Heat dissipation devices and projection equipment

Abstract

This application provides a heat dissipation device and a projection device. The heat dissipation device is used for a spatial light modulator. The spatial light modulator includes a spatial light modulator body and a control board connected to each other. The spatial light modulator body has a front side and a rear side, and the control board is located behind the rear side. The heat dissipation device includes a first heat-conducting component, a heat dissipation component, and a second heat-conducting component. The first heat-conducting component is disposed on the front side. The heat dissipation component is disposed behind the control board. The second heat-conducting component connects the first heat-conducting component and the heat dissipation component and bypasses the control board of the spatial light modulator. The heat of the spatial light modulator is transferred from the first heat-conducting component to the second heat-conducting component, and then to the heat dissipation component. The fact that the second heat-conducting component bypasses the control board instead of having an opening in the control board and directly passing through the control board makes the spatial light modulator and its heat dissipation device easy to install and has a compact structure. It also avoids the risk of damaging the wiring of the control board by having an opening in the control board.

Description

Technical Field

[0001] This application relates to the field of projection technology, and more specifically, to a heat dissipation device and a projection device. Background Technology

[0002] Spatial light modulators such as DMD (Digital Micromirror Device) are important components of projection equipment. The light power they can withstand often limits the brightness of the projection equipment. The maximum light power that a spatial light modulator can withstand is limited by its temperature limit. Therefore, it is particularly important to provide proper heat dissipation for spatial light modulators. Summary of the Invention

[0003] This application provides a heat dissipation device for a spatial light modulator. The spatial light modulator includes a modulator body and a control board connected together. The modulator body has a front side and a rear side, and the control board is located behind the rear side. The heat dissipation device includes a first heat-conducting component, a heat-dissipating component, and a second heat-conducting component. The first heat-conducting component is disposed on the front side of the modulator body. The heat-dissipating component is located behind the control board. The second heat-conducting component connects the first heat-conducting component and the heat-dissipating component, and bypasses the control board of the spatial light modulator. Heat from the spatial light modulator is transferred from the first heat-conducting component to the second heat-conducting component, and then to the heat-dissipating component.

[0004] In some embodiments, the second thermally conductive component includes a flexible thermally conductive portion made of a flexible material.

[0005] In some embodiments, the flexible thermal conductive portion includes at least one of the following structures: one or more metal sheets; one or more flexible heat pipes.

[0006] In some embodiments, there are gaps between multiple metal sheets or between multiple flexible heat pipes.

[0007] In some embodiments, the device further includes a first connecting portion and a second connecting portion, wherein the second heat-conducting component is connected to the first heat-conducting component through the first connecting portion and to the heat dissipation component through the second connecting portion.

[0008] In some embodiments, the second heat-conducting component further includes a first clip and a second clip respectively disposed at both ends of the flexible heat-conducting portion, wherein the first connecting portion attaches the first clip to the first heat-conducting component, and the second connecting portion attaches the second clip to the heat dissipation component.

[0009] In some embodiments, the first connection includes a pressure plate and a first fastener, wherein the first fastener secures the pressure plate to the first heat-conducting component and clamps the first locking block between the pressure plate and the first heat-conducting component.

[0010] In some embodiments, the width of the first clip is smaller than the width of the pressure plate, such that the first fastener passes only through the pressure plate.

[0011] In some embodiments, the second connection portion includes a second fastener, wherein the second block has at least one hole, and the second fastener engages with the at least one hole to attach the second block to the heat dissipation assembly.

[0012] In some embodiments, the first thermally conductive component is a heat-equalizing plate extending along the front side to equalize the heat on the front side.

[0013] In some embodiments, the front side of the spatial light modulator body is the side facing the light rays incident on the spatial light modulator body.

[0014] In some embodiments, the heat dissipation device further includes an auxiliary air-cooling component for assisting in heat dissipation of the second heat-conducting component, the auxiliary air-cooling component being configured such that the air output from the auxiliary air-cooling component is delivered in a direction parallel to the width of the second heat-conducting component.

[0015] In some embodiments, the second thermally conductive component also bypasses one or more other devices between the spatial light modulator body and the heat dissipation component.

[0016] This application also provides a projection device. The projection device includes one or more spatial light modulators and one or more heat dissipation devices, wherein each heat dissipation device is used for one of the one or more spatial light modulators, and each of the one or more heat dissipation devices is a heat dissipation device of any of the above embodiments.

[0017] In some embodiments, the projection device further includes a heat exchanger for performing heat exchange processing on heat dissipated by heat dissipation components of the heat dissipation device of one or more spatial light modulators.

[0018] In some embodiments, the heat dissipation devices for one or more spatial light modulator components share an auxiliary air-cooling component.

[0019] In the heat dissipation device and projection equipment provided in this application embodiment, a first heat-conducting component is disposed on the front side of the spatial light modulator body, a heat dissipation component is disposed on the rear side of the spatial light modulator body, and a second heat-conducting component connects the first heat-conducting component and the heat dissipation component. The heat generated by the spatial light modulator body is transferred from the first heat-conducting component on the front side to the second heat-conducting component, and then conducted through the second heat-conducting component to the heat dissipation component located behind the spatial light modulator body for heat dissipation. The second heat-conducting component bypasses the control board between the spatial light modulator body and the heat dissipation component. By bypassing the control board instead of creating a hole in the control board and directly passing through it, the second heat-conducting component facilitates the installation of the spatial light modulator and its heat dissipation device, resulting in a compact structure. It also avoids the risk of damaging the wiring of the control board due to creating a hole in the control board. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a heat dissipation device and a spatial light modulator according to an embodiment of this application.

[0022] Figure 2 It is based on Figure 1 A schematic diagram of the heat dissipation device and the spatial light modulator from another perspective.

[0023] Figure 3 It is based on Figure 1 The heat dissipation device and a cross-sectional schematic diagram based on the optical modulator structure.

[0024] Figure 4 This is a schematic diagram of the structure of a heat dissipation device and a spatial light modulator according to another embodiment of this application.

[0025] Figure 5 This is a schematic diagram of the structure of the second heat-conducting component of a heat dissipation device according to another embodiment of this application.

[0026] Figure 6 This is a schematic diagram of the structure of the second heat-conducting component of a heat dissipation device according to another embodiment of this application.

[0027] Figure 7 This is a schematic diagram of the structure of a heat dissipation device and a spatial light modulator according to another embodiment of this application.

[0028] Figure 8This is a schematic diagram of the structure of a heat dissipation device and a spatial light modulator according to another embodiment of this application.

[0029] Figure 9 This is a schematic diagram of the heat dissipation device and spatial light modulator provided according to another embodiment of this application.

[0030] Figure 10 This is a cross-sectional schematic diagram of a projection device according to an embodiment of this application. Detailed Implementation

[0031] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.

[0032] Spatial light modulators are widely used in projection devices. Taking a DMD as an example, the optical power a DMD can withstand often limits the brightness of a projection device, while the maximum optical power a DMD can withstand is limited by its maximum temperature range. According to the specifications provided by TI (Texas Instruments), to ensure good long-term reliability of a DMD, the temperature of the front window of the DMD package and the temperature of the micromirror array inside the DMD package must be kept within a certain range, and the absolute value of the temperature difference between the two must also be kept within a certain range.

[0033] The temperature rise of the front window of a DMD originates from the light energy directly absorbed by the package, including stray light and the light spot size tolerance (overfill) in the optical design. Although the micromirror array inside the DMD emits most of the light, a small portion still leaks through due to the gaps between the micromirrors, causing the light to illuminate the substrate of the micromirror array and resulting in an increase in the temperature of the back side of the DMD. Since the temperature of the micromirror array inside the DMD package cannot be directly measured, it is usually expressed as the temperature of the back side of the DMD.

[0034] To maximize the optical power that the spatial light modulator can withstand without increasing the number of spatial light modulators, thereby improving the brightness of the projection device, it is crucial to control the temperature of the front window of the spatial light modulator, the temperature of the back of the spatial light modulator, and the temperature difference between the two.

[0035] In optical design, the distance between the front window of the spatial light modulator and the optical engine prism of the projection device is generally small. To control the temperature of the front window of the spatial light modulator within a confined space, the heat dissipation design should be as simple and reliable as possible. For projection devices with general brightness, the heat dissipation design usually only needs to consider the heat dissipation measures on the back of the spatial light modulator. However, when the projector brightness is high, i.e., when the light power received by the spatial light modulator is large, the thermal conductivity of the materials used in the encapsulation of the spatial light modulator (such as Kovar alloy) is not high (approximately 17 W / m*K). This means that the heat absorbed by the front window of the spatial light modulator cannot be conducted to the heat dissipation device on the back of the spatial light modulator in time. This results in the front window temperature of the spatial light modulator being too high, or the temperature difference between the front and back of the spatial light modulator exceeding the specifications of the spatial light modulator, which will significantly affect the reliability and service life of the spatial light modulator.

[0036] Related technologies for heat dissipation devices in spatial light modulators employ a thin heat sink with high thermal conductivity on the front window surface of the modulator. A clamp is used to hold the thin heat sink in contact with the front window surface, increasing the heat dissipation area. However, under high overall brightness conditions, the thin heat sink can only withstand a limited amount of heat, resulting in poor heat dissipation. Furthermore, while these technologies utilize refrigerant-filled devices on the front window surface of the spatial light modulator, the narrow distance between the front window and the prism makes manufacturing these devices difficult, hindering the production of compact and complex designs and increasing costs.

[0037] Please see Figure 1 and Figure 2 This application provides a heat dissipation device 140 for a spatial light modulator 120. The spatial light modulator 120 includes a spatial light modulator body 126 and a control board 128 connected to each other. The spatial light modulator body 126 has a front side 122 and a rear side 124, with the front side 122 facing away from the rear side 124. The front side 122 of the spatial light modulator body 126 can be a front window surface, that is, the side facing the light incident on the spatial light modulator body 126. The rear side 124 can be the other side of the spatial light modulator body 126 facing away from the front side. The control board 128 can be a printed circuit board (PCB), located on the rear side 124 of the spatial light modulator body 126, and can be electrically connected to the spatial light modulator body 126 to control the operation of the spatial light modulator body 126.

[0038] In the embodiments of this application, the directional terms such as "front" and "rear" are compared with the relative positions of the components in the example figures, for example... Figure 1In the configuration, the spatial light modulator body 126 is located in front of the control board 128, and the control board 128 is located behind the spatial light modulator body 126, etc.

[0039] The heat dissipation device 140 includes a first heat-conducting component 142, a heat dissipation component 144, and a second heat-conducting component 146. The first heat-conducting component 142 is disposed on the front side 122 of the spatial light modulator body 126, the heat dissipation component 144 is located behind the control board 128, and the second heat-conducting component 146 connects the first heat-conducting component 142 and the heat dissipation component 144, bypassing the control board 128 of the spatial light modulator 120. With this structure, the heat of the spatial light modulator 120, especially the heat at the front side 122 of the spatial light modulator body 126, is transferred from the first heat-conducting component 142 to the second heat-conducting component 146, and then to the heat dissipation component 144, from which it is dissipated or transferred elsewhere.

[0040] This application is in Figures 1-10 In the embodiments described herein, a spatial light modulator 120 is used as a digital micromirror device for illustrative purposes. However, it is understood that the embodiments of this disclosure are also applicable to other types of spatial light modulators, and in other embodiments, the spatial light modulator 120 may be other types of spatial light modulators.

[0041] In the embodiments described above, when the second heat-conducting component 146 connects the first heat-conducting component 142 and the heat dissipation component 144, it does not create an opening in the control board 128 located between the first heat-conducting component 142 and the heat dissipation component 144 and directly pass through the control board 128. Instead, it bypasses the control board 128. This reduces the stress on the spatial light modulator body 126 and also avoids damaging the wiring of the control board 128 due to the opening, thus reducing the wiring risk of the control board 128. In another embodiment, the second heat-conducting component 146 bypasses not only the control board 128 but also one or more other components between the first heat-conducting component and the heat dissipation component.

[0042] The control board 128 has dense wiring and compact component arrangement. Since the second heat-conducting component 146 bypasses the control board 128, there is no need to drill through the control board 128. That is, the second heat-conducting component 146 does not directly pass through the control board 128, thus not affecting the wiring on the control board 128 and eliminating the risk of failure caused by drilling through the wiring on the control board 128. In addition, since the second heat-conducting component 146 does not pass through the control board 128, the stress it generates on the spatial light modulator body 126 is less compared to the case where it passes through the control board 128, making the spatial light modulator body 126 easier to install and adjust, and its performance more stable.

[0043] In some embodiments, the first heat-conducting component 142 can be a heat-equalizing sheet extending along the front side 122 to homogenize the heat on the front side 122, helping to avoid localized overheating of the front side 122. The first heat-conducting component 142 can be made of a material with high thermal conductivity, such as metal. In one embodiment, the first heat-conducting component 142 is made of pure copper. Since the thermal conductivity of pure copper is approximately 381 W / mK, it can effectively homogenize and dissipate the heat on the front side 122 of the spatial light modulator body 126, and can also effectively conduct the heat generated on the front side 122 of the spatial light modulator body 126 to the second heat-conducting component 146. The first heat-conducting component 142 can be a simple sheet structure, which helps the first heat-conducting component 142 to dissipate and conduct heat to the spatial light modulator body 126 even in a confined space.

[0044] The second heat-conducting component 146 contacts the first heat-conducting component 142 and the heat dissipation component 144 respectively, so that the heat generated by the front side 122 of the spatial light modulator 120 can be conducted to the heat dissipation component 144 through the first heat-conducting component 142 and the second heat-conducting component 146 for heat dissipation. This can reduce the temperature of the front side 122 and the temperature difference between the front side 122 and the rear side 124, which is beneficial to the stable operation of the spatial light modulator body 126 and the extension of the working life of the spatial light modulator body 126. It can also improve the brightness of the projection device without increasing the number of spatial light modulator bodies 126. The contact points between the second thermally conductive component 146 and the first thermally conductive component 142, and between the second thermally conductive component 146 and the heat dissipation component 144, can be coated or added with interface materials to reduce interfacial thermal resistance, such as thermal paste, thermal pads, graphite sheets, or graphene. This reduces the thermal resistance between the second thermally conductive component 146 and the first thermally conductive component 142 or the heat dissipation component 144, thereby improving the heat conduction effect between them. Furthermore, in addition to the contact points with the first thermally conductive component 142 and the heat dissipation component 144, other locations on the second thermally conductive component 146 can also be coated or added with interface materials to reduce interfacial thermal resistance. For example, the interface materials described above can be coated or added to both sides of the sheet-like second thermally conductive component 146, thereby accelerating the rate at which heat from the second thermally conductive component 146 dissipates into the air, further improving the heat dissipation effect of the heat dissipation device 140.

[0045] The number of second thermal conductive components 146 can be one or more, for example, Figure 1 In the illustrated embodiment, there is one second heat-conducting component 146, and the first heat-conducting component 142 and the heat dissipation component 144 conduct heat through the second heat-conducting component 146. For example, Figure 3 and Figure 4 In the illustrated embodiment, there are two second heat-conducting components 146, which bypass the control plate 128 from opposite sides of the first heat-conducting component 142. Figure 4 (Not shown) Connected to opposite sides of the heat dissipation assembly 144. In other embodiments, the number of second heat-conducting assemblies 146 may also be three or four, etc.

[0046] The heat dissipation component 144 serves two purposes: firstly, it directly conducts and dissipates heat from the rear side 124 of the spatial light modulator body 126; secondly, it conducts and dissipates heat from the front side 122 of the spatial light modulator body 126 through the second heat-conducting component 146 and the first heat-conducting component 142, dissipating the heat to, for example, the air environment or other media, or transferring it to other locations. The term "dissipating heat" here includes heat exchange processing.

[0047] For example, the heat dissipation assembly 144 may include a heat sink element 1442, a cooling element 1444, and a heat dissipation element 1446, which are stacked sequentially. The heat sink element 1442 can be connected to the second heat-conducting assembly 146 and can also contact the spatial light modulator body 126, for example, the heat sink element 1442 can contact the rear side 124, so that the heat sink element 1442 can dissipate and conduct heat from the front side 122 and the rear side 124 of the spatial light modulator body 126, and conduct the heat to the cooling element 1444. Since the front side 122 and the rear side 124 of the spatial light modulator body 126 are connected through the first heat-conducting assembly 142, the second heat-conducting assembly 146, and the heat dissipation assembly 144 (heat sink element 1442), the temperature difference between them can be eliminated or reduced.

[0048] A cooling element 1444 is disposed between a heat sink element 1442 and a heat dissipation element 1446. The cooling element 1444 dissipates heat from the heat sink element 1442 and conducts it to the heat dissipation element 1446. The cooling element 1444 can be a Peltier element, such as a thermal-electric cooler (TEC). The heat dissipation element 1446 dissipates heat from the cooling element 1444. The heat dissipation element 1446 can have a finned structure, thereby increasing the contact area between the heat dissipation element 1446 and the air, and improving the heat dissipation effect of the heat dissipation element 1446.

[0049] The heat dissipation device 140 provided in this application embodiment has a first heat-conducting component 142 disposed on the front side 122 of the spatial light modulator 120, a heat dissipation component 144 disposed on the rear side 124 of the spatial light modulator 120, and a second heat-conducting component 146 connected between the first heat-conducting component 142 and the heat dissipation component 144. The heat generated by the spatial light modulator 120 is transferred from the first heat-conducting component 142 at the front side 122 to the second heat-conducting component 146, and then conducted through the second heat-conducting component 146 to the heat dissipation component 144 located behind the spatial light modulator body 126 for heat dissipation. The second heat-conducting component 146 bypasses the control board 128 between the spatial light modulator body 126 and the heat dissipation component 144. By bypassing the control board 128 instead of opening a hole in the control board 128 and directly passing through it, the second heat-conducting component 146 facilitates the installation of the spatial light modulator 120 and its heat dissipation device 140, resulting in a compact structure. It also avoids damaging the wiring of the control board 128 by opening a hole in it.

[0050] The second heat-conducting component 146 may be made of a material with high thermal conductivity to improve the speed and efficiency of heat conduction from the front side 122 to the rear side 124.

[0051] In some implementations, please refer to Figure 5 and Figure 8 The second heat-conducting component 146 may include a flexible heat-conducting part 1464, which serves as the main body of the second heat-conducting component 146. The flexible heat-conducting part 1464 may be made of a flexible material, thereby facilitating bending and deformation. The main body of the second heat-conducting component 146 is made of a flexible material, allowing it to adapt to the installation space, thus saving space and making the device structure more compact. Furthermore, due to the use of a flexible material, the stress exerted by the second heat-conducting component 146 on the spatial light modulator 120 is greatly reduced, thereby improving the performance stability of the spatial light modulator 120.

[0052] In some implementations, please refer to Figure 6 The flexible heat-conducting part 1464 includes at least one of the following structures: one or more metal sheets 1464a and one or more flexible heat pipes 1464a. In some embodiments, gaps are provided between the multiple metal sheets and between the multiple flexible heat pipes to improve heat dissipation and conduction.

[0053] For example, Figure 5 As shown, the flexible heat-conducting part 1464 can be composed of a metal sheet 1464a. For example, the metal sheet 1464a can be a copper sheet or other metal sheet with high thermal conductivity and good flexibility, so that the flexible heat-conducting part 1464 has good heat dissipation and heat conduction functions. In other embodiments, the flexible heat-conducting part 1464 may include multiple metal sheets. For example, as... Figure 6 and Figure 7 As shown, the flexible heat-conducting part 1464 includes multiple stacked metal sheets 1464a, wherein the multiple metal sheets 1464a are spaced apart by a certain distance to ensure sufficient heat dissipation of each metal sheet 1464a. Here, "multiple" means two or more, for example, two, three, four, or more. Multiple metal sheets 1464a help enhance the heat dissipation and heat conduction effect of the flexible heat-conducting part 1464. The gaps between the multiple layers of metal sheets 1464a help the metal sheets 1464a dissipate heat into the air environment within the gaps.

[0054] As another example, the flexible heat-conducting part 1464 can also be a flexible heat pipe that can change its shape according to the spatial shape. For example, using a superhydrophilic copper oxide mesh as the capillary structure for the flexible heat pipe, the horizontal thermal conductivity can reach 1000 W / m*K, and the effective vertical thermal conductivity can reach 3000 W / m*K. In another example, the flexible heat pipe can use a copper corrugated pipe as the heat pipe and a copper mesh as the capillary structure inside, thus having both good heat dissipation and heat conduction functions and good flexibility. Similarly, the flexible heat-conducting part 1464 can include multiple flexible heat pipes, which are spaced apart to ensure sufficient heat dissipation of each flexible heat pipe. The multiple flexible heat pipes with gaps help to enhance the heat dissipation and heat conduction effect of the flexible heat-conducting part 1464. The gaps between the multiple flexible heat pipes help the flexible heat pipes dissipate heat into the air environment within the gaps. By using one or more flexible heat pipes as flexible heat conduction parts 1464, the control board 128 of the spatial light modulator 120 and other components between the heat dissipation assembly 144 located on the front side 122 and the rear side 124 of the spatial light modulator body 126 can be bypassed, and the first heat conduction assembly 146 on the front side 122 and the heat dissipation assembly 144 on the rear side 124 can be connected. At the same time, the spatial light modulator 120 has good stability and is suitable for multi-angle installation of projectors.

[0055] In some embodiments, please refer to Figure 8 The heat dissipation device 140 further includes a first connecting portion 145 and a second connecting portion 147. The second heat-conducting component 146 is connected to the first heat-conducting component 142 through the first connecting portion 145 and to the heat dissipation component 144 through the second connecting portion 147. The first connecting portion 145 can fix the second heat-conducting component 146 to the first heat-conducting component 142, thereby helping to enhance the stability of the connection between the second heat-conducting component 146 and the first heat-conducting component 142. Similarly, the second connecting portion 147 can fix the second heat-conducting component 146 to the heat dissipation component 144, thereby helping to enhance the stability of the connection between the second heat-conducting component 146 and the heat dissipation component 144.

[0056] The second heat-conducting component 146 can be connected to the first heat-conducting component 142 and the heat dissipation component 144 in various ways. For example, it can be connected by welding or by using connectors for fixing.

[0057] In some embodiments, please refer to Figure 5 , Figure 6 and Figure 8 The second heat-conducting component 146 includes a first locking block 1462 and a second locking block 1466 respectively disposed at both ends of the flexible heat-conducting portion 1464, serving as connectors. A first connecting portion 145 attaches the first locking block 1462 to the first heat-conducting component 142, and a second connecting portion 147 attaches the second locking block 1466 to the heat dissipation component 144. Thus, the first locking block 1462 and the second locking block 1466 respectively cooperate with the first connecting portion 145 and the second connecting portion 147 of the heat dissipation device 140 to connect the second heat-conducting component 146 to the first heat-conducting component 142 and the heat dissipation component 144.

[0058] In some embodiments, the first connecting portion 145 includes a pressure plate 1452 and a first fastener 1454, wherein the first fastener 1454 fixes the pressure plate 1452 to the first heat-conducting component 142 and clamps the first locking block 1462 between the pressure plate 1452 and the first heat-conducting component 142. The pressure plate 1452 may be in the form of a long plate or other shapes, and may be rigid or flexible. The first fastener 1454 may be any fixing device capable of fixing the pressure plate 1452 to the first heat-conducting component 142. For example, the first fastener 1454 may be a fastener such as a nail or stud with or without threads, which is fastened by inserting and fixing it into the threaded or unthreaded holes on the pressure plate 1452 and the first heat-conducting component 142. The number of first fasteners 1454 may be one or more, for example, there may be two first fasteners 1454, with the two first fasteners 1454 respectively installed at both ends of the pressure plate 1452.

[0059] In one example, the pressure plate 1452, the first locking block 1462, and the first heat-conducting component 142 may each be provided with holes corresponding to the first fastener 1454, so that the first fastener 1454 can pass through the holes of the pressure plate 1452 and the first locking block 1462 in sequence and be fixed in the hole of the first heat-conducting component 142, thereby allowing the pressure plate 1452 to fix the first locking block 1462 to the first heat-conducting component 142.

[0060] In other examples, the width of the first locking block 1462 is smaller than the width of the pressure plate 1452, so that the first fastener 1454 only passes through the hole on the pressure plate 1452 to reach the hole on the first heat-conducting component 142. Thus, the first locking block 1462 located between the pressure plate 1452 and the first heat-conducting component 142 is fixed to the first heat-conducting component 142 by compression through the fixing of the pressure plate 1452 to the first heat-conducting component 142. This avoids the need to create a corresponding hole on the first heat-conducting component 142, thereby simplifying the structure of the first heat-conducting component 142. Here, the width of the first locking block 1462 refers to... Figure 8 The width of the first card block 1462 along the X direction; similarly, the width of the pressure plate 1452 refers to... Figure 8 The width of the intermediate pressure plate 1452 along the X direction. That is, if the direction in which the second heat-conducting component 146 connects the first heat-conducting component 142 and the heat dissipation component 144 is called the length direction of the second heat-conducting component 146, then the X direction is the width direction of the second heat-conducting component 146.

[0061] In some embodiments, the second connecting portion 147 includes a second fastener 1472. The second fastener 1472 can be any fastening device that secures the second latch 1466 to the heat dissipation assembly 144. For example, the second fastener 1472 can be a threaded or unthreaded nail, stud, or other fastener, which is fastened by inserting into and securing it to threaded or unthreaded holes on the second latch 1466 and the heat dissipation assembly 144. In one example, the second latch 1466 has at least one hole 1467, and the second fastener 1472 engages with at least one hole 1467 to attach the second latch 1466 to the heat dissipation assembly 144.

[0062] For example, the second fastener 1472 can be a countersunk screw. The number of second fasteners 1472 is the same as the number of holes 1467. For example, if there are three holes 1467, then there are also three second fasteners 1472. The heat sink assembly 144 can be provided with holes (not shown) corresponding to the holes 1467. These holes can be provided in the heat sink element 1442, so that the second fasteners 1472 can pass through the holes 1467 of the second locking block 1466 to reach and be fixed in the holes of the heat sink assembly 144, thereby allowing the second connecting part 147 to fix the second locking block 1466 to the heat sink assembly 144.

[0063] The contact points between the first card block 1462 and the first heat-conducting component 142, and between the second card block 1466 and the heat dissipation component 144, can be coated or added with interface materials to reduce interfacial thermal resistance, such as thermal paste, thermal pads, graphite sheets, or graphene, thereby reducing the thermal resistance between the second heat-conducting component 146 and the first heat-conducting component 142 or the heat dissipation component 144, and improving the heat conduction effect between the second heat-conducting component 146 and the first heat-conducting component 142 or the heat dissipation component 144.

[0064] In addition, besides the contact points with the first thermally conductive component 142 and the contact points with the heat dissipation component 144, the second thermally conductive component 146 can also be coated or have interface materials added at other locations to reduce the interface thermal resistance. For example, the interface materials described above can be coated or added to both sides of the sheet-like second thermally conductive component 146, thereby accelerating the rate at which the heat of the second thermally conductive component 146 dissipates into the air environment and further improving the heat dissipation effect of the heat dissipation device 140.

[0065] In some embodiments, the heat dissipation device 140 further includes an auxiliary air-cooling component 141 for assisting in heat dissipation of the second heat-conducting component 146. The auxiliary air-cooling component 141 is configured such that the air output from the auxiliary air-cooling component 141 is delivered in a direction parallel to the width of the second heat-conducting component 146 (i.e., the width direction). The auxiliary air-cooling component 141 can be a fan or other air circulation device. The auxiliary air-cooling component 141 is used to dissipate heat from the second heat-conducting component 146, thereby accelerating the rate at which the heat of the second heat-conducting component 146 is dissipated to the external environment. The width of the second heat-conducting component 146 refers to... Figure 9 The width of the second heat-conducting component 146 along the X direction.

[0066] Please see Figure 10 This application also provides a projection device 10. The projection device 10 includes one or more spatial light modulators 120 and one or more heat dissipation devices 100. Each heat dissipation device 100 is used for one of the one or more spatial light modulators 120, and each of the one or more heat dissipation devices 100 is a heat dissipation device 100 of any of the above embodiments.

[0067] For example, there may be one spatial light modulator 120 and one heat dissipation device 100, which provides heat dissipation for the spatial light modulator 120. Alternatively, there may be two spatial light modulators 120 and two heat dissipation devices 100, each providing heat dissipation for one corresponding spatial light modulator 120. In this embodiment, there may be three spatial light modulators 120 and three heat dissipation devices 100, each providing heat dissipation for one corresponding spatial light modulator 120. It is understood that the projection device 10 may also include more spatial light modulators and corresponding heat dissipation devices.

[0068] exist Figure 10 In the illustrated embodiment, each spatial light modulator 120 has a corresponding heat dissipation device 100, and each heat dissipation device 100 includes the first heat-conducting component 142, the second heat-conducting component 144 and the heat dissipation component 146 as described above, which will not be repeated here.

[0069] In some embodiments, please refer to Figure 10 The projection device 10 also includes a heat exchanger 1482, which can be shared by the heat dissipation devices 100 of multiple spatial light modulators 120, and is used to perform heat exchange processing on the heat dissipated by these multiple heat dissipation devices 140. In one example, the heat exchanger 1482 and each heat dissipation device 140 can be connected by a structure such as a water pump 1484 and a pipe 1486. ​​For example, the pipe 1486 connects the heat dissipation component 144 of the heat dissipation device 140, the heat exchanger 1482, and the water pump 1484 to form a loop. The pipe 1486 can be connected to the heat dissipation element 1446 of the heat dissipation component 144. The pipe 1486 can be filled with coolant, which increases in temperature after flowing through the heat dissipation element 1446. The water pump 1484 draws the hot coolant near the heat dissipation element 1446 to the heat exchanger 1482, where it releases heat and is conducted to the external environment, thus lowering the temperature of the coolant. In addition, the water pump 1484 draws the coolant in the heat exchanger 1482 back to the vicinity of the heat dissipation element 1446 to dissipate heat, thus forming a water circulation and improving the heat dissipation effect of the heat dissipation assembly 1444.

[0070] In some embodiments, for example, see Figure 10 The heat dissipation devices 140 of multiple optical modulator components 100 can also share an auxiliary air cooling component 143, that is, an auxiliary air cooling component 143 dissipates heat for all heat dissipation devices 140, thereby reducing the number of auxiliary air cooling components 143 and saving equipment space.

[0071] Please see Figure 10The projection device 10 may further include a positioning member 110 for positioning and adjusting the spatial light modulator 100. The positioning member 110 has a positioning protrusion 1100 for positioning the light modulator body 126. The first heat-conducting assembly 142 may be provided with a clearance through hole 1420, so that the positioning protrusion 1100 can pass through the clearance through hole 1420 and connect to the light modulator body 126.

[0072] In this application, unless otherwise expressly specified or limited, the terms "installation," "connection," "fixation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components; they can refer to mere surface contact; or they can refer to surface contact connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0073] Furthermore, the terms "first," "second," etc., are used only for distinguishing descriptions and should not be construed as referring to specific or particular structures. The terms "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this application, as well as the features of different embodiments or examples.

[0074] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A heat dissipation device for a spatial light modulator, the spatial light modulator comprising a spatial light modulator body and a control board, the spatial light modulator body having a front side and a rear side, the control board being located behind the rear side, characterized in that, The heat dissipation device includes a first heat-conducting component, a heat dissipation component, a second heat-conducting component, a pressure plate, a first fastener, and a second connecting part; The first heat-conducting component is a heat-equalizing plate extending along the front side surface, used to equalize the heat on the front side surface; The heat dissipation component is located behind the control board; The second heat-conducting component includes a flexible heat-conducting part made of a flexible material and a first and a second locking block disposed at both ends of the flexible heat-conducting part. The first fastener fixes the pressure plate to the first heat-conducting component, such that the first locking block is clamped between the pressure plate and the first heat-conducting component. The second connecting part attaches the second locking block to the heat dissipation component. The second heat-conducting component bypasses the control board of the spatial light modulator. The heat from the spatial light modulator is transferred from the first heat-conducting component to the second heat-conducting component, and then to the heat dissipation component.

2. The heat dissipation device according to claim 1, characterized in that, The flexible thermally conductive part includes at least one of the following structures: One or more metal sheets; One or more flexible heat pipes.

3. The heat dissipation device according to claim 2, characterized in that, There are gaps between the plurality of metal sheets or between the plurality of flexible heat pipes.

4. The heat dissipation device according to claim 1, characterized in that, The width of the first clip is smaller than the width of the pressure plate, so that the first fastener passes only through the pressure plate.

5. The heat dissipation device according to claim 1, characterized in that, The second connection portion includes a second fastener, wherein the second clip has at least one hole, and the second fastener engages with the at least one hole to attach the second clip to the heat dissipation assembly.

6. The heat dissipation device according to any one of claims 1-5, characterized in that, The front side of the spatial light modulator body is the side facing the light rays incident on the spatial light modulator body.

7. The heat dissipation device according to any one of claims 1-5, characterized in that, The heat dissipation device further includes an auxiliary air-cooling component for assisting in heat dissipation of the second heat-conducting component. The auxiliary air-cooling component is configured such that the air output from the auxiliary air-cooling component is delivered in a direction parallel to the width of the second heat-conducting component.

8. The heat dissipation device according to any one of claims 1-5, characterized in that, The second heat-conducting component also bypasses one or more other devices between the spatial light modulator body and the heat dissipation component.

9. A projection device, characterized in that, include: One or more spatial light modulators; as well as One or more heat dissipation devices, wherein each heat dissipation device is used in one of the one or more spatial light modulators, wherein each of the one or more heat dissipation devices is a heat dissipation device as claimed in any one of claims 1-8.

10. The projection device according to claim 9, characterized in that, The projection device further includes a heat exchanger for performing heat exchange processing on the heat dissipation components of the heat dissipation device of the one or more spatial light modulators.

11. The projection device according to claim 9 or 10, characterized in that, The heat dissipation devices of the one or more spatial light modulators share an auxiliary air-cooling component.

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