Holding device for components to be broken

Abstract

A holding device (100) for a component to be broken (1), which is designed to be separated along a breaking plane (4) defined between an upper part (7) and a lower part (8) of the component to be broken (1), the holding device (100) comprising: at least two lugs (9), which are configured to hold the component to be broken (1) suspended in a substantially horizontal holding position, the lugs (9) being intended to be located between the upper part (7) and the lower part (8), against a peripheral chamfer (10) of the upper part; a support member (15), which is located below the lugs (9) and away from the lugs (9) to receive the lower part (8) by gravity when the component to be broken (1) is separated, and to hold the lower part at a certain distance from the upper part (7) held by the lugs (9).

Description

Technical Field

[0001] The present invention relates generally to the processing of materials and, more particularly, to the processing of substrates for electronic, optical or optoelectronic devices.

[0002] More specifically, the present invention relates to a holding device for a fracturable component intended to be separated along a fracturing plane between an upper portion and a lower portion of the fracturable component. Background Art

[0003] Smart Cut TM A known method for manufacturing a SOI "Silicon On Insulator" substrate comprises the following steps:

[0004] - a step of ion implanting a light species at a given depth in a donor substrate, so as to form a buried brittle plane comprising a microcavity and delimiting a surface layer intended to be transferred to a support substrate; the donor substrate is constituted, for example, of single-crystalline silicon;

[0005] - a step of assembling the donor substrate on a support substrate such as silicon (optionally surface oxidized), the assembly forming a breakable assembly;

[0006] - A breaking step of separating the breakable assembly along the buried brittle plane into a first portion comprising the support substrate and the transferred surface layer (SOI substrate) and a second portion comprising the remainder of the donor substrate.

[0007] During this last step, the embrittlement heat treatment promotes the coalescence and pressurization of the microcavities present in the buried brittle planes. Under the action of this heat treatment alone, or with the help of additional forces applied after the heat treatment, the initiation and propagation of fragmentation waves along the buried brittle planes allow the fragmentable assembly to separate into two parts.

[0008] This final step is traditionally accomplished in an annealing furnace. Figure 1 The horizontal configuration is shown in . These furnaces are designed to process multiple breakable components simultaneously in a 210 quartz tube.

[0009] therefore, Figure 1 A plurality of breakable assemblies 1 are shown arranged on a container 110 such as a quartz holder, aligned parallel to each other. The holder 110 is itself placed on a movable spoon 120, allowing the breakable assemblies 1 to be loaded into the tube 210 of the furnace and unloaded at the end of annealing.

[0010] Available from Figure 1 It can be seen that the breakable components 1 are arranged vertically, that is, the breakage planes of the individual breakable components 1 are vertical.

[0011] Due to the vertical arrangement of the breakable assembly 1, after breaking, the two parts are still very close to each other, even pressed against each other. The parts must then be gripped very carefully in order to ensure that the two parts are separated without damaging their surface finish (especially by friction). Various methods have been developed to achieve this manipulation. In particular, documents EP 1124674 or EP 1423244 can be cited.

[0012] Document EP 1331663 proposes an alternative to the horizontal annealing furnace. In this document, the breakable components are not arranged vertically, but horizontally. This document also describes the possibility of manipulating the breakable components using a manipulating robot before and after separation.

[0013] The Applicant has noticed that when the breakable assembly is positioned horizontally, the sliding of one part relative to the other during breakage and / or the step of gripping the various parts resulting from the separation can cause scratches on the face-to-face of the two parts, due to possible relative movement and friction of one part on the other. This is especially true if the assembly rests on a rigid support. After separation, the substrate located on top will approach the lower substrate under the effect of its own weight. The smaller the distance separating the two substrates, the higher the probability of contact (and therefore damage).

[0014] From document EP 1385683 a cutting device and a method are known which allow to separate with high precision two parts resulting from the fragmentation of a fracturable component. This method involves placing the fracturable component horizontally on a fixed flat chassis which also supports a wedge and a support for the movement of a fixed blade on this mobile support. The side surface of the fracturable component abuts against the wedge, the blade being intended to initiate the separation of the fracturable component in the fracturing plane.

[0015] However, this document does not address the prospect of the parts resulting from the breakable assembly once separation is complete. In fact, for such a device, it would be difficult to keep the various parts at a distance from each other, in particular in order to be able to grasp them, manipulate them and move them without risk of damage or contamination. Summary of the invention

[0016] The object of the present invention is to at least partially solve the above mentioned drawbacks by proposing a device which allows to separate the two parts of a horizontally breakable assembly after breaking with minimal intervention and which allows said parts to be easily manipulated, thus limiting the risks of damage or contamination.

[0017] To achieve this purpose, the subject of the invention proposes a holding device for a breakable assembly, intended to be separated along a breakage plane defined between an upper part and a lower part of the breakable assembly, comprising:

[0018] - at least two protrusions configured to keep the breakable assembly suspended in a substantially horizontal holding position, these protrusions being intended to be located between the upper part and the lower part against a peripheral chamfer of the upper part;

[0019] - A support member located below the protrusion and at a distance from the protrusion to receive the lower part by gravity when the fracturable assembly is separated and to keep the lower part at a distance from the upper part held by the protrusion.

[0020] Such a device allows the two parts of the breakable assembly to be separated and held at a distance from each other without reliance on any external manipulation which could damage or contaminate either part. The separation is provided solely by the action of gravity on the lower substrate.

[0021] Such a device also has the advantage of not applying any contact with the face of the various parts of the breakable component. Contact or stress applied on the face of the breakable component could deteriorate the quality of the breakage and thus reduce the uniformity of the transferred layer. Therefore, the device according to the invention has the advantage of providing a substrate showing a significant surface homogeneity.

[0022] Other advantages and non-limiting features of the invention considered alone or in any technically feasible combination:

[0023] - the distance between the support and the protrusion is between 1.5 and 10 mm, preferably between 2 and 5 mm;

[0024] - protrusions are provided on the column;

[0025] - at least one protrusion is provided on the removable post capable of being moved to place the fracturable component in a retaining position;

[0026] - the retaining means comprises at least three protrusions;

[0027] - the holding device further comprises means for inducing a fragmentation wave for inducing separation of the fragmentable component in a fragmentation plane;

[0028] - the initiation device comprises a blade;

[0029] - the initiating means comprises an ultrasonic device capable of emitting ultrasonic waves;

[0030] The support is intended to receive the lower portion near its back side and comprises a recess to allow the lower portion to be gripped by its back side.

[0031] The subject matter of the invention also relates to a separating device for separating fracturable components, comprising a housing and a holding device as described above arranged in the housing.

[0032] Other advantageous and non-limiting features of the invention considered alone or in any technically feasible combination are:

[0033] - the housing is a chamber of a furnace for heat treatment of the fracturable component and for embrittlement of the fracturing plane;

[0034] - the furnace comprises means for heating by convection, by IR or microwave radiation, by induction;

[0035] -The furnace is a single wafer rapid annealing furnace. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Further advantages and features of the invention will become apparent when reading the detailed description of embodiments which are by no means limiting, with reference to the attached drawings, in which:

[0037] [ Figure 1 ] Figure 1 A prior art annealing furnace is depicted;

[0038] [ Figure 2 ] Figure 2 depicts a cross-sectional view of a fracturable component;

[0039] [ Figure 3A ] Figure 3A depicts a side cross-sectional view of a retaining device according to the present invention prior to separation of a breakable component;

[0040] [ Figure 3B ] Figure 3B depicts a top view of a holding device according to the present invention;

[0041] [ Figure 3C ] Figure 3C Depicted is a side cross-sectional view of a retaining device according to the present invention after separation of a breakable assembly. DETAILED DESCRIPTION

[0042] Throughout the following description, detailed descriptions of known functions and elements that may unnecessarily obscure the gist of the present invention will be omitted.

[0043] The drawings are schematic representations which, for the sake of readability, are not necessarily to scale. In particular, the thicknesses of the layers are not to scale either with respect to the lateral dimensions of these layers, nor with respect to the dimensions of the elements forming the holding device according to the invention.

[0044] The invention relates to a holding device for a fracturable component 1 . Figure 2 The structure of such a breakable component 1 is schematically shown in FIG.

[0045] Conventionally, as described in the introduction, the breakable component 1 is provided with a Smart Cut TM Method implementation.

[0046] In this method, a step of ion implantation of light species (eg hydrogen and / or helium ions) is performed in the donor substrate 2 near the main face 3. The donor substrate 2 may consist of single crystal silicon or any other material of interest.

[0047] In a manner known per se and as Figure 2 As shown, the purpose of implanting ions is to form a brittle buried region 4 (hereinafter referred to as "fragmentation plane 4") which delimits the thin layer 5 located on one side of the main surface 3 and the rest of the donor substrate 2 (referred to as the negative part) on the other hand.

[0048] In a step subsequent to assembly (also well known), the main face 3 of the donor substrate 2 is assembled with one face of a support substrate 6. The support substrate 6 may consist of any material of interest, such as silicon, sapphire or glass.

[0049] The step of assembling the donor substrate 2 on the support substrate 6 may include direct bonding by molecular adhesion of the donor substrate 2 to the support substrate 6. An intermediate layer (not shown), for example made of silicon oxide, may be formed on one of the faces of one of the substrates 2, 6 before assembling.

[0050] At the end of this assembly step, a breakable assembly 1 is obtained comprising two associated substrates, the face of the support substrate 6 being adhered to the main face 3 of the donor substrate 2 .

[0051] The breakable assembly 1 , when in a horizontal position, has a break plane 4 defined between an upper portion 7 and a lower portion 8 , the upper portion 7 being located above the lower portion 8 .

[0052] exist Figure 2 In the example shown, the upper part 7 comprises the negative portion of the donor substrate 2. The lower part 8 for its part comprises the support substrate 6 and the thin layer 5 intended to be transferred. However, the invention is by no means limited to this configuration, and it is perfectly conceivable that the upper part 7 comprises the assembly of the support substrate 6 and the thin layer 5 and the lower part 8 comprises the negative portion of the donor substrate 2.

[0053] Smart Cut TM The purpose of this type of method is to transfer a thin layer 5 of a donor substrate 2 onto a supporting substrate 6. As previously mentioned, this transfer is traditionally performed after a heat treatment step for embrittlement of the fracture plane 4, followed by a step of inducing separation (thermal or mechanical) in order to propagate a fracture wave and cause separation between the two parts 7, 8 of the breakable component 1. In the context of the present application, the term separation means that the breakable component detaches in the vicinity of the fracture plane, resulting in the formation of the two parts 7, 8.

[0054] Figure 3A A holding device 100 according to the invention is depicted. Figure 3AAn orthogonal Oxyz coordinate system is shown in , such that the Oxy plane is horizontal. The holding device 100 comprises at least two protrusions 9 configured to hold the fracturable assembly 1 suspended in a substantially horizontal holding position.

[0055] In this description, the term "suspended" means that when the breakable assembly 1 is in the holding position, before separation, the face of the lower part 8 opposite the breaking plane 4 is not in contact with any support.

[0056] The term "substantially horizontal" means that the breakable assembly 1 is in a horizontal position, ie parallel to the Oxy plane, with an inclination relative to the horizontal plane less than or equal to ±10°, preferably less than or equal to ±5°.

[0057] Figure 3A The fracturable component 1 is shown in a holding position before separation. In this holding position, the protrusion is located between the upper part 7 and the lower part 8 of the fracturable component 1, abutting against the peripheral chamfer 10 of the upper part 7 (also shown in FIG. Figure 2 ).

[0058] Conventionally, for example, for a circular substrate with a diameter of 200 mm or 300 mm, the peripheral chamfer 10 of the upper portion 7 and the chamfer 11 of the lower portion 8 (if present) form a circular groove at the periphery of the breakable component 1 .

[0059] Each groove 9 has an end 12 configured to be inserted into the groove. The end 12 must be thin enough to be introduced deep enough into the groove to reliably hold the fracturable component 1 in the holding position.

[0060] Advantageously, the protuberance 9 is beveled, the thickness of which in direction (Oz) decreases in direction (Oy) from the base 13 to the end 12 .

[0061] Typically, the depth of the groove in the direction (Oy) is about 250 μm, and the gap between the upper portion 7 and the lower portion 8 in the direction (Oz) near the periphery of the groove is about 300 μm. In order to reliably hold the breakable component 1 in the holding position, the thickness of the end portion 12 is preferably less than 1 mm (e.g., 200 μm). The angle formed by the chamfer may be about 20°.

[0062] For optimal insertion into the slot, the end 12 may present a shape in the Oxy plane that is complementary to the shape of the slot. For example, if the slot is circular, the end 12 may have a concave circular geometry with a radius of curvature similar to that of the slot ( Figure 3B ).

[0063] Of course, the invention is by no means limited to the shapes of the substrate and protrusions previously described. For example, the substrate and therefore the groove may have a polygonal shape (e.g. rectangular), in which case the end 12 may have a straight geometry in the Oxy plane. The protrusion 9 may also have a uniform thickness in the direction (Oz), preferably less than 1 mm (e.g. equal to 200 μm).

[0064] The projections 9 are arranged on supporting elements 14 near their bases 13, which allow them to be kept at a height and angular position determined by the periphery of the fracturable assembly 1. Advantageously, the supporting elements 14 can be pillars. Compared to the assumption that the projections 9 would be arranged on the wall surrounding the device, this configuration facilitates the manipulation of the fracturable assembly 1 (before separation) and the two parts 7, 8 (after separation) between the projections 9, in particular with the use of an articulated arm.

[0065] Regardless of the nature of the support element 14 provided with the protrusion 9, the support element 14 and the protrusion 9 are formed by having a similar structure to that of Smart Cut. TM The separation methods of the method traditionally require materials that meet the cleanliness level required to avoid any contamination. For example, these materials can be selected from quartz, silicon carbide, silicon or certain polymers (e.g., ).

[0066] In a particularly advantageous manner, at least one protrusion 9 is movable so that it can be removed when the fracturable component is installed. To this end, the protrusion 9 can be fixed to a removable column. When the fracturable component 1 is mounted on the holding device 100, the fracturable component 1 is positioned to engage with the peripheral groove in the other protrusion 9 (for example, by means of an articulated arm) so as to place the peripheral chamfer 10 on the protrusion 9. Subsequently, the removable column can be moved until the movable protrusion 9 abuts against the peripheral chamfer 10 and is then arranged in this position, thereby placing the fracturable component 1 in the holding position.

[0067] According to a first alternative embodiment, the size of the end 12 of the protrusion 9 in the Oxy plane may be a fraction of the perimeter of the peripheral chamfer 10 .

[0068] For example, the size of the end 12 may be approximately one quarter, one third or even half of the circumference of the peripheral chamfer 10. Generally, in this first alternative embodiment, two protrusions 9 will be sufficient to hold the breakable assembly 1 in its holding position, especially when they are arranged facing each other.

[0069] According to a second particularly advantageous alternative embodiment, the dimensions of the end 12 of the projection 9 in the Oxy plane are negligible compared to the circumference of the peripheral chamfer 10 .

[0070] In the present description, the term “negligible” means that the size of the end portion 12 is smaller than a quarter of the circumference of the peripheral chamfer 10 , or even smaller than a tenth of the circumference of the peripheral chamfer 10 .

[0071] Typically, the dimension of the end 12 in the Oxy plane may be 10 mm.

[0072] This configuration allows the projection 9 to be arranged on a narrow column 14 so as to reduce its space requirement and facilitate handling operations.

[0073] exist Figure 3B In the alternative embodiment shown, the holding device 100 comprises at least three protrusions 9. This allows the breakable component 1 to remain stable in its holding position despite the small size of the protrusions 9. For example, the holding device 100 may comprise three, four, five, or even six protrusions 9 for holding the breakable component 1.

[0074] In case the retaining device 100 comprises more than four protrusions 9, it is desirable that at least two of the protrusions 9 are movable, being arranged on removable posts, to facilitate the manipulation and positioning of the fracturable assembly 1 in the retaining position.

[0075] Preferably, in order to provide better stability, the protrusions 9 are evenly positioned around the breakable component 1. For example, when the peripheral chamfer 10 is rounded, the protrusions 9 are evenly distributed around the breakable component 1, such as Figure 3B However, the present invention is by no means limited to this distribution.

[0076] As already mentioned, the breakable assembly 1 is intended to be separated along a breaking plane 4 in order to form an upper part 7 and a lower part 8 . Figure 3C 1 shows an illustration of the holding device 100 after separation of the fracturable component 1. The upper part 7 includes a front face 16 resulting from separation near the fracturing plane 4 of the fracturable component 1, which faces the front face 17 of the lower part 8. The upper part 7 also includes a back face 18 opposite to its front face 16. The lower part 8 similarly includes a back face 19 opposite to its front face 17.

[0077] The holding device 100 according to the invention comprises a support 15 located below the protrusion 9 and at a distance from the protrusion 9 .

[0078] In the context of this description, the term "below" means that when the support 15 is used with the fracturable assembly 1, it is positioned relative to the protrusion 9 so as to receive the lower part 8 by gravity when the fracturable assembly 1 is separated. In other words, when the fracturable assembly 1 is separated, the upper part 7 and the lower part 8 are separated in the vicinity of the fracturing plane 4: the upper part 7 remains held by the protrusion 9, while the lower part 8 is driven by gravity until its back face 19 comes into contact with the support 15.

[0079] The term "at a distance" means that the distance between the support 15 and the protrusion 9 is strictly greater than the thickness of the lower part 8, so that in the holding position, the breakable assembly 1 is not in contact with the support 15. The contact area between the breakable assembly 1 and the holding device 100 is therefore limited to the protrusion 9. Holding the breakable assembly 1 solely by the protrusion 9 allows minimizing the stresses applied thereto. Minimizing the contact surface between the breakable assembly 1 and the holding device 100 allows the various parts 7, 8 of the breakable assembly 1 to deform freely during fragmentation. Since any contact with the back surface 19 of the lower part 8 forms an indentation on its front surface 17 when fragmenting, minimizing these contacts promotes the homogeneous propagation of the fragmentation wave.

[0080] The term "at a distance" also means that when the fracturable assembly 1 is separated, the distance between the support 15 and the protrusion 9 is sufficient to allow the lower part 8 to be effectively separated from the upper part 7 retained by the protrusion 9 and to keep the two parts at a distance from each other, i.e. without any contact between their front faces 16, 17.

[0081] Advantageously, the distance between the support 15 and the projection 9 is sufficient to allow either of the portions 7 , 8 to be manipulated and removed without any risk of contact between them.

[0082] By way of example, for a lower portion 8 having a thickness in direction (Oz) comprised between 500 and 800 microns, the distance between protrusion 9 and support 15 is chosen to be comprised between 1.5 and 10 mm, or even between 2 and 5 mm.

[0083] The support 15 may be in one piece and connected to at least part of the support element 14. For example, it may be a plate designed integrally with the support element 14, for example circular and preferably consisting of the same material as them.

[0084] According to a particularly advantageous configuration, the support 15 comprises a recess to allow the lower part 8 to be gripped (for example, by an articulated arm of an automatic robot) by means of the back face 19 of the lower part 8. This configuration avoids any intervention in the area between the two front faces 16, 17, which could damage or contaminate either of the parts 7, 8.

[0085] Alternatively, the holding device 100 may include a plurality of supports 15, each of which is independently connected to the support element 14, so that the faces of the plurality of supports 15 facing the protrusions 9 are parallel and at the same height to hold the lower part 8 in a substantially horizontal position after separation. For example, if the support element includes a column 14, the support 15 may be the base of the column 14 extending below the protrusion in the same direction as the protrusion 9. In this particular embodiment, the lower part 8 is driven by gravity until its back face 19 contacts the plurality of supports 15.

[0086] The shape of the support 15 is not critical, for example rectangular. Preferably, its shape is adapted to be as compact as possible and not hinder the handling of the lower part 8.

[0087] Similarly, the size of the support 15 is not critical and may be selected according to the size of the breakable assembly 1 to limit space requirements, allow the lower portion 8 to be gripped by its back face 19 , and be strong enough to support the support element 14 and the breakable assembly 1 .

[0088] In any case, in order to allow comfortable handling, the distance between the two parts 7 , 8 resulting from the breakable element 1 after separation is preferably greater than 1 mm.

[0089] However, this distance must not be too great so as to avoid the risk of damaging the lower part 8 when it ends its fall in contact with the support 15 .

[0090] The Applicant has noted in particular that there is a maximum distance of approximately 5 mm which should not be exceeded in order to benefit from the physical effects that allow the speed of the lower part 8 to decrease as it falls, after the breakable assembly 1 has been separated.

[0091] When the two parts 7, 8 separate near the fracture plane 4, the lower part 8 is pulled towards the support 15 under the effect of gravity. Due to the pressure of the gaseous substance in the cavity forming the fracture plane 4, the pressure in the space between the back surface 19 of the lower part 8 and the support 15 is close to atmospheric pressure and lower than the pressure in the space between the two parts 7, 8. This pressure difference also promotes the separation of the two parts 7, 8.

[0092] However, the sudden separation of the two parts 7 , 8 results in a pressure deficit in the space between said parts 7 , 8 which slows down the fall of the lower part 8 , the pressure above which is lower than the pressure below.

[0093] The close spacing of the two parts 7, 8, combined with the viscosity of the air, limits the circulation of air and the re-equilibrium of pressure between the two parts 7, 8, which helps to slow down the fall of the lower part 8 until it contacts the support 15. This therefore reduces the risk of damaging the back side 19 of the lower part 8.

[0094] Therefore, when the back face 19 of the lower part 8 is in contact with the support 15 , the distance between the two front faces 16 , 17 is preferably between 1 and 5 mm in order to preserve the above-mentioned effect of promoting a controlled landing of the lower part 8 on the support 15 .

[0095] Where the lower part 8 is a SOI substrate, it is typically about 700 to 800 microns thick for a diameter of 200 or 300 mm.

[0096] Advantageously, and in no way limiting, the holding device 100 according to the invention can be used within the context of a separation apparatus for separating breakable components 1 .

[0097] The holding device 100 may be arranged in a housing, for example a chamber of a furnace capable of heat treating the fracturable component 1 at a temperature ranging from 100 to 500°C, for example.

[0098] The means for heating the furnace may be means for heating by convection, by infrared or microwave radiation or by induction.

[0099] This heat treatment, known per se, allows embrittlement of the fracture planes 4 by promoting the coalescence and compression of the microcavities contained therein.

[0100] Preferably, the holding device 100 is arranged in a single wafer rapid annealing furnace so as to enable the breakable component 1 to reach the embrittlement and / or breakage temperature in a very short period of time (usually, a few seconds to a few minutes). Such a speed allows for rapid separation of the breakable component 1, thereby allowing for a significantly high yield of the separation device.

[0101] Assuming that the holding device 100 is included in the separation device and the holding device 100 is likely to be placed in a furnace, in addition to meeting the conditions related to the contamination of the upper part 7 and the lower part 8 of the fracturable component 1, the material forming the support element 14 and the protrusion 9 must have heat resistance that meets the above-mentioned temperature. Specifically, from the above list, the material forming the support element 14 and the protrusion 9 is preferably selected from quartz, silicon carbide, silicon or

[0102] Alternatively, the holding device 100 according to the invention may be arranged not in the furnace but at the outlet of the furnace in order to collect the fracturable components 1 once the embrittlement step has been carried out and before fracturing occurs.

[0103] The holding device 100 according to the invention can also be completely separated from the furnace and the embrittlement of the fracturable component 1 can then be carried out upstream independently of the holding device 100 .

[0104] Advantageously, the housing in which the holding device 100 according to the invention may be placed may comprise means for maintaining a controlled atmosphere, preferably a non-oxidizing atmosphere, for at least some of the treatments. The Applicant has noted that such a non-oxidizing atmosphere will allow the two front faces 16, 17 to be smoothed at a lower temperature than in the case of an atmosphere containing a large amount of oxygen, when the temperature is that applied at least from the moment of separation of the two parts.

[0105] The term "non-oxidizing" is generally understood to mean an atmosphere containing less than 10 ppm of oxygen, which may be contained in molecular oxygen or, in particular, in water. Thus, the controlled atmosphere may be a neutral or reducing atmosphere. The non-oxidizing atmosphere within the enclosure may be obtained by circulating a continuous gas flow of an inert gas (e.g., argon or helium) or a reducing gas (e.g., hydrogen).

[0106] The effect of this smoothing step carried out in a non-oxidizing atmosphere is described in more detail in document FR 3061988.

[0107] According to an alternative embodiment of the invention, the holding device 100 may comprise means for inducing a fragmentation wave in the fragmentation plane 4 of the fragmentable component 1 .

[0108] According to a first option, the initiation means are formed by a mechanical opening element, comprising, for example, a blade. The blade may be provided on one of the removable posts, in addition to or instead of one of the protrusions 9. With the movement of the post 14, the blade may be inserted between the two parts 7, 8, thus applying a mechanical stress capable of initiating the propagation of a fragmentation wave along the fragmentation plane 4. Alternatively, the blade may be fixed to an articulated arm, the movement of which may be controlled independently of the post 14 supporting the protrusion 9.

[0109] The blade is made of a smooth material which is hard enough to penetrate the disintegrable component 1 but not too hard to avoid any risk of damage to the front faces 16, 17 of the parts 7, 8. As an example, the blade may be made of a material such as polyvinyl chloride (PVC) or polyetheretherketone (PEEK).

[0110] According to a second option, the initiation means comprise ultrasonic means capable of emitting ultrasonic waves. The ultrasonic waves directed towards the fracture plane 4 propagate inside the microcavities of the embrittled fracture plane 4, thus allowing the propagation of the initiation fragmentation wave.

[0111] Of course, other options for the initiation device are contemplated.

[0112] According to any of the above options, the mechanical initiation of fragmentation waves may be performed inside or outside the furnace.

[0113] After initiation, the fragmentation wave self-propagates in the fragmentation plane 4, resulting in the separation of the fragmentable component 1 into two parts 7, 8, as previously described and shown in Figure 3C of.

[0114] Of course, the invention is not limited to the embodiments described and alternative embodiments may be added without departing from the scope of the invention as defined by the claims.

[0115] Thus, even though a separation device has been described which allows separation of fracturable components at atmospheric pressure, means may be provided for controlling the pressure of the atmosphere prevailing around the portions 7, 8 during processing or from the moment of separation when this occurs in a housing.

[0116] Thus, the reduction in the housing pressure results in a reduction in the pressure difference existing between the space located between the two parts 7, 8 and the rest of the housing volume immediately after the moment of detachment. The phenomenon of slowing down the fall of the lower part 8 is then minimized. Such a control can be interesting because it allows the lower part 8 and the upper part 7 to be separated from each other at an accelerated rate. Conversely, the separation speed can be reduced by a controlled increase in the pressure prevailing in the housing.

Claims

1. A holding device (100) for a fracturable component (1), the fracturable component (1) being intended to be separated along a fracturing plane (4) defined between an upper part (7) and a lower part (8) of the fracturable component (1), the holding device (100) comprising: - at least two protrusions (9) configured to keep the breakable assembly (1) suspended in a substantially horizontal holding position, the protrusions (9) being intended to be located between the upper part (7) and the lower part (8), abutting against a peripheral chamfer (10) of the upper part (7); - a support (15) located below the protrusion (9) and at a distance from the protrusion (9) to receive the lower part (8) by gravity when the breakable assembly (1) is separated and to keep the lower part (8) at a distance from the upper part (7) held by the protrusion (9), The breakable component (1) comprises a supporting substrate (6) and a donor substrate (2) arranged on the supporting substrate (6), the donor substrate (2) comprises single crystal silicon, the upper part (7) comprises a portion of the donor substrate (2) on the opposite side of the supporting substrate (6) relative to the break plane (4), and the lower part (8) comprises a portion of the donor substrate (2) on the side of the supporting substrate (6) relative to the break plane (4).

2. The holding device (100) according to claim 1, wherein: The distance between the support member (15) and the protrusion (9) is between 1.5 and 10 mm.

3. The holding device (100) according to claim 2, wherein: The distance between the support (15) and the protrusion (9) is between 2 and 5 mm.

4. The holding device (100) according to one of claims 1 to 3, wherein: The protrusion (9) is arranged on a column (14).

5. The holding device (100) according to one of claims 1 to 3, wherein: At least one protrusion (9) is provided on the removable post which is movable to place the breakable assembly (1) in the retaining position.

6. Holding device (100) according to one of claims 1 to 3, comprising at least three protrusions (9).

7. The holding device (100) according to one of claims 1 to 3, further comprising an initiation device for initiating a fragmentation wave to initiate separation of the fragmentable component (1) in the fragmentation plane (4).

8. The holding device (100) according to claim 7, wherein: The initiation device includes a blade.

9. The holding device (100) according to claim 7, wherein: The initiating device comprises an ultrasonic device capable of emitting ultrasonic waves.

10. The holding device (100) according to one of claims 1 to 3, wherein: The support (15) is intended to receive the lower portion (8) near its back face (19) and comprises a recess to allow the lower portion (8) to be gripped by its back face (19).

11. A separation device for separating fracturable components (1), comprising a housing and a holding device (100) according to one of claims 1 to 10 arranged in the housing.

12. The separation device according to claim 11, wherein: The housing is the chamber of a furnace for heat treating the fracturable component (1) and for embrittlement of the fracturing plane (4).

13. The separation device according to claim 12, wherein: The furnace comprises means for heating by convection, by IR or microwave radiation, by induction.

14. The separation device according to claim 13, wherein: The furnace is a single wafer rapid annealing furnace.

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