Conductive particle ball, conductive glue and display device

Abstract

The embodiments of the present disclosure provide a conductive particle ball, a conductive adhesive and a display device. The conductive particle ball comprises: a metal core; a conductive layer covering the metal core; and a metal material layer covering the conductive layer; wherein the material of the metal core is a first metal, and the first metal is configured to conduct electrons to the metal material layer through the conductive layer when the metal material layer loses electrons. The technical solution of the present disclosure can avoid ionization of the conductive particle ball, avoid electrochemical corrosion, and improve product quality.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a conductive particle ball, a conductive glue and a display device. Background Art

[0002] Anisotropic Conductive Films (ACF) are widely used in display devices. Anisotropic conductive adhesives are also often used in the connection process of electronic products to achieve electrical connection. As the space for the connection process of electronic products becomes smaller, electrochemical corrosion will occur between adjacent terminals with large voltage differences in high temperature and high humidity environments, causing the connection points connected by anisotropic conductive adhesives to fail. Summary of the invention

[0003] The embodiments of the present disclosure provide a conductive particle ball, a conductive adhesive and a display device to solve or alleviate one or more technical problems in the prior art.

[0004] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a conductive particle ball, comprising:

[0005] Metal core;

[0006] a conductive layer covering the metal core; and

[0007] A metal material layer covering the conductive layer;

[0008] The material of the metal core is a first metal, and the first metal is configured to conduct electrons to the metal material layer through the conductive layer when the metal material layer loses electrons.

[0009] In some possible implementations, the material of the first metal includes at least one of iron, manganese, chromium, aluminum, and magnesium.

[0010] In some possible implementations, the diameter of the metal core ranges from 0.4 μm to 0.8 μm.

[0011] In some possible implementations, the material of the conductive layer includes conductive epoxy resin.

[0012] In some possible implementations, the thickness of the conductive layer ranges from 0.9 μm to 1.3 μm.

[0013] In some possible implementations, the material of the metal material layer includes at least one of nickel and gold.

[0014] In some possible implementations, the thickness of the metal material layer ranges from 0.1 μm to 0.2 μm.

[0015] In some possible implementations, the conductive particle ball further includes a protective film covering the metal material layer, and the thickness of the protective film ranges from 0.02 μm to 0.03 μm.

[0016] As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a conductive adhesive, including an adhesive and the conductive particle balls in any embodiment of the present disclosure, wherein the conductive particle balls are distributed in the adhesive.

[0017] As a third aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a conductive glue, including an adhesive and conductive particle balls distributed in the adhesive. The conductive glue also includes metal particles distributed in the adhesive, and the metal particles are configured to replenish electrons to the conductive particle balls when the conductive particle balls lose electrons.

[0018] In some possible implementations, the material of the metal particles includes at least one of nickel, gold, iron, manganese, chromium, aluminum, and magnesium.

[0019] In some possible implementations, the conductive particle ball array is distributed in the adhesive, and the metal particles are regularly distributed around each conductive particle ball.

[0020] In some possible implementations, the diameter of the metal particles is less than 1 μm.

[0021] In some possible implementations, the distance between the metal particles and the conductive particle balls is greater than or equal to 3 μm.

[0022] As a fourth aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display device, comprising the conductive adhesive in any embodiment of the present disclosure.

[0023] According to the technical solution of the embodiment of the present disclosure, the first metal is configured to conduct electrons to the metal material layer through the conductive layer when the metal material layer loses electrons. Therefore, even in a high temperature and high humidity environment and a large voltage difference between adjacent terminals, the metal layer outside the conductive particle balls in the conductive glue can obtain replenished electrons in time to avoid atomic ionization and electrochemical corrosion, thereby avoiding connection failure in products connected with anisotropic conductive glue and improving product quality.

[0024] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0026] Figure 1 It is a schematic diagram of the structure of a conductive particle ball in one embodiment of the present disclosure;

[0027] Figure 2 This is a schematic diagram of the internal structure of the conductive adhesive in one embodiment of the present disclosure;

[0028] Figure 3 Schematic diagram of using conductive adhesive in a display device.

[0029] Description of reference numerals:

[0030] 10. Adhesive; 20. Conductive particle balls; 21. Metal core; 22. Conductive layer; 23. Metal material layer; 24. Protective film; 30. Metal particles; 300. Conductive adhesive; 100. First substrate; 200. Adhesive layer. DETAILED DESCRIPTION

[0031] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0032] The embodiment of the present disclosure provides a conductive adhesive, including an adhesive and conductive particle balls, wherein the conductive particle balls are distributed in the adhesive. Exemplarily, a plurality of conductive particle ball arrays are distributed in the adhesive.

[0033] Figure 1 FIG. 1 is a schematic diagram of the structure of a conductive particle ball in an embodiment of the present disclosure. Figure 1 As shown, the conductive particle ball is applied to the conductive glue, and the conductive particle ball 20 includes a metal core 21, a conductive layer 22, a metal material layer 23 and a protective film 24. The conductive layer 22 covers the metal core 21, the metal material layer 23 covers the conductive layer 22, and the protective film 24 covers the metal material layer. Among them, the material of the metal core 21 is a first metal. The first metal is configured to conduct electrons to the metal material layer 23 through the conductive layer 22 when the metal material layer 23 loses electrons.

[0034] It should be noted that the anisotropic conductive adhesive in the related technology, when in a high temperature and high humidity environment and when there is a large pressure difference between adjacent terminals, will form an environment similar to an electrolyte due to the invasion of water vapor, causing the conductive particle balls therein to be easily corroded, resulting in electron loss and atomic ionization, causing failure of the product connection.

[0035] The conductive particle balls of the disclosed embodiment are applied to conductive glue, and the metal core 21 of the first metal material is configured to conduct electrons to the metal material layer 23 through the conductive layer 22 when the metal material layer 23 loses electrons. Thus, even in a high temperature and high humidity environment and a large voltage difference between adjacent terminals, the outer metal layer of the conductive particle balls in the conductive glue can obtain replenished electrons in time, avoiding atomic ionization and electrochemical corrosion, thereby avoiding connection failure of products connected by anisotropic conductive glue and improving product quality.

[0036] In the case of the metal material layer 23 losing electrons, the metal core 21 of the first metal material can conduct its own metal material electrons to the metal material layer 23 through the conductive layer 22, replenishing the lost electrons of the metal material layer 23, preventing the atomic ionization of the conductive particle ball 20, and thus avoiding electrochemical corrosion. In addition, the metal core 21 can play a supporting role in the bonding process of the product, preventing the conductive particle ball from being crushed and avoiding bonding failure.

[0037] The conductive particle ball in the embodiment of the present disclosure no longer needs to use precious metals such as gold (Au) on its outer side to prevent electrochemical corrosion, thereby reducing the cost of the conductive particle ball.

[0038] In one embodiment, the diameter of the conductive particle ball 20 may range from 3 μm to 3.4 μm (including the end value). Exemplarily, the diameter of the conductive particle ball 20 may be any value between 3 μm and 3.4 μm. For example, the diameter of the conductive particle ball 20 may be one of 3.1 μm, 3.2 μm, 3.3 μm, and 3.4 μm.

[0039] In one embodiment, the material of the first metal may be a metal with higher chemical activity than nickel and better monomer stability. For example, the material of the first metal may include at least one of iron, manganese, chromium, aluminum, magnesium and the like.

[0040] In one embodiment, the diameter of the metal core 21 ranges from 0.4 μm to 0.8 μm (including endpoint values). Exemplarily, the diameter of the metal core 21 can be any value from 0.4 μm to 0.8 μm. For example, the diameter of the metal core 21 can be one of 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, and 0.8 μm. The error range of the diameter of the metal core 21 can be -0.06 μm to +0.06 μm. In one embodiment, the diameter of the metal core 21 is (0.6 ± 0.06) μm.

[0041] In one embodiment, the material of the conductive layer 22 may include conductive epoxy resin or metal. For example, the conductive layer 22 may be a conductive polymer material formed by compounding epoxy resin and conductive distribution material, such as a composite material of epoxy resin and carbon black. Such a conductive layer has elasticity and good conductivity, and can conduct electrons of the metal core 21 of the conductive particle ball 20 to the metal material layer 23, replenishing the electrons lost by the metal material layer 23.

[0042] In one embodiment, the thickness of the conductive layer 22 may range from 0.9 μm to 1.3 μm (including the endpoint values). Exemplarily, the thickness of the conductive layer 22 may be any value from 0.9 μm to 1.3 μm. For example, the thickness of the conductive layer 22 may be one of 0.9 μm, 1.0 μm, 1.15 μm, 1.2 μm, and 1.3 μm. The thickness of the conductive layer 22 may have an error range of -0.12 μm to +0.12 μm. In one embodiment, the diameter of the conductive layer 22 is (1.15 ± 0.12) μm.

[0043] In one embodiment, the material of the metal material layer 23 may be a second metal having lower activity than the first metal. For example, the material of the metal material layer 23 may include at least one of nickel and gold.

[0044] In one embodiment, the thickness of the metal material layer 23 may range from 0.1 μm to 0.2 μm (including endpoint values). Exemplarily, the thickness of the metal material layer 23 may be any value from 0.1 μm to 0.2 μm. For example, the thickness of the metal material layer 23 may be one of 0.1 μm, 0.15 μm, and 0.2 μm. The error range of the thickness of the metal material layer 23 may be -0.015 μm to +0.015 μm. In one embodiment, the thickness of the metal material layer 23 may be (0.15±0.015) μm.

[0045] In one embodiment, the material of the protective film 24 may be resin glue, and the thickness of the protective film 24 may range from 0.02 μm to 0.03 μm (including the end value).

[0046] The preparation method of the conductive particle ball may include: forming a conductive layer 22 covering the metal core 21 on the outer surface of the metal core 21; forming a metal material layer 23 covering the conductive layer 22 on the outer surface of the conductive layer 22; and forming a protective film 24 covering the metal material layer 23 on the outer surface of the metal material layer 23. The conductive layer 22 is made of conductive epoxy resin to explain the preparation process of the conductive particle ball in detail.

[0047] In one embodiment, forming a conductive layer 22 covering the metal core 21 on the outer surface of the metal core 21 to form a composite microsphere may include: coating a conductive epoxy resin film on the outer surface of the metal core 21, and curing the conductive epoxy resin film to form a conductive layer 22 covering the metal core 21. It is understood that the method for forming the conductive layer 22 is not limited to the above, and the conductive layer 22 may be formed by conventional methods in the art.

[0048] In one embodiment, forming a metal material layer 23 covering the conductive layer 22 on the outer surface of the conductive layer 22 may include placing the formed composite microspheres in a solution formed by a second metal material, and forming the metal material layer 23 on the surface of the conductive layer 22 through electrochemical action. It is understood that the method for forming the metal material layer 23 is not limited to the above, and the metal material layer 23 may be formed by conventional methods in the art.

[0049] In one embodiment, forming a protective film 24 covering the metal material layer 23 on the outer surface of the metal material layer 23 may include: coating a protective glue on the outer surface of the metal material layer 23, and curing the protective glue to form the protective film 24. It is understood that the method for forming the protective film 24 is not limited to the above, and the protective film 24 may be formed by conventional methods in the art.

[0050] Figure 2 Schematic diagram of the internal structure of the conductive adhesive in one embodiment of the present disclosure. Figure 2 As shown, the conductive adhesive includes an adhesive 10, conductive particle balls 20 and metal particles 30. The conductive particle balls 20 are distributed in the adhesive 10, and the metal particles 30 are distributed in the adhesive 10. The metal particles 30 are configured to supplement electrons to the conductive particle balls when the conductive particle balls lose electrons.

[0051] In the conductive adhesive of the disclosed embodiment, when the outer metal layer of the conductive particle ball 20 loses electrons, the metal particles 30 can replenish electrons to the conductive particle ball, thereby avoiding atomic ionization of the conductive particle ball and electrochemical corrosion, thereby avoiding connection failure of products connected by anisotropic conductive adhesive and improving product quality.

[0052] In one embodiment, the material of the metal particles 30 includes a third metal, and the third metal includes at least one of nickel, gold, iron, manganese, chromium, aluminum, and magnesium. Such metal particles 30 can not only replenish electrons to the conductive particle balls when the conductive particle balls lose electrons, but also have good conductivity. When the conductive particle balls fail, the metal particles 30 can be used as conductive substances in the conductive glue.

[0053] There is no limitation on the arrangement of the plurality of conductive particle balls 20 in the adhesive 10, as long as the plurality of conductive particle balls 20 are evenly distributed in the adhesive 10. There is no limitation on the arrangement of the plurality of metal particles 30 in the adhesive 10.

[0054] In one embodiment, the conductive particle balls 20 are arrayed in the adhesive 10, the metal particles 30 are regularly arranged around the conductive particle balls 20, and the distance between the metal particles 30 and the conductive particle balls 20 is greater than or equal to 3 μm. For example, multiple metal particles 30 are distributed between adjacent conductive particle balls 20.

[0055] In one embodiment, the diameter of the metal particles 30 is less than 1 μm. Thus, the metal particles 30 can not only supply positive charges in the conductive paste, but also prevent short circuit problems.

[0056] In one embodiment, the material of the metal particles can be an active metal, which is more active than nickel metal and has better monomer stability. The material of the metal particles can include at least one of iron, manganese, chromium, aluminum, magnesium, nickel, gold and other metals.

[0057] The method for preparing the conductive adhesive may include: coating the conductive adhesive with the conductive particle balls 20 distributed thereon on the surface of an object; injecting metal particles into the conductive adhesive so that the metal particles are distributed around the conductive particle balls.

[0058] In one embodiment, injecting metal particles into the conductive glue may include: controlling the movement of an object coated with the conductive glue, and using an injection device to gradually inject the metal particles into the conductive glue, so that the metal particles are distributed around the conductive particle ball.

[0059] In one embodiment, the conductive particle ball 20 may be the conductive particle ball 20 in the embodiment of the present disclosure. In other embodiments, the conductive particle ball 20 may be a conventional conductive particle ball in the art.

[0060] In one embodiment, the conductive particle ball can be suitable for anisotropic conductive adhesive or isotropic conductive adhesive.

[0061] Based on the inventive concept of the above-mentioned embodiment, the embodiment of the present disclosure further provides a display device, which uses the conductive adhesive in the embodiment of the present disclosure. The display device can be: a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or any other product or component with a display function.

[0062] Figure 3 Schematic diagram of using conductive adhesive in a display device. Before applying conductive adhesive 300 to the surface of the first substrate 100, an adhesive layer 200 can be applied to the surface of the first substrate 100, and then conductive adhesive 300 is applied, and a second substrate (not shown in the figure) is placed on the conductive adhesive 300, and the first substrate 100 and the second substrate are pressed together to achieve electrical connection between the terminals of the first substrate 100 and the corresponding terminals of the second substrate. It can be understood that a plurality of terminals are provided on the first substrate 100, and there is a step difference between the gap between adjacent terminals and the terminals. The adhesive layer 200 has good fluidity, which can make up for the gap between adjacent terminals of the first substrate 100 and the step difference between the terminals, so that the conductive adhesive 300 can be applied on a flat surface.

[0063] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0064] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0065] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0066] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0067] The disclosure above provides many different embodiments or examples to implement different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0068] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A conductive particle ball, characterized in that: include: Metal core; a conductive layer covering the metal core; as well as A metal material layer covering the conductive layer; Among them, the material of the metal core is a first metal, and the first metal is configured to conduct electrons to the metal material layer through the conductive layer when the metal material layer loses electrons; the material of the first metal includes at least one of iron, manganese, chromium, aluminum, and magnesium; the material of the conductive layer includes conductive epoxy resin; the material of the metal material layer includes at least one of nickel and gold.

2. The conductive particle ball according to claim 1, characterized in that: The diameter of the metal core ranges from 0.4 μm to 0.8 μm.

3. The conductive particle ball according to claim 1, characterized in that: The thickness of the conductive layer is in a range of 0.9 μm to 1.3 μm.

4. The conductive particle ball according to claim 1, characterized in that: The thickness of the metal material layer is in a range of 0.1 μm to 0.2 μm.

5. The conductive particle ball according to any one of claims 1 to 4, characterized in that: The conductive particle ball further includes a protective film covering the metal material layer, and the thickness of the protective film ranges from 0.02 μm to 0.03 μm.

6. A conductive adhesive, characterized in that: The method comprises an adhesive and the conductive particle balls according to any one of claims 1 to 5, wherein the conductive particle balls are distributed in the adhesive.

7. A conductive adhesive, characterized in that: It includes an adhesive and a conductive particle ball as described in any one of claims 1 to 6, wherein the conductive particle ball is distributed in the adhesive, and the conductive adhesive also includes metal particles distributed in the adhesive, and the metal particles are configured to replenish electrons to the conductive particle ball in the event that the conductive particle ball loses electrons.

8. The conductive adhesive according to claim 7, characterized in that: The material of the metal particles includes at least one of nickel, gold, iron, manganese, chromium, aluminum and magnesium.

9. The conductive adhesive according to claim 7, characterized in that: The conductive particle ball array is distributed in the adhesive, and the metal particles are regularly distributed around each of the conductive particle balls.

10. The conductive adhesive according to claim 7, characterized in that: The diameter of the metal particles is less than 1 μm.

11. The conductive adhesive according to claim 7, characterized in that: The distance between the metal particles and the conductive particle balls is greater than or equal to 3 μm.

12. A display device, characterized in that: The conductive adhesive comprises the conductive adhesive as claimed in any one of claims 6 to 11.

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