An automatic device for measuring the thrust of headphone solder bridge

Abstract

The present invention discloses an automatic headphone solder bridge thrust test device, which includes: a frame, a product jig, an ejector jig and a driving mechanism; the frame is provided with the product jig, the product jig has a plurality of product placement cavities, and the plurality of product placement cavities are evenly distributed on the product jig; the ejector jig is arranged opposite to the product jig, and the ejector jig is arranged above the product jig; the ejector jig has a fixed cover plate, a plurality of ejectors and a plurality of elastic elements; the fixed cover plate has a plurality of ejector placement cavities, the plurality of ejectors are respectively arranged in the plurality of ejector placement cavities, and the plurality of elastic elements are respectively sleeved on the upper parts of the plurality of ejectors; the driving mechanism is arranged above the frame, and the driving mechanism is connected to the ejector jig. The present invention can effectively solve the technical problem of low detection efficiency existing in the current headphone solder bridge thrust test device.

Description

Technical Field

[0001] The invention relates to the technical field of automatic detection equipment for welding bridge thrust, and in particular to an automatic detection equipment for welding bridge thrust of earphones. Background Art

[0002] Headphones are common electronic products in people's lives, and their current market size is very large. In the production and assembly process of headphone parts, welding is the most commonly used production process. Since current headphones are small in size and have many small and fine parts, the existing headphone solder bridges are all made by automatic welding equipment that automatically loads and automatically welds. Since automatic welding equipment cannot automatically identify the welding quality of the welded products, in large-scale welding process production, it is often encountered that the headphone solder bridge has welding process defects, which in turn causes the welding part of the headphone to be loosely connected and causes the parts to fall off.

[0003] Based on this, Chinese patent CN210775021U discloses a thrust pen for detecting welding force of flexible circuit board parts, which includes a shell, a thrust pin partially arranged in the shell, a slider connected to the thrust pin and partially arranged in the shell, an elastic member respectively connected to the slider and the shell and arranged in the shell, and an adjusting member connected to the shell and connected to the thrust pin for adjusting the thrust size. The shell includes a columnar body, an upper cover flange arranged at one end of the body, and a lower cover flange arranged at the other end of the body. A through hole is provided on the lower cover flange, and the thrust pin is inserted in the through hole. A sliding hole is provided on the body along its axial direction, and the slider includes a sliding seat sleeved outside the thrust pin, and a fixing member respectively connected to the sliding seat and the thrust pin and extending to the outside of the shell through the sliding hole. Through the above-mentioned thrust pen, thrust can be applied to the earphone parts that have completed the welding process one by one to detect the welding quality.

[0004] However, the above-mentioned thrust pen still has technical problems that products are easily missed and the efficiency of product detection is low. Since the above-mentioned thrust pen needs to be held manually and tested one by one on the welded parts, firstly, manual holding has uncontrollable human interference factors, which easily leads to missed inspection of products; secondly, in the large-scale product production demand, manual inspection efficiency is low, and enterprises need to invest a large amount of manpower costs. Summary of the invention

[0005] Based on this, it is necessary to provide a high-efficiency automatic headphone solder bridge thrust detection device to address the technical problem of low detection efficiency of the current headphone solder bridge thrust detection equipment.

[0006] An automatic headphone solder bridge thrust measuring device comprises: a frame, a product jig, an ejector jig and a driving mechanism; the product jig is arranged in the frame, the product jig has a plurality of product placement cavities, and the plurality of product placement cavities are evenly distributed on the product jig; the ejector jig is arranged opposite to the product jig, and the ejector jig is arranged above the product jig; the ejector jig comprises a fixed cover plate, a plurality of ejectors and a plurality of elastic elements; the fixed cover plate has a plurality of ejector placement cavities, the plurality of ejectors are respectively arranged in the plurality of ejector placement cavities, and the plurality of elastic elements are respectively sleeved on the upper parts of the plurality of ejectors; the driving mechanism is arranged above the frame, and the driving mechanism is connected to the ejector jig in driving manner.

[0007] Furthermore, the automatic headphone solder bridge thrust measuring device also has a plurality of guide pillars, one end of each of which is connected to the ejector fixture, and each of which is movably connected to the frame.

[0008] Furthermore, a plurality of guide sleeves are arranged above the frame, and the plurality of guide sleeves are movably connected to the plurality of guide posts correspondingly.

[0009] Furthermore, the product fixture also has a positioning carrier and a product placement plate.

[0010] Furthermore, the positioning vehicle is connected to the frame.

[0011] Furthermore, the product placement plate is arranged above the positioning carrier, and the product placement plate is movably connected to the positioning carrier.

[0012] Furthermore, the positioning carrier has a pick-and-place recess and an anti-fool chamfer.

[0013] Furthermore, the fixed cover plate also has a lower cover plate, an upper cover plate and a driving plate.

[0014] Furthermore, the lower cover plate is connected below the upper cover plate.

[0015] Furthermore, the driving plate is connected above the upper cover plate.

[0016] In summary, the automatic headphone solder bridge thrust test device of the present invention is provided with a relatively placed product jig and a pin jig, and the product to be tested for welding reliability can be placed in the product jig. The pin jig can automatically perform downward or upward movement under the drive of the driving mechanism, and the product to be tested can be judged as a qualified product if it can remain in its original state during the repeated downward and upward movement of the pin jig. Specifically, a plurality of product placement cavities are evenly arranged in the product jig, and a plurality of pins and a plurality of elastic elements are evenly arranged in the pin jig, so that the automatic headphone solder bridge thrust test device can test multiple products at a time, thereby improving the use efficiency of the present invention. Furthermore, the product jig is also provided with a positioning carrier and a product placement plate, and the product placement plate is movably connected to the positioning carrier, so that the operator can take out the product placement plate separately and put multiple products to be tested in the whole plate at one time, thereby further improving the use efficiency of the automatic headphone solder bridge thrust test device of the present invention. Furthermore, the elastic element is arranged between the ejector pin and the upper cover plate, and the operator can replace different elastic elements according to different product detection requirements, thereby increasing the practicality of the automatic headphone solder bridge thrust detection device of the present invention. Therefore, the automatic headphone solder bridge thrust detection device disclosed in the present invention can effectively solve the technical problem of low detection efficiency existing in the current headphone solder bridge thrust detection device, and the automatic headphone solder bridge thrust detection device has a simple structure and is easy to promote and apply. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a structural schematic diagram of an automatic headphone solder bridge thrust measuring device according to the present invention;

[0018] Figure 2 It is a partial structural schematic diagram of an automatic headphone solder bridge thrust measuring device of the present invention;

[0019] Figure 3 It is a partial structural exploded diagram of an automatic headphone solder bridge thrust measuring device of the present invention;

[0020] Figure 4 The present invention is a partial structural schematic diagram of an automatic headphone solder bridge thrust measuring device. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0024] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0027] Please also read Figures 1 to 4 The present invention discloses an automatic headphone solder bridge thrust measuring device, comprising: a frame 1, a product jig 2, a pin jig 3 and a driving mechanism 4. The frame 1 is provided with the product jig 2, and the product jig 2 has a plurality of product placement cavities 201, and the plurality of product placement cavities 201 are evenly distributed on the product jig 2. The pin jig 3 is arranged opposite to the product jig 2, and the pin jig 3 is arranged above the product jig 2. The pin jig 3 has a fixed cover plate 301, a plurality of ejectors 302 and a plurality of elastic elements 303; the fixed cover plate 301 has a plurality of ejector placement cavities 301a, and the plurality of ejectors 302 are respectively arranged in the plurality of ejector placement cavities 301a, and the plurality of elastic elements 303 are respectively sleeved on the upper parts of the plurality of ejectors 302. The driving mechanism 4 is arranged above the frame 1, and the driving mechanism 4 is connected to the ejector jig 3 in a driving manner.

[0028] Specifically, before the automatic headphone solder bridge thrust test device of the present invention is in the workflow, the frame 1 needs to be placed on a flat and stable workbench. The operator needs to place the products to be tested for solder bridge thrust, such as headphone parts, etc., in each of the product placement cavities 201 in turn. In the process of placing the products, the operator can also use the packaging blister tray of the product to be tested, the product turntable or a customized special fixture to directly turn the entire plate of the product to be tested upside down in the product fixture 2 to improve the placement efficiency of the product to be tested. After all the products to be tested are placed in the product fixture 2, the operator can start the workflow of the automatic headphone solder bridge thrust test device. Specifically, the driving mechanism 4 drives the ejector fixture 3 downward to a preset position. At this time, each ejector 302 provided in the ejector fixture 3 abuts against the surface of each product to be tested. Then, the driving mechanism 4 drives the ejector fixture 3 upward again to make each ejector 302 leave the surface of the product to be tested. The pressing process of the ejector fixture 3 can be repeated multiple times according to the actual needs of the product. After the ejector fixture 3 completes the preset pressing process, the operator can take out the product fixture 2 and select the products. After selecting the unqualified products, the qualified products are transferred and packaged off the production line. The automatic headphone solder bridge thrust measuring device of the present invention can detect multiple products at a time, for example, Figure 1 An embodiment of setting 120 sets of the product placement cavities 201 and corresponding ejector pins 302 and elastic elements 303 is shown. In this embodiment, the automatic headphone welding bridge thrust measuring device can detect and judge 120 products at a time, greatly improving the efficiency of welding product detection.

[0029] Furthermore, an automatic headphone solder bridge thrust measuring device of the present invention also has a plurality of guide pillars 5, one end of the guide pillars 5 is connected to the ejector fixture 3, and the guide pillars 5 are movably connected to the frame 1. Specifically, a plurality of guide sleeves 101 are arranged above the frame 1, and the plurality of guide sleeves 101 are correspondingly and movably connected to the plurality of guide pillars 5. In order to make the downward stroke of the ejector fixture 3 more stable, one guide pillar 5 can be connected to each side of the ejector fixture 3, and the driving connection between the driving mechanism 4 and the ejector fixture 3 is located between the two guide pillars 5. Therefore, the downward stroke of the ejector fixture 3 can be guaranteed to be stable and each ejector 302 has the same downward speed, thereby ensuring that each ejector 302 maintains the same contact force with the corresponding product to be detected placed in each product placement cavity 201, thereby avoiding misjudgment caused by uneven force on the product to be detected.

[0030] Furthermore, the product fixture 2 also has a positioning carrier 202 and a product placement plate 203. The positioning carrier 202 is connected to the frame 1. The product placement plate 203 is arranged above the positioning carrier 202, and the product placement plate 203 is movably connected to the positioning carrier 202. The product placement cavity 201 is arranged above the product placement plate 203. The positioning carrier 202 is arranged at the bottom of the frame 1 to fix and position the relative position of the product fixture 2, so as to facilitate the alignment of the ejector fixture 3 and the product fixture 2. The product placement plate 203 is movably connected to the positioning carrier 202, so as to facilitate the operator to transfer the entire plate of products that have been inspected, or to facilitate the operator to place the entire plate into the product to be inspected. Specifically, the operator can remove the product placement plate 203 separately and pair it with an intermediate fixture such as a packaging blister tray of the product to be tested, so that the product in the packaging blister tray can be placed in the product placement plate 203 as a whole, and then the product placement plate 203 with the product placed on it can be installed back on the positioning carrier 202 to avoid the operator placing the products to be tested one by one, thereby improving the working efficiency of the automatic headphone solder bridge thrust measuring device of the present invention. Furthermore, the positioning carrier 202 has a pick-up and placement recess 202a and an anti-fool chamfer 202b. The pick-up and placement recess 202a is arranged on one side of the positioning carrier 202, and the pick-up and placement recess 202a is convenient for the operator to take out or put in the product placement plate 203. The anti-fool chamfer 202b is arranged in the positioning carrier 202, and the anti-fool chamfer 202b can prevent the operator from installing the product placement plate 203 upside down.

[0031] Furthermore, the fixed cover plate 301 also has a lower cover plate 301b, an upper cover plate 301c and a driving plate 301d. The lower cover plate 301b is connected to the lower part of the upper cover plate 301c, and the driving plate 301d is connected to the upper part of the upper cover plate 301c. A plurality of ejector pin placement cavities 301a are evenly distributed in the lower cover plate 301b, each ejector pin 302 is correspondingly arranged in each ejector pin placement cavity 301a, and each elastic element 303 is correspondingly sleeved on the upper part of each ejector pin 302. Specifically, a plurality of ejector pins 302 are arranged between the lower cover plate 301b and the upper cover plate 301c, and a plurality of elastic elements 303 are correspondingly arranged between a plurality of ejector pins 302 and the upper cover plate 301c. The testing pressure required by the product to be tested is provided by the elastic element 303 disposed between the ejector pin 302 and the upper cover plate 301c. The elastic element 303 may be an elastic part such as a spring. Different elastic elements 303 may be replaced according to the testing force requirements of different welding products.

[0032] Furthermore, the driving mechanism 4 has a servo motor 401, a support rod 402 and a screw rod 403. The servo motor 401 is arranged above the support rod 402, and the screw rod 403 is arranged in the support rod 402. One end of the support rod 402 is connected to the top of the frame 1, and the other end of the support rod 402 is connected to the servo motor 401. One end of the screw rod 403 is connected to the driving plate 301d, and the other end of the screw rod 403 is connected to the servo motor 401. Specifically, the screw rod 403 can convert the rotational motion of the servo motor 401 into a linear motion that drives the driving plate 301d, so that the screw rod drives the ejector fixture 3 downward or upward.

[0033] In summary, the automatic headphone solder bridge thrust test device of the present invention is provided with a relatively placed product jig 2 and a pin jig 3, and the product to be tested for welding reliability can be placed in the product jig 2. The pin jig 3 can automatically move downward or upward under the drive of the driving mechanism 4, and the product to be tested can be judged as a qualified product if it can remain in its original state during the repeated downward and upward movements of the pin jig 3. Specifically, a plurality of product placement cavities 201 are evenly arranged in the product jig 2, and a plurality of pins 302 and a plurality of elastic elements 303 are evenly arranged in the pin jig 3, so that the automatic headphone solder bridge thrust test device can detect multiple products at a time, thereby improving the use efficiency of the present invention. Furthermore, the product fixture 2 is also provided with a positioning carrier 202 and a product placement plate 203, and the product placement plate 203 is movably connected to the positioning carrier 202, so that the operator can take out the product placement plate 203 separately and put multiple products to be tested in the whole plate at one time, which further improves the use efficiency of the automatic headphone solder bridge thrust detection device of the present invention. Furthermore, the elastic element 303 is arranged between the ejector pin and the upper cover plate 301c, and the operator can replace different elastic elements according to different product detection requirements, which increases the practicality of the automatic headphone solder bridge thrust detection device of the present invention. Therefore, the automatic headphone solder bridge thrust detection device disclosed in the present invention can effectively solve the technical problem of low detection efficiency of the current headphone solder bridge thrust detection device, and the automatic headphone solder bridge thrust detection device has a simple structure and is easy to promote and apply.

[0034] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An automatic headphone solder bridge thrust test device, characterized in that: The automatic headphone solder bridge thrust measuring device comprises: a frame (1), a product fixture (2), a ejector fixture (3) and a driving mechanism (4); The product jig (2) is arranged in the frame (1), the product jig (2) has a plurality of product placement cavities (201), and the plurality of product placement cavities (201) are evenly distributed on the product jig (2); the ejector jig (3) is arranged opposite to the product jig (2), and the ejector jig (3) is arranged above the product jig (2); the ejector jig (3) has a fixed cover plate (301), a plurality of ejectors (302) and a plurality of elastic elements (303); the fixed cover plate (301) has a plurality of ejector placement cavities (301a), the plurality of ejectors (302) are respectively arranged in the plurality of ejector placement cavities (301a), and the plurality of elastic elements (303) are respectively sleeved on the upper parts of the plurality of ejectors (302); the driving mechanism (4) is arranged above the frame (1), and the driving mechanism (4) is connected to the ejector jig (3) for driving.

2. The automatic headphone solder bridge thrust measuring device according to claim 1 is characterized in that: The automatic headphone solder bridge thrust measuring device also has a plurality of guide pillars (5), one end of each of the guide pillars (5) is connected to the ejector fixture (3), and the guide pillars (5) are movably connected to the frame (1).

3. The automatic headphone solder bridge thrust measuring device according to claim 2 is characterized in that: A plurality of guide sleeves (101) are arranged above the frame (1), and the plurality of guide sleeves (101) are movably connected to the plurality of guide pillars (5) in correspondence.

4. The automatic headphone solder bridge thrust measuring device according to claim 1 is characterized in that: The product fixture (2) also has a positioning carrier (202) and a product placement plate (203).

5. The automatic headphone solder bridge thrust measuring device according to claim 4 is characterized in that: The positioning carrier (202) is connected to the frame (1).

6. The automatic headphone solder bridge thrust measuring device according to claim 5, characterized in that: The product placement plate (203) is arranged above the positioning carrier (202), and the product placement plate (203) is movably connected to the positioning carrier (202).

7. The automatic headphone solder bridge thrust measuring device according to claim 6 is characterized by: The positioning carrier (202) has a pick-and-place recess (202a) and an anti-fool chamfer (202b).

8. The automatic headphone solder bridge thrust measuring device according to claim 3 or 7, characterized in that: The fixed cover plate (301) further comprises a lower cover plate (301b), an upper cover plate (301c) and a driving plate (301d).

9. The automatic headphone solder bridge thrust measuring device according to claim 8, characterized in that: The lower cover plate (301b) is connected below the upper cover plate (301c).

10. The automatic headphone solder bridge thrust measuring device according to claim 8, characterized in that: The driving plate (301d) is connected above the upper cover plate (301c).

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