Apparatus and method of manufacturing display device and method of manufacturing mask assembly

Abstract

Disclosed are an apparatus for manufacturing a display device, a method of manufacturing a mask assembly, and a method of manufacturing a display device. The apparatus for manufacturing a display device includes a mask assembly, wherein the mask assembly includes a mask frame including an open area, a first mask disposed on the mask frame, the first mask including at least one opening, a second mask disposed on the first mask, the second mask including a mesh portion having a mesh shape and a blocking member shielding a portion of the mesh portion, and a first support to support a display substrate on the second mask and to separate the display substrate from the second mask, wherein the blocking member overlaps the opening.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0021769, filed on February 21, 2020, which is incorporated herein by reference for all purposes, as fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention generally relate to display devices, and more specifically, to apparatus for manufacturing display devices, methods for manufacturing mask assemblies, and methods for manufacturing display devices. Background Technology

[0004] In recent years, the applications of display devices have diversified. Furthermore, as the thickness and weight of display devices have decreased, their applications have expanded.

[0005] As the display area in such a display device is increased, various functions for connecting or linking other devices to the display device have been developed. As a method for adding various functions when increasing the display area, display devices having areas for adding various functions and image display within the display area have been studied.

[0006] An organic light-emitting display device, as an example of a display device, may include pixel electrodes and counter electrodes. Counter electrodes can be formed in various ways, one of which is by depositing a deposition material onto a surface. In this deposition method, counter electrodes can be formed by depositing the deposition material onto the entire surface of a substrate using a common mask. A shielding portion provided to block the opening space in the common mask can be used to form certain features, such as openings for cameras and sensors.

[0007] The information disclosed above in the background section is only for understanding the background of the inventive concept, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0008] The applicant discovered that when the shielding portion is fixed by ribs or similar structures, the deposition material on the ribs is not deposited across the entire display substrate. Therefore, another mask assembly must be used to redeposit the deposition material, potentially increasing the processing time for depositing the material onto the display substrate.

[0009] The apparatus for manufacturing a display device, as well as the method for manufacturing a mask assembly and a display device, constructed according to the principles and exemplary embodiments of the present invention, can provide high transmittance in the transmissive region within the display area. For example, the mesh portion of a mask having a shielding portion can be fixed to a mesh portion without any supporting ribs or the like. Therefore, uniform deposition can be achieved on substantially the entire display substrate through a single deposition process, and the efficiency of the method for manufacturing a display device can be improved.

[0010] Additional features of the inventive concept will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the inventive concept.

[0011] According to one aspect of the present invention, an apparatus for manufacturing a display device includes: a mask assembly, wherein the mask assembly includes: a mask frame including an opening region; a first mask disposed on the mask frame, the first mask including at least one opening; a second mask disposed on the first mask, the second mask including a blocking member having a grid portion having a grid shape and a portion of the shielding grid portion; and a first support for supporting a display substrate on the second mask and separating the display substrate from the second mask, wherein the blocking member overlaps with the opening.

[0012] The thickness of the mask frame can be greater than the thickness of the first mask or the thickness of the second mask, and the first support can couple the second mask to the mask frame.

[0013] The first support, the second mask, and the mask frame can be coupled to each other.

[0014] The first support may include a substrate support that is at least partially directly coupled to the mask frame.

[0015] The first support can be set along the mask frame.

[0016] The first support may include a first substrate support and a second substrate support, wherein the first substrate support may be spaced apart from the opening region and may be disposed along the mask frame, and the second substrate support may intersect with the opening region.

[0017] The mesh portion may include a plurality of first conductors extending in a first direction and a plurality of second conductors extending in a second direction intersecting the first direction, wherein the plurality of first conductors and the plurality of second conductors may define a plurality of mesh openings, wherein the blocking member may completely shield at least one of the plurality of mesh openings.

[0018] The blocking member may include a shielding portion having a generally circular shape in the plan view.

[0019] The apparatus may further include: a chamber in which a mask assembly may be disposed; and a deposition source disposed in the chamber, the deposition source being configured to supply deposition material into the chamber; wherein the mask assembly may be oriented to face the deposition source so that the deposition material passes through the mask assembly to reach the display substrate.

[0020] According to another aspect of the present invention, a method for manufacturing a mask assembly for producing a display device includes the following steps: fixing a first mask including an opening to a mask frame including an opening region; arranging a second mask on the first mask, the second mask including a mesh portion having a grid shape; coupling a first support to the second mask; and a blocking member forming part of the shielding mesh portion.

[0021] The thickness of the mask frame can be greater than the thickness of the first mask or the thickness of the second mask, wherein the step of coupling the first support can include coupling the first support, the second mask and the mask frame to each other.

[0022] The steps of coupling the first support may include coupling the first support, the second mask, and the mask frame by welding.

[0023] The first support may include multiple substrate supports, wherein one of the multiple substrate supports may intersect with the opening region.

[0024] The blocking components are formed by electroforming.

[0025] The blocking member may include a shielding portion formed by: forming photoresist on a second mask; overlapping an exposure mask with the second mask to expose at least a portion of the photoresist; and developing the photoresist.

[0026] The exposure mask may include an exposure opening, wherein a portion of the photoresist that may overlap with the exposure opening may be exposed when the exposure mask overlaps with the second mask.

[0027] According to another aspect of the present invention, a method of manufacturing a display device includes the steps of: arranging a display substrate in a cavity; supplying a deposition material into the cavity from a deposition source in the cavity; and depositing the deposition material on the display substrate by passing the deposition material through a mask assembly arranged to face the deposition source, wherein the mask assembly includes: a mask, a blocking member including a grid portion having a grid shape and a portion of the shielding grid portion; and a first support for supporting the display substrate on the mask and separating the display substrate from the mask. The method further includes the steps of forming opposing electrodes and overlapping components.

[0028] The step of forming the opposing electrode can involve having opposing electrode holes on the display substrate.

[0029] Optical electrode holes can be formed between first and second pixels that are spaced apart from each other on the display substrate.

[0030] The overlapping component can be overlapped with the opposite electrode hole.

[0031] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory, and are intended to provide further explanation of the claimed invention. Attached Figure Description

[0032] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate exemplary embodiments of the invention and, together with the description, serve to explain the inventive concept.

[0033] Figure 1 This is a cross-sectional view of an exemplary embodiment of an apparatus for manufacturing a display device constructed according to the principles of the present invention.

[0034] Figure 2 This is an exploded perspective view of an exemplary embodiment of a mask assembly constructed according to the principles of the present invention.

[0035] Figure 3 yes Figure 2 Top view of the mask assembly.

[0036] Figure 4 This is a drawing table illustrating an exemplary experimental example of the relative electrode deposition pattern based on the gap between the display substrate and the second mask.

[0037] Figure 5 This is a plan view of another exemplary embodiment of a mask assembly constructed according to the principles of the present invention.

[0038] Figure 6 , Figure 7 and Figure 8A This is a plan view illustrating an exemplary embodiment of a method for manufacturing a mask assembly according to the principles of the present invention.

[0039] Figure 8B It is along Figure 8A A cross-sectional view of the mask assembly taken by line A-A'.

[0040] Figures 9A to 9E This is a plan view of an exemplary embodiment of a mask assembly, illustrating a method for manufacturing a shielding portion according to the principles of the present invention.

[0041] Figure 10 This is a plan view illustrating an exemplary embodiment of a method for manufacturing a mask assembly according to the principles of the present invention.

[0042] Figure 11Is using Figure 1 A perspective view of an exemplary embodiment of a display device manufactured by the equipment manufacturer.

[0043] Figure 12 It is along Figure 11 A simplified cross-sectional view of the display device taken by line B-B'. Detailed Implementation

[0044] In the following description, numerous specific details are set forth for purposes of explanation in order to provide a thorough understanding of the various exemplary embodiments or implementations of this disclosure. As used herein, “implementation” and “method” are interchangeable terms for non-limiting examples of devices or methods employing one or more of the inventive concepts disclosed herein. However, it will be apparent, however, that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are illustrated in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may differ, but are not necessarily exclusive. For example, the specific shape, configuration, and characteristics of one exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0045] Unless otherwise specified, the illustrated exemplary embodiments should be understood as providing exemplary features of different details of how the inventive concept can be implemented in practice. Therefore, unless otherwise specified, features, components, modules, layers, films, panels, regions and / or aspects (hereinafter collectively referred to as “elements”) of various embodiments may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0046] The use of crosshairs and / or shading in the accompanying drawings is generally provided to clarify the boundaries between adjacent elements. Therefore, unless specified, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, scale, commonalities between elements, and / or any other characteristics, properties, etc., of the elements. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be implemented in different ways, the specific process sequence may be performed differently than the described sequence. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Furthermore, the same reference numerals refer to the same elements. Regardless of the drawing number, those parts that are the same or function substantially the same have the same reference numerals, and redundant descriptions of them are omitted to avoid redundancy.

[0047] When an element, such as a layer, zone, or component, is referred to as being "on," "connected to," or "coupled to" another element, layer, zone, or component, the element may be directly located on, directly connected to, or coupled to the other element, layer, zone, or component, or there may be intermediate elements, layers, zones, or components present. However, when an element or layer is referred to as being "directly" on, directly connected to, or directly coupled to another element or layer, there are no intermediate elements or layers present. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection, with or without intermediate elements. Furthermore, the D1, D2, and D3 axes are not limited to the three axes of a Cartesian coordinate system (such as the x, y, and z axes) but can be interpreted in a broader sense. For example, the D1, D2, and D3 axes can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0048] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0049] For descriptive purposes, spatial relative terms such as “below,” “under,” “below,” “lower,” “above,” “upper,” “above,” “above,” “above,” and “side” (e.g., as in “sidewall”) may be used herein to describe the relationship between one element and another as shown in the figures. In addition to the orientations depicted in the figures, the spatial relative terms are intended to cover different orientations of the device in use, operation, and / or manufacture. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features would then be oriented “above” other elements or features. Thus, the exemplary term “below” can cover both above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and therefore, the spatial relative descriptors used herein should be interpreted accordingly.

[0050] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a” and “the (described)” as used herein are intended to include the plural forms as well. Furthermore, when used herein, the terms “comprising” and / or “including” indicate the presence of the stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “generally,” “about,” and other similar terms are used as approximations rather than terms of degree, and are therefore used to include inherent deviations in measured, calculated, and / or provided values ​​recognized by those skilled in the art.

[0051] This document describes various exemplary embodiments with reference to cross-sectional and / or exploded views, which are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Therefore, variations in the shapes shown in the drawings should be expected due to, for example, manufacturing techniques and / or tolerances. Consequently, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the shapes of the specific areas shown, but rather include shape deviations caused, for example, by manufacturing processes. In this way, the areas shown in the drawings may be schematic in nature, and the shapes of these areas may not reflect the actual shapes of areas of the device, and are therefore not necessarily intended to be limiting.

[0052] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art as to which this disclosure is a part. Terms such as those defined in common dictionaries shall be interpreted as having meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0053] Figure 1 This is a cross-sectional view of an exemplary embodiment of an apparatus for manufacturing a display device constructed according to the principles of the present invention. Figure 2 This is an exploded perspective view of an exemplary embodiment of a mask assembly constructed according to the principles of the present invention. Figure 3 yes Figure 2 Top view of the mask assembly.

[0054] See Figures 1 to 3 The apparatus 1000 for manufacturing a display device may include a chamber 1100, a mask support 1200, a deposition source 1300, a pressure regulator 1400, a magnetic part 1500, a visual part 1600, and a mask assembly M.

[0055] The chamber 1100 may have a space formed therein, and one side of the chamber 1100 may be opened to allow the display substrate DS to be pulled out or stored. An opening and closing portion 1110, including a gate valve or the like, may be arranged in a portion of the chamber 1100 to selectively open and close the chamber 1100.

[0056] The display substrate DS can be a display device under manufacturing. The display substrate DS can include glass or polymer resin (such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate (PC), cellulose triacetate (TAC), or cellulose acetate propionate, etc.).

[0057] The mask assembly M can be mounted on the mask support 1200. The mask support 1200 can be arranged in the chamber 1100. The mask support 1200 can finely adjust the position of the mask assembly M. The mask support 1200 may include a drive portion and an alignment portion to move the mask assembly M.

[0058] The deposition source 1300 can be arranged to face the mask assembly M. The deposition source 1300 can contain deposition material and can evaporate or sublimate the deposition material by applying heat to it. Therefore, the deposition source 1300 can supply deposition material.

[0059] The pressure regulator 1400 may include a connecting pipe 1410 connected to the chamber 1100 and a pump 1420 installed in the connecting pipe 1410. Depending on the operation of the pump 1420, external air may be introduced through the connecting pipe 1410, or gas inside the chamber 1100 may be directed to the outside through the connecting pipe 1410.

[0060] Based on the mask assembly M, the magnetic portion 1500 can be arranged opposite to the deposition source 1300. The magnetic portion 1500 can apply magnetic force to the mask assembly M to push the mask assembly M toward the display substrate DS. The magnetic portion 1500 can not only prevent the mask assembly M from sagging, but also allow the mask assembly M to approach the display substrate DS. In addition, the magnetic portion 1500 can uniformly maintain the gap between the mask assembly M and the display substrate DS in the Z direction.

[0061] The vision unit 1600 can be arranged in the chamber 1100 and can capture images of the positions of the display substrate DS and the mask assembly M. The vision unit 1600 may include a camera that captures images of the display substrate DS and the mask assembly M. The positions of the display substrate DS and the mask assembly M can be determined based on the images captured by the vision unit 1600, and the position of the mask assembly M on the mask support 1200 can be finely adjusted based on the images.

[0062] The mask assembly M can be supported by the mask support 1200. The mask assembly M may include a mask frame MF, a first mask M1, a second mask M2, and a first support, which may be in the form of a substrate support DSS.

[0063] The mask frame MF may include an opening region OA. Therefore, deposited material can pass through the opening region OA. In an exemplary embodiment, the mask frame MF may include multiple frames surrounding the opening region OA. The multiple frames may extend in the X or Y direction.

[0064] The mask frame MF can comprise a metal with high hardness, which is a material that deforms very little. Furthermore, the thickness MFt of the mask frame MF can be greater than the thickness M1t of the first mask M1 or the thickness M2t of the second mask M2. Therefore, when the first mask M1 or the second mask M2 is fixed, the deformation of the mask frame MF can be very small.

[0065] The first mask M1 can be arranged in the mask frame MF. In this case, the first mask M1 can be integrally mounted to the mask frame MF. For example, the first mask M1 can be fixed to the mask frame MF in a tensioned state.

[0066] The first mask M1 may include an opening OP. In an exemplary embodiment, the first mask M1 may include at least one opening OP. The opening OP may overlap with the opening region OA of the mask frame MF. In another exemplary embodiment, the first mask M1 may include multiple opening OPs. In this case, the multiple opening OPs may be spaced apart from each other. The multiple opening OPs may overlap with the opening region OA of the mask frame MF. The first mask M1 may include stainless steel, a 64FeNi alloy (hereinafter referred to as "INVAR alloy") sold by Aperam of Luxembourg under the trademark INVAR, nickel (Ni), cobalt (Co), a Ni alloy, or a Ni-Co alloy, etc.

[0067] A second mask M2 can be disposed on top of a first mask M1. In this case, the second mask M2 can be arranged to connect to a mask frame MF. That is, the planar dimensions of the second mask M2 can be larger than the planar dimensions of the first mask M1. Therefore, the central portion of the second mask M2 can overlap with the central portion of the first mask M1, and the ends of the second mask M2 can be disposed on the mask frame MF. The second mask M2 may include a mesh portion MP and a blocking member, which may be in the form of a shielding portion SP.

[0068] The mesh portion MP can have a general mesh shape or a grid shape. In an exemplary embodiment, the mesh portion MP can be arranged such that a plurality of first conductors W1 extending in the X direction intersect with a plurality of second conductors W2 extending in the Y direction intersecting the X direction. Therefore, the plurality of first conductors W1 and the plurality of second conductors W2 can define a plurality of mesh openings MH. The plurality of first conductors W1 and the plurality of second conductors W2 can each comprise stainless steel, INVAR alloy, Ni, Co, Ni alloy, or Ni-Co alloy, etc.

[0069] The shape of each of the multiple meshes MH can vary. For example, each of the multiple meshes MH can have a general rectangular shape. As another example, each of the multiple meshes MH can have a general parallelogram shape or a general rhombus shape. As yet another example, each of the multiple meshes MH can have a general polygon shape.

[0070] The shielding portion SP can shield a part of the mesh portion MP. The shielding portion SP can overlap with the opening OP. When the first mask M1 includes multiple openings OP, multiple shielding portions SP can also be provided. Therefore, multiple shielding portions SP can be arranged in positions corresponding to one of the multiple openings OP.

[0071] The shielding portion SP can shield mesh MH. In an exemplary embodiment, the shielding portion SP can completely shield at least one of the plurality of mesh MH, and can at least partially shield another of the plurality of mesh MH. In another exemplary embodiment, the shielding portion SP can completely shield a plurality of adjacent mesh MH. Furthermore, the shielding portion SP can be connected to a plurality of first conductors W1 and a plurality of second conductors W2. Therefore, the shielding portion SP can be stably supported by the plurality of first conductors W1 and the plurality of second conductors W2.

[0072] The shape of the shielding portion SP can vary. For example, the shielding portion SP can have a generally circular shape or a generally elliptical shape in a plan view. As another example, the shielding portion SP can have a generally polygonal shape in a plan view. However, the following will mainly describe in detail the case where the shielding portion SP has a generally circular shape.

[0073] The shielding portion SP may include stainless steel, INVAR alloy, Ni, Co, Ni alloy, or Ni-Co alloy, etc. In an exemplary embodiment, the shielding portion SP may include the same material as the mesh portion MP. In another exemplary embodiment, the shielding portion SP may include different materials from the mesh portion MP. For example, the mesh portion MP may include one of stainless steel, INVAR alloy, Ni, Co, Ni alloy, and Ni-Co alloy, and the shielding portion SP may include another of stainless steel, INVAR alloy, Ni, Co, Ni alloy, and Ni-Co alloy. As described below, the shielding portion SP can be formed by an electroforming method.

[0074] The substrate support DSS can support the display substrate DS on the second mask M2. Multiple substrate supports DSS can be provided. For example, multiple substrate supports DSS can be arranged on the mask frame MF and spaced apart from each other. Therefore, multiple substrate supports DSS can stably support the display substrate DS.

[0075] In the illustrated exemplary embodiment, the substrate support DSS can be separated from the display substrate DS and the second mask M2. In this case, the height d of the substrate support DSS can be about 600 μm or more. Therefore, the gap between the display substrate DS and the second mask M2 can be about 600 μm or more. The maximum height of the substrate support DSS can be varied depending on the size of the shielding portion SP.

[0076] The substrate support DSS can secure the second mask M2 to the mask frame MF. Because the second mask M2 includes a mesh portion MP, the bonding strength of the second mask M2 may decrease even when it is tensioned and secured to the mask frame MF. In the illustrated exemplary embodiment, because the second mask M2 is arranged to be secured between the substrate support DSS and the mask frame MF, the bonding strength between the second mask M2 and the mask frame MF can be increased. In the exemplary embodiment, the substrate support DSS, the second mask M2, and the mask frame MF can be connected to each other by welding. For example, after the substrate support DSS is arranged on the second mask M2, a portion of the substrate support DSS can be melted. In this case, the melted portion of the substrate support DSS can connect the substrate support DSS, the second mask M2, and the mask frame MF to each other.

[0077] In an exemplary embodiment, the substrate support DSS may be arranged along the mask frame MF. For example, the substrate support DSS may be spaced apart from the opening region OA and extend along the mask frame MF in at least one of the X and Y directions. The substrate support DSS extending along the mask frame MF in the Y direction will be described in detail below.

[0078] In an exemplary embodiment, the length of the substrate support DSS can be greater than the width of the second mask M2. For example, the extension length of the substrate support DSS in the Y direction can be greater than the width of the second mask M2 in the Y direction. Therefore, at least a portion of the substrate support DSS can be directly connected to the mask frame MF.

[0079] The substrate support DSS, the second mask M2, and the mask frame MF can be connected to each other. For example, the substrate support DSS and the second mask M2 can be connected to each other, the second mask M2 and the mask frame MF can be connected to each other, and the substrate support DSS and the mask frame MF can also be connected to each other. In this case, because one of the mask frame MF, the second mask M2, and the substrate support DSS fixes another of the mask frame MF, the second mask M2, and the substrate support DSS, strong bonding strength can be ensured.

[0080] As described above, the mask assembly M in some exemplary embodiments may include a second mask M2, which includes a grid portion MP and a shielding portion SP. Therefore, the shielding portion SP of the second mask M2 can be stably supported by the grid portion MP. Additionally, the shielding portion SP can prevent deposition material from being deposited on the display substrate DS. For example, when a counterpart electrode including a counterpart electrode hole is formed on the display substrate DS, the shielding portion SP can prevent the deposition material forming the counterpart electrode corresponding to the counterpart electrode hole from being deposited. Therefore, the display device manufactured according to the exemplary embodiments can include a transmissive region corresponding to the counterpart electrode hole in the display area of ​​the displayed image, and the light transmittance in the transmissive region can be improved.

[0081] In some exemplary embodiments, the mask assembly M can support the display substrate DS and may include a substrate support DSS that separates the display substrate DS from the second mask M2. Unlike the illustrated exemplary embodiment, when the shielding portion SP is fixed by ribs extending from the opening OP of the first mask M1, and when the second mask M2 and the substrate support DSS are omitted, the deposition material may not be uniformly deposited on the display substrate DS due to the ribs. Therefore, in a display device manufactured by a manufacturing apparatus including ribs, dark lines may be identifiable in the display area of ​​the displayed image. In the illustrated exemplary embodiment, the shielding portion SP can be fixed to the grid portion MP, and a substrate support DSS that separates the display substrate DS from the second mask M2 can be provided. In this case, even if the deposition material is partially shielded by the first conductor W1 and the second conductor W2 of the grid portion MP, the deposition material can be uniformly deposited on the display area of ​​the displayed image in the display substrate DS due to shading phenomena.

[0082] Figure 4 This is a drawing table illustrating an exemplary experimental example of the relative electrode deposition pattern based on the gap between the display substrate and the second mask.

[0083] Figure 3 and Figure 4 The diagram illustrates the relative electrode deposition pattern based on the gap between the display substrate DS and the second mask M2 when the thickness of the first conductor W1 and / or the thickness of the second conductor W2 is from about 11.4 μm to about 29.1 μm and the maximum width of the mesh MH is about 56.8 μm.

[0084] When the gap between the display substrate and the second mask M2 is approximately 600 μm, the grid pattern caused by the grid portion MP is not recognized, and the deposition material forming the opposing electrode is deposited substantially uniformly on the entire surface of the display substrate. In this case, when the opposing electrode is a transparent or translucent layer, the deposition material forming the opposing electrode is deposited substantially uniformly on the entire surface of the display substrate.

[0085] Considering the shadowing phenomenon, the size (e.g., diameter) of the shielding portion SP needs to be larger than the transmission area where no deposited material is deposited, and the size of the shielding portion SP also needs to be considered to set the maximum gap between the second mask M2 and the display substrate.

[0086] Figure 5 This is a plan view of another exemplary embodiment of a mask assembly constructed according to the principles of the present invention.

[0087] See Figure 5 The mask assembly M-1 may include a mask frame MF-1, a first mask M1-1, a second mask M2-1, and a substrate support DSS-1. The mask frame MF-1 may include an opening region OA-1, and the first mask M1-1 may be disposed within the mask frame MF-1 and include an opening (see [link to documentation]). Figure 2 (OP in the image). The second mask M2-1 can be arranged on the first mask M1-1 and includes a grid portion MP-1 having a grid shape and a shielding portion SP-1 that is a part of the shielding grid portion MP-1. The substrate support DSS-1 can support the display substrate on the second mask M2-1 and separate the display substrate from the second mask M2-1. The mask frame MF-1, the first mask M1-1, the second mask M2-1, the grid portion MP-1, and the shielding portion SP-1 are... Figure 3 The mask frame MF, the first mask M1, the second mask M2, the mesh portion MP, and the shielding portion SP are essentially the same, and therefore, their detailed descriptions will be omitted to avoid redundancy.

[0088] The substrate support DSS-1 can fix the second mask M2-1 to the mask frame MF-1. Because the second mask M2-1 is arranged to be fixed between the substrate support DSS-1 and the mask frame MF-1, the bonding strength between the second mask M2-1 and the mask frame MF-1 can be increased.

[0089] In the illustrated embodiment, the substrate support DSS-1 may include a first substrate support DSSa and a second substrate support DSSb. In this case, the first substrate support DSSa may be spaced apart from the opening region OA-1 and arranged along the mask frame MF-1, and the second substrate support DSSb may intersect the opening region OA-1. The second substrate support DSSb may extend in at least one of the X and Y directions to intersect the opening region OA-1. The second substrate support DSSb extending in the Y direction will be described in detail below.

[0090] In an exemplary embodiment, a plurality of first substrate supports DSSa can be provided, and the plurality of first substrate supports DSSa can be spaced apart from each other and arranged along the mask frame MF-1. In this case, a second substrate support DSSb can be arranged between the plurality of first substrate supports DSSa. Therefore, warping due to the weight of the display substrate can be prevented.

[0091] The method for manufacturing the mask component M described above will be described in detail below.

[0092] Figure 6 , Figure 7 and Figure 8A This is a plan view illustrating an exemplary embodiment of a method for manufacturing a mask assembly according to the principles of the present invention. Figure 8B It is along Figure 8A A cross-sectional view of the mask assembly taken by line A-A'. Figures 9A to 9E This is a plan view of an exemplary embodiment of a mask assembly, illustrating a method for manufacturing a shielding portion according to the principles of the present invention. Figure 10 This is a plan view illustrating an exemplary embodiment of a method for manufacturing a mask assembly according to the principles of the present invention. Figures 6 to 10 In, with Figures 1 to 3 The same reference numerals refer to the same components, and therefore, repeated descriptions will be omitted to avoid redundancy.

[0093] See Figure 6 The first mask M1, including the opening OP, can be fixed to the area including the opening (see...). Figure 8B The mask frame MF of the OA in the diagram. In this case, the first mask M1 can be tensioned and fixed to the mask frame MF.

[0094] Next, see Figure 7 A second mask M2, including a grid portion MP having a general grid shape, can be disposed on the first mask M1. In an exemplary embodiment, the second mask M2 can be fixed to a mask frame MF. For example, the second mask M2 can be tensioned and fixed to the mask frame MF. In another exemplary embodiment, the second mask M2 can be fixed to the mask frame MF together with the substrate support DSS.

[0095] Next, see Figure 8A and Figure 8B The substrate support DSS can be fixed on the second mask M2. The thickness MFt of the mask frame MF can be greater than the thickness M1t of the first mask M1 or the thickness M2t of the second mask M2.

[0096] The substrate support DSS may be fixed to the mask frame MF. In an exemplary embodiment, the substrate support DSS may be spaced apart from and fixed to the mask frame MF. In another exemplary embodiment, a plurality of substrate supports DSS may be provided, and one of the plurality of substrate supports DSS may be fixed across the opening region OA of the mask frame MF.

[0097] In an exemplary embodiment, the length of the substrate support DSS can be greater than the width of the second mask M2. For example, the extension length of the substrate support DSS in the Y direction can be greater than the width of the second mask M2 in the Y direction. Therefore, at least a portion of the substrate support DSS can be directly connected to the mask frame MF.

[0098] In an exemplary embodiment, the substrate support DSS, the second mask M2, and the mask frame MF can be connected to each other. For example, the substrate support DSS and the second mask M2 can be connected to each other, the second mask M2 and the mask frame MF can be connected to each other, and the substrate support DSS and the mask frame MF can also be connected to each other. In this case, because one of the mask frame MF, the second mask M2, and the substrate support DSS fixes the other of the mask frame MF, the second mask M2, and the substrate support DSS, a strong bonding strength is provided.

[0099] In an exemplary embodiment, the substrate support DSS, the second mask M2, and the mask frame MF can be fixed by welding. For example, after the substrate support DSS is arranged on the second mask M2, a portion of the substrate support DSS can be melted. In this case, the melted portion of the substrate support DSS can connect the substrate support DSS, the second mask M2, and the mask frame MF to each other.

[0100] Next, a shielding portion SP, which is part of the shielding mesh portion MP, can be formed. In an exemplary embodiment, the mask assembly M being manufactured can be inverted. For example, the upper surface UM2 of the second mask M2 can be changed from facing the +Z direction to facing the -Z direction, and the lower surface DM2 of the second mask M2 can be changed from facing the -Z direction to facing the +Z direction.

[0101] Next, in an exemplary embodiment, the shielding portion SP can be formed by an electroforming method. The electroforming method is a technique that uses the principle of electroplating to form a metallic shape.

[0102] See Figure 9A First, the photoresist PR can be formed on the second mask M2. The photoresist PR can be a positive photoresist or a negative photoresist, and the second mask M2 can be coated with the photoresist PR. Specifically, in a positive photoresist, the exposed areas are etched in the subsequent development process. Conversely, in a negative photoresist, the remaining areas besides the exposed areas are etched. The case where the photoresist PR is a positive photoresist will be described in detail below.

[0103] The photoresist PR can be formed by applying the photoresist solution to the second mask M2 through various methods such as spin coating, spraying, or dipping.

[0104] In addition, before the photoresist PR is coated onto the second mask M2, an additional process of polishing the top surface of the second mask M2 to be coated with the photoresist PR can be performed.

[0105] Next, see Figure 9B The exposure mask PM can overlap with the second mask M2 to expose at least a portion of the photoresist PR. The exposure mask PM can include an exposure opening PMOP, and a portion of the photoresist PR corresponding to the exposure opening PMOP can be exposed. In this case, the portion corresponding to the exposure opening PMOP can be a portion forming a shielding portion.

[0106] Next, see Figure 9C The photoresist PR can be developed. Therefore, a portion of the photoresist PR can be removed. The photoresist PR is a photoresist using a positive photoresist solution, and when the development process is performed, the exposed areas of the photoresist PR can be removed. Therefore, photoresist openings PROP can be formed.

[0107] Next, see Figure 9DThe shielding portion SP can be formed using an electroforming method. The shielding portion SP may include stainless steel, INVAR alloy, Ni, Co, Ni alloy, or Ni-Co alloy, etc. In an exemplary embodiment, the shielding portion SP may comprise the same material as the mesh portion MP. In another exemplary embodiment, the shielding portion SP may comprise different materials from the mesh portion MP. For example, the mesh portion MP may comprise one of stainless steel, INVAR alloy, Ni, Co, Ni alloy, and Ni-Co alloy, and the shielding portion SP may comprise another of stainless steel, INVAR alloy, Ni, Co, Ni alloy, and Ni-Co alloy.

[0108] Next, see Figure 9E This can remove the remaining portion of the photoresist (PR). Therefore, see... Figure 10 It can form a mask assembly M including a shielding portion SP, where the shielding portion SP is part of the shielding mesh portion MP.

[0109] In another exemplary embodiment, the mesh portion MP and the shielding portion SP can be formed by laser patterning method of irradiating the second mask M2 with a laser. Specifically, the mask assembly M can be formed by irradiating the area corresponding to the mesh portion MP with a laser and not irradiating the area corresponding to the shielding portion SP.

[0110] It can be manufactured using equipment 1000 for manufacturing display devices. Figure 11 The display device 1 manufactured by the equipment 1000 will be described in detail first, and then the method of manufacturing the display device 1 will be described.

[0111] Display device 1 is a device for displaying images and can be a portable mobile device, such as a game console, multimedia device, or micro personal computer (PC). Display device 1, described later, may include liquid crystal displays, electrophoretic displays, organic light-emitting displays, inorganic electroluminescent displays (i.e., inorganic light-emitting displays), field emission displays, surface conduction electron emitter displays, quantum dot displays, plasma displays, or cathode ray displays, etc. Hereinafter, as a display device 1 according to an exemplary embodiment, an organic light-emitting display will be described as an example. However, exemplary embodiments may include various types of display devices 1 as described above.

[0112] Figure 11 Is using Figure 1 A perspective view of an exemplary embodiment of a display device manufactured by the equipment manufacturer.

[0113] See Figure 11 The display device 1 may include a first region A1, a second region A2 and a third region A3.

[0114] The first region A1 may be a region in which components capable of providing various functions to the display device 1 are arranged. For example, when the components include a light-using sensor or a camera, the first region A1 corresponds to a transmission region through which light from the sensor or light propagating through the camera can be transmitted.

[0115] The second region A2 may completely surround the first region A1. The second region A2 may include multiple pixels, for example, an array of pixels, and the second region A2 can display an image through the array of pixels. The second region A2 corresponds to the display area capable of displaying the image.

[0116] The third region A3 can be arranged to surround the second region A2. The third region A3 is a non-display area in which no pixels are arranged, and various types of wiring and internal circuitry can be arranged in the third region A3.

[0117] Figure 11 The illustration shows a first region A1 positioned on the upper right side of the display device 1. However, in another exemplary embodiment, the first region A1 may be positioned in the center of the second region A2 along the width direction (e.g., ±X direction) of the display device 1, or it may be positioned on the upper left side of the second region A2. Furthermore, the first region A1 may be positioned at various locations along the length direction (e.g., ±Y direction) of the display device 1, such as on the upper side, in the middle, or on the lower side.

[0118] Figure 11 The illustration shows that the display device 1 includes a first region A1, but in another exemplary embodiment, the display device 1 may include a plurality of first regions A1.

[0119] Figure 12 It is along Figure 11 A simplified cross-sectional view of the display device taken by line B-B'.

[0120] See Figure 12 The display device 1 may include a component COMP, a substrate 100, a buffer layer 111, a plurality of pixels (i.e., a first pixel P1 and a second pixel P2), and an insulating layer IL. The insulating layer IL may include an inorganic insulating layer IL1 and a planarization layer 117.

[0121] The component COMP can be arranged to correspond to the first area A1. The component COMP can be an electronic element that uses light or sound. For example, the electronic element can be a sensor that measures distance (e.g., a proximity sensor), a sensor that identifies a part of a user's body (e.g., fingerprint, iris, and face), a small light that outputs light, or an image sensor that captures an image (e.g., a camera). Electronic elements that use light can use light of various wavelengths, such as visible light, infrared light, and ultraviolet light. Electronic elements that use sound can use ultrasound or other frequency bands of sound.

[0122] In some exemplary embodiments, a component COMP may include sub-components such as a light-emitting portion and a light-receiving portion. The light-emitting portion and the light-receiving portion may be integrated together or physically separated from each other, and a pair formed by the light-emitting portion and the light-receiving portion may form a component COMP.

[0123] The substrate 100 may include: a base layer comprising a polymer resin; and a barrier layer comprising an inorganic insulating material. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 stacked sequentially. Each of the first base layer 101 and the second base layer 103 may include polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate (PC), cellulose triacetate (TAC), or cellulose acetate propionate, etc. Each of the first barrier layer 102 and the second barrier layer 104 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, and / or silicon nitride. In another exemplary embodiment, the substrate 100 may include glass.

[0124] A buffer layer 111 may be disposed on the substrate 100. The buffer layer 111 may reduce or prevent foreign matter, moisture or external air from penetrating from the bottom of the substrate 100. The buffer layer 111 may include inorganic materials (such as oxides or nitrides), organic materials or organic-inorganic composite materials, and may have a single-layer or multi-layer structure including inorganic and organic materials.

[0125] Multiple pixels, namely a first pixel P1 and a second pixel P2, can be arranged in a second region A2. For example, the first pixel P1 and the second pixel P2 can be arranged in the second region A2, and the first region A1 is between the first pixel P1 and the second pixel P2. The first pixel P1 and the second pixel P2 can each include a pixel circuit PC and an organic light-emitting diode (OLED). The first pixel P1 and the second pixel P2 are substantially the same, and therefore will be described in detail with reference to the first pixel P1.

[0126] A pixel circuit PC, including a thin-film transistor (TFT) and a storage capacitor Cst, can be disposed on a buffer layer 111. The TFT may include a semiconductor layer Act1, a gate electrode G1 overlapping the channel region of the semiconductor layer Act1, and a source electrode S1 and a drain electrode D1 respectively connected to the source and drain regions of the semiconductor layer Act1. A gate insulating layer 112 may be inserted between the semiconductor layer Act1 and the gate electrode G1, and a first interlayer insulating layer 113 and a second interlayer insulating layer 115 may be disposed between the gate electrode G1 and the source electrode S1 or between the gate electrode G1 and the drain electrode D1.

[0127] The storage capacitor Cst can be arranged to overlap with the thin-film transistor TFT. The storage capacitor Cst may include a first capacitor plate CE1 and a second capacitor plate CE2 that overlap each other. In some exemplary embodiments, the gate electrode G1 of the thin-film transistor TFT may include the first capacitor plate CE1 of the storage capacitor Cst. A first interlayer insulating layer 113 may be disposed between the first capacitor plate CE1 and the second capacitor plate CE2.

[0128] Semiconductor layer Act1 may include polycrystalline silicon. In some exemplary embodiments, semiconductor layer Act1 may include amorphous silicon. In some exemplary embodiments, semiconductor layer Act1 may include an oxide of at least one material selected from indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). Semiconductor layer Act1 may include a channel region and impurity-doped source and drain regions.

[0129] The gate insulating layer 112 may include inorganic insulating materials such as silicon oxide, silicon oxynitride, or silicon nitride, and may have a single-layer or multi-layer structure including the above materials.

[0130] The gate electrode G1 or the first capacitor plate CE1 may include a low-resistance conductive material such as molybdenum (Mo), aluminum (Al), copper (Cu) and / or titanium (Ti), and may have a single-layer or multi-layer structure including the above materials.

[0131] The first interlayer insulation layer 113 may include inorganic insulating materials such as silicon oxide, silicon oxynitride, or silicon nitride, and may have a single-layer or multi-layer structure including the above materials.

[0132] The second capacitor plate CE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may have a single-layer or multi-layer structure comprising the above materials.

[0133] The second interlayer insulation layer 115 may include inorganic insulating materials such as silicon oxide, silicon oxynitride, and silicon nitride, and may have a single-layer or multi-layer structure including the above materials.

[0134] The source electrode S1 or drain electrode D1 may include Al, Pt, Pd, Ag, Mg, Au, Nd, Ir, Cr, Ni, Ca, Mo, Ti, W and / or Cu, and may have a single-layer or multi-layer structure comprising the above materials. For example, the source electrode S1 or drain electrode D1 may have a three-layer structure of titanium layer / aluminum layer / titanium layer.

[0135] The planarization layer 117 may be made of a different material than at least one inorganic insulating layer disposed beneath it (e.g., gate insulating layer 112, first interlayer insulating layer 113, and second interlayer insulating layer 115). The planarization layer 117 may include an organic insulating material. The planarization layer 117 may include organic insulating materials such as acrylic acid, benzocyclobutene (BCB), polyimide, or hexamethyldisiloxane (HMDSO). The organic insulating material of the planarization layer 117 may be a photosensitive organic insulating material.

[0136] Pixel electrode 221 can be disposed on planarization layer 117. Pixel electrode 221 can be electrically connected to thin-film transistor (TFT) through contact holes formed in planarization layer 117.

[0137] Pixel electrode 221 may include a reflective layer, which may include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or compounds thereof. Pixel electrode 221 may include: a reflective layer comprising the above-mentioned materials; and a transparent conductive layer disposed above and / or below the reflective layer. The transparent conductive layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO), etc. In an exemplary embodiment, pixel electrode 221 may have a three-layer structure in which an ITO layer, an Ag layer, and an ITO layer are stacked sequentially.

[0138] A pixel defining layer 119 may be disposed on the pixel electrode 221. The pixel defining layer 119 may cover the edge of the pixel electrode 221 and include an opening 119OP that overlaps with the central portion of the pixel electrode 221. The pixel defining layer 119 may include an organic insulating material and / or an inorganic insulating material. The opening 119OP may define an emission region for light emitted from an organic light-emitting diode (OLED).

[0139] The intermediate layer 222 includes an emission layer 222b overlapping the pixel electrode 221. The emission layer 222b may include an organic material. The emission layer 222b may include a polymeric organic material or a low-molecular-weight organic material that emits light of a certain color. As described above, the emission layer 222b can be formed by a deposition process using a mask.

[0140] The first functional layer 222a and the second functional layer 222c can be disposed below and / or above the emitter layer 222b. The first functional layer 222a may comprise a single layer or multiple layers. For example, when the first functional layer 222a comprises a polymer material, it may be a hole transport layer (HTL) with a single-layer structure and may comprise poly(3,4)-ethylene-dihydroxythiophene (PEDOT) or polyaniline. When the first functional layer 222a comprises a low molecular weight material, it may comprise a hole injection layer (HIL) and an HTL.

[0141] The second functional layer 222c may be optional. For example, it may be desirable to form the second functional layer 222c when the first functional layer 222a and the emitter layer 222b each comprise a polymer material. The second functional layer 222c may be a single layer or multiple layers. The second functional layer 222c may include an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0142] The counter electrode 223 may include a conductive material having a relatively low work function. For example, the counter electrode 223 may include a (semi-)transparent layer comprising Ag, Mg, Al, Ni, Cr, Li, Ca, or alloys thereof. Alternatively, the counter electrode 223 may further include a layer comprising a material such as ITO, IZO, ZnO, or In2O3 on the (semi-)transparent layer comprising the above-described materials. In an exemplary embodiment, the counter electrode 223 may include Ag and Mg.

[0143] A stacked structure consisting of pixel electrode 221, intermediate layer 222 and opposite electrode 223 stacked in sequence can form a light-emitting diode, such as an organic light-emitting diode (OLED).

[0144] A capping layer 224 can be disposed on the opposing electrode 223. Additionally, a light extraction layer 225 can be disposed on the capping layer 224. Both the capping layer 224 and the light extraction layer 225 can be layers used to improve the extraction of light emitted from an organic light-emitting diode (OLED). The capping layer 224 may include at least one selected from aluminum tri-8-hydroxyquinoline (Alq3), ZnSe, 2,5-bis(6'-(2',2”-bipyridine))-1,1'-dimethyl-3,4-diphenylthiophene, 4'-bis[N-(1-naphthyl)-N-phenyl-amino]biphenyl (α-NPD), N,N'-diphenyl-N,N'-bis(3-methylphenyl)-1,1'-biphenyl-4,4'-diamine (TPD), and 1,1'-bis[(di-4-tolylamino)phenyl]cyclohexane (TAPC). The light extraction layer 225 may include at least one selected from CaF2, NaF, Na3AlF6, SiO2, etc. X (X>0), at least one of AlF3, LiF, MgF2 and IF3.

[0145] An encapsulation layer (not shown) may be disposed on the opposing electrode 223. In an exemplary embodiment, the encapsulation layer may include at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0146] At least one inorganic encapsulation layer may comprise one or more inorganic materials selected from alumina, titanium dioxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. At least one organic encapsulation layer may comprise a polymeric material. Examples of polymeric materials may include acrylic resins, epoxy resins, polyimides, and polyethylene. In an exemplary embodiment, the organic encapsulation layer may comprise an acrylate.

[0147] In another exemplary embodiment, the encapsulation layer may have a structure in which the substrate 100 and the upper substrate, which serves as a transparent member, are coupled to each other via a sealing member, and thus the internal space between the substrate 100 and the upper substrate is sealed. In this case, a desiccant or filler material may be located in the internal space. The sealing member may be a sealant. In another exemplary embodiment, the sealing member may include a material cured by laser. For example, the sealing member may be a glass frit. Specifically, the sealing member may include urethane resins, epoxy resins, or acrylic resins as organic sealants, or silicone as inorganic sealants. For example, urethane acrylates may be used as urethane resins. For example, butyl acrylate or ethylhexyl acrylate may be used as acrylic resins. The sealing member may include a material cured by heat.

[0148] A touch electrode layer (not shown), including touch electrodes, may be located on the encapsulation layer, and an optical functional layer (not shown) may be located on the touch electrode layer. The touch electrode layer can obtain coordinate information based on external input (e.g., a touch event). The optical functional layer can reduce the reflectivity of light incident on the display device 1 from the outside (external light) and / or can increase the color purity of light emitted from the display device 1. In an exemplary embodiment, the optical functional layer may include a retarder and a polarizer. The retarder may be a film-type or a liquid crystal coated type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be a film-type or a liquid crystal coated type. The film-type may include an elongated synthetic resin film, and the liquid crystal coated type may include liquid crystals arranged in a predetermined configuration. The retarder and polarizer may further include a protective film.

[0149] In another exemplary embodiment, the optical functional layer may include a black matrix and color filters. The color filters may be arranged considering the color of light emitted from each pixel of the display device 1. Each of the color filters may include a red, green, or blue pigment or dye. Alternatively, each of the color filters may further include quantum dots in addition to the pigments or dyes described above. Alternatively, some color filters may not include the pigments or dyes described above and may include, for example, dispersed particles of titanium dioxide.

[0150] In another exemplary embodiment, the optical functional layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer located on different layers. First reflected light and second reflected light reflected from the first reflective layer and the second reflective layer, respectively, can be destructively interfered with each other. Therefore, the reflectivity of external light can be reduced.

[0151] An adhesive component (not shown) may be located between the touch electrode layer and the optical functional layer. Common adhesive components known in the art can be used without limitation. The adhesive component may be a pressure-sensitive adhesive (PSA).

[0152] In an exemplary embodiment, at least one of the buffer layer 111, the inorganic insulating layer 111, the planarization layer 117, and the pixel defining layer 119 may include a hole corresponding to the first region A1. In an exemplary embodiment, the first hole 111H of the buffer layer 111, the second hole 111H of the inorganic insulating layer 111, the third hole 117H of the planarization layer 117, and the fourth hole 119H of the pixel defining layer 119 may be arranged to correspond to the first region A1. Furthermore, the first hole 111H to the fourth hole 119H may overlap and be connected to each other. In another exemplary embodiment, the buffer layer 111 does not include a hole and is continuously arranged in the first region A1, and the second hole 111H, the third hole 117H, and the fourth hole 119H may be arranged to correspond to the first region A1. However, various modifications are possible. As another example, the buffer layer 111, the inorganic insulating layer 111, and the planarization layer 117 may be continuously arranged in the first region A1, and the fourth hole 119H may be arranged in the first region A1.

[0153] In some exemplary embodiments, without holes, the buffer layer 111, the inorganic insulating layer 111, the planarization layer 117, and the pixel defining layer 119 can be continuously arranged in the first region A1.

[0154] In the illustrated embodiment, the display device 1 manufactured using equipment 1000 may include at least one of a first functional layer aperture 222aH, a second functional layer aperture 222cH, a counter electrode aperture 223H, a capping layer aperture 224H, and a light extraction layer aperture 225H. For example, the display device 1 may include the first functional layer aperture 222aH, the second functional layer aperture 222cH, the counter electrode aperture 223H, the capping layer aperture 224H, and the light extraction layer aperture 225H. In this case, each of the first functional layer aperture 222aH, the second functional layer aperture 222cH, the counter electrode aperture 223H, the capping layer aperture 224H, and the light extraction layer aperture 225H may be arranged to correspond to the first region A1. Therefore, the light transmittance of component COMP can be improved.

[0155] The following will describe in detail a method for manufacturing a display device 1 including a first functional layer hole 222aH, a second functional layer hole 222cH, a counter electrode hole 223H, a capping layer hole 224H, and a light extraction layer hole 225H. Specifically, the method for manufacturing a display device 1 including a counter electrode hole 223H will be described in detail.

[0156] See Figures 1 to 3 and Figure 12 First, the display substrate DS can be arranged on... Figure 1The display substrate DS can be mounted on the substrate support DSS within the chamber 1100. In this case, the display substrate DS can be a display device under manufacturing and can be in a state in which the second functional layer 222c has been formed.

[0157] Next, deposition material can be supplied to chamber 1100 via deposition source 1300 arranged in chamber 1100. The deposition material can be a gas containing components used as raw materials for the relative electrode 223.

[0158] Subsequently, a deposition material can be deposited on the display substrate DS using a mask assembly M arranged to face the deposition source 1300. Therefore, except for a portion of the display substrate DS corresponding to the shielding portion SP, the deposition material can be uniformly deposited on the display substrate DS.

[0159] Therefore, the relative electrode 223 with the relative electrode hole 223H can be formed on the display substrate DS. In this case, the relative electrode hole 223H can be formed between the first pixel P1 and the second pixel P2.

[0160] Next, component COMP can overlap with the relative electrode aperture 223H. Because the relative electrode 223 is not continuously arranged in the first region A1 in which component COMP is arranged, the transmittance of light entering or leaving component COMP can be improved.

[0161] In addition, the deposition material can be modified in a manner substantially the same as described above to form the first functional layer pores 222aH, the second functional layer pores 222cH, the capping layer pores 224H, and the light extraction layer pores 225H.

[0162] Unlike the exemplary embodiment, when the shielding portion SP is fixed by ribs extending from the opening OP of the first mask M1, and when the second mask M2 and the substrate support DSS are omitted, there may be areas on the display substrate DS where the deposition material was not deposited due to the ribs. In this case, because the deposition material must be redeposited on the areas where the deposition material was not deposited due to the ribs using a mask assembly different from the mask assembly M, the processing time for depositing the deposition material on the display substrate DS may be increased. In the exemplary embodiment, a grid portion MP can be provided, and the shielding portion SP can be fixed to the grid portion MP. Therefore, the opposing electrode 223 and the like can be uniformly deposited on the display substrate DS by a single deposition process, and the efficiency of the method for manufacturing the display device can be improved.

[0163] An apparatus for manufacturing a display device according to the principles of the present invention and some exemplary embodiments includes: a second mask comprising a shielding portion having a grid shape and a portion thereof shielding the grid shape; and a substrate support for separating the display substrate from the second mask. In this manner, the apparatus can produce a display device having high transmittance in the transmissive region. Furthermore, according to some exemplary embodiments, the efficiency of the apparatus for manufacturing a display device and the efficiency of the method for manufacturing a display device can be improved.

[0164] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from that description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those skilled in the art.

Claims

1. An apparatus for manufacturing a display device, the apparatus comprising: Mask assembly, The mask assembly includes: Mask frame, including the opening area; A first mask is disposed on the mask frame, the first mask including at least one opening; A second mask is disposed on the first mask, the second mask comprising a mesh portion having a grid shape and a blocking member that shields a portion of the mesh portion; and The first support is used to support the display substrate on the second mask and to separate the display substrate from the second mask. Wherein, the blocking member overlaps with the opening; The planar dimensions of the second mask are larger than those of the first mask; The grid portion includes multiple first wires extending in a first direction and multiple second wires extending in a second direction intersecting the first direction. The plurality of first conductors and the plurality of second conductors define a plurality of mesh openings. The blocking member completely shields at least one of the plurality of mesh openings.

2. The apparatus of claim 1, wherein, The thickness of the mask frame is greater than the thickness of the first mask or the thickness of the second mask. The first support couples the second mask to the mask frame, and The first support, the second mask, and the mask frame are coupled to each other.

3. The apparatus of claim 1, wherein, The first support is disposed along the mask frame.

4. The apparatus of claim 1, wherein, The first support includes a first substrate support and a second substrate support. The first substrate support is spaced apart from the opening region and disposed along the mask frame, and The second substrate support intersects with the opening region.

5. A method for manufacturing a mask assembly for producing a display device, the method comprising the following steps: Secure the first mask, including the opening, to the mask frame, including the opening area; A second mask is arranged on the first mask, the second mask including a grid portion having a grid shape; The first support is coupled to the second mask; as well as A blocking member that forms a portion of the mesh portion; Wherein, the planar dimensions of the second mask are larger than those of the first mask; The grid portion includes multiple first wires extending in a first direction and multiple second wires extending in a second direction intersecting the first direction. The plurality of first conductors and the plurality of second conductors define a plurality of mesh openings. The blocking member completely shields at least one of the plurality of mesh openings.

6. The method according to claim 5, wherein, The thickness of the mask frame is greater than the thickness of the first mask or the thickness of the second mask. The step of coupling the first support includes coupling the first support, the second mask, and the mask frame to each other.

7. The method according to claim 5, wherein, The blocking member is formed by electroforming.

8. The method according to claim 5, wherein, The blocking member includes a shielding portion formed by the following: Photoresist is formed on the second mask; The exposure mask is overlapped with the second mask to expose at least a portion of the photoresist; as well as The photoresist is developed.

9. A method for manufacturing a display device, the method comprising the following steps: The display substrate will be arranged inside the cavity; Deposited material is supplied to the chamber from a deposition source in the chamber; as well as The deposition material is deposited on the display substrate by passing it through a mask assembly arranged to face the deposition source. The mask assembly includes: A mask comprising a mesh portion having a grid shape and a blocking member that shields a portion of the mesh portion; and A first support is used to support the display substrate on the mask and to separate the display substrate from the mask; The grid portion includes multiple first wires extending in a first direction and multiple second wires extending in a second direction intersecting the first direction. The plurality of first conductors and the plurality of second conductors define a plurality of mesh openings. The blocking member completely shields at least one of the plurality of mesh openings.

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