A display device

Abstract

The present disclosure provides a display device, including: a display panel; a printed circuit board, including a first surface and a second surface arranged opposite to each other, and provided with at least one second positioning hole; a middle frame, the printed circuit board is folded back from one side of the display panel, the first surface of the printed circuit board is in contact with one side of the middle frame, and the middle frame is provided with a third positioning hole directly opposite to the position of the second positioning hole; a circuit board covering film covering the second surface of the printed circuit board, including an insulating adhesive layer, a conductive cloth layer and an insulating protective film layer, the insulating adhesive layer is adhered and fixed to the second surface of the printed circuit board, and at least one first positioning hole penetrating through each film layer is provided on the circuit board covering film, and connectors are inserted into the first positioning hole, the second positioning hole and the third positioning hole. The display device provided by the embodiment of the present disclosure can improve the anti-EMI and ESD capabilities of the display module, and at the same time, improve the assembly accuracy of the printed circuit board and the middle frame.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display device. Background Art

[0002] In the related art, OLED (Organic Light-Emitting Diode) display devices as display components of electronic devices have been widely used in various small-sized terminal products, and medium and large-sized OLED display products have also begun to be used in notebook computers.

[0003] For medium and large-sized products, considering the cost and wiring size requirements, most of the OLED circuits are connected to the terminal host through the display screen through COF (Chip On Flex, or Chip On Film) and PCB (Printed Circuit Board). In order to improve the display module's anti-EMI (Electro Magnetic Interference) and anti-ESD (Electro-Static discharge) capabilities, a covering film needs to be attached to the PCB board. Summary of the invention

[0004] The embodiments of the present disclosure provide a display device, which can improve the EMI and ESD resistance of the display module and at the same time improve the assembly accuracy of the printed circuit board and the middle frame.

[0005] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0006] The present disclosure provides a display device, including:

[0007] Display panel;

[0008] A printed circuit board connected to the display panel, the printed circuit board comprising a first surface and a second surface disposed opposite to each other, and at least one second positioning hole is provided on the printed circuit board;

[0009] A middle frame is arranged on the non-display side of the display panel, the printed circuit board is folded back from one side of the display panel, and the first surface of the printed circuit board is attached to one surface of the middle frame, and a third positioning hole is arranged on the middle frame and is directly opposite to the second positioning hole;

[0010] And, a circuit board covering film covering the second surface of the printed circuit board, the film layer structure of the circuit board covering film includes an insulating adhesive layer, a conductive cloth layer and an insulating protective film layer arranged in sequence, the insulating adhesive layer is adhered and fixed to the second surface of the printed circuit board, and at least one first positioning hole penetrating each film layer is provided on the circuit board covering film, the first positioning hole is directly opposite to the second positioning hole and the third positioning hole, and connectors are inserted into the first positioning hole, the second positioning hole and the third positioning hole.

[0011] Exemplarily, a grounded copper-exposed area is provided on the printed circuit board, the conductive cloth layer is in contact and conduction with the copper-exposed area, and the conductive cloth layer is in contact and conduction with the middle frame through the connecting member. Exemplarily, the conductive cloth layer includes a first side surface located on the side where the insulating adhesive layer is located, and a second side surface located on the side where the insulating protective film layer is located; wherein the first side surface is at least partially not covered by the insulating adhesive layer around the first positioning hole, thereby forming a first conductive cloth exposed area; the second side surface is at least partially not covered by the insulating adhesive layer around the first positioning hole, thereby forming a second conductive cloth exposed area;

[0012] The printed circuit board is provided with a copper exposed area around the second positioning hole, the second conductive cloth exposed area is in contact and conduction with the copper exposed area, and the fastening cap of the connector is in contact and conduction with the first conductive cloth exposed area.

[0013] Exemplarily, both the first conductive cloth exposed area and the second conductive cloth exposed area are annular areas arranged around the first positioning hole.

[0014] Exemplarily, the fastening cap of the connector is pressed onto the first conductive cloth exposed area to contact and conduct with the first conductive cloth exposed area, and the outer diameter of the fastening cap is larger than the inner diameter of the first conductive cloth exposed area and smaller than the outer diameter of the first conductive cloth exposed area.

[0015] Exemplarily, the outer diameter of the exposed area of ​​the first conductive cloth is 2 to 5 times the outer diameter of the fastening cap.

[0016] Exemplarily, the insulating protective film layer includes a polyester film.

[0017] Exemplarily, the printed circuit board includes at least a first sub-board and a second sub-board; the circuit board covering film includes at least a first sub-film covering the first sub-board and a second sub-film covering the second sub-board.

[0018] Exemplarily, the display panel includes a binding side connected to the printed circuit board;

[0019] At least two second positioning holes are arranged on the printed circuit board, and the distances between the at least two second positioning holes in a direction perpendicular to the binding side are different.

[0020] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0021] In order to ensure the accuracy of the PCB board after it is folded back onto the middle frame, the display device provided in the embodiment of the present disclosure has positioning holes respectively opened on the PCB board, the circuit board cover film and the middle frame, and connectors are inserted into the positioning holes to improve the assembly accuracy of the PCB board and the middle frame.

[0022] In a further embodiment of the present disclosure, the circuit board covering film also has a first conductive exposed area and a second conductive exposed area around its first positioning hole, so that the ground of the PCB board, the conductive cloth layer, the connector and the middle frame will form a charge path, which not only increases the grounding area of ​​the PCB board, but also, when charges accumulate on the surface of the conductive cloth layer, the charges can be conducted away through the middle frame, thereby improving the anti-EMI and anti-ESD capabilities of the display module and ensuring the electrical stability of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A partial top view showing a display device provided by an embodiment of the present disclosure when the PCB board is not covered with a circuit board cover film;

[0024] Figure 2 A partial top view showing a display device provided by an embodiment of the present disclosure after a circuit board cover film is covered on the PCB board;

[0025] Figure 3 A front view showing a circuit board cover film in a display device provided by an embodiment of the present disclosure;

[0026] Figure 4 A rear view showing a circuit board cover film in a display device provided by an embodiment of the present disclosure;

[0027] Figure 5 express Figure 4 The structural cross-sectional view of C-C';

[0028] Figure 6 express Figure 2 Local structural cross-sectional view of F-F'. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0030] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0031] Before describing in detail the display device provided by the embodiment of the present disclosure, it is necessary to describe the related technologies as follows:

[0032] In the related art, OLED (Organic Light-Emitting Diode) display devices as display components of electronic devices have been widely used in various small-sized terminal products, and medium and large-sized OLED display products have also begun to be used in notebook computers.

[0033] For medium and large-sized products, considering the cost and wiring size requirements, most of the OLED circuits are connected to the terminal host through the display screen, COF (Chip On Flex, or, Chip On Film), PCB (Printed Circuit Board), and PCB. There are many components on the PCB, mainly including T-CON (logic board), PMIC (Power Management IC), ELIC (Every Layer Interconnect Printed Circuit Board), various capacitors, resistors, etc., and its EMI (Electro Magnetic Interference) and ESD (Electro-Static discharge) risks are relatively high. In order to improve the anti-EMI and anti-ESD capabilities of the display module, a cover film needs to be attached to the PCB board.

[0034] In the related art, for medium and large-sized display modules, the PCB board is generally large in size, and the PCB board needs to be folded back from one side of the display panel and fixed on the middle frame, but for large-sized PCB boards, there is a problem of poor positioning accuracy. In addition, the current circuit board covering film covers the entire surface of the PCB board.

[0035] In order to solve the above problems, the embodiments of the present disclosure provide a circuit board covering film, which can improve the EMI and ESD resistance of the display module and at the same time improve the assembly accuracy of the printed circuit board and the middle frame.

[0036] like Figures 3 to 5 As shown, an embodiment of the present disclosure provides a circuit board covering film 10 for covering a printed circuit board (PCB board) of a display module; the film layer structure of the circuit board covering film 10 includes an insulating adhesive layer 11, a conductive cloth layer 12 and an insulating protective film layer 13 arranged in sequence, and at least one first positioning hole 14 penetrating each film layer is provided on the circuit board covering film 10.

[0037] The circuit board covering film 10 provided in the embodiment of the present disclosure has a stacked film layer structure mainly including an insulating adhesive layer 11, a conductive cloth layer 12 and an insulating protective film layer 13, wherein the insulating adhesive layer 11 is used for pasting with the PCB board, the insulating protective film layer 13 is used for protecting the conductive cloth layer 12, and the conductive cloth layer 12 is used for improving the anti-EMI and anti-ESD capabilities of the display module.

[0038] The insulating protective film layer 13 may be made of, for example, a PET film (polyester film). The conductive fabric layer 12 may be made of a film layer including conductive materials, such as metal copper, etc. The above is only an example, but is not limited thereto.

[0039] In the above scheme, if Figure 6 As shown, at least one first positioning hole 14 penetrating through each film layer is provided on the circuit board covering film 10. In order to ensure the accuracy of the PCB board 20 after being folded back onto the middle frame 30, a second positioning hole 21 corresponding to the position of the first positioning hole 14 is also provided on the PCB board 20, and a third positioning hole 31 is provided on the middle frame 30. In this way, the connector 40 can be inserted into the first positioning hole 14, the second positioning hole 21 and the third positioning hole 31 to improve the assembly accuracy of the PCB board 20 and the middle frame 30.

[0040] In some embodiments, a grounded copper-exposed area 22 is provided on the printed circuit board 20, the conductive cloth layer 12 is in contact and conduction with the copper-exposed area 22, and the conductive cloth layer 12 is in contact and conduction with the middle frame 30 through the connector 40. In this way, the ground of the PCB board, the conductive cloth layer 12, the connector 40 and the middle frame 30 will form a charge path, which not only increases the grounding area of ​​the PCB board 20, but also when charges accumulate on the surface of the conductive cloth layer 12, the charges can be conducted away through the middle frame 30, thereby improving the anti-EMI and ESD capabilities of the display module and ensuring the electrical stability of the display module. Specifically, in some embodiments, such as Figures 2 to 6 As shown, the conductive cloth layer 12 includes a first side surface located on the side where the insulating rubber layer 11 is located, and a second side surface located on the side where the insulating protective film layer 13 is located; the first side surface is at least partially not covered by the insulating rubber layer 11 around the first positioning hole 14, thereby forming a first conductive cloth exposure area A; the second side surface is at least partially not covered by the insulating rubber layer 11 around the first positioning hole 14, thereby forming a second conductive cloth exposure area B.

[0041] In the above scheme, the insulating rubber layer 11 and the insulating protective film layer 13 are designed to be inwardly shrunk around the first positioning hole 14, while the conductive cloth layer 12 is expanded outward, that is, the outer diameters of the insulating rubber layer 11 and the insulating protective film layer 13 at the first positioning hole 14 are larger than the outer diameters of the conductive cloth layer 12 at the first positioning hole 14, so that the first side surface and the second side surface opposite to the conductive cloth layer 12 both have conductive cloth exposed areas. In this way, as shown in the figure, when the connector is used for locking, the connector will squeeze the conductive cloth layer 12, and the second conductive cloth exposed area B of the conductive cloth layer 12 will be attached to the copper exposed area around the second positioning hole 21 on the PCB board 20 to achieve contact and conduction. Due to the inwardly shrunk design, the insulating protective film layer 13 will avoid the fastening cap of the connector, so that the fastening cap of the connector is in contact and conduction with the first conductive cloth exposed area A.

[0042] It should be noted that the first conductive cloth exposed area A and the second conductive cloth exposed area B only need to expose a portion of the area around the first positioning hole 14, and the specific area shapes of the first conductive cloth exposed area A and the second conductive part exposed area are not limited.

[0043] It should also be noted that the above is only an example. In actual applications, other methods can be used to achieve conduction between the ground of the PCB board, the conductive cloth layer 12, the connector 40 and the middle frame 30, and this is not limited to this.

[0044] As an exemplary embodiment, Figures 3 to 5 As shown, the first conductive cloth exposed area A and the second conductive cloth exposed area B are both annular areas surrounding the first positioning hole 14. In this way, the fastening cap of the connector can be in contact with all sides, which is beneficial to improve the anti-EMI and ESD capabilities.

[0045] In addition, if Figures 1 to 6 As shown, the embodiment of the present disclosure further provides a display device, including:

[0046] Display panel (not shown in the figure);

[0047] A printed circuit board (PCB board) 20 connected to the display panel, the printed circuit board 20 comprising a first surface and a second surface disposed opposite to each other, and at least one second positioning hole 21 is provided on the printed circuit board 20;

[0048] A middle frame 30 is disposed on the non-display side of the display panel, the printed circuit board 20 is folded back from one side of the display panel, and a first surface of the printed circuit board 20 is attached to a surface of the middle frame 30, and a third positioning hole 31 is provided on the middle frame 30 and is directly opposite to the second positioning hole 21;

[0049] And, a circuit board covering film 10 covering the second surface of the printed circuit board, the film layer structure of the circuit board covering film 10 includes an insulating adhesive layer 11, a conductive cloth layer 12 and an insulating protective film layer 13 arranged in sequence, the insulating adhesive layer 11 is adhered and fixed to the second surface of the printed circuit board, and at least one first positioning hole 14 penetrating each film layer is provided on the circuit board covering film 10, the first positioning hole 14 is opposite to the position of the second positioning hole 21 and the third positioning hole 31, and a connector 40 is inserted into the first positioning hole 14, the second positioning hole 21 and the third positioning hole 31.

[0050] The display device provided by the embodiment of the present disclosure, the circuit board covering film 10 used therein is the circuit board covering film 10 provided by the embodiment of the present disclosure, the stacked film layer structure of the circuit board covering film 10 mainly includes an insulating adhesive layer 11, a conductive cloth layer 12 and an insulating protective film layer 13, wherein the insulating adhesive layer 11 is used for bonding with the PCB board 20, the insulating protective film layer 13 is used for protecting the conductive cloth layer 12, and the conductive cloth layer 12 is used for improving the anti-EMI and anti-ESD capabilities of the display module.

[0051] In the above scheme, at least one first positioning hole 14 penetrating each film layer is provided on the circuit board covering film 10. In order to ensure the accuracy of the PCB board 20 after being folded back onto the middle frame 30, a second positioning hole 21 corresponding to the position of the first positioning hole 14 is also provided on the PCB board 20, and a third positioning hole 31 is provided on the middle frame 30. In this way, the connector 40 can be inserted into the first positioning hole 14, the second positioning hole 21 and the third positioning hole 31 to improve the assembly accuracy of the PCB board 20 and the middle frame 30.

[0052] In some embodiments, a grounded copper-exposed area 22 is provided on the printed circuit board 20, the conductive cloth layer 12 is in contact and conduction with the copper-exposed area 22, and the conductive cloth layer 12 is in contact and conduction with the middle frame 30 through the connector 40. In this way, the ground of the PCB board, the conductive cloth layer 12, the connector 40 and the middle frame 30 will form a charge path, which not only increases the grounding area of ​​the PCB board 20, but also, when charges are accumulated on the surface of the conductive cloth layer 12, the charges can be conducted away through the middle frame 30, thereby improving the anti-EMI and ESD capabilities of the display module and ensuring the electrical stability of the display module.

[0053] Specifically, in some embodiments, the conductive fabric layer 12 includes a first side surface located on the side where the insulating adhesive layer 11 is located, and a second side surface located on the side where the insulating protective film layer 13 is located; wherein the first side surface is at least partially not covered by the insulating adhesive layer 11 around the first positioning hole 14, thereby forming a first conductive fabric exposure area A; the second side surface is at least partially not covered by the insulating adhesive layer 11 around the first positioning hole 14, thereby forming a second conductive fabric exposure area B;

[0054] The printed circuit board 20 is provided with the copper exposed area 22 around the second positioning hole 21, the second conductive cloth exposed area B is in contact and conduction with the copper exposed area 22, and the fastening cap 41 of the connector 40 is in contact and conduction with the first conductive cloth exposed area A.

[0055] In the above scheme, the insulating rubber layer 11 and the insulating protective film layer 13 are designed to be inwardly shrunk around the first positioning hole 14, while the conductive cloth layer 12 is expanded outward, that is, the outer diameters of the insulating rubber layer 11 and the insulating protective film layer 13 at the first positioning hole 14 are larger than the outer diameters of the conductive cloth layer 12 at the first positioning hole 14, so that the first side surface and the second side surface opposite to the conductive cloth layer 12 both have conductive cloth exposed areas. In this way, as shown in the figure, when the connector is used for locking, the connector will squeeze the conductive cloth layer 12, and the second conductive cloth exposed area B of the conductive cloth layer 12 will be attached to the copper exposed area 22 around the second positioning hole 21 on the PCB board 20, so as to contact and conduct. Due to the inwardly shrunk design, the insulating protective film layer 13 will avoid the fastening cap 41 of the connector, so that the fastening cap 41 of the connector is in contact and conduct with the first conductive cloth exposed area A.

[0056] It should be noted that the first conductive cloth exposed area A and the second conductive cloth exposed area B only need to expose a portion of the area around the first positioning hole 14, and the specific area shapes of the first conductive cloth exposed area A and the second conductive part exposed area are not limited.

[0057] As some exemplary embodiments, the first conductive cloth exposed area A and the second conductive cloth exposed area B are both annular areas arranged around the first positioning hole 14. In this way, the fastening cap 41 of the connector can be in contact with all sides, which is beneficial to improve the anti-EMI and ESD capabilities.

[0058] In addition, in some embodiments, the connector 40 includes a fastening cap 41, which is pressed on the first conductive cloth exposed area A to contact and conduct with the first conductive cloth exposed area A, and the outer diameter of the fastening cap 41 is larger than the inner diameter of the first conductive cloth exposed area A and smaller than the outer diameter of the first conductive cloth exposed area A.

[0059] In this way, it can be ensured that the insulating protection film layer 13 effectively avoids the fastening cap 41 of the connector, so as to ensure that the fastening cap 41 of the connector 40 can be in good contact with the exposed area A of the first conductive cloth.

[0060] As some exemplary embodiments, the outer diameter of the first conductive cloth exposed area A is 2 to 5 times the outer diameter of the fastening cap 41 of the connector 40 .

[0061] Of course, it is understandable that the size relationship between the first conductive cloth exposed area A and the fastening cap 41 is not limited thereto.

[0062] The insulating protective film layer 13 may be made of, for example, a PET film (polyester film). The conductive fabric layer 12 may be made of a film layer including conductive materials, such as metal copper, etc. The above is only an example, but is not limited thereto.

[0063] In addition, in some exemplary embodiments, the printed circuit board 20 includes at least a first sub-board 201 and a second sub-board 202 ; the circuit board covering film 10 includes at least a first sub-film 101 covering the first sub-board 201 and a second sub-film 102 covering the second sub-board 202 .

[0064] In addition, if Figure 1 As shown, the display panel includes a binding side connected to the printed circuit board;

[0065] At least two second positioning holes are arranged on the printed circuit board, and the distances between the at least two second positioning holes in the direction perpendicular to the binding side are different. In other words, the at least two second positioning holes are arranged in a staggered manner, so that the staggered arrangement of the second positioning holes is more conducive to positioning the printed circuit board.

[0066] There are a few points to note:

[0067] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0068] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0069] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0070] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A display device, It is characterized in that include: Display panel; A printed circuit board connected to the display panel, the printed circuit board comprising a first surface and a second surface disposed opposite to each other, and at least one second positioning hole is provided on the printed circuit board; A middle frame is arranged on the non-display side of the display panel, the printed circuit board is folded back from one side of the display panel, and the first surface of the printed circuit board is attached to one surface of the middle frame, and a third positioning hole is arranged on the middle frame and is directly opposite to the second positioning hole; and, a circuit board covering film covering the second surface of the printed circuit board, the film layer structure of the circuit board covering film comprising an insulating adhesive layer, a conductive cloth layer and an insulating protective film layer arranged in sequence, the insulating protective film layer comprising a polyester film, the insulating adhesive layer is adhered and fixed to the second surface of the printed circuit board, at least one first positioning hole penetrating through each film layer is provided on the circuit board covering film, the first positioning hole is directly opposite to the second positioning hole and the third positioning hole, and a connector is inserted into the first positioning hole, the second positioning hole and the third positioning hole; A grounded copper-exposed area is provided on the printed circuit board, the conductive cloth layer is in contact and conduction with the copper-exposed area, and the conductive cloth layer is in contact and conduction with the middle frame through the connecting member; The conductive fabric layer includes a first side surface located on the side where the insulating adhesive layer is located, and a second side surface located on the side where the insulating protective film layer is located; wherein the first side surface is at least partially not covered by the insulating adhesive layer around the first positioning hole, thereby forming a first conductive fabric exposed area; and the second side surface is at least partially not covered by the insulating adhesive layer around the first positioning hole, thereby forming a second conductive fabric exposed area; The copper exposed area is arranged around the second positioning hole of the printed circuit board, the second conductive cloth exposed area is in contact and conduction with the copper exposed area, and the fastening cap of the connector is in contact and conduction with the first conductive cloth exposed area.

2. The display device according to claim 1, It is characterized in that The first conductive cloth exposed area and the second conductive cloth exposed area are both annular areas arranged around the first positioning hole.

3. The display device according to claim 2, It is characterized in that The fastening cap of the connector is pressed onto the first conductive cloth exposed area to be in contact and conduction with the first conductive cloth exposed area. The outer diameter of the fastening cap is larger than the inner diameter of the first conductive cloth exposed area and smaller than the outer diameter of the first conductive cloth exposed area.

4. The display device according to claim 3, It is characterized in that The outer diameter of the exposed area of ​​the first conductive cloth is 2 to 5 times the outer diameter of the fastening cap.

5. The display device according to claim 1, It is characterized in that The printed circuit board includes at least a first sub-board and a second sub-board; the circuit board covering film includes at least a first sub-film covering the first sub-board and a second sub-film covering the second sub-board.

6. The display device according to claim 1, It is characterized in that The display panel includes a binding side connected to the printed circuit board; At least two second positioning holes are arranged on the printed circuit board, and the distances between the at least two second positioning holes in a direction perpendicular to the binding side are different.

Images