Soaking structure and electronic device

Abstract

The present invention discloses a heat spreading structure, which includes a plate body having a heating area and a condensation area located on the periphery of the heating area. The heating area is used to connect to a heat source. The plate body is provided with a plurality of first capillary structures and a plurality of second capillary structures. The plurality of first capillary structures are radially distributed from the heating area to the condensation area. A first liquid channel is formed in the first capillary structure. The second capillary structure extends from the first capillary structure along a first direction or a second direction of the plate body to the condensation area. A second liquid channel is formed in the second capillary structure. A gas channel is formed between two adjacent capillary structures. The first direction is perpendicular to the second direction. Making the first capillary structures radially distributed from the heating area to the condensation area can shorten the path of liquid reflux. Making the second capillary structure extend along the first direction or the second direction can reduce the planning and design difficulty of the distribution of the second capillary structure on the plate body. In addition, the present invention also discloses an electronic device including the heat spreading structure.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation structures, and in particular to a heat spreader structure and an electronic device. Background Art

[0002] During the use of an electronic device, electronic components in the electronic device generate a large amount of heat, causing the ambient temperature of the electronic components to rise. However, if the electronic components are in a high-temperature environment for a long time, the service life of the electronic components will be shortened. In related technologies, in order to take into account the thin and light design of the electronic device, a VC (Vapor Chamber) heat spreader structure is mostly used to dissipate heat from electronic components (such as chips, batteries, etc.). The VC heat spreader structure mainly includes an upper heat conduction sheet and a lower heat conduction sheet. A sealed cavity is formed between the upper heat conduction sheet and the lower heat conduction sheet. At the same time, a plurality of channel structures for guiding a heat-conducting fluid are provided on the upper heat conduction sheet, so that the working fluid can circulate back and forth between the heating area and the condensation area of the heat conduction sheet by using the channel structure. However, since the working cavity is a sealed cavity, the phase change process of the working fluid between liquid and gas in the sealed cavity interferes with each other, affecting the heat conduction rate in the sealed cavity, and further affecting the heat dissipation effect of the heat spreader structure. Summary of the Invention

[0003] Embodiments of the present invention disclose a heat spreader structure and an electronic device, which can enable the phase change process of the working fluid between liquid and gas in the sealed cavity not to interfere with each other, effectively improve the heat conduction rate of the heat spreader structure, and improve the heat dissipation effect of the heat spreader structure.

[0004] To achieve the above object, in a first aspect, the present application discloses a heat spreader structure, including:

[0005] A plate body, the plate body having a heating area and a condensation area located outside the heating area;

[0006] The plate body is provided with a plurality of first capillary structures and a plurality of second capillary structures. The plurality of first capillary structures are radially distributed from the heating area to the condensation area, and a gas channel is formed between two adjacent first capillary structures. A first liquid channel is formed in the first capillary structure;

[0007] Among the multiple first capillary structures, there are multiple second capillary structures between two adjacent first capillary structures. One end of each second capillary structure is disposed adjacent to the first capillary structure, and the other end of each second capillary structure extends to the condensation area along the first direction and / or the second direction of the plate body. A gas channel is formed between two adjacent second capillary structures. The gas channel formed between the second capillary structures communicates with the gas channel formed between the first capillary structures. A second liquid channel for liquid flow is formed in the second capillary structure, and the second liquid channel communicates with the first liquid channel;

[0008] Wherein, the first direction of the plate body is perpendicular to the second direction, the gas is a gaseous working fluid, and the liquid is a liquid working fluid. The working fluid can be a fluid such as water, ethanol or ethylene glycol.

[0009] It can be understood that the heat spreader structure can be applied to an electronic device and is arranged corresponding to the heat source of the electronic device. Among them, the area of the heat spreader structure corresponding to the heat source can be defined as the heating area of the heat spreader structure, and the area of the heat spreader structure far from the heat source or the area located on the periphery of the heat source can be defined as the condensation area.

[0010] By arranging multiple first capillary structures and multiple second capillary structures on the plate body and forming gas channels between two adjacent first capillary structures and second capillary structures, the gas channels are separated from the first liquid channel formed by the first capillary structures themselves and the second liquid channel formed by the second capillary structures themselves, so as to effectively prevent the problem of interference during the liquid-gas phase change of the working fluid, make the phase change of the working fluid occur more smoothly, and effectively improve the heat dissipation effect of the heat spreader structure.

[0011] In addition, by arranging multiple first capillary structures to be radially distributed from the heating area to the condensation area, the path length of the liquid working fluid condensed in the condensation area flowing back to the heating area is greatly reduced, and the heat dissipation efficiency of the heat spreader structure is improved. At the same time, by arranging multiple second capillary structures between two adjacent first capillary structures, one end of each second capillary structure is adjacent to the first capillary structure, and the other end of each second capillary structure extends to the condensation area along the first direction or the second direction of the plate body, so that not only can the liquid flow back to the heating area from any place in the condensation area to avoid dry burning caused by insufficient liquid working fluid in the heating area, but also the distribution of the second capillary structures on the plate body can be made more regular, reducing the difficulty of distribution planning and design of the second capillary structures on the plate body.

[0012] As an alternative embodiment, in the embodiment of the first aspect of the present application, the first capillary structure includes multiple groups of first capillary units, and adjacent two groups of the first capillary units are spaced apart to form the first liquid channel;

[0013] The second capillary structure includes multiple groups of second capillary units, and adjacent two groups of the second capillary units are spaced apart to form the second liquid channel. In this way, the gas channel, the first liquid channel, and the second liquid channel can be spaced apart, effectively preventing the problem of interference during the liquid-gas phase change of the working fluid, making the phase change of the working fluid occur more smoothly, thereby effectively improving the heat dissipation rate of the heat spreader structure and further effectively enhancing the heat dissipation effect of the heat spreader structure.

[0014] As an alternative embodiment, in the embodiment of the first aspect of the present application, one end of the second capillary structure adjacent to the first capillary structure is connected to the second capillary structure, so that the first liquid channel and the second liquid channel can be directly connected, making it easier for the liquid to flow between the first liquid channel and the second liquid channel.

[0015] As an alternative embodiment, in the embodiment of the first aspect of the present application, among the multiple second capillary structures, some of the second capillary structures are first sub-capillary structures, and some of the second capillary structures are second sub-capillary structures. One end of the first sub-capillary structure is connected to the first capillary structure, and the other end of the first sub-capillary structure extends along the first direction of the plate body to the condensation area. One end of the second sub-capillary structure is connected to the first capillary structure, and the other end of the second sub-capillary structure extends along the second direction of the plate body to the condensation area;

[0016] A gas channel is formed between adjacent two first sub-capillary structures, adjacent two second sub-capillary structures, and adjacent first sub-capillary structure and second sub-capillary structure. The second liquid channel of the first sub-capillary structure is communicated with the second liquid channel of the second sub-capillary structure. In this way, the end of the first sub-capillary structure and the second sub-capillary structure extending to the condensation area can flow the liquid working fluid along the second liquid channel formed by the first sub-capillary structure or the second sub-capillary structure to the first liquid channel formed by the first capillary structure, and flow to the heat generation area through the first liquid channel, so that the liquid can flow back to the heat generation area from any place in the condensation area.

[0017] As an alternative embodiment, in the embodiment of the first aspect of the present application, the width b1 of the first capillary structure is the same as the width b2 of the second capillary structure, and the width b1 of the first capillary structure is 0.2 mm - 2.5 mm; the width d of the gas channel is 0.2 mm - 2.5 mm; the width h1 of the first liquid channel is the same as the width h2 of the second liquid channel, and the width h1 of the first liquid channel is 10 μm - 200 μm. Thus, while ensuring that the volumes of the first liquid channel formed by the first capillary structure and the second liquid channel formed by the second capillary structure can meet the usage requirements for ensuring a sufficient amount of liquid reflux, it is possible to avoid the phenomenon that the vaporized working fluid is difficult to be discharged into the gas channel due to the over-width of the first liquid channel or the second liquid channel, resulting in interference in the phase change process of the working fluid between the liquid state and the gaseous state, and affecting the heat conduction rate in the sealed cavity.

[0018] As an alternative embodiment, in the embodiment of the first aspect of the present application, the surface of the plate body provided with the first capillary structure and the second capillary structure is the first surface. The total area obtained by adding the areas of the first capillary structure and the second capillary structure on the first surface is S1, and the total area of the gas channels on the first surface is S2. The ratio range of S1 to S2 is 0.6 - 1.5. Thus, the first plate body can have a sufficient area of the first liquid channel, the second liquid channel, and the gas channel, enabling more working fluid to flow between the heating area and the condensation area, and improving the heat dissipation effect of the heat sink structure.

[0019] As an alternative embodiment, in the embodiment of the first aspect of the present application, on the first surface, the sum of the areas of the first capillary structure and the second capillary structure in the heating area is S3, and the total area of the gas channels in the heating area is S4. The ratio range of S3 to S4 is 1 - 5. Thus, the heating area of the heat sink structure can have a sufficient area of the first liquid channel and the second liquid channel, enabling more liquid to reflux into the heating area, avoiding the occurrence of dry burning in the heating area due to the too-fast vaporization rate of the liquid in the heating area, and improving the heat dissipation effect of the heat sink structure.

[0020] As an alternative embodiment, in the embodiment of the first aspect of the present application, the plate body is a rectangular plate. The plate body has two mutually perpendicular sides. The first direction is parallel to one of the two sides of the plate body, and the second direction is parallel to the other of the two sides of the plate body. In this way, the arrangement of the second capillary structure on the plate body is more regular, facilitating the arrangement of the second capillary structure on the plate body and reducing the processing difficulty of forming the second capillary structure on the plate body.

[0021] As an alternative embodiment, in the embodiment of the first aspect of the present application, the plate body includes a first plate body and a second plate body hermetically connected to the first plate body. The first plate body and the second plate body are provided with the first capillary structure and the second capillary structure. Each of the first capillary structures and the second capillary structures on the first plate body is correspondingly connected to each of the first capillary structures and the second capillary structures on the second plate body. Thus, while ensuring that the thickness of the heat dissipation structure is not increased, the volumes of the gas channel, the first liquid channel, and the second liquid channel are increased to increase the amount of the working fluid that can be sealed in the heat dissipation structure and improve the heat dissipation efficiency of the heat dissipation structure.

[0022] In a second aspect, the present application also discloses an electronic device, which includes a heat source and the heat dissipation structure as described in the first aspect above. The heat source is disposed corresponding to the heat generation area of the heat dissipation structure. By using the heat dissipation structure, the heat source of the electronic device can be quickly dissipated, thereby preventing the problem that the heat source may cause an operating failure due to excessive temperature and improving the reliability of the electronic device. In addition, by adopting the heat dissipation structure, its overall thickness is small, and the space occupied by the electronic device is small, which can meet the requirements of the thin and light design of the electronic device.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] The heat dissipation structure and the electronic device provided by the embodiments of the present invention can realize the spaced arrangement of the gas channel and the liquid channel, effectively prevent the problem of interference during the phase change of the working fluid between the liquid state and the gaseous state, make the phase change of the working fluid occur more smoothly, thereby effectively improving the heat dissipation rate of the heat dissipation structure, and further effectively improving the heat dissipation effect of the heat dissipation structure. In addition, since a plurality of first capillary structures are radially distributed with the heat generation area as the center to the condensation area, the path length of the liquid flowing back from the condensation area to the heat generation area can be shortened, and the heat dissipation efficiency of the heat dissipation structure can be improved. And since a plurality of second capillary structures extend from the first capillary structure along a first direction or a second direction perpendicular to the first direction to the condensation area, in this way, the liquid (i.e., the liquid working fluid) can flow back from any place in the condensation area to the heat generation area to avoid dry burning due to insufficient liquid working fluid in the heat generation area. At the same time, since the second capillary structure extends along the first direction or the second direction of the plate body, the planning and design difficulty of the distribution of the second capillary structure on the plate body can be reduced. Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 is a schematic structural diagram of the heat sink structure disclosed in the embodiments of the present application;

[0027] Figure 2 is a schematic structural diagram of a capillary structure disposed on a first plate body in the embodiments of the present application;

[0028] Figure 3 is Figure 2 an enlarged view of part A in

[0029] Figure 4 is another schematic structural diagram of a capillary structure disposed on a first plate body in the embodiments of the present application;

[0030] Figure 5 is still another schematic structural diagram of a capillary structure disposed on a first plate body in the embodiments of the present application;

[0031] Figure 6 is yet another schematic structural diagram of a capillary structure disposed on a first plate body in the embodiments of the present application;

[0032] Figure 7 is a partial schematic structural diagram of a capillary structure disposed on a first plate body in the embodiments of the present application;

[0033] Figure 8 is a schematic structural diagram of an electronic device disclosed in the embodiments of the present application.

[0034] Reference numerals: 1, heat sink structure; 10, plate body; 10a, heat generating area; 10b, condensation area; 100, first plate body; 101, second plate body; 11, first capillary structure; 110, first capillary unit; 12, second capillary structure; 120, second capillary unit; 120a, sub-capillary unit; 121, first sub-capillary structure; 122, second sub-capillary structure; 1a, gas channel; 1b, first liquid channel; 1c, second liquid channel; 1d, capillary groove; 20, electronic device; 21, heat source. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation.

[0037] Moreover, in addition to being used to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0038] In addition, the terms "mounted", "arranged", "provided with", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "a plurality" is two or more.

[0040] Next, the technical solutions of the present invention will be further described in conjunction with embodiments and drawings.

[0041] In the first aspect of the embodiments of the present application, a heat spreader structure is disclosed. The heat spreader structure disclosed in this embodiment can be applied to an electronic device to dissipate heat from heat sources (such as chips, batteries, etc.) in the electronic device to ensure the normal operation of the electronic device. Specifically, as Figures 1 to 3 shown, the heat spreader structure 1 includes a plate body 10. The plate body 10 has a heat generation area 10a and a condensation area 10b located on the outer periphery of the heat generation area 10a. The plate body 10 is provided with a plurality of first capillary structures 11 and a plurality of second capillary structures 12. The plurality of first capillary structures 11 are radially distributed from the heat generation area 10a to the condensation area 10b, and a gas channel 1a for gas to flow between the heat generation area 10a and the condensation area 10b is formed between two adjacent first capillary structures 11 (as Figure 2(as shown by the space between two adjacent first capillary structures 11 in []) A first liquid channel 1b for allowing liquid to flow between the heating zone 10a and the condensation zone 10b is formed within the first capillary structure 11. Among the plurality of first capillary structures 11, a plurality of second capillary structures 12 are provided between two adjacent first capillary structures 11. One end of the second capillary structure 12 is disposed adjacent to the first capillary structure 11, and the other end of the second capillary structure 12 extends along the first direction X and / or the second direction Y of the plate body 10 to the condensation zone 10b. A gas channel 1a for allowing gas to flow is formed between two adjacent second capillary structures 12 (as shown by the space between two adjacent second capillary structures 12 in []) Figure 2 (as shown by the space between two adjacent second capillary structures 12 in []) A second liquid channel 1c for allowing liquid to flow is formed within the second capillary structure 12. The second liquid channel 1c is in communication with the first liquid channel 1b. The gas channel 1a formed by the first capillary structure 11 is in communication with the gas channel 1a formed by the second capillary structure 12. Wherein, the first direction X of the plate body 10 is perpendicular to the second direction Y, and for the convenience of understanding and distinction, Figure 2 and Figure 3 in [], the first capillary structure 11 is shown by a thick solid line, and the second capillary structure 12 is shown by a thin solid line. It can be understood that the thickness of the solid line is only used to distinguish the distribution positions of the first capillary structure 11 and the second capillary structure 12, and does not indicate the existence or non-existence of differences in the structures of the first capillary structure 11 or the second capillary structure 12.

[0042] Wherein, the gas is a gaseous working fluid, and the liquid is a liquid working fluid. The working fluid can be a fluid such as water, ethanol or ethylene glycol.

[0043] It should be noted that the "adjacent" mentioned above can refer to the situation where two structures are close to each other and there is a gap between the two structures, or it can refer to the situation where two structures are connected. That is, "one end of the second capillary structure 12 is disposed adjacent to the first capillary structure 11" can mean that one end of the second capillary structure 12 is close to the first capillary structure 11, and there is a gap between one end of the second capillary structure 12 and the first capillary structure 11, or it can mean that one end of the second capillary structure 12 is connected to the first capillary structure 11.

[0044] It should also be noted that an included angle θ can be formed between two first capillary structures 11. As long as there is no other first capillary structure 11 within the range of the included angle θ, the two first capillary structures 11 can be regarded as adjacent. Wherein, the included angle θ satisfies: 0° ≤ θ ≤ 360°, that is, the included angle θ can be 0°, 45°, 90°, 135°, 180°, 225°, 270°, 315° or 360°, etc. It can be understood that when the included angle θ is 0°, 180° or 360°, the two first capillary structures 11 are parallel or collinear. As shown in Figure 2 shownFigure 2 As shown, there are four first capillary structures 11. Among these four first capillary structures 11, the included angle θ formed between any two adjacent first capillary structures 11 is approximately 0° or 180°. Among them, a second capillary structure 12 is provided between two adjacent first capillary structures 11 with the included angle θ approximately 180°, and a gas channel 1a is formed between two adjacent first capillary structures 11 with the included angle θ approximately 0°.

[0045] Furthermore, a second capillary structure 12 is provided between two adjacent first capillary structures 11. In other words, a second capillary structure 12 can be provided between all adjacent first capillary structures 11, or a second capillary structure 12 can be provided between some adjacent first capillary structures 11. For example, as Figure 2 shown, Figure 2 as shown, there are four first capillary structures 11. These four first capillary structures 11 form four pairs of adjacent first capillary structures 11. Among them, a second capillary structure 12 is provided between two pairs of adjacent first capillary structures 11, and only a gas channel 1a is formed between the other two pairs of adjacent first capillary structures 11, without a second capillary structure 12. It can be understood that the number of first capillary structures 11 is not limited to four. The foregoing examples are only relatively preferred embodiments and should not be construed as limitations on the technical solution.

[0046] As can be seen from the foregoing, since the heat spreader structure 1 can be applied to an electronic device and is arranged corresponding to the heat source of the electronic device, the position of the heat spreader structure 1 corresponding to the heat source can be defined as the heat generation area 10a of the heat spreader structure 1. This heat generation area 10a is mainly used for evaporating the liquid working fluid, while the area of the heat spreader structure 1 far from the heat source or the area located on the outer periphery of the heat source can be defined as the condensation area 10b. This condensation area 10b is mainly used for condensing the gaseous working fluid into a liquid working fluid, so that the liquid working fluid can flow between the condensation area 10b and the heat generation area 10a to achieve heat dissipation.

[0047] That is, by adopting the heat spreader structure 1 of the embodiment of the present application, a gas channel 1a is formed between two adjacent first capillary structures 11 and the second capillary structure 12, so that the gas channel 1a is separated from the first liquid channel 1b formed by the first capillary structure 11 itself and the second liquid channel 1c formed by the second capillary structure 12 itself. Thereby, it can effectively prevent the problem of interference during the phase change of the working fluid between the liquid state and the gaseous state, make the occurrence of the phase change of the working fluid smoother, and effectively improve the heat dissipation effect of the heat spreader structure 1.

[0048] In addition, by arranging a plurality of first capillary structures 11 to be radially distributed around the heating area 10a towards the condensation area 10b, the path length of the liquid working fluid condensed in the condensation area 10b flowing back to the heating area 10a is significantly reduced, improving the heat dissipation efficiency of the heat dissipation structure 1. At the same time, by arranging a plurality of second capillary structures 12 between two adjacent first capillary structures 11, one end of the second capillary structure 12 is adjacent to the first capillary structure 11, and the other end of the second capillary structure 12 extends along the first direction X or the second direction Y of the plate body 10 to the condensation area 10b. Thus, not only can the liquid (i.e., the liquid working fluid) flow back to the heating area 10a from any place in the condensation area 10b to avoid dry burning due to insufficient liquid working fluid in the heating area 10a, but also the distribution of the second capillary structures 12 on the plate body 10 can be made more regular, reducing the difficulty of the distribution planning and design of the second capillary structures 12 on the plate body 10.

[0049] Furthermore, by connecting the first liquid channel 1b and the second liquid channel 1c, the liquid working fluid can flow along the first liquid channel 1b to the second liquid channel 1c and then flow into the heating area 10a through the second liquid channel 1c, so that the liquid (i.e., the liquid working fluid) can flow back to the heating area 10a from any place in the condensation area 10b with a shorter path. Correspondingly, by connecting the gas channels 1a formed by the first capillary structures 11 and the gas channels 1a formed by the second capillary structures 12, the air pressure between the gas channels 1a can be balanced, avoiding the gas in the gas channel 1a with a higher air pressure diffusing into the adjacent gas channel 1a due to different air pressures between different gas channels 1a, thereby avoiding interference during the liquid-gas phase change process of the working fluid.

[0050] It can be understood that the gas channels 1a are formed between two adjacent first capillary structures 11 and the second capillary structures 12. Since the first capillary structures 11 and the second capillary structures 12 are arranged on the plate body 10, the position on the plate body 10 where the first capillary structures 11 and the second capillary structures 12 are not arranged forms the gas channels 1a, the position where the first capillary structures 11 are located forms the first liquid channels 1b, and the position where the second capillary structures 12 are located forms the second liquid channels 1c. In this way, there is no need to additionally arrange the gas channels 1a, and at the same time, the gas channels 1a can be separated from the first liquid channels 1b and the second liquid channels 1c, so that the working fluid can be free from mutual interference during the liquid-gas phase change process.

[0051] In some embodiments, the plate body 10 of the heat spreader structure 1 may include a first plate body 100 and a second plate body 101, and the first plate body 100 and the second plate body 101 are hermetically connected to each other to form a sealed cavity therebetween. Specifically, when arranging the first capillary structure 11 and the second capillary structure 12, it can be arranged on the first plate body 100, or on the second plate body 101, or on both the first plate body 100 and the second plate body 101 at the same time (for example, as Figure 1 shown, Figure 1 it shows that both the first plate body 100 and the second plate body 101 are provided with the first capillary structure 11 and the second capillary structure 12), so that the first capillary structure 11 and the second capillary structure 12 can be selectively arranged on the first plate body 100 and / or the second plate body 101 according to the actual situation, and the application range of the heat spreader structure 1 is wider.

[0052] As Figure 1 shown, further, when both the first plate body 100 and the second plate body 101 are provided with the first capillary structure 11 and the second capillary structure 12, each first capillary structure 11 on the first plate body 100 is correspondingly connected to each first capillary structure 11 on the second plate body 101, and each second capillary structure 12 on the first plate body 100 is correspondingly connected to each second capillary structure 12 on the second plate body 101, so that the gas channels 1a on the first plate body 100 and the second plate body 101 can just be correspondingly communicated, and at the same time, the first liquid channels 1b and the second liquid channels 1c on the first plate body 100 and the second plate body 101 can also just be correspondingly communicated. In this way, compared with only arranging the first capillary structure 11 and the second capillary structure 12 on the first plate body 100 or only on the second plate body 101, a sealed cavity with a larger volume can be obtained while ensuring that the total thickness of the plate body 10 remains unchanged, so that the volumes of the gas channels 1a, the first liquid channels 1b and the second liquid channels 1c can be increased, so as to increase the amount of the working fluid that can be sealed in the heat spreader structure 1 and improve the heat dissipation efficiency of the heat spreader structure 1.

[0053] Further, in order to match the heat source of the electronic device, the whole plate body 10 can be circular, quasi-circular (such as oval) plate-shaped or polygonal plate-shaped such as rectangular, regular pentagon, regular hexagon or irregular polygon. That is, both the first plate body 100 and the second plate body 101 can be circular, quasi-circular plate-shaped or polygonal plate-shaped such as rectangular. Considering that the overall thickness of the heat spreader structure 1 is small, that is, the heat spreader structure 1 is an ultra-thin heat spreader structure 1, the plate body 10 can be in the form of a thin sheet. Specifically, the first plate body 100 can be made of a metal sheet, and exemplary ones can be copper sheet, stainless steel sheet, aluminum sheet, etc. Correspondingly, the second plate body 101 can also be made of copper sheet, stainless steel sheet or aluminum sheet, etc.

[0054] In an optional example, the plate body 10 may be a rectangular sheet, in which case the plate body 10 has two perpendicular sides, the first direction X may be parallel to one of the two sides of the plate body 10, and the second direction Y may be parallel to the other of the two sides of the plate body 10. For example, the plate body 10 may be a rectangular sheet, in which case one of the two perpendicular sides of the plate body 10 is a long side and the other is a short side, the first direction X may be parallel to the length direction of the plate body 10, and the second direction Y may be parallel to the width direction of the plate body 10, that is, the second capillary structure 12 may extend along the length direction of the plate body 10 or along the width direction of the plate body 10. In this way, the second capillary structure 12 is arranged more regularly on the plate body 10, which facilitates the arrangement of the second capillary structure 12 on the plate body 10 and reduces the processing difficulty of forming the second capillary structure 12 on the plate body 10.

[0055] In another optional example, the plate body 10 is a circular sheet or an elliptical sheet, and the first direction X and the second direction Y are two radial directions perpendicular to the plate body 10, respectively. In this way, the arrangement of the second capillary structure 12 on the plate body 10 is more regular, which facilitates the arrangement of the second capillary structure 12 on the plate body 10 and reduces the processing difficulty of forming the second capillary structure 12 on the plate body 10.

[0056] The following description will take the first plate 100 as a rectangular sheet, the first plate 100 is provided with the first capillary structure 11 and the second capillary structure 12 , the first direction X is the length direction of the first plate 100 , and the second direction Y is the width direction of the first plate 100 as an example.

[0057] Optionally, the heating zone 10a can be roughly located in the middle of the plate body 10, and the condensation zone 10b can be located at the periphery of the heating zone 10a, that is, the condensation zone 10b can be located at the edge of the plate body 10. In this way, multiple first fine structures extend toward the edge of the plate body 10 (that is, the condensation zone 10b) with the middle of the plate body 10 (that is, the heating zone 10a) as the center. In this case, when the working fluid is in liquid or gaseous state, the liquid flow path or gaseous diffusion path of the working fluid is shorter, which can increase the reflux rate of the working fluid, thereby improving the heat dissipation efficiency of the heat equalizing structure 1.

[0058] It is understandable that in other embodiments, the heating area 10a may also be located near the edge of the board 10. In other words, the heating area 10a may be located in the middle of the board 10 or near the edge of the board 10, so that the heat-spreading structure 1 can be set according to the positions of different heat sources of the electronic device, thereby improving the applicability of the heat-spreading structure 1.

[0059] In this embodiment, the heating area 10 a is roughly located in the middle of the plate body 10 as an example. The heating area 10 a can be roughly formed into a circular area or a square area.

[0060] Optionally, one end of the second capillary structure 12 adjacent to the first capillary structure 11 is connected to the second capillary structure 12, so that the first liquid channel 1b can be directly connected to the second liquid channel 1c, making it easier for the liquid to flow between the first liquid channel 1b and the second liquid channel 1c.

[0061] It can be understood that a gas channel 1a can also be formed between adjacent first capillary structures 11 and second capillary structures 12 for gas circulation, such as Figure 4 shown, as Figure 4 illustrates that a gas channel 1a is formed between adjacent first capillary structures 11 and second capillary structures 12, where Figure 4 the blank part in is the gas channel 1a, the part filled with a cross pattern is the first capillary structure 11, the part filled with a dot matrix is the second capillary structure 12, and the boundary between the first capillary structure 11 and the second capillary structure 12 is roughly marked by a dotted line.

[0062] Optionally, the edges of the first capillary structure 11 and the second capillary structure 12 can be zigzag or wavy, so as to increase the contact area between the first capillary structure 11 and the second capillary structure 12 and the gas channel 1a respectively, thereby increasing the contact area between the first liquid channel 1b and the second liquid channel 1c and the gas channel 1a respectively, making it easier for the working fluid vaporized in the first liquid channel 1b or the second liquid channel 1c to move from the first liquid channel 1b or the second liquid channel 1c to the gas channel 1a, further preventing the problem of interference during the liquid-gas phase change process of the working fluid and improving the heat dissipation effect of the heat sink structure 1. It can be understood that in other embodiments, the edges of the first capillary structure 11 and the second capillary structure 12 can also be straight.

[0063] In some embodiments, to meet different usage requirements, multiple second capillary structures 12 can all extend along the first direction X, or can all extend along the second direction Y, or, among multiple second capillary structures 12, some second capillary structures 12 can extend along the first direction X and another part of the second capillary structures 12 can extend along the second direction Y.

[0064] In an optional example, one end of multiple second capillary structures 12 is adjacent to the first capillary structure 11, and the other ends of multiple second capillary structures 12 all extend along the first direction X of the plate body 10 to the condensation area 10b, so that the distribution mode of the second capillary structures 12 is the simplest, to minimize the distribution design difficulty of the second capillary structures 12, such as Figure 2 shown in Figure 4 and Figure 2 shown in Figure 4 respectively illustrate two structures in which multiple second capillary structures 12 all extend along the first direction X.

[0065] Please refer to Figure 5 and Figure 6 , in another alternative example, among the plurality of second capillary structures 12, some of the second capillary structures 12 are first sub-capillary structures 121, and the other part of the second capillary structures 12 are second sub-capillary structures 122. One end of the first sub-capillary structure 121 is connected to the first capillary structure 11, and the other end of the first sub-capillary structure 121 extends along the first direction X of the plate body 10 to the condensation area 10b. One end of the second sub-capillary structure 122 is connected to the first capillary structure 11, and the other end of the second sub-capillary structure 122 extends along the second direction Y of the plate body 10 to the condensation area 10b. Gas channels 1a are formed between two adjacent first sub-capillary structures 121, between two adjacent second sub-capillary structures 122, and between an adjacent first sub-capillary structure 121 and a second sub-capillary structure 122. The second liquid channel 1c of the first sub-capillary structure 121 communicates with the second liquid channel 1c of the second sub-capillary structure 122. In this way, the ends of the first sub-capillary structure 121 and the second sub-capillary structure 122 that extend to the condensation area 10b can flow the liquid working fluid along the second liquid channel 1c formed by the first sub-capillary structure 121 or the second sub-capillary structure 122 to the first liquid channel 1b formed by the first capillary structure 11, and flow through the first liquid channel 1b into the heating area 10a, so that the liquid (i.e., the liquid working fluid) can flow back from any place in the condensation area 10b to the heating area 10a, such as Figure 5 and Figure 6 shown Figure 5 and Figure 6 respectively show the structures of two second capillary structures 12 including a first sub-capillary structure 121 and a second sub-capillary structure 122, where Figure 5 and Figure 6 the blank parts are the gas channels 1a, the parts filled with cross patterns are the first capillary structures 11, and the parts filled with dot matrices are the second capillary structures 12.

[0066] It can be understood that both the first sub-capillary structure 121 and the second sub-capillary structure 122 have second capillary units 120, so that partial second liquid channels 1c can be formed inside the first sub-capillary structure 121 and the second sub-capillary structure 122.

[0067] In some embodiments, the gas channels 1a formed between the first sub-capillary structure 121 and the second sub-capillary structure 122 can be partially formed to be radially distributed from the heating area 10a to the condensation area 10b, so as to shorten the diffusion path of the gas, enable the gas to quickly diffuse from the heating area 10a to the condensation area 10b for condensation, and thus improve the heat dissipation efficiency of the heat sink structure 1, such as Figure 6 shown Figure 6It shows that among multiple first capillary structures 11, a substantially square space is formed by enclosing the edges of two adjacent first capillary structures 11 and the first plate body 100. Multiple first sub-capillary structures 121 are spaced apart and distributed within this square space, and all of these multiple first sub-capillary structures 121 extend from one of the first capillary structures 11 towards the condensation area 10b. Multiple second sub-capillary structures 122 are spaced apart and distributed within this square space, and all of these multiple second sub-capillary structures 122 extend from another first capillary structure 11 towards the condensation area 10b. The ends of these multiple first sub-capillary structures 121 extending along the first direction X are spaced apart from the ends of these multiple second sub-capillary structures 122 extending along the second direction, forming a gas channel 1a that is radially distributed from the self-heating area 10a to the condensation area.

[0068] Please refer to Figure 2 、 Figure 3 and Figure 7 specifically, each first capillary structure 11 includes multiple groups of first capillary units 110. There is a gap between two adjacent groups of first capillary units 110 to form a first liquid channel 1b for liquid to flow between the self-heating area 10a and the condensation area 10b (as shown by the gap between two adjacent first capillary units 110 in Figure 3 ). Each second capillary structure 12 includes multiple groups of second capillary units 120. There is a gap between two adjacent groups of second capillary units 120 to form a second liquid channel 1c for liquid to flow. The widths of the first liquid channel 1b and the second liquid channel 1c are relatively small, so that the siphon principle can be utilized to enable the liquid located in the condensation area 10b to flow back to the self-heating area 10a along the first liquid channel 1b or along the second liquid channel 1c and the first liquid channel 1b.

[0069] It can be understood that the specific structure of the second capillary structure 12 is substantially the same as that of the first capillary structure 11. The following will take the second capillary structure 12 as an example for illustration.

[0070] Furthermore, each group of second capillary units 120 can include multiple sub-capillary units 120a. There is a capillary groove 1d between two adjacent sub-capillary units 120a, and this capillary groove 1d is connected to the second liquid channel 1c, so that the second liquid channels 1c of each second capillary structure 12 are connected by using the capillary groove 1d, enabling the liquid working fluid to flow in each second liquid channel 1c, which is beneficial for the working fluid to flow faster between the self-heating area 10a and the condensation area 10b, thereby improving the capillary effect of the second capillary structure 12.

[0071] In some embodiments, among two adjacent sets of second capillary units 120, the number of sub-capillary units 120a included in each set of second capillary units 120 may be the same or different. For example, each set of second capillary units 120 may include 30 sub-capillary units 120a from the heat generation area 10a to the condensation area 10b. Alternatively, among two adjacent sets of second capillary units 120, the number of sub-capillary units 120a included in one set of second capillary units 120 may be 30, and the number of sub-capillary units 120a of the other set of second capillary units 120 may be 40. That is, the number of sub-capillary units 120a included in each set of second capillary units 120 can be adjusted according to actual situations, and this embodiment does not make specific limitations thereon.

[0072] Further, among two adjacent sets of second capillary units 120, the capillary grooves 1d formed by two adjacent sub-capillary units 120a of one set of second capillary units 120 are staggeredly arranged with the capillary grooves 1d formed by two adjacent sub-capillary units 120a of the other set of second capillary units 120. In this way, by using each staggeredly arranged capillary groove 1d, and each capillary groove 1d is communicated with the second liquid channel 1c, the liquid working fluid can rapidly flow back to the second liquid channel 1c through each capillary groove 1d, realizing the rapid condensation and reflux of the liquid working fluid. It can be understood that in other embodiments, the capillary grooves 1d formed by two adjacent sub-capillary units 120a of each set of second capillary units 120 may also be correspondingly arranged.

[0073] In some embodiments, the surface of the first plate body 100 provided with the first capillary structure 11 and the second capillary structure 12 is the first surface. The total area of the first capillary structure 11 and the second capillary structure 12 on the first surface is S1, and the total area of the gas channels 1a on the first surface is S2. In order to avoid the dry burning phenomenon in the heat generation area 10a caused by too small a liquid channel area and too little liquid return flow, or to avoid the gas not being able to fully move to the condensation area 10b due to too small an air channel area, resulting in insufficient liquefaction of the gas and too little returned liquid volume causing the dry burning phenomenon, the ratio range of S1 to S2 may be 0.6 - 1.5. Exemplarily, the ratio of S1 to S2 can be 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, or 1.5, etc. Thus, the first plate body 100 can have sufficient areas of the first liquid channel 1b, the second liquid channel 1c, and the gas channel 1a, enabling more working fluid to flow between the heat generation area 10a and the condensation area 10b and improving the heat dissipation effect of the heat dissipation structure 1.

[0074] In some embodiments, since the heating zone 10a is close to the heat source, when the heat spreader structure 1 is operating, the ambient temperature in the heating zone 10a is the highest, and the speed of liquid vaporization is the fastest. Therefore, in order to avoid dry burning in the heating zone 10a due to too small a liquid channel area and too little liquid return flow, on the first surface, the total area of the capillary structure in the heating zone 10a is S3, and the total area of the gas channel 1a in the heating zone 10a is S4. The ratio range of S3 to S4 can be 1 - 5. Exemplarily, the ratio of S3 to S4 can be 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, or 5.0, etc. Thus, there can be a sufficient area of the first liquid channel 1b and the second liquid channel 1c in the heating zone 10a of the heat spreader structure 1, enabling more liquid to flow back into the heating zone 10a, avoiding dry burning in the heating zone 10a due to too fast a vaporization rate of the liquid in the heating zone 10a, and improving the heat dissipation effect of the heat spreader structure 1.

[0075] It can be understood that when only the first capillary structure 11 is provided in the heating zone 10a of the first plate body 100, S3 is the total area of the first capillary structure 11 in the heating zone 10a. When both the second capillary structure 12 and the first capillary structure 11 are provided in the heating zone 10a of the first plate body 100, S3 is the total area of the second capillary structure 12 and the first capillary structure 11 in the heating zone 10a.

[0076] In some embodiments, the width b1 of the first capillary structure 11 and the width b2 of the second capillary structure 12 can be the same or different. In an alternative example, the width b1 of the first capillary structure 11 can be wider than the width b2 of the second capillary structure, thereby increasing the volume of the first liquid channel 1b formed by the first capillary structure 11, enabling the first capillary structure 11 to accommodate the liquid flowing in from each of the second capillary structures 12, and avoiding liquid stagnation in the second liquid channels 1c formed by the second capillary structures 12 due to too little liquid capacity in the first liquid channel 1b formed by the first capillary structure 11, so as to ensure a relatively fast liquid return speed and thus improve the heat dissipation efficiency of the heat spreader structure 1.

[0077] In another alternative example, the width b1 of the first capillary structure 11 is the same as the width b2 of the second capillary structure, which can further simplify the distribution planning and design of the first capillary structure 11 and the second capillary structure 12.

[0078] In this embodiment, it is taken as an example that the width b1 of the first capillary structure 11 is the same as the width b2 of the second capillary structure 12. In some embodiments, in order to ensure that the volume of the second liquid channel 1c formed by the second capillary structure 12 can meet the usage requirement of ensuring a sufficient amount of liquid reflux, while avoiding the phenomenon that the vaporized working fluid is difficult to be discharged into the gas channel 1a due to the over-wide second liquid channel 1c, which causes interference in the phase change process of the working fluid between the liquid state and the gas state, affects the heat conduction rate in the sealed cavity, and further affects the heat dissipation effect of the heat sink structure 1, the width b2 of each second capillary structure 12 can be 0.2 mm - 2.5 mm. For example, the width b2 of each second capillary structure 12 can be 0.2 mm, 0.4 mm, 0.6 mm, 1.0 mm, 1.5 mm, 2.0 mm or 2.5 mm, etc.

[0079] Optionally, in order to ensure that the gas channel 1a formed between two adjacent second capillary structures 12 can meet the usage requirement that the gaseous working fluid can flow rapidly from the heating area 10a to the condensation area 10b, while avoiding the phenomenon that the liquid formed by the condensation of the working fluid in the over-wide gas channel 1a stays in the gas channel 1a because it cannot contact the second liquid channel 1c, which affects the reflux of the liquid and thus affects the heat dissipation effect of the heat sink structure 1, the width d of each gas channel 1a can be 0.2 mm - 2.5 mm. For example, the width d of each gas channel 1a can be 0.2 mm, 0.4 mm, 0.6 mm, 1.0 mm, 1.5 mm, 2.0 mm or 2.5 mm, etc.

[0080] Optionally, the width h2 of the second liquid channel 1c can be the same as the width h1 of the first liquid channel 1b and the width h3 of the capillary groove 1d, and the width h2 of the second liquid channel 1c can meet 10 μm - 200 μm. For example, the width h2 of the second liquid channel 1c can be 10 μm, 30 μm, 50 μm, 70 μm, 90 μm, 110 μm, 150 μm or 200 μm, etc. The width h2 of the second liquid channel 1c should not be too large. If the width h2 of the second liquid channel 1c is too large, the capillary force of the second liquid channel 1c is insufficient, which may affect the flow of the liquid working fluid in the second liquid channel 1c. And if the width h2 of the second liquid channel 1c is too small, the processing difficulty is relatively large when forming the second liquid channel 1c on the plate body 10. Therefore, when forming the second liquid channel 1c between two adjacent groups of second capillary units 120, the width h2 of the second liquid channel 1c can be set at 10 μm - 200 μm.

[0081] By adopting the heat-distributing structure 1 disclosed in the embodiment of the present application, a gas channel 1a is formed between two adjacent first capillary structures 11 and the second capillary structure 12, and the gas channel 1a is separated from the first liquid channel 1b and the second liquid channel 1c, thereby effectively preventing the working fluid from interfering with each other during the phase change between liquid and gas, making the phase change of the working fluid smoother, and effectively improving the heat dissipation effect of the heat-distributing structure 1.

[0082] Furthermore, by arranging a plurality of first capillary structures 11 to be radially distributed toward the condensation zone 10b with the heating zone 10a as the center, the path length of the liquid working fluid condensed in the condensation zone 10b and flowing back to the heating zone 10a is greatly reduced, thereby improving the heat dissipation efficiency of the heat-averaging structure 1; by arranging a plurality of second capillary structures 12 between two adjacent first capillary structures 11, one end of the second capillary structure 12 is adjacent to the first capillary structure 11, and the other end of the second capillary structure 12 extends to the condensation zone 10b along the first direction X or the second direction Y of the plate body 10, so that not only can the liquid flow back from any point of the condensation zone 10b through the second capillary structure 12 to the first capillary structure 11 and flow back to the heating zone 10a, thereby avoiding the situation of dry burning due to insufficient liquid working fluid in the heating zone 10a, but also the distribution of the second capillary structure 12 on the plate body 10 can be made more regular, thereby reducing the difficulty of distribution planning and design of the second capillary structure 12 on the plate body 10.

[0083] Second, see Figure 8 The present application also discloses an electronic device 2, which includes a heat source 21 and a heat-spreading structure 1 as described in the first aspect above. The heat-spreading structure 1 is connected to the heat source 21. Specifically, the electronic device 2 may include but is not limited to a smart phone, a smart watch, a tablet computer, a handheld game console, etc. The heat source 21 may be an electronic device in the electronic device 2 that emits heat during operation, and may be exemplarily a battery, a chip (or a motherboard), a camera, a flash, a speaker, etc.

[0084] In actual settings, since the heat source 21 is located inside the electronic device 2, the heat equalizing structure 1 is also correspondingly arranged inside the electronic device 2. The heat equalizing structure 1 can be connected to the heat source 21 by being directly attached to the heat source 21, so that as much heat as possible can be conducted to the heat equalizing structure 1 for condensation, thereby achieving heat dissipation and cooling effects.

[0085] The electronic device 2 disclosed in the second aspect of the embodiments of the present application can achieve the effects of rapid heat dissipation and cooling by arranging the heat sink structure 1 to process the heat source 21. In addition, since the overall thickness of the heat sink structure 1 is very thin and light, setting it in the electronic device 2 occupies less space of the electronic device 2. Therefore, the heat sink structure 1 can be applied to electronic devices 2 with high requirements for thin and light design, and has a wide range of applications.

[0086] The heat sink structure and the electronic device disclosed in the embodiments of the present invention have been introduced in detail above. Specific examples are used in this article to elaborate on the principles and implementation manners of the present invention. The description of the above embodiments is only used to help understand the heat sink structure and the electronic device of the present invention and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A soaking structure, characterized in that, Comprising: a plate body, the plate body having a heating area and a condensation area located on the outer periphery of the heating area; The plate body is provided with a plurality of first capillary structures and a plurality of second capillary structures. The plurality of first capillary structures are radially distributed from the heating area to the condensation area with the heating area as the center. Both the heating area and the condensation area have the first capillary structures. A gas channel is formed between two adjacent first capillary structures, and a first liquid channel is formed within the first capillary structure; Among the plurality of first capillary structures, a plurality of second capillary structures are provided between two adjacent first capillary structures. One end of the second capillary structure is arranged adjacent to the first capillary structure, and the other end of the second capillary structure extends to the condensation area along the first direction and / or the second direction of the plate body. A gas channel is formed between two adjacent second capillary structures. The gas channel formed between the second capillary structures is communicated with the gas channel formed between the first capillary structures. A second liquid channel is formed within the second capillary structure, and the second liquid channel is communicated with the first liquid channel; Wherein, the first direction of the plate body is perpendicular to the second direction.

2. The soaking structure according to claim 1, wherein The first capillary structure includes a plurality of groups of first capillary units, and a first liquid channel is formed by being spaced between two adjacent groups of first capillary units; The second capillary structure includes a plurality of groups of second capillary units, and a second liquid channel is formed by being spaced between two adjacent groups of second capillary units.

3. The soaking structure according to claim 1, characterized in that, One end of the second capillary structure adjacent to the first capillary structure is connected to the second capillary structure.

4. The soaking structure according to claim 3, characterized in that, Among the plurality of second capillary structures, some of the second capillary structures are first sub-capillary structures, and some of the second capillary structures are second sub-capillary structures. One end of the first sub-capillary structure is connected to the first capillary structure, and the other end of the first sub-capillary structure extends to the condensation area along the first direction of the plate body. One end of the second sub-capillary structure is connected to the first capillary structure, and the other end of the second sub-capillary structure extends to the condensation area along the second direction of the plate body; A gas channel is formed between two adjacent first sub-capillary structures, between two adjacent second sub-capillary structures, and between an adjacent first sub-capillary structure and a second sub-capillary structure. The second liquid channel of the first sub-capillary structure is communicated with the second liquid channel of the second sub-capillary structure.

5. The soaking structure according to any one of claims 1-4, characterized in that The width b1 of the first capillary structure is the same as the width b2 of the second capillary structure, and the width b1 of the first capillary structure is 0.2 mm - 2.5 mm; the width d of the gas channel is 0.2 mm - 2.5 mm; the width h1 of the first liquid channel is the same as the width h2 of the second liquid channel, and the width h1 of the first liquid channel is 10 μm - 200 μm.

6. The soaking structure according to any one of claims 1-4, characterized in that, The surface of the plate body provided with the first capillary structure and the second capillary structure is the first surface. The sum of the areas of the first capillary structure and the second capillary structure on the first surface is S1, and the total area of the gas channels on the first surface is S2. The ratio range of S1 to S2 is 0.6 - 1.

5.

7. The soaking structure according to claim 6, characterized in that, On the first surface, the sum of the areas of the first capillary structure and the second capillary structure in the heating area is S3, and the total area of the gas channels in the heating area is S4. The ratio range of S3 to S4 is 1 - 5.

8. The soaking structure according to any one of claims 1-4, characterized in that, The plate body is a rectangular plate. The plate body has two perpendicular sides. The first direction is parallel to one of the two sides of the plate body, and the second direction is parallel to the other of the two sides of the plate body.

9. The soaking structure according to any one of claims 1-4, characterized in that, The plate body includes a first plate body and a second plate body hermetically connected to the first plate body. The first plate body and the second plate body are provided with the first capillary structure and the second capillary structure. Each of the first capillary structures and the second capillary structures on the first plate body is correspondingly connected to each of the first capillary structures and the second capillary structures on the second plate body.

10. An electronic device, characterized in that, It includes a heat source and a heat dissipation structure according to any one of claims 1 - 9, and the heat source is arranged corresponding to the heating area of the heat dissipation structure.

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