Method for manufacturing cover device or cover wafer, method for manufacturing micromechanical package, method for packaging device, cover wafer, cover device

Abstract

The present invention relates to a method for manufacturing a lid device or lid wafer, comprising the following steps: forming a first groove and a second groove on a first substrate surface of a first substrate, such that a first frame structure is formed through the first groove from the material of the first substrate; forming at least one continuous recess through the second substrate, such that a closed second frame structure is formed from the material of the second substrate by means of the continuous recess; covering the second groove with the closed second frame structure; and constructing a portion of the outer surface of a future lid device or lid wafer on the first and second frame structures, such that the second groove extends through the portion of the outer surface as a channel. The present invention also relates to a method for manufacturing a micromechanical package for at least one device and a method for packaging at least one device. The present invention also relates to a lid wafer, a lid device, a micromechanical package for at least one device, and an apparatus.

Description

Technical Field

[0001] The present invention relates to a method for producing at least one cover component or a cover wafer, a method for producing a micromechanical package for at least one component, and a method for packaging at least one component. The invention also relates to a cover wafer, a cover component, a micromechanical package for at least one component, and a device. Background Art

[0002] It is known from the prior art that components should be encapsulated to protect them. For example, DE 10 2015 222 519 A1 describes a micromirror encapsulated in a mirror housing having a light entrance window and a light exit window. However, DE 10 2015 222 519 A1 does not disclose any possibility of manufacturing such a mirror housing. Summary of the Invention

[0003] The present invention provides a method for producing at least one cover component or a cover wafer, the method comprising the following steps:

[0004] forming at least one first recess and at least one second recess in a first substrate surface of a first substrate such that a first continuous frame structure formed from the material of the first substrate is formed by means of the at least one first recess, the continuous first frame structures each surrounding a first recess formed on their inner side, and the continuous first frame structures are penetrated by at least one second recess that opens into the corresponding first recess;

[0005] forming at least one continuous recess through the second substrate in such a way that a closed second frame structure is formed by means of the at least one continuous recess, and, before forming the at least one continuous recess or forming the at least one closed second frame structure, attaching the second substrate to the inner side of the at least one continuous first frame structure in such a way that the at least one second recess is covered by the at least one closed second frame structure on the inner side of the at least one continuous first frame structure;

[0006] At least a portion of the outer surface of at least one subsequent cover component or a subsequent cover wafer is constructed on at least one first frame structure and the at least one second frame structure in such a way that the at least one second groove passes through the at least one portion of the outer surface of the at least one subsequent cover component or the subsequent cover wafer as a channel.

[0007] The present invention provides a method for producing a micromechanical package for at least one component, the method comprising the following steps:

[0008] Manufacturing at least one lid device or lid wafer according to the above manufacturing method;

[0009] At least one carrier component or carrier wafer is formed from the material of the third substrate in such a way that the at least one carrier component can be fixed on the fixing surface of the corresponding cover component on the side of its closed second frame structure pointing away from its through first frame structure, or the carrier wafer can be fixed on the fixing surface of the cover wafer on the side of its closed second frame structure pointing away from its through first frame structure.

[0010] The present invention provides a method for packaging at least one device, the method comprising the following steps:

[0011] manufacturing a micromechanical package according to the method for manufacturing a micromechanical package for at least one device;

[0012] Arranging the at least one device on at least one carrier device or carrier wafer of the micromechanical package;

[0013] The at least one carrier component is fixed on the fixing surface of the corresponding cover component, or the carrier wafer is fixed on the fixing surface of the cover wafer.

[0014] The present invention provides a cover wafer, which has:

[0015] a first substrate having a first substrate surface, wherein a plurality of first recesses and a plurality of second recesses are formed in the first substrate surface of the first substrate such that a first continuous frame structure formed from the material of the first substrate is formed by each first recess, the continuous first frame structures respectively surrounding a first recess formed on their inner side, and the continuous first frame structure is penetrated by at least one second recess that opens into the corresponding first recess;

[0016] a second substrate having a plurality of through-going recesses, such that a closed second frame structure consisting of the material of the second substrate is formed by each through-going recess, wherein the closed second frame structure is fastened to the inner side of the through-going first frame structure in such a way that the second groove is covered by the closed second frame structure on the inner side of the through-going first frame structure;

[0017] The second grooves serve as channels to penetrate at least a portion of the outer surface of the cover wafer.

[0018] The present invention provides a cover device, which has:

[0019] a first continuous frame structure, the first frame structure being formed from the material of the first substrate, the first frame structure surrounding a first groove formed on the inner side of the first frame structure, and the first continuous frame structure being penetrated by at least one second groove formed on the inner side of the first frame structure and opening into the first groove;

[0020] a closed second frame structure, which is formed from the material of the second substrate by means of at least one continuous recess and is fastened to the inner side of the through-going first frame structure in such a way that the at least one second recess is covered by the closed second frame structure on the inner side of the through-going first frame structure;

[0021] The at least one second groove serves as a channel and passes through at least a portion of the outer surface of the cover device.

[0022] The present invention provides a micromechanical package for at least one device, the micromechanical package having:

[0023] The aforementioned cover device or the aforementioned cover wafer;

[0024] At least one carrier device or carrier wafer made of the material of the third substrate, wherein the at least one carrier device can be fixed on the fixing surface of the corresponding cover device on the side of its closed second frame structure pointing away from its through first frame structure, or the carrier wafer can be fixed on the fixing surface of the cover wafer on the side of its closed second frame structure pointing away from its through first frame structure.

[0025] The present invention also provides a device comprising:

[0026] The above-mentioned micromechanical package;

[0027] at least one device disposed on a carrier device of the micromechanical package;

[0028] Wherein, the carrier component is fixed on the fixing surface of the cover component of the micromechanical package.

[0029] The present invention makes it possible to simply package a variety of different types of devices, such as micromechanical components, light-emitting devices, light-detecting devices, chemical sensor devices, and / or physical sensor devices. As will become clear from the following description, different devices can be packaged separately in a micromechanical package, that is, in a package manufactured using MEMS technology. Therefore, by using the present invention, the packaging of the corresponding devices can be achieved in a space-saving and weight-saving manner. In addition, the corresponding parts of the micromechanical package can be manufactured using a simple manufacturing method. In addition, the parts of the micromechanical package can be manufactured with relatively small size and relatively low weight. Moreover, when using the present invention, there is no need to worry about damage to at least one of the separately packaged components during packaging.

[0030] In an advantageous embodiment of the production method, during the formation of at least one partial surface of at least one subsequent cover component or of a subsequent cover wafer, at least one window attachment surface of at least one subsequent cover component or of a subsequent cover wafer is formed by the following steps: At least one inclined saw cut or milling cut is formed in a second substrate surface of the first substrate pointing away from the first substrate surface In this case, the inclined saw cut or milling cut is formed in a first cutting direction, which has a first inclination angle of between 10° and 80° relative to the second substrate surface of the first substrate; before, during or after forming the at least one inclined saw cut or milling cut, at least one vertical saw cut or milling cut is formed in the second substrate surface of the first substrate, wherein the vertical saw cut or milling cut is formed in a second cutting direction, which has a second inclination angle of between 80° and 90° relative to the second substrate surface of the first substrate. The saw cuts and milling cuts described herein can be easily implemented, thereby making it possible to construct the at least one window attachment surface in such a way that it can be attached to the at least one window attachment surface in a simple manner while maintaining the desired accuracy. Therefore, embodiments of the manufacturing method described herein can also be used to produce at least one cover device or cover wafer for hermetically encapsulated packaging. At least one window can be selectively used as a light entrance window and / or light exit window, respectively.

[0031] In an advantageous embodiment of the method for producing a micromechanical package for at least one component, at least one through-contact is structured through at least one carrier component or carrier wafer, thereby enabling reliable electrical contacting of the at least one component of the subsequent package.

[0032] In an advantageous embodiment of the device, the at least one component is a micromechanical component, a light emitting device, a light detecting device, a chemical sensor device and / or a physical sensor device. However, it should be noted that the types of components that can be packaged using the present invention are not to be construed as exhaustive. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Other features and advantages of the present invention are described below with reference to the accompanying drawings.

[0034] Figures 1A to 1H A schematic diagram is shown for explaining one specific embodiment of a production method for producing at least one cover component or a cover wafer;

[0035] Figure 2A and 2B A schematic diagram is shown for explaining one specific embodiment of a method for producing a micromechanical package for at least one component;

[0036] Figure 3A and 3B A schematic diagram illustrating one embodiment of a method for packaging at least one component is shown;

[0037] Figure 4 A schematic diagram showing a first embodiment of the device;

[0038] Figure 5 A schematic diagram showing a second embodiment of the device;

[0039] Figure 6 A schematic diagram of a third embodiment of the device is shown. DETAILED DESCRIPTION

[0040] Figures 1A to 1H A schematic diagram is shown for explaining one specific embodiment of a production method for producing at least one cover component or a cover wafer.

[0041] In the manufacturing method described herein, at least one first recess 10 and at least one second recess 12 are first formed in a first substrate surface 14a of a first substrate 14. The first substrate 14 is preferably a semiconductor substrate and / or a metal substrate, preferably a silicon substrate. The at least one first recess 10 and the at least one second recess 12 can be formed using at least one etching method. Preferably, at least one trench method is implemented, which allows (almost) vertical etching edges to be formed in the first substrate 14 and allows the recesses 10 and 12 to be precisely adapted to the desired recess shape, thereby forming the at least one first recess 10 and the at least one second recess 12.

[0042] The at least one first groove 10 is respectively configured to have a first maximum depth t1, which is less than the layer thickness d of the first substrate 14 oriented perpendicular to the first substrate surface 14a. The at least one first groove 10 will later serve as the "inner region" of the cavity. The at least one second groove 12 is also respectively configured to have a second maximum depth t2, which is less than the layer thickness d of the first substrate 14. The at least one second groove 12 will later serve as a channel 16, for example, as a light entrance channel and / or a light exit channel and / or as a medium transmission channel. Therefore, it is generally desirable that the at least one second maximum depth t2 of the at least one second groove 12 is less than the at least one first maximum depth t1 of the at least one first groove 10. This can be achieved by implementing a two-stage etching method / trench method.

[0043] from Figure 1A As can be seen in FIG, a continuous first frame structure 18 made of the material of the first substrate 14 is formed / structured by means of at least one first recess 10. An inner side 18a located on the first substrate surface 14a of the first substrate 14 can be defined for each of the first frame structures, and the first frame structure surrounds the first recess 10 formed on its inner side 18a. Furthermore, the at least one first frame structure 18 is penetrated by at least one second recess 12 that opens into the corresponding first recess 10.

[0044] from Figure 1A As can also be seen in FIG, the above method steps can also be used to accordingly form a plurality of first recesses 10 and a plurality of second recesses 12. Therefore, the manufacturing method described here can also be implemented for producing a lid wafer for (simultaneously) packaging a plurality of components, or for producing a plurality of lid components that are later structured along the separation lines 20.

[0045] Before or after forming the at least one first groove 10 and the at least one second groove 12, at least one bonding layer or adhesive layer 22 can be selectively deposited on at least a portion of the first substrate surface 14a of the first substrate 14, in particular on the (later) inner side 18a of the at least one first frame structure 18. The second substrate 24 can be fixed to the inner side 18a of the at least one first frame structure 18 by means of the at least one bonding layer or adhesive layer 22. In the embodiment of the manufacturing method described here, a bonding method is implemented to fix the second substrate 24 to the inner side 18a of the at least one through-going first frame structure 18. As a result, Figure 1B Shown in.

[0046] The second substrate 24 can also be a semiconductor substrate and / or a metal substrate, in particular a silicon substrate. Preferably, a seal glass bonding method (Seal-Glass-Bondverfahren), a eutectic bonding method (e.g., a germanium-aluminum eutectic bonding method), a SLID bonding method (Solid-Liquid-Interdiffusion-Bondung, solid-liquid interdiffusion bonding) is implemented, in particular using copper and tin, or a direct bonding method is implemented, for example, using silicon dioxide. The advantage of all these bonding methods is that they achieve a gas-tight and robust bonded connection 26 that can also withstand high temperatures. In addition, since the trench method etches germanium and silicon at (almost) equal etching rates, the bonding layer 22 containing germanium can be deposited on the first substrate surface 14a of the first substrate 14 before the grooves 10 and 12 are constructed, and the trenches are opened together when the grooves 10 and 12 are constructed. In this case, there is no need to structure the bonding layer 22 containing germanium.

[0047] Optionally, after the second substrate 24 has been fixed to the inner side 18 a of the at least one through-going first frame structure 18 , the layer thickness of the first substrate 14 and / or the second substrate 24 can be reduced by means of a grinding or etching method.

[0048] Figure 1C It is shown that at least one through-going recess 28 is formed by the second substrate 24, wherein a closed second frame structure 30 is formed / structured by the material of the second substrate 24 by means of the at least one through-going recess 28, but at least one second groove 12 / at least one channel 16 on the inner side 18a of at least one through-going first frame structure 18 remains covered by the corresponding second frame structure 30. In addition, the at least one through-going recess 28 is structured by the second substrate 24 so that it at least partially "exposes" the corresponding first groove 10. In addition, the at least one through-going recess 28 forms at least one cavity 32 with the corresponding first groove 10, wherein the at least one cavity 32 includes an "inner area" at the position of its first groove 10 and an "outer area" at the position of its through-going recess 28. From Figure 1C It can also be seen in FIG. 1 that the side edge shape of the at least one through-recess 28 may correspond to the side edge shape of the exposed first groove 10 .

[0049] To form the at least one continuous recess 30, an etching method, preferably a trenching method, can be performed. If necessary, the at least one first recess 10 can also be further deepened in the first substrate 14 using the etching method / trenching method, without requiring an additional mask for this purpose. After structuring the at least one continuous recess 28, the layer thickness of the first substrate 14 and / or the second substrate 24 can also be (further) reduced using a grinding method or an etching method.

[0050] In the embodiment described here, the second substrate 24 is attached to the inner side 18a of the at least one continuous first frame structure 18 before forming the at least one continuous recess 28. Alternatively, however, the at least one continuous recess 28 can be structured first by the second substrate 24, and only then the at least one closed second frame structure 30 can be attached to the inner side 18a of the at least one continuous first frame structure 18 in such a way that the at least one second groove 12 / the at least one channel 16 on the inner side 18a of the at least one continuous first frame structure 18 is covered by the respectively associated second frame structure 30.

[0051] Optionally, before or after forming the at least one through-cutout 28, at least one further bonding layer or adhesive layer 34 may be deposited on the outer side 30a of the (later) second frame structure 30, which faces away from the at least one through-cutout first frame structure 18. If the further bonding layer or adhesive layer 34 contains copper, for example, a bonding layer 34 later used for a copper-zinc SLID bonding method, it may be covered with a protective layer (not shown), for example, a silicon nitride layer.

[0052] In another method step, at least one partial outer surface 36 of at least one future cover component or future cover wafer is formed on at least one first frame structure 18 and at least one second frame structure 30 such that at least one second recess 12 / at least one channel 16 passes through the at least one partial outer surface 36 of the at least one future cover component or future cover wafer. In the embodiment described herein, when forming the at least one partial outer surface 36, at least one window attachment surface 36 of the at least one future cover component or future cover wafer is also formed. To this end, at least one inclined saw cut or milling cut 38 is first formed in the second substrate surface 14b of the first substrate 14, which faces away from the first substrate surface 14a. Furthermore, the inclined saw cut or milling cut 38 is formed in a first cutting direction having a first inclination angle of between 10° and 80° relative to the second substrate surface 14b of the first substrate 14 as a first cutting angle. This is to be understood as meaning that the middle plane extending centrally through the inclined saw cut or milling cut 38 is inclined at a first inclination angle of between 10° and 80° relative to the second substrate surface 14b of the first substrate 14. The inclined saw cut or milling cut 38 can be configured, for example, to have a first inclination angle of between 20° and 70°, in particular between 30° and 60°, relative to the second substrate surface 14b of the first substrate 14. As a result, Figure 1D Shown in.

[0053] It can be seen that, by means of the inclined saw cut or milled cut 38, the at least one window attachment surface 36 is shaped / configured to be inclined at a first inclination angle relative to the second substrate surface 14b of the first substrate 14. As a result, a window (transmissive for the desired spectrum) can be fixed relatively easily to the at least one window attachment surface 36 later.

[0054] from Figure 1E As can be seen in the figure, material protrusions 40 adjacent to the oblique saw or mill cut 38, which could be considered interfering, can be removed by means of at least one vertical saw or mill cut 42 in the second substrate surface 14b of the first substrate 14. The vertical saw or mill cut 42 is configured in a second cutting direction having a second inclination angle of between 80° and 90° relative to the second substrate surface 14b of the first substrate 14. Thus, a mid-plane extending centrally through the vertical saw or mill cut 42 is inclined at a second inclination angle of between 80° and 90° relative to the second substrate surface 14b of the first substrate 14. For example, the vertical saw or mill cut 42 can be configured to have a second inclination angle of between 85° and 90°, in particular, between 88° and 90°, relative to the second substrate surface 14b of the first substrate 14. Preferably, the oblique saw or milling cuts 38 and / or the vertical saw or milling cuts 42 extend into the second substrate 24. In particular, the end regions of the oblique saw or milling cuts 38 and / or the vertical saw or milling cuts 42 pointing away from the second substrate surface 14b of the first substrate 14 can lead into each other, thereby separating the material protrusion 40 from at least one remaining material of the first substrate 14.

[0055] It should also be noted that at least one perpendicular saw or mill cut 42 can optionally be formed before, simultaneously with, or after the formation of the at least one inclined saw or mill cut 38. The saw or mill cuts 38 and 42 can be produced relatively quickly and cost-effectively using sawing or milling equipment. Two different inclination angles relative to the second substrate surface 14 b of the first substrate 14 can be set as the cut angle while maintaining a high degree of cut angle accuracy.

[0056] Figure 1EAn embodiment of a lid wafer 44 manufactured using the above-described method steps is shown. The lid wafer 44 includes a first substrate 14 having a first substrate surface 14a. A plurality of first recesses 10 and a plurality of second recesses 12 are formed in the first substrate surface 14a of the first substrate 14 such that a continuous first frame structure 18 is formed from the material of the first substrate 14 with each first recess 10. Each first frame structure 18 surrounds a first recess 10 formed on its inner side 18a. Furthermore, each first frame structure 18 is penetrated by at least one second recess 12 that extends into the corresponding first recess 10. Each second recess 12 extends through at least a portion of the outer surface 36 of the lid wafer 44 as a channel 16. The lid wafer 44 also includes a second substrate 24 having a plurality of through-cut recesses 28. A closed second frame structure 30 is formed from the material of the second substrate 24 with each through-cut recess 28. Furthermore, the second frame structure 30 is fastened to the inner side 18 a of the through-going first frame structure 18 in such a way that the second recess 12 as the channel 16 is covered by the closed second frame structure 30 on the inner side 18 a of the through-going first frame structure 18 .

[0057] By dividing the cover wafer 44 along the dividing lines 20, a plurality of cover devices 46 can also be obtained from the cover wafer 44. The division of the cover wafer 44 can be carried out, for example, by means of a sawing method, a milling method or a trenching method. Each cover device 46 obtained in this way has a through-going first frame structure 18, which is formed from the material of the first substrate 14 and which surrounds a first groove 10 constructed on its inner side 18a and is penetrated by at least one second groove 12 constructed on its inner side 18a and leading into the first groove 10. In addition, at least one second groove 12 penetrates as a channel 16 through at least a portion of the outer surface 36 of the cover device 46, for example, the window attachment surface 36 of the cover device. In addition to the first frame structure 18, the cover device 46 also includes a closed second frame structure 30, which is formed from the material of the second substrate 24 by means of at least one through recess 28 and is fixed to the inner side 18a of the through-going first frame structure 18 in such a way that at least one second groove 12 is covered by the second frame structure 30 as a channel 16 on the inner side 18a of the through-going first frame structure 18.

[0058] As an optional method step of the production method, Figure 1FIt is shown that at least one channel 16 is covered by at least one window 48 (transmissive for the desired spectrum). The at least one window 48 can be arranged in a self-aligning manner on the corresponding window attachment surface 36. In particular, the at least one channel 16 can be hermetically sealed on the surface of the corresponding window 48 (later) aligned with the window attachment surface 36 and / or on the corresponding window attachment surface 36 by means of at least one bonding frame or adhesive frame 50. Preferably, first, a bonding frame 50 made of sealing glass is deposited on the surface of the at least one window 48 (later) aligned with the corresponding window attachment surface 36, and then, after the at least one window 48 is placed on the corresponding window attachment surface 36, the cover wafer 44 / the at least one cover device 46 is pressed against a chuck 54 by means of pressure 52 at high temperature (see Figure 1G ). Thus, the covering / sealing of at least one channel 16 can be performed relatively quickly by means of the at least one window 48. Alternatively, a plurality of channels 16 can also be covered / sealed in this manner by means of a single window 48.

[0059] As another optional method step, Figure 1H The diagram shows the deposition of at least one material 56 onto the lid wafer 44 / the at least one lid component 46. In this way, for example, a tin layer 56 can be formed on the bonding or adhesive layer 34, which later serves as at least one attachment surface 56a for the lid wafer 44 / the at least one lid component 46. However, the fact that the at least one attachment surface 56a of the lid wafer 44 / the at least one lid component 46 is composed of tin is to be interpreted merely as an example. The outer side 30a of the closed second frame structure 30 or a layer formed / deposited directly or indirectly on the outer side 30a and made of (almost) any material can also be used as the attachment surface 56a for the lid wafer 44 / the at least one lid component 46.

[0060] Figure 2A and 2B A schematic diagram is shown for explaining one specific embodiment of a method for producing a micromechanical package for at least one component.

[0061] To implement the method described herein, at least one cover component 46 or cover wafer 44 is manufactured according to the manufacturing method described above. Before, simultaneously with, or after manufacturing the at least one cover component 46 or cover wafer 44, at least one carrier component 60 or carrier wafer 62 is formed from the material of a third substrate 64. The at least one carrier component 60 is formed such that it can be fixed to the fixing surface 56a of the corresponding cover component 46 on the side of its closed second frame structure 30 that faces away from its through-through first frame structure 18. Correspondingly, the carrier wafer 62 is also formed such that it can be fixed to the fixing surface 56a of the cover wafer 44 on the side of its closed second frame structure 30 that faces away from its through-through first frame structure 18. A plurality of carrier components 60 can be structured from the carrier wafer 62 by separating the carrier wafer 62 along a dividing line 66 (before or after fixing the carrier wafer 62 to the cover wafer 44).

[0062] With the help of Figure 2A and 2B In the embodiment presented, in particular, at least one through-hole 68 is formed through at least one carrier component 60 or carrier wafer 62. For this purpose, at least one through-hole 70 is structured / etched through at least one carrier component 60 / carrier wafer 62. Figure 2A Shown in.

[0063] Subsequently, an isolation layer 72 is formed on the substrate surface of the third substrate 64 and on the sidewalls of at least one through-hole 70. The isolation layer 72 may be, for example, a silicon dioxide layer. If the third substrate 64 is made of silicon, the isolation layer 72 made of silicon dioxide may be formed by thermal oxidation. Optionally, at least one diffusion barrier (not shown) and / or at least one seed layer (not shown) may be deposited thereafter. Subsequently, as shown in FIG. Figure 2B As shown, at least one electrically conductive material 74 is deposited and structured. The at least one electrically conductive material 74 can be, for example, at least one metal, in particular copper. Thus, at least one through-contact 68 can be produced with relatively little effort.

[0064] Figure 2B A finished micromechanical package for at least one component (not shown) is shown. The micromechanical package has at least one cover component 46 or cover wafer 44. Furthermore, the micromechanical package includes at least one carrier component 60 or carrier wafer 62 made of the material of a third substrate 64, wherein the at least one carrier component 60 can be fixed to the fixing surface 56a of the corresponding cover component 46 on the side of its enclosed second frame structure 30 pointing away from the first frame structure 18 through which it passes, or the carrier wafer 62 can be fixed to the fixing surface 56a of the cover wafer 44 on the side of its enclosed second frame structure 30 pointing away from the first frame structure 18 through which it passes.

[0065] Figure 3A and 3B A schematic diagram is shown for explaining one specific embodiment of a method for packaging at least one component.

[0066] To implement the method described below, a micromechanical package is produced for at least one component 80 (to be packaged) having at least one lid component 46 or lid wafer 44 and at least one carrier component 60 or carrier wafer. The micromechanical package is produced according to the method described above.

[0067] Subsequently, at least one device 80 is placed on at least one carrier device 60 or carrier wafer 62 of the micromechanical package. Figure 3A and 3B In the schematically presented embodiment, at least one component 80 is fixed to its corresponding carrier component 60 or to a position of the carrier wafer 62 corresponding to the at least one component, for example, by means of at least one solder 82. In particular, each component 80 can be electrically connected to its corresponding at least one through-hole 68 in this manner. Figure 3A Shown in.

[0068] Figure 3B As shown, at least one carrier component 60 is fixed to the fixing surface 56a of the corresponding cover component 46, or the carrier wafer 62 is fixed to the fixing surface 56a of the cover wafer 44. This is achieved in that at least one device 80 arranged on at least one carrier component 60 / carrier wafer 62 is surrounded by at least one carrier component 60 / carrier wafer 62 and at least one cover component 46 / cover wafer 44. For example, the bonding method can be used to implement the bonding method. Figure 3B The method steps presented. In particular, a copper-tin-copper bonding method can be implemented, for which the tin layer 56 already described above can be used. Since the copper-tin-copper bonding method can be implemented at relatively low temperatures and allows for a durable and hermetically sealed connection, even temperature-sensitive components 80 can be hermetically sealed using the copper-tin-copper bonding method. In particular, the bonding method can be implemented under a defined atmosphere and a defined pressure. Figure 3B The method steps presented thus make it possible to set a desired atmosphere and / or a desired internal pressure, for example a negative pressure, in the at least one cavity 32 sealed in this manner.

[0069] Subsequently, by dividing the layer structure formed by the lid wafer 44 and the carrier wafer 62 along the dividing lines 20 and 66 , the packaged devices 80 can be singulated as apparatuses.

[0070] All of the methods described above can be implemented in a simple manner so that the at least one respectively encapsulated component 80 is not damaged. In particular, the at least one encapsulated component 80 is not exposed to high temperature loads, high pressures, or aggressive media. These methods also enable good calibration accuracy to be achieved.

[0071] Figure 4 A schematic diagram of a first embodiment of the device is shown.

[0072] exist Figure 4 The device schematically shown in FIG 4 comprises a micromechanical package having a cover component 46, a carrier component 60, and at least one component 80 arranged on the carrier component 60. The carrier component 60 is fixed to the fixing surface 56a of the cover component 46 in such a way that the component 80 is surrounded by the carrier component 60 and the cover component 46 fixed thereto.

[0073] The channels 16 extending laterally from the cover element 46 reliably prevent liquids or contaminants from penetrating into the cavity 32 of the micromechanical package. Nevertheless, the at least one encapsulated component 80 can be arranged on the carrier element 60 in such a way that a light beam 84 emitted by the at least one component 80 is emitted from the cavity 32 through the channels 16 in an emission direction oriented parallel to the surface of the respective carrier element 52.

[0074] As an optional development, the micromechanical package is also hermetically sealed by means of a window 48 fixed to window attachment surface 36 such that a desired atmosphere and / or a preferred internal pressure, in particular a negative pressure, can prevail in cavity 32 .

[0075] Figure 5 A schematic diagram of a second embodiment of the device is shown.

[0076] As a supplement to the above implementation, Figure 5 The device shown schematically in FIG also has a mirror element 90 attached to the cover device 46. Figure 5 It can be seen that the mirror element attachment surface 92 on the cover component 46 can be formed by means of additional oblique saw cuts or milling cuts and by means of additional vertical saw cuts or milling cuts.

[0077] about Figure 5 For other features of the device, see Figure 4 The aforementioned implementation method.

[0078] Figure 6 A schematic diagram of a third embodiment of the device is shown.

[0079] from Figure 6 It can be seen that it is also possible to package multiple optical devices 80 by means of one cover device 46 and one carrier device 60. Figure 6For other features of the device, see Figure 4 and Figure 5 The aforementioned implementation method.

[0080] All of the above-described devices each include a laser diode 80 as the at least one packaged component 80. However, it should be noted that, instead of the laser diode 80, other types of light-emitting devices and / or light-detecting devices can also be packaged as the at least one component 80. Similarly, the at least one component 80 can also be a micromechanical component, a chemical sensor device, and / or a physical sensor device. Micromechanical packaging can advantageously package micromechanical components, particularly those having at least one adjustable / movable component, such as acceleration sensors and / or speed sensors. By setting a desired pressure in the cavity 32 of the micromechanical package, favorable adjustability of the movable / adjustable component can be determined. However, the hermetic sealing of the corresponding micromechanical package can optionally be omitted.

[0081] All of the aforementioned micromechanical packages can be easily adapted with regard to their dimensions, the course of channels 16 or the use thereof for various components 80 .

Claims

1. A manufacturing method for manufacturing at least one cover device (46) or a cover wafer (44), the manufacturing method comprising the following steps: At least one first groove (10) and at least one second groove (12) are formed in a first substrate surface (14a) of a first substrate (14) such that a first through-frame structure (18) formed of the material of the first substrate (14) is formed by means of the at least one first groove (10), the through-frame structures respectively surrounding a first groove (10) formed on the inner side (18a) thereof, and the through-frame structures are penetrated by at least one second groove (12) that leads into the corresponding first groove (10); forming at least one through-going recess (28) through the second substrate (24) in such a way that a closed second frame structure (30) formed from the material of the second substrate (24) is formed by means of the at least one through-going recess (28), and, before forming the at least one through-going recess (28) or forming the at least one closed second frame structure (30), fixing the second substrate (24) on the inner side (18a) of the at least one through-going first frame structure (18) in such a way that the at least one second groove (12) on the inner side (18a) of the at least one through-going first frame structure (18) is covered by the at least one closed second frame structure (30); At least one partial outer surface (36) of at least one subsequent cover component (46) or of at least one subsequent cover wafer (44) is configured on at least one first frame structure (18) and the at least one second frame structure (30) in such a way that the at least one second recess (12) passes through the at least one partial outer surface (36) of the at least one subsequent cover component (46) or of the at least one subsequent cover wafer (44) as a channel (16), wherein: When constructing the at least one partial outer surface (36) of the at least one subsequent cover device (46) or the at least one subsequent cover wafer (44), the at least one window attachment surface (36) of the at least one subsequent cover device (46) or the at least one subsequent cover wafer (44) is constructed by the following steps: forming at least one inclined saw cut or milling cut (38) in a second substrate surface (14b) of the first substrate (14) pointing away from the first substrate surface (14a), wherein the inclined saw cut or milling cut (38) is formed in a first cutting direction having a first inclination angle of between 10° and 80° relative to the second substrate surface (14b) of the first substrate (14); Before, simultaneously with or after forming the at least one inclined saw cut or milling cut (38), at least one vertical saw cut or milling cut (42) is formed in the second substrate surface (14b) of the first substrate (14), wherein the vertical saw cut or milling cut (42) is formed in a second cutting direction having a second inclination angle between 80° and 90° relative to the second substrate surface (14b) of the first substrate (14).

2. A method for producing a micromechanical package for at least one device (80), comprising the following steps: Manufacturing at least one cover device (46) or cover wafer (44) according to the manufacturing method of claim 1; At least one carrier component (60) or carrier wafer (62) is formed from the material of the third substrate (64) in such a way that the at least one carrier component (60) can be fixed on the fixing surface (56a) of the corresponding cover component (46) on the side of its closed second frame structure (30) pointing away from its through first frame structure (18), or the carrier wafer (62) can be fixed on the fixing surface (56a) of the cover wafer (44) on the side of its closed second frame structure (30) pointing away from its through first frame structure (18).

3. The method according to claim 2, wherein: At least one through-hole (68) is formed through the at least one carrier component (60) or the carrier wafer (62).

4. A method for packaging at least one device (80), the method comprising the following steps: Manufacturing a micromechanical package according to the method of claim 2 or 3; Arranging the at least one device (80) on at least one carrier device (60) or carrier wafer (62) of the micromechanical package; The at least one carrier component (60) is respectively fixed on the fixing surface (56a) of the corresponding cover component (46), or the carrier wafer (62) is fixed on the fixing surface (56a) of the cover wafer (44).

5. A cover wafer (44), comprising: A first substrate (14) having a first substrate surface (14a), wherein A plurality of first grooves (10) and a plurality of second grooves (12) are formed in a first substrate surface (14a) of the first substrate (14) such that a first through frame structure (18) formed of the material of the first substrate (14) is formed by means of each first groove (10), the through first frame structures each surrounding a first groove (10) formed on their inner side (18a), and the through first frame structure is penetrated by at least one second groove (12) that leads to the corresponding first groove (10); a second substrate (24) having a plurality of through-going recesses (28), wherein each through-going recess (28) forms a closed second frame structure (30) made of the material of the second substrate (24), wherein the closed second frame structure (30) is fastened to the inner side (18a) of the through-going first frame structure (18) in such a way that the second groove (12) on the inner side (18a) of the through-going first frame structure (18) is covered by the closed second frame structure (30); wherein the second grooves (12) serve as channels (16) respectively penetrating at least a portion of the outer surface (36) of the cover wafer (44), The wafer cover is manufactured by the manufacturing method according to claim 1 .

6. A cover device (46), comprising: a first through-hole frame structure (18), the first frame structure being formed from the material of the first substrate (14), the first frame structure surrounding a first groove (10) formed on the inner side (18a) of the first frame structure (18), and the first through-hole frame structure being penetrated by at least one second groove (12) formed on the inner side (18a) of the first frame structure (18) and leading into the first groove (10); a closed second frame structure (30), which is formed from the material of the second substrate (24) by means of at least one continuous recess (28) and is fixed to the inner side (18a) of the through-going first frame structure (18) in such a way that the at least one second recess (12) on the inner side (18a) of the through-going first frame structure (18) is covered by the closed second frame structure (30); in, The at least one second groove (12) passes through at least a portion of the outer surface (36) of the cover device (46) as a channel (16), The cover device is manufactured by the manufacturing method according to claim 1 .

7. A micromechanical package for at least one device (80), the micromechanical package comprising: The cover device (46) according to claim 6 or the cover wafer (44) according to claim 5; and At least one carrier component (60) or carrier wafer (62) made of the material of a third substrate (64), wherein the at least one carrier component (60) can be fixed on the fixing surface (56a) of the corresponding cover component (46) on the side of its closed second frame structure (30) pointing away from its through-through first frame structure (18), or the carrier wafer (62) can be fixed on the fixing surface (56a) of the cover wafer (44) on the side of its closed second frame structure (30) pointing away from its through-through first frame structure (18).

8. A device comprising: The micromechanical package according to claim 7; at least one device (80) disposed on a carrier device (60) of the micromechanical package; in, The carrier component (60) is fixed on a fixing surface (56a) of a cover component (46) of the micromechanical package.

9. The device according to claim 8, wherein The at least one component (80) is a micromechanical component.

10. The device according to claim 8, wherein The at least one device (80) is a light emitting device and / or a light detecting device.

11. The device according to claim 8, wherein The at least one device (80) is a chemical sensor device and / or a physical sensor device.

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