Substrate transport system and load lock module

Abstract

A substrate transport system and a load lock module are provided. The substrate transport system includes an atmospheric substrate transport module, a vacuum substrate transport module, and a load lock module disposed on a side of the atmospheric substrate transport module and on an upper surface or a lower surface of the vacuum substrate transport module. The load lock module has a container, a first door, a second door, and a substrate lift mechanism. The container has a first substrate transport port formed on a side of the container and capable of communicating an inside of the container with the atmospheric substrate transport module, and a second substrate transport port capable of communicating the inside of the container with the vacuum substrate transport module. The first door is openable and closable to the first substrate transport port. The second door is openable and closable to the second substrate transport port. The substrate lift mechanism lifts a substrate between a first position in the inside of the container and a second position in the vacuum substrate transport module via the second substrate transport port. The first position is at the same height as the first substrate transport port. According to the present invention, a setting area of a substrate processing system can be reduced.

Description

TECHNICAL FIELD

[0001] Various aspects and embodiments of the present application relate to a substrate transport system and a load lock module. BACKGROUND

[0002] A semiconductor manufacturing apparatus having three carrier placement stages for placing substrate transport containers that hold a prescribed number of wafers as processing targets is described in Patent Literature 1. The semiconductor manufacturing apparatus of Patent Literature 1 has a first transport chamber for transporting wafers in an atmospheric atmosphere. The semiconductor manufacturing apparatus of Patent Literature 1 has, for example, two load lock chambers in left and right side-by-side arrangement for switching the inside of the chamber to an atmospheric atmosphere and a vacuum atmosphere and for standby of wafers. The semiconductor manufacturing apparatus of Patent Literature 1 includes a second transport chamber for transporting wafers in a vacuum atmosphere and, for example, four processing modules for performing process treatment on wafers that are fed in. Further, a transport device provided in the first transport chamber is described in Patent Literature 1. In the transport device of Patent Literature 1, a base is configured to be movable in the length direction of the first transport chamber and liftable by a drive mechanism, and is capable of transferring wafers between an alignment chamber and a substrate transport container.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Publication No. 2015-18875 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] The present application provides a substrate transport system and an atmospheric transport module that can reduce the installation area of a substrate processing system.

[0008] TECHNICAL MEANS FOR SOLVING THE PROBLEMS

[0009] One aspect of the present application is a substrate transport system including an atmospheric substrate transport module, a vacuum substrate transport module, and a load lock module disposed on a side surface of the atmospheric substrate transport module and disposed on an upper surface or a lower surface of the vacuum substrate transport module. The load lock module has a container, a first door, a second door, and a substrate lifting mechanism. The container has a first substrate transport port and a second substrate transport port. The first substrate transport port is formed in a side surface of the container and is capable of communicating the inside of the container with the atmospheric substrate transport module. The second substrate transport port is formed in a lower surface or an upper surface of the container and is capable of communicating the inside of the container with the vacuum substrate transport module. The first door is openable and closable to the first substrate transport port. The second door is openable and closable to the second substrate transport port. The substrate lifting mechanism is configured to lift a substrate between a first position in the container and a second position in the vacuum substrate transport module via the second substrate transport port. The first position is at the same height as the first substrate transport port.

[0010] Inventive Effects

[0011] According to various aspects and embodiments of the present application, it is possible to reduce the installation area of a substrate processing system. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 is a plan view showing one example of a substrate processing system in the first embodiment.

[0013] Figure 2 is a plan view showing one example of a substrate processing system in the first embodiment. Figure 1 is a view showing one example of the A-A cross section of the substrate processing system in the first embodiment.

[0014] Figure 3 is a view showing one example of the B-B cross section of the substrate processing system in the first embodiment. Figure 2

[0015] Figure 4 is a sectional view showing one example of a load lock module in the first embodiment.

[0016] Figure 5 is a perspective view showing one example of a door structure.

[0017] Figure 6 is a sectional view showing one example of a load lock module in the first embodiment.

[0018] Figure 7 is a sectional view showing one example of a substrate processing system when a substrate is being transported.

[0019] Figure 8 is a sectional view showing one example of a substrate processing system when a substrate is being transported.

[0020] Figure 9 is a sectional view showing one example of a substrate processing system when a substrate is being transported.

[0021] Figure 10 is a sectional view showing one example of a load lock module in the second embodiment.

[0022] Figure 11 is a sectional view showing one example of a load lock module in the second embodiment when a substrate is being transported between the load lock module and an atmospheric substrate transport module.

[0023] Figure 12 is a sectional view showing one example of a load lock module in the third embodiment.

[0024] Figure 13 is a sectional view showing one example of a load lock module in the fourth embodiment. ​

[0025] Figure 14 is a sectional view showing one example of a load lock module when a substrate is transported between the load lock module and a vacuum substrate transport module in the fourth embodiment.

[0026] Figure 15 is a sectional view showing another mode of a substrate processing system.

[0027] Figure 16 is a perspective view showing one example of a substrate holding portion.

[0028] Figure 17 is a sectional view showing one example of a substrate processing system when a substrate is transported between a load lock module and a vacuum substrate transport module.

[0029] BRIEF DESCRIPTION OF REFERENCE NUMERALS

[0030] G gate

[0031] W substrate

[0032] 1 substrate processing system

[0033] 10 main body

[0034] 110 transport robot

[0035] 11 vacuum substrate transport module

[0036] 12 substrate processing module

[0037] 17 atmospheric substrate transport module

[0038] 170 guide rail

[0039] 171 transport robot

[0040] 175 FFU

[0041] 177 exhaust device

[0042] 176 perforated floor

[0043] 18 load port

[0044] 100 control device

[0045] 20 load lock module

[0046] 200 lifting mechanism

[0047] 21 container

[0048] 210 first container

[0049] 212 opening portion

[0050] 213 sealing member

[0051] 214 opening portion

[0052] 211 second container

[0053] 22 door structure

[0054] 220 base portion

[0055] 221 door support portion

[0056] 222 lift pin

[0057] 223 substrate holding portion

[0058] 23 support portion

[0059] 230 recessed portion

[0060] 24 drive portion

[0061] 25 door mechanism

[0062] 250 support portion

[0063] 251 drive portion

[0064] 26 sealing mechanism

[0065] 260 sealing member

[0066] 261 holding portion

[0067] 262 bellows

[0068] 27 temperature adjustment portion

[0069] 28 locking portion

[0070] 280 stopper DETAILED DESCRIPTION

[0071] Hereinafter, embodiments of a substrate transport system and a load lock module will be described in detail based on the drawings. Furthermore, the disclosed substrate transport system and load lock module are not limited by the following embodiments.

[0072] In order to increase the number of substrates that can be processed per unit time, it is considered to increase the number of processing modules that process substrates. When the number of processing modules is increased, a substrate processing system including a plurality of processing modules, a vacuum transport module, a load lock module, and an atmospheric transport module, and the like is upsized. When the substrate processing system is upsized, the installation area (floor space) of the substrate processing system in a clean room or the like becomes large, and it is difficult to arrange a plurality of substrate processing systems. Therefore, it is desired to reduce the installation area of the substrate processing system.

[0073] Thus, the present application provides a technology capable of reducing the installation area of a substrate processing system.

[0074] (First Embodiment)

[0075] [Structure of Substrate Processing System 1]

[0076] Figure 1 is a plan view showing one example of the structure of the substrate processing system 1 in the first embodiment. Figure 2 is a view showing one example of the A-A cross section of the substrate processing system 1 in Figure 1 Figure 3 is a view showing one example of the B-B cross section of the substrate processing system 1 in Figure 2 Figure 1 In the first embodiment, the substrate processing system 1 includes a main body 10 and a control device 100 that controls the main body 10. The main body 10 includes a vacuum substrate transport module 11, a plurality of substrate processing modules 12, an atmospheric substrate transport module 17, a plurality of load ports 18, and a plurality of load lock modules 20. The vacuum substrate transport module 11 is configured to be capable of transporting a substrate under a vacuum atmosphere. In addition, "vacuum" in the present specification means a pressure lower than atmospheric pressure, and is sometimes described as "reduced pressure" or "low pressure".

[0077] The main body 10 includes a vacuum substrate transport module 11, a plurality of substrate processing modules 12, an atmospheric substrate transport module 17, a plurality of load ports 18, and a plurality of load lock modules 20. The vacuum substrate transport module 11 is configured to be capable of transporting a substrate under a vacuum atmosphere. In addition, "vacuum" in the present specification means a pressure lower than atmospheric pressure, and is sometimes described as "reduced pressure" or "low pressure".

[0078] In the first embodiment, the vacuum substrate transport module 11 is configured to be capable of transporting a substrate under a vacuum atmosphere between the substrate processing modules 12 and the load lock modules 20, or between the plurality of substrate processing modules 12. The atmospheric substrate transport module 17 is configured to be capable of transporting a substrate under an atmospheric pressure atmosphere. In the first embodiment, the atmospheric substrate transport module 17 is configured to be capable of transporting a substrate under an atmospheric pressure atmosphere between a FOUP (Front Opening Unified Pod) on the load port 18 and the load lock module 20.

[0079] A plurality of substrate transport ports are formed in the side wall of the vacuum substrate transport module 11, and a corresponding gate G1 that is openable and closable is installed in each substrate transport port. In the example of Figure 1 In the example of FIG. 1, two substrate transport ports are formed in the first side wall of the vacuum substrate transport module 11, and a gate G1 is installed in each substrate transport port. In addition, two substrate transport ports are formed in the second side wall that is on the opposite side of the first side wall, and a gate G1 is installed in each substrate transport port. Each substrate processing module 12 communicates with the vacuum substrate transport module 11 via a corresponding substrate transport port. In the example of Figure 1 ​​In the example, four substrate processing modules 12 are connected to the vacuum substrate transport module 11. However, the number of substrate processing modules 12 connected to the vacuum substrate transport module 11 may be less than three or more than five.

[0080] Each substrate processing module 12 performs a process such as etching or film formation (eg, plasma processing) on ​​the substrate W. Each substrate processing module 12 may be a module that performs the same process in the manufacturing process or a module that performs different processes.

[0081] In addition, for example Figure 2 and Figure 3 As shown, in this embodiment, a plurality of openings 212 are formed on the lower surface of the vacuum substrate transport module 11 and the upper surface of a plurality of load lock modules 20 (containers 21 described later). A gate G2 that can open and close the corresponding opening 212 is installed on each opening 212. The interior of each load lock module 20 can be connected to the interior of the vacuum substrate transport module 11 via the corresponding opening 212 and the gate G2. The opening 212 is an example of a second substrate transport port. The gate G2 is an example of a second door. In Figures 1-3 In the example, two load lock modules 20 are connected to the vacuum substrate transport module 11 . However, the number of load lock modules 20 connected to the vacuum substrate transport module 11 may be one or more.

[0082] A transport robot 110 is provided within the vacuum substrate transport module 11. The transport robot 110 is an example of a second transport robot. The transport robot 110 transports substrates W between the substrate processing module 12 and the load lock module 20. The substrates W are transported between the substrate processing module 12 and the load lock module 20 by the transport robot 110 via the vacuum substrate transport module 11. The interior of the vacuum substrate transport module 11 is maintained in a vacuum atmosphere (e.g., a predetermined pressure lower than atmospheric pressure; hereinafter sometimes referred to as "low pressure").

[0083] In addition, for example Figure 2 and Figure 3As shown, in this embodiment, multiple substrate conveying ports are formed on the side of the atmospheric substrate conveying module 17 and the side of multiple load lock modules 20 (containers 21 described later). A gate G3 is installed at each substrate conveying port to open and close the corresponding substrate conveying port. Each load lock module 20 can communicate with the atmospheric substrate conveying module 17 via the corresponding substrate conveying port. The substrate conveying port formed on the side of each load lock module 20 is an opening 214 described later. The opening 214 is an example of a first substrate conveying port. The gate G3 is an example of a first door. After the substrate W is conveyed from the atmospheric substrate conveying module 17 via the opening 214, the load lock module 20 closes the gate G3. Then, the pressure in the load lock module 20 is reduced from atmospheric pressure to low pressure using an exhaust device (not shown). Then, the load lock module 20 opens the gate G2, and the substrate W in the load lock module 20 is conveyed into the vacuum substrate conveying module 11 via the opening 212.

[0084] Furthermore, when the load lock module 20 is in a low pressure state (vacuum atmosphere), after the substrate W is transferred from the vacuum substrate transfer module 11 through the opening 212, the gate G2 is closed. Then, a gas (e.g., air) is supplied into the load lock module 20 using a gas supply device (not shown), thereby raising the pressure within the load lock module 20 from the low pressure to atmospheric pressure. The load lock module 20 then opens the gate G3, and the substrate W in the load lock module 20 is transferred into the atmospheric substrate transfer module 17 through the opening 214.

[0085] Multiple load ports 18 are provided on the side wall of the atmospheric substrate transfer module 17 connected to the load lock module 20 and the side wall of the atmospheric substrate transfer module 17 on the opposite side. A FOUP (Front Opening Unified Pod) storing multiple substrates W is connected to each load port 18.

[0086] A transport robot 171 is provided within the atmospheric substrate transport module 17. The transport robot 171 is an example of a first transport robot. The transport robot 171 transports substrates W between a FOUP connected to the load port 18 and the load lock module 20. Guide rails 170 are provided on the sidewall of the atmospheric substrate transport module 17 on the load lock module 20 side. The transport robot 171 moves within the atmospheric substrate transport module 17 along the guide rails 170.

[0087] In the upper part of the atmospheric substrate transport module 17, for example Figure 2As shown, a FFU (Fan Filter Unit) 175 is provided. The FFU 175 supplies air from which particles and the like have been removed (hereinafter referred to as clean air) from the atmosphere into the atmosphere substrate transport module 17 from the upper portion of the atmosphere substrate transport module 17. A perforated floor 176 is provided at the bottom of the atmosphere substrate transport module 17, and an exhaust device 177 for exhausting the clean air in the atmosphere substrate transport module 17 is connected below the perforated floor 176. The clean air supplied from the FFU 175 is exhausted by the exhaust device 177 via the perforated floor 176, whereby a descending flow of clean air is formed in the atmosphere substrate transport module 17. Thus, the entrainment of particles and the like in the atmosphere substrate transport module 17 can be suppressed. Further, it is preferable that the exhaust device 177 control the pressure in the atmosphere substrate transport module 17 so that the atmosphere substrate transport module 17 becomes a positive pressure. Thus, the intrusion of particles and the like from the outside into the atmosphere substrate transport module 17 can be suppressed.

[0088] The control device 100 includes a memory, a processor, and an input / output interface. Data or programs and the like of the scheme and the like are stored in the memory. The memory is, for example, a RAM (Random Access Memory), a ROM (Read Only Memory), an HDD (Hard Disk Drive), an SSD (Solid State Drive), or the like. The processor controls each part of the main body 10 based on the data of the scheme and the like stored in the memory by executing the programs read from the memory via the input / output interface. The processor is a CPU (Central Processing Unit), a DSP (Digital Signal Processor), or the like.

[0089] As described above, in the present embodiment, the load lock module 20 is connected to the lower surface of the vacuum substrate transport module 11 via the gate G2, and the atmosphere substrate transport module 17 is connected to the side surface of the load lock module 20 via the gate G3. Therefore, the load lock module 20 is arranged at the side surface of the atmosphere substrate transport module 17 and at the lower surface of the vacuum substrate transport module 11. Thus, compared to the case where the load lock module 20 is arranged between the vacuum substrate transport module 11 and the atmosphere substrate transport module 17, the installation area of the substrate processing system 1 can be reduced.

[0090] [Structure of Load Lock Module 20]

[0091] Figure 4is a sectional view showing one example of the load lock module 20 in the first embodiment. The load lock module 20 has a container 21, a door mechanism 25, and a lifting mechanism 200. The container 21 has a first container 210 and a second container 211. The lifting mechanism 200 includes a door structure 22, a support portion 23, and a driving portion 24. The lifting mechanism 200 is one example of a substrate lifting mechanism.

[0092] On the upper surface of the first container 210, an opening portion 212 having an inner shape larger than the outer shape of the substrate W is formed. On the upper surface of the container 21, around the opening portion 212, a seal member 213 such as an O-ring is provided in a manner of surrounding the opening portion 212. On the side surface of the first container 210, an opening portion 214 having an inner shape larger than the outer shape of the substrate W is formed. The substrate W is transported within the first container 210. An exhaust device and a gas supply device, not shown, are connected to the first container 210. With the exhaust device connected to the first container 210, the pressure within the first container 210 is lowered to a pre-set pressure lower than the atmospheric pressure. Further, with the gas supply device connected to the first container 210, a gas (for example, air) is supplied to the first container 210, whereby the pressure within the first container 210 is raised to the atmospheric pressure.

[0093] Figure 5 is a perspective view showing one example of the door structure 22. The door structure 22 has a shutter G2, a base portion 220, a plurality of door support portions 221, and a plurality of lifting pins 222. One end of each of the door support portions 221 is fixed to the base portion 220, and the other end is fixed to the shutter G2. Each of the door support portions 221 supports the shutter G2 with respect to the base portion 220. One end of each of the lifting pins 222 is fixed to the base portion 220. Each of the lifting pins 222 supports the substrate W at the other end. The door support portion 221 is one example of a door lifting mechanism.

[0094] Back Figure 4 The description will be continued. The shutter G2 has an outer shape larger than the inner shape of the opening portion 214. The base portion 220 is arranged within the second container 211. The support portion 23 supports the door structure 22. The driving portion 24 drives the support portion 23. The door structure 22 as a whole is lifted by lifting the support portion 23 with the driving portion 24. The driving portion 24 is configured to be able to lift the substrate W between the first position PI within the container 21 and the second position P2 within the vacuum substrate transport module 11 via the opening portion 212. The first position PI is the same height as the opening portion 214. For example, the first position PI is the height from the bottom surface of the first container 210. The first position PI is a position at which the substrate W can be transported between the inside of the container 21 and the atmospheric substrate transport module 17 via the opening portion 214. In the example shown in the drawing, the first position PI is a position between the height direction range Δh of the opening portion 214. Figure 4 In the example shown in the drawing, the first position PI is a position between the height direction range Δh of the opening portion 214.

[0095] In this embodiment, the gate structure 22 is raised and lowered as a whole, and the gate support parts 221 and the lift pins 222 included in the gate structure 22 are raised and lowered together. Thus, the gate G2 and the substrate W supported by the lift pins 222 are raised and lowered simultaneously.

[0096] For example, Figure 4 As shown, the door structure 22 descends and the gate G contacts the upper surface of the container 21, thereby blocking the communication between the interior of the container 21 of the load lock module 20 and the interior of the vacuum substrate transport module 11. Figure 6 As shown, the gate G2 rises by the rise of the door structure 22, and the interior of the first container 210 of the load lock module 20 is connected to the interior of the vacuum substrate transport module 11. Then, the lifting pins 222 supporting the substrate W are connected together with the gate G2 by the rise of the door structure 22. As a result, the substrate W is taken out from the lifting pins 222 by the transport robot 110 in the vacuum substrate transport module 11, and the substrate W is placed on the lifting pins 222 by the transport robot 110. When the substrate W is taken out from the lifting pins 222 by the transport robot 110, the drive unit 24 raises the substrate W to the second position P2 in the vacuum substrate transport module 11. The second position is, for example, Figure 6 , which is the height from the bottom surface of the first container 210. In this embodiment, the second position P2 is higher than the first position P1.

[0097] A door mechanism 25 is provided at the opening 214 of the container 21. The door mechanism 25 includes a gate G3, a support portion 250, and a drive portion 251. The support portion 250 supports the gate G3. The drive portion 251 raises and lowers the support portion 250. By raising and lowering the support portion 250 by the drive portion 251, the gate G3 is raised and lowered. When the gate G3 is lowered, the atmospheric substrate transport module 17 and the load lock module 20 are connected via the opening 214. Furthermore, when the gate G3 rises and contacts the upper surface of the opening 214, the opening 214 is closed, thereby blocking the connection between the atmospheric substrate transport module 17 and the load lock module 20.

[0098] [Conveyance of Substrate W]

[0099] Figures 7-9 1 is a cross-sectional view showing an example of the substrate processing system 1 when transporting a substrate W. When transporting a substrate W from a FOUP to the substrate processing module 12, first, the transport robot 171 takes out the substrate W from the FOUP connected to the load port 18 into the atmospheric substrate transport module 17 under atmospheric pressure. Then, for example, Figure 7As shown, the opening portion 214 is opened by the gate G3. The transfer robot 171 transfers the substrate W from the atmospheric substrate transfer module 17 into the load lock module 20 via the opening portion 214, and places the substrate W on the lift pins 222 in the load lock module 20.

[0100] Next, as shown in FIG. 6, for example, the door structure 22 is lowered by the drive section 24 under a vacuum atmosphere. By this, the gate G2 is lowered, and the opening portion 212 is closed by the gate G2. At the same time, the substrate W is lowered from the second position P2 in the vacuum substrate transfer module 11 to the first position PI in the load lock module 20. Figure 8 Next, as shown in FIG. 6, for example, the door structure 22 is lowered by the drive section 24 under a vacuum atmosphere. By this, the gate G2 is lowered, and the opening portion 212 is closed by the gate G2. At the same time, the substrate W is lowered from the second position P2 in the vacuum substrate transfer module 11 to the first position PI in the load lock module 20.

[0101] Figure 9 Next, as shown in FIG. 6, for example, the door structure 22 is lowered by the drive section 24 under a vacuum atmosphere. By this, the gate G2 is lowered, and the opening portion 212 is closed by the gate G2. At the same time, the substrate W is lowered from the second position P2 in the vacuum substrate transfer module 11 to the first position PI in the load lock module 20.

[0102] In the case where the substrate W is delivered from the substrate processing module 12 to the FOUP, a procedure opposite to that shown in FIG. 7 is performed. That is, the opening portion of the substrate processing module 12 is opened by the gate Gl, and the substrate W is transferred from the substrate processing module 12 into the vacuum substrate transfer module 11 by the transfer robot 110 under a vacuum atmosphere. Then, as shown in FIG. 8, for example, the door structure 22 is raised by the drive section 24, and the substrate W is placed on the lift pins 222 by the transfer robot 110. Then, as shown in FIG. 9, for example, the door structure 22 is lowered by the drive section 24 under a vacuum atmosphere. By this, the gate G2 is lowered, and the opening portion 212 is closed by the gate G2. At the same time, the substrate W is lowered from the second position P2 in the vacuum substrate transfer module 11 to the first position PI in the load lock module 20. Figures 7-9 Figure 9 Next, as shown in FIG. 6, for example, the door structure 22 is lowered by the drive section 24 under a vacuum atmosphere. By this, the gate G2 is lowered, and the opening portion 212 is closed by the gate G2. At the same time, the substrate W is lowered from the second position P2 in the vacuum substrate transfer module 11 to the first position PI in the load lock module 20. Figure 8 Next, a gas (for example, air) is supplied to the first container 210 by a gas supply device not shown, whereby the pressure in the first container 210 is raised to atmospheric pressure. Then, as shown in FIG. 10, for example, the opening portion 214 is opened by the gate G3, and the substrate W is taken out from the lift pins 222 by the transfer robot 171 under an atmospheric pressure atmosphere, and is transferred to the FOUP via the atmospheric substrate transfer module 17.

[0103] Figure 7 Next, as shown in FIG. 6, for example, the door structure 22 is lowered by the drive section 24 under a vacuum atmosphere. By this, the gate G2 is lowered, and the opening portion 212 is closed by the gate G2. At the same time, the substrate W is lowered from the second position P2 in the vacuum substrate transfer module 11 to the first position PI in the load lock module 20. ​​​

[0104] The first embodiment has been described above. As described above, the substrate processing system 1 in the present embodiment includes the vacuum substrate transport module 11, the atmospheric substrate transport module 17, and the load lock module 20 disposed at the side surface of the atmospheric substrate transport module 17 and at the lower surface of the vacuum substrate transport module 11. The load lock module 20 has the container 21, the gate G2, the gate G3, and the lifting mechanism 200. The container 21 has the opening portion 212 and the opening portion 214. The opening portion 214 is formed at the side surface of the container 21 and can communicate the inside of the container 21 with the atmospheric substrate transport module 17. The opening portion 212 is formed at the lower surface or the upper surface of the container 21 and can communicate the inside of the container 21 with the vacuum substrate transport module 11. The gate G3 can open and close the opening portion 214. The gate G2 can open and close the opening portion 212. The lifting mechanism 200 is configured to lift the substrate W between the first position PI in the container 21 and the second position P2 in the vacuum substrate transport module 11 via the opening portion 212. The first position PI is at the same height as the opening portion 214. Thus, the installation area of the substrate processing system 1 can be reduced.

[0105] In the first embodiment described above, the atmospheric substrate transport module 17 has the transport robot 171. The transport robot 171 is configured to transport the substrate W between the first position and the load lock module 20 connected to the atmospheric substrate transport module 17 via the opening portion 214. Thus, the substrate W can be transported between the atmospheric substrate transport module 17 and the load lock module 20.

[0106] In the first embodiment described above, the vacuum substrate transport module 11 has the transport robot 110. The transport robot 110 is configured to transport the substrate W between the second position and the substrate processing module 12 connected to the vacuum substrate transport module 11. Thus, the substrate W can be transported between the load lock module 20 and the substrate processing module 12 in an atmosphere of a predetermined pressure lower than the atmospheric pressure.

[0107] In the first embodiment described above, the load lock module 20 is disposed at the lower surface of the vacuum substrate transport module 11, and the second position is higher than the first position. Thus, the installation area of the substrate processing system 1 can be reduced.

[0108] In the first embodiment described above, the load lock module 20 has the door support portion 221. The door support portion 221 is configured to lift the gate G2 between a closed position and an open position. The closed position is a position where the opening portion 212 is closed from above by the gate G2, and the open position is a position higher than the second position. Thus, the gate G2 between the vacuum substrate transport module 11 and the load lock module 20 can be opened and closed.

[0109] Further, in the above-described first embodiment, the door support portion 221 is configured to be capable of raising and lowering the gate G2 together with the raising and lowering of the substrate W based on the raising and lowering mechanism 200. Thus, the mechanism for raising and lowering the door support portion 221 and the raising and lowering mechanism 200 can be commonized.

[0110] Further, in the above-described first embodiment, the raising and lowering mechanism 200 has a plurality of raising pins 222 configured to be capable of supporting the substrate W and a drive portion 24 configured to be capable of raising and lowering the plurality of raising pins 222. Thus, the substrate W can be raised and lowered.

[0111] Further, the load lock module 20 in the above-described first embodiment includes the container 21, the gate G3, the gate G2, and the raising and lowering mechanism 200. The container 21 has an opening portion 212 and an opening portion 214. The opening portion 214 is formed in a side surface of the container 21 and is capable of communicating the inside of the container 21 with the atmospheric substrate transport module 17. The opening portion 212 is formed in a lower surface or an upper surface of the container 21 and is capable of communicating the inside of the container 21 with the vacuum substrate transport module 11. The gate G3 is openable and closable to the opening portion 214. The gate G2 is openable and closable to the opening portion 212. The raising and lowering mechanism 200 is configured to be capable of raising and lowering the substrate W between a first position P1 inside the container 21 and a second position P2 outside the container 21 via the opening portion 212. The first position P1 is the same height as the opening portion 214.

[0112] (Second Embodiment)

[0113] In the second embodiment, a temperature adjustment portion for adjusting the temperature of the processed substrate W is provided in the load lock module 20. When the processed substrate W is fed into the load lock module 20 from the vacuum substrate transport module 11, the processed substrate W is placed on the temperature adjustment portion and exchanges heat with the temperature adjustment portion, whereby the processed substrate W is adjusted to a predetermined temperature. After the temperature of the processed substrate W is adjusted to the predetermined temperature, the processed substrate W is fed out of the load lock module 20 to the atmospheric substrate transport module 17. Further, the structure of the substrate processing system 1 in the second embodiment is the same as that of the substrate processing system 1 described in the above-described first embodiment except for the points described below. Figures 1-3 The structure of the substrate processing system 1 described in the first embodiment is the same as that of the substrate processing system 1 described in the above-described first embodiment except for the points described below.

[0114] [Structure of Load Lock Module 20]

[0115] Figure 10 is a cross-sectional view showing one example of the load lock module 20 in the second embodiment. The load lock module 20 has a container 21, a door mechanism 25, a sealing mechanism 26, a temperature adjustment portion 27, and a raising and lowering mechanism 200. Further, the constituent elements denoted by the same reference numerals as those in the above-described first embodiment have the same functions as those in the above-described first embodiment except for the points described below. Figure 10 Figure 4 Figure 4 ​​The same or similar functions of the constituent elements exemplified in the above embodiment are omitted from the description.

[0116] In the first container 210, a temperature adjustment section 27 for adjusting the temperature of the substrate W is provided. The processed substrate W is fed from the vacuum substrate transport module 11 into the load lock module 20, and is placed on the temperature adjustment section 27, for example, as shown in Figure 10 After being adjusted to a predetermined temperature, the processed substrate W is fed from the load lock module 20 to the atmospheric substrate transport module 17. When being fed from the load lock module 20 to the atmospheric substrate transport module 17, the substrate W is lifted from the temperature adjustment section 27 by the lift pins 222.

[0117] Here, in the present embodiment, the door support section 221 that supports the gate G2 and the lift pins 222 that support the substrate W are lifted together by the drive section 24. Therefore, when the lift pins 222 are lifted, the door support section 221 and the gate G2 are also lifted, and the blockage of the communication between the load lock module 20 and the vacuum substrate transport module 11 is released.

[0118] To avoid such a situation, in the present embodiment, a seal mechanism 26 is provided on the upper surface of the container 21 around the opening section 212 in a manner to surround the opening section 212. The seal mechanism 26 has a seal member 260 such as an O-ring, a holding section 261 that holds the seal member 260, and a bellows 262 that is disposed between the holding section 261 and the upper surface of the container 21. One end of the bellows 262 is fixed to the upper surface of the container 21, and the other end of the bellows 262 is fixed to the holding section 261. Further, the bellows 262 exerts a force on the holding section 261 in the direction of the gate G2.

[0119] Thus, in the case where the lift pins 222 are lifted in order to feed the substrate W from the load lock module 20 to the atmospheric substrate transport module 17, for example, as shown in Figure 11 Thus, in the case where the lift pins 222 are lifted in order to feed the substrate W from the load lock module 20 to the atmospheric substrate transport module 17, for example, as shown in

[0120] (Third Embodiment)

[0121] When the substrate W is being transported between the atmospheric substrate transport module 17 and the load lock module 20, the load lock module 20 is at atmospheric pressure. On the other hand, the vacuum substrate transport module 11 is at a pressure lower than atmospheric pressure, so a force is applied to the gate G2 in the direction from the load lock module 20 to the vacuum substrate transport module 11. Therefore, in this embodiment, when the connection between the load lock module 20 and the vacuum substrate transport module 11 is blocked by the gate G2, for example, Figure 12 As shown, the locking portion 28 is used to insert the stopper 280 into the recess 230 formed in the support portion 23. This can limit the movement of the support portion 23 and the rise of the gate G2. As a result, when the substrate W is transported between the atmospheric substrate transport module 17 and the load lock module 20, there is no need for the drive portion 24 to continuously apply a force to pull the gate G2 downward, thereby achieving power saving of the drive portion 24. In addition, the structure and use of the load lock module 20 are Figures 1-3 The substrate processing system 1 in the first embodiment described above is the same.

[0122] (Fourth embodiment)

[0123] In the first to third embodiments described above, the gate G2 is provided on the upper surface of the container 21 and on the outside of the container 21. In contrast, in the present embodiment, the gate G2 is provided on the upper surface of the container 21 and on the inside of the container 21. Thus, when the substrate W is transported between the atmospheric substrate transport module 17 and the load lock module 20, it is not necessary to continuously apply a force to the gate G2 by the drive unit 24 to pull the gate G2 downward, thereby achieving power saving of the drive unit 24. In addition, the structure other than the load lock module 20 is different from that using Figures 1-3 The substrate processing system 1 in the first embodiment described above is the same.

[0124] [Structure of the Load Lock Module 20]

[0125] Figure 13 : is a cross-sectional view showing an example of a load lock module 20 in the fourth embodiment. The load lock module 20 includes a container 21, a door mechanism 25, and a lifting mechanism 200. The lifting mechanism 200 includes a door structure 22, a support portion 23, and a drive portion 24. The door structure 22 includes a base 220 and a plurality of lifting pins 222. In addition, except for the points described below, Figure 10 In the Figure 4 The components with the same reference numerals have the same Figure 4 The components illustrated in the drawings have the same or similar functions, so repeated descriptions are omitted.

[0126] In the present embodiment, the gate G2 is provided on the upper surface of the first container 210 on the inner side of the first container 210. In the case of blocking the communication between the load lock module 20 and the vacuum substrate transport module 11, the gate G2 is brought into contact with the upper surface of the first container 210 on the inner side of the first container 210, for example, as shown in FIG. 9. In the case of performing the transport of the substrate W between the atmospheric substrate transport module 17 and the load lock module 20, the inside of the load lock module 20 becomes atmospheric pressure, and the inside of the vacuum substrate transport module 11 becomes a pressure lower than the atmospheric pressure. Therefore, a force is applied to the gate G2 in the direction from the inside of the load lock module 20 to the inside of the vacuum substrate transport module 11. Figure 13

[0127] However, in the present embodiment, the movement of the gate G2 in the direction from the inside of the load lock module 20 to the inside of the vacuum substrate transport module 11 is restricted by the upper portion of the load lock module 20. Therefore, it is not necessary to continuously apply a force to the gate G2 by the drive section 24 to pull the gate G2 downward when the transport of the substrate W is performed between the atmospheric substrate transport module 17 and the load lock module 20, and the power saving of the drive section 24 can be achieved.

[0128] On the other hand, in the case of making the load lock module 20 communicate with the vacuum substrate transport module 11, the gate G2 is retracted to the inner side of the first container 210, for example, as shown in FIG. 10. Then, the door structure 22 is raised by the drive section 24, and the substrate W is taken out from the lift pins 222 by the transport robot 110 in the vacuum substrate transport module 11. Figure 14

[0129] [Other]

[0130] Further, the technology disclosed in the present application is not limited to the above-described embodiments, and various modifications can be made within the scope of the gist thereof.

[0131] For example, in each of the above-described embodiments, the load lock module 20 is provided on the lower surface of the vacuum substrate transport module 11, but the technology disclosed is not limited thereto. As another mode, for example, as shown in FIG. 11, the load lock module 20 can be provided on the upper surface of the vacuum substrate transport module 11. Figure 15 Figure 15 is a cross-sectional view showing another mode of the substrate processing system 1. In the substrate processing system 1 shown in Figure 15

[0132] Figure 16 is a perspective view showing one example of the substrate holding portion 223. Each substrate holding portion 223 holds the substrate W at the key-shaped front end. In Figure 16 ​​​​In the example shown in FIG. 1, the substrate W is supported by four substrate holding portions 223, but the number of substrate holding portions 223 supporting the substrate W can be three or more than five.

[0133] In the case of transporting the substrate W between the load lock module 20 and the vacuum substrate transport module 11, for example, as shown in FIG. 2, the door structure 22 is lowered. By this, the gate G2 and the substrate W are lowered, and the vacuum substrate transport module 11 is communicated with the load lock module 20. Then, the substrate W is taken out from the substrate holding portion 223 with the transport robot 110 in the vacuum substrate transport module 11, and the substrate W is placed on the substrate holding portion 223 with the transport robot 110. Figure 17

[0134] Further, in each of the above embodiments, two load lock modules 20 are provided on the lower surface of the vacuum substrate transport module 11, but the disclosed technology is not limited to this. As another mode, at least one load lock module 20 can be provided on each of the upper surface and the lower surface of the vacuum substrate transport module 11.

[0135] Further, in each of the above embodiments, the door support portion 221 and the lift pin 222 are lifted and lowered together by the drive portion 24, but the disclosed technology is not limited to this. The door support portion 221 and the lift pin 222 can be fixed to different base portions 220, and each of the base portions 220 is lifted and lowered independently by a different drive portion 24. By this, in the case where the temperature adjustment portion is provided in the load lock module 20, the substrate W can be lifted and lowered independently of the opening and closing of the gate G2.

[0136] Further, in each of the above embodiments, the vacuum substrate transport module 11, the atmospheric substrate transport module 17, and the load lock module 20 transport the substrate W, but the disclosed technology is not limited to this. As another mode, the vacuum substrate transport module 11, the atmospheric substrate transport module 17, and the load lock module 20 can transport an edge ring in addition to the substrate W. In each of the substrate processing modules 12, a placement table on which the substrate W is placed is provided, and an edge ring is provided on the placement table in a manner of surrounding the substrate W. The edge ring is consumed due to the processing of the substrate W such as etching, and is replaced at a predetermined timing.

[0137] Further, it should be understood that the embodiments disclosed herein are illustrative in all respects, rather than restrictive. Indeed, the embodiments described herein can be embodied in a multitude of ways as defined by the broadest permissible scope of the appended claims. Furthermore, the embodiments described herein can be implemented in various ways, for example, by way of hardware, software or a combination thereof. Additionally, any of the features described herein can be implemented in any combination or sub-combination.​

Claims

1. A substrate transport system, characterized by, including: an atmospheric substrate transport module; a vacuum substrate transport module; and a load lock module disposed on a side of the atmospheric substrate transport module and on a lower surface of the vacuum substrate transport module, the load lock module including: a container having a first substrate transport port formed on a side of the container to communicate an interior of the container with the atmospheric substrate transport module and a second substrate transport port formed on an upper surface of the container to communicate the interior of the container with the vacuum substrate transport module; a first door openable and closable to the first substrate transport port; a second door openable and closable to the second substrate transport port; a substrate lift mechanism configured to lift a substrate between a first position within the container and a second position within the vacuum substrate transport module via the second substrate transport port, the first position being at a same height as the first substrate transport port, and the second position being at a higher position than the first position; and a door lift mechanism configured to lift the second door between a closed position in which the second substrate transport port is closed from above by the second door and an open position at a higher position than the second position independently of lifting of the substrate by the substrate lift mechanism.

2. The substrate transport system according to claim 1, wherein: the atmospheric substrate transport module has a first transport robot, the first transport robot is configured to transport a substrate between the first position and a load port connected to the atmospheric substrate transport module via the first substrate transport port.

3. The substrate transport system according to claim 1 or 2, wherein: the vacuum substrate transport module has a second transport robot, the second transport robot is configured to transport a substrate between the second position and a substrate processing module connected to the vacuum substrate transport module.

4. The substrate transport system according to claim 1 or 2, wherein: the substrate lift mechanism has: a plurality of lift pins configured to support a substrate; and a drive section configured to lift the plurality of lift pins. including: a container having a first substrate transport port formed on a side of the container to communicate an interior of the container with an atmospheric substrate transport module and a second substrate transport port formed on an upper surface of the container to communicate the interior of the container with a vacuum substrate transport module; 5. A load lock module, characterized by, a first door openable and closable to the first substrate transport port; a second door openable and closable to the second substrate transport port; a substrate lift mechanism configured to lift a substrate between a first position within the container and a second position within the vacuum substrate transport module via the second substrate transport port, the first position being at a same height as the first substrate transport port, and the second position being at a higher position than the first position; and a door lift mechanism configured to lift the second door between a closed position in which the second substrate transport port is closed from above by the second door and an open position at a higher position than the second position independently of lifting of the substrate by the substrate lift mechanism. ​ A door lifting mechanism configured to independently lift the second door between a closed position in which the second substrate transport port is closed from above by the second door and an open position that is higher than the second position, with respect to lifting of a substrate by the substrate lifting mechanism.

6. The load lock module of claim 5, wherein: the substrate lifting mechanism has: a plurality of lift pins configured to support a substrate; and a drive portion configured to lift the plurality of lift pins. ​

Images