Power conversion device

Abstract

Provided is a power conversion device, comprising: an inverter, which is composed of a plurality of electronic components; a smoothing capacitor, which smoothes the power; a housing, which accommodates the inverter and the smoothing capacitor; and a first conductor, which connects the smoothing capacitor and the inverter. The housing is composed of the following components: a base, which is formed of a resin material and on which the inverter and the smoothing capacitor are placed; and a cover, which is mounted on the base so as to cover the inverter and the smoothing capacitor. The first conductor is close to or in contact with the base of the housing in the middle of connecting the smoothing capacitor and the inverter.

Description

Technical Field

[0001] The invention relates to a power conversion device. Background Art

[0002] JP2018-121457A discloses a power conversion device including an inverter, a smoothing capacitor, and a metal housing for housing the inverter and the smoothing capacitor. In the power conversion device, the smoothing capacitor and the inverter are connected by a conductor, and an insulating member is interposed between the conductor and the housing to ensure insulation between the conductor and the metal housing. Summary of the invention

[0003] However, in the above-mentioned power conversion device, since the insulating member as a separate component is interposed between the conductor portion and the case, the number of components increases, and the manufacturing cost increases.

[0004] On the other hand, it is also possible to ensure insulation by increasing the insulating space distance between the conductor part and the metal case without using an insulating member, but in this case, a large space is required and the device becomes larger.

[0005] In view of the above problems, an object of the present invention is to provide a power conversion device that can ensure insulation between a conductor portion connected to a smoothing capacitor and a case and achieve cost reduction and space saving.

[0006] According to one embodiment of the present invention, there is provided a power conversion device, comprising: an inverter, which is composed of a plurality of electronic components; a smoothing capacitor, which smoothes the power; a housing, which accommodates the inverter and the smoothing capacitor; and a first conductor, which connects the smoothing capacitor and the inverter. The housing is composed of the following components: a base, which is formed of a resin material and on which the inverter and the smoothing capacitor are placed; and a cover, which is mounted on the base so as to cover the inverter and the smoothing capacitor. The first conductor is close to or in contact with the base of the housing in the middle of connecting the smoothing capacitor and the inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is a schematic cross-sectional view of the power conversion device according to the first embodiment.

[0008] Figure 2 is with Figure 1 Schematic cross-sectional views of the power conversion device according to the first embodiment at different positions.

[0009] Figure 3 This is an oblique view of the bottom of the smoothing capacitor.

[0010] Figure 4 It is a cross-sectional view of the base portion of the housing before the cover portion is mounted.

[0011] Figure 5 This is a diagram of the installation of a smoothing capacitor.

[0012] Figure 6 It is a schematic cross-sectional view of a power conversion device according to a modification of the first embodiment.

[0013] Figure 7 It is a schematic cross-sectional view of a power conversion device according to the second embodiment.

[0014] Figure 8 This is an oblique view of the bottom of the smoothing capacitor.

[0015] Fig. 9 It is a schematic cross-sectional view of a power conversion device according to a modification of the second embodiment.

[0016] Fig.10 It is a schematic cross-sectional view of a power conversion device according to a third embodiment.

[0017] Fig.11 It is a schematic cross-sectional view of a power conversion device according to a fourth embodiment.

[0018] Fig.12 It is a schematic cross-sectional view of a power conversion device according to a modified example of the fourth embodiment.

[0019] Fig.13 This is an oblique view of the bottom of the smoothing capacitor.

[0020] Fig.14 It is a schematic cross-sectional view of a power conversion device according to a fifth embodiment.

[0021] Fig.15 This is an oblique view of the bottom of the smoothing capacitor.

[0022] Fig.16 It is a schematic cross-sectional view of a power conversion device according to a sixth embodiment.

[0023] Fig.17 It is a cross-sectional schematic diagram of the power conversion device showing the appearance of a smoothing capacitor.

[0024] Fig.18 It is a schematic cross-sectional view of a power conversion device according to another embodiment. DETAILED DESCRIPTION

[0025] Hereinafter, embodiments of the present invention will be described with reference to the drawings and the like.

[0026] (First embodiment)

[0027] Reference Figure 1 to Figure 5A power conversion device 100 according to a first embodiment of the present invention will be described.

[0028] Figure 1 and Figure 2 is a schematic cross-sectional view of a power conversion device according to a first embodiment, Figure 1 This is a cross-sectional view of the part including the conductor part for input. Figure 2 It is a cross-sectional view of a portion including an output conductor portion.

[0029] like Figure 1 and Figure 2 As shown, the power conversion device 100 includes an inverter 1, a smoothing capacitor 2, and a case 3, and is mounted on a vehicle or the like.

[0030] Inverter 1 and smoothing capacitor 2 are accommodated in housing 3. Inverter 1 and smoothing capacitor 2 are electrically connected by a plurality of conductors 10 (first conductors), and smoothing capacitor 2 and power source 4 outside the housing are electrically connected by a plurality of conductors 20 and 30 (second conductors).

[0031] The inverter 1 is composed of a plurality of electronic components, including a power module 11 having a built-in semiconductor element and a control substrate 12 having a control circuit. The inverter 1 has a function of converting electric power into direct current or alternating current.

[0032] The power module 11 is composed of a plurality of semiconductor elements combined. The power module 11 is mounted on a substrate 111 and fixed to the substrate 111 by bolts or the like. The substrate 111 is fixed to a base portion 31 of a housing 3 described later by bolts or the like. In addition, the power module 11 is electrically connected to a control substrate 12 and is connected to a smoothing capacitor 2 via a conductor portion 10. The conductor portion 10 is fixed to the power module 11 by bolts or the like at a terminal portion 112 provided on the power module 11.

[0033] The smoothing capacitor 2 is composed of a capacitor element 21, a filling material 22, and a capacitor case 23, and is arranged in parallel with the inverter 1 in a substantially horizontal direction. The capacitor case 23 is made of a resin such as polyphenylene sulfide (PPS) or polyphthalamide (PPA), and accommodates the capacitor element 21. The capacitor element 21 is connected to the power module 11 of the inverter 1 via the conductor 10, and is connected to the power source 4 outside the housing 3 via the conductor 20 and the conductor 30. The filling material 22 is a potting material containing silicone, for example, and fills the periphery of the capacitor element 21 to fix the capacitor element 21 in the capacitor case 23.

[0034] The housing 3 is composed of the following components: a base portion 31 on which the inverter 1 and the smoothing capacitor 2 are placed; a cover portion 32 installed on the base portion 31 in a manner covering the inverter 1 and the smoothing capacitor 2; and a thin plate 33 provided on the lower surface of the base portion 31 and serving as a bottom plate of the cover portion 32.

[0035] The base 31 is formed into a plate-shaped member made of an electrically insulating resin material such as polyphenylene sulfide (PPS) or polyphthalamide (PPA), and the inverter 1 and the smoothing capacitor 2 are mounted on a mounting surface 311. The base 31 has a cooling path 34 (first refrigerant flow path) for cooling water (refrigerant) for cooling the inverter 1 below the portion where the inverter 1 is mounted. A metal thin plate 33 made of aluminum or the like that is larger than the outer shape of the lower surface 312 is provided on the lower surface 312 of the base 31.

[0036] A substrate 111 having a larger outer shape than the cooling path 34 is provided on the upper surface of the cooling path 34 of the base portion 31, and the substrate 111 is fastened to the base portion 31 by bolts or the like. Fins 113 are provided at the lower portion of the power module 11. The substrate 111 is provided with a plurality of holes through which the fins 113 pass, and the fins 113 contact the cooling water in the cooling path 34 through the holes. In addition, it is preferred that the fins 113 are provided on the power module 11 so as to contact the cooling water, but the present invention is not limited thereto, and the fins 113 may not be provided.

[0037] The cover 32 is formed of a metal material such as aluminum, and is mounted on the base 31 so as to cover the periphery of the inverter 1 and the smoothing capacitor 2. The cover 32 is composed of an upper wall 321 and a side wall 322. The side wall 322 is formed with an opening 323a ( Figure 1 ), which is opened in such a way that the conductor portion 30a for input connected to the power supply 4 passes through; and the opening 323b ( Figure 2 ), which is opened in a manner that allows the conductor portion 30b for output connected to the power source 4 to pass through. In addition, a step portion 324 having an end face that abuts against the mounting surface 311 of the base portion 31 is formed on the inner side of the side wall 322. The front end face 325 of the side wall 322 abuts against the outer peripheral edge 331 of the thin plate 33 provided on the lower surface 312 of the base portion 31. The cover portion 32, the base portion 31, and the thin plate 33 are fastened together and connected by bolts or the like from the outside of the thin plate 33 at a portion where the step portion 324 of the cover portion 32 abuts against the mounting surface 311 of the base portion 31. Thus, the inverter 1 and the smoothing capacitor 2 are completely covered by the cover portion 32 and the thin plate 33 formed of a metal material, thereby improving the electromagnetic shielding property of the power conversion device 100. Furthermore, an openable and closable cover portion 326 may be provided on the upper wall 321 of the cover portion 32 so that the conductor portion 20 and the conductor portion 30 described below can be tightly connected.

[0038] Figure 3 It is a perspective view of the bottom surface of the smoothing capacitor 2.

[0039] The capacitor case 23 of the smoothing capacitor 2 accommodates the capacitor element 21 inside, and the periphery of the capacitor element 21 is filled with the filling material 22. The periphery of the filling material 22 is covered by the upper surface 231, the front surface 232, the rear surface 233, and the side surface 234 of the capacitor case 23. The bottom surface of the capacitor case 23 is open, and the filling material 22 forms a filling surface 221 at the bottom surface of the smoothing capacitor 2.

[0040] The capacitor case 23 has a bracket 24 protruding outward from the front surface 232 and the rear surface 233, and a positioning pin 25 protruding downward from the bottom surface. The bracket 24 is a member for fastening the smoothing capacitor 2 to the case 3. The bracket 24 is provided with a hole 241 through which a bolt or the like for fastening the smoothing capacitor 2 to the base 31 passes. The positioning pin 25 is a member for determining the horizontal position of the smoothing capacitor 2 in the case 3. The positioning pin 25 protrudes downward from the bottom surface from a corner 235 connecting a side surface 234b of the capacitor case 23 on the bottom surface of the smoothing capacitor 2 and the front surface 232, and a corner 236 connecting a side surface 234b of the capacitor case 23 on the bottom surface of the smoothing capacitor 2 and the rear surface 233. The positioning pin 25 is inserted into the base 31 to determine the horizontal position of the smoothing capacitor 2 relative to the case 3.

[0041] In addition, in the present embodiment, the positioning pins 25 are respectively provided at the corners 235 and 236 connecting the side surface 234b of the capacitor case 23 on the bottom surface of the smoothing capacitor 2 with the front surface 232 and the rear surface 233, but the number and position of the positioning pins 25 are not limited thereto. For example, the positioning pins 25 may be provided at all four corners of the bottom surface of the smoothing capacitor 2.

[0042] The plurality of conductors 10 and 20 connected to the capacitor element 21 extend from the filling surface 221 to the outside of the smoothing capacitor 2. The conductors 10, 20, and the conductor 30 described later are, for example, metal busbars made of copper, aluminum, etc. having good conductivity. The conductor 10 protrudes from the vicinity of the side surface 234a of the capacitor case 23 on the filling surface 221 to the outside of the smoothing capacitor 2, and electrically connects the capacitor element 21 to the power module 11 of the inverter 1. In addition, the conductor 20 protrudes from the vicinity of the side surface 234b of the capacitor case 23 on the other side of the filling surface 221 to the outside of the smoothing capacitor 2, and electrically connects the capacitor element 21 to the power source 4 outside the power conversion device 100 via the conductor 30. The conductor 20 and the conductor 30 respectively include the conductor 20a and the conductor 30a for inputting power from the power source 4, and the conductor 20b and the conductor 30b for outputting power to the power source 4. Note that the details of the arrangement of the conductor portion will be described later.

[0043] Figure 4 3 is a cross-sectional view of the base portion 31 of the housing 3, and is a view showing the base portion 31 before the cover portion 32 is mounted. Figure 5 It is a cross-sectional view of the power conversion device 100 and is an installation diagram of the smoothing capacitor 2 .

[0044] The base portion 31 is formed of an electrically insulating resin material such as Figure 4 As shown in FIG. 1 , the cooling device is composed of a main body 313 and a bottom plate 314. The main body 313 has an opening 315 for forming a cooling path 34, a joint 316 for joining the bottom plate 314, and a terminal 317 for fastening and connecting the conductor 20 and the conductor 30. Figure 5 As shown, the main body 313 further includes: a holding portion 318 for holding the smoothing capacitor 2; and a pin support portion 319 into which the positioning pin 25 for positioning the smoothing capacitor 2 is inserted.

[0045] The opening 315 of the main body 313 is provided at the position of the base 31 where the inverter 1 is placed, and is open on the upper and lower surfaces. The joint 316 is a portion into which the convex portion 3141 of the bottom plate 314 described later is inserted and joined. The joint 316 is a hole with an open lower surface, and is provided around the opening 315.

[0046] The bottom plate portion 314 has a larger shape than the opening portion 315 of the main body portion 313, and has a convex portion 3141 protruding upward from the upper surface of the bottom plate portion 314 at a position of the main body portion 313 corresponding to the joint portion 316. The convex portion 3141 and the joint portion 316 of the main body portion 313 are joined by welding or the like, and a concave portion 341 is formed at the position of the opening portion 315 by joining the main body portion 313 and the bottom plate portion 314. The concave portion 341 is a groove for constituting a cooling path 34 for the flow of cooling water for cooling the inverter 1. Figure 5 As shown, the upper portion of the recess 341 is covered with the substrate 111 of the power module 11 , thereby forming a cooling path 34 (first refrigerant flow path) surrounded by the main body 313 , the bottom plate 314 , and the substrate 111 .

[0047] like Figure 5 As shown, the terminal portion 317 of the main body 313 is a portion for connecting the conductor portion 20 connected to the smoothing capacitor 2 and the conductor portion 30 connected to the power supply 4, and is provided at a position between the portion where the smoothing capacitor 2 is provided and the side wall 322 of the housing 3. The terminal portion 317 is provided integrally with the base portion 31 in a manner protruding upward from the mounting surface 311 of the base portion 31, and the conductor portion 20 and the conductor portion 30 are fastened to the base portion by bolts or the like at the upper surface 3171 of the terminal portion 317. In this way, the terminal portion 317 is provided integrally with the base portion 31 constituting the housing 3, so that cost reduction can be achieved compared with the case where the terminal portion 317 is provided as a separate component.

[0048] The holding portion 318 of the main body 313 is a portion for holding the smoothing capacitor 2, and is provided at a position opposite to the bracket 24 of the smoothing capacitor 2, protruding upward from the mounting surface 311 of the base 31. The smoothing capacitor 2 is fastened to the holding portion 318 by bolts or the like through the hole 241 of the bracket 24. As a result, the movement of the smoothing capacitor 2 in the vertical direction relative to the housing 3 is particularly restricted.

[0049] The pin support portion 319 of the body portion 313 is provided at a position corresponding to the positioning pin 25 of the smoothing capacitor 2 so as to protrude upward from the mounting surface 311 of the base portion 31. The positioning pin 25 is inserted into the pin support portion 319 to determine the horizontal position of the smoothing capacitor 2 relative to the case 3.

[0050] Furthermore, in order to facilitate positioning of the smoothing capacitor 2 , as described above, it is preferable to provide the positioning pins 25 on the capacitor case 23 and the pin support portions 319 on the base portion 31 , but these components are not necessarily provided.

[0051] A cavity 3101 with an open bottom surface can be formed in a portion of the base 31 where the cooling path 34 is not provided. Thus, the power conversion device 100 is lightweight. In addition, the number and shape of the cavity 3101 are not particularly limited. For example, a large cavity can be provided, and a structure with a closed bottom surface can be provided.

[0052] Next, the arrangement of the conductor portion will be described in detail.

[0053] like Figure 1 and Figure 2 As shown, one end of the conductor part 10 electrically connecting the inverter 1 and the smoothing capacitor 2 is connected to the capacitor element 21 of the smoothing capacitor 2, and protrudes downward from the potting surface 221 of the smoothing capacitor 2. The other end of the conductor part 10 is fixed to the power module 11 by bolts or the like at the terminal part 112 provided on the power module 11 of the inverter 1. Thus, the inverter 1 and the smoothing capacitor 2 are electrically connected by the conductor part 10.

[0054] In addition, the conductor part 10 is close to the base part 31 of the housing 3 in the middle of connecting the capacitor element 21 of the smoothing capacitor 2 and the power module 11 of the inverter 1. In this way, even if the conductor part 10 is arranged at a position close to the base part 31, since the base part 31 is formed of an insulating material, the insulation between the conductor part 10 and the housing 3 can be ensured. In addition, since the conductor part 10 is close to the base part 31, the heat of the conductor part 10 is also released to the base part 31 through the space between the base part 31 and the conductor part 10. Here, the base part 31 has a cooling path 34, so the base part 31 is also cooled by the cooling water flowing in the cooling path 34. Therefore, heat exchange is performed between the base part 31 cooled by the cooling water and the conductor part 10, and the smoothing capacitor 2 connected to the conductor part 10 is cooled.

[0055] The conductor part 20 and the conductor part 30 are components for electrically connecting the smoothing capacitor 2 and the power source 4 outside the housing 3. The conductor part 20 is composed of the conductor part 20a for input and the conductor part 20b for output, and the conductor part 30 is composed of the conductor part 30a for input and the conductor part 30b for output. Figure 1 to Figure 3 As shown, one end of the conductor parts 20a, 20b is connected to the capacitor element 21 of the smoothing capacitor 2, and protrudes downward from the potting surface 221 of the smoothing capacitor 2. The other ends of the conductor parts 20a, 20b are connected to the conductor parts 30a, 30b at the upper surfaces 3171a, 3171b of the terminal parts 317a, 317b protruding upward from the mounting surface 311 of the base part 31. The conductor parts 20a, 20b and the conductor parts 30a, 30b are fastened to the base part 31 together at the upper surfaces 3171a, 3171b of the terminal parts 317a, 317b by bolts or the like.

[0056] In addition, the conductor parts 20a and 20b are close to the base part 31 of the case 3 in the middle of connecting the capacitor element 21 of the smoothing capacitor 2 and the conductor parts 30a and 30b. In this way, even if the conductor parts 20a and 20b are arranged at a position close to the base part 31, since the base part 31 is formed of an insulating material, the insulation between the conductor parts 20a and 20b and the case 3 can be ensured. In addition, similarly to the conductor part 10, the conductor parts 20a and 20b are close to the base part 31, so the heat of the conductor parts 20a and 20b is also released to the base part 31 through the space between the base part 31 and the conductor parts 20a and 20b. That is, similarly to the conductor part 10, heat exchange is performed between the base part 31 cooled by cooling water and the conductor parts 20a and 20b, and the smoothing capacitor 2 connected to the conductor parts 20a and 20b is cooled.

[0057] One end of the conductor parts 30a, 30b is connected to the conductor parts 20a, 20b at the upper surfaces 3171a, 3171b of the terminal parts 317a, 317b, and is extended from the opening parts 323a, 323b formed in the side wall 322 of the housing 3 to the outside of the housing 3. The other ends of the conductor parts 30a, 30b are connected to the external power supply 4. In this way, the smoothing capacitor 2 and the power supply 4 are electrically connected via the conductor parts 20a and 30a for input and the conductor parts 20b and 30b for output.

[0058] The length of the portion where the conductor portion 10 and the conductor portion 20 are close to the base portion 31 is not particularly limited, but in order to further increase the cooling effect of the cooling water, it is preferable to make the distance of the close portion as long as possible.

[0059] In addition, Figure 3 In the embodiment, six conductor portions 10 and two conductor portions 20a and two conductor portions 20b protrude from the smoothing capacitor 2, but the number of conductor portions is not limited thereto.

[0060] According to the power conversion device 100 of the first embodiment described above, the following effects can be obtained.

[0061] The housing 3 of the power conversion device 100 is formed of a resin material and is composed of the following components: a base portion 31 on which the inverter 1 and the smoothing capacitor 2 are placed; and a cover portion 32 which is attached to the base portion 31 in a manner covering the inverter 1 and the smoothing capacitor 2. In addition, the conductor portion 10 (first conductor portion) connecting the smoothing capacitor 2 and the inverter 1 is close to the base portion 31 of the housing 3 in the middle of connecting the smoothing capacitor 2 and the inverter 1. In this way, the base portion 31 is formed of an insulating material to ensure insulation between the conductor portion 10 and the housing 3, and the conductor portion 10 is arranged at a position close to the base portion 31. Therefore, it is not necessary to interpose other components such as an insulating member between the conductor portion 10 and the housing 3, so that cost reduction can be achieved, and the conductor portion 10 is arranged at a position close to the base portion 31, so that space saving can be achieved compared with a case where the insulation space distance between the conductor portion 10 and the housing 3 is increased. That is, it is possible to provide a power conversion device that ensures insulation between the conductor portion 10 connected to the smoothing capacitor 2 and the housing 3 and achieves cost reduction and space saving.

[0062] Next, the power conversion device 100 has conductors 20 and 30 (second conductors) connecting the smoothing capacitor 2 and the power source 4 outside the housing 3, and the conductor 20 is close to the base 31 of the housing 3 in the middle of connecting the smoothing capacitor 2 and the power source 4. The base 31 is formed of an insulating material, so it is not necessary to insert other components such as insulating members between the conductor 20 and the housing 3 as with the conductor 10, and low cost can be achieved. In addition, the conductor 20 is arranged at a position close to the base 31, so that space saving can be achieved compared to the case where the insulating space distance between the conductor 20 and the housing 3 is increased. That is, it is possible to provide a power conversion device that ensures insulation between the conductor 20 connected to the smoothing capacitor 2 and the housing 3 and achieves low cost and space saving.

[0063] In addition, the base portion 31 of the power conversion device 100 has a cooling path 34 (first refrigerant flow path) for cooling water (refrigerant) for cooling the inverter 1. Thus, the inverter 1 is directly cooled, and the base portion 31 is also cooled by heat exchange between the cooling water and the base portion 31. On the other hand, the conductor portions 10 and 20 are close to the base portion 31, so the heat of the conductor portions 10 and 20 is also released to the base portion 31 through the base portion 31 and the space between the conductor portions 10 and 20. Therefore, heat exchange is performed between the base portion 31 cooled by the cooling water and the conductor portions 10 and 20, and the cooling performance of the smoothing capacitor 2 connected to the conductor portions 10 and 20 can be improved. That is, it is possible to provide a power conversion device that ensures the insulation between the conductor portions 10 and 20 connected to the smoothing capacitor 2 and the housing 3 and improves the cooling effect of the smoothing capacitor 2.

[0064] (Variation of the first embodiment)

[0065] Reference Figure 6 A modification of the power conversion device 100 according to the first embodiment of the present invention will be described.

[0066] Figure 6 1 is a schematic cross-sectional view of a power conversion device 100 according to a modified example of the first embodiment. Figure 6 As shown, in this modification, the conductor part 10 is arranged to contact the base part 31 of the case 3 in the middle of connecting the capacitor element 21 of the smoothing capacitor 2 and the power module 11 of the inverter 1. In this way, even if the conductor part 10 is in contact with the base part 31, since the base part 31 is formed of an insulating material, the insulation between the conductor part 10 and the case 3 can be ensured.

[0067] According to the modification of the above-mentioned first embodiment, the following effects can also be obtained.

[0068] The power conversion device 100 has a base portion 31 of a housing 3 formed of an insulating resin material, and a conductor portion 10 (first conductor portion) connecting the smoothing capacitor 2 and the inverter 1 is in contact with the base portion 31 of the housing 3 in the middle of connecting the smoothing capacitor 2 and the inverter 1. That is, by forming the base portion 31 with an insulating material, the insulation between the conductor portion 10 and the housing 3 can be ensured, and the conductor portion 10 is arranged to be in contact with the base portion 31. In this way, the conductor portion 10 is in contact with the housing 3, so that the space between the conductor portion 10 and the housing 3 disappears, and thus the power conversion device can be further space-saving. That is, it is possible to provide a power conversion device that ensures the insulation between the conductor portion 10 connected to the smoothing capacitor 2 and the housing 3 and further achieves space saving.

[0069] In addition, since the conductor part 10 is in contact with the base part 31 of the housing 3, heat exchange is performed between the cooling water flowing in the cooling path 34 (first refrigerant flow path) via the base part 31 and the conductor part 10. That is, heat exchange is performed between the cooling water and the conductor part 10 without passing through the space between the conductor part 10 and the base part 31. Therefore, compared with the case where the conductor part 10 is not in contact with the base part 31 of the housing 3, the cooling effect of the cooling water flowing in the cooling path 34 is more easily transmitted to the conductor part 10, and the cooling performance of the smoothing capacitor 2 connected to the conductor part 10 can be further improved. That is, it is possible to provide a power conversion device that ensures the insulation between the housing 3 and the conductor part 10 and further improves the cooling performance of the smoothing capacitor 2.

[0070] In addition, in this embodiment, it can be configured so that only the conductor part 10 is in contact with the base part 31, but both the conductor part 10 and the conductor part 20 are in contact with the base part 31. In addition, it can be configured so that only the conductor part 20 is in contact with the base part 31, so that the conductor part 10 is close to the base part 31.

[0071] (Second embodiment)

[0072] Reference Figure 7 and Figure 8 A power conversion device 100 according to the second embodiment will be described. Note that the same elements as those of the first embodiment are denoted by the same reference numerals and description thereof will be omitted.

[0073] Figure 7 is a schematic cross-sectional view of a power conversion device 100 according to the second embodiment. Figure 8 FIG. 2 is a bottom oblique view of the smoothing capacitor 2. Figure 7 and Figure 8 As shown in FIG. 1 , the present embodiment is different from the first embodiment and the modification of the first embodiment in that a conductor portion 40 (third conductor portion) dedicated to cooling is provided.

[0074] like Figure 8 As shown, the smoothing capacitor 2 has a potting surface 221 formed of a filling material 22 on the bottom surface. On the basis of the conductor parts 10 and 20 , the conductor part 40 extends from the potting surface 221 to the outside of the capacitor.

[0075] The conductor part 40 is a component for cooling the capacitor, and is made of, for example, copper or aluminum having good conductivity. Figure 7 As shown, one end of the conductor part 40 is connected to the capacitor element 21, and the other end is in contact with the base part 31. In addition, the conductor part 40 protrudes from the vicinity of the side surface 234a of the capacitor case 23 on the filling surface 221 to the outside of the smoothing capacitor 2, and is extended to a position in contact with the base part 31. At the position in contact with the base part 31, the conductor part 40 is bent and extended toward the inner side of the smoothing capacitor 2 in a state in contact with the base part 31. Thus, a contact surface 401 where the conductor part 40 contacts the base part 31 is formed.

[0076] In this way, the conductor part 40 is in contact with the base part 31, so that heat exchange is performed between the cooling water flowing in the cooling path 34 through the base part 31 and the conductor part 40, and the conductor part 40 and the smoothing capacitor 2 connected to the conductor part 40 are cooled. That is, by providing the conductor part 40 dedicated to cooling, the cooling effect of the cooling water is transmitted to the conductor part 40 through the base part 31, so the cooling performance of the smoothing capacitor 2 is further improved. In addition, even if the conductor part 40 is arranged at a position in contact with the base part 31 in this way, since the base part 31 is formed of an insulating material, the insulation between the conductor part 40 and the housing 3 can be ensured.

[0077] Furthermore, the conductor 40 is bent at a position in contact with the base 31 to form a contact surface 401 between the conductor 40 and the base 31 . This increases the contact area between the conductor 40 and the base 31 , further improving the cooling performance of the smoothing capacitor 2 .

[0078] According to the power conversion device 100 according to the second embodiment described above, the following effects can be obtained.

[0079] The power conversion device 100 has a base portion 31 of a housing 3 formed of an insulating resin material, and has a conductor portion 40 for cooling a smoothing capacitor 2. The conductor portion 40 has a portion connected to the smoothing capacitor 2 and in contact with the base portion 31 of the housing 3. That is, the base portion 31 is formed of an insulating material to ensure insulation between the conductor portion 40 and the housing 3, and the conductor portion 40 is in contact with the base portion 31. As a result, heat exchange is performed between the cooling water flowing in the cooling path 34 via the base portion 31 and the conductor portion 40. In this way, the cooling effect of the cooling water flowing in the cooling path 34 is transmitted to the conductor portion 40 via the base portion 31, so that the cooling performance of the smoothing capacitor 2 connected to the conductor portion 40 is further improved. Therefore, it is possible to provide a power conversion device that ensures insulation between the housing 3 and the conductor portion 40 and further improves the cooling effect of the smoothing capacitor 2.

[0080] In order to further improve the cooling performance of the smoothing capacitor 2 , the conductor 40 is preferably arranged in contact with the base 31 as in the present embodiment, but the present invention is not limited thereto and the conductor 40 may be arranged close to the base 31 .

[0081] In the present embodiment, the conductor portion 40 is bent inwardly of the smoothing capacitor 2 , but the bending direction may be outwardly of the smoothing capacitor 2 .

[0082] In the present embodiment, the conductor portion 40 is provided so as to protrude from the vicinity of one side surface 234 a of the capacitor case 23 to the outside of the smoothing capacitor 2 . The conductor portion 40 may be provided so as to protrude from the vicinity of the other side surface 234 b of the capacitor case 23 .

[0083] In addition, Figure 8 In the embodiment, the capacitor case 23 is not provided with the positioning pins 25 , but the smoothing capacitor 2 may be positioned by providing the positioning pins 25 and the pin support portions 319 as in the first embodiment.

[0084] (Variation of the Second Embodiment)

[0085] Reference Fig. 9A power conversion device 100 according to a modification of the second embodiment will be described. Note that the same elements as those in other embodiments are denoted by the same reference numerals, and description thereof will be omitted.

[0086] Fig. 9 FIG. 1 is a schematic cross-sectional view of a power conversion device 100 according to a modified example of the second embodiment. Fig. 9 As shown, in this variation, the conductor portion 10 (first conductor portion) and the conductor portion 40 (third conductor portion) are not in direct contact with the base portion 31 , and an elastic conductive component 5 is sandwiched between the conductor portion 10 and the conductor portion 40 and the base portion 31 of the housing 3 .

[0087] like Fig. 9 As shown in the figure, the conductor portion 10 protruding from the potting surface 221 formed on the bottom surface of the smoothing capacitor 2 approaches the base portion 31 of the case 3 in the middle of connecting the smoothing capacitor 2 and the inverter 1. In addition, the conductor portion 40 protruding from the potting surface 221 formed on the bottom surface of the smoothing capacitor 2 is bent toward the inside of the smoothing capacitor 2 at a position close to the base portion 31 of the case 3. In addition, the direction of the bending process may also be the outside direction of the smoothing capacitor 2, similarly to the second embodiment.

[0088] In addition, if Fig. 9 As shown, the elastic conductive member 5 is interposed between the conductor parts 10, 40 and the base part 31. The elastic conductive member 5 is, for example, a highly conductive grease, adhesive, sheet, etc., and is disposed between each conductor part and the base part 31 at a portion close to the conductor parts 10, 40 and the base part 31. The upper surface 51 of the elastic conductive member 5 contacts the conductor parts 10, 40, and the bottom surface 52 contacts the base part 31.

[0089] In this way, the elastic conductive member 5 having high conductivity is interposed between the conductor part 10, 40 and the base part 31, so that the elastic conductive member 5 plays a function of absorbing the dimensional tolerance between the conductor part 10, 40 and the base part 31. As a result, the thermal conductivity between the conductor part 10, 40 and the base part 31 can be improved compared with the case where the conductor part 10, 40 is in direct contact with the base part 31. In other words, the heat exchange rate between the cooling water flowing in the cooling path 34 through the base part 31 and the conductor part 10, 40 is improved. In addition, since the conductor part 10, 40 is in contact with the base part 31 of the housing 3 through the elastic conductive member 5 having high conductivity, the insulation between the conductor part 10, 40 and the housing 3 can also be ensured because the base part 31 is formed of an insulating material.

[0090] According to the modification of the second embodiment described above, the following effects can be further obtained.

[0091] The power conversion device 100 has a base portion 31 of a housing 3 formed of an insulating resin material, and has an elastic conductive member 5 in contact with the base portion 31, and the conductor portion 10 (first conductor portion) and the conductor portion 40 (third conductor portion) are in contact with the elastic conductive member 5 at a portion close to the base portion 31. That is, the base portion 31 is formed of an insulating material to ensure insulation between the conductor portions 10, 40 and the housing 3, and the conductor portions 10, 40 are in contact with the base portion 31 via the elastic conductive member 5. In this way, the elastic conductive member 5 in contact with the base portion 31 and the conductor portions 10, 40 is provided at a portion close to the conductor portions 10, 40 and the base portion 31, so that the elastic conductive member 5 plays a function of absorbing the dimensional tolerance between the conductor portions 10, 40 and the base portion 31. As a result, the thermal conductivity between the conductor portions 10, 40 and the base portion 31 can be improved compared to the case where the conductor portions 10, 40 are in direct contact with the base portion 31. Therefore, the heat exchange rate between the cooling water flowing in the cooling path 34 through the base portion 31 and the conductor portions 10 and 40 is improved, and the cooling performance of the smoothing capacitor 2 can be further improved. That is, it is possible to provide a power conversion device that ensures the insulation between the housing 3 and the conductor portions 10 and 40 and further improves the cooling performance of the smoothing capacitor 2.

[0092] In the present embodiment, the elastic conductive member 5 is interposed between the conductors 10 and 40 and the base 31 . However, the elastic conductive member 5 in contact with the conductor 20 and the base 31 may be provided at a portion close to the conductor 20 and the base 31 .

[0093] (Third embodiment)

[0094] Reference Fig.10 A power conversion device 100 according to a third embodiment will be described. Note that the same elements as those in other embodiments are denoted by the same reference numerals, and description thereof will be omitted.

[0095] Fig.10 2 is a schematic cross-sectional view of a power conversion device 100 according to the third embodiment. Fig.10 As shown, in the present embodiment, the base portion 31 has a second cooling path 35 (second coolant flow path) in which cooling water (coolant) flows below the elastic conductive member 5 .

[0096] like Fig.10 As shown, the main body 313 of the base 31 has a concave portion 351 whose bottom surface is open below the position opposite to the conductor portions 10 and 40, that is, below the elastic conductive member 5. In addition, the main body 313 has a hole, i.e., a joint portion 316, whose lower surface is open around the opening 315 and around the concave portion 351.

[0097] In addition, the bottom plate portion 314 of the base portion 31 has an outer shape of a size that can also cover the opening portion 315 of the main body portion 313 and any bottom surface of the recessed portion 351, and has a convex portion 3141 protruding upward from the upper surface of the bottom plate portion 314 at a position corresponding to the joint portion 316. The convex portion 3141 and the joint portion 316 of the main body portion 313 are joined by welding or the like, and the main body portion 313 and the bottom plate portion 314 are joined to form a cooling path 34 surrounded by the main body portion 313, the bottom plate portion 314, and the substrate 111 of the power module 11 at the position of the opening portion 315. In addition, a second cooling path 35 surrounded by the main body portion 313 and the bottom plate portion 314 is formed at the position of the recessed portion 351.

[0098] The cooling path 35 is a flow path for cooling water for cooling the smoothing capacitor 2, and is formed below the position opposite to the conductor parts 10 and 40, that is, below the elastic conductive member 5, and is connected to the cooling path 34. Therefore, the cooling water circulates in the cooling path 34 and the cooling path 35. In this way, by providing the second cooling path 35 below the position opposite to the conductor parts 10 and 40, the heat conduction path between the conductor parts 10 and 40 and the cooling water can be shortened compared to the case where the base part 31 has only the cooling path 34, and the cooling performance of the smoothing capacitor 2 can be further improved. In addition, similarly to the modified example of the second embodiment, the conductor parts 10 and 40 are in contact with the base part 31 of the housing 3 via the elastic conductive member 5 with high conductivity, but since the base part 31 is formed of an insulating material, the insulation between the conductor parts 10 and 40 and the housing 3 can be ensured.

[0099] In addition, regarding the cooling path 34 and the cooling path 35, when the inverter 1 (power module 11) needs to be further cooled compared to the smoothing capacitor 2, the cooling path 34 only needs to be located on the upstream side, and when the smoothing capacitor 2 needs to be further cooled, the cooling path 35 only needs to be located on the upstream side.

[0100] According to the power conversion device 100 according to the third embodiment described above, the following effects can be obtained.

[0101] The power conversion device 100 has a base portion 31 of a housing 3 formed of an insulating resin material, and the base portion 31 has a cooling path 35 (second coolant flow path) for cooling water (refrigerant) to flow below the portion opposite to the conductor portions 10 and 40, that is, below the elastic conductive member 5. That is, the base portion 31 is formed of an insulating material to ensure insulation between the conductor portions 10 and 40 and the housing 3, and the second cooling path 35 is provided below the elastic conductive member 5 with which the conductor portions 10 and 40 contact. As a result, compared with a case where the base portion 31 has only a cooling path 34 for cooling the inverter 1, the heat conduction path between the conductor portions 10 and 40 and the cooling water is shortened, and the cooling performance of the smoothing capacitor 2 is further improved. That is, the insulation between the housing 3 and the conductor portions 10 and 40 can be ensured, and the cooling performance of the smoothing capacitor 2 can be further improved.

[0102] Furthermore, in the present embodiment, the elastic conductive member 5 is interposed between the conductor portions 10 , 40 and the base portion 31 . However, the conductor portions 10 , 40 may be in direct contact with the base portion 31 without the elastic conductive member 5 being interposed therebetween.

[0103] In addition, in the present embodiment, the cooling path 34 and the cooling path 35 are connected and the cooling water circulates between the cooling path 34 and the cooling path 35, but it can also be formed into a structure as follows, that is, the cooling path 34 and the cooling path 35 are respectively formed as independent different flow paths, and the two flow paths are not connected.

[0104] In addition, in the present embodiment, the cooling path 35 is provided at the portion of the base portion 31 facing the conductor portions 10 and 40, but the cooling path 35 may be provided only at the position facing either the conductor portion 10 or the conductor portion 40, or at the portion facing the conductor portion 20. In addition, the following structure may be adopted, that is, the cooling path 45 is provided at the portion of the base portion 31 facing the conductor portions 10 and 40, and another cooling path is provided at the portion facing the conductor portion 20.

[0105] (Fourth embodiment)

[0106] Reference Fig.11 A power conversion device 100 according to a fourth embodiment will be described. Note that the same elements as those in other embodiments are denoted by the same reference numerals, and description thereof will be omitted.

[0107] Fig.11 Schematic cross-sectional view of a power conversion device 100 according to the fourth embodiment. Fig.11 As shown, the present embodiment is different from the third embodiment in that the base portion 31 includes a metal member 6 .

[0108] like Fig.11As shown, the base portion 31 has a cooling path 35 (second refrigerant flow path) for cooling water for cooling the smoothing capacitor 2, and a metal member 6 provided at a position opposite to the cooling path 35. The cooling path 35 has a substantially U-shaped cross-sectional shape with a recessed portion 352 formed in the center of the cross-section viewed from the front direction.

[0109] The metal component 6 is made of a metal material with high thermal conductivity, such as copper or aluminum, and is provided at a position opposite to the cooling path 35 directly below the elastic conductive component 5. The metal component 6 has a T-shaped cross-section viewed from the front direction of the cooling path 35, and is composed of an upper portion 61 having an upper surface 611 in contact with the elastic conductive component 5 and a convex portion 62 protruding toward the concave portion 351 of the cooling path 35. The metal component 6 is provided so as to be integrated with the base portion 31 by insert molding, external molding based on press-fitting, or the like.

[0110] In this way, the metal member 6 having a high thermal conductivity is provided so as to protrude toward the cooling path 35 at a position opposite to the cooling path 35, so that the heat of the conductor parts 10 and 40 connected to the smoothing capacitor 2 can be efficiently conducted to the vicinity of the cooling path 35 via the elastic conductive member 5 and the metal member 6. In addition, the base part 31 formed of a resin material is interposed between the metal member 6 and the cooling path 35, so that the insulation between the metal member 6 and the housing 3 and the cooling water is ensured, and the insulation between the conductor parts 10 and 40 and the housing 3 is ensured.

[0111] In addition, since the cooling path 35 is provided in a substantially U-shaped shape in the cross section viewed from the front direction, the contact surface area between the cooling water and the base portion 31 is increased compared to the case where a circular or quadrilateral cooling path is provided. As a result, the heat exchange rate between the cooling water and the base portion 31 is improved, and the heat exchange rate between the cooling water and the conductor portions 10 and 40 via the base portion 31 is also improved. Therefore, the cooling performance of the smoothing capacitor 2 connected to the conductor portions 10 and 40 is further improved.

[0112] According to the power conversion device 100 according to the fourth embodiment described above, the following effects can be obtained.

[0113] The power conversion device 100 has a base portion 31 of a housing 3 formed of an insulating resin material, and the base portion 31 has a metal member 6 in contact with an elastic conductive member 5, and the metal member 6 is provided at a position opposite to a cooling path 35. Thus, the metal member 6 in contact with the elastic conductive member 5 is provided at a position opposite to the cooling path 35, so that the heat of the conductor portions 10 and 40 connected to the smoothing capacitor 2 can be efficiently conducted to the vicinity of the cooling path 35 via the elastic conductive member 5 and the metal member 6. In addition, since the base portion 31 formed of a resin material is interposed between the metal member 6 and the cooling path 35, the insulation between the metal member 6 and the housing 3 and the cooling water is ensured, and the insulation between the conductor portions 10 and 40 and the housing 3 is ensured. Therefore, the insulation between the conductor portions 10 and 40 and the housing 3 can be ensured, and the cooling efficiency of the smoothing capacitor 2 can be further improved.

[0114] In the power conversion device 100 according to the present embodiment, the metal member 6 in contact with the elastic conductive member 5 also functions as a thermal mass for storing the heat of the conductor parts 10 and 40. Therefore, the heat capacity of the base part 31 is increased by the metal member 6, so that the temperature rise of the smoothing capacitor 2 connected to the conductor parts 10 and 40 can be suppressed to a low level, and the transient thermal performance of the smoothing capacitor 2 is improved.

[0115] In the present embodiment, the metal member 6 is provided directly below the elastic conductive member 5 in contact with the conductors 10 and 40 . Alternatively, the elastic conductive member 5 , the metal member 6 in contact with the elastic conductive member 5 , and the cooling path 35 may be provided below the conductor 20 .

[0116] In addition, the contact surface area between the cooling water and the base portion 31 is increased, so the cross section of the cooling path 35 is formed into a substantially U-shape, and in order to make the metal component 6 closer to the cooling water, it is preferred that the cross section of the metal component 6 is formed into a T-shape, but the shapes of the cooling path 35 and the metal component 6 are not limited thereto. As long as the metal component 6 is in contact with the elastic conductive component 5 and the base portion 31 is interposed between the metal component 6 and the cooling path 35, the cooling path 35 and the metal component 6 may have any shape.

[0117] (Variation of the Fourth Embodiment)

[0118] Reference Fig.12 and Fig.13 A modification of the power conversion device 100 according to the fourth embodiment of the present invention will be described. Note that the same elements as those in other embodiments are denoted by the same reference numerals and description thereof will be omitted.

[0119] Fig.12 is a schematic cross-sectional view of a power conversion device 100 according to a modification of the fourth embodiment. Fig.13 FIG. 2 is a bottom oblique view of the smoothing capacitor 2. Fig.12 and Fig.13 As shown, in this modification, the base portion 31 has a protrusion 310 for positioning the smoothing capacitor 2 , and the conductor portions 10 , 20 are formed with holes 101 , 201 (positioning holes) into which the protrusion 310 is inserted.

[0120] like Fig.12 As shown, the base portion 31 has a protrusion 310 protruding from the surface (mounting surface 311) on the side where the inverter 1 and the smoothing capacitor 2 are mounted at a position corresponding to the holes 101 and 201 of the conductor portions 10 and 20 described later. The protrusion 310 is provided integrally with the base portion 31 and inserted into the holes 101 and 201 of the conductor portions 10 and 20.

[0121] like Fig.12 and Fig.13 As shown, the conductor parts 10 and 20 protruding downward from the potting surface 221 of the smoothing capacitor 2 have holes 101 and 201 for inserting the protruding part 310 of the base part 31 at locations close to the base part 31, respectively.

[0122] The holes 101 and 201 are provided in the conductor parts 10 and 20 that are arranged opposite to each other among the plurality of conductor parts 10 and 20, and the center point of the hole 101 of the conductor part 10 and the center point of the hole 201 of the conductor part 20 that is opposite to the conductor part 10 are arranged on a straight line parallel to the front surface 232 and the rear surface 233 of the smoothing capacitor 2. The protrusion 310 of the base part 31 is inserted into the holes 101 and 201, so that the smoothing capacitor 2 is positioned and the conductor parts 10 and 20 are also positioned.

[0123] In addition, from the viewpoint of ensuring the stability of the positioning of the smoothing capacitor 2, the holes 101 and 201 are preferably provided in the conductor part 10 and the conductor part 20 that are arranged opposite to each other, but the present invention is not limited thereto. For example, the holes 101 and 201 may be provided in the conductor parts that are not opposite to each other, and the positioning holes may be provided in the conductor part 40. Furthermore, in the present embodiment, one hole 101 and one hole 201 are provided in the conductor part 10 and the conductor part 20, respectively, and the number of the conductor parts where the holes 101 and 201 are provided is not limited thereto, and for example, the positioning holes may be provided in all the conductor parts.

[0124] According to the modification of the fourth embodiment described above, the following effects can also be obtained.

[0125] Regarding the power conversion device 100, the base portion 31 of the housing 3 has a protrusion 310 protruding from the surface (mounting surface 311) on the side where the inverter 1 and the smoothing capacitor 2 are mounted, and holes (positioning holes) 101 and 201 for inserting the protrusion 310 are provided in the conductor portions 10 and 20. The protrusion 310 of the base portion 31 is inserted into the holes 101 and 201 of the conductor portions 10 and 20, thereby positioning the smoothing capacitor 2 and also positioning the conductor portions 10 and 20. In this way, the conductor portions 10 and 20 are directly positioned, so that the positioning accuracy of the conductor portions 10 and 20 relative to the terminal portions 112 and 317 is improved, and the connection quality of the conductor portions of the terminal portions 112 and 317 is improved.

[0126] (Fifth embodiment)

[0127] Reference Fig.14 and Fig.15 A power conversion device 100 according to a fifth embodiment will be described. Note that the same elements as those in other embodiments are denoted by the same reference numerals, and description thereof will be omitted.

[0128] Fig.14 is a schematic cross-sectional view of a power conversion device 100 according to a fifth embodiment. Fig.15 FIG. 2 is a bottom oblique view of the smoothing capacitor 2. Fig.14 and Fig.15 As shown, in this embodiment, the conductor portion 40A (third conductor portion) for cooling the smoothing capacitor 2 protrudes from the potting surface 221 of the smoothing capacitor 2 and is inserted into the base portion 31 at a position facing the cooling path 35, which is different from other embodiments.

[0129] like Fig.14 As shown, the base portion 31 includes: a metal member 6A having high thermal conductivity; a cooling path 35 formed in a substantially U-shaped cross section viewed from the front direction; and a groove 402 for inserting a conductor portion 40A for cooling the smoothing capacitor 2 .

[0130] Similar to the fourth embodiment, the cooling path 35 has a substantially U-shaped cross-sectional shape in which a recessed portion 352 is formed at the center of the cross section when viewed from the front direction.

[0131] The metal member 6A is provided at a position opposite to the cooling path 35 directly below the elastic conductive member 5, and has an L-shaped cross-section viewed from the front direction of the cooling path 35. The metal member 6A is composed of an upper portion 61A having an upper surface 611A in contact with the elastic conductive member 5, and a convex portion 62A protruding toward the concave portion 352 of the cooling path 35. The convex portion 62A is extended to the vicinity of the cooling path 35, and conducts the heat of the smoothing capacitor 2 conducted to the metal member 6A via the conductor portion 10 and the elastic conductive member 5 to the vicinity of the cooling water flowing in the cooling path 35. In addition, the base portion 31 formed of a resin material is interposed between the metal member 6A and the cooling path 35, so that the insulation between the metal member 6A and the housing 3 and the cooling water is ensured, and the insulation between the conductor portion 10 and the housing 3 is ensured.

[0132] The groove 402 formed in the base portion is a groove for inserting the conductor portion 40A for cooling the smoothing capacitor 2 , and is formed to the vicinity of the cooling path 35 toward the recessed portion 352 of the cooling path 35 .

[0133] The conductor part 40A is a component for cooling the capacitor, one end of which is connected to the capacitor element 21 of the smoothing capacitor 2, and protrudes downward from the vicinity of the side surface 234a of the capacitor case 23 of the filling surface 221 of the smoothing capacitor 2 to the outside of the smoothing capacitor 2. The other end of the conductor part 40A is inserted into the groove 402 of the base part 31 by light press-fitting or the like. Fig.14 and Fig.15 As shown, the conductor part 40A is not subjected to bending processing, but protrudes from the filling surface 221 of the smoothing capacitor 2 and extends to the vicinity of the cooling path 35. As a result, the heat of the smoothing capacitor 2 is conducted to the vicinity of the cooling water flowing in the cooling path 35 through the conductor part 40A. In addition, since the base part 31 is formed of an insulating resin material, the insulation between the conductor part 40A inserted in the base part 31 and the housing 3 is ensured. In addition, by inserting the conductor part 40A into the base part 31, the smoothing capacitor 2 can be positioned and the conductor parts 10 and 20 can be positioned relative to the terminal parts 112 and 317.

[0134] According to the power conversion device 100 according to the fifth embodiment described above, the following effects can be obtained.

[0135] In the power conversion device 100, the base portion 31 of the housing 3 is formed of an insulating resin material, and the conductor portion 40A (third conductor portion) connected to the smoothing capacitor 2 at one end is inserted into the base portion 31 at a position opposite to the cooling path 35. Thus, the heat of the smoothing capacitor 2 is conducted to the vicinity of the cooling water flowing in the cooling path 35 through the body portion 40A. On the other hand, since the base portion 31 is formed of an insulating resin material, the insulation between the conductor portion 40A inserted into the base portion 31 and the housing 3 is ensured. Therefore, the insulation between the conductor portion 40A and the housing 3 can be ensured, and the cooling performance of the smoothing capacitor 2 can be further improved.

[0136] In addition, by inserting the conductor part 40A into the base part 31, the smoothing capacitor 2 can be positioned, and the conductor parts 10 and 20 can be positioned relative to the terminal parts 112 and 317. In this way, positioning is performed by the conductor part 40A instead of the positioning pin 25 of the capacitor case 23, so that the positioning accuracy of the conductor parts 10 and 20 relative to the terminal parts 112 and 317 is improved, and the connection quality of the conductor parts of the terminal parts 112 and 317 is stabilized.

[0137] In addition, in the present embodiment, the cross-sectional shape of the metal component 6A is L-shaped, and the cross-sectional shape of the cooling path 35 is approximately U-shaped, but the shapes of the metal component 6A and the cooling path 35 are not limited thereto. As long as the conductor portion 40A and one end of the metal component 6A are located near the cooling path 35, the metal component 6A and the cooling path 35 may have any shape.

[0138] (Sixth Implementation Method)

[0139] Reference Fig.16 and Fig.17 A power conversion device 100 according to a fifth embodiment will be described. Note that the same elements as those in other embodiments are denoted by the same reference numerals, and description thereof will be omitted.

[0140] Fig.16 is a schematic cross-sectional view of a power conversion device 100 according to a sixth embodiment. Fig.17 FIG. 2 is a schematic cross-sectional view of the power conversion device 100 showing the appearance of the smoothing capacitor 2. Fig.16 and Fig.17 As shown, in this embodiment, the elastic member 7 is sandwiched between the upper surface 231 of the smoothing capacitor 2 and the cover portion 32 of the case 3, and the smoothing capacitor 2 and the case 3 are not fastened together by bolts or the like, which is different from other embodiments.

[0141] like Fig.16As shown, the elastic member 7 is sandwiched between the upper surface 231 of the smoothing capacitor 2 (capacitor case 23) and the upper portion 327 of the cover portion 32 of the housing 3. The elastic member 7 is made of an elastic material having a higher thermal conductivity than the capacitor case 23, and the lower surface 71 is in contact with the upper surface 231 of the smoothing capacitor 2, and the upper surface 72 is in contact with the inner side surface of the upper portion 327 of the cover portion 32. In this way, the upper surface 231 of the smoothing capacitor 2 is in contact with the cover portion 32 of the housing 3 via the elastic member 7, so that the movement of the smoothing capacitor 2 in the up-down direction is restricted. In this way, the movement of the smoothing capacitor 2 in the up-down direction is restricted by the elastic member 7, and therefore, in this embodiment, as shown in FIG. Fig.17 As shown, the bracket 24 of the smoothing capacitor 2 and the holding portion 318 of the base portion 31 are not fastened together by bolts or the like.

[0142] Furthermore, the elastic member 7 may be a conductive member or an insulating member as long as it is an elastic material with good thermal conductivity.

[0143] According to the power conversion device 100 according to the sixth embodiment, the following effects can be obtained.

[0144] In the power conversion device 100, the upper surface 231 of the smoothing capacitor 2 is in contact with the cover portion 32 of the housing 3 via the elastic member 7. As a result, the vertical movement of the smoothing capacitor 2 is restricted, so it is not necessary to fasten the capacitor case 23 of the smoothing capacitor 2 and the base portion 31 of the housing 3 with bolts or the like. Therefore, the cycle time during manufacturing can be shortened.

[0145] In addition, the elastic member 7 interposed between the smoothing capacitor 2 and the cover portion 32 of the case 3 is made of an elastic material having a higher thermal conductivity than the capacitor case 23. Therefore, the heat of the smoothing capacitor 2 can be released from the elastic member 7 to the cover portion 32 formed of a metal material, and the temperature increase of the smoothing capacitor 2 can be suppressed.

[0146] In any embodiment, the mounting direction of the power conversion device 100 does not need to arrange the base portion 31 of the housing 3 at the bottom, and can be arranged in a free direction according to the layout of the vehicle on which the power conversion device 100 is mounted. Fig.18 As shown, the base portion 31 can be placed at the top and the cover portion 32 can be placed at the bottom. Figure 1 The power conversion device 100 shown in the figure is set in an upside-down state, and the power conversion device 100 may be set in a tilted state.

[0147] In addition, in any of the embodiments, the coolant flowing in the cooling path is cooling water, but the coolant is not limited to this, and may be, for example, a refrigerant gas.

[0148] The embodiments of the present invention have been described above, but the above embodiments merely illustrate a part of application examples of the present invention, and the technical scope of the present invention is not limited to the specific structures of the above embodiments.

[0149] Although the above-mentioned embodiments are described as separate embodiments, they can be appropriately combined.

Claims

1. A power conversion device, comprising: An inverter, which is composed of multiple electronic components; a smoothing capacitor, which smoothes the electric power; a housing for housing the inverter and the smoothing capacitor; as well as a first conductor portion connecting the smoothing capacitor and the inverter, In the power conversion device, The housing is composed of the following components: a base portion formed of an insulating resin material on which the inverter and the smoothing capacitor are placed; a cover portion mounted on the base portion so as to cover the inverter and the smoothing capacitor; and a metal thin plate formed on the lower surface of the base portion and functioning as a bottom plate of the cover portion, The first conductor extends on the base portion in the housing while being close to or in contact with a surface of the base portion on which the inverter and the smoothing capacitor are placed, in the middle of connecting the smoothing capacitor and the inverter. The base portion includes a first refrigerant flow path through which a refrigerant for cooling the inverter flows, and the first refrigerant flow path is formed below a portion on which the inverter is placed.

2. The power conversion device according to claim 1, wherein: The power conversion device further includes a second conductor portion connecting the smoothing capacitor and a power source outside the housing. The second conductor portion is close to or in contact with the base portion of the case in the middle of connecting the smoothing capacitor and the power source.

3. The power conversion device according to claim 2, wherein: The power conversion device further includes a third conductor portion for cooling the smoothing capacitor. The third conductor portion is connected to the smoothing capacitor and has a portion that is close to or in contact with the base portion of the housing.

4. The power conversion device according to claim 3, wherein: The power conversion device further includes an elastic thermally conductive member in contact with the base portion of the housing. At least any one of the first conductor portion, the second conductor portion, and the third conductor portion is in contact with the elastic thermally conductive member at a portion close to the base portion.

5. The power conversion device according to claim 3 or 4, wherein: The base portion includes a second refrigerant flow path through which a refrigerant flows, below a portion facing at least any one of the first conductor portion, the second conductor portion, and the third conductor portion.

6. The power conversion device according to claim 4, wherein: The base portion includes: a heat-conductive metal component in contact with the elastic heat-conductive component; and a second refrigerant flow path formed below a portion in contact with the elastic heat-conductive component and through which the refrigerant flows. The thermally conductive metal member is formed at a position facing the second refrigerant flow path.

7. The power conversion device according to claim 5, wherein: The third conductor portion is inserted into the base portion at a position facing the vicinity of the second refrigerant flow path.

8. The power conversion device according to claim 2, wherein: The base portion has a protruding portion protruding from a surface on a side where the inverter and the smoothing capacitor are placed. A positioning hole into which the protrusion is inserted is formed in at least one of the first conductor portion and the second conductor portion.

9. The power conversion device according to any one of claims 1 to 4, wherein: An upper surface of a capacitor case of the smoothing capacitor is in contact with the cover portion of the case via a thermally conductive elastic member.

10. The power conversion device according to claim 9, wherein: The thermally conductive elastic member is made of a material having a higher thermal conductivity than the capacitor case.

Images