A cooling heat sink and stacked array for high-power semiconductor light source chips

Abstract

The present invention relates to the field of semiconductor optoelectronic technology, and specifically to a cooling heat sink and stacked array applied to high-power semiconductor light source chips, which solves the problems of poor heat exchange capacity of existing cooling heat sinks and lack of guiding measures for heat transfer. The cooling heat sink includes an upper sealing laminate, an upper cooling laminate, a guide laminate, a lower cooling laminate and a lower sealing laminate stacked from top to bottom. A third water inlet, a second water outlet and a fourth hollow microstructure are arranged on the upper cooling laminate; a heat guide plate is arranged in the fourth hollow microstructure and at a position corresponding to the guide structure on the guide laminate; the heat guide plate made of copper, diamond or silicon carbide is made of copper, diamond or silicon carbide, and includes N equidistantly arranged ribs, and the N equidistantly arranged fine ribs constitute N+1 micro channels, and the width of the ribs and the width of the micro channels are both 0.10 mm.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor optoelectronic technology, and in particular to a cooling heat sink and a stacked array applied to a high-power semiconductor light source chip. Background Art

[0002] With the widespread adoption of semiconductor light source chips and their widespread application in scientific research, industry, and other sectors, their performance parameters are gradually improving. As chip power continues to increase, so too does the amount of heat generated. This increase in heat not only affects energy consumption but also impacts chip reliability and lifespan, and can even lead to direct burnout. Therefore, combining heat sinks with higher heat transfer capabilities and efficiency is an effective solution.

[0003] The existing cooling heat sink design of semiconductor light source chips mainly improves the turbulent flow state by changing the microchannel structure to increase the heat transfer coefficient, such as the jet single hole design. Its design and principle are shown in Figures 1 to 3 . The cooling heat sink includes an upper sealing laminate 05, an upper cooling laminate 04, a guide laminate 03, a lower cooling laminate 02 and a lower sealing laminate 01 stacked on each other from top to bottom. The lower sealing laminate 01 includes a water inlet 06 and a water outlet 013 isolated from each other; the lower cooling laminate 02 is provided with a first hollow microstructure 07 corresponding to the position of the water inlet 06, and a third hollow microstructure 012 corresponding to the position of the water outlet 013, and the two are isolated from each other, and the first hollow microstructure 07 is provided with a plurality of first cooling channels 08 of the same width formed by a plurality of ribs, and the third hollow microstructure 012 extends along both sides of the lower cooling laminate 02 to the first cooling channel 08, and the length of the plurality of first cooling channels 08 decreases from the middle area to the two side areas; the guide laminate 03 is provided with a plurality of jet holes 09 corresponding to the position of the first cooling channel 08, and the third hollow microstructure 012 is provided with a plurality of jet holes 09 corresponding to the position of the first cooling channel 08. The hollow microstructure 012 is identical to the second hollow microstructure 011, and the second water inlet 014 corresponds to the position of the first hollow microstructure 07, and the three are isolated from each other; the upper cooling laminate 04 includes a fourth hollow microstructure 015, a third water inlet 016 and a second water outlet 017 isolated from each other, and the fourth hollow microstructure 015 is provided with a second cooling channel 010 composed of a plurality of ribs, which corresponds to the positions of the plurality of jet holes 09, and the positions of the third water inlet 016 and the second water outlet 017 correspond to the second water inlet 014 and the second hollow microstructure 011 respectively; the upper sealing laminate 05 includes a fourth water inlet 018 and a third water outlet 019 isolated from each other.

[0004] The flow direction of cooling water is as follows Figure 2As shown, the cooling water enters the first hollow microstructure 07 from the water inlet 06 of the lower sealing laminate 01, passes through the first cooling channel 08, and then enters the second cooling channel 010 through the jet hole 09, and then enters the fourth hollow microstructure 015, the second hollow microstructure 011 and the third hollow microstructure 012 in sequence, and finally flows out from the water outlet 013.

[0005] However, the above heat sink structure has the following defects during use:

[0006] 1. The aforementioned heat sink structure primarily increases the heat transfer coefficient by enhancing the turbulent flow of the internal water. Further reducing the temperature rise requires greater pressure and flow rate. Simply increasing the heat transfer capacity by changing the fluid flow state is limited, thus limiting its application in high-power chips. Furthermore, the aforementioned heat sink structure struggles to guide heat transfer across the chip, and the chip surface temperature distribution cannot be uniformly controlled.

[0007] 2. If Figure 3 As shown, a 0.2mm*1.0mm jet hole 09 is set on the top of the guide stack 03. Since it is a jet array, there is no obvious guiding measure for heat transfer, and the heat cannot be adjusted according to the actual heating conditions of the chip surface.

[0008] 3. The pressure of the heat sink structure mentioned above changes greatly. When the cooling water passes through the jet hole 09, the flow area is sharply reduced, and the pressure and flow rate are sharply increased, which will accelerate the damage of the heat sink structure and shorten its life. Summary of the Invention

[0009] The purpose of the present invention is to solve the problems of poor heat exchange capacity and lack of heat transfer guidance in existing cooling heat sinks, and to provide a cooling heat sink and stacked array for high-power semiconductor light source chips.

[0010] To achieve the above objectives, the technical solutions provided by the present invention are as follows:

[0011] A cooling heat sink for a high-power semiconductor light source chip comprises an upper sealing laminate, an upper cooling laminate, a guide laminate, a lower cooling laminate and a lower sealing laminate stacked one on top of the other.

[0012] The lower sealing laminate is provided with a first water inlet and a first water outlet isolated from each other;

[0013] The lower cooling lamination is provided with a first hollow microstructure and a second hollow microstructure isolated from each other; the position of the first hollow microstructure corresponds to the first water inlet; the first hollow microstructure is provided with a cooling channel composed of a plurality of ribs; the position of the second hollow microstructure corresponds to the first water outlet;

[0014] The guide lamination is provided with a second water inlet, a third hollow microstructure and a guide structure that are isolated from each other; the position of the second water inlet corresponds to the first hollow microstructure; the position of the guide structure corresponds to the plurality of cooling channels;

[0015] The upper cooling lamination is provided with a third water inlet, a second water outlet, and a fourth hollow microstructure that are isolated from each other; the positions of the third water inlet and the second water outlet correspond to the second water inlet and the third hollow microstructure respectively;

[0016] The upper sealing laminate is provided with a fourth water inlet and a third water outlet isolated from each other, and their positions correspond to the third water inlet and the second water outlet respectively;

[0017] Its special features are:

[0018] A heat guide sheet is provided in the fourth hollow microstructure at a position corresponding to the guide structure on the guide laminate;

[0019] The heat guide is made of copper, diamond or silicon carbide, and includes N equidistantly arranged ribs. The N equidistantly arranged fine ribs constitute N+ micro channels. The width of the ribs and the width of the micro channels are both 0.10 mm.

[0020] The heat guide plate is made of copper, diamond or silicon carbide.

[0021] Furthermore, the guide structure is a wave-shaped guide groove.

[0022] Furthermore, the length of the heat guide plate is 3.20 mm.

[0023] Furthermore, the fourth hollow microstructure extends along both sides of the third water inlet and to the second water outlet.

[0024] Furthermore, the second hollow microstructure includes a main flow area, two mutually symmetrical first microchannels and two mutually symmetrical second microchannels;

[0025] The position of the main flow area corresponds to the first water outlet;

[0026] The first microchannel extends from the main flow area to the first hollow microstructure; the second microchannel extends from the main flow area to the edge of the first microchannel and is isolated from the first microchannel;

[0027] The third hollow microstructure is completely identical to the second hollow microstructure.

[0028] Furthermore, the length of the ribs located in the middle area of ​​the heat guiding plate gradually decreases.

[0029] Furthermore, the widths of the plurality of cooling channels decrease gradually from the middle area to the side areas.

[0030] Furthermore, the radius of the fourth water inlet is equal to that of the third water outlet, the radius of the first water inlet, the second water inlet, the third water inlet, the first water outlet and the second water outlet are equal, and the radius of the fourth water inlet is greater than that of the first water inlet;

[0031] The fourth water inlet and the third water outlet are provided with sealing rings, and the inner diameter of the sealing ring is the same as the diameter of the first water inlet.

[0032] Furthermore, the upper sealing lamination, upper cooling lamination, guide lamination, lower cooling lamination and lower sealing lamination are all provided with a first positioning hole, a second positioning hole and a third positioning hole in the center position; the second positioning hole and the third positioning hole are symmetrically arranged; the five first positioning holes, the five second positioning holes and the five second positioning holes are all coaxially arranged with each other.

[0033] In addition, the present invention also provides a stacked array for high-power semiconductor light source chips, which is special in that it includes multiple groups of cooling heat sink units stacked in sequence from top to bottom, and the cooling heat sink units adopt the cooling heat sink applied to high-power semiconductor light source chips.

[0034] The present invention has the following advantages:

[0035] 1. The heat exchange energy is strong, and the heat is guided in a controllable and purposeful manner. Through the setting of the heat guide plate, the heat flow is transferred from the upper sealing laminate to the heat guide plate, and merged with the cooling water to generate heat exchange and take away the heat. The heat guide plate is made of a material with a high thermal conductivity coefficient. For example, a solid copper plate has a thermal conductivity coefficient close to 400W / m·K, which is much larger than the thermal conductivity coefficient of fluids such as water, which is 0.55-0.6W / m·K, a difference of nearly 730 times. Solid copper has a better transfer effect. Compared with the structure in the prior art, with the same heating power and the same flow cooling test effect, the temperature rise of the structure of the invention is reduced by 4.43°C. In addition, the heat flow guide plate acts as a bridge to guide and transfer heat, and therefore has the purpose of controlling the uniformity of surface temperature.

[0036] 2. The heat guide plate controls the temperature uniformity of the chip surface based on advantage 1. There is a temperature gradient between the chip and the heat guide plate, and heat quickly diffuses to the heat guide plate, and liquids such as water exchange heat with it. By adjusting the length and length distribution of the heat guide plate, the heat exchange path from the chip surface to the fluid is adjusted, which is equivalent to adjusting the path of the chip to the fluid heat transfer bridge, thereby achieving the purpose of controlling the temperature distribution on the chip surface.

[0037] 3. While ensuring heat exchange, the pressure of the cooling water does not change significantly. Compared with the jet holes in the prior art, the guide groove in the present invention extends the stroke of the microchannel, reduces pressure, increases the specific surface area, and thus improves the heat transfer efficiency. The length of the ribs located in the middle area of ​​the heat guide plate gradually decreases, which is conducive to the cooling water flowing from the microchannel to the fourth hollow microstructure, eliminating resistance and reducing pressure. In addition, the fourth hollow microstructure in the prior art only extends to the third water inlet, and the area communicating with the second hollow structure accounts for a small proportion, while the fourth hollow structure of the present invention extends to the second water outlet, and the area communicating with the third hollow structure accounts for a large proportion, thereby increasing its circulation space, further eliminating resistance and reducing pressure. In addition, the second hollow microstructure in the present invention includes a main flow area, a first microchannel and a second microchannel that are not connected to each other. The first microchannel extends to both sides of the first hollow structure, and the second microchannel extends to the first microchannel. Compared with the second hollow microstructure and the third hollow microstructure in the prior art, its area accounts for a larger proportion, and thus the circulation space of the cooling water is larger, which is conducive to the outflow of cooling water.

[0038] 4. Since the present invention is provided with a heat guide plate, the guide structure is a wavy guide groove, and the second hollow microstructure, the third hollow microstructure and the fourth hollow microstructure have a large area, the above four technical features as a whole enable the cooling heat sink to have a significant cooling effect. Compared with the reference heat sink under the same flow conditions, the temperature rise is reduced by 4°C, and the chip surface temperature distribution can be adjusted according to the length and length distribution of the ribs; when the above effect conditions are met, the fluid driving pressure does not change much. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a schematic diagram of the overall structure of a semiconductor light source chip cooling heat sink in the background art;

[0040] Figure 2 Schematic diagram of an exploded view of a semiconductor light source chip cooling heat sink in the background art (the black arrow represents the flow direction of cooling water);

[0041] Figure 3 1. It is a schematic diagram of the structure of each layer of the semiconductor light source chip cooling heat sink in the background art;

[0042] Figures 1 to 3 The reference numerals are as follows:

[0043] 01-lower sealing laminate, 02-lower cooling laminate, 03-guide laminate, 04-upper cooling laminate, 05-upper sealing laminate, 06-water inlet, 07-first hollow microstructure, 08-first cooling channel, 09-jet hole, 010-second cooling channel, 011-second hollow microstructure, 012-third hollow microstructure, 013-water outlet, 014-second water inlet, 015-fourth hollow microstructure, 016-third water inlet, 017-second water outlet, 018-fourth water inlet, 019-third water outlet;

[0044] Figure 4 2 is a schematic diagram of the overall structure of a semiconductor light source chip cooling heat sink according to an embodiment of the present invention;

[0045] Figure 5 Schematic diagram of the exploded structure of the semiconductor light source chip cooling heat sink in an embodiment of the present invention (the black arrow represents the flow direction of the cooling water, and the gray line represents the heat transfer direction);

[0046] Figure 6 Schematic diagram of the structure of each layer of the semiconductor light source chip cooling heat sink in an embodiment of the present invention;

[0047] Figure 7 2 is a schematic structural diagram of the lower sealing laminate according to an embodiment of the present invention;

[0048] Figure 8 2 is a schematic structural diagram of the lower cooling lamination in an embodiment of the present invention;

[0049] Figure 9 2 is a schematic structural diagram of a guide lamination in an embodiment of the present invention;

[0050] Figure 10 2 is a schematic structural diagram of an upper cooling stack according to an embodiment of the present invention;

[0051] Figure 11 2 is a schematic structural diagram of an upper sealing laminate according to an embodiment of the present invention;

[0052] Figure 12 2 is a schematic structural diagram of a heat guide plate according to an embodiment of the present invention;

[0053] Figures 4 to 12 The reference numerals are as follows:

[0054] 1-upper sealing laminate, 2-upper cooling laminate, 3-guide laminate, 4-lower cooling laminate, 5-lower sealing laminate, 6-first water inlet, 7-first water outlet, 8-first hollow microstructure, 9-second hollow microstructure, 91-main flow area, 92-first microchannel, 93-second microchannel, 10-cooling channel, 11-second water inlet, 12-third hollow microstructure, 13-guide groove, 14-third water inlet, 15-second water outlet, 16-fourth hollow microstructure, 17-heat guide plate, 18-fourth water inlet, 19-third water outlet, 20-first positioning hole, 21-second positioning hole, 22-third positioning hole, 23-microchannel. DETAILED DESCRIPTION

[0055] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0056] like Figures 4 to 7 As shown, a cooling heat sink used for high-power semiconductor light source chips includes five layers of laminates with a length of 28 mm. The laminates are stacked from top to bottom in the order of upper sealing laminate 1, upper cooling laminate 2, guide laminate 3, lower cooling laminate 4 and lower sealing laminate 5.

[0057] like Figure 6 As shown, the lower sealing laminate 5 is provided with a first water inlet 6 and a first water outlet 7 which are isolated from each other.

[0058] The lower cooling laminate 4 is provided with a first hollow microstructure 8 and a second hollow microstructure 9, which are isolated from each other. The position of the first hollow microstructure 8 corresponds to the first water inlet 6, and the position of the second hollow microstructure 9 corresponds to the first water outlet 7. In addition, a cooling channel 10 composed of several ribs is provided within the first hollow microstructure 8. The lengths of the several cooling channels 10 decrease from the middle area to the two side areas, and the width of the cooling channel 10 in the middle area is greater than the width of the remaining cooling channels 10. The lengths of the ribs are 3.35mm, 2.85mm, and 1.85mm, respectively, from long to short, and their width is 0.3mm. The distance between the outermost rib and the edge of the lower cooling laminate 4 is 0.62mm.

[0059] The second hollow microstructure 9 includes a main flow region 91, two mutually symmetrical first microchannels 92, and two mutually symmetrical second microchannels 93. The main flow region 91 is located corresponding to the first water outlet 7. The first microchannels 92 extend from the main flow region 91 to the first hollow microstructure 8. The second microchannels 93 extend from the main flow region 91 to the edges of the first microchannels 92 and are isolated from the first microchannels 92.

[0060] The guide lamination 3 is provided with a second water inlet 11, a third hollow microstructure 12 and a guide groove 13 which are isolated from each other; the position of the second water inlet 11 corresponds to the position of the first microstructure cavity 8; the third microstructure cavity 12 corresponds to the position of the second microstructure cavity 9, and the structure of the third microstructure cavity 12 is exactly the same as that of the second microstructure cavity 9; the guide groove 13 corresponds to the position of several cooling channels 10 and is close to the edge of the guide lamination 3.

[0061] The upper cooling laminate 2 is provided with a third water inlet 14, a second water outlet 15, a fourth hollow microstructure 16 and a heat guide plate 17 that are isolated from each other. The positions of the third water inlet 14 and the second water outlet 15 correspond to the second water inlet 11 and the third hollow microstructure 12 respectively. The fourth hollow microstructure 16 extends along both sides of the third water inlet 14 and extends to the second water outlet 15. A heat guide plate 17 is provided in the fourth hollow microstructure 16 and at a position corresponding to the guide structure on the guide laminate 3. The heat guide plate 17 is made of copper, diamond or silicon carbide, and includes 49 equidistantly arranged ribs. The 49 equidistantly arranged fine ribs constitute 50 micro channels. The width of the ribs and the width of the micro channels 23 are both 0.10 mm. The heat guide plate 17 is made of copper, diamond or silicon carbide. The multiple microchannels 23 form a comb-like pattern, with the ribs in the central region gradually decreasing in length. The ribs on the left and right sides are equal in length, each 3.20 mm. In addition to straight ribs, the heat guide 17 can also employ curved ribs. Furthermore, the heat guide 17 can also be applied to other similar cooling heat sinks, not just this type.

[0062] The upper sealing laminate 1 is provided with a fourth water inlet 18 and a third water outlet 19 which are isolated from each other and whose positions correspond to the third water inlet 14 and the second water outlet 15 respectively.

[0063] The specific flow direction of cooling water of the present invention is as follows:

[0064] The cooling water enters the first hollow microstructure 8 from the first water inlet 6, flows into each cooling channel 10, and then enters the each microchannel 23 on the heat guide plate 17 through the guide groove 13. Since the chip is located at a position corresponding to the upper sealing laminate 1 and the heat guide plate 17, the heat of the chip is transferred to the heat guide plate 17 at this time. After the cooling water exchanges heat with the heat guide plate 17, it takes away the heat, and then the cooling water passes through the fourth hollow microstructure 16, the third hollow microstructure 12, the second hollow microstructure 9, and the first water outlet 7 and flows out, meeting the recycling conditions.

[0065] The principle of this invention is to transfer heat generated by the chip to the coolant in microchannels 23 through solid-state heat transfer. Heat guides 17 act as a bridge, increasing the heat exchange area between the solid structure and the coolant, enhancing heat dissipation and regulating chip surface temperature uniformity. The length and distribution of heat guides 17 affect the heat exchange area and heat conduction.

[0066] This cooling heat transfer not only enhances heat dissipation and reduces the temperature rise of the power chip, but also does not produce a significant change in pressure. The reasons are: 1. Compared with the jet holes in the prior art, the guide groove 13 has an extended stroke and reduces the pressure. 2. The length of the ribs in the middle area of ​​the heat guide plate 17 gradually decreases, which is conducive to the cooling water flowing from the microchannel 23 to the fourth hollow microstructure 16, eliminating resistance. 3. The fourth hollow microstructure in the prior art only extends to the third water inlet, and the area communicating with the second hollow structure accounts for a small proportion, while the fourth hollow microstructure 16 in the present invention extends along both sides of the third water inlet 14 and extends to the second water outlet 15, and the area communicating with the third hollow structure 12 accounts for a large proportion, thereby increasing its circulation space and eliminating resistance. 4. The second hollow microstructure in the present invention includes a main flow area, a first microchannel and a second microchannel that are not connected to each other. The first microchannel extends to both sides of the first hollow structure, and the second microchannel extends to the first microchannel. Compared with the second hollow microstructure and the third hollow microstructure in the prior art, its area occupies a larger proportion, and thus the circulation space of cooling water is larger, eliminating resistance and facilitating the outflow of cooling water.

[0067] As a further optimization of the present invention, the fourth water inlet 18 and the third water outlet 19 have the same radius of 8 mm. The first water inlet 7, the second water inlet 11, the third water inlet 14, the first water outlet 7, and the second water outlet 15 have the same radius of 6 mm. The fourth water inlet 18 and the third water outlet 19 are provided with sealing rings, and the inner diameter of the sealing rings is the same as the diameter of the first water inlet.

[0068] As a further optimization of the present invention, to facilitate positioning, the upper sealing laminate 1, the upper cooling laminate 2, the guide laminate 3, the lower cooling laminate 4, and the lower sealing laminate 5 are each provided with a first positioning hole 20, a second positioning hole 21, and a third positioning hole 22 located in the center. The second positioning hole 21 is symmetrically arranged with the third positioning hole 22. The five first positioning holes 20, the five second positioning holes 21, and the five second positioning holes 22 are all coaxially arranged. The provision of the first positioning hole 20, the second positioning hole 21, and the third positioning hole 22 facilitates the installation of multiple cooling heat sinks. During installation, the upper sealing laminate 5, the upper cooling laminate 4, the guide laminate 3, the lower cooling laminate 2, and the lower sealing laminate 1 can be ensured to be installed in a straight line by inserting a pin, thereby improving assembly accuracy and efficiency.

[0069] In addition, the present invention also provides a stacked array for high-power semiconductor light source chips, including multiple groups of cooling heat sink units stacked in sequence from top to bottom. The cooling heat sink unit provided by the present invention is a cooling heat sink for high-power semiconductor light source chips.

[0070] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A cooling heat sink for a high-power semiconductor light source chip, comprising an upper sealing laminate (1), an upper cooling laminate (2), a guide laminate (3), a lower cooling laminate (4) and a lower sealing laminate (5) which are stacked one on another from top to bottom; The lower sealing laminate (5) is provided with a first water inlet (6) and a first water outlet (7) which are isolated from each other; A first hollow microstructure (8) and a second hollow microstructure (9) isolated from each other are provided on the lower cooling laminate (4); the position of the first hollow microstructure (8) corresponds to the first water inlet (6); a cooling channel (10) composed of a plurality of ribs is provided in the first hollow microstructure (8); the position of the second hollow microstructure (9) corresponds to the first water outlet (7); The guide lamination (3) is provided with a second water inlet (11), a third hollow microstructure (12) and a guide structure which are isolated from each other; the position of the second water inlet (11) corresponds to the first hollow microstructure (8); the position of the guide structure corresponds to a plurality of cooling channels (10); The upper cooling lamination (2) is provided with a third water inlet (14), a second water outlet (15), and a fourth hollow microstructure (16) that are isolated from each other; the positions of the third water inlet (14) and the second water outlet (15) correspond to the second water inlet (11) and the third hollow microstructure (12), respectively; The upper sealing laminate (1) is provided with a fourth water inlet (18) and a third water outlet (19) which are isolated from each other, and their positions correspond to the third water inlet (14) and the second water outlet (15) respectively; Features: A heat guide sheet (17) is provided in the fourth hollow microstructure (16) at a position corresponding to the guide structure on the guide stack (3); The heat guide plate (17) is made of copper, diamond or silicon carbide, and includes N equidistantly arranged ribs, the N equidistantly arranged ribs forming N+1 micro channels, the width of the ribs and the width of the micro channels (23) are both 0.10 mm, and the length of the ribs located in the middle area of ​​the heat guide plate (17) gradually decreases, so as to adjust the heat exchange path from the chip surface to the fluid and control the temperature distribution on the chip surface; The guide structure is a wave-shaped guide groove (13); The fourth hollow microstructure (16) is arranged along both sides of the third water inlet (14) and extends to the second water outlet (15).

2. The cooling heat sink for high-power semiconductor light source chip according to claim 1, characterized in that: The length of the heat guiding sheet (17) is 3.20 mm.

3. The cooling heat sink for high-power semiconductor light source chip according to claim 2, characterized in that: The second hollow microstructure (9) comprises a main flow area (91), two mutually symmetrical first microchannels (92) and two mutually symmetrical second microchannels (93); The position of the main flow area (91) corresponds to the first water outlet (7); The first microchannel (92) extends from the main flow area to the first hollow microstructure (8); the second microchannel (93) extends from the main flow area (91) to the edge of the first microchannel (92) and is isolated from the first microchannel (92); The third hollow microstructure (12) is completely identical to the second hollow microstructure (9).

4. The cooling heat sink for high-power semiconductor light source chip according to claim 3, characterized in that: The widths of the plurality of cooling channels (10) decrease in sequence from the middle area to the two side areas.

5. A cooling heat sink for a high-power semiconductor light source chip according to any one of claims 1 to 4, characterized in that: The radii of the fourth water inlet (18) and the third water outlet (19) are equal, the radii of the first water inlet (6), the second water inlet (11), the third water inlet (14), the first water outlet (7) and the second water outlet (15) are equal, and the radius of the fourth water inlet (18) is greater than that of the first water inlet (6); The fourth water inlet (18) and the third water outlet (19) are provided with sealing rings, and the inner diameter of the sealing rings is the same as the diameter of the first water inlet.

6. The cooling heat sink for high-power semiconductor light source chip according to claim 5, characterized in that: The upper sealing lamination (1), the upper cooling lamination (2), the guide lamination (3), the lower cooling lamination (4) and the lower sealing lamination (5) are all provided with a first positioning hole (20), a second positioning hole (21) and a third positioning hole (22) at a central position; the second positioning hole (21) and the third positioning hole (22) are symmetrically arranged; the five first positioning holes (20), the five second positioning holes (21) and the five third positioning holes (22) are all coaxially arranged with each other.

7. A stacked array for high-power semiconductor light source chips, characterized in that: It comprises a plurality of cooling heat sink units stacked in sequence from top to bottom, wherein the cooling heat sink units adopt the cooling heat sink applied to the high-power semiconductor light source chip as claimed in claim 1.

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