Automatic sticking and peeling device

Abstract

The present invention relates to an automatic bonding and stripping device, which includes a carrier electrostatic generating group for adsorbing a wireless electrostatic carrier, and a substrate transfer group for adsorbing a thinned substrate. The substrate transfer group can be linearly displaced relative to the carrier electrostatic generating group, so that the substrate transfer group can drive the thinned substrate to be pressed onto the surface of the wireless electrostatic carrier of the carrier electrostatic generating group. In this way, the carrier electrostatic generating group can be driven to make the wireless electrostatic carrier generate an electrostatic electric field to bond the thinned substrate, thereby improving the bonding efficiency, greatly reducing the bonding failure rate, and reducing the occurrence of cracks or fragments.

Description

Technical Field

[0001] The present invention relates to an automatic bonding technology for an electrostatic chuck, specifically an automatic bonding and detachment device, which enables the electrostatic chuck to perform automated bonding and dissociation operations with a thinned substrate such as a wafer, improving work efficiency, reducing bonding failures and substrate breakage, and thus enhancing the process automation of the thinned substrate. Background Art

[0002] In recent years, due to the miniaturization development of semiconductor processes, such as memory and power devices, their miniaturization has been moving towards smaller sizes, higher performance, and lower costs. To make the chip area smaller, the semiconductor industry has adopted a design solution that changes the original horizontally deployed chip design to a vertical stacking method, namely the so-called 3DIC stacking package. Since the 3DIC stacking package is stacked vertically, the through-silicon via (TSV) technology is required to physically and electrically connect the functional chips in the IC package. Therefore, the thickness of the silicon wafer will be compressed to less than 100 microns. In addition, recently, the camera quality of smartphones is comparable to that of professional single-lens reflex cameras. One of the key factors for the significant improvement in the imaging quality of smartphone camera lenses is the introduction of ultra-thin blue glass filters in the smartphone camera lenses, which can absorb excess infrared light and restore the true color of objects.

[0003] When these thinned substrates, whether they are thinned wafers for 3D ICs or ultra-thin filters for lenses, have a thickness less than 200μm, 100μm, or even less than 50μm, and the surface area is larger, such as 8 inches, 12 inches or more in semiconductor processes. The thinned substrate will become very soft and elastic, and then warp. However, in the production of thinned substrates such as silicon wafers or glass sheets, they need to undergo polishing, cleaning, multi-layer coating, etching, and cutting. Since the ultra-thin substrate will be uneven and stressed due to warping during the process, it will cause process defects such as uneven thickness during coating. Moreover, the thinned substrate cannot be effectively focused during inspection due to warping, resulting in detection errors or delayed detection time, directly affecting the detection of defective products. Furthermore, there are also problems such as low storage capacity, fragility, and vulnerability during the transportation and assembly of the thinned substrate. Therefore, the warping problem of the thinned substrate has a significant adverse impact on the process reliability, resulting in increased process costs and unqualified rates.

[0004] In order to enable the thinned substrate to enter the process while maintaining flatness, a temporary bonding process is currently adopted for the thinned substrate to strengthen its tensile strength. The temporary bonding process mainly uses a bonding material of multiple layers of polymers to reversibly mount the thinned substrate onto a carrier. However, after the process, peeling is required. Thus, the qualification rate of the thinned substrate itself must be maintained both during bonding and peeling. At the same time, for the bonding material used after bonding, it is also necessary to cope with the mismatch of the coefficient of thermal expansion (CTE) between the bonding material and the material to be bonded, maintain the internal stress of the thinned wafer, and maintain the surface smoothness of the front / back of the wafer, as well as the acid and alkali problems of the bonding material in the process environment. These are all the problems faced in the temporary bonding process.

[0005] Currently, the latest improvement method is to use a wireless electrostatic chuck (E-Chuck or Supporter) to bond the thinned substrate and then supply it for the process operation of the thinned substrate. However, currently, the wireless electrostatic chuck bonds the thinned substrate manually. The manual bonding and peeling device pivotally mounts a selectively coverable substrate carrier on one side of an electrostatic force generating base. In use, the staff first places the thinned substrate on the electrostatic force generating base, and then manually rotates and lowers the upper substrate carrier to cover the electrostatic force generating base to adsorb the thinned substrate with the substrate carrier. Then, the staff places the wireless electrostatic chuck on the electrostatic force generator and rotates and covers the substrate carrier again to press the thinned substrate onto the opposite surface of the wireless electrostatic chuck. Finally, electricity is conducted to generate a static electric field between the wireless electrostatic chuck and the thinned substrate, so that the thinned substrate can be bonded to the wireless electrostatic chuck. When dissociating the wireless electrostatic chuck from the thinned substrate, the reverse operation is performed. The wireless electrostatic chuck with the thinned substrate bonded is placed on the electrostatic force generating base, and then the substrate carrier is covered above the thinned substrate. When the electrostatic force generating base starts dissociation and releases the electric field of the wireless electrostatic chuck, the upper substrate carrier can adsorb the thinned substrate and lift it upward, thereby separating the wireless electrostatic chuck from the thinned substrate.

[0006] However, such a manual operation method is not only extremely slow, but also because the relative bonding surfaces of the wireless electrostatic chuck and the thinned substrate cannot be ensured to be clean and dry under the personnel environment operation, resulting in bonding failure, and the bonding operation needs to be performed again. Moreover, there may even be problems of cracking or fragmentation due to misalignment, slippage, or uneven pressing. Therefore, its bonding efficiency is extremely poor. Furthermore, since the manual operation is carried out manually, it is difficult to accurately align the wireless electrostatic chuck and the thinned substrate during bonding. For the semiconductor process with high requirements for miniaturization and high precision, it is difficult to be directly applied to high-precision processes and can only be used in occasions with low precision requirements such as transmission and storage.

[0007] In other words, since the existing wireless electrostatic carrier plate bonds the thinned substrate manually, there are not only problems of low efficiency and high failure rate, but also possible cracking or fragmentation may occur. At the same time, it cannot meet the requirements of high-precision processes. How to solve the above problems is expected by the industry and is also the technical problem to be solved by the present invention.

[0008] Therefore, the inventor of the present invention deeply explored the problems faced by the existing wireless electrostatic carrier plate when bonding the thinned substrate, and relying on the requirements of the technological development in recent years, through continuous efforts in improvement and trial production, finally successfully developed an automatic bonding and detaching device to overcome the disadvantages and inconveniences caused by the existing manual operation. Summary of the Invention

[0009] Therefore, the main object of the present invention is to provide an automatic bonding and detaching device, which can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracking or fragmentation.

[0010] Furthermore, another main object of the present invention is to provide an automatic bonding and detaching device, which can quickly and accurately automatically bond a wireless electrostatic carrier plate and a thinned substrate, so that the wireless electrostatic carrier plate and the thinned substrate can be applied to subsequent processes, greatly improving the process qualification rate of the thinned substrate, and reducing costs and increasing profits.

[0011] Based on this, the present invention mainly realizes the above-mentioned objects and effects through the following technical means:

[0012] An automatic bonding and detaching device for bonding or dissociating a wireless electrostatic carrier plate and a thinned substrate. The bottom surface of the wireless electrostatic carrier plate has a guide electrode for generating an electrostatic power field by conduction. The automatic bonding and detaching device is characterized in that it comprises:

[0013] A frame;

[0014] A carrier plate electrostatic generation group, which is arranged on the frame. The carrier plate electrostatic generation group has a working plane for the wireless electrostatic carrier plate to be placed flat. A series of suction attachments corresponding to the bottom surface of the wireless electrostatic carrier plate are arranged on the working plane, and there are a multiple of two corresponding guide electrodes for contacting the bottom guide electrode of the wireless electrostatic carrier plate on the working plane to drive the generation or release of the electrostatic power field of the wireless electrostatic carrier plate. There is a guide post group on the working plane. The guide post group includes at least two fixed guide posts for restricting the lateral position of the carrier plate and at least one movable guide post capable of laterally pushing the carrier plate to engage with the fixed guide posts, so that the wireless electrostatic carrier plate or the thinned substrate can be positioned at a correct position on the working plane;

[0015] A substrate transfer group, which is arranged on the frame and is opposite to the carrier plate electrostatic generation group. The substrate transfer group and the carrier plate electrostatic generation group can move relative to each other, so that the substrate transfer group can adsorb a thinned substrate with a correct position;

[0016] After the substrate transfer group drives the thinning substrate to be pressed against the wireless electrostatic carrier tray, it can drive the carrier plate electrostatic generation group to generate an electrostatic power field on the wireless electrostatic carrier tray to bond the thinning substrate.

[0017] The automatic adhesion and detachment device, wherein: the working plane is composed of a main frame plate and wing plates pivotally arranged at both side edges of the main frame plate, and one end of the two wing plates different from the main frame plate can be selectively displaced downward.

[0018] The automatic adhesion and detachment device, wherein: a material ejecting member capable of being selectively lifted and lowered is arranged inside the main frame plate, and the material ejecting member can be displaced between the working plane and a receiving plane higher than the working plane.

[0019] The automatic adhesion and detachment device, wherein: an inclined guiding edge is formed on the peripheral edge of the top of the fixed guide post and the movable guide post of the guide post group, so that when the material ejecting member descends, the wireless electrostatic carrier tray can be guided to the correct position on the working plane.

[0020] The automatic adhesion and detachment device, wherein: a touch detection group is arranged at the outer peripheral edge of the wireless electrostatic carrier tray corresponding to the carrier plate electrostatic generation group. The touch detection group includes at least two touch convex columns that can be telescoped and surround the outer peripheral edge of the wireless electrostatic carrier tray and at least one guiding and correcting convex column that can move back and forth. The guiding and correcting convex column can rotate and correct with the axis as the center by using the positioning notch of the wireless electrostatic carrier tray or the thinning substrate.

[0021] The automatic adhesion and detachment device, wherein: an optical detection group is arranged at the outer peripheral edge of the wireless electrostatic carrier tray corresponding to the carrier plate electrostatic generation group. The optical detection group includes at least three photoelectric elements surrounding the outer peripheral edge of the wireless electrostatic carrier tray, and is used to trigger an alarm when any photoelectric element is blocked due to the wireless electrostatic carrier tray not being properly positioned.

[0022] The automatic adhesion and detachment device, wherein: a blowing unit is respectively arranged at the corresponding positions of the two wing plates of the carrier plate electrostatic generation group. The blowing unit has a jet nozzle extending from the outer peripheral edge of the wireless electrostatic carrier tray towards the axis direction, for blowing high-speed gas to effectively separate the wireless electrostatic carrier tray and the thinning substrate.

[0023] The automatic adhesion and detachment device, wherein: the substrate transfer group has a frame base, and a plurality of suction members are arranged on the surface of the frame base. The plurality of suction members include surface suction members corresponding to the range of the thinning substrate or edge suction members adjacent to the edge of the thinning substrate. The surface suction members adopt the adsorption technology of Bernoulli's law.

[0024] The automatic bonding and debonding device described above, wherein: an optical detection group is provided at the outer periphery of the thinning substrate corresponding to the substrate transfer group. The optical detection group includes at least three photoelectric elements surrounding the outer periphery of the thinning substrate, and is used to trigger an alarm when any one of the photoelectric elements is blocked due to the misalignment of the thinning substrate.

[0025] The automatic bonding and debonding device described above, wherein: a falling prevention member that can selectively expand and contract may be provided at the periphery of the substrate transfer group. The range surrounded by it when it extends is smaller than the outer diameter of the thinning substrate. When the thinning substrate enters the adsorption surface of the substrate transfer group, the falling prevention member can be extended to prevent the thinning substrate from falling due to ineffective adsorption. And the falling prevention member can retract after confirming that the thinning substrate is effectively adsorbed by the substrate transfer group.

[0026] In this way, through the specific implementation of the above technical means, the present invention can improve the bonding efficiency, greatly reduce the bonding failure rate, and reduce the occurrence of cracks or fragments. The wireless electrostatic carrier plate can bond the thinning substrate and can be applied to subsequent processes, which can greatly improve the process qualification rate of the thinning substrate, reduce costs and increase profits, so as to increase its added value, and further improve its economic benefits.

[0027] To further understand the composition, features and other purposes of the present invention, the following are preferred embodiments of the present invention, which are described in detail with reference to the drawings as follows, so that those skilled in the art can implement it specifically. Description of the Drawings

[0028] Figure 1 It is a schematic external view of the automatic bonding and debonding device of the present invention.

[0029] Figure 2 It is a schematic side view of the automatic bonding and debonding device of the present invention.

[0030] Figure 3 It is a schematic external view of the carrier plate electrostatic generation group in the automatic bonding and debonding device of the present invention.

[0031] Figure 4 It is a schematic top view of the carrier plate electrostatic generation group in the automatic bonding and debonding device of the present invention.

[0032] Figure 5 It is a schematic external view of the substrate transfer group in the automatic bonding and debonding device of the present invention.

[0033] Figure 6 It is a schematic partial bottom view of the substrate transfer group in the automatic bonding and debonding device of the present invention.

[0034] Figure 7 It is a schematic side view of the carrier plate electrostatic generation group during top feeding in the automatic bonding and debonding device of the present invention.

[0035] Figure 8It is a schematic side view of the operation of the carrier electrostatic generation group in the automatic sticking and detaching device of the present invention during alignment.

[0036] Figure 9 It is a schematic top view of the operation of the carrier electrostatic generation group in the automatic sticking and detaching device of the present invention during alignment.

[0037] Figure 10 It is a schematic partial top view of the operation of the carrier electrostatic generation group in the automatic sticking and detaching device of the present invention during alignment.

[0038] Figure 11 It is a schematic partial side view of the operation of the carrier electrostatic generation group in the automatic sticking and detaching device of the present invention during dissociation.

[0039] Description of reference numerals: 50 - sticking and detaching device; 51 - lower frame; 52 - upper frame; 60 - carrier plate electrostatic generation group; 61 - main frame plate; 62 - ejector; 620 - detection element; 63 - guide electrode; 64 - adsorbing member; 65 - side wing plate; 66 - guide post; 660 - fixed guide post; 661 - inclined guide surface; 665 - movable guide post; 666 - inclined guide surface; 67 - triggering detection group; 670 - triggering convex post; 675 - alignment convex post; 68 - optical detection group; 680 - optoelectronic element; 69 - blowing unit; 690 - injection nozzle; 70 - driving member; 80 - substrate transfer group; 81 - frame base; 810 - detection element; 82 - lifting mechanism; 83 - adsorbing member; 830 - surface adsorbing member; 835 - edge adsorbing member; 85 - optical detection group; 850 - optoelectronic element; 86 - anti - falling member. Detailed Description of the Invention

[0040] The present invention is an automatic sticking and detaching device. In the accompanying drawings showing the specific embodiments of the present invention and its components, all references to front and back, left and right, top and bottom, upper and lower, and horizontal and vertical are for convenience of description only, and do not limit the present invention, nor limit its components to any position or spatial direction. The dimensions specified in the drawings and the description can be changed according to the design and requirements of the specific embodiments of the present invention without departing from the scope of the patent application of the present invention.

[0041] The automatic bonding system of the present invention for a wireless electrostatic chuck is as Figure 1 、 Figure 2As shown, it is used for the automatic bonding of a wireless electrostatic carrier tray 100 and a thinned substrate 200 and the automatic dissociation after bonding. The thinned substrate 200 can be a semiconductor wafer, a glass sheet, or a plastic sheet. The bonding and dissociation device 50 includes a carrier plate electrostatic generation group 60 for adsorbing the wireless electrostatic carrier tray 100 and a substrate transfer group 80 for adsorbing the thinned substrate 200, which can be displaced relative to each other. The bonding and dissociation device 50 has a frame that can be fixedly arranged on the machine body 10. The frame includes a lower frame 51 and an upper frame 52. The carrier plate electrostatic generation group 60 is arranged at the top of the lower frame 51, and the substrate transfer group 80 is arranged above the carrier plate electrostatic generation group 60 corresponding to the upper frame 52 by means of a lifting mechanism 82, so that the substrate transfer group 80 can drive the thinned substrate 200 to be correspondingly pressed against the surface of the wireless electrostatic carrier tray 100 on the top surface of the carrier plate electrostatic generation group 60;

[0042] And the aforementioned carrier plate electrostatic generation group 60 is as Figure 3 、 Figure 4 shown. It has a main frame plate 61 and side wing plates 65 pivotally arranged on both side edges of the main frame plate 61. The main frame plate 61 and the side wing plates 65 on both sides have a working plane for the wireless electrostatic carrier tray 100 to be placed flat. A detection element 610 is arranged on the main frame plate 61 of the working plane to detect whether the wireless electrostatic carrier tray 100 or the thinned substrate 200 exists. In addition, a pusher 62 is arranged inside the main frame plate 61. The pusher 62 can be displaced between the working plane and a higher receiving plane (as Figure 7 、 Figure 8 shown), which is convenient for the gripper of the transfer device 20 such as a robotic arm to penetrate and place or take away the wireless electrostatic carrier tray 100 or the thinned substrate 200. The pusher 62 can be composed of at least three synchronously liftable ejector rods or a liftable top plate. In addition, a telescopic cylinder 70 is arranged between the central bottom edge of the outer side of the two side wing plates 65 different from the main frame plate 61 and the lower frame 51 to selectively actuate the outer side edges of the two side wing plates 65 to be inclined downward (as Figure 11As shown in the figure, it is used to drive the wireless electrostatic carrier tray 100 and the bonded thinned substrate 200 to be peeled off relatively from the outer edge. Furthermore, a series of suction attachments 64 (such as vacuum suction cups) corresponding to the bottom surface of the wireless electrostatic carrier tray 100 are provided on the main frame plate 61 and the side wing plates 65, for selectively fixing the wireless electrostatic carrier tray 100 on the working planes of the main frame plate 61 and the side wing plates 65. And the main frame plate 61 is provided with two or a multiple of two conductive poles 63, corresponding to the positive and negative conductive poles 105 on the bottom surface of the wireless electrostatic carrier tray 100, to provide electricity so that an electrostatic power field can be generated or dissociated on the surface of the wireless electrostatic carrier tray 100 relative to the thinned substrate 200, for enabling the wireless electrostatic carrier tray 100 to be adhesively bonded or dissociated with the thinned substrate 200. Moreover, a guiding group 66 is provided on the side wing plates 65 on both sides. The guiding group 66 includes at least two fixed guide posts 660 and at least one movable guide post 665 surrounding the outer peripheral edge of the wireless electrostatic carrier tray 100. In the present invention, two fixed guide posts 660 and two movable guide posts 665 are taken as the main embodiments. Wherein the at least one movable guide post 665 can push the wireless electrostatic carrier tray 100 to be positioned at the correct horizontal position of the at least two fixed guide posts 660 (as shown in Figure 9 As shown in the figure. Furthermore, an inclined guiding edge 661, 666 is formed on the peripheral edges of the tops of the at least two fixed guide posts 660 and the at least one movable guide post 665, so that when the ejector member 62 descends, the wireless electrostatic carrier tray 100 or the thinned substrate 200 can be guided to the correct range on the working plane. Moreover, a touch detection group 67 and an optical detection group 68 are respectively provided on the carrier plate electrostatic generation group 60 corresponding to the outer peripheral edge of the wireless electrostatic carrier tray 100. Wherein the touch detection group 67 includes at least two touch convex posts 670 that can be telescoped and surround the outer peripheral edge of the wireless electrostatic carrier tray 100 and at least one guiding and correcting convex post 675 that can move back and forth. Wherein the guiding and correcting convex post 675 can correspond to the positioning notches 101, 201 of the wireless electrostatic carrier tray 100 or the thinned substrate 200, so that the guiding and correcting convex post 675 can make it rotate and be guided with the axis as the center by using the positioning cuts 101, 201 of the wireless electrostatic carrier tray 100 or the thinned substrate 200 (as shown in Figure 10 As shown in the figure. And it is further used to trigger an alarm when the wireless electrostatic carrier tray 100 or the thinned substrate 200 touches any one of the touch convex posts 670 when it is not properly positioned. As for the optical detection group 68, it includes at least three optoelectronic elements 680 surrounding the outer peripheral edge of the wireless electrostatic carrier tray 100, for triggering an alarm when the wireless electrostatic carrier tray 100 or the thinned substrate 200 touches and blocks any one of the optoelectronic elements 680 when it is not properly positioned, to ensure the accurate alignment of the wireless electrostatic carrier tray 100 and the thinned substrate 200. Another example is as shown in Figure 9 As shown in the figure, the carrier plate electrostatic generation group 60 is respectively provided with a blowing unit 69 at the positions corresponding to the side wing plates 65 on both sides of the lower frame. The blowing unit 69 has a jet nozzle 690 extending in the axial direction of the outer peripheral edge of the wireless electrostatic carrier tray 100 (as shown in Figure 11As shown, when the wireless electrostatic carrier 100 starts dissociation and is driven by the side wing plates 65 to peel off from the thinned substrate 200, high-speed gas can be blown in to effectively separate the wireless electrostatic carrier 100 from the thinned substrate 200.

[0043] Moreover, the aforementioned substrate transfer group 80 is as shown in Figure 5 and Figure 6 It is composed of a frame base 81 that can selectively adsorb the thinned substrate 200. The frame base 81 can be linearly actuated up and down by a lifting mechanism 82 to drive the thinned substrate 200 to selectively press against the wireless electrostatic carrier 100 below. Moreover, a detection element 810 is provided on the surface of the frame base 81 to detect the presence of the thinned substrate 200. The frame base 81 has an adsorption surface, and the adsorption surface of the frame base 81 has a plurality of adsorbing members 83, which can include surface adsorbing members 830 within the range corresponding to the thinned substrate 200 or edge adsorbing members 835 near the edge of the thinned substrate 200. Among them, the surface adsorbing members 830 can be adsorption technologies based on Bernoulli's law to reduce possible damage to the thinned substrate 200 during the adsorption process. Furthermore, an optical detection group 85 is provided at the outer periphery of the substrate transfer group 80 corresponding to the thinned substrate 200. The optical detection group 85 includes at least three optoelectronic elements 850 surrounding the outer periphery of the thinned substrate 200, which can trigger an alarm when the thinned substrate 200 is not properly positioned and blocks any one of the optoelectronic elements 850 to ensure accurate alignment of the thinned substrate 200. According to some embodiments, a selectively retractable anti-falling member 86 can be provided at the periphery of the substrate transfer group 80, and the range surrounded when it extends is smaller than the outer diameter of the thinned substrate 200. When the thinned substrate 200 enters the adsorption surface of the substrate transfer group 80, the anti-falling member 86 can be extended to prevent the thinned substrate 200 from falling due to ineffective adsorption, and it can retract after confirming that the thinned substrate 200 is effectively adsorbed by the substrate transfer group 80. According to some embodiments, the substrate transfer group 80 can be a robotic arm that can clamp the thinned substrate 200 relative to the carrier plate electrostatic generation group 60.

[0044] In this way, an automatic bonding system that can automatically bond and automatically dissociate the wireless electrostatic carrier 100 and the thinned substrate 200 is formed.

[0045] During its actual operation, as shown in Figure 1 and Figure 2 and Figure 3 and Figure 4 The transmission device 20 places the wireless electrostatic carrier 100 on the working plane of the main frame plate 61 and the wing plates 65 of the carrier plate electrostatic generation group 60 (as shown in Figure 7 and Figure 8 ), and uses it to trigger the detection group 67 and the optical detection group 68 to ensure that the wireless electrostatic carrier 100 is accurately positioned in the specified orientation (as shown in Figure 9 andFigure 8 As shown, the carrier plate static electricity generation group 60 can fix the wireless static electricity carrier tray 100 by using the adsorption member 64. Additionally, as Figure 5 shown, Figure 6 the transfer device 20 places the thinned substrate 200 on the bottom surface of the substrate transfer group 80. After using its touch detection group 67 and optical detection group 85 to ensure that the thinned substrate 200 is accurately positioned in a specified orientation, the substrate transfer group 80 can fix the thinned substrate 200 by using the adsorption member 83, and make the wireless static electricity carrier tray 100 and the thinned substrate 200 face each other in the same specified orientation;

[0046] After the wireless static electricity carrier tray 100 and the thinned substrate 200 are fixed on the opposite surfaces in the same specified orientation, as Figures 7 to 10 shown, the substrate transfer group 80 drives the thinned substrate 200 to linearly displace relative to the wireless static electricity carrier tray 100 of the carrier plate static electricity generation group 60, so that the thinned substrate 200 can be attached to the surface of the wireless static electricity carrier tray 100 in the same specified orientation, and the outer peripheral edges of both completely overlap. After the wireless static electricity carrier tray 100 and the thinned substrate 200 are attached, the carrier plate static electricity generation group 60 can electrically conduct the wireless static electricity carrier tray 100, so that the wireless static electricity carrier tray 100 can generate an electrostatic field relative to the thinned substrate 200, and complete the work of electrostatically bonding the thinned substrate 200 to the wireless static electricity carrier tray 100.

[0047] Furthermore, the bonded thinned substrate 200 and the wireless static electricity carrier tray 100 can also be dissociated. The wireless static electricity carrier tray 100 bonded with the thinned substrate 200 is placed in the carrier plate static electricity generation group 60 for adsorption and fixation, and the substrate transfer group 80 is linearly displaced and adsorbed and fixed on the surface of the thinned substrate 200 on the side different from the wireless static electricity carrier tray 100. Then, the carrier plate static electricity generation group 60 releases the electrostatic field of the wireless static electricity carrier tray 100, so that the static electricity of the wireless static electricity carrier tray 100 is released, and then the thinned substrate 200 can be dissociated. The substrate transfer group 80 drives the thinned substrate 200 and the wireless static electricity carrier tray 100 to relatively separate in the reverse displacement, and finally the relative transfer device 20 is used to place the wireless static electricity carrier tray 100 and the thinned substrate 200 into the corresponding carrier tray loading and unloading ports 18 and substrate loading and unloading ports 16 respectively. According to some embodiments, as Figure 11 shown, after the static electricity of the wireless static electricity carrier tray 100 is released, the outer peripheral edge of the wireless static electricity carrier tray 100 can be actuated downward, so that the outer peripheral edge of the wireless static electricity carrier tray 100 can be pre-peeled relative to the thinned substrate 200 to generate an opening, and high-speed gas is blown into the wireless static electricity carrier tray 100 from the outer peripheral edge through the jet nozzle 690 of a jet unit 69, so that the wireless static electricity carrier tray 100 and the thinned substrate 200 can be effectively separated.

[0048] As can be seen from the above, the automatic bonding and de-bonding device of the present invention can improve the bonding efficiency, significantly reduce the bonding failure rate, and reduce the occurrence of cracks or chips. It can meet the requirements of high-precision processes to satisfy the needs of the automated production of thinned substrates, enabling the wireless electrostatic carrier to bond the thinned substrates for subsequent processes, greatly improving the process qualification rate of the thinned substrates, and reducing costs and increasing profits.

[0049] The above description is illustrative rather than restrictive to the present invention. Those of ordinary skill in the art understand that without departing from the spirit and scope defined by the claims, many modifications, variations, or equivalents can be made, but all will fall within the protection scope of the present invention.

Claims

1. An automatic bonding and detaching device is used for bonding or dissociating a wireless electrostatic carrier tray and a thinned substrate. The bottom surface of the wireless electrostatic carrier tray has electrodes for generating an electrostatic power field through conduction. Characterized in that, The automatic bonding and detaching device includes: A frame; A carrier plate electrostatic generation group, which is arranged on the frame. The carrier plate electrostatic generation group has a working plane for the wireless electrostatic carrier tray to be placed flat. A series of suction attachments corresponding to the bottom surface of the wireless electrostatic carrier tray are arranged on the working plane, and there are a multiple of two electrodes corresponding to and contacting the bottom electrodes of the wireless electrostatic carrier tray on the working plane to drive the generation or release of the electrostatic power field of the wireless electrostatic carrier tray. There is a guide post group on the working plane. The guide post group includes at least two fixed guide posts for restricting the lateral position of the carrier tray and at least one movable guide post capable of laterally pushing the carrier tray to engage with the fixed guide posts, so that the wireless electrostatic carrier tray or the thinned substrate can be positioned at a correct position on the working plane; A substrate transfer group, which is arranged on the frame and opposite to the carrier plate electrostatic generation group. The substrate transfer group and the carrier plate electrostatic generation group can move relative to each other, so that the substrate transfer group can adsorb a thinned substrate with a correct position; After the substrate transfer group drives the thinned substrate to press against the wireless electrostatic carrier tray, it can drive the carrier plate electrostatic generation group to generate an electrostatic power field for the wireless electrostatic carrier tray to bond the thinned substrate.

2. The automatic bonding and detaching device according to claim 1, Characterized in that: The working plane is composed of a main frame plate and wing plates pivotally arranged on both side edges of the main frame plate, and one ends of the two wing plates different from the main frame plate can be selectively displaced downward.

3. The automatic bonding and detaching device according to claim 2, Characterized in that: A top feeding part capable of being selectively lifted and lowered is arranged inside the main frame plate, and the top feeding part can be displaced between the working plane and a receiving plane higher than the working plane.

4. The automatic bonding and detaching device according to claim 3, Characterized in that: An inclined guide edge is formed on the peripheral edges of the top ends of the fixed guide posts and the movable guide posts of the guide post group, so that the wireless electrostatic carrier tray can be guided to the correct position on the working plane when the top feeding part descends.

5. The automatic bonding and detaching device according to claim 1, Characterized in that: A touch detection group is arranged at the outer peripheral edge of the wireless electrostatic carrier tray corresponding to the carrier plate electrostatic generation group. The touch detection group includes at least two touch convex posts that can be telescoped and surround the outer peripheral edge of the wireless electrostatic carrier tray and at least one guiding convex post that can move back and forth. The guiding convex post can use the positioning notch of the wireless electrostatic carrier tray or the thinned substrate to rotate and guide it with the axis as the center.

6. The automatic bonding and detaching device according to claim 1 or 5, Characterized in that: An optical detection group is arranged at the outer peripheral edge of the wireless electrostatic carrier tray corresponding to the carrier plate electrostatic generation group. The optical detection group includes at least three photoelectric elements surrounding the outer peripheral edge of the wireless electrostatic carrier tray, which is used to trigger an alarm when the wireless electrostatic carrier tray is not placed correctly and blocks any one of the photoelectric elements.

7. The automatic bonding and detaching device according to claim 2, Characterized in that: The electrostatic generation group of the carrier board is respectively provided with a blowing unit at the corresponding two side wing plates. The blowing unit has a jet nozzle extending from the outer periphery of the corresponding wireless electrostatic carrier plate towards the axis direction, for blowing in high-speed gas to effectively separate the wireless electrostatic carrier plate from the thinned substrate.

8. The automatic sticking and detaching device according to claim 1, characterized in that: The substrate transfer group has a frame base, and there are a plurality of suction attachments on the surface of the frame base. The plurality of suction attachments include surface suction attachments corresponding to the range of the thinned substrate or edge suction attachments at the edge of the thinned substrate. Among them, the surface suction attachments adopt the adsorption technology based on Bernoulli's law.

9. The automatic sticking and detaching device according to claim 1 or 8, characterized in that: The substrate transfer group is provided with an optical detection group at the outer periphery of the corresponding thinned substrate. The optical detection group includes at least three optoelectronic elements surrounding the outer periphery of the thinned substrate, used to trigger an alarm when any optoelectronic element is blocked due to the thinned substrate not being properly positioned.

10. The automatic sticking and detaching device according to claim 1, characterized in that: The periphery of the substrate transfer group is provided with a fall prevention member that can selectively expand and contract. The range surrounded by it when it extends is smaller than the outer diameter of the thinned substrate. When the thinned substrate enters the adsorption surface of the substrate transfer group, the fall prevention member can extend to prevent the thinned substrate from falling due to ineffective adsorption, and the fall prevention member can retract after confirming that the thinned substrate is effectively adsorbed by the substrate transfer group.

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