Display device

Abstract

A display device includes a display panel, a data driver that transmits a data voltage to the display panel, a first flexible printed circuit board attached to the display panel and including an input side wiring electrically connected to the data driver, a first printed circuit board (PCB) electrically connected to the input side wiring to transmit a high-speed driving signal to the data driver, and a metal tape overlapping the input side wiring in a plan view and attached on the first flexible printed circuit board, wherein a portion of the metal tape overlapping the input side wiring in the plan view defines an opening.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2020-0027044, filed on March 4, 2020, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure relates to display devices, and more particularly to driver chips for display devices and strips covering their peripheral wiring. Background Technology

[0004] Various types of display devices are used, and typically, the display device can be a liquid crystal display or an organic light-emitting device.

[0005] A liquid crystal display includes a backlight unit and is a display device that blocks or transmits light emitted from the backlight unit to display an image.

[0006] Organic light-emitting devices are display devices with self-emissive properties, and unlike liquid crystal displays, organic light-emitting devices do not require a separate light source.

[0007] Display devices are manufactured in a variety of sizes, with small displays being typical for mobile phones, and televisions and monitors being typical examples of large displays.

[0008] Large display devices are getting really big. The largest display device previously sold was 50 inches, but now displays over 70 inches are being sold, and there are even ultra-large displays of 100 inches on the market.

[0009] Such a display device is driven by a driver chip, which receives signals through high-speed signal wiring, converts the signals, and outputs the converted signals to the display panel. Summary of the Invention

[0010] An exemplary embodiment provides a display device for improving transmission performance by taking into account the impedance characteristics of signals transmitted to a driver chip.

[0011] A display device according to an exemplary embodiment includes: a display panel; a data driver that transmits data voltage to the display panel; a first flexible printed circuit board attached to the display panel and including input-side wiring electrically connected to the data driver; a first printed circuit board (“PCB”) electrically connected to the input-side wiring to transmit high-speed drive signals to the data driver; and a metal strip that overlaps with the input-side wiring in a plan view and is attached to the first flexible printed circuit board, wherein the portion of the metal strip that overlaps with the input-side wiring in the plan view defines an opening.

[0012] The opening may be defined in the wiring overlap portion of the metal strip that overlaps with the input-side wiring.

[0013] The overlapping portion of the wiring can extend from the data driver toward the input-side pad located at the end of the input-side wiring.

[0014] The metal strip may also include a heat dissipation section covering the data driver.

[0015] The metal strip may also include an adhesive portion that assists in attaching to the first flexible printed circuit board.

[0016] The width of the heat dissipation portion and the width of the adhesive portion may be different from each other.

[0017] The width of the heat dissipation portion and the width of the adhesive portion can be the same.

[0018] The metal strip may have a plate-like structure.

[0019] The openings can be multiple, and the wiring overlap portion can also include a linear structure disposed along the outer periphery of the wiring overlap portion.

[0020] A display device according to an exemplary embodiment includes: a display panel; a data driver that transmits data voltage to the display panel; a first flexible printed circuit board attached to the display panel and including input-side wiring electrically connected to the data driver; a first printed circuit board (PCB) electrically connected to the input-side wiring and transmitting high-speed drive signals to the data driver; and a metal strip that overlaps with the input-side wiring in a plan view and is attached to the first flexible printed circuit board, wherein the metal strip includes: a heat dissipation portion that overlaps with the data driver in the plan view and is disposed in the extension direction of the data driver, and a wiring overlap portion disposed in a direction perpendicular to the extension direction of the data driver.

[0021] The metal strip may include a metal layer and an adhesive layer, and the adhesive layer may be disposed on the entire surface of the metal strip.

[0022] The metal strip may also include an adhesive portion that assists in attaching to the first flexible printed circuit board, and in the plan view, the heat dissipation portion, the wiring overlap portion, and the adhesive portion may be separated from each other.

[0023] The width of the heat dissipation portion and the width of the adhesive portion may be different from each other.

[0024] The width of the heat dissipation portion and the width of the adhesive portion can be the same.

[0025] In the plan view, the overlapping portion of the wiring can be separated from the input-side pad located at the end of the input-side wiring by a predetermined distance.

[0026] In the plan view, the overlapping portion of the wiring can contact the input-side pad located at the end of the input-side wiring.

[0027] The heat dissipation portion and the wiring overlap portion can be separated by a predetermined interval, and the separated heat dissipation portion and wiring overlap portion can be connected to each other by an adhesive contained in the metal strip.

[0028] The overlapping portion of the wiring can define multiple openings and can have a linear structure arranged along the outer periphery of the overlapping portion of the wiring.

[0029] The display device may further include: a timing controller that processes an externally applied image signal and transmits the processed image signal to the data driver; a second printed circuit board (PCB) in which the timing controller is disposed; and a second flexible printed circuit board that connects the second printed circuit board (PCB) and the first printed circuit board (PCB).

[0030] The first printed circuit board (PCB) can be provided in multiple ways, and the first printed circuit board (PCB) can include a first printed circuit board (PCB) connected to the second flexible printed circuit board and a first printed circuit board (PCB) not connected to the second flexible printed circuit board. The display device can also include a third flexible printed circuit board that connects the first printed circuit board (PCB) not connected to the second flexible printed circuit board and the first printed circuit board (PCB) connected to the second flexible printed circuit board.

[0031] According to an exemplary embodiment, by covering the wiring to the driver chip and including a metal strip, the impedance of the signal has a reduced difference or is set to be smaller than a predetermined range, thereby improving the signal transmission performance to the driver chip. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of a display device according to an exemplary embodiment.

[0033] Figure 2 This is a top plan view showing a first flexible printed circuit board and its surroundings according to an exemplary embodiment.

[0034] Figure 3 This is an exploded perspective view showing a first flexible printed circuit board and its surroundings according to an exemplary embodiment.

[0035] Figure 4 It is along Figure 2 The cross-sectional view taken from line IV-IV.

[0036] Figure 5 It is a graph showing the impedance characteristics of the signal transmitted to the driver chip in the display device according to the comparative example and exemplary embodiment.

[0037] Figure 6A and Figure 6B This is a view showing the electric field characteristics on a cross section of a first flexible printed circuit board according to a comparative example and an exemplary embodiment.

[0038] Figure 7 It is used for Figure 1 An equivalent circuit diagram of the transmission path of a display device according to an exemplary embodiment.

[0039] Figure 8 This is an eye diagram on the input side of the data driver according to an exemplary embodiment.

[0040] Figure 9 It is an eye diagram on the input side of the data driver based on a comparison example.

[0041] Figure 10 This is an enlarged cross-sectional view of the metal strip according to an exemplary embodiment.

[0042] Figure 11 and Figure 12 This is a top plan view of a metal strip according to an exemplary embodiment.

[0043] Figure 13 This is a top plan view of a first flexible printed circuit board with a metal strip attached, according to an exemplary embodiment.

[0044] Figure 14This is a top plan view of a first flexible printed circuit board with a metal strip attached, according to an exemplary embodiment.

[0045] Figure 15 This is a top plan view of a first flexible printed circuit board with a metal strip attached, according to an exemplary embodiment.

[0046] Figure 16 It is along Figure 15 A cross-sectional view taken from line XVI-XVI.

[0047] Figure 17 to Figure 25 This is a top plan view of a first flexible printed circuit board with a metal strip attached, according to an exemplary embodiment.

[0048] <Figure Labels>

[0049] 100: Display panel; 110: Display area

[0050] 200, 310, 410: Flexible printed circuit board; PX: Pixel

[0051] 300, 400: Printed Circuit Board (PCB) W1, W2: Width

[0052] 250: Data driver; 450: Timing controller

[0053] 220: Input side pad 225: Input side routing

[0054] 320: Pad; 325: High-speed drive wiring

[0055] 230, 230': Metal strip; 231: Adhesive part

[0056] 232, 232': Heat dissipation section

[0057] 233, 233-Mesh: Overlapping wiring portion; d: Spacing.

[0058] 230-2: Adhesive layer; 230-M: Metal layer

[0059] 230-1: Reinforcing layer; 230-3: Release layer

[0060] 231-M: Adhesive metal layer; 232-M: Heat dissipation metal layer

[0061] 233-M: Overlapping metal layer for wiring; 211: Film layer

[0062] 212: Insulating layer; 213: Adhesive layer

[0063] 311, 411: Input terminals; 312, 412: Output terminals

[0064] 313, 413: Wiring section Detailed Implementation

[0065] In the following description, the invention will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are illustrated. As those skilled in the art will recognize, the described embodiments may be modified in various ways without departing from the spirit or scope of the invention.

[0066] The accompanying drawings and descriptions are to be regarded as illustrative rather than restrictive in nature, and throughout the specification, the same reference numerals indicate the same elements.

[0067] Furthermore, in the accompanying drawings, the dimensions and thicknesses of each element are arbitrarily represented for better understanding and ease of description, and the invention is not limited thereto. In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are exaggerated for clarity. In the accompanying drawings, the thicknesses of some layers and regions are exaggerated for understanding and ease of description.

[0068] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element, or there may be intermediate elements present. In contrast, when an element is referred to as being "directly on" another element, there are no intermediate elements present. Furthermore, in the specification, the terms "on" or "above" indicate that the element is located on or below the object portion, and do not necessarily indicate that it is located on the upper side of the object portion based on the direction of gravity.

[0069] In addition, unless explicitly stated otherwise, the word “including” and variations such as “comprising” or “containing” will be understood to implicitly include the stated element, but not exclude any other element.

[0070] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the teachings herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be designated as a second element, second component, second region, second layer, or second part.

[0071] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, unless expressly indicated otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms, including “at least one.” “At least one” is not to be construed as limited to “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0072] Furthermore, throughout the instruction manual, the phrase "in plan view" refers to the target portion viewed from the top, while the phrase "in cross section" refers to the cross section formed by vertically cutting the target portion viewed from the side.

[0073] In the following text, refer to Figure 1 Describe the display device as a whole.

[0074] Figure 1 This is a schematic diagram of a display device according to an exemplary embodiment.

[0075] The display device according to an exemplary embodiment may include a display panel 100, flexible printed circuit boards 200, 310 and 410, printed circuit boards (PCBs) 300 and 400, a data driver 250 and a timing controller 450.

[0076] The display panel 100 according to this exemplary embodiment includes a display area 110 in which a plurality of pixels PX are disposed, and the driving unit can be disposed outside the display area 110 using the same process as that used to form the pixels PX. The display panel 100 may be a liquid crystal panel including liquid crystal or a light-emitting display panel including light-emitting elements. Additionally, Figure 1 The display panel 100 shown in the exemplary embodiment can be a medium to large display panel.

[0077] The multiple pixels PX included in the display panel 100 can be controlled by various control signals including scan signals and data voltages, and can receive a power supply voltage with a constant voltage.

[0078] In a liquid crystal panel, multiple pixels (PX) receive data voltages and scan signals. The data voltages applied to the pixels (PX) form an electric field with a common voltage, and the arrangement orientation of the liquid crystal molecules is determined based on this electric field. The liquid crystal panel may also include additional light units, and brightness is presented when the ratio of light supplied from the light units is controlled according to the phase difference of the liquid crystal molecule arrangement orientation and a polarizer.

[0079] The light-emitting display panel can be an organic light-emitting panel including an organic emitting layer or an inorganic light-emitting display panel including an inorganic emitting layer. In the light-emitting display panel, multiple pixels (PX) receive a data voltage and at least one scan signal, and can also receive a driving voltage and a low driving voltage as power supply voltages. Additionally, a light emission signal can be received. In the organic light-emitting panel, the output current of the driving transistor is determined based on the data voltage, and light is emitted while the output current flows to the organic light-emitting diode (OLED). The brightness of the light emitted by the OLED is determined based on the magnitude of the current flowing through the OLED.

[0080] Despite Figure 1 Although not shown, the display panel 100 includes a scan driver that generates scan signals. The scan driver is located outside the display area 110 and can be formed together using a process for forming multiple pixels (PX).

[0081] The light emission signal used in the organic light emission device is also provided from a separate driver that conforms to the scan driver, and the driver that provides the light emission signal can also be formed together in some areas outside the display area 110 by a process of forming multiple pixels PX.

[0082] In an exemplary embodiment, a data driver 250 (hereinafter referred to as a data driver chip) that applies a data voltage is disposed on a first flexible printed circuit board 200 (hereinafter referred to as a flexible printed circuit board for the data driver chip), and a timing controller 450 is disposed on a second printed circuit board (PCB) 400 (hereinafter referred to as a printed circuit board (PCB) for the timing controller).

[0083] The timing controller 450 generates image data and control signals based on the image signal input from the outside, and the data driver 250 receives the image data from the timing controller 450, changes the image data into a data voltage to be applied to the pixel PX, and transmits the data voltage to the pixel PX.

[0084] The signal output from the timing controller 450 is transmitted to the first printed circuit board (PCB) 300 through the second printed circuit board (PCB) 400 and the second flexible printed circuit board 410.

[0085] exist Figure 1In an exemplary embodiment, four first printed circuit boards (PCBs) 300 are formed and configured in pairs. The pairs of first PCBs 300 are electrically connected to each other via a third flexible printed circuit board 310 (also referred to as a flexible printed circuit board for connection). Consequently, if a signal output from the timing controller 450 is applied to a first first PCB 300 via the second PCB 400 and the second flexible printed circuit board 410, the signal is transmitted to the second first PCB 300 via the third flexible printed circuit board 310. When classifying the first PCBs 300 based on their connection relationships, the classification is based on whether the first PCB 300 is directly connected to the second flexible printed circuit board 410 or not.

[0086] The first printed circuit board (PCB) 300, which is directly connected to the second flexible printed circuit board 410, receives signals output from the timing controller 450 through the second printed circuit board (PCB) 400 and the second flexible printed circuit board 410.

[0087] A first printed circuit board (PCB) 300, not directly connected to the second flexible printed circuit board 410, is connected to the first PCB 300 directly connected to the second flexible printed circuit board 410 via a third flexible printed circuit board 310. As a result, the first PCB 300, not directly connected to the second flexible printed circuit board 410, receives signals output from the timing controller 450 via the third flexible printed circuit board 310. Here, the third flexible printed circuit board 310 receives signals output from the timing controller 450 via the second PCB 400, the second flexible printed circuit board 410, and the adjacent first PCB 300.

[0088] Signals transmitted from the first printed circuit board (PCB) 300 to the first flexible printed circuit board 200 can be processed in the data driver 250 and transmitted to the display panel 100. However, some of the signals transmitted to the first flexible printed circuit board 200 can be transmitted to the display panel 100 without going through the data driver 250.

[0089] The control signal (i.e., data control signal) and image signal from the control signal output from the timing controller 450 are transmitted to the data driver 250 disposed in the first flexible printed circuit board 200 and converted into data voltage, and then the data voltage is transmitted to the display panel 100.

[0090] The scan driver control signal (i.e., scan control signal) in the control signal output from the timing controller 450 is transmitted to the scan driver in the display panel 100 through the second printed circuit board (PCB) 400, the second flexible printed circuit board 410, the first printed circuit board (PCB) 300 and the first flexible printed circuit board 200 without passing through the data driver 250.

[0091] exist Figure 1 In an exemplary embodiment, a total of sixteen first flexible printed circuit boards 200 are included, and a total of sixteen data drivers 250 are included. The data drivers 250 may be attached to the first printed circuit boards (PCBs) 300 in the form of IC chips.

[0092] Furthermore, the timing controller 450 can be attached to the second printed circuit board (PCB) 400 in the form of an IC chip. The second printed circuit board (PCB) 400 may further include a power supply voltage generator for generating the power supply voltage.

[0093] Display panel 100, flexible printed circuit boards 200, 310 and 410, and printed circuit boards (PCBs) 300 and 400 are attached to and electrically connected to each other via anisotropic conductive film (“ACF”).

[0094] In an exemplary embodiment, the display device may include only a flexible printed circuit board and a printed circuit board (PCB). In this case, the timing controller 450 may be disposed on the PCB, and the data driver 250 may be disposed on the flexible printed circuit board, or may be attached to and formed on a side region of the display panel 100. Alternatively, in another exemplary embodiment, in the case that substantially includes a flexible printed circuit board and a PCB, an additional flexible printed circuit board or PCB may be included.

[0095] In the following text, refer to Figure 2 to Figure 4 A detailed description of the first flexible printed circuit board and its surrounding structure is provided.

[0096] Figure 2 This is a top plan view showing the first flexible printed circuit board 200 and its surroundings according to an exemplary embodiment. Figure 3 This is an exploded perspective view showing a first flexible printed circuit board 200 and its surroundings according to an exemplary embodiment, and Figure 4 It is along Figure 2 The cross-sectional view taken from line IV-IV.

[0097] First, description Figure 2 and Figure 3 .

[0098] Figure 2 A portion of a display panel 100 and a portion of a first printed circuit board (PCB) 300 are shown, with a first flexible printed circuit board 200 as the main component. Figure 3 The structure of the first flexible printed circuit board 200 in a disassembled state is shown.

[0099] Input-side wiring 225, connected to data driver 250, is disposed on first flexible printed circuit board 200. Figure 2 and Figure 3 In this diagram, a portion of the wiring input to the data driver 250 is omitted, as is the wiring output from the data driver 250 to the display panel 100 (output-side wiring).

[0100] An extended input-side pad 220 is disposed at the end of the input-side wiring 225 connected to the data driver 250. The input-side pad 220 is electrically connected to a pad 320 disposed at the end of a high-speed drive wiring 325 disposed on the first printed circuit board (PCB) 300. As a result, the input-side wiring 225 connected to the data driver 250 is electrically connected to the high-speed drive wiring 325 disposed on the first printed circuit board (PCB) 300, and can have a differential pair for transmitting signals through a pair of wirings similar to the high-speed drive wiring 325. The input-side pad 220 and the pad 320 of the first printed circuit board (PCB) 300 are electrically connected via anisotropic conductive material (ACF).

[0101] The metal strip 230 is attached to the first flexible printed circuit board 200 and covers the data driver 250 attached in the form of a chip.

[0102] The metal strip 230 includes an adhesive portion 231, a heat dissipation portion 232 that overlaps with the data driver 250, and a wiring overlap portion 233 that overlaps with the input-side wiring 225.

[0103] Figure 2 The heat dissipation portion 232 of the metal strip 230 according to the exemplary embodiment absorbs the heat of the data driver 250 to dissipate the heat generated when the data driver 250 is operated, and transfers the absorbed heat to the adhesive portion 231 and / or the wiring overlap portion 233, and thus the heat of the data driver 250 is transferred to the first flexible printed circuit board 200, thereby reducing the heat. Figure 2 The heat dissipation portion 232 according to the exemplary embodiment has a structure in which the width W2 of the heat dissipation portion 232 is narrower than the width W1 of the adhesive portion 231.

[0104] The adhesive portion 231 may be located at the right / left end of the heat dissipation portion 232 and partially overlap with the data driver 250. However, the adhesive portion 231 completely overlaps with the first flexible printed circuit board 200, such that the entire metal strip 230 is attached to the first flexible printed circuit board 200. The width of the adhesive portion 231 is wide enough that the metal strip 230 will not fall off, and heat is effectively dissipated to the first flexible printed circuit board 200. Figure 2 An exemplary embodiment has a structure in which the width W1 of the adhesive portion 231 is greater than the width W2 of the heat dissipation portion 232.

[0105] The wiring overlap portion 233 is configured to extend from the heat dissipation portion 232 toward the upper part of the input-side wiring 225 and has an overlapping structure in the plan view, such that the input-side wiring 225 to which a high-speed signal is applied is disposed internally. The wiring overlap portion 233 can eliminate or reduce the impedance difference that occurs on the high-speed signal transmitted through the input-side wiring 225. According to an exemplary embodiment, the dimensions of the wiring overlap portion 233 can be configured to match the impedance. However, the impedance does not necessarily need to match, and the impedance difference can be reduced to reduce the loss of signal transmission performance. As a result, a capacitance is formed between the metal layer of the wiring overlap portion 233 and the input-side wiring 225, thereby reducing the loss caused by the impedance difference that may occur when transmitting high-speed signals and reducing the impedance difference to a level equal to that of impedance matching.

[0106] The overlapping wiring portion 233 extends from the heat dissipation portion 232 and can extend to a position close to the input-side pad 220. Figure 2 In an exemplary embodiment, the distance between the input-side pad 220 and the wiring overlap portion 233 in the plan view is represented by g, and g is in the range including 0. As the value of g increases, the capacitance between the metal layer of the wiring overlap portion 233 and the input-side wiring 225 decreases. Depending on the change in capacitance, the value of g can be set to the minimum loss for capacitance. In another exemplary embodiment, the value of g can be negative, such that the wiring overlap portion 233 can be configured to overlap with the input-side pad 220 in the plan view. In yet another exemplary embodiment, the wiring overlap portion 233 can pass through the input-side pad 220 and extend to the outside of the first flexible printed circuit board 200. When it passes through the input-side pad 220 and extends to the outside of the first flexible printed circuit board 200, the wiring overlap portion 233 has its maximum length, and the wiring overlap portion 233 can have a shorter length than usual. By taking into account the parasitic capacitance and impedance characteristics with other overlapping wiring, the wiring overlap portion 233 can be configured to have an appropriate length. In addition, when the overlapping portion 233 of the wiring overlaps with the input side pad 220, the input side pad 220 can be configured so that there is no problem in electrically connecting to the pad 320 provided on the first printed circuit board (PCB) 300.

[0107] In other words, according to the exemplary embodiment, the wiring overlap portion 233 can have various sizes and shapes. The minimum width of the wiring overlap portion 233 is when it has the same width as the input-side wiring 225 to which a high-speed signal is applied, and in this case, the opening is defined in the portion between the two pairs of input-side wirings 225, such that the wiring overlap portion 233 is not disposed in the portion between the two pairs of input-side wirings 225. The wiring overlap portion 233 can typically be wider than the minimum width, and can be configured to have an appropriate width by taking into account the parasitic capacitance and impedance characteristics with other overlapping wirings.

[0108] According to exemplary embodiments, the wiring overlap portion 233 can define openings of various structures, and some exemplary embodiments are in... Figure 14 , Figure 18 , Figure 21 and Figure 24 As shown in the image.

[0109] Furthermore, the overlapping portion 233 of the wiring does not overlap with the output-side wiring from the data driver 250 to the display panel 100, so that parasitic capacitance in the wiring that transmits signals to the display panel 100 will not cause signal delay. In addition, apart from the portion required during heat dissipation, the heat dissipation portion 232 does not have a portion that overlaps with the output-side wiring, so as to minimize the overlap area with the output-side wiring, thereby having a structure that reduces problems caused by parasitic capacitance.

[0110] Figure 4 It shows along Figure 2 The cross-sectional view is taken from line IV-IV, and the cross-sectional structure of the first flexible printed circuit board 200 is shown.

[0111] In the first flexible printed circuit board 200, in a cross-sectional view, the overlapping portions 233 of the wiring of the film layer 211, input-side wiring 225, insulating layer 212, adhesive layer 213, and metal strip 230 are sequentially arranged from the bottom. Figure 4 In the cross-section, only the wiring overlap portion 233 is shown in the metal strip 230, and only the input side wiring 225 is shown in the various wirings. A portion of another metal strip 230 is located in the same position as the wiring overlap portion 233, and the other various wirings are located in the same position as the input side wiring 225.

[0112] The film layer 211 is formed of or includes a flexible material such as polyimide, and various wirings including input-side wiring 225 made of or including metal are formed on the film layer 211. An insulating layer 212 is disposed on the various wirings including the input-side wiring 225, and an adhesive layer 213 is disposed on the insulating layer 212 such that the overlapping portion 233 of the wiring of the metal strip 230 is attached to the adhesive layer 213.

[0113] In this exemplary embodiment, the adhesive layer 213 is attached to the first flexible printed circuit board 200, the wiring overlap portion 233 of the metal strip 230 is attached to the adhesive layer 213, and the width of the adhesive layer 213 is greater than the width of the wiring overlap portion 233 of the metal strip 230. However, in the exemplary embodiment, the adhesive layer 213 may be disposed over the entire bottom surface of the metal strip 230 to have the same width as the cross-sectional width of the wiring overlap portion 233 of the metal strip 230. (Ref.) Figure 16 Adhesive layer 230-2)

[0114] like Figure 4 As shown, the overlapping portion 233 of the wiring overlaps with the input-side wiring 225 in the vertical direction, thereby forming a parasitic capacitor together with the adhesive layer 213 and the insulating layer 212 disposed between them. The impedance difference on the transmission path is reduced by the capacitance of the parasitic capacitor, thus preventing the signal transmission performance from deteriorating due to the impedance difference.

[0115] In addition, Figure 4 In this process, the parasitic capacitance between the overlapping portion 233 of the wiring and the input-side wiring 225 is also affected by the distance between them. As a result, the thickness of the adhesive layer 213 and / or the insulating layer 212 disposed between them can also be modified to reduce the impedance difference on the transmission line.

[0116] The effect of reducing impedance difference can be achieved through Figure 5 The graph is shown.

[0117] Figure 5 It is a graph showing the impedance characteristics of the signal transmitted to the driver chip in the display device according to the comparative example and exemplary embodiment.

[0118] Figure 5 The diagram illustrates the change in impedance (ohms: Ω) values ​​(y-axis) over time (x-axis), with a comparative example being a structure excluding the wiring overlap 233, and an exemplary embodiment showing a structure with... Figure 2 to Figure 4 The situation regarding the structure.

[0119] like Figure 5As shown, in the comparative example, when the signal is transmitted from the first printed circuit board (PCB) 300 to the first flexible printed circuit board 200, the impedance value changes from 100Ω to 168Ω, resulting in an impedance difference of 68Ω. However, in Figure 2 to Figure 4 In an exemplary embodiment, the impedance value is reduced to 130Ω by the parasitic capacitance caused by the overlapping portion 233 of the wiring, thereby reducing the difference in impedance value (i.e., the changed value) to 30Ω.

[0120] result, Figure 2 to Figure 4 The exemplary embodiment does not achieve impedance matching where no impedance difference exists. However, compared to the comparative example, the impedance difference is reduced by half or more, resulting in reduced losses due to the impedance difference during signal transmission. As a result, improved signal transmission performance can be achieved.

[0121] The impedance value can be varied depending on the width, length (depending on value g), and structure of the wiring overlap 233.

[0122] Next, through Figure 6A and 6B To compare the electric field characteristics on the cross-sectional diagram.

[0123] Figure 6A and Figure 6B This is a view showing the electric field characteristics on a cross section of a first flexible printed circuit board according to a comparative example and an exemplary embodiment.

[0124] Figure 6A The electric field characteristics on a cross section are shown in a comparative example without wiring overlap 233 (i.e., the metal layer), and Figure 6B The electric field characteristics on a cross section in an exemplary embodiment including wiring overlap portion 233 (i.e., metal layer) are shown.

[0125] Compare Figure 6A and Figure 6B It can be clearly confirmed that there is a difference in the electric field around the input-side wiring 225, and it can be confirmed that... Figure 6A In comparison, Figure 6B In this process, the electric field between a pair of input-side wirings 225 is improved, thereby reducing crosstalk with other wirings caused by the electric field.

[0126] In the following text, the path for applying signals from the display device to the data driver 250 is described. Figure 7 In the diagram, it is represented as a transmission line, and through... Figure 8 and Figure 9 The eye diagrams on the input side of the data driver 250 are compared and described with comparative examples and exemplary embodiments.

[0127] Figure 7 It is used forFigure 1 An equivalent circuit diagram of the transmission path of a display device according to an exemplary embodiment. Figure 8 This is an eye diagram on the input side of the data driver according to an exemplary embodiment, and Figure 9 It is an eye diagram on the input side of the data driver based on a comparison example.

[0128] First, Figure 7 and Figure 1 The structures are compared and described as follows.

[0129] exist Figure 1 In this configuration, the first printed circuit board (PCB) 300, which is not directly connected to the second flexible printed circuit board 410, receives signals output from the timing controller 450 via the third flexible printed circuit board 310. The third flexible printed circuit board 310 receives signals via the second printed circuit board (PCB) 400, the second flexible printed circuit board 410, and the adjacent first printed circuit board (PCB) 300. Here, as... Figure 7 As shown, an additional terminal TX for external connection to timing controller 450 and a terminal RX for outputting signals from data driver 250 to display panel 100 are provided to form an equivalent circuit diagram for transmission lines.

[0130] Reference Figure 7 The terminal TX, which is externally connected to the timing controller 450, is formed by or includes a pair of wires for transmitting and outputting signals, thus this is shown as a diode amplifier structure. This is not a diagram of the actual configuration of the terminal TX, but simply shown as an equivalent circuit. The terminal TX, which is externally connected to the timing controller 450, can be located on a second printed circuit board (PCB) 400.

[0131] Following the terminal TX for input from the outside to the timing controller 450, a second printed circuit board (PCB) 400 and the timing controller 450 are provided. Here, the characteristics of the second printed circuit board (PCB) 400 shown are the sum of the portion where signals are input to the timing controller 450 and the portion where signals are output to the timing controller 450.

[0132] The second flexible printed circuit board 410 is positioned immediately following the timing controller 450. The second flexible printed circuit board 410 is shown by dividing it into input terminals 411, output terminals 412, and wiring portions 413 between them.

[0133] In a subsequent location of the second flexible printed circuit board 410, the first printed circuit board (PCB) 300 is positioned and simply shown. The characteristics of the portion where the second flexible printed circuit board 410 and the first printed circuit board (PCB) 300 are electrically connected are shown as the output terminal 412 of the second flexible printed circuit board 410.

[0134] In a subsequent location of the first printed circuit board (PCB) 300, a third flexible printed circuit board 310 is disposed and shown as including an input terminal 311, an output terminal 312, and a wiring portion 313 between them. The characteristics of the portion electrically connected between the first printed circuit board (PCB) 300 and the third flexible printed circuit board 310 are shown as the input terminal 311 of the third flexible printed circuit board 310.

[0135] In a subsequent location of the third flexible printed circuit board 310, the first printed circuit board (PCB) 300 may be set up, and this is the first printed circuit board (PCB) 300 that may not be directly connected to the second flexible printed circuit board 410.

[0136] In a subsequent position of the first printed circuit board (PCB) 300, the first flexible printed circuit board 200 and the data driver 250 are arranged, and the terminal RX that outputs signals from the data driver 250 to the display panel 100 is arranged in a subsequent position of the data driver 250.

[0137] like Figure 8 The diagram illustrates the signal characteristics at the input side of the data driver 250 in these transmission lines, and for comparison, in Figure 9 The comparison example is shown in the figure.

[0138] Figure 8 and Figure 9 Simulates a 3.4 gigabits (Gbps) high-speed drive signal at the input terminals of the data driver 250.

[0139] Figure 8 and Figure 9 This shows the change in voltage (millivolts: mV on the y-axis) over time (picoseconds: ps on the x-axis), and the changes are accumulated and displayed while a high-speed drive signal is applied. Located at Figure 8 and Figure 9 The diamond at the center has an eye shape and is called an eye diagram. If there is no part of the eye shape that overlaps with the surrounding signal waveform, it means that the display device matches the signal specification; if part of the eye shape overlaps with the surrounding signal waveform, it does not meet the signal specification and indicates that an error has occurred during signal transmission.

[0140] Figure 8 yes Figure 2 to Figure 4The simulation diagram of the exemplary embodiment shows a space formed around the eye shape, confirming that even with a high-speed drive signal of 3.4Gbps, there is a margin and no transmission error problem. As a result, it can be predicted that it can be used in high-speed drives above 3.4Gbps (e.g., 4Gbps or 6Gbps). In particular, if the impedance difference is reduced by adjusting the parasitic capacitance formed by the overlapping portion 233 and the input-side wiring 225, transmission error problems will not occur even in various high-speed drives.

[0141] On the other hand, with Figure 2 to Figure 4 different, Figure 9 This is a simulation diagram of a comparative example structure excluding the wiring overlap portion 233, and it can be confirmed that when driven at a high speed of 3Gbps, a portion of the eye shape is obscured by the waveform, and this is caused by... Figure 9 The spark shape on the waveform is shown. Therefore, in the comparative example, there is a high probability of transmission error problems when driven at a high speed of 3.4Gbps, and it may be difficult to use in high-speed drives.

[0142] Next, the description Figure 2 to Figure 4 Various variations of the exemplary embodiment of the metal strip 230 shown herein.

[0143] pass Figure 10 The cross-sectional structure of the metal strip 230 according to an exemplary embodiment is described.

[0144] Figure 10 This is an enlarged cross-sectional view of the metal strip 230 according to an exemplary embodiment.

[0145] like Figure 10 As shown, Figure 10 The metal strip 230 according to an exemplary embodiment includes a metal layer 230-M and an adhesive layer 230-2, and a reinforcing layer 230-1 and a release layer 230-3 are disposed on corresponding sides of the metal layer 230-M. The reinforcing layer 230-1 serves to protect the metal strip 230, and during attachment, after the release layer 230-3 is removed, the metal strip 230 is attached to the first flexible printed circuit board 200 by using the adhesive layer 230-2 disposed inside the release layer 230-3.

[0146] Figure 10Metal layer 230-M, adhesive layer 230-2, and reinforcing layer 230-1 can be disposed on all adhesive portions 231, heat dissipation portions 232, and wiring overlap portions 233. Metal layer 230-M disposed on heat dissipation portion 232 plays a major role in absorbing and transferring heat emitted from data driver 250, and metal layer 230-M disposed on wiring overlap portion 233 transfers heat, but plays an important role in reducing impedance difference by generating parasitic capacitance with input-side wiring 225. Adhesive layer 230-2 disposed on adhesive portion 231 allows metal strip 230 to be fixed to first flexible printed circuit board 200, and metal layer 230-M disposed on adhesive portion 231 plays an important role in heat transfer and releases heat to first flexible printed circuit board 200.

[0147] In the following text, through Figure 11 and Figure 12 Describes both an overall exemplary embodiment and individual exemplary embodiments.

[0148] Figure 11 and Figure 12 This is a top plan view of the metal strip 230 according to an exemplary embodiment.

[0149] Figure 11 An exemplary embodiment shows the relationship with Figure 2 to Figure 4 The integral metal strip 230 with the same shape as shown in the figure.

[0150] and Figure 2 to Figure 4 different, Figure 11 The metal strip 230 in which the adhesive layer 230-2 and the metal layer 230-M are disposed together is shown. Figure 11 The plan view shows that the adhesive layer 230-2 has a width that is wider than the metal layer 230-M, but in an exemplary embodiment, the adhesive layer 230-2 and the metal layer 230-M may have matching contours or the adhesive layer 230-2 may be disposed inside each other.

[0151] The metal layer 230-M includes an adhesive metal layer 231-M corresponding to the adhesive portion 231, a heat dissipation metal layer 232-M corresponding to the heat dissipation portion 232, and a wiring overlap metal layer 233-M corresponding to the wiring overlap portion 233.

[0152] On the other hand, Figure 12 In an exemplary embodiment, with Figure 11 Unlike the exemplary embodiment, the wiring overlap metal layer 233-M in the metal layer 230-M has a structure that is separate from the heat dissipation metal layer 232-M.

[0153] The wiring overlap metal layer 233-M and the heat dissipation metal layer 232-M are separated, but have a structure in which the wiring overlap metal layer 233-M and the heat dissipation metal layer 232-M are connected by an adhesive layer 230-2. According to an exemplary embodiment, the spacing d between the wiring overlap metal layer 233-M and the heat dissipation metal layer 232-M can be various, and can be provided to a degree that allows the wiring overlap metal layer 233-M and the heat dissipation metal layer 232-M to remain connected and not separated by the adhesive layer 230-2.

[0154] exist Figure 11 and Figure 12 The structure includes an adhesive layer 230-2 disposed beneath the metal layer 230-M. According to an exemplary embodiment, the parasitic capacitance between the wiring overlap portion 233 and the input-side wiring 225 can be altered by changing the thickness of the adhesive layer 230-2. That is, the thickness of the adhesive layer 230-2 can be increased to reduce the parasitic capacitance, or the thickness of the adhesive layer 230-2 can be decreased to increase the parasitic capacitance. Reducing the impedance difference improves signal transmission capability.

[0155] In the following text, through Figure 13 to Figure 16 An exemplary embodiment of a linear metal strip is described.

[0156] First, refer to Figure 13 The structure of a linear metal strip is described in an exemplary embodiment.

[0157] Figure 13 This is a top plan view of a first flexible printed circuit board with a metal strip attached, according to an exemplary embodiment.

[0158] exist Figure 13 In, with Figure 2 to Figure 4 Unlike other metal strips, the metal strip has a structure that includes only the wiring overlap portion 233 but not the adhesive portion 231 and the heat dissipation portion 232.

[0159] in addition, Figure 13 An exemplary embodiment illustrates a structure in which the end of the wiring overlap portion 233 matches one side of the input-side pad 220. However, as Figure 2 As shown, the end of the wiring overlap portion 233 can be separated from one side of the input-side pad 220 or can overlap with the input-side pad 220. This is in Figure 14 to Figure 25 The same applies. The width of the overlapping portion 233 can also have a minimum width that overlaps only with the input-side wiring 225.

[0160] Since the data drive 250 is easy to dissipate heat, and therefore there is no need to form a heat dissipation section 232, it can be used Figure 13 The metal strip according to an exemplary embodiment. Additionally... Figure 13The exemplary embodiment does not have a portion that overlaps with the output-side wiring, which also has the advantage that there is no problem of the signal transmitted to the display panel 100 being delayed by parasitic capacitance.

[0161] like Figure 13 The exemplary embodiment of the linear metal strip shown can be additionally modified to have, for example, the following characteristics: Figure 14 The grid structure.

[0162] Figure 14 This is a top plan view of a first flexible printed circuit board 200 with a metal strip attached, according to an exemplary embodiment.

[0163] exist Figure 14 In this embodiment, a wiring overlap portion 233-Mesh with a straight-line shape defines multiple diamond-shaped openings. Hereinafter, this is also referred to as a mesh structure or mesh pattern. Furthermore, in this exemplary embodiment, since the mesh structure comprises a linear pattern along the outer periphery of the wiring overlap portion 233-Mesh, the openings do not have a structure connecting to the outside. However, according to the exemplary embodiment, the shape of the openings can be various, such as circular, and the size and arrangement of the openings can be irregularly defined, or the openings can connect to the outside. The parasitic capacitance between the wiring overlap portion 233-Mesh and the input-side wiring 225 can be adjusted by the area of ​​the openings in the mesh pattern, such that the impedance difference can be controlled by controlling the area.

[0164] In addition, Figure 14 In an exemplary embodiment, a structure is shown in which the ends of the wiring overlap portion 233-Mesh with a mesh pattern coincide with one side of the input-side pad 220. However, as Figure 14 As shown, the end of the wiring overlap portion 233-Mesh with a grid pattern can be separated from one side of the input-side pad 220.

[0165] In the following text, refer to Figure 15 and Figure 16 The description has been modified to include, for example: Figure 10 and Figure 11 An exemplary embodiment of the adhesive layer 230-2 shown.

[0166] Figure 15 This is a top plan view of a first flexible printed circuit board 200 with a metal strip attached, according to an exemplary embodiment. Figure 16 It is along Figure 15 A cross-sectional view taken from line XVI-XVI.

[0167] Figure 15 An exemplary embodiment is wherein Figure 13The exemplary embodiment also includes an exemplary embodiment of adhesive layer 230-2, wherein the wiring overlap portion 233 is indicated by a thicker line to show adhesive layer 230-2 in a plan view, and adhesive layer 230-2 is marked on the corresponding thicker line.

[0168] If this is described as a cross section, then it is similar to... Figure 16 The cross-section is the same, and with Figure 4 In contrast, the adhesive layer 230-2 is configured to have the same width as the wiring overlap portion 233.

[0169] That is, a film layer 211, an input-side wiring 225, and an insulating layer 212 constituting the first flexible printed circuit board 200 are sequentially disposed thereon, and an adhesive layer 230-2 constituting a metal strip and a wiring overlap portion 233 are sequentially disposed thereon. Next, in Figure 19 , Figure 22 and Figure 25 In the plan view, through, as Figure 15 The thick outer line in the middle shows Figure 16 The cross-sectional structure of the adhesive layer 230-2 and the metal strip is shown in the figure.

[0170] In the following text, refer to Figure 17 to Figure 25 Various exemplary embodiments are shown.

[0171] Figure 17 to Figure 25 This is a top plan view of a first flexible printed circuit board 200 with a metal strip attached, according to an exemplary embodiment.

[0172] in, Figure 17 to Figure 19 It shows the basis Figure 10 Exemplary variations of the structure, Figure 20 to Figure 22 An exemplary embodiment of the T-shaped metal strip is shown, and Figure 23 to Figure 25 An exemplary embodiment of a plate-shaped metal strip is shown.

[0173] First, refer to Figure 17 to Figure 19 describe Figure 13 to Figure 16 How are the variations applied? Figure 2 to Figure 4 The exemplary embodiments shown are illustrated below.

[0174] Figure 17 It shows the relationship with Figure 2 The structure corresponds to the structure of the metal strip 230. For example... Figure 2 and Figure 17 The structure is an exemplary embodiment in which the adhesive portion 231 assists the heat dissipation portion 232, thereby improving the heat dissipation characteristics. As a result, this is an exemplary embodiment that can be used when the demand for heat dissipation is high.

[0175] and Figure 17Unlike other embodiments, in this exemplary model, the end of the wiring overlap portion 233 may be separate from or overlap with one side of the input-side pad 220. Furthermore, the width of the wiring overlap portion 233 may have a minimum width that overlaps only with the input-side wiring 225. Figure 17 The exemplary embodiment does not include the portion where the wiring overlaps with the output-side wiring, and only the heat dissipation portion 232 is configured to overlap with the output-side wiring to a minimum. As a result, the problem of signal transmission to the display panel 100 being delayed by parasitic capacitance does not occur.

[0176] exist Figure 18 An exemplary embodiment is shown in which a mesh structure is further added. Figure 17 An exemplary embodiment of the invention.

[0177] The mesh pattern is only set in the wiring overlap portion 233-Mesh in the metal strip 230.

[0178] At the same time, if in Figure 17 In an exemplary embodiment, it is modified to include an adhesive layer 230-2, thus becoming Figure 19 An exemplary embodiment is shown in [the document]. Figure 19 In the diagram, the overlapping portion 233 of the wiring is shown by a thicker line to show the adhesive layer 230-2 in the plan view, and the adhesive layer 230-2 is marked on the corresponding thicker line.

[0179] In the following text, refer to Figure 20 to Figure 22 Exemplary embodiments of the T-shaped metal strip and exemplary variations thereof are described.

[0180] Figure 20 An exemplary embodiment of a T-shaped metal strip is shown, and in this structure, with Figure 2 Unlike other components, the heat dissipation portion 232 and the adhesive portion 231 are formed without any width difference, thus constituting the heat dissipation portion 232'. Due to the large area of ​​the metal strip, the heat from the data driver 250 can be dissipated more easily, and when combined with... Figure 2 In an exemplary embodiment, it can be used when more heat dissipation is required. However, Figure 20 The exemplary embodiments can be modified to include Figure 2 and Figure 17 The heat dissipation portion 232 shown in the figure, and the adhesive portion 231 can be like... Figure 2 and Figure 17 The heat dissipation portion 232 is formed in a narrow width. This configuration has the effect of preventing signal delay by reducing parasitic capacitance caused by the output-side wiring, rather than by dissipating heat in a minimal area. The impedance matching the input-side wiring 225 can be adjusted by the size of the wiring overlap portion 233.

[0181] In an exemplary embodiment, with Figure 2 Unlike other methods, the end of the wiring overlap portion 233 can be separated from one side of the input-side pad 220 or overlap with the input-side pad 220. Furthermore, the width of the wiring overlap portion 233 can also have a minimum width that overlaps only with the input-side wiring 225. Additionally, Figure 20 The exemplary embodiment does not include the portion where the wiring overlaps with the output-side wiring, and only the heat dissipation portion 232 is configured to overlap with the output-side wiring. There is also a possibility that the signal transmitted to the display panel 100 may be delayed due to the generation of parasitic capacitance caused by the overlap between the heat dissipation portion 232 and the output-side wiring. However, according to the exemplary embodiment, the structure of the heat dissipation portion 232 can be modified to achieve delay-free heat dissipation.

[0182] exist Figure 21 An exemplary embodiment is shown in which a mesh structure is further added. Figure 20 An exemplary embodiment of the invention.

[0183] In the metal strip, the mesh pattern is only set on the overlapping portion of the wiring 233-Mesh.

[0184] on the other hand, Figure 20 The exemplary embodiment is modified to further include an adhesive layer 230-2 to become Figure 22 The exemplary embodiments shown are illustrated below. Figure 22 The overlapping portion 233 of the wiring is also shown with thicker lines to show the adhesive layer 230-2 in the plan view, and the adhesive layer 230-2 is marked on the corresponding thicker lines.

[0185] In the following text, refer to Figure 23 to Figure 25 Exemplary embodiments of plate-shaped metal strips and exemplary variations thereof are described.

[0186] like Figure 23 As shown, the metal strip 230' has a quadrilateral shape and includes an adhesive portion, a heat dissipation portion, and a wiring overlap portion, but has a structure that is difficult to distinguish structurally. Figure 23 In an exemplary embodiment, the heat dissipation portion may include a peripheral portion based on the portion overlapping with the data driver 250, and the wiring overlap portion may include a peripheral portion based on the portion overlapping with the input-side wiring 225. Additionally, the adhesive portion may include portions corresponding to the heat dissipation portion and the wiring overlap portion, and may include portions directly attached to the metal strip 230' and the first flexible printed circuit board 200.

[0187] In an exemplary embodiment, with Figure 23Unlike other wiring systems, the end of the overlapping portion 233 can be separated from or overlap with one side of the input-side pad 220. Additionally, the metal strip 230' overlaps with the output-side wiring, which may delay the signal transmission to the display panel 100 due to parasitic capacitance. However, by changing the structure of the heat dissipation portion 232, heat dissipation can be achieved without delay.

[0188] exist Figure 24 An exemplary embodiment is shown in which a mesh structure is added. Figure 23 An exemplary embodiment. For example... Figure 24 As shown, the overlapping portion 233-Mesh of the wiring with a grid pattern is only provided in the portion of the metal strip 230' that overlaps with the input-side wiring 225. This is to adjust the degree of overlap of the input-side wiring 225 to control parasitic capacitance.

[0189] On the other hand, by modifying Figure 23 An exemplary embodiment further includes an adhesive layer 230-2 to provide Figure 25 An exemplary embodiment. In Figure 25 In the diagram, the overlapping portion 233 of the wiring is shown with a thicker line to show the adhesive layer 230-2 in the plan view, and the adhesive layer 230-2 is marked on the corresponding thicker line.

[0190] In addition to the exemplary embodiments shown above, various additional exemplary embodiments are also possible. That is, in the exemplary embodiments described above, a quadrilateral structure is shown, but the structure can be modified based on a circle or a polygon. Furthermore, the size and length of the wiring overlap 233 can be changed, and the shape of the mesh can also be changed. The wiring overlap 233 and the mesh can be changed to reduce impedance difference or to match the parasitic capacitance of the input-side wiring 225.

[0191] Although this disclosure has been described in conjunction with what is now considered to be exemplary practices, it should be understood that the invention is not limited to the disclosed embodiments. Rather, it is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A display device, wherein, The display device includes: Display panel; A data driver that transmits data voltage to the display panel; A first flexible printed circuit board is attached to the display panel and includes input-side wiring electrically connected to the data driver; A first printed circuit board, electrically connected to the input-side wiring to transmit high-speed drive signals to the data driver; and A metal strip, in the plan view, covers the input-side wiring and is attached to the first flexible printed circuit board, while also covering the data driver. In the plan view, the portion of the metal strip that overlaps with the input-side wiring defines an opening.

2. The display device according to claim 1, wherein, The opening is defined in the overlapping portion of the metal strip that overlaps with the input-side wiring.

3. The display device according to claim 2, wherein, The overlapping portion of the wiring extends from the data driver toward the input-side pad located at the end of the input-side wiring, and The metal strip also includes a heat dissipation portion covering the data driver and an adhesive portion that assists in attaching to the first flexible printed circuit board.

4. The display device according to claim 3, wherein, The width of the heat dissipation portion and the width of the adhesive portion may be different from or the same as each other, and The metal strip has a plate-like structure.

5. The display device according to claim 2, wherein, The openings are provided in multiple ways, and the wiring overlap portion further includes a linear structure disposed along the outer periphery of the wiring overlap portion.

6. A display device, wherein, The display device includes: Display panel; A data driver that transmits data voltage to the display panel; A first flexible printed circuit board is attached to the display panel and includes input-side wiring electrically connected to the data driver; A first printed circuit board, electrically connected to the input-side wiring and transmitting high-speed drive signals to the data driver; and A metal strip, in the plan view, covers the input-side wiring and is attached to the first flexible printed circuit board, while also covering the data driver. The metal strip includes: a heat dissipation portion that overlaps with the data driver in the plan view and is disposed in the extension direction of the data driver, and a wiring overlap portion disposed in a direction perpendicular to the extension direction of the data driver.

7. The display device according to claim 6, wherein, The metal strip includes a metal layer and an adhesive layer, and The adhesive layer is disposed on the entire surface of the metal strip.

8. The display device according to claim 6, wherein, The metal strip also includes an adhesive portion that assists in attaching to the first flexible printed circuit board. In the plan view, the heat dissipation portion, the wiring overlap portion, and the adhesive portion are separated from each other, and The width of the heat dissipation portion and the width of the adhesive portion may be different from or the same as each other.

9. The display device according to claim 6, wherein, In the plan view, the overlapping portion of the wiring is separated from the input-side pad located at the end of the input-side wiring by a predetermined distance, or In the plan view, the overlapping portion of the wiring contacts the input-side pad located at the end of the input-side wiring.

10. The display device according to claim 6, wherein, The heat dissipation portion and the wiring overlap portion are separated by a predetermined interval, and the separated heat dissipation portion and wiring overlap portion are connected to each other by an adhesive contained in the metal strip.

11. The display device according to claim 6, wherein, The wiring overlap portion defines multiple openings and includes a linear structure disposed along the outer periphery of the wiring overlap portion.

12. The display device according to claim 6, wherein, The display device further includes: A timing controller that processes externally applied image signals and transmits the processed image signals to the data driver; A second printed circuit board, wherein the timing controller is disposed; A second flexible printed circuit board, connecting the second printed circuit board and the first printed circuit board, and A third flexible printed circuit board connects the first printed circuit board, which is not connected to the second flexible printed circuit board, and the first printed circuit board, which is connected to the second flexible printed circuit board. in, The first printed circuit board is provided in multiple forms, and the first printed circuit board includes a first printed circuit board connected to the second flexible printed circuit board and a first printed circuit board not connected to the second flexible printed circuit board.

Images