Substrate transport container
By designing a variable-mode substrate transport container and utilizing support foam and receiving structure, the problem of substrate damage caused by swaying during transportation was solved, achieving a protective effect during transportation and testing.
Patent Information
- Application Number
- CN202110220310.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-03-02
- Filing Date
- 2021-02-26
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2041-02-26
AI Technical Summary
Large-size flat panel display substrates are easily damaged by impacts during transportation, and existing technologies are insufficient to effectively prevent damage caused by substrate swaying.
A substrate transport container is designed, comprising a support foam and a receiving part. A guide can pop out in a first mode and insert into the receiving part in a second mode, providing multiple modes to adapt to the transportation and testing process and prevent substrate damage.
By changing the position and state of the guide, the substrate can be effectively prevented from swinging during transportation, reducing the risk of damage and adapting to different needs during transportation and testing.
Smart Images

Figure CN113345824B_ABST
Abstract
Description
[0001] Cross-reference to related applications
[0002] This patent application claims priority to Korean Patent Application No. 10-2020-0026138, filed on March 2, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field
[0003] This disclosure relates to a container, and more particularly, to a substrate transport container for transporting substrates. Background Technology
[0004] Recently, the size of substrates used in flat panel display devices (e.g., those with liquid crystal, plasma, or organic EL display panels) has been increasing. These substrates are easily damaged by impacts during transportation.
[0005] Before shipping the panels, the substrate undergoes various tests to check the product's stability. In each test, the substrate is unloaded from the shipping container, tested, and then loaded back into the shipping container. In this case, a portion of the substrate may be provided in the shipping container as a guide to prevent damage from substrate wobbling. Summary of the Invention
[0006] An embodiment of the present invention provides a substrate transport container, which includes a guide to prevent damage to the substrate.
[0007] According to an embodiment of the present invention, a substrate transport container may include: a support foam including a support surface supporting the substrate and a sidewall bent from the support surface and defining a receiving hole; a receiving portion disposed in the receiving hole, the receiving portion defining an internal space; and a guide adjacent to a corner of the substrate. The guide may be ejected from the internal space in a first mode and may be inserted into the internal space in a second mode.
[0008] In an embodiment, the area of the guide overlapping the support surface in the first mode may be greater than the area of the guide overlapping the support surface in the second mode.
[0009] In one embodiment, the guide may be closer to the substrate in the first mode than in the second mode.
[0010] In an embodiment, the receiving hole can include a first sub-receiving hole and a second sub-receiving hole, the first sub-receiving hole and the second sub-receiving hole not overlapping each other and extending in a first direction and a second direction perpendicular to the first direction, respectively. The receiving portion can include a first sub-receiving portion disposed in the first sub-receiving hole to define a first internal space and a second sub-receiving portion disposed in the second sub-receiving hole to define a second internal space. The guide can include a first sub-guide inserted into or ejected from the first internal space and a second sub-guide inserted into or ejected from the second internal space.
[0011] In an embodiment, in the second mode, the first sub-guide can be inserted into the first sub-receiving portion in the first direction, and the second sub-guide can be inserted into the second sub-receiving portion in the second direction.
[0012] In an embodiment, in the first mode, a portion of the first sub-guide and a portion of the second sub-guide can overlap each other.
[0013] In an embodiment, the first sub-guide can define a through-hole. In the first mode, the second sub-guide can overlap the support surface and can be inserted into the through-hole. In the second mode, the second sub-guide can not overlap the through-hole and can be inserted into the second internal space.
[0014] In an embodiment, the substrate can include a first side surface and a second side surface adjacent to each other. In the first mode, a portion of the first sub-guide can face the first side surface in the second direction, and a portion of the second sub-guide can face the second side surface in the first direction.
[0015] In an embodiment, the support surface can include a first support surface and a second support surface supporting the substrate, the second support surface at least partially surrounding the first support surface when viewed in a plan view. The second support surface can have a shape recessed from the first support surface in a thickness direction of the substrate. In the first mode, the guide can overlap the second support surface.
[0016] In an embodiment, the guide can define an inner hole. The substrate transport container can further include an auxiliary guide inserted into the inner hole in the second mode and ejected from the inner hole in the first mode.
[0017] In an embodiment, in the first mode, the auxiliary guide can overlap the support surface completely.
[0018] In an embodiment, each of the receiving portion and the guide can extend in a first direction. In the second mode, the guide can be inserted into the inner space in the first direction, and the auxiliary guide can be inserted into the inner hole of the guide in a second direction perpendicular to the first direction.
[0019] In an embodiment, in the second mode, the guide can be inserted into the inner space in the first direction, and the auxiliary guide can be inserted into the inner hole of the guide in the first direction. Each of the receiving portion and the guide can extend in a second direction perpendicular to the first direction.
[0020] In an embodiment, the receiving hole can include a first sub-receiving hole and a second sub-receiving hole, the first sub-receiving hole and the second sub-receiving hole not overlapping each other and extending in a first direction. The receiving portion can include a first sub-receiving portion disposed in the first sub-receiving hole to define a first inner space, and a second sub-receiving portion disposed in the second sub-receiving hole to define a second inner space. The guide can include a first sub-guide inserted in the first inner space, and a second sub-guide inserted in the second inner space.
[0021] In an embodiment, in the first mode, a length of the first sub-guide overlapping the support surface in the first direction can be greater than a length of the second sub-guide overlapping the support surface in the first direction.
[0022] In an embodiment, the first sub-guide and the second sub-guide can be spaced apart from each other in a second direction perpendicular to the first direction.
[0023] In an embodiment, the substrate can include a first side surface, a second side surface, a third side surface, and a fourth side surface. The guides can include a first guide adjacent to a first corner of the substrate, the first corner defined by the first side surface extending in a first direction and the second side surface extending in a second direction perpendicular to the first direction; a second guide adjacent to a second corner of the substrate, the second corner defined by the second side surface and the third side surface opposite to the first side surface in the second direction; a third guide adjacent to a third corner of the substrate, the third corner defined by the third side surface and the fourth side surface opposite to the second side surface in the first direction; and a fourth guide adjacent to a fourth corner of the substrate, the fourth corner defined by the fourth side surface and the first side surface.
[0024] In an embodiment, the receiving holes defined in the side wall can include first to fourth receiving holes. The receiving portions can include first to fourth receiving portions respectively disposed in the first to fourth receiving holes to respectively define first to fourth internal spaces. In the second mode, the first to fourth guides can be respectively inserted into the first to fourth internal spaces.
[0025] In an embodiment, the side wall can include a first side wall and a second side wall opposite to each other in a first direction, and a third side wall and a fourth side wall opposite to each other in a second direction perpendicular to the first direction. Each of the first to fourth side walls can define at least one hole serving as a receiving hole in which the receiving portion is disposed.
[0026] In an embodiment, the side wall can include a first side wall and a second side wall opposite to each other in a first direction, and a third side wall and a fourth side wall opposite to each other in a second direction perpendicular to the first direction. Two of the first to fourth side walls can define at least one hole serving as a receiving hole in which the receiving portion is disposed. BRIEF DESCRIPTION OF DRAWINGS
[0027] The example embodiments will be more clearly understood from the following brief description, taken in conjunction with the accompanying drawings. The drawings represent non-limiting example embodiments as described herein.
[0028] Figure 1A is a perspective view illustrating a substrate transport container in a first mode according to an embodiment of the present inventive concept.
[0029] Figure 1B is a perspective view illustrating a substrate transport container in a second mode according to an embodiment of the present inventive concept.
[0030] Figure 2A This is an exploded perspective view illustrating an embodiment of a substrate transport container according to the concept of the present invention.
[0031] Figure 2B This is a plan view illustrating an embodiment of a substrate transport container according to the concept of the present invention.
[0032] Figure 3A and Figure 3B These are examples illustrating embodiments based on the concept of the present invention. Figure 2A A perspective view of the guide component.
[0033] Figure 4A and Figure 4B These are examples illustrating embodiments based on the concept of the present invention. Figure 2A A perspective view of the guide and receiving parts.
[0034] Figure 5 This is a plan view illustrating an embodiment of a substrate transport container according to the concept of the present invention.
[0035] Figure 6A and Figure 6B These are examples illustrating embodiments based on the concept of the present invention. Figure 5 A perspective view of the guide component.
[0036] Figure 7 This is a plan view illustrating an embodiment of a substrate transport container according to the concept of the present invention.
[0037] Figure 8 These are examples illustrating embodiments based on the concept of the present invention. Figure 7 Plan view of the guide and receiving parts.
[0038] Figure 9 This is a plan view illustrating an embodiment of a substrate transport container according to the concept of the present invention.
[0039] Figure 10A and Figure 10B These are examples illustrating embodiments based on the concept of the present invention. Figure 9 Plan view of the guide and receiving parts.
[0040] It should be noted that these figures are intended to illustrate the general characteristics of the methods, structures, and / or materials used in some exemplary embodiments and are intended to supplement the written description provided below. However, these figures are not drawn to scale and may not accurately reflect the precise structural or performance characteristics of any given embodiment, and should not be construed as limiting or restricting the range of values or characteristics covered by the exemplary embodiments. For example, the relative thickness and positioning of molecules, layers, regions, and / or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numerals in the various figures is intended to indicate the presence of similar or identical elements or features. DETAILED DESCRIPTION
[0041] Example embodiments of the present inventive concepts will now be described more fully with reference to the accompanying drawings. Example embodiments of the present inventive concepts may, however, be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concepts to those skilled in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity. Like reference numerals in the drawings indicate like elements, and therefore a description thereof will not be repeated.
[0042] It will be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements can be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. Like reference numerals designate like elements throughout the specification. As used herein the term “and / or” includes any and all combinations of one or more of the associated listed items. Other words used to describe the relationship between elements or layers should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” “on” versus “directly on,” etc.).
[0043] It will be understood that, although the terms “first,” “second,” etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of example embodiments.
[0044] To facilitate description, spatially relative terms, such as “underneath,” “below,” “lower,” “over,” “upper,” and the like, can be used herein for describing the relationship between one element or feature and another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as “underneath” or “below” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “underneath” can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0045] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.
[0046] Example embodiments of the inventive concept are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of the example embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, example embodiments of the inventive concept should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. Thus, the example embodiments of the inventive concept are to cover illustrative embodiments that can be
[0047] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments of the inventive concept belong. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
[0048] Figure 1A is a perspective view illustrating a substrate transport container in a first mode according to an embodiment of the inventive concept. Figure 1B is a perspective view illustrating a substrate transport container in a second mode according to an embodiment of the inventive concept.
[0049] Referring to Figure 1A , the substrate transport container TF can include a support foam SF supporting the substrate PS, a guide GD preventing the substrate PS from swinging, and a reception part RV accommodating the guide GD. Each of the reception part RV and the guide GD can be provided as a plurality. In an embodiment, as shown in Figure 1A and Figure 1B , each of the reception part RV and the guide GD can consist of four portions adjacent to corners of the substrate PS. However, the inventive concept is not limited to this example, and the number of the reception part RV and the guide GD can be variously changed according to a structure for preventing the substrate PS from swinging.
[0050] In the present specification, the substrate PS can denote a display module. The display module can include at least one of a display panel for displaying an image and an input sensing unit for sensing an external input. In addition, the substrate PS can denote a single base substrate included in the display module. The substrate PS can be disposed in a mounting area PA defined in the support foam SF.
[0051] The substrate PS can be parallel to a plane defined by the first direction DR1 and the second direction DR2. A normal direction or a thickness direction of the substrate PS will be referred to as a third direction DR3. In the present specification, the expressions "when viewed in a plan view or in a plan view" and "planar area" can be used to describe the shape and area of an object viewed in the third direction DR3. Hereinafter, a front surface or a top surface and a rear surface or a bottom surface of each element are distinguished based on the third direction DR3. However, the directions indicated by the first to third directions DR1, DR2, and DR3 can not be limited to this example, and in certain embodiments, they can be changed to indicate other or opposite directions.
[0052] The substrate transport container TF can define an accommodation space in which the substrate PS is disposed. For example, the substrate transport container TF can include a support foam SF, which can include a support surface BS that supports the substrate PS, and a side wall SD that is bent from the support surface BS. When viewed in a plan view, the side wall SD can have a shape that encloses the support surface BS. In an embodiment, the support surface BS and the side wall SD can be a single object formed of the same material.
[0053] In an embodiment, the side wall SD can define at least one receiving hole in which the receiving portion RV is disposed. The number of receiving holes defined in the side wall SD can be adjusted according to the number of guides GD.
[0054] The receiving portion RV can be disposed in the receiving hole defined in the side wall SD, and the receiving portion RV and the side wall SD can form a single object. However, the receiving portion RV and the side wall SD of the support foam SF can be formed of or include different materials from each other. For example, the receiving portion RV can be formed of or include a plastic material, and the side wall SD can be formed of or include a polystyrene foam. In addition, the receiving portion RV can be a structure that substantially overlaps the side wall SD as a whole, and can define an internal space.
[0055] The guide GD can be physically connected to the receiving part RV and can be disposed adjacent to a corner of the substrate PS. The guide GD disposed adjacent to the corner of the substrate PS can prevent the substrate PS from swinging when the substrate transport container TF is moved. The guide GD can include a material capable of protecting the side of the substrate PS. For example, the guide GD can be formed of or include various materials such as plastic or rubber.
[0056] Meanwhile, the substrate PS can be subjected to various tests before the product is shipped. In each test, the substrate PS can be unloaded from the substrate transport container TF or can be loaded in the substrate transport container TF. In the process of loading or unloading the substrate PS, a portion of the substrate PS can be damaged by the guide GD.
[0057] According to an embodiment of the inventive concept, the substrate transport container TF can be in one of a first mode and a second mode. When the substrate transport container TF is in the first mode, the guide GD can be popped out from the inner space of the receiving part RV, and when the substrate transport container TF is in the second mode, the guide GD can be inserted into the inner space of the receiving part RV.
[0058] Figure 1A The guide GD when the substrate transport container TF is in the first mode can be exemplified. When the substrate PS is shipped, the substrate transport container TF can be in the first mode in which the guide GD is popped out from the inner space of the receiving part RV.
[0059] Figure 1B The guide GD when the substrate transport container TF is in the second mode can be exemplified. When the substrate PS is tested, the substrate transport container TF can be in the second mode in which the guide GD is inserted in the inner space of the receiving part RV. As a result, when the substrate PS is unloaded from the substrate transport container TF for testing or is loaded in the substrate transport container TF, an interference problem caused by the guide GD can be prevented.
[0060] In an embodiment, an area of the guide GD overlapping the support surface BS in the first mode can be greater than an area of the guide GD overlapping the support surface BS in the second mode. In the second mode, the guide GD can not (or at least partially not) overlap the support surface BS. The guide GD in the first mode can be disposed adjacent to (i.e., closer to) the substrate PS compared to the guide GD in the second mode to prevent the substrate PS from swinging.
[0061] According to the above-described structure, the substrate transport container TF can be in one of the first mode and the second mode, and the mode of the substrate transport container TF or the configuration of the guide GD can be determined according to which process is performed on the substrate PS. For example, the guide GD according to an embodiment of the inventive concept can be provided in a movable structure, rather than in a fixed structure.
[0062] Figure 2A is an exploded perspective view illustrating a substrate transport container according to an embodiment of the inventive concept. Figure 2B is a plan view illustrating a substrate transport container according to an embodiment of the inventive concept. Figure 3A and Figure 3B is a perspective view illustrating a guide of Figure 2A according to an embodiment of the inventive concept. Figure 4A and Figure 4B is a perspective view illustrating a guide and a receiving portion of Figure 2A according to an embodiment of the inventive concept.
[0063] Referring to Figure 2A and Figure 2B , the support foam SF can include a side wall SD and a support surface BS. The support surface BS can include a first support surface BP1 and a second support surface BP2 that at least partially surrounds the first support surface BP1 when viewed in a plan view. The first support surface BP1 can define a mounting area PA on which the substrate PS is mounted. The second support surface BP2 can have a shape that is recessed from the first support surface BP1 in a third direction DR3.
[0064] The side wall SD can include first to fourth side walls SD1-SD4 that are bent from the second support surface BP2. The first side wall SD1 and the third side wall SD3 can be spaced apart from each other to face each other in the second direction DR2, and the second side wall SD2 and the fourth side wall SD4 can be spaced apart from each other to face each other in the first direction DR1.
[0065] The first side wall SD1 can define a first sub-receiving hole SF-H1a and a second sub-receiving hole SF-H1b. The first sub-receiving hole SF-H1a and the second sub-receiving hole SF-H1b can be areas that are spaced apart from each other to face each other in the first direction DR1.
[0066] The second side wall SD2 can define a third sub-receiving hole SF-H2a and a fourth sub-receiving hole SF-H2b. The third sub-receiving hole SF-H2a and the fourth sub-receiving hole SF-H2b can be areas that are spaced apart from each other to face each other in the second direction DR2.
[0067] The third side wall SD3 can define a fifth sub-receiving hole SF-H3a and a sixth sub-receiving hole SF-H3b. The fifth sub-receiving hole SF-H3a and the sixth sub-receiving hole SF-H3b can be regions spaced apart from each other in the first direction DR1 to face each other.
[0068] The fourth side wall SD4 can define a seventh sub-receiving hole SF-H4a and an eighth sub-receiving hole SF-H4b. The seventh sub-receiving hole SF-H4a and the eighth sub-receiving hole SF-H4b can be regions spaced apart from each other in the second direction DR2 to face each other.
[0069] In an embodiment, the side wall SD can define at least one receiving hole in which the receiving part RV is disposed. As shown in FIG. 1A, the side wall SD can define first to fourth receiving holes SF-H1, SF-H2, SF-H3, and SF-H4. The receiving part RV can include first to fourth receiving parts RV1-RV4 disposed in the first to fourth receiving holes SF-H1, SF-H2, SF-H3, and SF-H4, respectively. Figure 2A
[0070] The first receiving hole SF-H1 can include a first sub-receiving hole SF-H1a and a third sub-receiving hole SF-H2a adjacent to each other. The first sub-receiving hole SF-H1a and the third sub-receiving hole SF-H2a can be adjacent to a first corner, which is one of the corners of the support surface BS. The first corner of the support surface BS can correspond to a corner of the second support surface BP2 defined by the first side wall SD1 and the second side wall SD2.
[0071] The first receiving part RV1 can include a first sub-receiving part RV1a extending in the first direction DR1 and disposed in the third sub-receiving hole SF-H2a, and a second sub-receiving part RV1b extending in the second direction DR2 and disposed in the first sub-receiving hole SF-H1a. Each of the first sub-receiving part RV1a and the second sub-receiving part RV1b can define an inner space.
[0072] The second receiving hole SF-H2 can include a fourth sub-receiving hole SF-H2b and a fifth sub-receiving hole SF-H3a adjacent to each other. The fourth sub-receiving hole SF-H2b and the fifth sub-receiving hole SF-H3a can be adjacent to a second corner, which is one of the corners of the support surface BS. The second corner of the support surface BS can correspond to a corner of the second support surface BP2 defined by the second side wall SD2 and the third side wall SD3.
[0073] The second receiving portion RV2 can include a third sub-receiving portion RV2a extending in the first direction DR1 and disposed in the fourth sub-receiving hole SF-H2b, and a fourth sub-receiving portion RV2b extending in the second direction DR2 and disposed in the fifth sub-receiving hole SF-H3a. Each of the third and fourth sub-receiving portions RV2a and RV2b can define an inner space.
[0074] The third receiving hole SF-H3 can include a sixth sub-receiving hole SF-H3b and a seventh sub-receiving hole SF-H4a adjacent to each other. The sixth and seventh sub-receiving holes SF-H3b and SF-H4a can be adjacent to a third corner, which is one of the corners of the support surface BS. The third corner of the support surface BS can correspond to a corner of the second support surface BP2 defined by the third and fourth side walls SD3 and SD4.
[0075] The third receiving portion RV3 can include a fifth sub-receiving portion RV3a extending in the first direction DR1 and disposed in the seventh sub-receiving hole SF-H4a, and a sixth sub-receiving portion RV3b extending in the second direction DR2 and disposed in the sixth sub-receiving hole SF-H3b. Each of the fifth and sixth sub-receiving portions RV3a and RV3b can define an inner space.
[0076] The fourth receiving hole SF-H4 can include an eighth sub-receiving hole SF-H4b and the second sub-receiving hole SF-H1b adjacent to each other. The eighth sub-receiving hole SF-H4b and the second sub-receiving hole SF-H1b can be adjacent to a fourth corner, which is one of the corners of the support surface BS. The fourth corner of the support surface BS can correspond to a corner of the second support surface BP2 defined by the fourth and first side walls SD4 and SD1.
[0077] The fourth receiving portion RV4 can include a seventh sub-receiving portion RV4a extending in the first direction DR1 and disposed in the eighth sub-receiving hole SF-H4b, and an eighth sub-receiving portion RV4b extending in the second direction DR2 and disposed in the second sub-receiving hole SF-H1b. Each of the seventh and eighth sub-receiving portions RV4a and RV4b can define an inner space.
[0078] The guide GD can include first to fourth guides GD1-GD4 disposed on the second support surface BP2. The first guide GD1 can be physically connected to the first receiving portion RV1, and can include a first sub-guide GD1a extending in the first direction DR1 and a second sub-guide GD1b extending in the second direction DR2. The first sub-guide GD1a can be connected to the first sub-receiving portion RV1a, and can be inserted into or ejected from an internal space defined in the first sub-receiving portion RV1a. The second sub-guide GD1b can be connected to the second sub-receiving portion RV1b, and can be inserted into or ejected from an internal space defined in the second sub-receiving portion RV1b.
[0079] The second guide GD2 can be physically connected to the second receiving portion RV2, and can include a third sub-guide GD2a extending in the first direction DR1 and a fourth sub-guide GD2b extending in the second direction DR2. The third sub-guide GD2a can be connected to the third sub-receiving portion RV2a, and can be inserted into or ejected from an internal space defined in the third sub-receiving portion RV2a. The fourth sub-guide GD2b can be connected to the fourth sub-receiving portion RV2b, and can be inserted into or ejected from an internal space defined in the fourth sub-receiving portion RV2b.
[0080] The third guide GD3 can be physically connected to the third receiving portion RV3, and can include a fifth sub-guide GD3a extending in the first direction DR1 and a sixth sub-guide GD3b extending in the second direction DR2. The fifth sub-guide GD3a can be connected to the fifth sub-receiving portion RV3a, and can be inserted into or ejected from an internal space defined in the fifth sub-receiving portion RV3a. The sixth sub-guide GD3b can be connected to the sixth sub-receiving portion RV3b, and can be inserted into or ejected from an internal space defined in the sixth sub-receiving portion RV3b.
[0081] The fourth guide GD4 can be physically connected to the fourth receiving portion RV4, and can include a seventh sub-guide GD4a extending in the first direction DR1 and an eighth sub-guide GD4b extending in the second direction DR2. The seventh sub-guide GD4a can be connected to and can be inserted into or ejected from an internal space defined in the seventh sub-receiving portion RV4a. The eighth sub-guide GD4b can be connected to and can be inserted into or ejected from an internal space defined in the eighth sub-receiving portion RV4b.
[0082] The substrate PS can include a first side surface facing the first side wall SD1, a second side surface facing the second side wall SD2, a third side surface facing the third side wall SD3, and a fourth side surface facing the fourth side wall SD4. According to an embodiment of the present inventive concept, in the first mode, a portion of the first sub-guide GD1a can directly face the first side surface in the second direction DR2, and a portion of the second sub-guide GD1b can directly face the second side surface in the first direction DR1. Similar to the above-described structure of the first sub-guide GD1a and the second sub-guide GD1b, two sub-guides included in each of the remaining guides (i.e., the second to fourth guides GD2-GD4) can include portions directly facing corresponding ones of the side surfaces of the substrate PS.
[0083] According to an embodiment of the present inventive concept, when the substrate transport container TF is in the first mode as described with reference to Figure 1A The two sub-guides included in each of the first to fourth guides GD1-GD4 can overlap each other in at least one region when the substrate transport container TF is in the first mode as described with reference to
[0084] In detail, Figure 3A and Figure 3B The first guide GD1 among the first to fourth guides GD1-GD4 is exemplarily shown in FIGS. 1 to 3, but the other guides (e.g., the second to fourth guides GD2-GD4) can have substantially the same structure as the first guide GD1 in FIGS. 1 to 3. Figure 3A and Figure 3B
[0085] Referring to Figure 3A The first sub-guide GD1a can define a perforation OPa. The perforation OPa can be formed to have a shape corresponding to a shape of the second sub-guide GD1b. For example, the perforation OPa can have a shape in which the second sub-guide GD1b can be inserted.
[0086] Referring to Figure 3B When the substrate transport container TF is in the second mode, the second sub-guide GD1b can move through the perforation OPa in the second direction DR2. As a result, the second sub-guide GD1b can be inserted into the inner space RV1b-H of the second sub-receiver RV1b through the perforation OPa of the first sub-guide GD1a, as shown in FIG. 1B. Figure 4A
[0087] In addition, as shown in FIG. 1B, after the second sub-guide GD1b is inserted into the second sub-receiver RV1b through the perforation OPa of the first sub-guide GD1a, the first sub-guide GD1a can be inserted into the inner space RV1a-H of the first sub-receiver RV1a in the first direction DR1. As a result, the first sub-guide GD1a and the second sub-guide GD1b can not overlap each other when the substrate transport container TF is in the second mode. Figure 4B
[0088] When the substrate transport container TF is in the first mode, the first sub-guide GD1a can be ejected from the first sub-receiver RV1a in the first direction DR1. Thereafter, the second sub-guide GD1b can be ejected from the second sub-receiver RV1b in the second direction DR2. In this case, the second sub-guide GD1b can pass through the perforation OPa and can overlap the first sub-guide GD1a.
[0089] Figure 5 is a plan view illustrating a substrate transport container according to an embodiment of the inventive concept. Figure 6A and Figure 6B is a perspective view illustrating a guide of Figure 5 according to an embodiment of the inventive concept.
[0090] Figure 5 The substrate transport container TF-1 shown in FIG. 1A can include first to fourth receivers RV1-1, RV2-1, RV3-1, and RV4-1, first to fourth guides GD1-1 to GD4-1, and a support foam SFa.
[0091] In an embodiment, each of the second side wall SD2 and the fourth side wall SD4, which are two side walls of the first to fourth side walls SD1-SD4 of the support foam SFa opposing each other in the first direction DR1, can define at least one receiving hole. As an example, Figure 5 each of the second side wall SD2 and the fourth side wall SD4 can define two receiving holes.
[0092] Each of the first to fourth receiving portions RV1-1, RV2-1, RV3-1, and RV4-1 can have a shape extending in the first direction DR1. The first receiving portion RV1-1 and the second receiving portion RV2-1 can be disposed in two receiving holes defined in the second side wall SD2 of the support foam SFa. The third receiving portion RV3-1 and the fourth receiving portion RV4-1 can be disposed in two receiving holes defined in the fourth side wall SD4 of the support foam SFa.
[0093] The first guide GD1-1 can be physically connected to the first receiving portion RV1-1, and can include a first sub-guide GD1a-1 extending in the first direction DR1 and a second sub-guide GD1b-1 extending in the second direction DR2. The first sub-guide GD1a-1 can be connected to the first receiving portion RV1-1, and can be inserted into or ejected from an inner space defined in the first receiving portion RV1-1. The second sub-guide GD1b-1 can be inserted into or ejected from a bore defined in the first sub-guide GD1a-1.
[0094] In detail, as shown in FIG. 1A, the first sub-guide GD1a-1 can define a bore OPb. In an embodiment, the bore OPb can define a space in which the entire second sub-guide GD1b-1 can be inserted. For example, the bore OPb can be a perforation partially passing through the first sub-guide GD1a-1 or a partially recessed space. Figure 6A
[0095] According to an embodiment of the inventive concept, when the substrate transport container TF-1 is in the first mode, the first sub-guide GD1a-1 can be ejected from the first receiving portion RV1-1 in the first direction DR1. The second sub-guide GD1b-1 can be ejected from the bore OPb of the first sub-guide GD1a-1 in the second direction DR2.
[0096] When the substrate transport container TF-1 is in the second mode, the second sub-guide GD1b-1 can be inserted into the bore OPb of the first sub-guide GD1a-1. The first sub-guide GD1a-1 in which the second sub-guide GD1b-1 is inserted can be inserted into the first receiving portion RV1-1.
[0097] In an embodiment, a width D1 of the first sub-guide GD1a-1 measured in the second direction DR2 can be greater than a length D2 of the second sub-guide GD1b-1 measured in the second direction DR2. As a result, when the substrate transport container TF-1 is in the second mode, the second sub-guide GD1b-1 can be completely inserted in the bore OPb, as shown in FIG. 1A. Figure 6B The second sub-guide GD1b-1 can be completely overlapped with the second support surface BP2 in the first mode, for example.
[0098] In the present specification, the second sub-guide GD1b-1 inserted in the first sub-guide GD1a-1 can be referred to as an auxiliary guide.
[0099] Referring back to Figure 5 , the second guide GD2-1 can be physically connected to the second receiving portion RV2-1, and can include a third sub-guide GD2a-1 extending in the first direction DR1 and a fourth sub-guide GD2b-1 extending in the second direction DR2. The third sub-guide GD2a-1 can be connected to the second receiving portion RV2-1, and can be inserted into or ejected from an internal space defined in the second receiving portion RV2-1. The fourth sub-guide GD2b-1 can be inserted into or ejected from a bore defined in the third sub-guide GD2a-1. Similarly, the connection structure of the third sub-guide GD2a-1 and the fourth sub-guide GD2b-1 can substantially correspond to the structure illustrated in Figure 6A and Figure 6B .
[0100] The third guide GD3-1 can be physically connected to the third receiving portion RV3-1, and can include a fifth sub-guide GD3a-1 extending in the first direction DR1 and a sixth sub-guide GD3b-1 extending in the second direction DR2. The fifth sub-guide GD3a-1 can be connected to the third receiving portion RV3-1, and can be inserted into or ejected from an internal space defined in the third receiving portion RV3-1. The sixth sub-guide GD3b-1 can be inserted into or ejected from a bore defined in the fifth sub-guide GD3a-1. Similarly, the connection structure of the fifth sub-guide GD3a-1 and the sixth sub-guide GD3b-1 can substantially correspond to the structure illustrated in Figure 6A and Figure 6B .
[0101] The fourth guide GD4-1 can be physically connected to the fourth receiving portion RV4-1, and can include a seventh sub-guide GD4a-1 extending in the first direction DR1 and an eighth sub-guide GD4b-1 extending in the second direction DR2. The seventh sub-guide GD4a-1 can be connected to the fourth receiving portion RV4-1, and can be inserted into or ejected from an inner space defined in the fourth receiving portion RV4-1. The eighth sub-guide GD4b-1 can be inserted into or ejected from a bore defined in the seventh sub-guide GD4a-1. Similarly, the connection structure of the seventh sub-guide GD4a-1 and the eighth sub-guide GD4b-1 can substantially correspond to the structure illustrated in FIGS. 1A and 1B. Figure 6A and Figure 6B .
[0102] Figure 7 is a plan view illustrating a substrate transport container according to an embodiment of the inventive concept. Figure 8 is a plan view illustrating a guide and a receiving portion of Figure 7 according to an embodiment of the inventive concept.
[0103] Referring to Figure 7 , the substrate transport container TF-2 can include first to fourth receiving portions RV1-2, RV2-2, RV3-2, and RV4-2, first to fourth guides GD1-2-GD4-2, and a support foam SFb.
[0104] In an embodiment, each of the second side wall SD2 and the fourth side wall SD4, which are two side walls among the first to fourth side walls SD1-SD4 of the support foam SFb opposing each other in the first direction DR1, can define at least one receiving hole.
[0105] Each of the first to fourth receiving portions RV1-2, RV2-2, RV3-2, and RV4-2 can have a shape extending in the first direction DR1. The first receiving portion RV1-2 and the second receiving portion RV2-2 can be disposed in receiving holes defined in the second side wall SD2, respectively, and the third receiving portion RV3-2 and the fourth receiving portion RV4-2 can be disposed in receiving holes defined in the fourth side wall SD4, respectively, the receiving holes can include a first sub-receiving hole and a second sub-receiving hole, the first sub-receiving hole and the second sub-receiving hole can not overlap each other and can extend in the first direction DR1. In addition, each of the first to fourth guides GD1-2-GD4-2 can have a shape extending in the first direction DR1.
[0106] The first receiving portion RV1-2 can include a first sub-receiving portion RV1a-2 and a second sub-receiving portion RV1b-2, which extend in the first direction DR1 and are spaced apart from each other in the second direction DR2. The first sub-receiving portion RV1a-2 can have a longer length than the second sub-receiving portion RV1b-2 when measured in the first direction DR1.
[0107] In detail, referring to Figure 8 , the first guide GD1-2 can include a first sub-guide GD1a-2 and a second sub-guide GD1b-2, which extend in the first direction DR1 and are spaced apart from each other in the second direction DR2. The first sub-guide GD1a-2 can be inserted into or ejected from an inner space RV1a-H2 defined in the first sub-receiving portion RV1a-2. The second sub-guide GD1b-2 can be inserted into or ejected from an inner space RV1b-H2 defined in the second sub-receiving portion RV1b-2.
[0108] When the substrate transport container TF-2 is in the first mode, the first sub-guide GD1a-2 and the second sub-guide GD1b-2 can be ejected from the first sub-receiving portion RV1a-2 and the second sub-receiving portion RV1b-2, respectively. In this case, the first sub-guide GD1a-2 can have a length from the second side wall SD2 in the first direction DR1 that is greater than a length of the second sub-guide GD1b-2 from the second side wall SD2 in the first direction DR1. When the substrate transport container TF-2 is in the second mode, the first sub-guide GD1a-2 and the second sub-guide GD1b-2 can be inserted into the first sub-receiving portion RV1a-2 and the second sub-receiving portion RV1b-2, respectively. In the first mode, the first sub-guide GD1a-2 can have a length that overlaps the support surface BS in the first direction DR1 that is greater than a length of the second sub-guide GD1b-2 that overlaps the support surface BS in the first direction DR1.
[0109] Referring back to Figure 7 , the second guide GD2-2 can include a third sub-guide GD2a-2 and a fourth sub-guide GD2b-2, which extend in the first direction DR1 and are spaced apart from each other in the second direction DR2. The third sub-guide GD2a-2 and the fourth sub-guide GD2b-2 can have lengths that are the same as or different from each other in the first direction DR1. Figure 8The connection structure of the first sub-guide GD1a-2 and the second sub-guide GD1b-2 described is substantially the same connection structure, and thus a detailed description thereof will be omitted.
[0110] The third guide GD3-2 can include a fifth sub-guide GD3a-2 and a sixth sub-guide GD3b-2, the fifth sub-guide GD3a-2 and the sixth sub-guide GD3b-2 extending in the first direction DR1 and spaced apart from each other in the second direction DR2. The fifth sub-guide GD3a-2 and the sixth sub-guide GD3b-2 can have substantially the same connection structure as the first sub-guide GD1a-2 and the second sub-guide GD1b-2 described with reference to FIG. 1A. Figure 8 The connection structure of the first sub-guide GD1a-2 and the second sub-guide GD1b-2 described is substantially the same connection structure, and thus a detailed description thereof will be omitted.
[0111] The fourth guide GD4-2 can include a seventh sub-guide GD4a-2 and an eighth sub-guide GD4b-2, the seventh sub-guide GD4a-2 and the eighth sub-guide GD4b-2 extending in the first direction DR1 and spaced apart from each other in the second direction DR2. The seventh sub-guide GD4a-2 and the eighth sub-guide GD4b-2 can have substantially the same connection structure as the first sub-guide GD1a-2 and the second sub-guide GD1b-2 described with reference to FIG. 1A. Figure 8 The connection structure of the first sub-guide GD1a-2 and the second sub-guide GD1b-2 described is substantially the same connection structure, and thus a detailed description thereof will be omitted.
[0112] Figure 9 is a plan view illustrating a substrate transport container according to an embodiment of the inventive concept. Figure 10A and Figure 10B is a plan view illustrating a substrate transport container according to an embodiment of the inventive concept. Figure 9 of the guides and the receiving portions.
[0113] Referring to Figure 9 , the substrate transport container TF-3 can include first to fourth receiving portions RV1-3, RV2-3, RV3-3, and RV4-3, first to fourth guides GD1-3-GD4-3, and a support foam SFc.
[0114] In embodiments, each of the second side wall SD2 and the fourth side wall SD4 of the first to fourth side walls SD1-SD4 of the support foam SFc opposing each other in the first direction DR1 can define at least one receiving hole. As an example, Figure 9 Each of the second side wall SD2 and the fourth side wall SD4 shown in
[0115] Each of the first to fourth receiving portions RV1-3, RV2-3, RV3-3, and RV4-3 can have a shape extending in the second direction DR2. The first receiving portion RV1-3 and the second receiving portion RV2-3 can be disposed in two receiving holes defined in the second side wall SD2. The third receiving portion RV3-3 and the fourth receiving portion RV4-3 can be disposed in two receiving holes defined in the fourth side wall SD4.
[0116] The first guide GD1-3 can be physically connected to the first receiving portion RV1-3, and can include a first sub-guide GD1a-3 extending in the second direction DR2 and a second sub-guide GD1b-3 extending in the first direction DR1. However, the inventive concept is not limited to this example, and the second sub-guide GD1b-3 can not have a shape extending in a particular direction. For example, the second sub-guide GD1b-3 can have a rectangular or square shape when viewed in a plan view.
[0117] The first sub-guide GD1a-3 can be connected to the first receiving portion RV1-3, and can be inserted into or ejected from an inner space defined in the first receiving portion RV1-3. The second sub-guide GD1b-3 can be inserted into or ejected from a bore defined in the first sub-guide GD1a-3.
[0118] In detail, the first sub-guide GD1a-3 can define a bore OPc. In an embodiment, the bore OPc can define a space in which the entire second sub-guide GD1b-3 can be inserted. For example, the bore OPc can be a perforation partially passing through the first sub-guide GD1a-3 or a partially recessed space.
[0119] As shown in FIG. 1A, when the substrate transport container TF-3 is in the first mode, the first sub-guide GD1a-3 can be inserted into the first receiving portion RV1-3. The second sub-guide GD1b-3 can be inserted into the bore OPc of the first sub-guide GD1a-3. Figure 10A As shown in FIG. 1A, when the substrate transport container TF-3 is in the first mode, the first sub-guide GD1a-3 can be inserted into the first receiving portion RV1-3. The second sub-guide GD1b-3 can be inserted into the bore OPc of the first sub-guide GD1a-3.
[0120] When the substrate transport container TF-3 is in the second mode, the second sub-guide GD1b-3 can be inserted into the bore OPc of the first sub-guide GD1a-3. The first sub-guide GD1a-3 in which the second sub-guide GD1b-3 is inserted can be inserted into the first receiving portion RV1-3. As shown in FIG. 1A, when the substrate transport container TF-3 is in the second mode, the third sub-guide GD3a-3 can be inserted into the third receiving portion RV3-3. The fourth sub-guide GD4b-3 can be inserted into the bore OPc of the fourth sub-guide GD4a-3. Figure 10BAs shown in FIG. 1, the second sub-guide GD1b-3 can be completely inserted in the first sub-guide GD1a-3, and the first sub-guide GD1a-3 can be moved in the first direction DR1 and can be inserted in the inner space RV1-H3 of the first receiving portion RV1-3.
[0121] In the present specification, the second sub-guide GD1b-3 inserted in the first sub-guide GD1a-3 can be referred to as an auxiliary guide.
[0122] Referring back to FIG. 1, Figure 9 , the second guide GD2-3 can be physically connected to the second receiving portion RV2-3, and can include a third sub-guide GD2a-3 extending in the second direction DR2 and a fourth sub-guide GD2b-3 extending in the first direction DR1. The connection structure of the third sub-guide GD2a-3 and the fourth sub-guide GD2b-3 can substantially correspond to the structure shown in Figure 10A and Figure 10B .
[0123] The third guide GD3-3 can be physically connected to the third receiving portion RV3-3, and can include a fifth sub-guide GD3a-3 extending in the second direction DR2 and a sixth sub-guide GD3b-3 extending in the first direction DR1. The connection structure of the fifth sub-guide GD3a-3 and the sixth sub-guide GD3b-3 can substantially correspond to the structure shown in Figure 10A and Figure 10B .
[0124] The fourth guide GD4-3 can be physically connected to the fourth receiving portion RV4-3, and can include a seventh sub-guide GD4a-3 extending in the second direction DR2 and an eighth sub-guide GD4b-3 extending in the first direction DR1. The connection structure of the seventh sub-guide GD4a-3 and the eighth sub-guide GD4b-3 can substantially correspond to the structure shown in Figure 10A and Figure 10B .
[0125] According to embodiments of the inventive concept, the substrate transport container can have a shape that can be appropriately changed for one of a test mode and a shipping mode. In particular, the substrate transport container can include a guide that prevents a substrate from swinging and can be moved in a certain direction depending on whether the substrate transport container is in the test mode or the shipping mode.
[0126] According to embodiments of the inventive concept, a distance between the guide and the substrate in the test mode can be greater than a distance between the guide and the substrate in the shipping mode. Accordingly, when the substrate is loaded on or unloaded from the substrate transport container, the substrate can be prevented from being damaged by the guide.
[0127] While example embodiments of the inventive concept have been particularly shown and described, ordinary skilled in the art will understand that changes can be made in form and details without departing from the spirit and scope of the appended claims.
Claims
1. A substrate transport container, comprising: Support foam includes a support surface of a support substrate and a sidewall that bends from the support surface and defines a receiving hole; A receiving portion is provided in the receiving hole, the receiving portion defining an internal space; as well as Guides adjacent to the corners of the substrate, In a first mode, the guide pops out of the internal space, and in a second mode, it inserts into the internal space. The guide defines an inner hole, and The substrate transport container further includes an auxiliary guide that is inserted into the inner hole in the second mode and ejected from the inner hole in the first mode.
2. The substrate transport container according to claim 1, wherein, In the first mode, the area of the guide overlapping the support surface is greater than the area of the guide overlapping the support surface in the second mode.
3. The substrate transport container according to claim 1, wherein, The guide is closer to the substrate in the first mode than in the second mode.
4. The substrate transport container according to claim 1, wherein, The receiving hole includes a first sub-receiving hole and a second sub-receiving hole, the first sub-receiving hole and the second sub-receiving hole do not overlap each other and extend in a first direction and a second direction perpendicular to the first direction, respectively. The receiving portion includes a first sub-receiving portion and a second sub-receiving portion. The first sub-receiving portion is disposed in a first sub-receiving hole to define a first internal space, and the second sub-receiving portion is disposed in a second sub-receiving hole to define a second internal space. The guide includes a first sub-guide and a second sub-guide. The first sub-guide is inserted into or ejected from the first internal space, and the second sub-guide is inserted into or ejected from the second internal space.
5. The substrate transport container according to claim 4, wherein, In the second mode, the first sub-guide is inserted into the first sub-receiver in the first direction, and the second sub-guide is inserted into the second sub-receiver in the second direction.
6. The substrate transport container according to claim 5, wherein, In the first mode, a portion of the first sub-guide and a portion of the second sub-guide overlap each other.
7. The substrate transport container according to claim 5, wherein, The first sub-guide defines the perforation. In the first mode, the second sub-guide overlaps with the support surface and is inserted into the perforation, and In the second mode, the second sub-guide does not overlap with the perforation and is inserted into the second internal space.
8. The substrate transport container according to claim 1, wherein, The receiving aperture includes a first sub-receiving aperture and a second sub-receiving aperture, the first sub-receiving aperture and the second sub-receiving aperture do not overlap each other and extend in a first direction. The receiving portion includes a first sub-receiving portion and a second sub-receiving portion. The first sub-receiving portion is disposed in a first sub-receiving hole to define a first internal space, and the second sub-receiving portion is disposed in a second sub-receiving hole to define a second internal space. The guide includes a first sub-guide and a second sub-guide, the first sub-guide being inserted into the first internal space and the second sub-guide being inserted into the second internal space.
9. The substrate transport container according to claim 8, wherein, In the first mode, the length by which the first sub-guide overlaps with the support surface in the first direction is greater than the length by which the second sub-guide overlaps with the support surface in the first direction.
Citation Information
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