figures 5a to 5cCompared with the corresponding embodiment, the flexible connecting bands are not limited in the first hollow structure U1, and have greater freedom of movement, which is conducive to further increasing the freedom of the second circuit board 10. Moreover, since the first hollow portion U1 is not provided, the structural strength of the first circuit board 8 is greater. Moreover, the lateral movement space of the second circuit board 10 is no longer limited to the first hollow portion U1, but is expanded to the entire area of the first circuit board 8, which is conducive to further improving the anti-shake performance. In addition, the size of the second circuit board 10 is not limited to the first hollow portion U1, but can be smaller than the first circuit board 8, which means that a larger second circuit board 10 can be provided, which is conducive to placing a larger image sensor 2 on the third surface B1.

[0087] Alternatively, as shown in FIG. 6, the first circuit board 8 is not located in the first hollow portion U1, and the second circuit board 10 is located in the first hollow portion U1. Figure 8c Compared with the embodiment of FIG. 6, the difference lies in that the second hollow portion U2 is not provided, which is conducive to, and the normal projection of each flexible connecting band on the reference surface is completely located within the normal projection range of the third surface on the reference surface. Figure 8b Alternatively, as shown in FIG. 7, the first circuit board 8 is not located in the first hollow portion U1, and the second circuit board 10 is located in the first hollow portion U1.

[0088] Figure 8d In addition, the first hollow portion U1 can be added at the position opposite to the second circuit board 10 of the first circuit board 8, but the first circuit board 8 is not located in the first hollow portion U1, and the first hollow portion U1 can achieve the effect of weight reduction.

[0089] As long as the following conditions are met, the resistance of the second circuit board 10 to move in the direction in the XY plane can be reduced in the case of additionally occupying space in the direction in the XY plane: the plane where the second surface A2 is located is oppositely arranged with the plane where the third surface B1 is located; the first end of each flexible connecting band is connected with the second surface A2, the second end is connected with the third surface B1, and the normal projection of the plurality of bending structures of the flexible connecting band on the reference surface at least partially overlaps with the normal projection of the second surface A2 on the reference surface.

[0090] Based on the same inventive concept, a circuit board assembly is provided, which includes the first circuit board 8, the second circuit board 10 and the connecting assembly in the foregoing camera module embodiments, and the structure and effects thereof can be referred to the relevant description of the foregoing embodiments.

[0091] Based on the same inventive concept, an electronic device, which can be a mobile phone or a tablet computer, is provided, which includes the camera module provided in the foregoing embodiments, and the effects thereof relative to the prior art can be referred to the effect analysis of the camera module embodiments.

[0092] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.​

Claims

1. A camera module, characterized in that, The application relates to a camera module, comprising: a first circuit board, a second circuit board, a plurality of flexible connecting bands, a lens, an image sensor and a driving assembly; the first circuit board has opposite first and second surfaces; the second circuit board has opposite third and fourth surfaces and a peripheral surface connecting the third and fourth surfaces, the third surface has the same orientation as the first surface, the fourth surface has the same orientation as the second surface, the third and fourth surfaces are both rectangular, and the third surface is provided with an electric connection structure for electrically connecting the image sensor; a normal projection of the second circuit board on a reference surface is located within the outer contour of a normal projection of the first circuit board on the reference surface, wherein the reference surface is a plane in which the first surface is located; the flexible connecting bands are flexible circuit boards and have at least one bending structure, the first end of the flexible connecting bands is connected to the first circuit board through an anisotropic conductive adhesive film process or an integrated connection, and the second end of the flexible connecting bands is connected to the second circuit board through an anisotropic conductive adhesive film process or an integrated connection, so as to achieve flexible connection and electric connection of the first circuit board and the second circuit board; the normal projection of the plurality of bending structures of each flexible connecting band on the reference surface at least partially overlaps with the normal projection of the surface of the first circuit board or the second circuit board on the reference surface; the image sensor is arranged on the third surface and is electrically connected to the second circuit board through the electric connection structure, and the lens is arranged on the side of the image sensor away from the second circuit board; the driving assembly is used for supporting the second circuit board on the side of the lens close to the image sensor and driving the second circuit board to move relative to the first circuit board in a direction parallel to the reference surface, so as to realize an anti-shake function; each flexible connecting band extends in a direction parallel to the reference surface, each flexible connecting band spirally extends around a central axis of the second circuit board, the central axis is perpendicular to the third surface and passes through the geometric center of the third surface; and the projection of each flexible connecting band in a width direction overlaps with the projection of another flexible connecting band in the width direction, wherein the width direction refers to a direction parallel to the reference surface and perpendicular to the extension direction of the flexible connecting band.

2. The camera module of claim 1, wherein, The middle part of the first circuit board has a first hollow part, and the peripheral surface of the second circuit board is at least partially arranged opposite to the inner peripheral surface of the first hollow part in a direction parallel to the reference surface, and there is an annular gap between the normal projections of the first circuit board and the second circuit board on the reference surface.

3. The camera module of claim 2, wherein, The first hollow part is rectangular, and the inner peripheral surface of the first hollow part has a first sub-side surface corresponding to each side of the first surface; the first end of the flexible connecting band is connected to one of the first sub-side surfaces.

4. The camera module of claim 3, wherein, The first end of each flexible connecting band is formed with a first corner structure bent from the extension direction of the flexible connecting band to the first circuit board.

5. The camera module of claim 3, wherein, The normal projection of each flexible connecting band on the reference surface is located within the annular gap. The second end of each of the flexible connection strips is connected to the outer circumferential surface.

6. The camera module of claim 5, wherein, The outer circumferential surface has a second sub-side corresponding to each side of the first surface; In the two opposite second sub-sides, each of the second sub-sides is connected to at least two flexible connection strips.

7. The camera module of claim 6, wherein, In the two opposite second sub-sides, the flexible connection strips connected to the two second sub-sides respectively are symmetrical about the symmetry axis of the two second sub-sides.

8. The camera module of claim 6, wherein, The second end of each of the flexible connection strips is formed with a second corner structure bent from the extension direction of the flexible connection strip to the second circuit board.

9. The camera module of claim 2, wherein, In the normal direction of the reference surface, the second surface is located on the side of the fourth surface away from the third surface; In the normal direction of the reference surface, the flexible connection strips are located on the side of the fourth surface away from the third surface, the normal projection of the plurality of bending structures of each of the flexible connection strips on the reference surface at least partially overlaps with the normal projection of the fourth surface on the reference surface, and the first end is connected to the inner circumferential surface surrounding the first hollow part and the second end is connected to the fourth surface.

10. The camera module of claim 9, wherein, In the normal direction of the reference surface, the thickness of the flexible connection strips is less than the thickness of the first circuit board, and the flexible connection strips are located between the second surface and the fourth surface; and The first end is connected to the inner circumferential surface, and the minimum distance from the first end to the second surface is less than the minimum distance from the first end to the first surface.

11. The camera module of claim 2, wherein, The third surface is higher than the first surface; In the normal direction of the reference surface, the flexible connection strips are located on the side of the first surface away from the second surface, the second end of each of the flexible connection strips is connected to the outer circumferential surface, and the normal projection of the plurality of bending structures of the flexible connection strips on the reference surface at least partially overlaps with the first surface and is connected to the first surface through the first end.

12. The camera module of claim 11, wherein, In the normal direction of the reference surface, the thickness of the flexible connection strips is less than the thickness of the second circuit board, and the flexible connection strips are located between the first surface and the third surface; and The minimum distance from the second end to the third surface is less than the minimum distance from the second end to the fourth surface.

13. The camera module of claim 1, wherein, The plane in which the first surface is located is arranged opposite to the plane in which the fourth surface is located; The first end of each of the flexible connection strips is connected to the first surface, the second end is connected to the fourth surface, and the normal projection of the plurality of bending structures of the flexible connection strips on the reference surface at least partially overlaps with the normal projection of the fourth surface on the reference surface.

14. The camera module of claim 1, wherein, A second hollow part extending in the extension direction of the flexible connection strip is arranged in the middle of each of the flexible connection strips.

15. The camera module of claim 1, wherein, The included angle between the first end and the second end of each of the flexible connection strips and the connecting line of the center axis is between 90° and 180°, and the connecting line is parallel to the reference surface.

16. The camera module of claim 1, wherein, The driving assembly comprises a support component and a lateral driving component, the lateral driving component is connected to a side of the lens close to the image sensor and is used to move the support component relative to the first circuit board in a direction parallel to the reference surface, and the support component is used to support the second circuit board on the lateral driving component.

17. The camera module of claim 1, wherein, The driving assembly comprises a support component and a lateral driving component; wherein, The support component is used to support the second circuit board on a side of the lens close to the image sensor; The lateral driving component is used to drive the second circuit board to move relative to the first circuit board in a direction parallel to the reference surface.

18. The camera module of claim 17, wherein, The lateral driving component comprises a coil and a magnet, wherein, The coil is arranged on the second circuit board, and the magnet is arranged on the first circuit board; or the magnet is arranged on the second circuit board, and the coil is arranged on the first circuit board; The coil is used to attract or repel the magnet.

19. The camera module of claim 16 or 17, wherein, The lateral driving component comprises an optical anti-shake motor, and the support component comprises a suspension wire.

20. The camera module of claim 16 or 17, wherein, The camera module further comprises a filter holder and an infrared cut filter, the infrared cut filter is located between the lens and the image sensor, and the filter holder supports the infrared cut filter on the third surface; The support component is connected between the lens and the filter holder.

21. The camera module of claim 1, wherein, The camera module further comprises a gold wire, and the image sensor is electrically connected to the electrical connection structure through the gold wire.

22. The camera module of claim 2, wherein, When the first circuit board is provided with the first hollow part, the camera module further comprises a reinforcement plate, the reinforcement plate is arranged on a surface of the first circuit board away from the lens, and the reinforcement plate covers the first hollow part.

23. An electronic device, comprising: The camera module comprises a housing and the camera module according to any one of claims 1 to 22, and the camera module is arranged in the housing. The camera module comprises a housing and the camera module according to any one of claims 1 to 22, and the camera module is arranged in the housing.

Images