Display substrate, manufacturing method thereof, and display device

Abstract

The present disclosure provides a display substrate, a manufacturing method thereof, and a display device. The display substrate includes a base substrate and a source / drain metal layer, a planar layer, and an electrode layer sequentially arranged from a side close to the base substrate to a side away from the base substrate. The source / drain metal layer includes at least a first source / drain metal pattern covered by the planar layer and a second source / drain metal pattern not covered by the planar layer. The electrode layer includes an electrode pattern and a shielding pattern, the electrode pattern being located above the planar layer; the shielding pattern directly covering at least a portion of the second source / drain metal pattern and being arranged along the pattern edge of the second source / drain metal pattern. The display substrate, the manufacturing method thereof, and the display device of the embodiments of the present disclosure can solve the technical problem of side defects in the source / drain metal pattern resulting in poor performance when the electrode layer is etched.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate and a manufacturing method thereof, and a display device. Background Art

[0002] In related technologies, the array substrate of a display panel includes a substrate, and a source / drain metal layer and an electrode layer located on the substrate. The source / drain metal layer includes a source electrode, a drain electrode, a data line, and various source / drain metal patterns located in the binding area (such as terminals and traces of the binding circuit, and packaging base patterns, etc.). The electrode layer is located on the side of the source / drain metal layer away from the substrate.

[0003] When manufacturing an array substrate, first, a source-drain metal layer is formed on a substrate. The source-drain metal layer is made by patterning a metal layer, and the metal layer usually adopts a stacked structure of titanium (Ti)-aluminum (Al)-titanium; then, an insulating layer is covered behind the source-drain metal layer. After the insulating layer is patterned, it only covers the source-drain metal layer in the display area, while the source-drain metal pattern in the binding area is not covered with the insulating layer; then, an electrode layer is made. At this time, there is an insulating layer between the source-drain metal layer and the electrode layer in the display area, and for the binding area, the electrode layer will directly cover the source-drain metal pattern. Since the patterning process of the electrode layer includes an exposure and etching process, and the etching rate of aluminum metal is faster than that of titanium metal, this will cause the patterned source-drain metal pattern to be prone to severe lateral etching problems, which in turn causes bad bright spots. Summary of the Invention

[0004] The embodiments of the present disclosure provide a display substrate and a manufacturing method thereof, and a display device, which can solve the technical problem that side defects of source and drain metal patterns occur during etching of the electrode layer, resulting in defects.

[0005] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0006] An embodiment of the present disclosure provides a display substrate, comprising a base substrate and a source-drain metal layer, a planar layer, and an electrode layer arranged in sequence from a side close to the base substrate to a side away from the base substrate, wherein the source-drain metal layer comprises at least a first source-drain metal pattern covered by the planar layer and a second source-drain metal pattern not covered by the planar layer, wherein the electrode layer comprises an electrode pattern and a shielding pattern, and the electrode pattern is located on the planar layer; the shielding pattern directly covers at least a portion of the second source-drain metal pattern and is arranged along the pattern edge of the second source-drain metal pattern.

[0007] Exemplarily, the second source-drain metal pattern includes a first metal layer, a second metal layer, and a third metal layer, which are arranged in sequence from a side close to the substrate to a side away from the substrate. The etching rate of the second metal layer when etched under a preset etching solution is greater than the etching rate of the third metal layer. The second metal layer includes a side that is not covered by the third metal layer, and the shielding pattern at least covers the side of the second metal layer.

[0008] Exemplarily, the shielding pattern conformally covers the second source / drain metal pattern, and the shielding pattern includes:

[0009] a first shielding area covering the surface of the third metal layer on a side away from the base substrate;

[0010] a second shielding area covering a side surface of the second metal layer;

[0011] and a third shielding area covering a side surface of the first metal layer, wherein the third shielding area is formed by extending from a side of the side shielding area away from the first shielding area and along a direction parallel to the base substrate.

[0012] Exemplarily, the orthographic projection of the first shielding area on the base substrate completely covers a surface of the third metal layer on a side away from the base substrate.

[0013] Exemplarily, the first blocking area has a hollow pattern to expose at least a portion of the surface of the third metal layer away from the base substrate, and the shape of the hollow pattern is along the edge shape of the second source / drain metal pattern.

[0014] Exemplarily, the display substrate includes a display area and a peripheral area located outside the display area, and the second source / drain metal pattern is located in the peripheral area.

[0015] Exemplarily, the peripheral region includes a binding region and a package substrate region, and the second source / drain metal pattern includes:

[0016] A binding circuit located in the binding area, the binding circuit including terminals and binding traces;

[0017] and / or, a packaging substrate pattern located in the packaging substrate area.

[0018] The embodiments of the present disclosure further provide a display device, comprising the display substrate provided by the embodiments of the present disclosure.

[0019] The present disclosure also provides a method for manufacturing a display substrate, which is used to manufacture the display substrate of the present disclosure. The method includes:

[0020] providing a substrate;

[0021] A source-drain metal layer, a planarizing layer, and an electrode layer are sequentially formed on the base substrate, wherein the source-drain metal layer includes at least a first source-drain metal pattern covered by the planarizing layer and a second source-drain metal pattern not covered by the planarizing layer, wherein the electrode layer includes an electrode pattern and a shielding pattern, and the electrode pattern is located on the planarizing layer; the shielding pattern directly covers at least a portion of the second source-drain metal pattern and is arranged along a pattern edge of the second source-drain metal pattern.

[0022] Exemplarily, in the method, forming a source / drain metal layer, a planarization layer, and an electrode layer on the substrate in sequence specifically includes:

[0023] forming a source-drain metal layer on the base substrate, and patterning the source-drain metal layer to form the first source-drain metal pattern and the second source-drain metal pattern;

[0024] forming a planarization layer on the source / drain metal layer, wherein the planarization layer is located above the first source / drain metal pattern but does not cover the second source / drain metal pattern;

[0025] An electrode layer is formed on the planar layer, and the electrode layer is patterned to form the electrode pattern and the shielding pattern.

[0026] The beneficial effects brought about by the embodiments of the present disclosure are as follows:

[0027] The display substrate, manufacturing method thereof, and display device provided by the embodiments of the present disclosure are characterized in that a shielding pattern formed by an electrode layer is provided on the portion of the source / drain metal layer not covered by the flat layer, that is, above the second source / drain metal pattern. The shielding pattern is provided along the edge of the second source / drain metal pattern. In this way, in the patterning process of the electrode layer, after forming the entire electrode layer, the electrode layer can be patterned by performing an etching process on the electrode layer, and the photoresist above the electrode layer can be patterned so that the electrode layer above the edge of the second source / drain metal pattern is covered and protected by the photoresist to protect the edge of the second source / drain metal pattern from being etched, that is, the side of the second source / drain metal pattern from being etched, thereby solving the problem of defects caused by depressions on the side of the source / drain metal pattern in the related art. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram showing the structure of the optical adhesive above the second source / drain metal pattern when the electrode layer of the display substrate provided in some embodiments of the present disclosure is patterned;

[0029] Figure 2 A schematic diagram showing the structure of a shielding pattern above the second source / drain pattern of a display substrate provided in some embodiments of the present disclosure;

[0030] Figure 3 A schematic diagram showing the structure of the optical adhesive above the second source / drain metal pattern when the electrode layer of the display substrate provided in other embodiments of the present disclosure is patterned;

[0031] Figure 4 A schematic diagram showing the structure of a shielding pattern above the second source / drain pattern of a display substrate provided in some other embodiments of the present disclosure;

[0032] Figure 5 A schematic diagram showing the dimensions and structure of two adjacent terminals in a binding area of a display substrate in the related art;

[0033] Figure 6 express Figure 2 A schematic diagram showing the dimensions and structure of two adjacent terminals in the binding area of the display substrate in the illustrated embodiment;

[0034] Figure 7 express Figure 4 A schematic diagram showing the dimensions and structure of two adjacent terminals in the binding area of the display substrate in the illustrated embodiment;

[0035] Figure 8 A schematic diagram showing a local wiring structure of a binding area and a packaging base area of a display substrate in an embodiment of the present disclosure;

[0036] Figure 9 A schematic diagram showing a partial cross-sectional structure of a display substrate at a terminal in a binding area in an embodiment of the present disclosure;

[0037] Figure 10 A schematic diagram showing a partial cross-sectional structure of a display substrate in an embodiment of the present disclosure at a packaging substrate region. DETAILED DESCRIPTION

[0038] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0039] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0040] Before describing in detail the display substrate, manufacturing method thereof, and display device provided by the embodiments of the present disclosure, it is necessary to describe the related technologies as follows:

[0041] In the related art, the display substrate includes a source-drain metal layer, a planar layer and an electrode layer arranged in sequence from bottom to top, wherein the pattern of the source-drain metal layer mainly includes a first source-drain metal pattern located in the display area, such as the source and drain of the thin film transistor, and signal lines such as data lines, and a second source-drain metal pattern is also provided in the peripheral area, such as: terminals and binding traces of the binding circuits, packaging substrate patterns and peripheral signal traces, such as peripheral VSS traces.

[0042] The author of the present disclosure has found through research that the flat layer mainly serves to insulate the source-drain metal layer from the electrode layer and to provide a flat surface for the electrode layer. The electrode layer is generally only provided in the display area. Therefore, the flat layer is usually patterned to cover the display area. Therefore, the source-drain metal layer in the display area will be covered by the flat layer, while part of the source-drain metal pattern in the peripheral area will not be covered by the flat layer. Then, for this part of the source-drain metal pattern not covered by the flat layer, before the electrode layer is patterned in the electrode layer manufacturing process, the source-drain metal pattern is directly covered with the electrode layer. When the electrode layer is exposed and etched, since the source-drain metal pattern generally includes a stack of titanium and aluminum, the etching rates of titanium and aluminum are different, which will cause depressions to appear on the side of the source-drain metal pattern. For example, when the source-drain metal layer adopts a stack structure of titanium (Ti)-aluminum (Al)-titanium (Ti), defects such as various grooves may easily appear on the side of the aluminum layer in the source-drain metal pattern, causing the titanium layer above the aluminum layer to protrude, and may fall into the display area and cause adverse phenomena.

[0043] In order to solve the above problems, if a flat layer is also set on the second source and drain metal pattern in the peripheral area, the thickness of the flat layer is large and is not suitable for the thickness requirements of peripheral areas such as the binding area. If the thickness of the flat layer is to be reduced in the peripheral area, the patterning process is complicated, and the flat layer close to the edge will also cause problems such as water vapor.

[0044] Based on the above problems, the embodiments of the present disclosure provide a display substrate and a manufacturing method thereof, as well as a display device, which can solve the technical problem that side defects of the source and drain metal pattern occur during etching of the electrode layer, resulting in defects.

[0045] Figure 2 、 Figure 4 、 Figure 9 and Figure 10 Shown is a schematic diagram of a partial structure of a display substrate provided by an embodiment of the present disclosure.

[0046] like Figure 2 、 Figure 4 、 Figure 9 and Figure 10 As shown, an embodiment of the present disclosure provides a display substrate, comprising: a base substrate 100, and a source-drain metal layer, a planar layer, and an electrode layer arranged in sequence from a side close to the base substrate 100 to a side away from the base substrate 100, the source-drain metal layer comprising at least a first source-drain metal pattern (not shown in the figure) covered by the planar layer and a second source-drain metal pattern 400 not covered by the planar layer; wherein the electrode layer comprises an electrode pattern (not shown in the figure) and a shielding pattern 300, and the electrode pattern is located on the planar layer; the shielding pattern 300 directly covers at least a portion of the second source-drain metal pattern 400, and is arranged along the pattern edge of the second source-drain metal pattern 400. In the above scheme, a shielding pattern 300 formed by the electrode layer is arranged on the portion of the source-drain metal layer that is not covered by the flat layer, that is, above the second source-drain metal pattern 400. The shielding pattern 300 is arranged along the edge of the second source-drain metal pattern 400. In this way, in the patterning process of the electrode layer, after forming the entire electrode layer, the electrode layer can be patterned by performing an etching process on the electrode layer, while retaining the electrode layer above the edge of the second source-drain metal pattern 400 to form the shielding pattern 300. Specifically, the photoresist 600 above the electrode layer can be patterned so that the electrode layer photoresist 600 above the edge of the second source-drain metal pattern 400 is covered and protected to retain this part of the electrode layer to form the shielding pattern 300, thereby shielding the edge of the second source-drain metal pattern 400 from being etched. In this way, the side of the second source-drain metal pattern 400 is not etched, thereby solving the problem of depression on the side of the source-drain metal pattern in the related art and causing defects.

[0047] It should be noted here that the shielding pattern 300 is arranged along the pattern edge of the second source-drain metal pattern 400, which means that the shielding pattern 300 at least covers the side of the second source-drain metal pattern 400, and the shape of the shielding pattern 300 matches the shape of the second source-drain metal pattern 400, and will not have an adverse effect on the function of the second source-drain metal pattern 400. For example, when the second source-drain metal pattern 400 includes a terminal in the binding area, the shielding pattern covered thereon is arranged along the edge shape of the terminal. In this way, the pattern of the stacked structure composed of the second source-drain metal pattern 400 and the shielding pattern 300 still maintains the pattern of the terminal.

[0048] The technical solutions provided by the embodiments of the present disclosure are described in more detail below.

[0049] In the display substrate provided by the present disclosure, the second source-drain metal pattern 400 includes a first metal layer 410, a second metal layer 420 and a third metal layer 430, which are arranged in sequence from the side close to the base substrate 100 to the side away from the base substrate 100. The etching rate of the second metal layer 420 when etched under a preset etching solution is greater than the etching rate of the third metal layer 430. The second metal layer 420 includes a side surface not covered by the third metal layer 430, and the shielding pattern 300 at least covers the side surface of the second metal layer 420.

[0050] Using the above solution, the second source-drain metal pattern 400 can be a three-layer metal stacked structure, wherein the second metal layer 420 located in the middle layer will have an etching rate greater than the etching rate of the third metal layer 430 located above it when the electrode layer is etched. In some embodiments, the stacked structure of the second source-drain metal pattern 400 can be a titanium (Ti)-aluminum (Al)-titanium (Ti) stacked structure, that is, the first metal layer 410 is a titanium (Ti) layer, the second metal layer 420 is an aluminum (Al) layer, and the third metal layer 430 is a titanium (Ti) layer. It should be noted that the above is only an example of the stacked structure of the second source-drain metal pattern 400. In actual applications, the stacked structure of the second source-drain metal pattern 400 is not limited to this.

[0051] In some exemplary embodiments of the present disclosure, the blocking pattern 300 is conformally covered on the second source-drain metal pattern 400, and the blocking pattern 300 includes: a first blocking area 310 covering the surface of the third metal layer 430 on a side away from the base substrate 100; a second blocking area 320 covering the side of the second metal layer 420; and a third blocking area 330 covering the side of the first metal layer 410, and the third blocking area 330 is formed by extending from the side of the side blocking area away from the first blocking area 310 and in a direction parallel to the base substrate 100.

[0052] In the above scheme, the blocking pattern 300 is conformally covered on the second source-drain metal pattern 400, and at least a portion of it is covered on the upper surface of the third metal layer 430 (that is, the surface of the third metal layer 430 located away from the base substrate 100), that is, the first blocking area 310; at least a portion is covered on the side of the second metal layer 420, that is, the second blocking area 320; at least a portion is covered on the side of the third metal layer 430 and extends outward for a distance, that is, the third blocking area 330.

[0053] Figure 3 and Figure 4 and Figure 7 FIG. 3 is a schematic diagram of a shielding pattern 300 in some embodiments of the present disclosure. Figure 3 and Figure 4 and Figure 7 As shown, in some embodiments, the orthographic projection of the first shielding area 310 on the base substrate 100 completely covers the side surface of the third metal layer 430 away from the base substrate 100 .

[0054] In this embodiment, in the electrode layer patterning process, the photoresist 600 includes a retained area and a removed area. By designing the patterns of the retained area and the removed area of the photoresist 600, taking the photoresist 600 as a positive photoresist as an example, the orthographic projection of the retained area of the photoresist 600 on the base substrate 100 completely covers the orthographic projection of the second source-drain metal pattern 400 on the base substrate 100, so that the electrode layer finally forms the shielding pattern 300.

[0055] Figure 1 、 Figure 2 and Figure 6 FIG. 3 is a schematic diagram of a shielding pattern 300 in some other embodiments of the present disclosure. Figure 1 、 Figure 2 and Figure 6As shown, in other embodiments, a hollow pattern 311 is provided on the first shielding area 310 to expose at least a portion of the surface of the third metal layer 430 away from the base substrate 100, and the pattern shape of the hollow pattern 311 is along the pattern edge shape of the second source / drain metal pattern 400.

[0056] In the above scheme, the first shielding area 310 has a hollow pattern 311, and the pattern shape of the hollow pattern 311 is along the pattern edge shape of the second source / drain metal pattern 400. That is, the first shielding area 310 divides the shielding pattern 300 and only designs the edge stroke of the second source / drain metal pattern 400 to be shielded.

[0057] In addition, in some embodiments, the display substrate includes a display area AA and a peripheral area located outside the display area AA, the first source-drain metal pattern is located in the display area AA (not shown in the figure), and the second source-drain metal pattern 400 is located in the peripheral area.

[0058] For display substrates, Figure 8 As shown, the peripheral area mainly includes a binding area C and a package substrate area B (Frit sub) located between the binding area C and the display area AA (not shown in the figure). The binding area C is arranged with binding lines, and the binding lines include terminals 1 and binding traces 4, etc. The peripheral area can also include some peripheral traces 2, such as Vss, Vdd traces, etc.

[0059] like Figure 8 As shown, the binding circuit includes multiple terminals 1 and binding traces 4 connected to the terminals. The terminals 1 can be arranged in at least one row in sequence, at least one terminal 1 is connected to at least one binding trace 4, and a Vss trace or a Vdd trace is arranged at the end of the binding area, wherein the VSS trace can be arranged around the display area.

[0060] The packaging base area B is used to set the packaging base pattern. The packaging base pattern 3 may include a base part 31 and multiple openings 32 on the base part 31. The packaging base pattern is used to provide a base for packaging when the display substrate is packaged, and the openings on the packaging base pattern facilitate the connection of the upper packaging material of the packaging base pattern and the lower material of the packaging base pattern to improve the packaging effect.

[0061] In some embodiments, the Vss trace may be led out from one end of the binding area, circle around the periphery of the display area AA, and extend to connect to the other end of the binding area.

[0062] In some embodiments, peripheral signal lines such as Vss and Vdd can be made of the same layer and material as the package base pattern 3 and be integrated into one, for example, they are all made of source and drain metal layer materials. That is to say, the package base pattern can also be reused as peripheral signal lines such as Vss and Vdd.

[0063] In the display substrate provided by the embodiment of the present disclosure, the second source-drain metal pattern 400 may include the above-mentioned binding circuits, such as the terminal 1 and the binding trace 4 , and may also include the peripheral trace 2 and the package substrate pattern 3 .

[0064] It should be understood that, for the display substrate, the peripheral signal lines or other source-drain patterns formed by patterning the source-drain metal layer arranged in its peripheral area are all the second source-drain metal patterns 400, that is, the peripheral signal lines or other source-drain patterns formed by patterning the source-drain metal layer arranged in the peripheral area of the display substrate can be provided with a shielding pattern formed by the electrode layer above.

[0065] In addition, the display substrate further includes a gate layer 500, and the pattern of the gate layer 500 includes gates and gate lines. The orthographic projection of the bonding circuit on the base substrate 100 may at least partially overlap with the orthographic projection of the gate layer on the base substrate 100; the orthographic projection of the package base pattern on the base substrate 100 may at least partially overlap with the orthographic projection of the gate layer on the base substrate 100, or at least partially not overlap.

[0066] Taking the second source-drain metal pattern 400 as an example, the terminal in the binding circuit of the display substrate is Figure 9 The figure shows the cross-sectional structure diagram of the connection between the terminal and the gate through the via hole. Figure 2 、 Figure 4 and Figures 6 and 7 Shown is a schematic diagram of the cross-sectional structure where the terminal is not connected to the gate through a via.

[0067] like Figure 9 As shown, the binding area C of the base substrate 100 includes a gate layer 500, a gate insulation layer 700, a source-drain metal layer and an electrode layer arranged in sequence from bottom to top, wherein the pattern of the source-drain metal layer is the second source-drain metal pattern 400, the gate layer 500 is overlapped by a via, and the edge of the second source-drain metal pattern 400 is covered with a blocking pattern 300.

[0068] like Figure 10 As shown, the packaging base area B of the substrate 100 includes a gate insulation layer 700, a source-drain metal layer and an electrode layer arranged in sequence from bottom to top, wherein the pattern of the source-drain metal layer is the second source-drain metal pattern 400, and the edge of the second source-drain metal pattern 400 is covered with a blocking pattern 300.

[0069] The second source / drain metal pattern 400 covers the shielding pattern 300 and does not affect its original function. Considering factors such as the line width of terminals and traces, the size of the second source / drain metal pattern 400 after the shielding pattern 300 is provided is described as follows:

[0070] Take the terminal 1 in the second source-drain metal pattern in the related art as an example. Figure 5 As shown, in the related art, the length of the terminal 1 of the binding line is f1, the width is c1, and the interval is e1. For example, the length f1 = 600 μm, the width c1 = 12 μm, and the interval e1 = 10 μm.

[0071] exist Figure 6 In the illustrated embodiment, the gap e2 between the shielding patterns on two adjacent terminals is equal to e1. The distance d between the edges of the shielding pattern 300 on the same terminal is equal to c1. The first light-shielding area of the shielding pattern 300 on the same terminal is divided into two sub-areas by the hollow pattern. The widths of the two sub-areas are the same, b. The sum of the widths of the two sub-areas and the hollow pattern is c. The width of the third sub-area is a, so d = 2a + c. The length f of the shielding pattern 300 is equal to f1. Taking the length f1 = 600 μm, the width c1 = 12 μm, and the spacing e1 = 10 μm as an example, the values d = 12 μm, c = 9 μm, a = 1.5 μm, b = 1.5 μm, and f = 600 μm are obtained. The values of a, b, c, and d can be adjusted based on the performance and accuracy of different exposure machines and are not limited to these values.

[0072] exist Figure 7 In the illustrated embodiment, the gap e3 between the shielding patterns on two adjacent terminals is equal to e1. The distance d' between the edges of the shielding pattern 300 on the same terminal is equal to c1. The width of the first light-shielding area of the shielding pattern 300 on the same terminal is c', and the width of the third sub-area is a'. Thus, d'=2a'+c'. The length f2 of the shielding pattern 300 is equal to f1. Taking the length f1=600μm, the width c1=12μm, and the gap e1=10μm as an example, d'=12μm, c'=9μm, and a'=1.5μm. The values of a', b', c', and d' can be adjusted based on the performance and accuracy of different exposure machines and are not limited to this.

[0073] It should be noted that for the second source-drain metal pattern 400 in the peripheral area of the display substrate, such as terminals, binding lines, VDD lines, VSS lines, and other signal lines, these signal lines also have the function of signal transmission. The embodiment of the present disclosure provides a shielding pattern 300 disposed above the second source-drain metal pattern 400 in the display substrate. Compared with the solution in the related art that only uses the second source-drain metal pattern and only uses the source-drain metal layer, since the pattern size ultimately formed by the second source-drain metal pattern and the shielding pattern above it corresponds to (is approximately the same as) the original pattern size obtained by using only the source-drain metal layer, there will be little change in the signal and no impact on normal signal transmission.

[0074] It should also be noted that the above description is only based on the terminal pattern in the second source and drain pattern as an example. For the routing and packaging substrate patterns, the final size of the shielding pattern 300 and the second source and drain metal pattern 400 should be reasonably designed based on the performance accuracy of the exposure machine and the wiring requirements.

[0075] In addition, the present disclosure also provides a display device including the display substrate provided in the present disclosure. The display device may include various display devices such as mobile phones, tablet computers, and monitors.

[0076] In addition, the present disclosure also provides a method for manufacturing a display substrate, which is used to manufacture the display substrate of the present disclosure. The method includes:

[0077] Step S01, providing a base substrate 100;

[0078] Step S02: forming a source-drain metal layer, a planarizing layer, and an electrode layer in sequence on the base substrate 100, wherein the source-drain metal layer includes at least a first source-drain metal pattern covered by the planarizing layer and a second source-drain metal pattern 400 not covered by the planarizing layer, wherein the electrode layer includes an electrode pattern and a shielding pattern 300, and the electrode pattern is located on the planarizing layer; the shielding pattern 300 directly covers at least a portion of the second source-drain metal pattern 400 and is arranged along the pattern edge of the second source-drain metal pattern 400.

[0079] Exemplarily, in the method, step S02 specifically includes:

[0080] Step S021: forming a source-drain metal layer on the base substrate 100, and patterning the source-drain metal layer to form the first source-drain metal pattern and the second source-drain metal pattern 400;

[0081] The source-drain metal layer may include a stacked structure of a first metal layer 410, a second metal layer 420, and a third metal layer 430 sequentially arranged from bottom to top, for example, a stacked structure of titanium (Ti)-aluminum (Al)-titanium (Ti). After depositing each layer in sequence, steps such as exposure, development, and etching are performed to pattern the source-drain metal layer to form a first source-drain metal pattern and a second source-drain metal pattern 400.

[0082] Step S022: forming a planar layer on the source / drain metal layer, wherein the planar layer is located on the first source / drain metal pattern but does not cover the second source / drain metal pattern 400;

[0083] The flat layer can play the role of insulation and flatness, and can be an inorganic insulating layer or an organic insulating layer;

[0084] Step S023: Figure 1 and Figure 3 As shown, an electrode layer is formed on the flat layer, and the electrode layer is patterned to form the electrode pattern and the shielding pattern 300;

[0085] The electrode layer can be an anode layer, such as an ITO layer (indium tin oxide layer) or a metal layer. The electrode layer is first deposited on the entire base substrate 100, and then the electrode layer patterning process is performed using processes such as exposure, development, and etching. During exposure and development, the photoresist 600 includes a retained area and a removed area. Taking the photoresist 600 as a positive photoresist as an example, the pattern of the retained area at least covers the edge alignment position of the second source and drain metal pattern 400 to retain the electrode layer above the second source and drain metal pattern 400, and form a shielding pattern 300 to protect the side of the second source and drain metal pattern 400 from being etched.

[0086] In addition, it should be noted that the display substrate provided by the embodiment of the present disclosure may further include steps for manufacturing film layers such as a gate, a gate insulating layer, and an active layer, which will not be described in detail.

[0087] There are a few points to note:

[0088] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure. Other structures may refer to conventional designs.

[0089] (2) For the sake of clarity, the thickness of layers or regions in the drawings used to describe the embodiments of the present disclosure are exaggerated or reduced, i.e., these drawings are not drawn to scale. It is understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or intervening elements may be present.

[0090] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to form new embodiments.

[0091] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. The protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display substrate, characterized in that: The display substrate includes a base substrate and a source / drain metal layer, a planar layer, and an electrode layer sequentially arranged from a side close to the base substrate to a side away from the base substrate. The display substrate includes a display area and a peripheral area located outside the display area. The planar layer covers the display area but does not cover the peripheral area. The peripheral area includes a packaging base area and a binding area. The source-drain metal layer includes at least a first source-drain metal pattern located in the display area and covered by the planar layer, and a second source-drain metal pattern located in the peripheral area not covered by the planar layer, wherein the electrode layer includes an electrode pattern and a shielding pattern, and the electrode pattern is located on the planar layer; the shielding pattern directly covers at least a portion of the second source-drain metal pattern and is arranged along a pattern edge of the second source-drain metal pattern, and the second source-drain metal pattern includes: a binding circuit located in the binding area, the binding circuit including a terminal and a binding trace; and a package substrate pattern located in the package substrate area, the package substrate pattern including a base portion and a plurality of openings located on the base portion; The second source-drain metal pattern includes a first metal layer, a second metal layer, and a third metal layer arranged in sequence from a side close to the substrate to a side away from the substrate, and the shielding pattern is conformally covered on the second source-drain metal pattern, and the shielding pattern includes: a first shielding area covering the surface of the third metal layer on a side away from the substrate; a second shielding area covering the side of the second metal layer; and a third shielding area covering the side of the first metal layer, wherein the third shielding area is formed by extending from a side of the side shielding area away from the first shielding area and in a direction parallel to the substrate; wherein The gap e between the shielding patterns on two adjacent terminals is 10 μm, the distance d between the edges of the shielding pattern on the same terminal is 12 μm, the width c of the first shielding area is 9 μm, and the width a of the third shielding area is 1.5 μm.

2. The display substrate according to claim 1, wherein: The etching rate of the second metal layer when etched under a preset etching solution is greater than the etching rate of the third metal layer. The second metal layer includes a side surface not covered by the third metal layer, and the shielding pattern at least covers the side surface of the second metal layer.

3. The display substrate according to claim 1, wherein The orthographic projection of the first shielding area on the base substrate completely covers a surface of the third metal layer on a side away from the base substrate.

4. The display substrate according to claim 1, wherein The first shielding area has a hollow pattern to expose at least a portion of the surface of the third metal layer away from the base substrate, and the shape of the hollow pattern follows the edge shape of the second source / drain metal pattern.

5. A display device, characterized in that: The display substrate comprises the display substrate according to any one of claims 1 to 4.

6. A method for manufacturing a display substrate, characterized in that: For manufacturing the display substrate according to any one of claims 1 to 4, the method comprises: providing a substrate; A source-drain metal layer, a planarizing layer, and an electrode layer are sequentially formed on the base substrate, wherein the source-drain metal layer includes at least a first source-drain metal pattern covered by the planarizing layer and a second source-drain metal pattern not covered by the planarizing layer, wherein the electrode layer includes an electrode pattern and a shielding pattern, and the electrode pattern is located on the planarizing layer; the shielding pattern directly covers at least a portion of the second source-drain metal pattern and is arranged along a pattern edge of the second source-drain metal pattern.

7. The method according to claim 6, characterized in that In the method, a source / drain metal layer, a planarization layer, and an electrode layer are sequentially formed on the substrate, specifically comprising: forming a source-drain metal layer on the base substrate, and patterning the source-drain metal layer to form the first source-drain metal pattern and the second source-drain metal pattern; forming a planarization layer on the source / drain metal layer, wherein the planarization layer is located above the first source / drain metal pattern but does not cover the second source / drain metal pattern; An electrode layer is formed on the planar layer, and the electrode layer is patterned to form the electrode pattern and the shielding pattern.

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