A contactless wafer transfer device

Abstract

The invention discloses a contactless wafer transfer device, which belongs to the field of wafer production. The contactless wafer transfer device comprises a transfer bracket, one side of which is provided with a suction mechanism, the suction mechanism is used for contactless suction and fixation of the wafer, the suction mechanism comprises a Y-shaped gripper, the Y-shaped gripper is provided on one side of the transfer bracket, high-pressure air cavities are provided on both sides of the interior of the Y-shaped gripper, jet holes are evenly provided on the top of the high-pressure air cavity, a deflection blocking column is provided inside the jet hole, and a guide side plate is provided on one side of the top of the deflection blocking column; a transfer mechanism is provided between the Y-shaped gripper and the transfer bracket, the transfer mechanism can utilize the Bernoulli principle to realize contactless and firm grasping of the wafer, and solves the problem that the traditional manual handling and the ordinary negative pressure vacuum suction handling methods may cause the distortion, deformation or fragmentation of the wafer.

Description

Technical Field

[0001] The present invention relates to the field of wafer production, and more specifically, to a contactless wafer transfer device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8 inches and 12 inches, and transfer equipment is needed to move the wafer when inspecting and etching it.

[0003] However, the conventional manual handling and common negative pressure vacuum suction handling methods used in existing wafer transfer may cause the wafer to be distorted or broken. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] In view of the problems existing in the prior art, the purpose of the present invention is to provide a contactless wafer transfer device, which can utilize the Bernoulli principle to achieve contactless and firm grasping of wafers, thereby solving the problem that traditional manual handling and ordinary negative pressure vacuum suction handling methods may cause distortion, deformation or breakage of wafers.

[0006] 2. Technical solution

[0007] To solve the above problems, the present invention adopts the following technical solutions.

[0008] A contactless wafer transfer device comprises a transfer bracket, a suction mechanism is installed on one side of the transfer bracket, the suction mechanism is used for contactless suction and fixation of the wafer, the suction mechanism comprises a Y-shaped gripper, the Y-shaped gripper is installed on one side of the transfer bracket, high-pressure air cavities are opened on both sides of the interior of the Y-shaped gripper, jet holes are evenly opened on the top of the high-pressure air cavity, a deflection blocking column is arranged inside the jet hole, and a guide side plate is installed on one side of the top of the deflection blocking column; a transfer mechanism is arranged between the Y-shaped gripper and the transfer bracket, the transfer mechanism is used for driving the Y-shaped gripper to move, the transfer mechanism comprises a Z-axis bracket, the Z-axis bracket is embedded in one side of the transfer bracket, an X-axis bracket is movably arranged on one side of the Z-axis bracket, a fixed frame is installed on the bottom end of the X-axis bracket, and the fixed frame and the X-axis bracket are connected and fixed by a connecting bracket.

[0009] Furthermore, the top of the guide side plate is rotatably connected to the end of the deflection baffle column via a swivel clamp, and a fixing screw ring is threadedly connected to the top of the swivel clamp.

[0010] Furthermore, a high-pressure air pump is embedded in one side of the top of the Y-shaped gripper corresponding to the end of the high-pressure air cavity, and the Y-shaped gripper is made of ceramic material.

[0011] Furthermore, one side of the Y-shaped gripper and the bottom end of the connecting bracket are fixedly connected to the fixed frame via an electrical slip ring, and a rotating shaft seat is installed on one side of the end of the electrical slip ring.

[0012] Furthermore, a transmission chain is clamped on one side of the outer wall of the transfer bracket and the top of the X-axis bracket.

[0013] Furthermore, an optical fiber detection bracket is clamped on the other side of the outer wall of the fixed frame.

[0014] Furthermore, a protective mechanism is provided at the bottom end of the fixed frame corresponding to the bottom of the Y-shaped claw, and the protective mechanism includes a protective bottom bucket, which is installed at the bottom end of the fixed frame at a position corresponding to the bottom of the Y-shaped claw, a support shaft is rotatably installed at the top of the protective bottom bucket, a movable plate is installed outside the support shaft, and collecting side cavities are opened on both sides of the bottom end of the protective bottom bucket, and a pressure sensor is embedded on one side of the inner wall of the collecting side cavity.

[0015] Furthermore, a driving motor is arranged on one side of the supporting shaft, and the surfaces of the protective bottom bucket and the movable plate are both covered with sponge cushions.

[0016] Furthermore, both ends of the support shaft are connected to the inner wall of the protective bottom bucket through bearings, and the movable plate is fixedly sleeved on the support shaft.

[0017] 3. Beneficial effects

[0018] Compared with the prior art, the advantages of the present invention are:

[0019] (1) This scheme is provided with a suction mechanism. By using the Bernoulli principle, a high-pressure body jet is ejected from the jet hole through the high-pressure gas cavity, and the jet gas is laterally ejected around the surface of the Y-shaped gripper through the deflection baffle column, so that a cyclone is generated between the surface of the Y-shaped gripper and the surrounding air to form a negative pressure, which can absorb the wafer without contact, thus solving the problem that the traditional manual handling and ordinary negative pressure vacuum suction handling methods may cause the wafer to be distorted, deformed or broken. In addition, the jet gas is deflected and guided by the guide side plate, thus solving the problem that the jet gases of adjacent jet holes interfere with each other, resulting in uneven suction on the surface of the Y-shaped gripper.

[0020] (2) This solution is provided with a transfer mechanism. Driven by a transmission chain, the Y-shaped gripper can be moved in the horizontal direction by the sliding of the connecting bracket at the X-axis bracket, and can be moved in the vertical direction by the sliding of the X-axis bracket at the Z-axis bracket. In conjunction with the rotation of the fixed frame by the electrical slip ring and the rotating shaft seat, the Y-shaped gripper can rotate continuously 360 degrees while transmitting electricity and fluid pressure, thereby ensuring the accuracy and efficiency of the Y-shaped gripper in transferring wafers.

[0021] (3) This solution is provided with a protective mechanism. When the Y-shaped gripper fails to transfer the wafer or the optical fiber detection bracket detects unqualified wafers, the wafers can be protected and collected by the movable plate. By flipping the movable plate, the dropped qualified wafers and the detected unqualified wafers can be collected into the two collection side cavities respectively. When the pressure sensor is in contact with one side of the movable plate and is under pressure, the number of unqualified wafers can be counted, thereby realizing the wafer protection function and the counting and collection function of unqualified wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the device of the present invention;

[0023] Figure 2 For the present invention Figure 1 Schematic diagram of the structure of the Y-shaped gripper installation;

[0024] Figure 3 For the present invention Figure 2 Structural diagram of the fixed frame installation;

[0025] Figure 4 For the present invention Figure 3 Schematic diagram of the overall structure of the Y-shaped gripper;

[0026] Figure 5 For the present invention Figure 4 A schematic diagram of the structure of the inner section of the Y-shaped gripper;

[0027] Figure 6 For the present invention Figure 4 A schematic diagram of the structure at the middle jet hole is enlarged;

[0028] Figure 7 For the present invention Figure 2 Structural diagram of the installation of the connecting bracket;

[0029] Figure 8 It is a structural schematic diagram of the transfer mechanism in the present invention 2;

[0030] Fig. 9 For the present invention Figure 1 Structural diagram of the installation of the middle protective bottom bucket;

[0031] Fig.10For the present invention Fig. 9 Schematic diagram of the structure inside the middle protective bottom bucket.

[0032] Description of the numbers in the figure:

[0033] 1. Transfer bracket; 2. Suction mechanism; 201. Y-shaped gripper; 202. High-pressure air cavity; 203. Jet hole; 204. Deflection baffle column; 205. Guide side plate; 206. Rotating clamp ring; 3. Transfer mechanism; 301. X-axis bracket; 302. Z-axis bracket; 303. Fixed frame; 304. Connecting bracket; 305. Transmission chain; 4. Optical fiber detection bracket; 5. Electrical slip ring; 6. Rotating shaft seat; 7. Driving motor; 8. High-pressure air pump; 9. Protection mechanism; 901. Protective bottom bucket; 902. Support shaft; 903. Movable plate; 904. Collecting side cavity; 905. Pressure sensor. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0035] Embodiment 1:

[0036] See also Figure 1-10A contactless wafer transfer device comprises a transfer support 1, a suction mechanism 2 is installed on one side of the transfer support 1, the suction mechanism 2 comprises a Y-shaped gripper 201, the Y-shaped gripper 201 is installed on one side of the transfer support 1, high-pressure air cavities 202 are opened on both sides of the Y-shaped gripper 201, jet holes 203 are evenly opened on the top of the high-pressure air cavity 202, a deflection blocking column 204 is arranged inside the jet hole 203, and a guide side plate 205 is installed on one side of the top of the deflection blocking column 204. By using the Bernoulli principle, a high-pressure body jet is ejected from the jet hole 203 through the high-pressure air cavity 202, and the jet gas is laterally ejected around the surface of the Y-shaped gripper 201 through the deflection blocking column 204, so that the surface of the Y-shaped gripper 201 and the surrounding air are The cyclone is generated to form negative pressure, and the wafer and the surface of the Y-shaped gripper 201 will form a suspended distance of the air surface, so that the wafer can be sucked without contact, which solves the problem that the traditional manual handling and ordinary negative pressure vacuum suction handling methods may cause the wafer to be distorted, deformed or broken. In addition, the deflection and guidance of the jet gas by the guide side plate 205 solves the problem that the jet gas of adjacent jet holes 203 interferes with each other, resulting in uneven suction on the surface of the Y-shaped gripper 201. The device is safe and stable to use and firmly adsorbs the wafer. The content of Bernoulli is: Bernoulli's equation is the dynamic equation of the steady flow of ideal fluid, which means that in the flow of fluid ignoring viscosity loss, the sum of the pressure potential energy, kinetic energy and potential energy of any two points on the streamline remains unchanged. This theory was proposed by Bernoulli in 1738 and was called Bernoulli's principle at that time. Later generations called the integral of the Euler equation along the streamline in the steady flow in the gravitational field the Bernoulli integral, and the energy equation of the steady adiabatic flow of inviscid fluid in the gravitational field the Bernoulli theorem. These are collectively known as the Bernoulli equations, one of the fundamental equations of fluid dynamics;

[0037] A transfer mechanism 3 is arranged between the Y-shaped gripper 201 and the transfer bracket 1, and the transfer mechanism 3 includes a Z-axis bracket 302, the Z-axis bracket 302 is embedded in one side of the transfer bracket 1, an X-axis bracket 301 is movably arranged on one side of the Z-axis bracket 302, a fixed frame 303 is installed at the bottom end of the X-axis bracket 301, the fixed frame 303 and the X-axis bracket 301 are connected and fixed by a connecting bracket 304, a transmission chain 305 is clamped on one side of the outer wall of the transfer bracket 1 and the top of the X-axis bracket 301, one side of the Y-shaped gripper 201 and the bottom end of the connecting bracket 304 are fixedly connected to the fixed frame 303 by an electrical slip ring 5, and one side of the end of the electrical slip ring 5 is A rotating shaft seat 6 is installed, and the Y-shaped gripper 201 is integrally connected and fixed via a fixed frame 303 and a connecting bracket 304. Driven by a transmission chain 305, the Y-shaped gripper 201 can be moved in a horizontal direction by the sliding of the connecting bracket 304 at the X-axis bracket 301, and can be moved in a vertical direction by the sliding of the X-axis bracket 301 at the Z-axis bracket 302. With the rotation of the fixed frame 303 by the electrical slip ring 5 and the rotating shaft seat 6, the Y-shaped gripper 201 can continuously rotate 360 ​​degrees while transmitting electricity and fluid pressure, thereby ensuring the accuracy and efficiency of the Y-shaped gripper 201 in transferring wafers.

[0038] See also Figure 6 The top of the guide side plate 205 is rotatably connected to the end of the deflection baffle column 204 through a rotating clamp ring 206. The direction of the jet through the guide side plate 205 inside a single jet hole 203 can be set through the rotating clamp ring 206 to avoid interference between the jet gases of adjacent jet holes 203. A fixing screw ring is threadedly connected to the top of the rotating clamp ring 206, and the adjusted guide side plate 205 can be fixed at the deflection baffle column 204 through the fixing screw ring.

[0039] See also Figure 4 A high-pressure air pump 8 is embedded on one side of the end of the high-pressure air cavity 202 corresponding to the top of the Y-shaped gripper 201, and the high-pressure air pump 8 can spray high-pressure gas into the high-pressure air cavity 202. In order to improve the strength of the Y-shaped gripper 201 itself and avoid magnetism when the Y-shaped gripper 201 is used, the Y-shaped gripper 201 is made of ceramic material.

[0040] See also Figure 2 and Figure 3 A fiber optic detection bracket 4 is clamped on the other side of the outer wall of the fixed frame 303. The fiber optic detection bracket 4 can be used to detect whether there are cracks on the surface of the wafer before transfer. The detection method and working principle of the fiber optic detection bracket 4 are existing technologies, and the technology is mature, so they will not be elaborated here.

[0041] See also Fig. 9 and Fig.10The bottom of the fixed frame 303 is provided with a protection mechanism 9 corresponding to the bottom of the Y-shaped gripper 201. The protection mechanism 9 includes a protection bottom bucket 901. The protection bottom bucket 901 is installed at the bottom of the fixed frame 303 corresponding to the bottom position of the Y-shaped gripper 201. A support shaft 902 is rotatably installed at the top of the protection bottom bucket 901. A movable plate 903 is installed outside the support shaft 902. Collection side cavities 904 are opened on both sides of the bottom of the protection bottom bucket 901. A pressure sensor 905 is embedded on one side of the inner wall of the collection side cavity 904. When the Y-shaped gripper 20 When a wafer transfer failure occurs or unqualified wafers are detected by the optical fiber detection bracket 4, the movable plate 903 at the protective bottom bucket 901 can be used to protect and collect the wafers, and the movable plate 903 can be flipped by the support shaft 902 to collect the dropped qualified wafers and the detected unqualified wafers into the two collection side cavities 904 respectively, and the number of unqualified wafers can be counted under the pressure count of the pressure sensor 905 contacting and pressurizing one side of the movable plate 903, thereby realizing the wafer protection function and the counting and collection function of unqualified wafers.

[0042] See also Fig.10 A driving motor 7 is provided on one side of the support shaft 902, and the driving motor 7 can deflect the support shaft 902 to both sides according to the use requirements. In order to ensure the softness of the top of the protective bottom bucket 901 and the movable plate 903, the surfaces of the protective bottom bucket 901 and the movable plate 903 are covered with sponge cushions.

[0043] See also Fig.10 In order to ensure the smoothness of the flipping of the movable plate 903, the two ends of the support shaft 902 are connected to the inner wall of the protective bottom bucket 901 through bearings, and the movable plate 903 is fixedly sleeved on the support shaft 902.

[0044] Working principle: First, the present invention utilizes the Bernoulli principle. Under the action of the high-pressure air pump 8, the high-pressure body jet is ejected from the jet hole 203 through the high-pressure air cavity 202, and the jet gas is laterally ejected around the surface of the Y-shaped gripper 201 through the deflection baffle column 204, and the jet gas is deflected and guided by the guide side plate 205, so that a cyclone is generated between the surface of the Y-shaped gripper 201 and the surrounding air to form a negative pressure. A suspended distance between the wafer and the surface of the Y-shaped gripper 201 will be formed, and the wafer can be sucked without contact. Then, when the wafer is transferred, the Y-shaped gripper 201 is integrally connected and fixed through the fixed frame 303 and the connecting bracket 304. Under the driving action of the transmission chain 305, the Y-shaped gripper 201 can be moved by the sliding of the connecting bracket 304 at the X-axis bracket 301. Moving in the horizontal direction, the sliding of the X-axis bracket 301 at the Z-axis bracket 302 can move the Y-shaped gripper 201 in the vertical direction, and the rotation of the fixed frame 303 by the electrical slip ring 5 and the rotating shaft seat 6 can make the Y-shaped gripper 201 rotate continuously at 360 degrees while transmitting electricity and fluid pressure. Finally, when the Y-shaped gripper 201 fails to transfer the wafer or the optical fiber detection bracket 4 detects unqualified wafers, the wafers can be collected by the movable plate 903, and the movable plate 903 can be flipped by the support shaft 902 to collect the fallen qualified wafers and the detected unqualified wafers into the two collection side cavities 904 respectively, and the number of unqualified wafers can be counted by counting the pressure sensor 905 in contact with one side of the movable plate 903.

[0045] The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A contactless wafer transfer device, comprising a transfer support (1), characterized in that: A suction mechanism (2) is installed on one side of the transfer bracket (1), and the suction mechanism (2) is used for contactless suction and fixation of the wafer. The suction mechanism (2) comprises a Y-shaped gripper (201), and the Y-shaped gripper (201) is installed on one side of the transfer bracket (1). High-pressure air cavities (202) are provided on both sides of the interior of the Y-shaped gripper (201), and jet holes (203) are evenly provided on the top of the high-pressure air cavity (202). A deflection blocking column (204) is provided inside the jet hole (203), and a guide side plate (205) is installed on one side of the top of the deflection blocking column (204); A transfer mechanism (3) is provided between the Y-shaped gripper (201) and the transfer bracket (1), and the transfer mechanism (3) is used to drive the Y-shaped gripper (201) to move. The transfer mechanism (3) comprises a Z-axis bracket (302), and the Z-axis bracket (302) is embedded in one side of the transfer bracket (1). An X-axis bracket (301) is movably provided on one side of the Z-axis bracket (302). A fixed frame (303) is installed at the bottom end of the X-axis bracket (301), and the fixed frame (303) and the X-axis bracket (301) are connected and fixed by a connecting bracket (304); the top of the guide side plate (205) and the end of the deflection blocking column (204) are rotatably connected by a rotating clamp ring (206), and the top of the rotating clamp ring (206) is threadedly connected with a fixing screw ring.

2. The contactless wafer transfer device according to claim 1, characterized in that: A high-pressure air pump (8) is embedded in one side of the top end of the Y-shaped gripper (201) corresponding to the end of the high-pressure air cavity (202), and the Y-shaped gripper (201) is made of ceramic material.

3. The contactless wafer transfer device according to claim 1, characterized in that: One side of the Y-shaped gripper (201) and the bottom end of the connecting bracket (304) are fixedly connected to the fixed frame (303) via an electrical slip ring (5), and a rotating shaft seat (6) is installed on one side of the end of the electrical slip ring (5).

4. The contactless wafer transfer device according to claim 1, characterized in that: A transmission chain (305) is clamped between one side of the outer wall of the transfer bracket (1) and the top of the X-axis bracket (301).

5. The contactless wafer transfer device according to claim 1, characterized in that: An optical fiber detection bracket (4) is clamped on the other side of the outer wall of the fixed frame (303).

6. A contactless wafer transfer device according to claim 1, characterized in that: A protective mechanism (9) is provided at the bottom of the fixed frame (303) corresponding to the bottom of the Y-shaped gripper (201), and the protective mechanism (9) includes a protective bottom bucket (901), and the protective bottom bucket (901) is installed at the bottom of the fixed frame (303) at a position corresponding to the bottom of the Y-shaped gripper (201), and a support shaft (902) is rotatably installed at the top of the protective bottom bucket (901), and a movable plate (903) is installed outside the support shaft (902), and collection side cavities (904) are opened on both sides of the bottom end of the protective bottom bucket (901), and a pressure sensor (905) is embedded on one side of the inner wall of the collection side cavity (904).

7. The contactless wafer transfer device according to claim 6, characterized in that: A driving motor (7) is disposed on one side of the support shaft (902), and the surfaces of the protective bottom bucket (901) and the movable plate (903) are both covered with sponge cushions.

8. The contactless wafer transfer device according to claim 6, characterized in that: Both ends of the support shaft (902) are connected to the inner wall of the protective bottom bucket (901) via bearings, and the movable plate (903) is fixedly sleeved on the support shaft (902).

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