Heat dissipation structure, heat dissipation method, terminal and storage medium

Abstract

The present invention discloses a heat dissipation structure, a heat dissipation method, a terminal and a storage medium. The heat dissipation structure includes a first heat dissipation element, a second heat dissipation element and a driving element. A first channel for accommodating a cooling liquid is provided on the first heat dissipation element, a second channel for accommodating a cooling liquid is provided on the second heat dissipation element, and the cooling liquid is driven to circulate between the first channel and the second channel by the driving element, so that the heat of the first heat dissipation element can be transferred to the second heat dissipation element along with the flow of the cooling liquid. When the second heat dissipation element is exposed to the terminal, the heat from the first heat dissipation element can be released to the external environment by the second heat dissipation element, and then the cooling liquid flows back to the first channel, thereby effectively improving the heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation structure, a heat dissipation method, a terminal and a storage medium. Background Art

[0002] With the advancement of science and technology and the development of 5G, the power consumption of terminals (such as smartphones, tablets, etc.) is increasing, and the heat generation is becoming more and more serious. Traditional heat dissipation generally uses graphite sheets or heat pipe technology. Since graphite sheets or heat pipes generally need to be installed inside the terminal, they only absorb heat from the heat source by heat conduction and cannot be exposed to the terminal. Therefore, the heat dissipation efficiency of traditional heat dissipation technology is not high and cannot meet the rapid heat dissipation requirements of high-power terminals. Summary of the invention

[0003] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0004] The embodiments of the present invention provide a heat dissipation structure, a heat dissipation method, a terminal and a storage medium, which can effectively improve the heat dissipation efficiency.

[0005] In a first aspect, an embodiment of the present invention provides a heat dissipation structure, applied to a terminal, including:

[0006] A first heat dissipation element is provided with a first channel for accommodating a cooling liquid, wherein the first channel is provided with a first communication port and a second communication port;

[0007] A second heat sink is provided with a second channel for accommodating cooling liquid, the second channel is provided with a third communication port and a fourth communication port, the first communication port is connected to the fourth communication port;

[0008] A driving member is connected to the second communication port and the third communication port respectively, and is used to drive the coolant to circulate between the first channel and the second channel.

[0009] In a second aspect, an embodiment of the present invention further provides a heat dissipation method, which is applied to a terminal, wherein the terminal is provided with a heat dissipation structure, and the heat dissipation structure includes:

[0010] A first heat sink is provided with a first channel for accommodating a cooling liquid;

[0011] A second heat sink is provided with a second channel for accommodating cooling liquid;

[0012] a driving member, used for driving the coolant to circulate between the first channel and the second channel;

[0013] A temperature detection component, used for detecting the temperature of a heat source;

[0014] A controller, connected to the driving member and the temperature detection member respectively;

[0015] The heat dissipation method comprises:

[0016] Acquire the temperature value of the heat source detected by the temperature detection component;

[0017] The driving element is controlled to start and stop according to the temperature value of the heat source.

[0018] In a third aspect, an embodiment of the present invention further provides a terminal, including the heat dissipation structure described in the first aspect;

[0019] or,

[0020] It includes at least one processor and a memory for communicating with the at least one processor; the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the heat dissipation method described in the second aspect.

[0021] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the heat dissipation method described in the second aspect.

[0022] An embodiment of the present invention includes: a first heat sink, a second heat sink and a driving member. A first channel for accommodating coolant is set on the first heat sink, a second channel for accommodating coolant is set on the second heat sink, and the driving member drives the coolant to circulate between the first channel and the second channel, so that the heat of the first heat sink can be transferred to the second heat sink as the coolant flows. When the second heat sink is exposed to the terminal setting, the heat from the first heat sink can be released to the external environment by the second heat sink, and then the coolant flows back to the first channel, thereby effectively improving the heat dissipation efficiency.

[0023] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.

[0025] Figure 1 is a structural schematic diagram of a heat dissipation structure provided by an embodiment of the present invention;

[0026] Figure 2 is a structural exploded diagram of a heat dissipation structure provided by an embodiment of the present invention;

[0027] Figure 3 is a structural cross-sectional view of a heat dissipation structure provided by an embodiment of the present invention;

[0028] Figure 4 is a structural schematic diagram of the front side of a first main body in a heat dissipation structure provided by an embodiment of the present invention;

[0029] Figure 5 is a structural schematic diagram of the reverse side of a first main body in a heat dissipation structure provided by an embodiment of the present invention;

[0030] Figure 6 is a flow chart of a heat dissipation method provided by an embodiment of the present invention;

[0031] Figure 7 It is a flow chart of controlling the start and stop of the driving component according to the temperature value of the heat source in a heat dissipation method provided by an embodiment of the present invention;

[0032] Figure 8 It is a schematic diagram of the structure of a terminal provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0034] It should be understood that in the description of the embodiments of the present invention, the meaning of multiple (or multiple) is more than two, greater than, less than, and exceeding are understood to exclude the number itself, and above, below, and within are understood to include the number itself. If there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0035] With the advancement of science and technology and the development of 5G, the power consumption of terminals (such as smartphones, tablets, etc.) is increasing, and the heat generation is becoming more and more serious. Traditional heat dissipation generally uses graphite sheets or heat pipe technology. Since graphite sheets or heat pipes generally need to be installed inside the terminal, they only absorb heat from the heat source by heat conduction and cannot be exposed to the terminal. Therefore, the heat dissipation efficiency of traditional heat dissipation technology is not high and cannot meet the rapid heat dissipation requirements of high-power terminals.

[0036] The embodiments of the present invention provide a heat dissipation structure, a heat dissipation method, a terminal and a storage medium, which can effectively improve the heat dissipation efficiency.

[0037] Reference Figure 1 , Figure 2 An embodiment of the present invention provides a heat dissipation structure, which is applied to a terminal, wherein the terminal may be a smart phone, a tablet computer, a smart wearable device, etc. The heat dissipation structure includes a first heat dissipation element 100, a second heat dissipation element 200 and a driving element 300. The first heat dissipation element 100 is provided with a first channel 110 for accommodating cooling liquid, and the first channel 110 is provided with a first connecting port 111 and a second connecting port 112; the second heat dissipation element 200 is provided with a second channel 210 for accommodating cooling liquid, and the second channel 210 is provided with a third connecting port 211 and a fourth connecting port 212, and the first connecting port 111 and the fourth connecting port 212 are connected; the driving element 300 is respectively connected to the second connecting port 112 and the third connecting port 211, and is used to drive the cooling liquid to circulate between the first channel 110 and the second channel 210.

[0038] Exemplarily, when the above-mentioned heat dissipation structure is applied to a terminal, the first heat sink 100 can be arranged inside the terminal to transfer heat from a heat source 400 (such as a processing chip, etc.), the second heat sink 200 can be arranged on the side wall of the terminal and exposed, and the coolant can fill the first channel 110. Therefore, by arranging a first channel 110 for accommodating coolant on the first heat sink 100, and arranging a second channel 210 for accommodating coolant on the second heat sink 200, and driving the coolant to circulate between the first channel 110 and the second channel 210 through the driving member 300, the heat of the first heat sink 100 can be transferred to the second heat sink 200 as the coolant flows. Since the second heat sink 200 is exposed in the terminal, the heat from the first heat sink 100 can be released to the external environment by the second heat sink 200, and then the coolant flows back to the first channel 110, thereby effectively improving the heat dissipation efficiency.

[0039] Based on this, the first heat sink 100 and the second heat sink 200 can form a T-shaped structure. It is understandable that the second heat sink 200 is not limited to being set on the side wall of the terminal, for example, it can also be set at the bottom of the terminal, which can be determined according to the design requirements of the terminal. The driving member 300 can use a liquid pump to drive the coolant to flow.

[0040] Reference Figure 3In one embodiment, the first heat sink 100 may also be provided with a third channel 120, through which the first communication port 111 and the fourth communication port 212 are communicated, so that the coolant circulates between the first channel 110 and the second channel 210 through the driving member 300. The third channel 120 is provided with a fifth communication port 121 and a sixth communication port 122, the fifth communication port 121 is communicated with the first communication port 111, and the sixth communication port 122 is communicated with the fourth communication port 212. Exemplarily, the first channel 110 and the third channel 120 may be provided inside the first heat sink 100.

[0041] Reference Figure 2 In one embodiment, the first heat sink 100 includes a first body 130 and a first heat sink 140. The first body 130 is provided with a first surface. In this embodiment, the first surface is the front of the first body 130. The first channel 110 is provided on the first surface. The first heat sink 140 is provided on the first surface so that the first channel 110 forms a closed space for accommodating the coolant. Among them, the first heat sink 140 can directly contact the heat source 400 to transfer the heat generated by the heat source 400. Since the first channel 110 is provided on the first surface, the first heat sink 140 is provided on the first surface so that the first channel 110 forms a closed space for accommodating the coolant. Therefore, the coolant in the first channel 110 can directly contact the first heat sink 140, so as to quickly absorb the heat of the first heat sink 140. Exemplarily, the first heat sink 140 can be attached to the first surface by means of high temperature resistant glue, friction welding, screw fastening, etc., so as to ensure that the first channel 110 forms a closed space for accommodating the coolant. Exemplarily, the first heat sink 140 can be made of copper sheet.

[0042] Reference Figure 2In one embodiment, the first heat sink 100 further includes a second heat sink 150, and the first body 130 is further provided with a second surface opposite to the first surface. In this embodiment, the second surface is the reverse side of the first body 130, and the third channel 120 is provided on the second surface. The second heat sink 150 is provided on the second surface so that the third channel 120 forms a closed space for accommodating the coolant. After the coolant releases heat to the external environment in the second channel 210, it flows to the third channel 120 under the drive of the driving member 300. Similarly, since the second heat sink 150 is provided on the second surface so that the third channel 120 forms a closed space for accommodating the coolant, the coolant in the third channel 120 can directly contact the second heat sink 150, and the heat of the coolant can be transferred to the second heat sink 150, so that the temperature of the coolant is further reduced. Afterwards, the coolant after cooling flows back to the first channel 110 through the first connecting port 111, thereby achieving the effect of circulating heat dissipation and effectively improving the heat dissipation efficiency. For example, the second heat sink 150 can also be attached to the second surface by means of high temperature resistant glue, friction welding, screw fastening, etc., so as to ensure that the third channel 120 forms a closed space for accommodating the coolant. For example, the second heat sink 150 can also be made of copper.

[0043] Based on the second heat sink 150 and the third channel 120, the coolant can also fill the first channel 110 and the third channel 120 at the same time. The heat of the heat source 400 can be transferred to the first heat sink 140 and the second heat sink 150 at the same time. Then, the coolant flows to the second channel 210 driven by the driving member 300 to release the heat to the external environment, which can also improve the heat dissipation efficiency.

[0044] Reference Figure 4 In one embodiment, the first channel 110 is spiral, the first connecting port 111 is the spiral center of the first channel 110, and the second connecting port 112 is the spiral end of the first channel 110. Therefore, when the position of the heat source 400 corresponds to the center position of the first channel 110, it is convenient to bring the heat from the center of the first channel 110 to the second channel 210, thereby ensuring the heat transfer effect.

[0045] Reference Figure 5In one embodiment, the third channel 120 may also be spiral, the fifth communication port 121 is the spiral center of the third channel 120, and the sixth communication port 122 is the spiral end of the third channel 120. On the basis that the coolant fills the first channel 110, when the coolant flows from the second channel 210 to the third channel 120, the temperature of the coolant in the center of the third channel 120 can be more effectively reduced, so that the temperature reduction effect of the coolant flowing back to the first channel 110 is better. On the basis that the coolant fills the first channel 110 and the third channel 120, when the position of the heat source 400 corresponds to the center position of the first channel 110, it is convenient to bring the heat in the center of the first channel 110 and the heat in the center of the third channel 120 to the second channel 210, thereby ensuring the heat transfer effect.

[0046] It is understandable that the first channel 110 and the third channel 120 may also be in other shapes, such as a sawtooth shape. The shapes of the first channel 110 and the third channel 120 may also be different, for example, the first channel 110 is spiral and the third channel 120 is linear.

[0047] In one embodiment, the second channel 210 may be in a sawtooth shape, which can effectively improve the heat dissipation efficiency.

[0048] In one embodiment, the first channel 110 and the third channel 120 can be staggered. Since the first channel 110 and the third channel 120 both have a certain depth, the staggered distribution of the first channel 110 and the second channel 210 can reduce the space occupied in the thickness direction of the first body 130, realize the lightweight and thin first body 130, and enable the terminal to have a larger design space.

[0049] Reference Figure 2 In one embodiment, the second heat sink 200 may include a second body 220 and a third heat sink 230. The second body 220 is provided with a third surface. In this embodiment, the third surface may be a side of the second body 220 close to the first channel 110. The second channel 210 is provided on the third surface. The third heat sink 230 is provided on the third surface so that the second channel 210 forms a closed space for accommodating the coolant. Similarly, since the second channel 210 is provided on the third surface, the third heat sink 230 is provided on the third surface so that the second channel 210 forms a closed space for accommodating the coolant. Therefore, the coolant in the second channel 210 can directly contact the third heat sink 230. Therefore, the coolant in the second channel 210 releases heat to the external environment while also transferring heat to the third heat sink 230, effectively improving the heat dissipation effect. Exemplarily, the third heat sink 230 may also be attached to the third surface by means of high temperature resistant glue, friction welding, screw fastening, etc., so as to ensure that the second channel 210 forms a closed space for accommodating the coolant. Exemplarily, the third heat sink 230 may also be made of copper.

[0050] In one embodiment, the diameter of the second channel 210 is greater than the diameter of the first channel 110 , so that the flow space of the coolant in the second channel 210 is larger, thereby improving the heat dissipation efficiency.

[0051] It is understandable that the capacity of the second channel 210 needs to be greater than or equal to the volume of the coolant to ensure that the coolant can all flow into the second channel 210 .

[0052] Based on the fact that the first heat sink 100 includes the first heat sink 140 and the second heat sink 150 , the working principle of the heat dissipation structure of the embodiment of the present invention is briefly described below.

[0053] One way is that the coolant fills the first channel 110. Under the action of the driving member 300, the coolant flows from the first channel 110 to the second channel 210, thereby releasing the heat of the first heat sink 140 to the external environment. Then, under the action of the driving member 300, the coolant flows from the second channel 210 to the third channel 120, and the coolant is further cooled under the action of the second heat sink 150. Finally, the coolant flows back to the first channel 110. This cycle realizes heat convection heat dissipation and improves heat dissipation efficiency.

[0054] Another way is that the coolant fills the first channel 110 and the third channel 120. Under the action of the driving member 300, the coolant flows to the second channel 210 through the second connecting port 112, thereby releasing the heat of the first heat sink 140 and the second heat sink 150 to the external environment, and then, under the action of the driving member 300, the coolant flows from the second channel 210 to the third channel 120 and the first channel 110 in sequence until the coolant fills the first channel 110 and the third channel 120 again, so that the cycle realizes heat convection heat dissipation and improves the heat dissipation efficiency.

[0055] In one embodiment, the heat dissipation structure may also be provided with a temperature sensor (not shown in the drawings) to detect the temperature value of the heat source 400. Then, the start and stop of the driver 300 may be controlled according to the temperature value of the heat source 400. For example, when the temperature value of the heat source 400 is 40°C, the driver 300 remains in a shut-down state, and only the first heat sink 140 (the first channel 110 is filled with the coolant) or the first heat sink 140 and the second heat sink 150 (the first channel 110 and the third channel 120 are filled with the coolant) are used for heat conduction and heat dissipation; when the temperature value of the heat source 400 is 45°C, the driver 300 is started to circulate the coolant between the first channel 110 and the second channel 210 for heat convection and heat dissipation. The above heat dissipation method can reasonably control the heat dissipation structure and reduce the power consumption generated by the driver 300. Of course, the above temperature values ​​can be changed according to actual needs.

[0056] In addition, an embodiment of the present invention further provides a terminal, including the heat dissipation structure in the above embodiment, wherein the first heat dissipation element 100 is located inside the terminal, and the second heat dissipation element 200 is exposed to the terminal. For example, the second heat dissipation element 200 can be integrated with the side wall of the terminal. Therefore, by providing a first channel 110 for accommodating coolant on the first heat dissipation element 100, and providing a second channel 210 for accommodating coolant on the second heat dissipation element 200, and driving the coolant to circulate between the first channel 110 and the second channel 210 by the driving element 300, the heat of the first heat dissipation element 100 can be transferred to the second heat dissipation element 200 as the coolant flows. Since the second heat dissipation element 200 is exposed to the terminal, the heat from the first heat dissipation element 100 can be released to the external environment by the second heat dissipation element 200, and then the coolant flows back to the first channel 110, so that the terminal has good heat dissipation performance.

[0057] Reference Figure 6 Based on the heat dissipation structure in the above embodiment, the embodiment of the present invention further provides a heat dissipation method, including but not limited to the following steps:

[0058] Step 601: obtaining the temperature value of the heat source detected by the temperature detection component;

[0059] Step 602: Control the start and stop of the driving element according to the temperature value of the heat source.

[0060] By obtaining the temperature value of the heat source detected by the temperature detection component and controlling the start and stop of the driving component according to the temperature value of the heat source, the driving component performs heat convection heat dissipation when it is turned on and performs heat conduction heat dissipation when it is turned off, so that the heat dissipation structure can be reasonably controlled to reduce the power consumption generated by the driving component. Exemplarily, the temperature detection component can be a temperature sensor.

[0061] Reference Figure 7 In one embodiment, in the above step 602, the start and stop of the driving element is controlled according to the temperature value of the heat source, which specifically includes the following steps:

[0062] When the temperature value of the heat source is higher than the first temperature threshold, starting the driving member;

[0063] In one embodiment, in the above step 602, controlling the start and stop of the driving element according to the temperature value of the heat source may further include the following steps:

[0064] When the temperature value of the heat source is lower than the second temperature threshold, shutting down the driving member;

[0065] Among them, the first temperature threshold can be equal to the second temperature threshold. For example, the first temperature threshold is set to 40°C. When the temperature value of the heat source is higher than 40°C, a high-efficiency heat dissipation method is required, so the driver is started to perform thermal convection heat dissipation; when the temperature value of the heat source is lower than 40°C, the requirement for heat dissipation efficiency is reduced, so the driver is shut down and the first heat sink and the second heat sink are used for thermal convection heat dissipation.

[0066] In addition, the first temperature threshold may also be greater than the second temperature threshold. For example, the first temperature threshold is set to 45°C and the second temperature threshold is set to 40°C. At this time, there is a buffer zone between the first temperature threshold and the second temperature threshold, which can avoid frequent control of the driving component and improve the stability of the driving component.

[0067] It can be understood that the first temperature threshold and the second temperature threshold can be set according to actual needs.

[0068] It should also be understood that the various implementations provided in the embodiments of the present invention can be combined arbitrarily to achieve different technical effects.

[0069] Figure 8 The terminal 800 provided by the embodiment of the present invention is shown. The terminal 800 includes: a memory 801, a processor 802, and a computer program stored in the memory 801 and executable on the processor 802. When the computer program is executed, it is used to execute the above heat dissipation method.

[0070] The processor 802 and the memory 801 may be connected via a bus or other means.

[0071] The memory 801 is a non-transitory computer-readable storage medium that can be used to store non-transitory software programs and non-transitory computer executable programs, such as the heat dissipation method described in the embodiment of the present invention. The processor 802 implements the above heat dissipation method by running the non-transitory software programs and instructions stored in the memory 801.

[0072] The memory 801 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and application programs required for at least one function; the data storage area may store the heat dissipation method for executing the above-mentioned method. In addition, the memory 801 may include a high-speed random access memory 801, and may also include a non-volatile memory 801, such as at least one disk memory 801, a flash memory device or other non-volatile solid-state memory 801. In some embodiments, the memory 801 may optionally include a memory 801 remotely arranged relative to the processor 802, and these remote memories 801 may be connected to the terminal 800 via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0073] The non-transient software program and instructions required to implement the above heat dissipation method are stored in the memory 801. When executed by one or more processors 802, the above heat dissipation method is executed, for example, Figure 6 , Figure 7 The method steps described in .

[0074] The embodiment of the present invention further provides a computer-readable storage medium storing computer-executable instructions, wherein the computer-executable instructions are used to execute the above-mentioned heat dissipation method.

[0075] In one embodiment, the computer-readable storage medium stores computer-executable instructions, which are executed by one or more control processors 802, for example, by a processor 802 in the terminal 800, so that the one or more processors 802 can perform the above-mentioned heat dissipation method, for example, execute Figure 6 , Figure 7 The method steps described in .

[0076] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0077] It will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed method above may be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or may be implemented as hardware, or may be implemented as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or a non-transitory medium) and a communication medium (or a temporary medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory 801 technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassette, magnetic tape, disk storage or other magnetic storage device, or any other medium that may be used to store desired information and may be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media generally include computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0078] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A heat dissipation structure, applied to a terminal, characterized in that: include: A first heat dissipation element is provided with a first channel for accommodating a cooling liquid, wherein the first channel is provided with a first communication port and a second communication port; A second heat sink is provided with a second channel for accommodating a cooling liquid, the second channel is provided with a third communication port and a fourth communication port, the first communication port is connected to the fourth communication port; a driving member, connected to the second communication port and the third communication port respectively, and used for driving the coolant to circulate between the first channel and the second channel; Wherein, the first heat sink comprises a first body and a first heat sink, the first body is provided with a first surface, the first channel is provided on the first surface, and the first heat sink is provided on the first surface so that the first channel forms a closed space for accommodating the coolant; The first heat sink also includes a second heat sink, the first body is also provided with a second surface opposite to the first surface, the second surface is provided with a third channel, the second heat sink is arranged on the second surface so that the third channel forms an enclosed space for accommodating coolant, and the first connecting port and the fourth connecting port are connected through the third channel.

2. The heat dissipation structure according to claim 1, characterized in that: The first channel is spiral-shaped, the first communication port is the spiral center of the first channel, and the second communication port is the spiral end of the first channel.

3. The heat dissipation structure according to claim 1 or 2, characterized in that: The third channel is spiral-shaped and is provided with a fifth connecting port and a sixth connecting port. The fifth connecting port is connected to the first connecting port, and the sixth connecting port is connected to the fourth connecting port. The fifth connecting port is the spiral center of the third channel, and the sixth connecting port is the spiral end of the third channel.

4. The heat dissipation structure according to claim 1 or 2, characterized in that: The first channel and the third channel are distributed alternately.

5. The heat dissipation structure according to claim 1, characterized in that: The second heat sink includes a second body and a third heat sink. The second body is provided with a third surface. The second channel is provided on the third surface. The third heat sink is provided on the third surface so that the second channel forms a closed space for accommodating coolant.

6. The heat dissipation structure according to claim 1, characterized in that: The diameter of the second channel is greater than the diameter of the first channel.

7. A heat dissipation method, characterized in that: Applied to a terminal, the terminal is provided with a heat dissipation structure, and the heat dissipation structure includes: A first heat sink is provided with a first channel for accommodating a cooling liquid, the first channel is provided with a first communication port and a second communication port, wherein the first heat sink comprises a first body and a first heat sink, the first body is provided with a first surface, the first channel is provided on the first surface, the first heat sink is provided on the first surface so that the first channel forms a closed space for accommodating the cooling liquid; the first heat sink also comprises a second heat sink, the first body is further provided with a second surface opposite to the first surface, the second surface is provided with a third channel, and the second heat sink is provided on the second surface so that the third channel forms a closed space for accommodating the cooling liquid; A second heat sink is provided with a second channel for accommodating a coolant, the second channel is provided with a third communication port and a fourth communication port, the first communication port and the fourth communication port are communicated through the third channel; a driving member, used for driving the coolant to circulate between the first channel and the second channel; A temperature detection component, used for detecting the temperature of a heat source; A controller, connected to the driving member and the temperature detection member respectively; The heat dissipation method comprises: Acquire the temperature value of the heat source detected by the temperature detection component; The driving element is controlled to start and stop according to the temperature value of the heat source.

8. The heat dissipation method according to claim 7, characterized in that: The controlling the start and stop of the driving element according to the temperature value of the heat source comprises: When the temperature value of the heat source is higher than a first temperature threshold, the driving member is started.

9. The heat dissipation method according to claim 8, characterized in that: The controlling the start and stop of the driving element according to the temperature value of the heat source also includes: When the temperature value of the heat source is lower than a second temperature threshold, shutting down the driving member; The first temperature threshold is greater than or equal to the second temperature threshold.

10. A terminal, characterized in that: A heat dissipation structure comprising any one of claims 1 to 6; or, comprising at least one processor and a memory for communicatively connecting to the at least one processor; The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the heat dissipation method according to any one of claims 7 to 9.

11. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the heat dissipation method according to any one of claims 7 to 9.

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