Method and apparatus for manufacturing mask assembly and method of manufacturing display device

Abstract

An apparatus and method for manufacturing a mask assembly and a method of manufacturing a display device are provided. The apparatus can include a tensioning portion configured to be spaced apart from a mask frame including at least one opening, the tensioning portion configured to tension a mask sheet in at least one of a first direction and a second direction, the mask sheet including a unit area corresponding to the at least one opening and a dummy portion disposed outside the unit area; a pressing portion configured to press the dummy portion corresponding to the dummy portion toward the mask frame in a third direction, the third direction intersecting a plane in which the first direction and the second direction extend; and a head portion configured to irradiate a laser beam toward the mask sheet to fix the mask sheet to the mask frame.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0053387, filed on May 4, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Various aspects of the embodiments of this disclosure relate to an apparatus for manufacturing a mask assembly, a method for manufacturing a mask assembly, and a method for manufacturing a display device. Background Technology

[0004] Mobile electronic devices are widely used. Besides small electronic devices such as mobile phones, tablet PCs have become increasingly popular in recent years as mobile electronic devices.

[0005] Mobile electronic devices include display devices used to provide users with visual information such as images or videos to support various functions. Recently, as other components used to drive the display device have been miniaturized, the display device in electronic devices has become increasingly important, and structures that can be bent to have an angle in a flat state have also been developed.

[0006] On the other hand, in the process of manufacturing display devices, methods such as depositing organic materials at desired locations can be used by adhering a thin-film metal mask to a substrate. The higher the image quality of the display device to be manufactured, the higher the alignment accuracy requirement of the mask. Summary of the Invention

[0007] According to one or more embodiments of the present disclosure, an apparatus for manufacturing a mask assembly is provided, wherein mask deformation is reduced and alignment accuracy is improved; a method for manufacturing a mask assembly and a method for manufacturing a display device are also provided. However, this aspect is merely exemplary, and the scope of the present disclosure is not limited thereto.

[0008] Other aspects will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practicing embodiments of the present disclosure.

[0009] According to one or more embodiments, an apparatus for manufacturing a mask assembly includes: a tensioning portion configured to be spaced apart from a mask frame including at least one opening, the tensioning portion being configured to tension a mask sheet along at least one of a first direction and a second direction, the mask sheet including a unit region corresponding to the at least one opening and a virtual portion disposed outside the unit region; a pressing portion configured to press the virtual portion toward the mask frame along a third direction corresponding to the virtual portion, the third direction intersecting a plane extending therein of the first direction and the second direction; and a head configured to irradiate a laser beam toward the mask sheet to secure the mask sheet to the mask frame.

[0010] The tensioning portion may include: at least one pair of clamping portions configured to clamp the edge of the virtual portion; and a moving portion that moves the at least one pair of clamping portions along the first direction or the second direction to apply tension to the mask sheet.

[0011] The tensioning portion may further include a rotating body that causes the clamping portion to rotate about a rotation axis parallel to the surface of the mask frame.

[0012] The head can be configured to check the alignment between the mask sheet and the mask frame.

[0013] The head can be configured to irradiate a laser beam onto the mask to cut a portion of the virtual portion from the unit region of the mask.

[0014] The pressing part may include at least two rollers positioned to directly contact the virtual part.

[0015] The at least two rollers may be arranged on opposite sides of the region corresponding to the unit region to sandwich the region between the at least two rollers.

[0016] The pressing part may include an injection port configured to inject compressed air into the virtual part along the third direction.

[0017] The pressing part may include a plurality of magnets arranged to apply magnetic force to the virtual part along the third direction.

[0018] The pressing portion can be configured to bend the mask sheet such that the unit region is closer to the mask frame than the edge of the virtual portion.

[0019] The pressing part can be configured to bend a portion of the mask into a circle.

[0020] According to one or more embodiments, a method of manufacturing a mask assembly includes: preparing a mask frame including at least one opening; preparing a mask sheet including a unit region corresponding to the at least one opening and a virtual portion disposed outside the unit region; tensioning the mask sheet; aligning the mask sheet to one side of the mask frame; pressing the virtual portion of the mask sheet toward the mask frame; and securing the mask sheet to the mask frame by irradiating the virtual portion with a laser beam.

[0021] The method may further include forming at least two patterned holes in the unit region of the mask.

[0022] Tensuring the mask may include clamping the edge of the virtual portion and applying tension to the mask in a first or second direction.

[0023] Pressing the virtual portion may include: pressing the mask sheet towards the mask frame by directly applying force to the virtual portion; bending a portion of the virtual portion; and bringing the virtual portion into contact with the mask frame.

[0024] Pressing the virtual portion may include: pressing the virtual portion toward the mask frame by spraying compressed air toward the virtual portion; bending a portion of the virtual portion; and bringing the virtual portion into contact with the mask frame.

[0025] Pressing the virtual portion may include: pressing the virtual portion toward the mask frame by applying a magnetic force to the virtual portion; bending a portion of the virtual portion; and bringing the virtual portion into contact with the mask frame.

[0026] The method may further include bending at least a portion of the virtual portion into a circle.

[0027] The method may further include cutting the portion of the virtual portion from the cell region of the mask by irradiating a portion of the virtual portion with a laser beam.

[0028] According to one or more embodiments, a method of manufacturing a display device includes: preparing a mask assembly; placing and aligning a substrate and the mask assembly within a cavity; and supplying a deposition material from a deposition source to the substrate through the mask assembly, wherein preparing the mask assembly includes: tensioning a mask sheet including a cell region and a dummy portion disposed outside the cell region; aligning the mask sheet over a mask frame including at least one opening; pressing the dummy portion of the mask sheet toward the mask frame; and securing the mask sheet to the mask frame by irradiating the dummy portion with a laser beam.

[0029] These and / or other aspects will become apparent and more readily understood from the following description, drawings and claims of some embodiments.

[0030] These and / or other aspects may be implemented by using systems, methods, computer programs, or a combination of particular systems, methods, and computer programs. Attached Figure Description

[0031] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 This is a schematic plan view illustrating a mask assembly according to one embodiment;

[0033] Figure 2 This is an example Figure 1 A schematic cross-sectional view of the mask assembly;

[0034] Figure 3 This is a schematic plan view illustrating a mask sheet according to one embodiment;

[0035] Figure 4 This is a schematic cross-sectional view illustrating an apparatus for manufacturing a mask assembly according to one embodiment;

[0036] Figure 5 This is a schematic perspective view illustrating a portion of an apparatus for manufacturing a mask assembly according to an embodiment;

[0037] Figure 6 This is a schematic plan view illustrating a portion of a process for manufacturing a mask assembly using an apparatus for manufacturing a mask assembly, according to one embodiment.

[0038] Figures 7A to 7F This is a schematic cross-sectional view illustrating the process of manufacturing a mask assembly according to one embodiment;

[0039] Figure 8 This is a schematic cross-sectional view illustrating a portion of a process for manufacturing a mask assembly using an apparatus for manufacturing a mask assembly, according to one embodiment.

[0040] Figure 9 This is a schematic cross-sectional view illustrating a part of a process for manufacturing a mask assembly using an apparatus for manufacturing a mask assembly, according to another embodiment;

[0041] Figure 10 This is a schematic cross-sectional view illustrating a part of a process for manufacturing a mask assembly using an apparatus for manufacturing a mask assembly, according to another embodiment;

[0042] Figure 11 This is a schematic cross-sectional view illustrating an apparatus for manufacturing a display device according to an embodiment;

[0043] Figure 12 This is a schematic plan view illustrating a display device manufactured by an apparatus for manufacturing a display device according to an embodiment; and

[0044] Figure 13 This is an example Figure 12 A schematic cross-sectional view of a portion of a display device. Detailed Implementation

[0045] Reference will now be made in more detail to some embodiments, examples of which are illustrated in the accompanying drawings, in which the same reference numerals refer to the same elements throughout. In this respect, the embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, the embodiments are described below only by reference to the accompanying drawings in order to explain aspects of this disclosure. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout the disclosure, the expression “at least one of a, b, and c” indicates only a, only b, only c, both a and b, both a and c, both b and c, and all of a, b, and c, or variations thereof.

[0046] The exemplary embodiments will now be described in more detail with reference to the accompanying drawings. Identical or corresponding parts are given the same reference numerals, which are independent of the drawing numbers, and redundant explanations may be omitted.

[0047] Although terms such as "first" and "second" can be used to describe various components, these components are not limited by the aforementioned terms. The aforementioned terms are used to distinguish one component from another.

[0048] Expressions used in the singular form include plural expressions, unless they have a distinctly different meaning in the context.

[0049] In this specification, it should be understood that the terms “comprising,” “having,” and “including” are intended to indicate the presence of the features, figures, steps, actions, components, parts, or combinations thereof disclosed in the specification, and are not intended to exclude the possibility that one or more other features, figures, steps, actions, components, parts, or combinations thereof may be present or added.

[0050] It should be understood that when a layer, region, or component is referred to as being “formed on” another layer, region, or component, it may be formed directly or indirectly on the other layer, region, or component. That is, for example, one or more intermediate layers, regions, or components may exist.

[0051] The dimensions of the components in the accompanying drawings may be exaggerated for ease of explanation. In other words, because the dimensions and thicknesses of the components in the accompanying drawings may be arbitrarily illustrated for ease of explanation, the following embodiments are not limited thereto.

[0052] When a particular embodiment can be implemented differently, the specific process sequence may be performed in a different order than that described. For example, two consecutively described processes may be performed substantially simultaneously, or in the reverse order of their description.

[0053] In the specification, the phrase "A and / or B" means A, B, or A and B. Additionally, the phrase "at least one of A and B" means A, B, or A and B.

[0054] In the following embodiments, when a layer, region, or element is referred to as being “connected,” it should be understood that it may be directly connected, or one or more intermediate portions may exist between the layer, region, or element. For example, when a layer, region, or element is referred to as being “electrically connected,” it may be directly electrically connected, or the layer, region, or element may be indirectly electrically connected, and one or more intermediate portions may exist.

[0055] The x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0056] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept pertains. It should also be understood that terms defined in common dictionaries shall be interpreted as having the meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0057] Figure 1 This is a schematic plan view illustrating a mask assembly MA according to one embodiment; and Figure 2 This is an example Figure 1 A schematic cross-sectional view of the mask assembly MA. Figure 2 Can correspond to along Figure 1 The cross section of the mask assembly MA is taken from line II-II'.

[0058] Reference Figure 1 and Figure 2 A mask assembly MA may include a mask frame MF and a mask sheet MS. For example, a mask assembly MA may include a mask frame MF and at least one mask sheet MS. Although Figure 1 The mask assembly MA is shown to provide a total of twelve mask sheets MS, but this disclosure is not limited to this, and the user can design the mask assembly MA differently depending on the size of the mask frame MF and the mask sheets MS.

[0059] The mask frame MF can be quadrilateral in shape on a plane, but is not limited to this. For example, the mask frame MF can have any of a variety of shapes, such as polygons, triangles or pentagons, circles and ellipses. However, for ease of description, this paper will describe the case where the mask frame MF has a rectangular shape.

[0060] The mask frame MF can have a very small thickness compared to its horizontal or vertical length. When the thickness of the mask frame MF is too large, it may restrict the deposition material from passing through the mask sheet MS during deposition using the mask assembly MA. Conversely, when the thickness of the mask frame MF is too small, it may be difficult to ensure the rigidity used to support the mask sheet MS. Therefore, considering the above points, the mask frame MF should have a suitable thickness.

[0061] In one embodiment, the mask frame MF may comprise a material such as Invar alloy, nickel, or nickel-cobalt. Because these materials have a low coefficient of thermal expansion, deformation of the mask frame MF caused by heat during the fabrication of the mask assembly MA can be reduced.

[0062] The mask frame MF may include at least one opening OP. Because the mask sheet MS is fixed to one side of the mask frame MF, the opening OP located in the mask frame MF is... Figure 1 Not shown in. However, in Figure 2 and Figure 4 The diagram shows an opening OP. An opening OP can be, for example, a quadrilateral shape in a plane, or any of various shapes, such as polygons, triangles or pentagons, circles, and ellipses. However, for ease of description, this paper will describe the case where the opening OP is a quadrilateral shape.

[0063] When multiple openings OP are formed in a mask frame MF, the mask frame MF may have a grid structure, such as a window frame or a screen. In one embodiment, the openings OP may have the same area. In another embodiment, the openings OP may be arranged at equal intervals.

[0064] The cross section taken along the thickness direction of the mask frame MF can have a quadrilateral shape, such as a rectangle, rhombus, or parallelogram, and the corners of the quadrilateral shape can be rounded.

[0065] The mask frame MF supports the mask sheet MS, which will be described below.

[0066] The mask MS can have a quadrilateral shape on a plane, but is not limited to this. For example, the mask MS can have any of a variety of shapes, such as polygons, triangles or pentagons, circles and ellipses. However, for ease of description, this paper will describe the case where the mask MS has a quadrilateral shape.

[0067] In one embodiment, a mask sheet MS may be disposed in an opening OP of a mask frame MF. In this case, the mask sheet MS can cover the opening OP of the mask frame MF. The mask sheet MS in a tensioned state can be fixed to the mask frame MF. For example, the mask sheet MS can be fixed to the mask frame MF by welding. In this case, welding can be performed along the edge of the mask sheet MS, and therefore, the mask sheet MS can be fixed to the mask frame MF by solder joints W.

[0068] In a mask MS, a cell region CA corresponding to an opening OP of a mask frame MF can be provided. A cell region CA may correspond to a display device. At least one patterned hole PH can be formed in the cell region CA. The patterned hole PH can be a hole penetrating in the thickness direction of the mask MS, through which deposition material can pass. That is, deposition material can be deposited on an object (e.g., a substrate, etc.) through the opening OP of the mask frame MF and the patterned hole PH of the mask MS.

[0069] In one embodiment, the patterned hole PH may have a rectangular or square shape on a plane, but may have any of a variety of shapes, such as circles, ellipses, and polygons such as triangles. In one embodiment, when multiple patterned holes PH are provided, the area of ​​the patterned holes PH on the plane may be the same.

[0070] In one embodiment, the mask sheet MS may include materials such as Invar alloy, nickel, and nickel-cobalt, which have the same or similar coefficient of thermal expansion as the mask frame MF.

[0071] As a comparative example, the mask MS can be rod-shaped or plate-shaped, and multiple cell regions can be provided on a rod or plate. In this case, as the size of the display device to be manufactured increases, the cell region of the mask corresponding to the display device can also increase. As the size of a cell region increases, the mask comprising multiple cell regions can become very large. Because the mask has a very small thickness, the larger the size of the mask, the more prone it may be to warping or sagging under load. To reduce this phenomenon, the mask can be tensioned and fixed to a mask frame. However, in this case, as the size of the mask increases, greater tension is required, and it may be difficult to ensure accuracy due to sagging and warping. In addition, because there are multiple cell regions in a mask, considerable processing time may be required to measure the alignment of all cell regions and perform mask tensioning and alignment. Furthermore, when a defect occurs in a cell region, there may be issues with repairing or discarding the entire mask.

[0072] However, in the case of the mask sheet MS according to one or more embodiments of the present disclosure, because a unit region CA is provided in a mask sheet MS, the horizontal or vertical length of a mask sheet MS may be relatively short. That is, the size and weight of the mask sheet MS can be reduced. In one embodiment, a unit region CA may correspond to an opening OP of a mask frame MF and may be supported by the mask frame MF. Therefore, sagging and warping due to the load on the mask sheet MS can be reduced. In addition, the tension used to tension a mask sheet MS can also be relatively small. In this way, the degree of deformation of the mask sheet MS can be reduced, and the pixel position accuracy (PPA) of the patterned aperture PH of the mask sheet MS can be improved.

[0073] Furthermore, because the processing time required to perform tensioning and alignment of a mask sheet MS is significantly reduced, even when manufacturing mask assemblies MA including the same cell regions CA, the processing time may be less than that of the comparative example. This improves the yield of mask assemblies MA.

[0074] Furthermore, even if a defect occurs in the patterned hole PH formed in a single cell region CA, only one mask MS needs to be repaired or discarded, and therefore, the process of manufacturing mask assembly MA can be highly efficient.

[0075] Figure 3 This is a schematic plan view illustrating a mask MS according to one embodiment.

[0076] Reference Figure 3 The mask MS, as described above, may include a cell region CA and patterned holes PH disposed in the cell region CA. Furthermore, the mask MS may include a virtual portion DP disposed outside the cell region CA. The virtual portion DP may be defined as a region in the mask MS other than the cell region CA.

[0077] The virtual part DP may include a fixed region DP1 adjacent to the unit region CA outside the unit region CA, a clamping region DP3 located on the outermost side along the edge of the mask sheet MS, and a pressing region DP2 between the fixed region DP1 and the clamping region DP3.

[0078] The clamping area DP3 can be a mask sheet MS in which a tensioning part 100 (see...) Figure 4 The area being clamped is shown in the following text. Figure 4 Therefore, the clamping region DP3 is located on the outermost side of the mask MS so that it can be clamped by the tensioning part 100, and sufficient area can be provided for the clamping region DP3. For example, the clamping region DP3 may be arranged along two edges positioned relative to each other and with the unit region CA located therebetween. As an example, the clamping region DP3 may be arranged along all four edges of the mask MS.

[0079] The pressing area DP2 can be arranged within the clamping area DP3. See below for reference. Figure 4 The pressing area DP2 can be a receiver for the pressing part 200 (see...) Figure 4 The area of ​​force directed toward the mask frame MF. Therefore, the bending of the mask sheet MS can essentially occur in the pressing area DP2.

[0080] The fixing region DP1 can be a region for fixing the mask sheet MS to the mask frame MF. For example, welding for fixing the mask sheet MS to the mask frame MF can be performed in the fixing region DP1, and therefore, the solder joints can be arranged in the fixing region DP1. When the mask sheet MS is fixed to the mask frame MF, the fixing region DP1 can be positioned adjacent to the cell region CA of the mask sheet MS, thereby preventing or substantially preventing the mask sheet MS from warping or bending.

[0081] Figure 4 This is a schematic cross-sectional view illustrating an apparatus 10 (hereinafter referred to as a mask assembly manufacturing apparatus) for manufacturing a mask assembly according to an embodiment.

[0082] Reference Figure 4 The mask assembly manufacturing apparatus 10 may include a tensioning part 100, a pressing part 200, and a head 300.

[0083] The tensioning portion 100 may be spaced apart from the mask frame MF. For example, the tensioning portion 100 may be arranged above the mask frame MF. In this case, the mask sheet MS may be supported on the upper side of the mask frame MF. As another example, the tensioning portion 100 may be arranged below the mask frame MF. In this case, the mask sheet MS may be supported on the lower side of the mask frame MF. For ease of description, the case in which the tensioning portion 100 is arranged above the mask frame MF will be described herein.

[0084] The tensioning portion 100 can tension the mask MS along at least one of a first direction DR1 and a second direction DR2. The first direction DR1 and the second direction DR2 may intersect each other. For example, the angle at which the first direction DR1 and the second direction DR2 intersect each other may be a right angle or an acute angle. For example, when the mask MS is tensioned in directions perpendicular to the four edges of the mask MS, which has a rectangular shape in a plane, the first direction DR1 and the second direction DR2 may form a right angle. As another example, when the mask MS is tensioned in directions from the center of the mask MS toward the four vertices of the mask MS, the angle at which the first direction DR1 and the second direction DR2 intersect each other may be an acute angle. For ease of description, the case where the first direction DR1 and the second direction DR2 form a right angle and the mask MS is tensioned in directions perpendicular to the four edges of the mask MS will be described herein.

[0085] The tensioning portion 100 may include clamping portions 110 for holding the mask sheet MS. As an example, the tensioning portion 100 may include at least a pair of clamping portions 110 for holding opposite edges of the virtual portion DP of the mask sheet MS. The mask sheet MS may be located between a pair of clamping portions 110.

[0086] Furthermore, the tensioning portion 100 may include a movable portion 120 that moves the clamping portion 110 along a first direction DR1 or a second direction DR2. The movable portion 120 applies tension to the mask MS by moving the clamping portion 110 that clamps the mask MS in directions that are far apart from each other, and thus the mask MS can be tensioned along the first direction DR1 and / or the second direction DR2. The movable portion 120 may include a linear actuator (not shown), such as a pneumatic cylinder, a hydraulic cylinder, a linear motor, or a motor with a rack and pinion gear.

[0087] In one embodiment, the tensioning portion 100 may include a rotating body 130 that rotates the clamping portion 110 about a rotation axis R parallel to the plane of the mask frame MF. The rotating body 130 may include a rotary actuator (not shown), such as a servo motor, a pneumatic motor, a rotary cylinder, a motor with a V-belt, etc.

[0088] The pressing part 200 may be spaced apart from the mask frame MF. For example, the pressing part 120 may be arranged above and spaced apart from the mask frame MF. The pressing part 200 may move along a third direction DR3, which intersects a plane in which the tensioned mask MS extends along a first direction DR1 and a second direction DR2, and the pressing part 200 may apply force to the mask MS along the third direction DR3. For example, the pressing part 200 may be arranged above the mask frame MF and the mask MS, and may move up and down in a direction perpendicular to the plane on which the mask MS is placed. The pressing part 200 may apply a downward force toward the mask MS.

[0089] When the pressing part 200 moves along the third direction DR3, the pressing part 200 can pass between a pair of tensioning parts 100 facing each other. For this purpose, the length of the pressing part 200 in the first direction DR1 or the second direction DR2 can be less than the distance between the pair of tensioning parts 100 facing each other.

[0090] In one embodiment, the pressing portion 200 may include at least two rollers 210 positioned to contact the mask sheet MS. Reference will be made below. Figure 5 The shape of the pressing part 200 is described in more detail.

[0091] The head 300 may be arranged above the pressing part 200 and on the opposite side of the mask frame MF to clamp the pressing part 200 therebetween. In one embodiment, the head 300 may include a laser unit 310 for irradiating a laser beam and a sensing unit 320 for taking pictures and sensing the alignment state of the mask sheet MS.

[0092] The head 300 can fix the mask MS to the mask frame MF by irradiating a laser beam toward the mask MS. For example, the head 300 can weld the mask MS and the mask frame MF by irradiating a welding laser beam. In one embodiment, the head 300 can cut the mask MS by irradiating a laser beam toward the mask MS. For example, the head 300 can laser-cut a portion of the mask MS by irradiating a cutting laser beam. In one embodiment, the laser unit 310 can emit a laser beam by changing the laser conditions, thereby emitting both a welding laser beam and a cutting laser beam.

[0093] The head 300 can photograph and sense the alignment status of the pattern holes PH of the mask MS through the sensing unit 320. Based on this, by finely adjusting the position of the tensioning part 100 that holds the mask MS, the mask MS can be aligned to the desired position.

[0094] In one embodiment, the tensioning part 100, the pressing part 200, and the head 300 are interlocked with each other and can move together on one side of the mask frame MF. For example, the tensioning part 100, the pressing part 200, and the head 300 can move together on the mask frame MF along a first direction DR1, a second direction DR2, and a third direction DR3. Figure 4 In the diagram, the mask frame MF is shown as having one opening OP. However, the mask frame MF may include multiple openings OP, and in this case, the tensioning part 100, the pressing part 200, and the head 300 may move together to position the mask sheet MS on the corresponding opening OP. In one embodiment, the pressing part 200 is capable of relative movement with respect to the tensioning part 100 and the head 300 while the tensioning part 100 and the head 300 are stationary.

[0095] Figure 5 This is a schematic perspective view illustrating a portion of an apparatus for manufacturing a mask assembly according to one embodiment. Figure 5 This shows the pressing part 200 of an apparatus for manufacturing a mask assembly according to an embodiment.

[0096] Reference Figure 5 In one embodiment, the pressing portion 200 has a quadrilateral shape in a plane, but is not limited thereto. In one embodiment, the pressing portion 200 may have a shape similar to that of the mask sheet MS (see...). Figure 3 The shape corresponds to the shape of the pressing part 200, and can have any of various shapes, such as circles, ellipses, and polygons such as triangles. In one embodiment, when the pressing part 200 has a polygonal shape, each corner of the pressing part 200 may be chamfered or rounded. The area of ​​the planar shape of the pressing part 200 may be smaller than that including the unit region CA (see...). Figure 3 ) and virtual part DP (see Figure 3 The area of ​​the mask MS.

[0097] The pressing part 200 may include a through portion 200TH disposed at its center. The through portion 200TH may correspond to the cell region CA of the mask sheet MS (see Figure 3 ) and the fixed region DP1 of the virtual part DP (see Figure 3 The 200TH through section can be formed to allow the head to be 300 (see...). Figure 4 The laser beam emitted from the head 300 can pass through the through-hole 200TH to reach the mask MS. In one embodiment, the through-hole 200TH may have a quadrilateral shape in a plane, or may have a shape corresponding to the pressing part 200 (see...). Figure 4 Any of the various shapes of the shape.

[0098] At least two rollers 210 may be arranged on the surface of the pressing portion 200 facing the mask sheet MS. For example, when two rollers 210 are arranged in a pressing portion 200 having a quadrilateral shape, the two rollers 210 may be arranged at opposite edges of the pressing portion 200 to place the through portion 200TH therebetween. Thus, multiple rollers 210 may be arranged on opposite sides of the through portion 200TH (corresponding to the area of ​​unit region CA) to place (or sandwich) the through portion 200TH therebetween. In this case, the longitudinal direction of the rollers 210 may intersect the tensioning direction of the mask sheet MS. As another example, when four rollers 210 are arranged in a pressing portion 200 having a quadrilateral shape, the four rollers 210 may be arranged at the four edges of the pressing portion 200. In this document, for ease of description, the case in which four rollers 210 are provided will be described.

[0099] Each roller 210 may have a circular cross-section in a direction perpendicular to its longitudinal direction. For example, the cross-section of the roller 210 may have a diameter of approximately 1 mm to approximately 20 mm, and in one embodiment, it may have a diameter of approximately 2 mm to approximately 3 mm. The length of the roller 210 may be relatively longer than the diameter of its cross-section and may be equal to or less than the length of the side portion of the pressing portion 200.

[0100] Roller 210 can directly contact the virtual portion DP of the mask MS. The area of ​​the virtual portion DP that directly contacts roller 210 can be defined as the pressing area DP2. Because roller 210 directly contacts the mask MS, roller 210 can include a flexible material such as rubber or polyurethane to avoid damaging the mask MS. In one embodiment, roller 210 can include a shaft containing a metallic material to ensure rigidity, and a contact portion including the flexible material described above can be arranged on the surface of the shaft.

[0101] In one embodiment, the roller 210 of the pressing portion 200 may be tilted. As described below, the roller 210 may directly contact and press the mask MS. In this case, in order to uniformly press the mask MS, which has a very small thickness, the surface of the roller 210 may require good straightness. However, straightness tolerances may occur when manufacturing the roller 210, and the roller 210 may be slightly tilted to compensate for the tolerances. Figure 5 The reference numeral α in the attached diagram indicates the angle of inclination of roller 210. Angle α can be from 0° to 90°.

[0102] Figure 6 This is a schematic plan view illustrating a part of a process for manufacturing a mask assembly using an apparatus for manufacturing a mask assembly, according to one embodiment.

[0103] Figure 6 The diagram shows a mask frame MF comprising twelve openings (OPs), three mask sheets (MS) fixed to three of the twelve openings respectively, and a fourth mask sheet (MS) corresponding to the state of the openings (OPs). However, the number of openings (OPs) in the mask frame MF and the order in which the mask sheets (MS) are fixed are merely examples and are not limited thereto.

[0104] Tensioner 100 may be arranged in tensioner frame 100F. Tensioner frame 100F may include frame opening 100OP at its center, and tensioner 100 may be arranged along the inside of frame opening 100OP. Tensioner 100 may clamp and tension mask MS within frame opening 100OP. Tensioner 100 may be in pairs, and a pair of tensioner 100 may face each other. Although Figure 6 An example in which eight tensioning portions 100 are provided is illustrated, but this disclosure is not limited thereto, and at least two tensioning portions 100 may be provided.

[0105] In one embodiment, the planar shape of the frame opening 100OP may correspond to the shape of the mask sheet MS. For example, when the mask sheet MS is rectangular, the planar shape of the frame opening 100OP may also be rectangular. The area of ​​the frame opening 100OP may be larger than the area of ​​the opening OP of the mask frame MF and the area of ​​the mask sheet MS including the unit region CA and the virtual portion DP. In this case, the area may be represented by the area on the plane in which the first direction DR1 and the second direction DR2, which are the stretching directions of the mask sheet MS, extend.

[0106] The frame opening 100OP can be a through area through which the pressing part 200 and the laser beam emitted from the head 300 can pass. Therefore, the area of ​​the frame opening 100OP can be larger than the area occupied by the pressing part 200 on the plane.

[0107] After the tensioning portions 100 clamp the mask sheet MS facing each other, the tensioning frame 100F can enter the area above the mask frame MF and arrange the mask sheet MS corresponding to the opening OP. The tensioning frame 100F can move along a first direction DR1 and a second direction DR2, which can be performed by a frame moving part (not shown). In one embodiment, the frame moving part (not shown) may include a guide or track for guiding the movement of the tensioning frame 100F, and a combination of a pneumatic cylinder, a linear driver of a linear motor, a motor with a V-belt, and a motor with a rack and pinion.

[0108] According to one embodiment, a tensioning member 100 enters the region of the mask frame MF to clamp the mask sheet MS and then arranges it corresponding to the opening OP. For this purpose, the tensioning member 100 can be arranged above the mask sheet MS and move in the region above the mask sheet MS.

[0109] This paper describes the process in which the mask sheet MS corresponds to the opening OP and is fixed to the mask frame MF.

[0110] Figures 7A to 7F This is a schematic cross-sectional view illustrating the process of manufacturing a mask assembly according to one embodiment. References to the above may be omitted. Figure 4 The description of the mask assembly manufacturing apparatus is the same as or similar in construction, and the following description will focus primarily on the differences.

[0111] Reference Figure 7A A mask frame MF having at least one opening OP can be fabricated. In one embodiment, the opening OP in the mask frame MF can be formed by etching using a photoresist or laser processing.

[0112] Furthermore, a mask MS can be fabricated comprising a cell region CA corresponding to an opening OP and a virtual portion DP disposed outside the cell region CA. The mask MS may include patterned holes PH disposed in the cell region CA. In one embodiment, the patterned holes PH may also be formed by etching using photoresist or laser processing.

[0113] The clamping portions 110 can be positioned facing each other. After the clamping portions 110 clamp both sides of the mask sheet MS, the moving portion 120 can apply tension to the mask sheet MS by moving the clamping portions 110 in a direction away from each other. In this way, by allowing the mask sheet MS to be arranged on the mask frame MF in a flat state without sagging or warping due to load, alignment accuracy can be improved.

[0114] Subsequently, the mask MS can be aligned on one side of the mask frame MF. The tensioning part 100 can enter the area above the mask frame MF and align the mask MS on the mask frame MF, so that the opening OP and the cell area CA of the mask MS correspond to each other. In this case, the sensing unit 320 of the head 300 can take pictures and sense the alignment state of the mask MS, and can perform fine alignment of the mask MS by using the photographed and sensed alignment state, thereby improving the alignment accuracy.

[0115] Reference Figure 7B When the mask sheet MS is tensioned and aligned on the mask frame MF, the pressing part 200 can move toward the mask sheet MS in the third direction DR3. The pressing part 200 can directly contact the mask sheet MS and apply force to the mask sheet MS in the direction toward the mask frame MF. For example, the roller 210 of the pressing part 200 can contact the virtual portion DP of the mask sheet MS and apply force directly to the mask sheet MS.

[0116] Reference Figure 7C A portion of the mask sheet MS, having received force from the pressing part 200, can be bent. As a result, the mask sheet MS is bent such that the unit region CA of the mask sheet MS is closer to the mask frame MF than the edge of the virtual portion DP held by the clamping part 110. The unit region CA of the mask sheet MS can descend along the third direction DR3 from its position before bending to its position after bending. A portion of the virtual portion DP, directly receiving force applied by the roller 210, can be bent along the surface of the roller 210. Therefore, the bent portion of the virtual portion DP can be circular or curved.

[0117] The pressing part 200 can bend the mask sheet MS until a portion of the mask sheet MS contacts the mask frame MF. In this case, the portion that contacts the mask frame MF can be essentially the pressing area DP2 of the virtual portion DP of the mask sheet MS.

[0118] According to one embodiment, the degree of bending of the mask sheet MS and the degree of descent of the unit region CA can be adjusted by controlling the movable range of the pressing part 200 in the third direction DR3. The degree of bending can represent the angle at which the mask sheet MS is bent, and the degree of descent can represent the difference in position of the unit region CA before and after bending. According to one embodiment, since a tensioning part 100 for tensioning the mask sheet MS and a separate pressing part 200 are provided, the movable range of the pressing part 200 can be easily increased, and therefore, the degree of bending of the mask sheet MS and the degree of descent of the unit region CA can be easily increased. In addition, since the force is directly applied to the mask sheet MS by the pressing part 200, the mask sheet MS contacts the mask frame MF, which can improve the adhesion between the mask sheet MS and the mask frame MF. In this way, the manufacturing quality of the mask assembly MA can be improved.

[0119] As a comparative example, when the mask MS is sharply bent, stress may concentrate, potentially damaging the mask MS. Furthermore, the likelihood of plastic deformation exceeding the elastic deformation of the mask MS increases, making it difficult to secure the mask MS to the mask frame MF in a flat state. However, according to one embodiment, because the virtual portion DP of the mask MS is bent into a circle along the surface of the roller 210, stress concentration is reduced, and the likelihood of damage to the mask MS is decreased. Additionally, the possibility of plastic deformation of the mask MS is reduced, and sufficient tension is applied to the mask MS, allowing it to be secured to the mask frame MF in a flat state without sagging or warping. Thus, a high-quality mask assembly MA with improved alignment accuracy can be manufactured.

[0120] Reference Figure 7D With the mask MS in contact with the mask frame MF, the head 300 can emit a laser beam toward a portion of the mask MS and fix the mask frame MF and the mask MS. For example, laser welding can be performed by irradiating a fixed area DP1 of a virtual portion DP of the mask MS with a laser beam. Solder joints W can be formed in the area irradiated by the laser beam, and thus the mask MS can be fixed to the mask frame MF. In one embodiment, the irradiation of the laser beam can be repeated, and multiple solder joints W can be formed. Solder joints W can be in the form of dots or spots, and can be in the form of lines, not limited to dots.

[0121] Therefore, the mask sheet MS can be fixed to the mask frame MF under tension. Thus, the mask sheet MS can be arranged on the mask frame MF in a flat state without sagging or warping due to its own load.

[0122] Reference Figure 7E When the mask sheet MS is fixed, the pressing part 200 can return to the initial position away from the mask frame MF along the third direction DR3.

[0123] Reference Figure 7F The head 300 can cut the mask MS around the cell region CA by irradiating the mask MS with a laser beam. For example, the head 300 can cut the mask MS around the cell region CA by irradiating the mask MS with a cutting laser beam. Figure 7F In the figure, the cutting portion is indicated by reference numeral t. In this case, the position of the laser beam irradiating the cutting portion can be outside the portion where the weld point W is located. For this purpose, the position of the laser unit 310 of the head 300 can be adjusted outward from the position where welding is performed. By cutting a portion of the mask MS, a portion of the virtual portion DP can be separated from the unit region CA. As a result, only the unit region CA and the fixed region DP1 of the mask MS can remain in the mask frame MF.

[0124] Through the above process, the mask sheet MS aligned on the mask frame MF can be fixed in a tensioned state. By repeating these processes, the mask assembly MA can be manufactured.

[0125] Figure 8 This is a schematic cross-sectional view illustrating a portion of a process for manufacturing a mask assembly using an apparatus for manufacturing a mask assembly, according to one embodiment. References to the above may be omitted. Figure 4 The description of the mask assembly manufacturing apparatus is the same as or similar in construction, and the following description will focus primarily on the differences.

[0126] The tensioning part 100 may include a rotating body 130 that rotates the clamping part 110 about a rotation axis R parallel to a plane of the mask frame MF. The rotation axis R may, for example, intersect the stretching direction of the mask sheet MS, or may be perpendicular to the stretching direction of the mask sheet MS. The rotation axes R of the tensioning parts 100 facing each other may be parallel to each other.

[0127] As mentioned above Figure 4 The rotating body 130 may include a rotary driver (not shown), such as a servo motor, pneumatic motor, rotary cylinder, motor with a V-belt, etc., and thus can rotate the clamping part 110 by a first angle θ. The direction of rotation may be the direction in which the clamping part 110 rotates toward the mask frame MF. The first angle θ may be from 0° to 90°.

[0128] When the pressing part 200 applies force to the mask sheet MS, causing the mask sheet MS to bend, the rotating body 130 can rotate accordingly. When the pressing part 200 applies force to the mask sheet MS, a portion of the mask sheet MS held by the clamping part 110 can be bent. Plastic deformation may occur in the bent portion, and in the worst case, the mask sheet MS may break undesirably. Therefore, the rotating body 130 can prevent or reduce undesirable breakage of the mask sheet MS.

[0129] Figure 9 This is a schematic cross-sectional view illustrating a portion of a process for manufacturing a mask assembly using an apparatus for manufacturing a mask assembly, according to another embodiment. References to the above may be omitted. Figure 4 The description of the mask assembly manufacturing apparatus is the same as or similar in construction, and the following description will focus primarily on the differences.

[0130] Reference Figure 9 In one embodiment, at least two injection holes, i.e., a plurality of injection holes 220, may be provided on the surface of the pressing portion 200 facing the mask sheet MS. The plurality of injection holes 220 may be arranged along the edge of the pressing portion 220. The plurality of injection holes 220 may be arranged to correspond to the pressing area DP2 of the virtual portion DP.

[0131] Each injection hole 220 can inject compressed air toward the mask MS. For example, the injection hole 220 can bend a portion of the mask MS by injecting compressed air into the pressing area DP2 of the virtual portion DP of the mask MS.

[0132] Although the mask MS comprises metallic material, it is a thin film with a very small thickness compared to its length. Therefore, compressed air can be used to fully bend a portion of the mask MS. The compressed air can be injected concentratedly into the portion to be bent, but can also be dispersed around the portion after reaching it. In this case, maximum pressure can be applied to the portion to be bent, and progressively decreasing pressure can be applied to the area surrounding that portion. Thus, a portion of the mask MS can be bent into a circle. Therefore, as described above, stress concentration in the bent portion can be reduced, and the possibility of damage to the mask MS can be reduced.

[0133] Furthermore, by bending the mask sheet MS in a non-contact manner, physical impacts applied to the mask sheet MS can be reduced, thus reducing the possibility of damage to the mask sheet MS. Additionally, since the pressing part 200 does not need to descend along the third direction DR3 until the mask sheet MS contacts the mask frame MF, the range of motion of the pressing part 200 can be reduced.

[0134] Figure 10 This is a schematic cross-sectional view illustrating a portion of a process for manufacturing a mask assembly using an apparatus for manufacturing a mask assembly, according to another embodiment. References to the above may be omitted. Figure 4 The description of the mask assembly manufacturing apparatus is the same as or similar in construction, and the following description will focus primarily on the differences.

[0135] Reference Figure 10 The pressing part 200 may include a plurality of magnets 230. The magnets 230 may be embedded in the pressing part 200 or disposed on the outer surface of the pressing part 200. For ease of description, the case in which the magnets 230 are embedded in the pressing part 200 will be described herein. The magnets 230 may be arranged to correspond to the virtual portion DP of the mask sheet MS. The magnets 230 may be permanent magnets or electromagnets.

[0136] By appropriately arranging multiple magnets 230, the pressing portion 200 can apply a magnetic force to the mask sheet MS on the third direction DR3. For example, a pair of magnets 230 can be arranged with a center line CL between them, and the directions of the magnetic poles of the pair of magnets 230 can be opposite to each other. In this case, an upward magnetic force can be applied to a portion of the virtual portion DP corresponding to the position of the magnet 230, and a downward magnetic force can be applied to another portion of the virtual portion DP corresponding to the center line CL. Magnetic forces in opposite directions can be applied to both portions of the virtual portion DP, and thus the virtual portion DP can be bent. In one embodiment, a ferromagnetic material or the like can be arranged along the inner surface of the through portion 200TH of the pressing portion 200 and shield the magnetic force, thereby preventing or substantially preventing the application of magnetic force to the unit region CA outside the virtual portion DP.

[0137] As another example, each magnet 230 may comprise a ferromagnetic material, and the virtual portion DP of the mask MS may comprise a diamagnetic material. In this case, the virtual portion DP can receive magnetic force in a direction away from the magnet 230. However, because at least two side edges of the virtual portion DP are secured by the clamping portion 110, the virtual portion DP can be bent at its ends.

[0138] Figure 11 This is a schematic cross-sectional view illustrating an apparatus 20 (hereinafter referred to as a display device manufacturing apparatus) for manufacturing a display device according to an embodiment.

[0139] Reference Figure 11 The display device 30 can be manufactured by the display device manufacturing apparatus 20 (see...) Figure 12 ).

[0140] In one embodiment, the display device manufacturing apparatus 20 may include a cavity 21, a mask assembly MA, a first support 23, a second support 24, a deposition source 25, a magnetic generator 26, a visual portion 27, and a pressure controller 28.

[0141] The cavity 21 may have a space formed therein, and a portion of the cavity 21 may be open. In this case, the gate valve 22 may be arranged to open and close in the open portion of the cavity 21.

[0142] The mask assembly MA can be selectively arranged within cavity 21. In this case, the mask assembly MA may include a mask frame MF and a mask sheet MS. The mask sheet MS can be fixed to the mask frame MF in a tensioned state. The mask sheet MS may include at least one patterned hole PH.

[0143] The display substrate D can be positioned on the first support member 23. In this case, the first support member 23 can adjust the position of the display substrate D. For example, the first support member 23 may include a UVW stage.

[0144] The mask assembly MA can be positioned on the second support 24. In this case, similar to the first support 23, the second support 24 can adjust the position of the mask assembly MA.

[0145] At least one of the first support member 23 and the second support member 24 can be raised and / or lowered within the cavity 21. In this case, at least one of the first support member 23 and the second support member 24 can adjust the distance between the display substrate D and the mask frame MF.

[0146] In one embodiment, the deposition source 25 can supply the deposition material to the cavity 21 by evaporating or sublimating the deposition material after receiving it. In this case, the deposition source 25 may include a heater, and the deposition material in the deposition source 25 can be heated by the operation of the heater to melt or sublimate the deposition material. In this case, the deposition source 25 may be arranged at the center or edge of the cavity 21.

[0147] The magnetic generator 26 can be arranged in the cavity 21, and the mask assembly MA can be in close contact with the display substrate D. In this case, the magnetic generator 26 may include an electromagnet or a permanent magnet that generates magnetic force.

[0148] The vision section 27 can be arranged in the cavity 21 to take pictures of the positions of the mask assembly MA and the display substrate D. In this case, the vision section 27 can take pictures of alignment marks, etc., of at least one of the mask assembly MA and the display substrate D.

[0149] Pressure controller 28 may be connected to cavity 21 to regulate pressure within cavity 21. In one embodiment, pressure sensor 28 may include a connecting pipe 28a connected to cavity 21 and a pump 28b disposed in connecting pipe 28a.

[0150] Regarding the operation of the display device manufacturing apparatus 20, the gate valve 22 can be opened while the pressure controller 28 maintains the pressure inside the cavity 21 at a level equal to or similar to atmospheric pressure, allowing the display substrate D and the mask assembly MA to be inserted into the cavity 21. In this case, at least one of the display substrate D and the mask assembly MA can be moved by a separate robotic arm arranged outside the cavity 21 or by a shuttle inserted into or retracted from the cavity 21. In this case, the display substrate D can be positioned therein, for example, with a structure such as... Figure 13 The state of the pixel limiting layer 39, the pixel electrode 38A, and the layer disposed below the pixel limiting layer 39 is shown.

[0151] After the mask frame MF and the display substrate D are respectively arranged on the second support 24 and the first support 23, the positions of the mask frame MF and the display substrate D can be detected and aligned by the vision section 27. Subsequently, the display substrate D and the mask frame MF can be brought close to each other, and then the mask frame MF and the display substrate D can be brought into close contact with each other by the magnetic force generator 26.

[0152] When deposition material is released from deposition source 25, the deposition material can be deposited on display substrate D through patterned holes PH of mask MS to form a pattern. In this case, deposition material can be deposited on display substrate D, thereby forming, for example, an intermediate layer (e.g., Figure 13 The intermediate layer 38B) or at least one sublayer constituting the intermediate layer.

[0153] When the above process is completed, the display substrate D can be removed from the cavity 21 or moved to another position of the cavity 21 to form another layer on the display substrate D.

[0154] Figure 12 This is a schematic plan view illustrating a display device 30 manufactured by a display device manufacturing apparatus according to an embodiment.

[0155] Reference Figure 12 The display device 30 may include a display area DA and a surrounding area SA located outside the display area DA. The display device 30 can provide an image through a two-dimensional array of pixels PX arranged in the display area DA. The surrounding area SA is an area where no image is provided and may completely or partially surround the display area DA. Drivers for providing electrical signals or power to the pixels PX may be arranged in the surrounding area SA. Pads may be arranged in the surrounding area SA, which are areas where electronic devices or printed circuit boards can be electrically connected.

[0156] Figure 13 This is an example Figure 12 A schematic cross-sectional view of a portion of the display device 30. Figure 13 Can correspond to along Figure 12 The cross section of the display device 30 is taken by line A-A'.

[0157] Reference Figure 13In one embodiment, the display device 30 may include a display substrate D, an intermediate layer 38B, a counter electrode 38C, and an encapsulation layer. In one embodiment, the display substrate D may include a substrate 31, a buffer layer 32, a thin-film transistor (TFT), a planarization layer 37, a pixel electrode 38A, and a pixel defining layer 39. Additionally, the encapsulation layer may include an encapsulation substrate (not shown) that may be the same as or similar to the substrate 31, or a thin-film encapsulation layer E. When the encapsulation layer includes an encapsulation substrate, a sealing member (not shown) may be disposed between the substrate 31 and the encapsulation substrate. However, for ease of description, the case in which the encapsulation layer includes a thin-film encapsulation layer E will be described in this document.

[0158] In one embodiment, the substrate 31 may have a multilayer structure, which includes a base layer comprising a polymer resin and an inorganic layer. For example, the substrate 31 may include a base layer comprising a polymer resin and a shielding layer composed of an inorganic insulating material layer.

[0159] A buffer layer 32 may be disposed on a substrate 31. The buffer layer 32 may reduce or block the penetration of foreign matter, moisture or external air from the underside of the substrate 31 and may provide a flat surface on the substrate 31. The buffer layer 32 may comprise an inorganic insulating material such as silicon dioxide, silicon oxynitride or silicon nitride, and may have a single-layer or multi-layer structure comprising the aforementioned materials.

[0160] After an active layer 33 with a specific pattern arrangement is formed on the buffer layer 32, the active layer 33 may be covered by the gate insulating layer 34. The active layer 33 may include a source region 33C and a drain region 33A, and may further include a channel region 33B between the source region 33C and the drain region 33A.

[0161] The active layer 33 may comprise any of a variety of materials. For example, the active layer 33 may comprise an inorganic semiconductor material such as amorphous silicon or crystalline silicon. As another example, the active layer 33 may comprise an oxide semiconductor. As yet another example, the active layer 33 may comprise an organic semiconductor material. However, for ease of description herein, the case in which the active layer 33 comprises amorphous silicon will be described in more detail.

[0162] In one embodiment, an active layer 33 can be formed by forming amorphous silicon on buffer layer 32, crystallizing the amorphous silicon to form a polycrystalline silicon film, and patterning the polycrystalline silicon film. In the active layer 33, the source region 33C and the drain region 33A may be doped with impurities depending on the type of thin-film transistor (TFT) (e.g., a driving thin-film transistor or a switching thin-film transistor).

[0163] A gate electrode 35 corresponding to the active layer 33 and an interlayer insulating layer 36 covering the gate electrode 35 may be formed on the upper surface of the gate insulating layer 34.

[0164] Then, after forming contact holes H1 in the interlayer insulating layer 36 and the gate insulating layer 34, source electrode 37B and drain electrode 37A can be formed on the interlayer insulating layer 36 to contact source region 33C and drain region 33A respectively.

[0165] A planarization layer 37 may be formed on the thin-film transistor TFT as described above, and a pixel electrode 38A of an organic light-emitting diode (OLED) 38 may be formed on the planarization layer 37. The pixel electrode 38A may contact the drain electrode 37A of the thin-film transistor TFT through a via H2 formed in the planarization layer 37. The planarization layer 37 may comprise inorganic and / or organic materials, and may comprise a single layer or two or more layers. The planarization layer 37 may be formed as a planarization film such that its upper surface is flat and independent of the irregularities of the underlying film. On the other hand, the planarization layer 37 may be formed such that irregularities are formed along the irregularities of the underlying film. In one embodiment, the planarization layer 37 may comprise a transparent insulator to achieve a resonant effect.

[0166] After forming the pixel electrode 38A on the planarization layer 37, the pixel defining layer 39 may be formed to cover at least a portion of the pixel electrode 38A and the planarization layer 37, and an opening may be formed in the pixel defining layer 39 to expose the pixel electrode 38A. Additionally, an intermediate layer 38B and a counter electrode 38C may be formed on the pixel electrode 38A.

[0167] In one embodiment, pixel electrode 38A is used as an anode electrode, and counter electrode 38C is used as a cathode electrode. However, the polarity of pixel electrode 38A and counter electrode 38C can be reversed.

[0168] The pixel electrode 38A and the counter electrode 38C are insulated from each other through an intermediate layer 38B, and voltages of different polarities are applied to the intermediate layer 38B, causing light to be emitted from the organic emitting layer.

[0169] Intermediate layer 38B may include an organic emitter layer. As another alternative example, intermediate layer 38B includes an organic emitter layer and may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. This embodiment is not limited thereto, and intermediate layer 38B may include an organic emitter layer and may further include various other functional layers (not shown).

[0170] In one embodiment, the thin-film encapsulation layer E may include multiple inorganic layers, or it may include both inorganic and organic layers.

[0171] In one embodiment, the organic layer of the thin-film encapsulation layer E may include a polymer-based material. Examples of polymer-based materials may include acrylic resins, epoxy resins, polyimides, and polyethylene. For example, the organic layer may include an acrylic resin, such as polymethyl methacrylate or polyacrylic acid. The organic layer may be formed by curing monomers or coating polymers.

[0172] The inorganic layer of the thin-film encapsulation layer E may include an inorganic insulating material. In one embodiment, the inorganic insulating material may include aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and / or silicon oxynitride.

[0173] In one embodiment, the top layer of the thin-film encapsulation layer E exposed to the outside may include an inorganic layer, thereby preventing or substantially preventing moisture from penetrating into the OLED.

[0174] In one embodiment, the thin-film encapsulation layer E may include at least one sandwich structure in which at least one organic layer is between at least two inorganic layers. As another example, the thin-film encapsulation layer E may include both a sandwich structure in which at least one organic layer is between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is between at least two organic layers.

[0175] In one embodiment, the thin-film encapsulation layer E may, in sequence, comprise a first inorganic layer, a first organic layer, and a second inorganic layer from the top of the OLED. As another example, the thin-film encapsulation layer E may, in sequence, comprise a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer from the top of the OLED.

[0176] By using the display device manufacturing apparatus 20 according to one or more embodiments of the present disclosure, a metal layer, organic layer, or inorganic layer located on the entire surface of the display area DA of the display device 30 can be formed in precise locations. For example, the counter electrode 38C and the thin-film encapsulation layer E can be formed in precise locations using the display device manufacturing apparatus 20. In this way, a display device 30 with uniform quality can be manufactured.

[0177] According to one or more embodiments described above, apparatus for manufacturing a mask assembly, method for manufacturing a mask assembly, and method for manufacturing a display device can be implemented, which can minimize the size of the mask sheet, reduce mask sheet deformation, improve mask alignment accuracy, and shorten the process time required to manufacture the mask assembly. However, the scope of this disclosure is not limited to these aspects and effects.

[0178] It should be understood that the embodiments described herein are to be considered in a descriptive sense and are not intended to be limiting. The description of features or aspects within each embodiment should generally be considered as other similar features or aspects that may be used in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope set forth by the following claims.

Claims

1. An apparatus for manufacturing a mask assembly, the apparatus comprising: A tensioning portion is configured to be spaced apart from a mask frame including at least one opening, the tensioning portion being configured to tension a mask sheet in at least one of a first direction and a second direction, the mask sheet including a unit region corresponding to the at least one opening and a virtual portion disposed outside the unit region; A pressing part is configured to correspond to the virtual part and press the virtual part toward the mask frame along a third direction, the third direction intersecting a plane in which the first direction and the second direction extend; as well as A head is configured to irradiate a laser beam toward the mask to secure the mask to the mask frame; The pressing portion is configured to bend the mask sheet such that the unit region is closer to the mask frame than the edge of the virtual portion; and The virtual portion includes a fixed region adjacent to the unit region outside the unit region and a pressing region adjacent to the fixed region outside the fixed region, the laser beam irradiating the fixed region, and the pressing portion being configured to bend a portion of the mask into a circle in the pressing region.

2. The apparatus according to claim 1, wherein the tensioning part comprises: At least one pair of clamping parts are configured to clamp the edge of the virtual portion; and The moving part moves the at least one pair of clamping parts along the first direction or the second direction to apply tension to the mask sheet.

3. The apparatus of claim 2, wherein the tensioning portion further comprises a rotating body that causes the at least one pair of clamping portions to rotate about a rotation axis parallel to the surface of the mask frame.

4. The apparatus of claim 1, wherein the head is configured to check the alignment between the mask sheet and the mask frame.

5. The apparatus of claim 1, wherein the head is configured to irradiate the mask with a laser beam to cut a portion of the virtual portion from the unit region of the mask.

6. The apparatus of claim 1, wherein the pressing portion comprises at least two rollers positioned to directly contact the virtual portion.

7. The apparatus of claim 6, wherein the at least two rollers are arranged on opposite sides of a region corresponding to the unit region to sandwich the region between the at least two rollers.

8. The apparatus of claim 1, wherein the pressing portion includes an injection port configured to inject compressed air into the virtual portion in the third direction.

9. The apparatus of claim 1, wherein the pressing portion comprises a plurality of magnets arranged to apply magnetic force to the virtual portion along the third direction.

10. A method of manufacturing a mask assembly, the method comprising: Prepare a mask frame including at least one opening; Prepare a mask sheet, the mask sheet comprising a cell region corresponding to the at least one opening and a virtual portion disposed outside the cell region; Tension the mask sheet; Align the mask sheet with one side of the mask frame; Press the virtual portion of the mask sheet toward the mask frame so that at least a portion of the virtual portion is bent into a circle; as well as The mask is fixed to the mask frame by irradiating the virtual portion with a laser beam; The virtual portion includes a fixed region adjacent to the unit region outside the unit region and a pressing region adjacent to the fixed region outside the fixed region, the laser beam irradiating the fixed region, and at least a portion of the mask being bent into a circle in the pressing region.

11. The method of claim 10, further comprising forming at least two patterned holes in the unit region of the mask.

12. The method of claim 10, wherein tensioning the mask sheet includes clamping the edge of the virtual portion and applying tension to the mask sheet in a first direction or a second direction.

13. The method of claim 10, wherein pressing the virtual portion comprises: By directly applying force to the virtual portion, the mask sheet is pressed towards the mask frame; as well as Make the virtual part contact the mask frame.

14. The method of claim 10, wherein pressing the virtual portion comprises: By injecting compressed air into the virtual portion and pressing it towards the mask frame, the virtual portion is pressed down. Make the virtual part contact the mask frame.

15. The method of claim 10, wherein pressing the virtual portion comprises: By applying magnetic force to the virtual portion and pressing it towards the mask frame, the virtual portion is then... Make the virtual part contact the mask frame.

16. The method of claim 10, further comprising cutting the portion of the virtual portion from the cell region of the mask by irradiating a portion of the virtual portion with a laser beam.

17. A method of manufacturing a display device, the method comprising: Fabrication of mask components; Place and align the substrate and the mask assembly within the cavity; as well as The deposition material is supplied from the deposition source to the substrate through the mask assembly. The fabrication of the mask assembly includes: A tensioned mask sheet, the mask sheet comprising a unit region and a virtual portion disposed outside the unit region; Align the mask sheet over a mask frame that includes at least one opening; Press the virtual portion of the mask sheet toward the mask frame so that at least a portion of the virtual portion bends into a circle; and The mask is fixed to the mask frame by irradiating the virtual portion with a laser beam; The virtual portion includes a fixed region adjacent to the unit region outside the unit region and a pressing region adjacent to the fixed region outside the fixed region, the laser beam irradiating the fixed region, and at least a portion of the mask being bent into a circle in the pressing region.

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