An antenna with improved low-frequency bandwidth

Abstract

The present invention relates to the field of antennas, and more particularly to an antenna with improved low-frequency bandwidth. The antenna comprises a dielectric substrate and a conductive layer attached to the dielectric substrate, the conductive layer comprising a first conductive geometric structure, a connecting portion, and a switch point, the switch point being connected to the first conductive geometric structure via the connecting portion, and a slot being formed between the switch point and the connecting portion and the first conductive geometric structure. The antenna with improved low-frequency bandwidth of the present invention improves the low-frequency performance of the antenna after the switch inductor is switched, thereby improving the low-frequency bandwidth. After the switch is switched, the low-frequency efficiency is almost non-loss, whereas the low-frequency efficiency of conventional antennas is severely lost after the switch point is switched, with the performance degradation exceeding 3dB.

Description

Technical Field

[0001] The present invention relates to the field of antennas, and in particular to an antenna with improved low-frequency bandwidth. Background Art

[0002] Antennas are commonly found in most modern wireless devices, such as mobile computers, mobile phones, tablet computers, smartphones, etc.

[0003] A prior art LOOP antenna for improving low-frequency bandwidth includes a continuous wire coil formed by shaped routing to form a LOOP antenna, a signal feed point and a ground feed point respectively disposed at both ends of the wire coil. The wire coil includes a square three-sided structure formed around the signal feed point, a rectangular loop structure connected to the square three-sided structure by a hypotenuse, a first extension branch extending from one side of the rectangular loop structure toward the signal feed point, a second extension branch extending vertically upward at the bottom end of the square three-sided structure, the end of the second extension branch being disposed at the signal feed point, a ground feed point disposed at the end of the first extension branch and flush with the signal feed point, and a gap formed between the first extension branch and the rectangular loop structure. However, the structure used in this technical solution to improve low-frequency bandwidth is relatively complex. Summary of the Invention

[0004] The embodiments of the present invention provide an antenna with improved low-frequency bandwidth, so as to at least solve the technical problem that the existing antennas with improved low-frequency bandwidth have a relatively complex structure.

[0005] According to an embodiment of the present invention, an antenna with improved low-frequency bandwidth is provided. The antenna includes a dielectric substrate and a conductive layer attached to the dielectric substrate. The conductive layer includes a first conductive geometric structure, a connecting portion, and a switch point. The switch point is connected to the first conductive geometric structure via the connecting portion, and a slot is formed between the switch point and the connecting portion and the first conductive geometric structure.

[0006] Furthermore, the length of the slot is greater than 5 mm.

[0007] Furthermore, the width of the slot is 0-2 mm.

[0008] Furthermore, the width of the slot is 1 mm.

[0009] Furthermore, the direction of the slots is parallel to the overall direction of the conductive geometric structure.

[0010] Furthermore, the antenna includes a main antenna, the first conductive geometric structure, the connecting portion and the switch point constitute a conductive layer of the main antenna, and the main antenna is applied in a frequency band of 700-1000 MHz.

[0011] Furthermore, the conductive geometric structure is a Cu layer.

[0012] Furthermore, the switching point is the NI AU layer.

[0013] Furthermore, the antenna further includes a parasitic line, the conductive layer of the parasitic line includes a second geometric conductive structure and a parasitic point arranged on the second geometric conductive structure, and the first geometric conductive structure and the second conductive geometric structure are arranged at intervals.

[0014] Furthermore, the conductive layer of the main antenna and the conductive layer of the parasitic line are manufactured at one time by using a TDP pad printing process or a TDP printing process.

[0015] The antenna with improved low-frequency bandwidth in the embodiments of the present invention improves the antenna's low-frequency performance and low-frequency bandwidth after switching the inductor. After switching, low-frequency efficiency is almost negligible, whereas conventional antennas experience significant low-frequency efficiency loss after switching the switch point, with performance degradation exceeding 3dB. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0017] Figure 1 A schematic diagram of the structure of an antenna for improving low-frequency bandwidth according to the present invention;

[0018] Figure 2 The application principle diagram of the antenna for improving low-frequency bandwidth of the present invention;

[0019] Figure 3 Produced using pad printing technology Figure 1 Flowchart of the antenna shown;

[0020] Figure 4 Produced using inkjet printing technology Figure 1 Flowchart of the antenna shown;

[0021] The figures are marked as follows: 1. first conductive geometric structure; 2. switching point; 3. connecting part; 4. slot; 5. slot hole; 6. feeding point; 7. through slot; 8. parasitic line; 9. parasitic point. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0023] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0024] Example 1

[0025] According to an embodiment of the present invention, an antenna with improved low frequency bandwidth is provided. Figure 1 , including: a dielectric substrate (not shown), a conductive layer attached to the dielectric substrate, the conductive layer including a first conductive geometric structure 1, a connecting portion 3 and a switch point 2, the switch point 2 is connected to the first conductive geometric structure 1 through the connecting portion 3, and a slot 4 is formed between the switch point 2 and the connecting portion 3 and the first conductive geometric structure 1.

[0026] The antenna with improved low-frequency bandwidth in the embodiment of the present invention improves the antenna's low-frequency performance and low-frequency bandwidth after switching the inductor. After switching, low-frequency efficiency is almost negligible, whereas conventional antennas experience significant low-frequency efficiency loss after switching at switch point 2, with performance degradation exceeding 3dB.

[0027] Preferably, the length of the slot 4 is greater than 5 mm.

[0028] Preferably, the width of the slot 4 is 0-2 mm.

[0029] Preferably, the width of the slot 4 is 1 mm.

[0030] Preferably, the direction of the slots 4 is parallel to the overall direction of the first conductive geometric structure 1 .

[0031] Preferably, the antenna includes a main antenna, the first conductive geometric structure 1, the connecting portion 3 and the switch point 2 constitute a conductive layer of the main antenna, and the main antenna is used in a frequency band of 700-1000 MHz.

[0032] Preferably, the first conductive geometric structure 1 is a Cu layer.

[0033] Preferably, the switching point 2 is the NI AU layer.

[0034] Preferably, the antenna further includes a parasitic line 8, the conductive layer of the parasitic line 8 includes a second geometric conductive structure and a parasitic point 9 arranged on the second geometric conductive structure, and the first geometric conductive structure 1 and the second conductive geometric structure are spaced apart.

[0035] Preferably, four slots 5 are provided on the first conductive geometric structure 1 , wherein one slot 5 is opened, a feeding point 6 is provided on the first conductive geometric structure 1 next to another slot 5 , and the two slots 5 are connected via a through slot 7 .

[0036] Preferably, the conductive layer of the main antenna and the conductive layer of the parasitic line 8 are manufactured at one time by using a TDP pad printing process or a TDP printing process.

[0037] The antenna for improving low frequency bandwidth in the embodiment of the present invention is described in detail in Figure 2 , which can significantly improve the low-frequency performance of the antenna after the switch is open to switch inductor L1 or inductor L2, and increase the low-frequency bandwidth. See the table below for details:

[0038]

[0039] The technical solution of the present invention has almost no loss in low-frequency efficiency after the switch is switched; while the conventional antenna switch point has serious loss in low-frequency efficiency after switching, with the performance degradation exceeding 3dB.

[0040] Preferably, the antenna can be manufactured using a TDP pad printing process or a TDP printing process. For details on the TDP pad printing process or the TDP printing process, please refer to Example 2. Using the TDP pad printing process or the TDP printing process, the conductive layer of the main antenna and the conductive layer of the parasitic line 8 can be manufactured simultaneously. The dielectric substrate can be a ceramic, plastic, or glass substrate for electronic products.

[0041] Example 2

[0042] According to an embodiment of the present invention, a method for preparing an antenna with improved low-frequency bandwidth is provided to prepare the antenna described in Example 1. The method includes a pad printing process and a spray printing process.

[0043] Figure 3 A method for preparing an antenna using a TDP (Three Dimensional Printing, 3D printing) pad printing process is shown, comprising the following steps:

[0044] S10, performing plasma treatment on the carrier to obtain an antenna carrier.

[0045] S20, providing an intermediate mold for making an antenna pattern, and spraying a conductive silver paste on the intermediate mold to fill the antenna pattern of the intermediate mold.

[0046] S30, using a transfer head to transfer the conductive silver paste filled in the antenna pattern to the surface of the antenna carrier after plasma treatment to form a transfer layer, thereby obtaining an intermediate.

[0047] S40, baking and solidifying the intermediate to obtain a crude product.

[0048] S50, performing laser engraving on the pad printing layer of the rough product to perform size repair to obtain an antenna.

[0049] The above-mentioned method of preparing antennas using TDP pad printing process can effectively clean and activate the surface of the carrier by subjecting the carrier to plasma treatment, and then print the conductive silver paste onto the antenna pattern of the intermediate mold by spray printing on the intermediate mold, and use a transfer head to transfer the conductive silver paste filled in the antenna pattern to the surface of the antenna carrier after plasma treatment to form a pad layer. Compared with the traditional LDS process for manufacturing antennas, the TDP pad printing process has a wider range of choices for antenna carriers and no special restrictions. Antennas can be made directly on backplanes such as glass, ceramics, and plastics, saving 20% of space. The pad printing layer has strong adhesion, high intelligence, and simple process, so the cost is reduced and the sample cycle is shorter; further, since it replaces traditional chemical plating and does not produce sewage, it is environmentally friendly; at the same time, the conductive silver paste has a stable resistivity and can meet the RF power consumption requirements of 5G mobile communications; and, through laser engraving, high-precision dimensional production can be achieved with an accuracy of ±0.03mm, which can meet the performance requirements of new antennas. In addition, in 5G mobile communication applications, since Sub-6G (5G operating frequency band) adopts MIMO (Multi Input Multi Output) technology, mobile terminals such as mobile phones are equipped with multiple Sub-6G antennas. Compared with traditional FPC antennas that can only be assembled one at a time, the TDP pad printing process can form all antennas at once, ensuring assembly consistency, reducing assembly time and saving costs.

[0050] In one embodiment, in step S10, the carrier is subjected to plasma treatment. Plasma treatment involves plasma ionization of the carrier surface. Specifically, a set of electrodes is applied with an internal radio frequency voltage, forming a high-frequency alternating electric field between the electrodes. Gas within this alternating electric field is agitated to form plasma. The active plasma physically bombards and chemically reacts with the cleaning product. Particles and gaseous substances formed on the carrier surface are then removed by vacuuming to achieve the cleaning purpose. During the plasma treatment, the carrier is placed in a vacuum chamber at a treatment temperature of 200°C and an argon gas flow rate of 60 cm³ / min.

[0051] By performing plasma treatment on the carrier, the surface of the carrier can be cleaned and activated, so that the sprayed layer can be firmly bonded to the surface of the carrier.

[0052] In one embodiment, the conductive silver paste includes silver powder and a thermoplastic resin. The silver powder is ultrafine silver powder, and the particle size is usually less than 100nm. The thermoplastic resin can be an organic adhesive such as bisphenol A epoxy resin. The conductive silver paste formed by uniformly blending the ultrafine silver powder and the thermoplastic resin has the characteristic of being curable at low temperature (90-130°). The conductive silver paste can act as a conductor and a resistor when pad printed on a carrier. The pad printing film thickness is 6-12μm, which greatly reduces the cost of consumables. After curing, it also has good conductivity (conductivity is less than 1Ω), printing linearity, strong adhesion (adhesion is greater than 4B), and good scratch resistance (using a 1cm*1cm steel wool to apply 150g pressure and wipe 100 times in a cycle without exposing the bottom).

[0053] In one embodiment, in S20, the intermediate mold may be made of a steel plate, and the antenna pattern is made on the intermediate mold, that is, the antenna pattern having a concave structure is carved according to the shape of the antenna.

[0054] During the printing process of the conductive silver paste onto the intermediate mold, the atomized conductive silver paste is sprayed onto the intermediate mold along a predetermined path. The conductive silver paste is atomized by the internal structure of the fluid-air atomizing nozzle, which evenly mixes the liquid silver paste and gas to produce fine droplets—a spray. This can usually be achieved by increasing the gas pressure or decreasing the liquid pressure to create even finer droplets. The atomizing nozzle then applies the spray to the surface of the product to be coated, forming a layer of silver paste.

[0055] A multi-axis robot drives the atomizing nozzle to spray the atomized silver paste onto the intermediate mold. This printing process allows for the application of silver paste to irregular shapes, corners, via locations, and surfaces with uneven surfaces. Compared to the traditional LDS process, which limits antenna vias to a thickness of 0.5mm to 1mm and a conical shape, antenna vias produced using the TDP transfer process are not limited to conical shapes and have a wider thickness range of 0.5mm to 5mm. This reduces manufacturing complexity, enhances product via design capabilities, and improves product yield and production efficiency.

[0056] Step S10 and step S20 may be performed simultaneously, or step S10 may be performed first and step S20 may be performed later.

[0057] In one embodiment, in the step of baking and curing the antenna intermediate in S40, far infrared rays are used for baking and curing. Baking and curing with far infrared rays can effectively shorten the curing time and improve the efficiency.

[0058] Furthermore, in the operation of baking and curing with far infrared rays, the temperature is raised to 100° C.-120° C., and then baked for 4 min-5 min at a power of 20 kW-25 kW and a temperature of 100° C.-120° C.

[0059] Furthermore, the heating rate is 3°C / min-5°C / min.

[0060] In one embodiment, in S50, the step of laser engraving the pad printing layer of the rough product to perform dimensional repair includes the following steps:

[0061] Detect the dimensions of the pad printing layer;

[0062] Laser engraving is used to trim the outer dimensions of the pad printing layer to a preset thickness.

[0063] Laser engraving utilizes 3D CNC technology, using lasers as the processing medium. On products requiring dimensional refinement, excess material is instantly melted and vaporized under laser irradiation, achieving dimensional correction. Laser precision machining offers high precision, capable of improving product dimensions to 0.05mm-0.03mm. Antennas manufactured using other processes can achieve dimensional accuracy greater than 0.1mm. In one embodiment, the laser wavelength is 1064nm.

[0064] In one embodiment, the material of the carrier is ceramic, glass or plastic. It can be seen that the method of forming the pad printing layer on the surface of the carrier by pad printing has no special requirements for the carrier and is relatively low in cost.

[0065] Furthermore, the plastic includes at least one of polycarbonate, acrylonitrile-butadiene-styrene and polyimide.

[0066] Preferably, all the above steps are performed in a vacuum chamber.

[0067] remove Figure 3 In addition to the pad printing process shown, Figure 4 A method for preparing an antenna using a TDP (Three Dimensional Printing, 3D printing) printing process is also shown, comprising the following steps:

[0068] S10′, subjecting the carrier to plasma treatment to obtain an antenna carrier.

[0069] S20′, spray-printing a conductive silver paste on the surface of the antenna carrier to form a spray-printed layer on the surface of the antenna carrier to obtain an intermediate.

[0070] S30′, baking and solidifying the intermediate to obtain a crude product.

[0071] S40′, performing laser engraving on the printing layer of the rough product to perform size repair, thereby obtaining an antenna.

[0072] The above-mentioned method of preparing antennas using TDP printing process can effectively clean and activate the surface of the carrier by subjecting the carrier to plasma treatment, and then spray-print the conductive silver paste onto the surface of the antenna carrier by the spray printing method to form a spray-printed layer. Compared with the traditional LDS process for manufacturing antennas, the TDP printing process has a wider range of choices for antenna carriers and no special restrictions. Antennas can be made directly on back panels such as glass, ceramics, and plastics, saving 20% of space. The spray-printed layer has strong adhesion, high intelligence, and simple process. Therefore, the cost is reduced and the sample cycle is shorter. Furthermore, since it replaces traditional chemical plating and does not produce sewage, it is environmentally friendly. At the same time, the conductive silver paste has a stable resistivity and can meet the RF power consumption requirements of 5G mobile communications. In addition, high-precision size production can be achieved through laser engraving, with an accuracy of ±0.03mm, which can meet the performance requirements of new antennas. In addition, in 5G mobile communication applications, since Sub-6G (5G operating frequency band) adopts MIMO (Multi Input Multi Output) technology, mobile terminals such as mobile phones are equipped with multiple Sub-6G antennas. Compared with traditional FPC antennas that can only be assembled one at a time, the TDP printing process can form all antennas at one time, ensuring assembly consistency, reducing assembly time and saving costs.

[0073] In one embodiment, in step S10′, the carrier is subjected to a plasma treatment. Plasma treatment involves plasma ionization of the carrier surface. Specifically, a set of electrodes is applied with an internal radio frequency voltage, forming a high-frequency alternating electric field between the electrodes. Gas within this alternating electric field is agitated to form a plasma. The active plasma acts both physically and chemically on the cleaning product. Particles and gaseous substances formed on the carrier surface are then removed by vacuuming to achieve the cleaning purpose. During the plasma treatment, the carrier is placed in a vacuum chamber at a treatment temperature of 200°C and an argon gas flow rate of 60 cm³ / min.

[0074] By performing plasma treatment on the carrier, the surface of the carrier can be cleaned and activated, so that the sprayed layer can be firmly bonded to the surface of the carrier.

[0075] In one embodiment, the conductive silver paste includes silver powder and a thermoplastic resin. Among them, the silver powder is ultrafine silver powder, and the particle size is usually less than 100nm. The thermoplastic resin can be an organic adhesive such as bisphenol A epoxy resin. The conductive silver paste formed by uniformly blending the ultrafine silver powder and the thermoplastic resin has the characteristic of being curable at low temperature (90-130°). The conductive silver paste printed on the carrier can play the role of a conductor and a resistor. The printed film thickness is 6-12μm, which greatly reduces the cost of consumables. After curing, it also has good conductivity (conductivity is less than 1Ω), printing linearity, strong adhesion (adhesion is greater than 4B), and good scratch resistance (using a 1cm*1cm steel ball to apply 150g pressure, and wiping 100 times in a cycle without exposing the bottom).

[0076] In one embodiment, in the step of printing the conductive silver paste on the surface of the antenna carrier in S20′, atomized conductive silver paste is sprayed onto the antenna carrier along a predetermined path. The conductive silver paste is atomized by uniformly mixing the liquid silver paste and gas through the internal structure of the fluid-air atomizing nozzle to produce fine droplets—a spray. Typically, finer liquid droplets can be obtained by increasing the gas pressure or decreasing the liquid pressure. The atomizing nozzle sprays the spray onto the surface of the product to be coated, forming a layer of silver paste coating.

[0077] A multi-axis robot drives the atomizing nozzle to spray the atomized silver paste onto the antenna carrier. This printing process allows for the application of silver paste to irregular shapes, corners, via locations, and surfaces with uneven surfaces. Compared to the traditional LDS process, which limits antenna vias to a thickness of 0.5mm to 1mm and a conical shape, antenna vias produced using the TDP printing process are not limited to conical shapes and have a wider thickness range of 0.5mm to 5mm. This reduces manufacturing complexity, enhances product via design capabilities, and improves product yield and production efficiency.

[0078] In one embodiment, in the step of baking and curing the antenna intermediate in S30', far infrared rays are used for baking and curing. Baking and curing with far infrared rays can effectively shorten the curing time and improve the efficiency.

[0079] Furthermore, in the operation of baking and curing with far infrared rays, the temperature is raised to 100° C.-120° C., and then baked for 4 min-5 min at a power of 20 kW-25 kW and a temperature of 100° C.-120° C.

[0080] Furthermore, the heating rate is 3°C / min-5°C / min.

[0081] In one embodiment, in S40′, the step of laser engraving the printed layer of the rough product to perform dimensional repair includes the following steps:

[0082] Detect the external dimensions of the printed layer;

[0083] Laser engraving is used to trim the outer dimensions of the printed layer to a preset thickness.

[0084] Laser engraving utilizes 3D CNC technology, using lasers as the processing medium. On products requiring dimensional refinement, excess material is instantly melted and vaporized under laser irradiation, achieving dimensional correction. Laser precision machining offers high precision, capable of improving product dimensions to 0.05mm-0.03mm. Antennas manufactured using other processes can achieve dimensional accuracy greater than 0.1mm. In one embodiment, the laser wavelength is 1064nm.

[0085] In one embodiment, the material of the carrier is ceramic, glass or plastic. It can be seen that the method of forming the printing layer on the surface of the carrier by printing has no special requirements for the carrier and is relatively low in cost.

[0086] Furthermore, the plastic includes at least one of polycarbonate, acrylonitrile-butadiene-styrene and polyimide.

[0087] The serial numbers of the above embodiments of the present invention are for description only and do not represent the advantages or disadvantages of the embodiments.

[0088] In the above embodiments of the present invention, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0089] In the several embodiments provided by the present invention, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the system embodiments described above are merely illustrative. For example, the division of units can be a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, and can be electrical or other forms.

[0090] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple units. Some or all of the units may be selected to achieve the purpose of the present embodiment according to actual needs.

[0091] In addition, the functional units in the various embodiments of the present invention may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0092] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server or network device, etc.) to execute all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk, etc. Various media that can store program codes.

[0093] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An antenna for improving low-frequency bandwidth, characterized in that: The antenna includes a dielectric substrate and a conductive layer attached to the dielectric substrate. The conductive layer includes a first conductive geometric structure, a connecting portion, and a switch point. The switch point is connected to the first conductive geometric structure via the connecting portion. A slot is formed between the switch point and the connecting portion and the first conductive geometric structure. The first conductive geometric structure is provided with four slots, one of which has an opening. A feed point is provided on the first conductive geometric structure adjacent to another slot, and the two slots are connected by a through slot.

2. The antenna with improved low-frequency bandwidth according to claim 1, wherein: The length of the slot is greater than 5 mm.

3. The antenna with improved low-frequency bandwidth according to claim 1, wherein: The width of the slot is 0-2 mm.

4. The antenna with improved low-frequency bandwidth according to claim 3, wherein: The width of the slot is 1 mm.

5. The antenna with improved low-frequency bandwidth according to claim 1, wherein: The direction of the slots is parallel to the overall direction of the conductive geometric structure.

6. The antenna with improved low-frequency bandwidth according to claim 1, wherein: The antenna includes a main antenna, the first conductive geometric structure, the connecting portion and the switch point constitute a conductive layer of the main antenna, and the main antenna is used in a frequency band of 700-1000 MHz.

7. The antenna with improved low-frequency bandwidth according to claim 1, wherein: The conductive geometric structure is a Cu layer.

8. The antenna with improved low-frequency bandwidth according to claim 1, wherein: The switching point is the NI-AU layer.

9. The antenna with improved low-frequency bandwidth according to claim 8, characterized in that: The antenna further includes a parasitic line, the conductive layer of the parasitic line includes a second geometric conductive structure and a parasitic point arranged on the second geometric conductive structure, and the first conductive geometric structure and the second geometric conductive structure are spaced apart.

10. The antenna with improved low-frequency bandwidth according to claim 9, characterized in that: The conductive layer of the main antenna and the conductive layer of the parasitic line are manufactured at one time by using a TDP pad printing process or a TDP printing process.

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