Semiconductor modules and vehicles

Abstract

In semiconductor modules equipped with coolers, when the cooler is fixed to an external refrigerant supply device using fasteners such as screws, the tightening force of the fasteners can sometimes cause the cooler to bend, potentially affecting the sealing of the refrigerant flow path formed between the cooler and the refrigerant supply device. This invention provides a semiconductor module equipped with a semiconductor device and a cooling device. The semiconductor device has a semiconductor chip and a circuit board on which the semiconductor chip is mounted. The cooling device has a top plate, sidewalls, a bottom plate, a refrigerant flow section, an inlet, an outlet, and multiple fins. The top and bottom plates include through holes for inserting fasteners to secure the semiconductor module to the external device; that is, three through holes penetrating the top and bottom plates in one direction respectively. When viewed from above, the geometric centroid of the opening of at least one of the inlet and outlet can be located inside an imaginary triangle with the three through holes as vertices.

Description

Technical Field

[0001] This invention relates to semiconductor modules and vehicles. Background Technology

[0002] Previously, semiconductor modules containing multiple semiconductor elements, such as power semiconductor chips with cooling fins, were known (see, for example, Patent Documents 1-11).

[0003] Existing technical documents

[0004] Patent documents

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2019-129208

[0006] [Patent Document 2] International Publication WO2016 / 121159

[0007] [Patent Document 3] Japanese Patent Application Publication No. 2020-027891

[0008] [Patent Document 4] Japanese Patent Application Publication No. 2019-204922

[0009] [Patent Document 5] Japanese Patent No. 6486579

[0010] [Patent Document 6] Japanese Patent Application Publication No. 2020-027891

[0011] [Patent Document 7] International Publication WO2016 / 204257

[0012] [Patent Document 8] Japanese Patent Application Publication No. 2017-183421

[0013] [Patent Document 9] Japanese Patent Application Publication No. 2017-098439

[0014] [Patent Document 10] Japanese Patent Application Publication No. 2016-100456

[0015] [Patent Document 11] International Publication WO2016 / 042903 Summary of the Invention

[0016] The technical problem that the invention aims to solve

[0017] When the aforementioned semiconductor module is mounted on an external refrigerant supply device, fasteners such as screws are used to fix the cooler to the refrigerant supply device. However, the tightening force of the fasteners can sometimes cause the cooler to bend, which may affect the sealing of the refrigerant flow path formed between the cooler and the refrigerant supply device.

[0018] Technical means for solving technical problems

[0019] To address the aforementioned problems, a first aspect of the present invention provides a semiconductor module comprising a semiconductor device and a cooling device. The semiconductor device may include a semiconductor chip and a circuit board on which the semiconductor chip is mounted. The cooling device may include a top plate that fixes the circuit board of the semiconductor device to a main surface. The cooling device may include a sidewall connected to the top plate. The cooling device may include a bottom plate connected to the sidewall and facing the top plate. The cooling device may include a refrigerant flow section defined by the top plate, sidewall, and bottom plate for allowing refrigerant to flow. The cooling device may include an inlet formed in the bottom plate for introducing refrigerant into the refrigerant flow section. The cooling device may include an outlet formed in the bottom plate for discharging refrigerant from the refrigerant flow section. The cooling device may include a plurality of fins disposed in the refrigerant flow section and extending in a manner connecting the top plate and the bottom plate. The top plate and the bottom plate may include through holes for inserting fasteners for fastening the semiconductor module to an external device, i.e., three through holes penetrating the top plate and the bottom plate respectively in one direction. When viewed from above, the geometric centroid of the opening of at least one of the entrance and exit can be located inside an imaginary triangle with the three through holes as vertices.

[0020] Two of the three through holes can be located on opposite sides of the opening. When viewed from above, the perpendicular bisector of the line segment connecting the points inside the two through holes can pass through the opening.

[0021] When viewed from above, the perpendicular bisector of the line segment obtained by connecting the geometric centroids of the two through holes can pass through the geometric centroid of the opening.

[0022] The outer edge of the opening can be located inside an imaginary triangle with the three through holes as vertices.

[0023] The through-hole may include a first through-hole, a second through-hole, a third through-hole, and a fourth through-hole. Viewed from above, the first and fourth through-holes may be located on either side of the entrance. The second and third through-holes may be located on either side of the exit. Viewed from above, and taken from a direction orthogonal to the line connecting the first and fourth through-holes, the second through-hole may be located between the first and fourth through-holes. Viewed from above, the geometric centroid of the entrance may be located inside an imaginary triangle with the first, fourth, and second through-holes as vertices. Viewed from above, the geometric centroid of the exit may be located inside an imaginary triangle with the second, third, and fourth through-holes as vertices.

[0024] When viewed from a direction orthogonal to the straight line connecting the first and fourth through holes, at least a portion of the second through hole can overlap with the entrance.

[0025] When viewed from a direction orthogonal to the straight line connecting the first and fourth through holes, the geometric centroid of the second through hole can coincide with the geometric centroid of the entrance.

[0026] When viewed from a direction orthogonal to the straight line connecting the second and third through holes, at least a portion of the fourth through hole can overlap with the outlet.

[0027] When viewed from a direction orthogonal to the straight line connecting the second and third through holes, the geometric centroid of the fourth through hole can coincide with the geometric centroid of the outlet.

[0028] The line connecting the first and fourth through holes can be parallel to the line connecting the third and second through holes. The line connecting the first and fourth through holes can form an acute angle with the line connecting the second and fourth through holes.

[0029] The top and bottom plates can be rectangular when viewed from above. The through-hole may also include a fifth through-hole. When viewed from a direction orthogonal to the line connecting the first and fourth through-holes, at least a portion of the second through-hole may overlap with the fourth through-hole, and at least a portion of the fifth through-hole may overlap with the third through-hole.

[0030] The through hole may also include a sixth through hole. When viewed from a direction orthogonal to the line connecting the first and fourth through holes, at least a portion of the sixth through hole may overlap with the first through hole.

[0031] When viewed from above, the first through hole, the third through hole, the fifth through hole, and the sixth through hole can be located at the four corners of the rectangle.

[0032] The thickness of the base plate can be greater than the thickness of the portion of the top plate facing the refrigerant flow section.

[0033] At least one of the three through holes can penetrate the top plate, side wall and bottom plate in one direction.

[0034] The sidewall may include a thin-walled portion and a thick-walled portion. At least one through hole may be formed in the thick-walled portion.

[0035] The cooling device may also have a reinforcing section located outside the refrigerant flow section and connected to the top plate and the bottom plate. At least one of the three through holes may penetrate the top plate, the reinforcing section, and the bottom plate in one direction.

[0036] The semiconductor device may also have a resin structure for sealing the semiconductor chip. The resin structure may be fixed to the main surface of the top plate. The through-hole may penetrate at least the resin structure, the top plate, and the bottom plate in one direction.

[0037] The resin structure may have a recessed portion, which, in the case of a screw, is used to accommodate the head of the screw so that the head does not protrude outside the resin structure.

[0038] A second aspect of the present invention provides a vehicle having the semiconductor module involved in the first aspect.

[0039] Furthermore, the above summary of the invention is not an enumeration of all essential features of the invention. In addition, sub-combinations of these feature groups can also constitute an invention. Attached Figure Description

[0040] Figure 1 This is a schematic perspective view illustrating an example of a semiconductor module 100 according to an embodiment of the present invention.

[0041] Figure 2 This is a schematic perspective view illustrating an example of a semiconductor module 100 according to an embodiment of the present invention.

[0042] Figure 3 This is a schematic perspective view showing an example of a cooling device 10 for a semiconductor module 100 according to an embodiment of the present invention.

[0043] Figure 4 It is along Figure 1 The schematic cross-sectional view is obtained by imagining that line II cuts through the semiconductor module 100.

[0044] Figure 5 yes Figure 4 A magnified view of the area [A] indicated by the dashed line.

[0045] Figure 6 This is a diagram illustrating an example of the arrangement and shape of the sidewalls 36 and reinforcement 25 in the semiconductor module 100 according to an embodiment of the present invention, the arrangement of the cooling region 95 of the cooling device 10, the arrangement of the metal layer 85 of the semiconductor device 70, the arrangement and shape of the fins 94, and the flow direction of the refrigerant.

[0046] Figure 7 This is a schematic bottom view showing an example of the base plate 64 of a semiconductor module 100 according to an embodiment of the present invention.

[0047] Figure 8 This is a schematic perspective view showing an example of a state in which a semiconductor module 100 according to an embodiment of the present invention is mounted on a refrigerant supply unit 130.

[0048] Figure 9This is a schematic perspective view showing an example of the state after the semiconductor module 100 according to an embodiment of the present invention is installed on the refrigerant supply unit 130.

[0049] Figure 10 This is a schematic bottom view showing an example of a modified version of the base plate 64 of the semiconductor module 100 according to an embodiment of the present invention, namely, a base plate 67.

[0050] Figure 11 This is a schematic bottom view showing an example of a modified version of the base plate 64 of the semiconductor module 100 according to an embodiment of the present invention, namely, a base plate 68.

[0051] Figure 12 This is a diagram showing an outline of a vehicle 200 according to one embodiment of the present invention.

[0052] Figure 13 This is a main circuit diagram of a semiconductor module 100 according to one embodiment of the present invention. Detailed Implementation

[0053] The present invention will now be described through embodiments thereof; however, these embodiments do not limit the scope of the invention as defined in the claims. Furthermore, the combinations of features described in the embodiments are not necessarily all necessary technical means to solve the technical problems of the present invention.

[0054] Figure 1 and Figure 2 This is a schematic perspective view illustrating an example of a semiconductor module 100 according to an embodiment of the present invention. Figure 3 This is a schematic perspective view illustrating an example of a cooling device 10 for a semiconductor module 100 according to an embodiment of the present invention. Furthermore, Figure 4 It means along Figure 1 The schematic cross-sectional view shown is obtained by imaginarily cutting the semiconductor module 100 along line II. Figure 5 yes Figure 4 A magnified view of the area [A] indicated by the dashed line. Furthermore, Figure 6 This is a diagram illustrating an example of the configuration and shape of the sidewalls 36 and reinforcement 25 in the semiconductor module 100 according to an embodiment of the present invention, the configuration of the cooling region 95 of the cooling device 10, the configuration of the metal layer 85 of the semiconductor device 70, the configuration and shape of the fins 94, and the flow direction of the refrigerant.

[0055] Figure 1 , Figure 4 and Figure 5 For the sake of simplicity and clarity, the following has been omitted. Figure 2 The illustration shows the resin structure 71. Furthermore, Figure 5In this context, the thickness of the portion of the top plate 20 facing the refrigerant flow section 92 in the z-axis direction is represented by T1, the thickness of the thick-walled portion 36-2 of the side wall 36 in the x-axis direction is represented by T2, and the thickness of the bottom plate 64 in the z-axis direction is represented by T3. Furthermore, Figure 6 In the middle, it is represented by a dashed line. Figure 1 The metal layers 85 of the U-phase unit 70U, V-phase unit 70V and W-phase unit 70W shown.

[0056] The semiconductor module 100 includes a semiconductor device 70 and a cooling device 10. In this embodiment, the semiconductor device 70 is mounted on the cooling device 10. In this embodiment, the surface of the cooling device 10 on which the semiconductor device 70 is mounted is designated as the xy-plane, and the axis perpendicular to the xy-plane is designated as the z-axis. The xyz-axis forms a right-handed coordinate system. In this embodiment, the direction from the cooling device 10 toward the semiconductor device 70 in the z-axis direction is referred to as "upper," and the opposite direction is referred to as "lower," but the upper and lower directions are not limited to the direction of gravity. Furthermore, in this embodiment, the surface on the upper side of each component is referred to as the upper surface, the surface on the lower side is referred to as the lower surface, and the surface between the upper and lower surfaces is referred to as the side surface. In this embodiment, a top view represents the semiconductor module 100 as viewed from the positive or negative z-axis direction.

[0057] The semiconductor device 70 includes a semiconductor chip 78 and a circuit board 76 on which the semiconductor chip 78 is mounted. In this embodiment, the semiconductor device 70 includes three circuit boards 76 arranged along the y-axis on the cooling device 10. Each circuit board 76 may mount one or more semiconductor chips 78. In this embodiment, each circuit board 76 mounts two semiconductor chips 78, and the two semiconductor chips 78 are arranged along the y-axis on the circuit board 76. Furthermore, the semiconductor device 70 of this embodiment also includes a resin structure 71 for sealing the semiconductor chips 78.

[0058] In this embodiment, the semiconductor module 100 functions as a device constituting a three-phase AC inverter. For example... Figure 1 As shown, the semiconductor device 70 of this embodiment is a power semiconductor device, comprising: a U-phase unit 70U including a circuit board 76 and semiconductor chips 78-1 and 78-4; a V-phase unit 70V including a circuit board 76 and semiconductor chips 78-2 and 78-5; and a W-phase unit 70W including a circuit board 76 and semiconductor chips 78-3 and 78-6. Furthermore, each semiconductor chip 78 of the U-phase unit 70U, V-phase unit 70V, and W-phase unit 70W serves as a heat source for the semiconductor module 100 to generate heat during operation.

[0059] Semiconductor chip 78 is a vertical semiconductor device with an upper surface electrode and a lower surface electrode. As an example, semiconductor chip 78 includes components such as an insulated-gate bipolar transistor (IGBT), a MOSFET, and a current-driven diode (FWD) formed on a semiconductor substrate such as silicon. Semiconductor chip 78 can also be a reverse-conducting IGBT (RC-IGBT) where the IGBT and FWD are formed on a single semiconductor substrate. In an RC-IGBT, the IGBT and FWD can be connected in parallel in reverse.

[0060] The lower surface electrode of the semiconductor chip 78 is connected to the upper surface of the circuit substrate 76. In this embodiment, the semiconductor chip 78 is fixed to the upper surface of the circuit substrate 76 by solder 79. The upper surface electrode of the semiconductor chip 78 can be an emitter, source, or anode electrode, and the lower surface electrode can be a collector, drain, or cathode electrode. The semiconductor substrate in the semiconductor chip 78 can be silicon carbide (SiC) or gallium nitride (SiN).

[0061] The semiconductor chip 78, which includes switching elements such as IGBTs and MOSFETs, has control electrodes. The semiconductor module 100 may have control terminals connected to the control electrodes of the semiconductor chip 78. The switching elements can be controlled by an external control circuit via the control terminals.

[0062] like Figure 5 As shown, the circuit board 76 is a laminated substrate that sequentially includes an insulating plate 81 having an upper surface and a lower surface, a circuit layer 83 disposed on the upper surface of the insulating plate 81, and a metal layer 85 disposed on the lower surface of the insulating plate 81.

[0063] The circuit board 76 has an upper surface and a lower surface, with the lower surface disposed on the upper surface of the cooling device 10. In this embodiment, the circuit board 76 is fixed to the upper surface of the cooling device 10 via a metal layer 85 and solder 79. Furthermore, as an example, two semiconductor chips 78 are fixed on the upper surface of the circuit board 76 in this embodiment.

[0064] The circuit board 76 can be, for example, a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Brazing) substrate. The insulating plate 81 in this embodiment comprises ceramic. The insulating plate 81 can be formed using ceramic materials such as alumina (Al2O3), aluminum nitride (AlN), or silicon nitride (Si3N4). The insulating plate 81 in this embodiment is rectangular when viewed from above.

[0065] In this application's specification, a rectangle can refer to a quadrilateral or a rectangular shape. Furthermore, at least one corner can be a chamfered shape or a smooth shape. For example, a rectangle can include octagons, dodecagons, hexagons, etc., where all four corners are chamfered.

[0066] The circuit layer 83 and the metal layer 85 can be a substrate containing conductive materials such as copper or copper alloys. In this embodiment, the circuit layer 83 and the metal layer 85, like the insulating board 81, are rectangular when viewed from above.

[0067] The circuit layer 83 is fixed to the upper surface of the insulating plate 81 by solder or brazing. The upper surface of the circuit layer 83 is electrically and mechanically connected to the semiconductor chip 78 by solder or the like, that is, directly connected in a way that forms a circuit. In addition, the circuit layer 83 can be electrically connected to other conductive components by wires or the like. Furthermore, the circuit layer 83 can also be directly bonded to the upper surface of the insulating plate 81 (DCB: Direct Copper Bonding).

[0068] The resin structure 71 appears rectangular when viewed from above, more specifically, it is a rectangle with a long side and a short side. For example... Figure 2 As shown, the resin structure 71 of this embodiment includes a sealing portion 74 for sealing the semiconductor chip 78 and a receiving portion 72 surrounding the sealing portion 74. The sealing portion 74 is an insulating member containing, for example, a resin such as silicone or epoxy resin. In this embodiment, the sealing portion 74 not only seals the semiconductor chip 78, but also seals the circuit board 76 and other circuit elements.

[0069] The housing 72 is a shell formed of an insulating material such as a thermosetting resin or an ultraviolet-curable resin. In this embodiment, the housing 72 is provided on the upper surface 22 of the top plate 20 and surrounds the area where the circuit board 76 and the like are disposed. In other words, the housing 72 of this embodiment has an internal space capable of housing the semiconductor chip 78, the circuit board 76, and other circuit elements. The housing 72 can be bonded to the upper surface of the top plate 20. As an example, the sealing portion 74 is formed by filling the internal space of the housing 72 with the aforementioned resin and then curing it. Alternatively, the resin structure 71 may not include the housing 72, but only the sealing portion 74.

[0070] In the housing 72, a plurality of conductive connection portions 73 are embedded and formed. One end of each of the plurality of conductive connection portions 73 is electrically connected to the semiconductor device 70, and the other end is electrically connected to an external device. The plurality of conductive connection portions 73 respectively constitute any one of the input terminal and output terminal (N terminal, P terminal) of the semiconductor device 70.

[0071] Furthermore, the resin structure 71 of this embodiment includes at least three through holes 77 corresponding to the holes for inserting fasteners in the cooling device 10. The through holes 77 penetrate the resin structure 71 along the z-axis. The resin structure 71 of this embodiment includes a first through hole 77-1, a second through hole 77-2, a third through hole 77-3, a fourth through hole 77-4, a fifth through hole 77-5, and a sixth through hole 77-6. Viewed from above, the first through hole 77-1, the third through hole 77-3, the fifth through hole 77-5, and the sixth through hole 77-6 are located at the four corners of the rectangle of the resin structure 71.

[0072] The cooling device 10 has a top plate 20, a side wall 36, a bottom plate 64, a refrigerant flow section 92, an inlet 41, an outlet 42, and a plurality of fins 94. In this embodiment, the top plate 20, the side wall 36, and the plurality of fins 94 are sometimes collectively referred to as the substrate 40. The cooling device 10 of this embodiment also has a reinforcing section 25.

[0073] The top plate 20 is a plate-shaped member having a main surface that is laid flat on the xy plane. A circuit board 76 of the semiconductor device 70 is fixed to the main surface of the top plate 20. In this embodiment, a resin structure 71 is also fixed to the main surface of the top plate 20. The top plate 20 of this embodiment is rectangular when viewed from above, and more specifically, a rectangle having a long side and a short side. The short side of the top plate 20 of this embodiment is parallel to the x-axis, and the long side is parallel to the y-axis. Furthermore, in this application's specification, when referred to as a rectangle, square, quadrilateral, rhombus, polygon, etc., these shapes may also be shapes obtained by chamfering at least one corner or smooth shapes.

[0074] The top plate 20 includes at least three through holes 80 for inserting fasteners such as bolts, bosses, screws, etc., to secure the semiconductor module 100 to an external device. The through holes 80 extend through the top plate 20 along the z-axis. In this embodiment, the top plate 20 includes a first through hole 80-1, a second through hole 80-2, a third through hole 80-3, a fourth through hole 80-4, a fifth through hole 80-5, and a sixth through hole 80-6. Viewed from above, the first through hole 80-1, the third through hole 80-3, the fifth through hole 80-5, and the sixth through hole 80-6 are located at the four corners of the rectangle of the top plate 20.

[0075] like Figure 3 As shown, the top plate 20 has an upper surface (front side) 22 and a lower surface (back side) 24 parallel to the xy plane. As an example, the top plate 20 can be formed of metal, more specifically, for example, a metal containing aluminum. The top plate 20 may have a plating such as nickel formed on its front side.

[0076] In this embodiment, the circuit board 76 of the semiconductor device 70 is directly fixed to the upper surface 22 of the top plate 20 by solder 79. More specifically, the metal layer 85 of the circuit board 76 is bonded to the main surface of the top plate 20 by solder 79. Heat generated in each semiconductor chip 78 is transferred to the top plate 20. The top plate 20, the circuit board 76, and the semiconductor chips 78 are arranged in this order facing the positive z-axis. The top plate 20 and the circuit board 76, as well as the circuit board 76 and the semiconductor chips 78, can be thermally connected. In this embodiment, the components are fixed together by solder 79, and the components are thermally connected via the solder 79. In addition, the aforementioned receiving portion 72 is also bonded to the main surface of the top plate 20 in this embodiment by adhesive.

[0077] The sidewall 36 is connected to the top plate 20. In this embodiment, the sidewall 36 and the top plate 20 are integrally formed, extending from the top plate 20 along the negative z-axis. The sidewall 36 forms the side of the cooling device 10. As an example, the sidewall 36 is formed of metal, and more specifically, as an example, it is formed of a metal containing aluminum, like the top plate 20.

[0078] like Figure 6 As shown, the sidewall 36 of this embodiment includes a thin-walled portion 36-1 and a thick-walled portion 36-2. The thicknesses of the thin-walled portion 36-1 and the thick-walled portion 36-2 are different in a cross-section parallel to the main surface of the top plate 20. The thin-walled portion 36-1 has a substantially fixed thickness, for example, it may be more than 1 mm and less than 3 mm. The thick-walled portion 36-2 is thicker than the thin-walled portion 36-1, and its thickness varies continuously along the continuous direction of the sidewall 36. The thin-walled portion 36-1 and the thick-walled portion 36-2 are continuously alternated along the continuous direction of the sidewall 36.

[0079] The sidewall 36 of this embodiment has a generally rectangular outline in the xy-plane, more specifically, a rectangular outline with a long side and a short side. In the xy-plane, the outline of the sidewall 36 of this embodiment is located further inward than the outline of the top plate 20. Furthermore, the outline can refer to a line drawn along the shape of an object.

[0080] The base plate 64 is connected to the side wall 36 and faces the top plate 20. In this embodiment, the base plate 64 is a plate-shaped member. When viewed from above, the base plate 64 is rectangular, more specifically, a rectangle with a long side and a short side. Furthermore, the short side of the base plate 64 in this embodiment is parallel to the x-axis, and the long side is parallel to the y-axis.

[0081] Like the top plate 20, the base plate 64 also includes at least three through holes 65 for inserting fasteners, such as bosses, to secure the semiconductor module 100 to an external device. The through holes 65 extend through the base plate 64 along the z-axis. In this embodiment, the base plate 64 includes a first through hole 65-1, a second through hole 65-2, a third through hole 65-3, a fourth through hole 65-4, a fifth through hole 65-5, and a sixth through hole 65-6. Viewed from above, the first through hole 65-1, the third through hole 65-3, the fifth through hole 65-5, and the sixth through hole 65-6 are located at the four corners of the rectangle of the base plate 64.

[0082] In this embodiment, such as Figures 1 to 6 As shown, the first through hole 77-1 of the resin structure 71, the first through hole 80-1 of the top plate 20, and the first through hole 65-1 of the bottom plate 64 are coaxially arranged. Furthermore, the second through hole 77-2 of the resin structure 71, the second through hole 80-2 of the top plate 20, and the second through hole 65-2 of the bottom plate 64 are coaxially arranged. Additionally, the third through hole 77-3 of the resin structure 71, the third through hole 80-3 of the top plate 20, and the third through hole 65-3 of the bottom plate 64 are coaxially arranged.

[0083] Furthermore, the fourth through hole 77-4 of the resin structure 71, the fourth through hole 80-4 of the top plate 20, and the fourth through hole 65-4 of the bottom plate 64 are coaxially arranged. Additionally, the fifth through hole 77-5 of the resin structure 71, the fifth through hole 80-5 of the top plate 20, and the fifth through hole 65-5 of the bottom plate 64 are coaxially arranged. Furthermore, the sixth through hole 77-6 of the resin structure 71, the sixth through hole 80-6 of the top plate 20, and the sixth through hole 65-6 of the bottom plate 64 are coaxially arranged.

[0084] Therefore, the through hole 77 of the resin structure 71, the through hole 80 of the top plate 20, and the through hole 65 of the bottom plate 64 penetrate at least through the resin structure 71, the top plate 20, and the bottom plate 64 in one direction. Furthermore, the through holes 80 of the top plate 20 and 65 of the bottom plate 64, which are coaxially arranged, can also penetrate the top plate 20, the side wall 36, and the bottom plate 64 in one direction. In this embodiment, as... Figures 3 to 6 As shown, the first through hole 80-1 to the fifth through hole 80-5 of the top plate 20 and the first through hole 65-1 to the fifth through hole 65-5 of the bottom plate 64 are each grouped and penetrate the top plate 20, the side wall 36 and the bottom plate 64 along the z-axis direction.

[0085] The first through holes 80-1 and the first through holes 65-1 are formed in the thick-walled portion 36-2 of the sidewall 36. As a result, the refrigerant flow portion 92 can be enlarged to improve cooling efficiency without increasing the size of the semiconductor module 100, and the rigidity can be improved to withstand the strong fastening forces that may be applied when the semiconductor module 100 is firmly fastened to an external device using bolts or the like.

[0086] Additionally, on the inner surfaces of the through holes 80 and 65 that penetrate the top plate 20, side wall 36, and bottom plate 64 in one direction, thread grooves that are complementary to the thread tooth shape of the screws that engage therema can also be formed. The inner surface can also be a smooth curved surface as a whole, or a smooth curved surface in which the thread grooves are formed in part.

[0087] like Figure 5 As shown, the thickness T1 of the portion of the top plate 20 facing the refrigerant flow section 92 in the z-axis direction is thinner than the representative thickness T2 of the thick-walled portion 36-2 of the sidewall 36 in the xy plane and the thickness T3 of the bottom plate 64 in the z-axis direction. By reducing the thickness of the top plate 20, the heat dissipated by the semiconductor device 70 disposed on the upper surface 22 of the top plate 20 can be efficiently transferred to the refrigerant flowing in the refrigerant flow section 92.

[0088] On the other hand, the strength of the portion of the top plate 20 in which the through hole 80 is formed is higher than the strength of the portion of the thick-walled portion 36-2 of the side wall 36 that extends in the negative z-axis direction and faces the refrigerant flow portion 92. Therefore, it is possible to prevent the top plate 20 from breaking due to the aforementioned fastening force.

[0089] Furthermore, by arranging multiple thick-walled portions 36-2 continuously along the sidewall 36, the strength of the sidewall 36 can be improved, thereby preventing the top plate 20 from deforming due to mechanical or thermal influences. Thus, the semiconductor module 100 can prevent large stresses and plastic deformations from occurring at the solder 79 where the semiconductor device 70 is fixed to the top plate 20.

[0090] Furthermore, the thickness T3 of the base plate 64 in the z-axis direction is greater than the thickness T1 of the portion of the top plate 20 facing the refrigerant flow section 92. This improves the overall rigidity of the cooling device 10.

[0091] The base plate 64 can be disposed directly or indirectly in close contact with the lower end of the side wall 36 in the negative z-axis direction. Indirect contact means that the lower end of the side wall 36 is in close contact with the base plate 64 through an adhesive 98, such as a sealing material, adhesive, or brazing material, provided between the lower end of the side wall 36 and the base plate 64. In this embodiment, the base plate 64 is disposed in close contact with the lower end of the side wall 36 via the adhesive 98. As an example, the base plate 64 is formed of metal, and more specifically, as an example, it is formed of a metal containing aluminum, like the substrate 40.

[0092] Alternatively, the lower end of the sidewall 36 and the base plate 64 are preferably brazed together. In this case, the brazing material is preferably a metal with a lower melting point than the base 40 and the base plate 64.

[0093] The refrigerant flow section 92 is a space for the flow of refrigerants such as LLC and water, and is defined by the top plate 20, side walls 36, and bottom plate 64. In other words, the side walls 36 are arranged in the xy plane to surround the refrigerant flow section 92, and the top plate 20 and bottom plate 64 are arranged in the z-axis direction to sandwich the refrigerant flow section 92 between them, facing each other. Therefore, the outline of the refrigerant flow section 92 in the xy plane is defined by the inner periphery of the side walls 36. Thus, the refrigerant flow section 92 is approximately rectangular when viewed from above. More specifically, as... Figure 6 As shown, the refrigerant flow section 92, in a cross-section parallel to the main surface of the top plate 20, is approximately rectangular with a long side 96 and a short side 93. Furthermore, in this embodiment, the direction of the long side 96 is the y-axis direction, and the direction of the short side 93 is the x-axis direction.

[0094] The refrigerant flow section 92 can be sealed by the top plate 20, the side wall 36, and the bottom plate 64. In this case, the lower end of the side wall 36 and the bottom plate 64 can be tightly attached. In addition, "tightly attached" means that the refrigerant inside the refrigerant flow section 92 will not leak out from the tightly attached part.

[0095] Inlet 41 is a hole for introducing refrigerant into refrigerant flow section 92, and it is formed on base plate 64. Outlet 42 is a hole for discharging refrigerant from refrigerant flow section 92, and it, like inlet 41, is also formed on base plate 64. By forming inlet 41 and outlet 42 on the thickest part of base plate 64 within the structure used to define refrigerant flow section 92, the strength of cooling device 10 can be improved, and the manufacturing of cooling device 10 can be simplified.

[0096] Inlet 41 and outlet 42 are located on one side of the cooling device 10 and the opposite side thereon in the x-axis direction, and on one side of the cooling device 10 and the opposite side thereon in the y-axis direction, respectively. That is, inlet 41 and outlet 42 are located at opposite ends of the refrigerant flow section 92, which is rectangular in the xy plane.

[0097] Multiple fins 94 are disposed in the refrigerant flow section 92 and extend in a manner connecting the top plate 20 and the bottom plate 64. The refrigerant flow section 92 includes a cooling region 95 with the multiple fins 94 disposed thereon. Furthermore, Figure 3 In the diagram, cooling areas 95 are represented by dots instead of fins 94. Additionally, in the following description, one or more fins 94 may sometimes be referred to simply as fin 94.

[0098] The cooling area 95 can appear rectangular when viewed from above. For example... Figure 6 As shown, the cooling area 95 in this embodiment is rectangular when viewed from above, with its short side parallel to the x-axis and its long side parallel to the y-axis.

[0099] In the cooling region 95 of this embodiment, the number of fins 94 arranged along the long side 96 of the refrigerant flow section 92 is greater than the number of fins 94 arranged along the short side 93 of the refrigerant flow section 92. The cooling region 95 includes a region provided with fins 94 and flow paths between the fins 94. In addition, the spacing between adjacent fins 94 can be narrower than the width of the fins 94 themselves.

[0100] The refrigerant flow section 92 also includes a first manifold 30-1 adjacent to one side of the cooling region 95 and a second manifold 30-2 adjacent to the opposite side of the cooling region 95. In other words, when viewed from above, the refrigerant flow section 92 includes the first manifold 30-1 and the second manifold 30-2 arranged to sandwich the cooling region 95 in the middle. In this embodiment, the first manifold 30-1 is adjacent to the negative side of the cooling region 95 in the x-axis direction, and the second manifold 30-2 is adjacent to the positive side of the cooling region 95 in the x-axis direction. These manifolds 30 refer to spaces in the refrigerant flow section 92 with a height of a predetermined height (length in the z-axis direction) or higher. The height of the predetermined height may be the distance between the top plate 20 and the bottom plate 64.

[0101] In this embodiment, the first manifold 30-1 is connected to the inlet 41 and does not have multiple fins 94. Similarly, in this embodiment, the second manifold 30-2 is connected to the outlet 42 and does not have multiple fins 94. In addition, the first manifold 30-1 and the second manifold 30-2 may be provided with, for example, blade fins for guiding refrigerant flow or needle-shaped fins for reinforcing the top plate 20.

[0102] Furthermore, in this embodiment, the first manifold 30-1 and the second manifold 30-2 extend along the y-axis direction when viewed from above, and the length in the y-axis direction is longer than the length in the x-axis direction.

[0103] As an example, fin 94 is formed of metal, and more specifically, as an example, it is formed of a metal containing aluminum, just like top plate 20.

[0104] The fin 94 has an upper end and a lower end facing each other in the z-axis direction. In this embodiment, the upper end of the fin 94 is thermally and mechanically connected to the lower surface 24 of the top plate 20. In this embodiment, the fin 94 and the top plate 20 are integrally formed; in other words, the fin 94 protrudes integrally from the lower surface 24 of the top plate 20. In this embodiment, the fin 94 extends from the lower surface 24 of the top plate 20 toward the refrigerant flow section 92 in the negative z-axis direction.

[0105] In this embodiment, the lower end of the fin 94 is bonded to the base plate 64 by adhesive 98. Furthermore, in this embodiment, the extending direction of the fin 94 is approximately orthogonal to the main surfaces of the top plate 20 and the base plate 64, respectively.

[0106] In this embodiment, the plurality of fins 94 are needle-shaped fins. Furthermore, in this embodiment, the cross-sectional shape of each of the plurality of fins 94 parallel to the main surface of the top plate 20 is rectangular. Therefore, compared to a fin with a circular cross-sectional shape, the surface area of ​​the fin 94 in contact with the refrigerant can be increased, thereby improving heat dissipation efficiency.

[0107] Furthermore, the plurality of fins 94 can also be arranged in the refrigerant flow section 92 such that, when refrigerant flows through the refrigerant flow section 92, none of the sides of the rectangle are orthogonal to the main flow direction of the refrigerant in the cooling region 95. In the example of this embodiment, the main flow direction of the refrigerant in the cooling region 95 is the x-axis direction. In this embodiment, the plurality of fins 94 are arranged in the refrigerant flow section 92 such that none of the sides of the rectangle are orthogonal to the x-axis direction. More specifically, the plurality of fins 94 in this embodiment are arranged in the refrigerant flow section 92 such that none of the sides of the rectangle are orthogonal to the x-axis direction, and one diagonal is parallel to the y-axis direction, while the other diagonal is parallel to the x-axis direction. Alternatively, the plurality of fins 94 can also be arranged in the refrigerant flow section 92 such that none of the sides of the rectangle are orthogonal to the x-axis direction, and one diagonal is inclined relative to the y-axis direction, while the other diagonal is inclined relative to the x-axis direction. Compared to the case where multiple fins are arranged in the refrigerant flow section 92 with any side of the rectangle orthogonal to the main flow direction, the refrigerant flow rate loss in the refrigerant flow section 92 can be reduced by using any of the above structures, thereby improving heat dissipation efficiency.

[0108] Furthermore, in this embodiment, the fin 94 has a rhombus shape in cross-section in the xy plane, and the length of this rhombus in the direction of the short side 93 of the refrigerant flow section 92 is longer than its length in the direction of the long side 96. Additionally, of the pair of diagonals of this rhombus, the diagonal parallel to the long side 96 is shorter than the diagonal parallel to the short side 93. The length of each side of the rhombus cross-section of the fin 94 can be from 1.9 mm to 2.2 mm. Each corner of the rhombus cross-section can have a chamfer with a radius of curvature of 0.1 mm to 0.2 mm.

[0109] Furthermore, the cross-sectional shape of each of the plurality of fins 94 can be polygonal, for example, square. In this case, one diagonal of the positive direction can be arranged in the refrigerant flow section 92 along the direction from the first manifold 30-1 toward the second manifold 30-2.

[0110] Furthermore, multiple fins 94 can be arranged in a predetermined pattern within the xy plane of the refrigerant flow section 92. In this embodiment, the multiple fins 94 are as follows: Figure 6 As shown, they are arranged in an alternating pattern. Multiple fins 94 can be arranged squarely in the xy plane of the refrigerant flow section 92.

[0111] like Figure 6 As shown, in this embodiment, the metal layers 85 of the U-phase unit 70U, V-phase unit 70V, and W-phase unit 70W all partially overlap with the cooling region 95 when viewed from above, and the remaining portions overlap with the first manifold 30-1 and the second manifold 30-2. Alternatively, the metal layers 85 of the U-phase unit 70U, etc., may partially overlap with the cooling region 95 when viewed from above, and the remaining portions may overlap with one of the first manifold 30-1 and the second manifold 30-2, or they may overlap entirely with the cooling region 95.

[0112] like Figure 3 and Figure 6 As shown, the reinforcing portion 25 is located outside the refrigerant flow section 92 and is connected to the top plate 20 and the bottom plate 64. The aforementioned fifth through hole 80-5 and fifth through hole 65-5 penetrate the top plate 20, the reinforcing portion 25, and the bottom plate 64 along the z-axis. Furthermore, the reinforcing portion 25 can be connected to the side wall 36; in other words, it can be a part of the side wall 36. In this case, the reinforcing portion 25 constitutes a thick-walled portion 36-2 of the side wall 36.

[0113] Figure 7 This is a schematic bottom view showing an example of the base plate 64 of a semiconductor module 100 according to an embodiment of the present invention. Figure 7 In the diagram, the geometric centers of gravity of the through-hole 65, inlet 41, and outlet 42, viewed from above, are indicated by black dots. Furthermore, line segments used to illustrate the positions of their respective geometric centers of gravity are indicated by dashed lines. Additionally, the angle between two specific dashed lines is indicated by θ. Furthermore, in the following description, sometimes only the through-hole 65 of the base plate 64 in the semiconductor module 100 is described; however, the through-hole 80 of the top plate 20 and the through-hole 77 of the resin structure 71, which are coaxially positioned with the through-hole 65 of the base plate 64, are omitted from repeated descriptions.

[0114] Viewed from above, the geometric centroid of at least one of the openings, inlet 41 and outlet 42, lies inside an imaginary triangle with the three through holes 65 as vertices. Two of the three through holes 65 are located on either side of the opening. Furthermore, viewed from above, the perpendicular bisector of a line segment connecting points located inside each of the two through holes 65 passes through the opening. More preferably, viewed from above, the perpendicular bisector of a line segment connecting the geometric centroids of the two through holes 65 passes through the geometric centroid of the opening. Furthermore, it is preferable that the outer edge of the opening may lie inside the imaginary triangle with the three through holes 65 as vertices.

[0115] In this embodiment, when viewed from above, the first through hole 65-1 and the fourth through hole 65-4 are located on both sides of the inlet 41, and the second through hole 65-2 and the third through hole 65-3 are located on both sides of the outlet 42. Furthermore, when viewed from above, and viewed from a direction orthogonal to the line connecting the first through hole 65-1 and the fourth through hole 65-4, the second through hole 65-2 is located between the first through hole 65-1 and the fourth through hole 65-4.

[0116] like Figure 7 As shown, in this embodiment, further, when viewed from above, the geometric center of gravity of the inlet 41 is located inside the imaginary triangle A with the first through hole 65-1, the fourth through hole 65-4, and the second through hole 65-2 as vertices. Similarly, when viewed from above, the geometric center of gravity of the outlet 42 is located inside the imaginary triangle B with the second through hole 65-2, the third through hole 65-3, and the fourth through hole 65-4 as vertices.

[0117] In this embodiment, further, when viewed from a direction orthogonal to the line connecting the first through hole 65-1 and the fourth through hole 65-4, at least a portion of the second through hole 65-2 overlaps with the inlet 41. When viewed from a direction orthogonal to the line connecting the first through hole 65-1 and the fourth through hole 65-4, the geometric center of gravity of the second through hole 65-2 may coincide with the geometric center of gravity of the inlet 41. Similarly, in this embodiment, when viewed from a direction orthogonal to the line connecting the second through hole 65-2 and the third through hole 65-3, at least a portion of the fourth through hole 65-4 overlaps with the outlet 42. When viewed from a direction orthogonal to the line connecting the second through hole 65-2 and the third through hole 65-3, the geometric center of gravity of the fourth through hole 65-4 may coincide with the geometric center of gravity of the outlet 42.

[0118] Furthermore, in this embodiment, the outer edge of the inlet 41, when viewed from above, is located inside an imaginary triangle with the first through hole 65-1, the fourth through hole 65-4, and the second through hole 65-2 as vertices. Similarly, the outer edge of the outlet 42, when viewed from above, is located inside an imaginary triangle with the third through hole 65-3, the second through hole 65-2, and the fourth through hole 65-4 as vertices. This configuration improves the sealing performance of the refrigerant flow path through the inlet 41 and the outlet 42.

[0119] In addition, such as Figure 7 As shown, in this embodiment, the line connecting the first through hole 65-1 and the fourth through hole 65-4 is preferably parallel to the line connecting the third through hole 65-3 and the second through hole 65-2. Furthermore, in this embodiment, the angle θ formed by the line connecting the first through hole 65-1 and the fourth through hole 65-4 and the line connecting the second through hole 65-2 and the fourth through hole 65-4 is preferably an acute angle.

[0120] Figure 8 This is a schematic perspective view showing an example of a semiconductor module 100 according to an embodiment of the present invention being mounted on a refrigerant supply unit 130. Furthermore, Figure 9 This is a schematic perspective view showing an example of the state after the semiconductor module 100 according to an embodiment of the present invention is installed on the refrigerant supply unit 130.

[0121] In this embodiment, the inlet 41 and outlet 42 formed on the base plate 64 are respectively connected to the inlet 141 and outlet 142 of the external refrigerant supply unit 130, forming a refrigerant flow path between the cooling device 10 and the refrigerant supply unit 130. The inlet 141 and outlet 142 are respectively connected to the inlet pipe 143 and outlet pipe 144 formed inside the refrigerant supply unit 130. The inlet 141 and outlet 142 are respectively formed on the flange of the refrigerant supply unit 130.

[0122] The refrigerant supply unit 130 allows refrigerant to flow from the inlet pipe 143 and inlet port 141 into the refrigerant circulation section 92 through inlet 41, and allows the refrigerant flowing through the refrigerant circulation section 92 to flow out through outlet 42 through outlet port 142 and outlet pipe 144. Therefore, the cooling device 10 receives refrigerant from the external refrigerant supply unit 130 through inlet 41, and after circulating inside the refrigerant circulation section 92, the refrigerant is discharged to the refrigerant supply unit 130 through outlet 42.

[0123] here, Figure 9The diagram shows the semiconductor module 100 fastened to the refrigerant supply unit 130 by fasteners 120. When the semiconductor module 100 is fastened to the refrigerant supply unit 130 using fasteners 120, a strong fastening force applied by the fasteners 120 is applied to the cooling device 10 of the semiconductor module 100 through the through-hole 77 of the resin structure 71, the through-hole 80 of the top plate 20, and the through-hole 65 of the bottom plate 64 to improve the sealing of the refrigerant flow path. The inlet 41 and outlet 42 of the cooling device 10 are pressed against the inlet 141 and outlet 142 of the refrigerant supply unit 130 by a sealing element, such as a rubber O-ring. The openings of the inlet 41 and outlet 42, when viewed from above, can be chamfered rectangles, rectangles, circles, or ellipses. A sealing surface can be provided on the lower surface of the bottom plate 64 to support the sealing element around the openings of the inlet 41 and outlet 42.

[0124] According to the semiconductor module 100 of this embodiment described above, the top plate 20 and bottom plate 64 of the cooling device 10 include at least three sets of through holes 80 and 65 for inserting fasteners 120. Further, according to the semiconductor module 100, when viewed from above, the geometric center of gravity of the opening of at least one of the inlet 41 and outlet 42 is located inside an imaginary triangle with the three sets of through holes 80 and 65 as vertices. With this structure, when the semiconductor module 100 is mounted on an external device such as a refrigerant supply unit 130, the seals disposed around the opening can be uniformly compressed from three different directions, thereby effectively preventing leakage in the refrigerant flow path formed between the module and the external device.

[0125] In addition, such as Figure 2 and Figure 9 As shown, the resin structure 71 includes a recess 75 for receiving the head of a screw when the fastener 120 is a screw. The recess 75 prevents the head of the screw from protruding outside the resin structure 71 when the semiconductor module 100 is fastened to an external device by inserting the screw into the through hole 77 or the like.

[0126] Furthermore, the semiconductor module 100 of this embodiment has a configuration structure in which the main flow direction (positive x-axis direction) of the refrigerant flowing through the cooling device 10 is orthogonal to the arrangement direction (y-axis direction) of the plurality of heat sources. For example, if there are a plurality of heat sources such as semiconductor chips 78 on the top plate 20 of the cooling device 10 along the y-axis direction, if the main flow direction of the refrigerant flowing through the cooling device 10 is parallel to the arrangement direction (y-axis direction) of the heat sources, the heat sources will not be cooled uniformly.

[0127] In contrast, according to the semiconductor module 100 of this embodiment, the cross-section of the refrigerant flow section 92 parallel to the main surface of the top plate 20 (on the xy plane) is a rectangle with a long side 96 and a short side 93. The refrigerant is introduced into the refrigerant flow section 92 from an inlet 41 connected to one side in the direction of the short side 93 (x-axis direction), diffuses throughout the entire refrigerant flow section 92, and is then discharged from an outlet 42 connected to the other side in the direction of the short side 93 (x-axis direction). The refrigerant contacts the lower surface 24 and fins 94 of the top plate 20, on which the circuit board 76 is placed, cooling each semiconductor chip 78 of the semiconductor device 70. In other words, the heat generated by each semiconductor chip 78 moves into the refrigerant passing through the top plate 20 and near the fins 94.

[0128] Thus, according to the semiconductor module 100 of this embodiment, the cooling device 10 can efficiently cool the heat generated by each semiconductor chip 78 arranged along the y-axis direction on the upper surface of the cooling device 10 using a refrigerant.

[0129] In the above embodiments, the top plate 20, sidewall 36, and fins 94 forming the substrate 40 can be integrally formed. In this embodiment, the top plate 20, sidewall 36, and fins 94 can be integrally formed. For example, the top plate 20, sidewall 36, and fins 94 can be integrally formed from a continuous plate-like member.

[0130] For example, the top plate 20, sidewall 36, and fins 94 can be integrally formed by stamping a continuous plate-like component using a die corresponding to the shape of the top plate 20, sidewall 36, and fins 94. Alternatively, they can be integrally formed by any forging method, such as cold forging at room temperature, warm forging at high temperature, hot forging, or liquid forging, using an impact press, or by casting. By integrally forming the top plate 20, sidewall 36, and fins 94, the semiconductor module 100 of this embodiment reduces the number of components compared to forming them separately and then bonding them together.

[0131] Figure 10 This is a schematic bottom view showing an example of a modified version of the base plate 64 of the semiconductor module 100 according to an embodiment of the present invention, namely, a base plate 67. Figure 11 This is a schematic bottom view showing an example of a modified version of the base plate 64 of the semiconductor module 100 according to an embodiment of the present invention, namely, a base plate 68.

[0132] Figure 10 and Figure 11 In the figure, only the base plate 67 and base plate 68 of the semiconductor module 100 are shown, and illustrations of other structures in the semiconductor module 100 are omitted. Furthermore, in... Figure 10and Figure 11 In, with Figure 7 Similarly, when viewed from above, the geometric centers of gravity of the through-hole 65, inlet 41, and outlet 42 are indicated by black dots. Furthermore, lines used to indicate the location of their respective geometric centers of gravity are indicated by dashed lines.

[0133] In addition, Figure 10 and Figure 11 In the variant example shown, and with the use of Figures 1-9 Compared to the semiconductor module 100 in the described embodiments, only the configuration, quantity, and / or size of specific structures differ; their functions and uses are the same. Therefore, Figure 10 and Figure 11 Use and utilization of the various structures in the modified examples shown Figures 1-9 Reference numerals that are the same for all structures in the described embodiments are omitted.

[0134] Figure 10 In the modified example shown, when viewed from above, the perpendicular bisector of the line segment connecting the geometric centroids of the first through hole 65-1 and the fourth through hole 65-4 passes through the geometric centroid of the inlet 41. Furthermore, in this embodiment, when viewed from above, the first through hole 65-1 and the fourth through hole 65-4 are located on either side of the inlet 41, and the second through hole 65-2 and the third through hole 65-3 are located on either side of the outlet 42. Moreover, when viewed from above, and viewed from a direction orthogonal to the line connecting the first through hole 65-1 and the fourth through hole 65-4, the second through hole 65-2 is located between the first through hole 65-1 and the fourth through hole 65-4.

[0135] In addition, such as Figure 10 As shown, in this embodiment, further, when viewed from above, the geometric center of gravity of the inlet 41 is located inside the imaginary triangle A with the first through hole 65-1, the fourth through hole 65-4, and the second through hole 65-2 as vertices. Similarly, when viewed from above, the geometric center of gravity of the outlet 42 is located inside the imaginary triangle B with the second through hole 65-2, the third through hole 65-3, and the fourth through hole 65-4 as vertices.

[0136] In this embodiment, further, when viewed from a direction orthogonal to the line connecting the first through hole 65-1 and the fourth through hole 65-4, at least a portion of the second through hole 65-2 overlaps with the fourth through hole 65-4, and at least a portion of the fifth through hole 65-5 overlaps with the third through hole 65-3. Furthermore, when viewed from a direction orthogonal to the line connecting the first through hole 65-1 and the fourth through hole 65-4, at least a portion of the sixth through hole 65-6 overlaps with the first through hole 65-1.

[0137] Furthermore, in this embodiment, the outer edge of the inlet 41, when viewed from above, is located inside an imaginary triangle with the first through hole 65-1, the fourth through hole 65-4, and the second through hole 65-2 as vertices. Similarly, the outer edge of the outlet 42, when viewed from above, is located inside an imaginary triangle with the third through hole 65-3, the second through hole 65-2, and the fourth through hole 65-4 as vertices. The semiconductor module 100 according to this modified example can also achieve the same effect as described above.

[0138] Figure 11 The base plate 68 of the modified example shown is identical to the one using the method of... except that it does not contain the fifth through hole 65-5 and the sixth through hole 65-6. Figures 1-9 The structure of the base plate 64 described is the same. The semiconductor module 100 according to this modified example can also achieve the same effect as described above.

[0139] Figure 12 This is a schematic diagram illustrating a vehicle 200 according to one embodiment of the present invention. The vehicle 200 is a vehicle that uses electricity to generate at least a portion of its propulsion. As an example, the vehicle 200 is an electric vehicle that uses an electric drive device such as an electric motor to generate all its propulsion, or a hybrid vehicle that uses both an electric drive device such as an electric motor and an internal combustion engine that uses fuel such as gasoline for propulsion.

[0140] The vehicle 200 is equipped with a control device 210 (external device) for controlling electric drive equipment such as electric motors. The control device 210 includes a semiconductor module 100. The semiconductor module 100 can control the power supplied to the electric drive equipment.

[0141] Figure 13 This is a main circuit diagram of the semiconductor module 100 according to various embodiments of the present invention. The semiconductor module 100 can function as a three-phase inverter circuit with output terminals U, V and W, and is part of an on-board unit for driving a vehicle's electric motor.

[0142] In semiconductor module 100, semiconductor chips 78-1, 78-2, and 78-3 can form the upper arm, and semiconductor chips 78-4, 78-5, and 78-6 can form the lower arm. A group of semiconductor chips 78-1 and 78-4 can form a branch (U phase). Similarly, a group of semiconductor chips 78-2 and 78-5, and a group of semiconductor chips 78-3 and 78-6 can also form branches (V phase and W phase). In semiconductor chip 78-4, the emitter can be electrically connected to the input terminal N1, and the collector can be electrically connected to the output terminal U. In semiconductor chip 78-1, the emitter can be electrically connected to the output terminal U, and the collector can be electrically connected to the input terminal P1. Similarly, in semiconductor chips 78-5 and 78-6, the emitters can be electrically connected to the input terminals N2 and N3, respectively, and the collectors can be electrically connected to the output terminals V and W, respectively. In addition, in semiconductor chips 78-2 and 78-3, the emitter can be electrically connected to the output terminals V and W respectively, and the collector can be electrically connected to the input terminals P2 and P3 respectively.

[0143] Each semiconductor chip 78-1 to 78-6 can alternately switch on and off according to the signal input to the corresponding control terminal. In this embodiment, each semiconductor chip 78 can generate heat when switching on and off. Input terminals P1, P2, and P3 can be connected to the positive terminal of an external power supply, input terminals N1, N2, and N3 can be connected to the negative terminal of an external power supply, and output terminals U, V, and W can be connected to the load. Input terminals P1, P2, and P3 can be electrically connected to each other, and other input terminals N1, N2, and N3 can also be electrically connected to each other.

[0144] In semiconductor module 100, multiple semiconductor chips 78-1 to 78-6 can each be an RC-IGBT (reverse conduction IGBT) semiconductor chip. Furthermore, semiconductor chips 78-1 to 78-6 can each contain combinations of transistors and diodes such as MOSFETs and IGBTs.

[0145] In the description of the above multiple embodiments, terms such as "approximately orthogonal", "approximately the same", "approximately consistent", "approximately fixed", "approximately symmetrical", "approximately rhomboid", "approximately rectangular" and other terms using the word "approximately" are sometimes used to express a specific state. These expressions not only include the specific state in a strict sense, but also include situations that are approximately the specific state.

[0146] The present invention has been described above using embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments. Various changes or improvements can be made based on the above embodiments, which will be apparent to those skilled in the art. As can be seen from the claims, such changes or improvements are also included within the technical scope of the present invention.

[0147] For example, in the above embodiment, the semiconductor module 100 is described as having a structure with three semiconductor devices 70, but it may also have one, two or more semiconductor devices 70 as an alternative.

[0148] For example, the fins 94 can be configured in a grid pattern, preferably in a diagonal grid pattern or a diamond grid pattern. As another example, the inlet 41 and outlet 42 can be adjacent to the cooling region 95 in the refrigerant flow section 92 and arranged diagonally. As yet another example, the openings of the inlet 41 and outlet 42 can have a length in the direction of the longer side 96 that is greater than the length in the direction of the shorter side 93 when viewed from above.

[0149] For example, in the above embodiment, a structure in which the top plate 20, sidewall 36, and fins 94 are formed integrally in the substrate 40 is described. However, alternatively, the top plate 20, sidewall 36, and fins 94 may be formed separately and then bonded together using an adhesive 98 or the like. Alternatively, the top plate 20 and sidewall 36 may be formed integrally, with the separately formed fins 94 bonded to the top plate 20. Alternatively, the top plate 20 and fins 94 may be formed integrally, with the separately formed sidewall 36 bonded to the top plate 20 using an adhesive 98 or the like. Alternatively, the sidewall 36 and bottom plate 64 may be formed integrally by, for example, broaching, with the separately formed top plate 20 bonded to the sidewall 36 using an adhesive 98 or the like, for example, by brazing. In this case, the sidewall 36 may extend outward in the xy plane, and this extending surface of the sidewall 36 is connected to the lower surface 24 of the top plate 20.

[0150] Furthermore, for example, in the above embodiment, a structure was described in which the fin 94 is integrally formed with the top plate 20 and extends towards the bottom plate 64. However, alternatively, the fin 94 may also be integrally formed with the bottom plate 64 and extend from the bottom plate 64 towards the top plate 20. In this case, an adhesive 98 or the like may be used to bond the front end of the fin 94 to the top plate 20.

[0151] Furthermore, for example, in the above embodiment, a structure was described in which the fin 94 extends along the normal direction of the main surface of the top plate 20 between the top plate 20 and the bottom plate 64, that is, extends perpendicularly to the top plate 20 and the bottom plate 64. However, alternatively, the fin 94 may extend at an angle relative to the normal direction of the main surface of the top plate 20 between the top plate 20 and the bottom plate 64. In addition, the dimensions of the cross-section of the fin 94 in the xy plane can be fixed or variable in the z-axis direction. More specifically, as an example, the leading edge gradually tapers from one direction of the top plate 20 and the bottom plate 64 to the other.

[0152] Furthermore, for example, in the above embodiment, it is described that the plurality of fins 94 are needle-shaped fins, but instead, they may be plate-shaped blades, or for example, the shape of the cross section parallel to the main surface of the base plate 20 is an elongated rectangle.

[0153] Furthermore, for example, in the accompanying drawings of the above embodiments, a broken line is used to illustrate the inner side of the sidewall 36 when viewed from above, but it is not limited to a broken line; it can also be a straight line or a curve. For example, when viewed from above, the inner side of the sidewall 36, etc., can be a curve that bulges out in an arc towards the refrigerant flow section 92, or it can be a curve that curves down in an arc towards the opposite side.

[0154] Please note that the execution order of actions, processes, steps, and stages in the apparatus, systems, programs, and methods shown in the claims, specification, and drawings can be implemented in any order, unless explicitly stated as "before," "prior to," or the output of a previous process is used in a subsequent process. The use of terms such as "firstly," "next," etc., in the action flow of the claims, specification, and drawings for ease of explanation does not imply that the actions must be performed in that order.

[0155] Label Explanation

[0156] 10 Cooling device; 20 Base plate; 22 Upper surface; 24 Lower surface; 25 Reinforcing part; 30 Manifold; 30-1 First manifold; 30-2 Second manifold; 36 Side wall; 36-1 Thin-walled part; 36-2 Thick-walled part; 40 Substrate; 41 Inlet; 42 Outlet; 64, 67, 68 Base plate; 65 Through hole; 65-1 First through hole; 65-2 Second through hole; 65-3 Third through hole; 65-4 Fourth through hole; 65-5 Fifth through hole; 65-6 Sixth through hole; 70 Semiconductor device; 70U U-phase unit; 70V V-phase unit; 70W W-phase unit; 71 Resin structure; 73 Conductive connection part; 75 Recessed part; 77 Through hole; 77-1 First through hole; 77-2 Second through hole; 77-3 Third through hole; 77-4 Fourth through hole; 77-5 Fifth through hole; 77-6 Sixth through hole; 72 Receiving part; 74 Sealing part; 76 Circuit board; 78 Semiconductor chip; 79 Solder; 80 Through hole; 80-1 First through hole; 80-2 Second through hole; 80-3 Third through hole; 80-4 Fourth through hole; 80-5 Fifth through hole; 80-6 Sixth through hole; 81 Insulating board; 83 Circuit layer; 85 Metal layer; 92 Refrigerant flow section; 93 Short side; 96 Long side; 94 Fin; 95 Cooling area; 98 Adhesive; 100 Semiconductor module; 120 Fastener; 130 Refrigerant supply unit; 131 Through hole; 131-1 First through hole; 131-2 Second through hole; 131-3 Third through hole; 131-4 Fourth through hole; 131-5 Fifth through hole; 131-6 Sixth through hole; 141 Inlet; 142 Outlet; 143 Inlet pipe; 144 Outlet pipe; 200 Vehicle; 210 Control device.

Claims

1. A semiconductor module comprising a semiconductor device and a cooling device, characterized in that, The semiconductor device has a semiconductor chip and a circuit board on which the semiconductor chip is mounted. The cooling device includes: A top plate on the circuit board to which the semiconductor device is fixed on the main surface; The sidewall connected to the top plate; A bottom plate that is connected to the sidewall and faces the top plate; A refrigerant flow section defined by the top plate, the side wall, and the bottom plate and used for the flow of refrigerant; An inlet formed on the base plate and used to introduce refrigerant into the refrigerant flow section; An outlet formed on the base plate for discharging refrigerant from the refrigerant flow section; and Multiple fins are disposed in the refrigerant flow section and extend between the top plate and the bottom plate. The top plate and the bottom plate include through holes for inserting fasteners to secure the semiconductor module to an external device, specifically three through holes penetrating the top plate and the bottom plate respectively in one direction. When viewed from above, the geometric centroid of the opening of at least one of the inlet and the outlet lies inside an imaginary triangle with the three through holes as vertices. At least one of the three through holes penetrates the top plate, the side wall, and the bottom plate in one direction. The sidewall includes a thin-walled portion and a thick-walled portion, and the at least one through hole is formed in the thick-walled portion.

2. The semiconductor module as described in claim 1, characterized in that, Two of the three through holes are located on either side of the opening. When viewed from above, the perpendicular bisector of the line segment formed by connecting the points located inside each of the two through holes passes through the opening.

3. The semiconductor module as described in claim 2, characterized in that, When viewed from above, the perpendicular bisector of the line segment obtained by connecting the geometric centroids of the two through holes passes through the geometric centroid of the opening.

4. The semiconductor module according to any one of claims 1 to 3, characterized in that, The outer edge of the opening is located inside an imaginary triangle with the three through holes as vertices.

5. The semiconductor module according to any one of claims 1 to 3, characterized in that, The through hole includes a first through hole, a second through hole, a third through hole, and a fourth through hole. Viewed from above, the first through hole and the fourth through hole are located on either side of the inlet, and the second through hole and the third through hole are located on either side of the outlet. Viewed from above, and taken from a direction orthogonal to the line connecting the first through hole and the fourth through hole, the second through hole is located between the first through hole and the fourth through hole. Viewed from above, the geometric center of gravity of the entrance is located inside an imaginary triangle with the first through hole, the fourth through hole, and the second through hole as its vertices. When viewed from above, the geometric center of gravity of the outlet is located inside an imaginary triangle with the second through hole, the third through hole, and the fourth through hole as its vertices.

6. The semiconductor module as described in claim 5, characterized in that, When viewed from a direction orthogonal to the line connecting the first through hole and the fourth through hole, at least a portion of the second through hole overlaps with the inlet.

7. The semiconductor module as described in claim 6, characterized in that, When viewed from a direction orthogonal to the line connecting the first through hole and the fourth through hole, the geometric center of gravity of the second through hole coincides with the geometric center of gravity of the entrance.

8. The semiconductor module as described in claim 6 or 7, characterized in that, When viewed from a direction orthogonal to the line connecting the second through hole and the third through hole, at least a portion of the fourth through hole overlaps with the outlet.

9. The semiconductor module as described in claim 8, characterized in that, When viewed from a direction orthogonal to the line connecting the second and third through holes, the geometric center of gravity of the fourth through hole coincides with the geometric center of gravity of the outlet.

10. The semiconductor module as described in claim 5, characterized in that, The line connecting the first through hole and the fourth through hole is parallel to the line connecting the third through hole and the second through hole. The line connecting the first through hole and the fourth through hole forms an acute angle with the line connecting the second through hole and the fourth through hole.

11. The semiconductor module as described in claim 5, characterized in that, The top plate and the bottom plate are rectangular when viewed from above. The through hole also includes a fifth through hole. When viewed from a direction orthogonal to the line connecting the first through hole and the fourth through hole, at least a portion of the second through hole overlaps with the fourth through hole, and at least a portion of the fifth through hole overlaps with the third through hole.

12. The semiconductor module as claimed in claim 11, characterized in that, The through hole also includes a sixth through hole. When viewed from a direction orthogonal to the line connecting the first through hole and the fourth through hole, at least a portion of the sixth through hole overlaps with the first through hole.

13. The semiconductor module as described in claim 12, characterized in that, When viewed from above, the first through hole, the third through hole, the fifth through hole, and the sixth through hole are located at the four corners of the rectangle.

14. The semiconductor module according to any one of claims 1 to 3, characterized in that, The thickness of the base plate is greater than the thickness of the portion of the top plate facing the refrigerant flow section.

15. The semiconductor module according to any one of claims 1 to 3, characterized in that, The cooling device also includes a reinforcement section located outside the refrigerant flow section and connected to the top plate and the bottom plate. At least one of the three through holes penetrates the top plate, the reinforcement, and the bottom plate in one direction.

16. The semiconductor module according to any one of claims 1 to 3, characterized in that, The semiconductor device also includes a resin structure for sealing the semiconductor chip. The resin structure is fixed to the main surface of the top plate. The through hole penetrates at least the resin structure, the top plate, and the bottom plate in one direction.

17. The semiconductor module as claimed in claim 16, characterized in that, The resin structure includes a recess for receiving the head of a screw in the case that the fastener is a screw, so that the head does not protrude outside the resin structure.

18. A vehicle, characterized in that, It includes a semiconductor module as described in any one of claims 1 to 17.

19. A semiconductor module comprising a semiconductor device and a cooling device, characterized in that, The semiconductor device has a semiconductor chip and a circuit board on which the semiconductor chip is mounted. The cooling device includes: A top plate on the circuit board to which the semiconductor device is fixed on the main surface; The sidewall connected to the top plate; A bottom plate that is connected to the sidewall and faces the top plate; A refrigerant flow section defined by the top plate, the side wall, and the bottom plate and used for the flow of refrigerant; An inlet formed on the base plate and used to introduce refrigerant into the refrigerant flow section; An outlet formed on the base plate for discharging refrigerant from the refrigerant flow section; and Multiple fins are disposed in the refrigerant flow section and extend between the top plate and the bottom plate. The top plate and the bottom plate include through holes for inserting fasteners to secure the semiconductor module to an external device, specifically three through holes penetrating the top plate and the bottom plate respectively in one direction. When viewed from above, the geometric centroid of the opening of at least one of the inlet and the outlet lies inside an imaginary triangle with the three through holes as vertices. The cooling device also includes a reinforcement section located outside the refrigerant flow section and connected to the top plate and the bottom plate. At least one of the three through holes penetrates the top plate, the reinforcement, and the bottom plate in one direction.

20. A semiconductor module comprising a semiconductor device and a cooling device, characterized in that, The semiconductor device has a semiconductor chip and a circuit board on which the semiconductor chip is mounted. The cooling device includes: A top plate on the circuit board to which the semiconductor device is fixed on the main surface; The sidewall connected to the top plate; A bottom plate that is connected to the sidewall and faces the top plate; A refrigerant flow section defined by the top plate, the side wall, and the bottom plate and used for the flow of refrigerant; An inlet formed on the base plate and used to introduce refrigerant into the refrigerant flow section; An outlet formed on the base plate for discharging refrigerant from the refrigerant flow section; and Multiple fins are disposed in the refrigerant flow section and extend between the top plate and the bottom plate. The top plate and the bottom plate include through holes for inserting fasteners to secure the semiconductor module to an external device, specifically four through holes that penetrate the top plate and the bottom plate respectively in one direction. When viewed from above, the geometric centroid of the opening of at least one of the inlet and the outlet lies inside an imaginary triangle with the three through holes as vertices. The through hole includes a first through hole, a second through hole, a third through hole, and a fourth through hole. Viewed from above, the first through hole and the fourth through hole are located on either side of the inlet, and the second through hole and the third through hole are located on either side of the outlet. Viewed from above, the geometric center of gravity of the entrance is located inside an imaginary triangle with the first through hole, the fourth through hole, and the second through hole as its vertices. Viewed from above, the geometric center of gravity of the outlet is located inside an imaginary triangle with the second through hole, the third through hole, and the fourth through hole as its vertices. When viewed from a direction orthogonal to the line connecting the first through hole and the fourth through hole, at least a portion of the second through hole overlaps with the inlet.

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