Liquid-cooled heat dissipation module and electronic device having the same

Abstract

The present invention provides a liquid-cooled heat dissipation module and an electronic device having the liquid-cooled heat dissipation module, which are used to solve the problems of the existing liquid-cooled heat dissipation system having more components and occupying a larger space. The present invention comprises: a housing, wherein a power chamber and a flow channel are connected to each other, and the housing has a heat absorption area and a cooling area; a pump, located in the power chamber, wherein the pump has a liquid outlet connected to the first end of the flow channel, and the pump has a liquid inlet connected to the second end of the flow channel; and a working fluid, which flows into the flow channel from the liquid outlet of the pump, flows through the heat absorption area and the cooling area, and flows back into the pump through the liquid inlet of the pump.

Description

Technical Field

[0001] The present invention relates to a heat dissipation module and an electronic device, in particular to a liquid cooling heat dissipation module which can help the electronic device maintain a proper working temperature and an electronic device having the liquid cooling heat dissipation module. Background Art

[0002] Please refer to Figure 1 , which is a known liquid cooling heat dissipation system 9, the existing liquid cooling heat dissipation system 9 has a heat absorbing unit 91, a heat dissipation unit 92, a pump 93 and a pipe set 94. The heat absorbing unit 91 can be attached to the heat source Z of the electronic device, and the pipe set 94 connects the pump 93 and the heat absorbing unit 91 by a pipe 941, connects the pump 93 and the heat dissipation unit 92 by a pipe 942, and connects the heat absorbing unit 91 and the heat dissipation unit 92 by a pipe 943.

[0003] According to the aforementioned structure, the pump 93 can drive the working fluid to flow in the pipe assembly 94, and the working fluid that absorbs heat and heats up through the heat absorbing unit 91 can be cooled down when passing through the heat dissipation unit 92 and directed to the heat absorbing unit 91 again; this continuous cycle allows the heat source Z to maintain an appropriate working temperature, thereby avoiding overheating of the electronic device.

[0004] However, the existing liquid cooling heat dissipation system 9 has many components, and the components need to occupy a certain amount of installation space due to the need for assembly and combination, making it difficult to reduce the space required for the entire liquid cooling heat dissipation system 9. For thin and light electronic devices, it is often difficult to configure the installation space. Furthermore, if the pipe assembly 94 of the existing liquid cooling heat dissipation system 9 is not accurately assembled with the corresponding components, it may cause leakage of the internal working fluid, so it needs to be assembled carefully, which is relatively labor-intensive and time-consuming.

[0005] In view of this, the existing liquid cooling system still needs to be improved. Summary of the invention

[0006] To solve the above problems, an object of the present invention is to provide a liquid-cooled heat dissipation module and an electronic device having the liquid-cooled heat dissipation module, which can reduce the number of required components and reduce the space occupied by the assembly and combination of components.

[0007] A second object of the present invention is to provide a liquid-cooled heat dissipation module and an electronic device having the liquid-cooled heat dissipation module, which can ensure that the working fluid will not leak due to inaccurate assembly between components.

[0008] Another object of the present invention is to provide a liquid-cooled heat dissipation module and an electronic device having the liquid-cooled heat dissipation module, which can be pre-assembled so as to be quickly assembled to a predetermined position of the electronic device later.

[0009] Another object of the present invention is to provide a liquid-cooled heat dissipation module and an electronic device having the liquid-cooled heat dissipation module, so that the working fluid can fully exchange heat with the housing.

[0010] The directions or their approximate terms described throughout the present invention, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inside", "outside", "side", etc., mainly refer to the directions of the accompanying drawings, and each direction or its approximate terms are only used to assist in the explanation and understanding of the embodiments of the present invention, and are not used to limit the present invention.

[0011] The elements and components described throughout the present invention use the quantifiers "a" or "an" only for convenience of use and to provide a general meaning of the scope of the present invention; in the present invention, they should be interpreted as including one or at least one, and a single concept also includes multiple situations, unless it is obvious that it means otherwise.

[0012] The similar terms such as "combination", "assembly" or "assembly" described throughout the present invention mainly include the connection that can be separated without damaging the components, or the connection that makes the components inseparable, which can be selected by technicians in this field according to the materials of the components to be connected or the assembly requirements.

[0013] The liquid-cooled heat dissipation module of the present invention comprises: a shell having a power chamber and a flow channel connected therein, the shell having a heat absorption zone and a cooling zone; a pump located in the power chamber, the pump having a liquid outlet connected to the first end of the flow channel, the pump having a liquid inlet connected to the second end of the flow channel; and a working fluid flowing from the liquid outlet of the pump into the flow channel, flowing through the heat absorption zone and the cooling zone, and flowing back into the pump through the liquid inlet of the pump.

[0014] The electronic device of the present invention comprises: a casing; an electronic module located in the casing and having a heating area; and the aforementioned liquid cooling heat dissipation module, which is arranged in the casing and the heat absorption area contacts the heating area.

[0015] Therefore, the liquid-cooled heat dissipation module of the present invention and the electronic device having the liquid-cooled heat dissipation module can reduce the number of components required and reduce the space required for assembly and combination of components by directly forming a connected power chamber and flow channel in the shell of the liquid-cooled heat dissipation module; in addition, the liquid-cooled heat dissipation module of the present invention can also be assembled in advance so that it can be quickly assembled to the predetermined position of the electronic device later, and ensure that its working fluid will not leak due to inaccurate assembly between components. Therefore, the liquid-cooled heat dissipation module of the present invention has the effects of improving space utilization and assembly efficiency, and is conducive to the development of lightweight and thin electronic devices having the liquid-cooled heat dissipation module.

[0016] The heat absorption area and the cooling area are each located in the flow channel, and the housing can also have a preparation area located between the first end of the flow channel and the heat absorption area. In this way, the heat absorption area can maintain an appropriate distance from the pump, which has the effect of improving the heat dissipation effect.

[0017] The housing may have a heat insulating portion, which may be located between the preparation area and the cooling area. In this way, the working fluid in the preparation area will not easily exchange heat with the working fluid in the cooling area, which can reduce the impact on the temperature of the fluid flowing into the heat absorption area, thereby improving the heat dissipation effect.

[0018] The flow channel in the preparation area can be arranged in a straight line, so as to reduce the kinetic energy consumption of the working fluid before flowing into the heat absorption area, thereby improving the flow smoothness of the working fluid.

[0019] The housing may have a plurality of protrusions, which may be located in the flow channel and may be located in the heat absorption zone and the cooling zone. In this way, the contact area between the housing and the working fluid may be further increased by the plurality of protrusions, thereby improving the heat dissipation effect.

[0020] The flow channel may have a plurality of straight portions and a plurality of curved portions, and both the straight portion and the curved portion located in the heat absorption zone may have the convex portion. Thus, the portion of the flow channel in the heat absorption zone can provide a better evaporation efficiency for the working fluid, thereby improving the heat dissipation effect.

[0021] The flow channel may have a plurality of straight portions and a plurality of curved portions, the straight portion located in the cooling zone may have the convex portion, and the curved portion located in the cooling zone may not have the convex portion. In this way, the smoothness of the working fluid flowing through the curved portion can be improved, which has the effect of improving the smoothness of the flow of the working fluid.

[0022] The pump may be a centrifugal pump, the first end of the flow channel may be linearly opposite to the liquid outlet, and the second end of the flow channel may be tangentially opposite to the liquid inlet. In this way, the smoothness of the working fluid flowing out and back to the pump can be improved, which has the effect of improving the smoothness of the flow of the working fluid.

[0023] The housing may include a first plate and a second plate, the power chamber and the flow channel may be formed on the first plate and / or the second plate, the first plate and the second plate may be relatively combined to form the power chamber and the flow channel, and the power chamber and the flow channel may be enclosed in the housing. In this way, the housing may be easy to manufacture and can effectively prevent leakage of the working fluid, thereby improving manufacturing convenience and leak-proof effect.

[0024] The housing may have at least one spoiler located at the second end of the flow channel, and the two sides of the spoiler may form a first channel respectively, and the front end of the spoiler may contact the inner wall of the housing, and when the working fluid flows into the power chamber, it flows to the liquid inlet of the pump through each first channel. In this way, the working fluid can flow at an appropriate flow rate to fully exchange heat with the housing, thereby improving the heat dissipation effect.

[0025] The housing may have at least one partition wall, the housing may have a flow divider block located in front of the liquid outlet of the pump, a second channel may be formed between the flow divider block and the partition wall, the front end of the flow divider block may contact the inner wall of the housing, and the working fluid flows into the flow channel from the second channel. In this way, the working fluid can flow at an appropriate flow rate to fully exchange heat with the housing, thereby improving the heat dissipation effect.

[0026] The housing may have a stopper, and the stopper may have a middle portion connecting the inner wall of the housing and the pump. In this way, the working fluid can flow into the liquid inlet of the pump without being pressurized by the pump, and will not flow directly into the flow channel, thereby improving the circulation smoothness of the working fluid.

[0027] The block may have at least one side wall connected to the side end of the middle portion, and the side wall may be connected to the partition wall, so that the second channel may be gradually expanded toward the main channel. In this way, the first end and the second end of the flow channel may be separated without being connected from above the partition wall, and the working fluid may flow at an appropriate flow rate to fully exchange heat with the shell, thereby improving the circulation smoothness of the working fluid and the heat dissipation effect.

[0028] The flow channel may have a main channel connected to two branch channels, the main channel may be connected to the liquid outlet of the pump, and the two branch channels may be connected to the liquid inlet of the pump, and the working fluid may flow from the main channel into the two branch channels and then flow back to the pump. In this way, the liquid cooling heat dissipation module can provide another type of heat dissipation path and range, which has the effect of improving the practicality of different electronic devices.

[0029] The housing may include a first plate and a second plate that can be relatively combined, the first plate may have a ring wall surrounding the periphery of the first plate, and two partition walls may be used to divide the main channel and two branch channels in the ring wall, and the second plate may be partially raised to form the power chamber. In this way, it can be made of a simple structure, which has the effect of improving the convenience of manufacturing and assembly.

[0030] The outer shell can form the cooling zone at the place where the main channel connects the two branch channels, thereby improving the heat dissipation effect.

[0031] The main channel can be located between the two branch channels, the housing can form the heat absorption area at the power chamber, and the liquid outlet of the pump can be oriented toward the main channel. In this way, after the working fluid flows forward from the main channel located in the middle, it can easily flow evenly to the two branch channels located on both sides when it turns to flow backward, so that the flow in the two branch channels is more even, which has the effect of improving heat dissipation uniformity.

[0032] The liquid cooling heat dissipation module can further include a heat dissipation fin group, which can be connected to the housing and can be located in the cooling area. In this way, the heat dissipation fin group can help the cooling area of ​​the housing to dissipate heat quickly, thereby improving the heat dissipation effect.

[0033] The housing can be etched to form the flow channel, thereby improving the molding yield and facilitating the development of thinness.

[0034] The working fluid may be a non-conductive fluid, thereby simplifying the structure of the liquid-cooled heat dissipation module to improve manufacturing convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0036] Figure 1 : A conventional liquid cooling heat dissipation system diagram;

[0037] Figure 2 : An exploded perspective view of a first embodiment of the present invention;

[0038] Figure 3 : Front view of the second plate and pump assembly of the first embodiment of the present invention;

[0039] Figure 4 : An exploded perspective view of the first embodiment of the present invention and an electronic device;

[0040] Figure 5 : An exploded perspective view of a second embodiment of the present invention;

[0041] Figure 6 :like Figure 5 An enlarged view of the local structure shown;

[0042] Figure 7 : An enlarged view of the local structure of the second embodiment of the present invention from another viewing angle;

[0043] Figure 8 : A front view of the assembly of the second embodiment of the present invention;

[0044] Fig. 9 :along Figure 8 AA line profile of

[0045] Fig.10 :along Figure 8 BB line profile of;

[0046] Fig.11 : A front view of the combination of the third embodiment of the present invention.

[0047] Description of Reference Numerals

[0048] [the present invention]

[0049] 1: Shell

[0050] 1a: First board

[0051] 1b: Second board

[0052] 11: Power chamber

[0053] 12: Runner

[0054] 13:convex part

[0055] 14: Insulation

[0056] 2: Pump

[0057] 21:Liquid outlet

[0058] 22: Liquid inlet

[0059] 3: Working fluid

[0060] 4: Casing

[0061] 5: Electronic module

[0062] 51: Fever area

[0063] 6: Shell

[0064] 6a: First board

[0065] 6b: Second board

[0066] 61: Power chamber

[0067] 62: Runner

[0068] 621: The Main Road

[0069] 622:Branch Road

[0070] 63: Convex wall group

[0071] 631: Ring Wall

[0072] 632: Partition wall

[0073] 64: Spoiler Block

[0074] 65: Shunt block

[0075] 66: Stopper

[0076] 661: Middle

[0077] 662: Side wall

[0078] 7: Heat sink fins

[0079] C: Cooling Zone

[0080] E: Electronic devices

[0081] E1: First End

[0082] E2: Second end

[0083] F1: First channel

[0084] F2: Second channel

[0085] H: Heat absorption area

[0086] P: Preparation area

[0087] S: Straight

[0088] T: Bend

[0089] V: Front-end

[0090] W: Inner wall

[0091] [Existing Technology]

[0092] 9: Liquid cooling system

[0093] 91:Heat absorption unit

[0094] 92: Cooling unit

[0095] 93: Pump

[0096] 94: Pipe fittings

[0097] 941,942,943: Pipe fittings

[0098] Z: Heat source. DETAILED DESCRIPTION

[0099] In order to make the above and other purposes, features and advantages of the present invention more clearly understood, preferred embodiments of the present invention are listed below and described in detail with reference to the accompanying drawings as follows:

[0100] Please refer to Figure 2 , Figure 3 As shown, it is a first embodiment of the liquid-cooled heat dissipation module of the present invention, comprising a housing 1, a pump 2 and a working fluid 3. The pump 2 is located in the housing 1 and can be used to drive the working fluid 3 to circulate in the housing 1.

[0101] The housing 1 may be made of copper, aluminum or other materials with high thermal conductivity, and has a power chamber 11 and a flow channel 12 connected thereto. The power chamber 11 may be used to accommodate the pump 2 , and the working fluid 3 may be driven by the pump 2 to circulate in the flow channel 12 .

[0102] In detail, for the convenience of processing and manufacturing, the housing 1 of this embodiment may include a first plate 1a and a second plate 1b, and the power chamber 11 and the flow channel 12 may be arbitrarily formed on the first plate 1a or / and the second plate 1b, and after the first plate 1a and the second plate 1b are relatively combined, the first plate 1a and the second plate 1b jointly form the power chamber 11 and the flow channel 12, and the power chamber 11 and the flow channel 12 are both enclosed inside the housing 1, thereby effectively preventing the working fluid 3 from leaking out of the housing 1. Among them, when the thickness of the housing 1 is extremely thin (the thickness excluding the power chamber 11 is less than or equal to 3 mm), the flow channel 12 can be formed by etching process. In addition, the present invention does not limit the combination method of the first plate 1a and the second plate 1b, and the second plate 1b can be combined with the first plate 1a by bonding, embedding, clamping, locking or welding. In this embodiment, laser welding is used to combine the first plate 1a and the second plate 1b, so that the first plate 1a and the second plate 1b are closely connected without any gap, thereby improving the sealing performance and structural strength of the housing 1.

[0103] On the other hand, the flow channel 12 of this embodiment can have its first end E1 and the second end E2 connected to the power chamber 11 respectively, and there is no branch between the first end E1 and the second end E2 of the flow channel 12, so that the working fluid 3 can continuously flow from the first end E1 of the flow channel 12 to the second end E2, or can also flow in the opposite direction, through the drive of the pump 2. The portion of the flow channel 12 between the first end E1 and the second end E2 can be extended by forming a plurality of straight portions S and a plurality of bends T; for example, in this embodiment, two adjacent straight portions S can be connected by a bend T to form a meandering flow channel 12, and the flow channel 12 can almost cover the interior of the housing 1.

[0104] In addition, the housing 1 has a heat absorption area H, which is located at a part of the flow channel 12, preferably at an appropriate distance from the first end E1 and the second end E2 of the flow channel 12. The housing 1 can be attached to the heat source of the electronic device through the heat absorption area H, so that the working fluid 3 can absorb the heat energy at the heat source when flowing through the heat absorption area H. The power chamber 11 can be selectively arranged away from the heat absorption area H. For example, but not limited to, the housing 1 of this embodiment can be roughly rectangular, and the power chamber 11 and the heat absorption area H can be selectively arranged at both ends in the length direction.

[0105] The housing 1 also has a cooling zone C, which is also located in a part of the flow channel 12, and the cooling zone C can be adjacent to the heat absorption zone H, so that the working fluid 3 leaving the heat absorption zone H can enter the cooling zone C to release heat. In this embodiment, the cooling zone C can be located between the heat absorption zone H and the second end E2 of the flow channel 12. The housing 1 can be attached to the metal housing of the electronic device through the cooling zone C, so as to exchange heat with the outside through the metal housing; or a heat dissipation fan group can be provided to blow air to the cooling zone C, or a heat dissipation fin group can be connected to the cooling zone C, or the heat dissipation fan group and the heat dissipation fin group can be provided at the same time.

[0106] The housing 1 may have a plurality of protrusions 13, which are located in the flow channel 12 and are oppositely located in the heat absorption zone H and the cooling zone C, so that the contact area between the housing 1 and the working fluid 3 is further increased by the plurality of protrusions 13. The plurality of protrusions 13 may be, for example, protrusions or columns distributed in the flow channel 12, so as to facilitate the etching of the flow channel 12, and the shape of the protrusions 13 is not limited by the present invention. When the height of the plurality of protrusions 13 is approximately the same as the depth of the flow channel 12, the plurality of protrusions 13 may abut against the opposite plate body (taking the figure of this embodiment as an example, abut against the first plate 1a) when the first plate 1a and the second plate 1b are relatively combined, providing auxiliary support for the plate body to maintain the volume of the flow channel 12. In this embodiment, the straight portion S and the curved portion T of the flow channel 12 in the heat absorption zone H may have the convex portion 13, and the plurality of convex portions 13 may be evenly distributed, so that the portion of the flow channel 12 in the heat absorption zone H can provide better heat absorption efficiency for the working fluid 3. In addition, the straight portion S of the flow channel 12 in the cooling zone C may have a plurality of convex portions 13, while the curved portion T may not have the convex portion 13, so as to improve the smoothness of the working fluid 3 flowing through the curved portion T.

[0107] The housing 1 may also have a preparatory area P, which is approximately located between the first end E1 of the flow channel 12 and the heat absorption area H. The portion of the flow channel 12 in the preparatory area P may be arranged in a straight line to reduce the kinetic energy consumption of the working fluid 3 before flowing into the heat absorption area H. Preferably, the housing 1 may have a heat insulating portion 14, which is located between the preparatory area P and the cooling area C, so that the working fluid 3 located in the preparatory area P is not easy to exchange heat with the working fluid 3 located in the cooling area C, and the influence on the liquid temperature flowing into the heat absorption area H can be reduced. For example, in this embodiment, the heat insulating portion 14 may be selected to be a long groove that is recessed or protruding from the second plate 1b, and the long groove is not connected to the flow channel 12, so that a cavity is formed together after the first plate 1a and the second plate 1b are relatively combined, thereby effectively reducing the heat transfer efficiency between the preparatory area P and the cooling area C, and avoiding the working fluids 3 in two different areas from interfering with each other's liquid temperature.

[0108] The pump 2 is located in the power chamber 11, and the pump 2 has a liquid outlet 21 connected to the first end E1 of the flow channel 12, and the pump 2 has a liquid inlet 22 connected to the second end E2 of the flow channel 12. In this way, the operation of the pump 2 can guide the working fluid 3 flowing into the power chamber 11 from the liquid inlet 22 into the interior of the pump 2, and then pump it out from the liquid outlet 21 to be injected into the flow channel 12 through the first end E1. The present invention does not limit the type of the pump 2, and the principle is to be able to drive the working fluid 3 to circulate. In this embodiment, the pump 2 can adopt a shaft-inlet side-outlet centrifugal pump, the first end E1 of the flow channel 12 can be linearly opposite to the liquid outlet 21, and the second end E2 of the flow channel 12 can be opposite to the tangent direction of the liquid inlet 22, so as to improve the smoothness of the working fluid 3 flowing out and back to the pump 2. A non-conductive liquid may be selected as the working liquid 3, so that the stator of the pump 2 does not need to be additionally provided with a waterproof structure.

[0109] Please refer to Figure 3 , Figure 4 As shown, according to the above structure, the assembled liquid-cooled heat dissipation module can be placed in a housing 4 of an electronic device E, and the heat absorption area H of the housing 1 contacts a heating area 51 of an electronic module 5 located in the housing 4. During the operation of the electronic device E, when the temperature of the heating area 51 rises, the heat absorption area H of the housing 1 absorbs the heat energy of the heating area 51, and then the working fluid 3 passing through the heat absorption area H absorbs the heat energy, so that the temperature of the working fluid 3 rises; then it flows into the cooling area C, so that the working fluid 3 can release heat and cool down when it contacts the relatively low temperature part of the housing 1, and flow back into the pump 2 through the liquid inlet 22 of the pump 2. In this way, through the continuous circulation of the working fluid 3, the heat energy of the heating area 51 can be effectively taken away, helping the electronic module 5 to dissipate heat to maintain a proper working temperature. The electronic device E to which the liquid cooling heat dissipation module is applicable may be, for example, but not limited to, a mobile phone, a tablet computer, a handheld game console, a notebook computer, a desktop computer, a smart wearable device, AR / VR glasses, or an electronic medical device.

[0110] Please refer to Figure 5 , Figure 8 , which is a second embodiment of the liquid-cooled heat dissipation module of the present invention; in this embodiment, the housing 6 can form a heat absorption area H at the power chamber 61, so that the pump 2 can be arranged in the heat absorption area H of the housing 6. In addition, the flow channel 62 of the housing 6 can have branches to provide different heat dissipation paths and ranges.

[0111] In detail, the flow channel 62 of this embodiment may have a main channel 621 connected to two branch channels 622, the main channel 621 is connected to the liquid outlet 21 of the pump 2, and the two branch channels 622 are connected to the liquid inlet 22 of the pump 2, so that the working fluid 3 can flow from the main channel 621 into the two branch channels 622 and then flow back to the pump 2; that is, the starting end of the main channel 621 is the first end E1 of the flow channel 62, the terminal end of the main channel 621 connects the starting ends of the two branch channels 622, and the terminal ends of the two branch channels 622 are the second end E2 of the flow channel 62. In addition, the main channel 621 can be located between the two branch channels 622, so that after the working fluid 3 flows forward from the main channel 621 located in the middle, it can easily flow to the two branch channels 622 located on both sides when turning to flow backward, so that the flow in the two branch channels 622 is more even.

[0112] For example, but not limited to, in order to achieve the aforementioned method of guiding the flow of the working fluid 3, the housing 6 of this embodiment may include a first plate 6a and a second plate 6b, the first plate 6a may have a convex wall group 63, the convex wall group 63 may have a ring wall 631 surrounding the circumference of the first plate 6a, and two partition walls 632 are used to divide the main channel 621 and the two branch channels 622 within the range surrounded by the ring wall 631; the second plate 6b may be partially raised to form the power chamber 61. After the first plate 6a and the second plate 6b are relatively combined, the second plate 6b may abut against the ring wall 631, and the power chamber 61 may cover the beginning of the main channel 621 and the terminal of the two branch channels 622. Among them, the pump 2 may be arranged in the power chamber 61, and the liquid outlet 21 of the pump 2 may face the main channel 621.

[0113] In addition, please refer to Figure 5 , Figure 6 As shown, the pump 2 of this embodiment adopts a shaft-inlet and side-outlet centrifugal pump. The housing 6 may have two spoiler blocks 64 and a diverter block 65. The two spoiler blocks 64 and the diverter block 65 may be made of sintered copper powder material. The two spoiler blocks 64 may be fixed to the first plate 6a and respectively located on both sides of the pump 2. A first channel F1 may be formed on both sides of each spoiler block 64; that is, a first channel F1 is provided between each spoiler block 64 and the annular wall 631, and another first channel F1 is provided between each spoiler block 64 and the adjacent partition wall 632. The top of each spoiler block 64 may be lower than the liquid inlet 22 of the pump 2, and the front end V of each spoiler block 64 may contact the inner wall W of the housing 6 to block the gap between the first plate 6a and the second plate 6b (please refer to Fig. 9 As shown), the connection between the front and rear spaces inside the housing 6 is cut off, so that after the working fluid 3 flows into each branch channel 622, when it flows into the power chamber 61, it can only flow to the terminal of the branch channel 622 through the two first channels F1, and flow back to the liquid inlet 22 of the pump 2 from the top of the power chamber 61.

[0114] Similarly, the diverter block 65 can be fixedly mounted on the first plate 6a and located in front of the liquid outlet 21 of the pump 2, and a second channel F2 can be formed between the two sides of the diverter block 65 and the two partition walls 632. The rear end of the diverter block 65 can be lower than the liquid outlet 21 of the pump 2, and the front end V of the diverter block 65 can contact the inner wall W of the housing 6 to block the gap between the first plate 6a and the second plate 6b (please refer to Fig.10 As shown), the working fluid 3 flows into the main channel 621 only through the two second channels F2.

[0115] Please refer to Figure 7 , Figure 8 , Fig.10 As shown, the housing 6 may further include a stopper 66, which may include a middle portion 661 and two side walls 662, the two side walls 662 being connected to both sides of the middle portion 661, the middle portion 661 being connected to the inner wall W of the second plate 6b of the housing 6 and the pump 2, so as to block the communication between the liquid inlet 22 of the pump 2 and the space above the diverter block 65, so that the working fluid 3 can all flow into the liquid inlet 22 of the pump 2, and will not directly flow forward into the main channel 621 without being pressurized by the pump 2, causing a circulation disorder. The two side walls 662 of the stopper 66 can be connected to the inner wall W of the second plate 6b of the housing 6 and the two partition walls 632, respectively, and the two second channels F2 can be gradually expanded toward the main channel 621, so that the main channel 621 and the two branch channels 622 in the housing 6 can be separated, and will not be connected from above the two partition walls 632.

[0116] Please refer to Figure 5 , Figure 8 As shown, the shell 6 can form the cooling zone C at the location where the main channel 621 connects the two branch channels 622, and a heat sink fin group 7 can be connected to the shell 6 and located at the cooling zone C, and the heat sink fin group 7 helps the cooling zone C of the shell 6 to dissipate heat quickly.

[0117] Please refer to Figure 8 to Figure 10As shown, according to the above structure, the liquid-cooled heat dissipation module of this embodiment can contact the heat absorption area H of the housing 6 with the heating area of ​​an electronic device, while the cooling area C of the housing 6 is located farther away from the heating area. After the pump 2 pumps out the relatively high temperature working fluid 3 that has absorbed heat energy, the working fluid 3 can flow into the main channel 621 from the two second channels F2 and flow to the cooling area C along the two partition walls 632 to gradually dissipate heat and cool down. After the working fluid 3 flows into the two branch channels 622 along the two partition walls 632, it can flow to the heat absorption area H along the two branch channels 622. In each branch channel 622, the relatively low-temperature working fluid 3 that dissipates heat in the cooling zone C can absorb the heat energy of the housing 6 again when flowing into the power chamber 61 (entering the heat absorption zone H), and flow from the two first channels F1 located on both sides of the spoiler block 64 to the terminal of the branch channel 622, and the flow velocity is reduced by the spoiler block 64, extending the heat absorption time of the working fluid 3, and finally making the relatively high-temperature working fluid 3 flow from the top of the power chamber 61 into the liquid inlet 22 of the pump 2 to complete a cycle. In this way, through the continuous circulation of the working fluid 3, the heat energy of the heating zone of the electronic device can be effectively removed, helping the electronic device to dissipate heat to maintain a proper working temperature.

[0118] Please refer to Fig.11 As shown in FIG. 1 , it is the third embodiment of the liquid-cooled heat dissipation module of the present invention. The flow channel 62 of the liquid-cooled heat dissipation module of this embodiment may not be provided with a branch channel; in other words, the number of partition walls 632 of the convex wall group 63 may be only one, so that after the working fluid 3 is pumped out from the liquid outlet 21 of the pump 2, it can flow through the second channel F2 on the side of the diverter block 65, along the partition wall 632 to the cooling area C of the housing 6, and after turning, it flows to the heat absorption area H of the housing 6, through the first channel F1 on the side of the spoiler block 64, and finally flows from the top of the power chamber 61 into the liquid inlet 22 of the pump 2. The structure of the liquid-cooled heat dissipation module of this embodiment is simpler and can be applied to electronic devices with a smaller heat dissipation area.

[0119] In summary, the liquid-cooled heat dissipation module of the present invention and the electronic device having the liquid-cooled heat dissipation module can reduce the number of components required and reduce the space required for assembly and combination of components by directly forming a connected power chamber and flow channel in the shell of the liquid-cooled heat dissipation module; in addition, the liquid-cooled heat dissipation module of the present invention can also be assembled in advance so that it can be quickly assembled to the predetermined position of the electronic device later, and ensure that its working fluid will not leak due to inaccurate assembly between components. Therefore, the liquid-cooled heat dissipation module of the present invention has the effects of improving space utilization and assembly efficiency, and is conducive to the development of electronic devices with the liquid-cooled heat dissipation module to be lighter and thinner.

[0120] Although the present invention has been disclosed using the above-mentioned preferred embodiments, they are not intended to limit the present invention. Any person skilled in the art may make various changes and modifications to the above-mentioned embodiments without departing from the spirit and scope of the present invention. Such changes and modifications are still within the technical scope protected by the present invention. Therefore, the protection scope of the present invention shall be determined by the protection scope of the claims.

Claims

1. A liquid-cooled heat dissipation module, characterized in that: include: A shell having a power chamber and a flow channel connected therein, and the shell having a heat absorption area and a cooling area; a pump located in the power chamber, the pump having a liquid outlet connected to the first end of the flow channel, and a liquid inlet connected to the second end of the flow channel; and A working fluid flows into the flow channel from the fluid outlet of the pump, flows through the heat absorption zone and the cooling zone, and flows back into the pump through the fluid inlet of the pump; The housing has at least one spoiler located at the second end of the flow channel, and two sides of the spoiler form a first channel respectively. The front end of the spoiler contacts the inner wall of the housing. When the working fluid flows into the power chamber, it flows to the liquid inlet of the pump through each first channel; The housing has at least one partition wall, the housing has a flow divider block located in front of the liquid outlet of the pump, a second channel is formed between the flow divider block and the partition wall, the front end of the flow divider block contacts the inner wall of the housing, and the working fluid flows into the flow channel from the second channel; The flow channel has a main channel connected to two branch channels, the main channel is connected to the liquid outlet of the pump, and the two branch channels are connected to the liquid inlet of the pump. The working fluid flows from the main channel into the two branch channels and then flows back to the pump.

2. The liquid-cooled heat dissipation module according to claim 1, characterized in that: A stopper is arranged inside the shell, and the stopper has a middle part connected with the inner wall of the shell and the pump.

3. The liquid-cooled heat dissipation module according to claim 2, characterized in that: The block has at least one side wall connected to the side end of the middle portion, the side wall is connected to the partition wall, and makes the second channel gradually expand toward the flow channel.

4. The liquid-cooled heat dissipation module according to claim 1, characterized in that: The shell includes a first plate and a second plate which can be relatively combined. The first plate has a ring wall surrounding the circumference of the first plate. In addition, two partition walls are used to divide the main channel and two branch channels within the ring wall. The second plate is partially raised to form the power chamber.

5. The liquid-cooled heat dissipation module according to claim 1, characterized in that: The shell forms the cooling zone at the place where the main channel connects the two branch channels.

6. The liquid-cooled heat dissipation module according to claim 1, characterized in that: The main channel is located between the two branch channels, the shell is located opposite to the power chamber to form the heat absorption area, and the liquid outlet of the pump faces the main channel.

7. The liquid-cooled heat dissipation module according to any one of claims 1 to 6, characterized in that: In addition, a heat dissipation fin group is provided, which is connected to the shell and is located opposite to the cooling area.

8. The liquid-cooled heat dissipation module according to any one of claims 1 to 6, characterized in that: The flow channel is formed in the shell by etching process.

9. The liquid-cooled heat dissipation module according to any one of claims 1 to 6, characterized in that: The working fluid is a non-conductive fluid.

10. An electronic device, characterized in that: include: a housing; an electronic module located in the housing and having a heating area; and A liquid-cooled heat dissipation module as claimed in any one of claims 1 to 9 is arranged in the housing, and the heat absorption area contacts the heat generation area.

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