A smart card

Abstract

The present invention provides a smart card, which relates to the field of communication equipment technology. The smart card includes a satellite signal receiving component, a main control chip, and a substrate. The satellite signal receiving component includes an antenna interface and a satellite signal receiving chip, and the antenna interface is connected to the satellite signal receiving chip. The satellite signal receiving component and the main control chip are mounted on the substrate, and the satellite signal receiving chip is connected to the main control chip via pins on the substrate. This achieves the technical effect of providing satellite navigation and positioning functions through a smart card.

Description

Technical Field

[0001] The present application relates to the technical field of communication equipment, and in particular to a smart card. Background Art

[0002] Satellite navigation currently refers to the use of navigation satellites to provide navigation and positioning services for users on the ground, at sea, in the air, and in space. Examples include the Galileo and Beidou satellite navigation systems. Satellite navigation combines the advantages of traditional navigation systems, enabling truly high-precision, passive global navigation and positioning in all weather conditions. Time-of-range satellite navigation systems, in particular, not only provide continuous, three-dimensional global and near-Earth space coverage, high-precision three-dimensional positioning and velocity measurement, but also exhibit strong anti-interference capabilities.

[0003] With the rapid development of the economy and the rapid advancement of information technology, navigation and positioning in mobile terminals have become a standard feature. Although satellite navigation and positioning have gained widespread adoption, this functionality is typically integrated into the mobile terminal's communication control chip in an IP-based format. Currently, mainstream mobile terminal communication control chips feature a high level of board-level integration and a densely packed component layout. Adding a satellite navigation receiver module requires reserving space within the existing communication control chip's hardware. However, reserving additional space within the limited space of the communication control chip is difficult, increasing design complexity, restrictions, and high costs. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a smart card that can achieve the technical effect of having satellite navigation and positioning functions through the smart card.

[0005] The embodiment of the present application provides a smart card, including a satellite signal receiving component, a main control chip and a substrate;

[0006] The satellite signal receiving component includes an antenna interface and a satellite signal receiving chip, and the antenna interface is connected to the satellite signal receiving chip;

[0007] The satellite signal receiving component and the main control chip are mounted on the substrate, and the satellite signal receiving chip is connected to the main control chip via pins of the substrate.

[0008] In the above implementation process, the smart card installs the main control chip and the satellite signal receiving component together on the substrate, and enables the main control chip and the satellite signal receiving component to achieve communication connection through the pins of the substrate. The satellite signals received by the satellite signal receiving component, such as satellite navigation positioning information, emergency rescue information, etc., are transmitted to the processor of the personal terminal device through the main control chip, so that the main control chip and the satellite signal receiving component form an integrated device, thereby achieving the technical effect of having satellite navigation and positioning functions through the smart card.

[0009] Furthermore, the satellite signal receiving component also includes a signal filtering circuit, and the signal filtering circuit is connected to the antenna interface and the satellite signal receiving chip respectively.

[0010] In the above implementation process, the signal filtering circuit is used for signal filtering on the radio frequency link between the antenna interface and the satellite signal receiving chip.

[0011] Furthermore, the satellite signal receiving component further includes a signal amplifying circuit, and the signal amplifying circuit is connected to the signal filtering circuit and the satellite signal receiving chip respectively.

[0012] In the above implementation process, the signal amplification circuit is used to amplify the signal on the radio frequency link between the antenna interface and the satellite signal receiving chip.

[0013] Furthermore, the satellite signal receiving component further includes a matching circuit, which is connected to the signal amplifying circuit and the satellite signal receiving chip respectively.

[0014] In the above implementation process, the matching circuit includes power splitters and combiners for link matching of the radio frequency link between the antenna interface and the satellite signal receiving chip, so that the satellite signal receiving component can operate normally.

[0015] Furthermore, the satellite signal receiving component also includes a clock chip, and the clock chip is connected to the satellite signal receiving chip.

[0016] In the above implementation process, the clock chip is used to provide an internal clock signal for the system operation of the satellite signal receiving chip.

[0017] Furthermore, the satellite signal receiving chip includes a receiving signal port and a transmitting signal port, and the receiving signal port and the transmitting signal port are respectively connected to the main control chip.

[0018] In the above implementation process, the receiving signal port is the serial port RX, the serial port communication receives the signal, and the satellite signal receiving chip can receive the communication signal sent from the serial port of the main control chip; the transmitting signal port is the serial port TX, the serial port communication transmits the signal, and the satellite signal receiving chip can send the navigation positioning information solved by the satellite navigation to the main control chip for processing by the main control chip.

[0019] Furthermore, the satellite signal receiving chip further includes a universal signal port, and the universal signal port is connected to the main control chip.

[0020] In the above implementation process, the satellite signal receiving chip can receive the synchronization control signal sent by the main control chip through the universal signal port.

[0021] Furthermore, the satellite signal receiving chip further includes a reset signal port, and the reset signal port is connected to the main control chip.

[0022] In the above implementation process, the satellite signal receiving chip can receive the reset control signal sent by the main control chip through the reset signal port.

[0023] Furthermore, the satellite signal receiving chip further includes a power input port, and the satellite signal receiving chip is connected to a power source through the power input port.

[0024] Furthermore, the smart card further includes a plurality of pads and a memory chip, the plurality of pads are respectively connected to the pins of the substrate in a one-to-one correspondence, and the memory chip is connected to the satellite signal receiving chip.

[0025] In the above implementation process, the electrical bonding wires between the matching components and the substrate are connected between each chip and circuit on the substrate. According to a certain electrical logic, one end is connected to the pads on the chip and components, and the other end is connected to the pads on the substrate. The pads can respectively form the main control chip signal interface and the satellite signal receiving component satellite receiving antenna interface.

[0026] Other features and advantages disclosed in the present application will be described in the following description, or some features and advantages can be inferred or determined without doubt from the description, or can be learned by implementing the above-mentioned technology disclosed in the present application.

[0027] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 A schematic diagram of the structure of a smart card provided in an embodiment of the present application;

[0030] Figure 2 A circuit structure block diagram of a satellite signal receiving component provided in an embodiment of the present application;

[0031] Figure 3 This is a diagram of the connection structure of the smart card provided in an embodiment of the present application.

[0032] Icons: 10-smart card; 110-main control chip; 120-satellite signal receiving component; 121-satellite signal receiving chip; 122-memory chip; 123-antenna interface; 124-signal filtering circuit; 125-signal amplification circuit; 126-matching circuit; 127-clock chip; 130-substrate; 131-electrical bonding lead; 140-soldering pad. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of this application.

[0034] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0035] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0036] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or point connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0037] Furthermore, the terms "first," "second," etc., are primarily used to distinguish between different devices, elements, or components (which may or may not be of the same type and configuration), and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0038] An embodiment of the present application provides a smart card that can be used in personal terminal devices, such as mobile phones, tablet computers, etc.; the smart card installs a main control chip and a satellite signal receiving component together on a substrate, and enables the main control chip and the satellite signal receiving component to communicate through the pins of the substrate. The satellite signals received by the satellite signal receiving component, such as satellite navigation positioning information, emergency rescue information, etc., are transmitted to the processor of the personal terminal device through the main control chip, so that the main control chip and the satellite signal receiving component form an integrated device, thereby achieving the technical effect of having satellite navigation and positioning functions through the smart card.

[0039] See Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of the smart card provided in the embodiment of the present application. Figure 2 This is a circuit structure block diagram of a satellite signal receiving component provided in an embodiment of the present application. Figure 3 This is a connection structure diagram of a smart card provided in an embodiment of the present application. The smart card 10 includes a main control chip 110 , a satellite signal receiving component 120 and a substrate 130 .

[0040] Exemplarily, the satellite signal receiving component 120 includes a satellite signal receiving chip 121 , a memory chip 122 , and an antenna interface 123 . The antenna interface 123 is connected to the satellite signal receiving chip 121 , and the memory chip 122 is connected to the satellite signal receiving chip 121 .

[0041] In some embodiments, the satellite signal receiving chip 121 receives and decodes satellite navigation and positioning signals. It is a highly integrated System on Chip (SOC) that integrates satellite navigation and positioning, GSM (Global System for Mobile Communications) voice, and GPRS (General Packet Radio Service) data communications. The satellite signal receiving chip 121 includes a radio frequency chip and a baseband chip; the satellite signal receiving chip 121 may also be an integrated radio frequency and baseband chip, which is not limited here.

[0042] Optionally, in the embodiment of the present application, the satellite signal receiving component 120 can be used to receive satellite signals of the Beidou satellite navigation and positioning system, and the satellite signal receiving chip 121 is used to process the received Beidou satellite signals; it should be noted that the satellite signal receiving component 120 is not limited to the Beidou satellite navigation and positioning system, and can also process other satellite navigation and positioning systems such as the Global Positioning System (GPS), the Galileo satellite navigation system, the GLONASS satellite navigation system, etc.

[0043] Exemplarily, the memory chip 122 may be a coded flash memory, ie, a FLASH chip, for running a preset program so that the smart card 10 can operate normally.

[0044] For example, a FLASH chip is a widely used storage material, which is a magnetic disk that uses magnetic material to record information.

[0045] Illustratively, electrical bonding wires 131 are provided on the substrate 130 , and the pins of the main control chip 110 , the satellite signal receiving component 120 and the substrate 130 are respectively connected through the electrical bonding wires 131 .

[0046] Exemplarily, the satellite signal receiving component 120 and the main control chip 110 are mounted on the substrate 130 , and the satellite signal receiving component 120 is connected to the main control chip 110 via pins of the substrate 130 .

[0047] In some embodiments, the matching circuit 126, including passive components such as resistors, capacitors, inductors, and magnetic beads used for system matching, respectively establishes a certain interconnected logical relationship with the main control chip 110 or the satellite signal receiving component 120, including reset logic, control logic, synchronization logic, and communication logic.

[0048] For example, the smart card in the embodiment of the present application, namely the SIM (Subscriber Identity Module) card, is an IC card held by a mobile user of the GSM system, also known as a user identification card. The GSM system uses the SIM card to identify GSM users. The same SIM card can be used on different mobile phones. A GSM mobile phone can only be connected to the network and used after the SIM card is inserted. The SIM card is the key for the GSM mobile phone to connect to the GSM network. Once the SIM card is removed from the mobile phone, the mobile phone will not be able to enjoy the various services provided by the network operator except for emergency calls. In addition to being a key, the SIM card also provides a lot of convenience for users. Users only need to insert or embed the SIM card into any GSM terminal to achieve communication. The SIM card also manages a lot of information provided to the user's services and can be used to store short messages, especially those received when the user does not turn on the phone or is not there.

[0049] In some implementation scenarios, the smart card 10 installs the main control chip 110 and the satellite signal receiving component 120 together on the substrate 130, and enables the main control chip 110 and the satellite signal receiving component 120 to achieve communication connection through the pins of the substrate 130. The satellite signals received by the satellite signal receiving component 120, such as satellite navigation positioning information, emergency rescue information, etc., are transmitted to the processor of the personal terminal device through the main control chip 110, so that the main control chip 110 and the satellite signal receiving component 120 form an integrated device, thereby achieving the technical effect of having satellite navigation and positioning functions through the smart card 10.

[0050] Exemplarily, the satellite signal receiving component 120 further includes a signal filtering circuit 124 , which is connected to the antenna interface 123 and the satellite signal receiving chip 121 respectively.

[0051] Exemplarily, the signal filtering circuit 124 is used for filtering signals on the radio frequency link between the antenna interface 123 and the satellite signal receiving chip 121 .

[0052] Optionally, the signal filtering circuit 124 includes a surface acoustic wave filter chip. The main working principle of the surface acoustic wave filter is to utilize the piezoelectric properties of piezoelectric materials and use input and output transducers to convert the input signal of the radio wave into mechanical energy. After processing, the mechanical energy is converted into an electrical signal to filter out unnecessary signals and noise and improve the reception quality. The main function of the surface acoustic wave filter chip is to filter out noise. It is simpler to install and smaller in size than traditional low-pass filters.

[0053] Exemplarily, the satellite signal receiving component 120 further includes a signal amplifying circuit 125 , which is connected to the signal filtering circuit 124 and the satellite signal receiving chip 121 , respectively.

[0054] Exemplarily, the signal amplifying circuit 125 is used to amplify the signal on the radio frequency link between the antenna interface 123 and the satellite signal receiving chip 121 .

[0055] Optionally, signal amplification circuit 125 includes a low-noise amplifier (LNA) chip. A LNA is a special type of electronic amplifier primarily used in communication systems to amplify signals received from antennas for processing by subsequent electronic devices. Because antenna signals are typically very weak, LNAs are typically located very close to the antenna to minimize signal losses through the transmission line. This "active antenna" configuration is widely used in microwave systems such as satellite navigation and positioning systems, and offers the advantage of minimal losses within the microwave frequency range.

[0056] For example, the surface acoustic wave filter chip and the low noise amplifier chip are interconnected according to a certain logical relationship, so that the smart card 10 can achieve multi-frequency and multi-mode high-precision navigation and positioning functions.

[0057] Exemplarily, the satellite signal receiving component 120 further includes a matching circuit 126 , which is connected to the signal amplifying circuit 125 and the satellite signal receiving chip 121 , respectively.

[0058] Exemplarily, the matching circuit 126 includes a power splitter device, a combiner device, etc. for link matching of the radio frequency link between the antenna interface 123 and the satellite signal receiving chip 121, so that the satellite signal receiving component 120 can operate normally.

[0059] For example, a power divider is a device that splits the energy of an input signal into two or more outputs of equal or unequal energy. It can also combine the energy of multiple signals into one output, and is also called a combiner. A certain degree of isolation should be ensured between the output ports of a power divider. Power dividers, also called overcurrent dividers, are available in active and passive types. They can evenly divide a signal into several outputs. Generally, each divided signal has a few dB of attenuation. Different signal frequencies have different attenuation levels for different dividers. To compensate for the attenuation, a passive power divider is made by adding an amplifier.

[0060] Exemplarily, the satellite signal receiving component 120 further includes a clock chip 127 , which is connected to the satellite signal receiving chip 121 .

[0061] Exemplarily, the clock chip 127 is used to provide an internal clock signal for the system operation of the satellite signal receiving chip 121 .

[0062] For example, clock chip 127, also known as a clock device or clock circuit, is an oscillating circuit that generates accurate clock-like motion. All operations follow a time sequence, and the circuit used to generate this time is a clock circuit. A clock circuit generally consists of a crystal oscillator, a crystal oscillator control chip, and capacitors.

[0063] Exemplarily, the satellite signal receiving chip 121 includes a receiving signal port RX and a transmitting signal port TX, and the receiving signal port RX and the transmitting signal port TX are respectively connected to the main control chip 110 .

[0064] For example, the receiving signal port RX is the serial port RX, and the serial port communication receives the signal. The satellite signal receiving chip 121 can receive the communication signal sent from the serial port of the main control chip 110; the transmitting signal port TX is the serial port TX, and the serial port communication transmits the signal. The satellite signal receiving chip 121 can send the navigation positioning information solved by the satellite navigation to the main control chip 110 for processing by the main control chip 110.

[0065] Exemplarily, the satellite signal receiving chip 121 further includes a general-purpose input / output (GPIO) port, which is connected to the main control chip 110 .

[0066] For example, the satellite signal receiving chip 121 can receive the synchronization control signal sent from the main control chip 110 through the general signal port GPIO.

[0067] Exemplarily, the satellite signal receiving chip 121 further includes a reset signal port RESETn, and the reset signal port RESETn is connected to the main control chip 110 respectively.

[0068] For example, the satellite signal receiving chip 121 may receive a reset control signal from the main control chip 110 through the reset signal port RESETn.

[0069] Exemplarily, the satellite signal receiving chip further includes a power input port, and the satellite signal receiving chip 121 is connected to a power source via the power input port.

[0070] Exemplarily, the smart card 10 further includes a plurality of pads 140 , and the plurality of pads 140 are respectively connected to the pins of the substrate 130 in a one-to-one correspondence.

[0071] For example, the electrical bonding wires 131 between the matching components and the substrate 130 on each chip and circuit on the substrate 130 are connected, according to a certain electrical logic, at one end to the pads 140 on the chips and components, and at the other end to the pads 140 on the substrate 130. The pads 140 can respectively form the signal interface of the main control chip 110 and the satellite receiving antenna interface of the satellite signal receiving component 120.

[0072] Optionally, the pad 140 is a metal pad; the metal pad provided in the embodiment of the present application is not limited to a shape, and can be rectangular, square, circular, spherical, etc.

[0073] In all embodiments of the present application, "big" and "small" are relative, "more" and "less" are relative, and "up" and "down" are relative. The expressions of such relative terms will not be elaborated in the embodiments of the present application.

[0074] It should be understood that the phrases “in this embodiment,” “in an embodiment of the present application,” or “as an optional implementation” mentioned throughout the specification mean that specific features, structures, or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, “in this embodiment,” “in an embodiment of the present application,” or “as an optional implementation” appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in one or more embodiments in any suitable manner. Those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required for the present application.

[0075] In the various embodiments of the present application, it should be understood that the size of the serial numbers of the above-mentioned processes does not necessarily mean the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0076] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A smart card, characterized in that: The smart card is a SIM card, which includes a satellite signal receiving component, a main control chip and a substrate; The satellite signal receiving component includes an antenna interface and a satellite signal receiving chip, wherein the antenna interface is connected to the satellite signal receiving chip; the satellite signal receiving component transmits the received satellite signal to the processor of the mobile terminal device through the main control chip; wherein the satellite signal includes satellite navigation positioning information or emergency rescue information; The satellite signal receiving component and the main control chip are mounted on the substrate, and the satellite signal receiving chip is connected to the main control chip via pins of the substrate; The satellite signal receiving chip includes a serial port receiving signal port, a serial port transmitting signal port, a general signal port and a reset signal port respectively connected to the main control chip; The satellite signal receiving chip further receives a synchronization control signal from the main control chip through the universal signal port, and receives a reset control signal from the main control chip through the reset signal port.

2. The smart card according to claim 1, wherein: The satellite signal receiving component further includes a signal filtering circuit, which is connected to the antenna interface and the satellite signal receiving chip respectively.

3. The smart card according to claim 2, wherein: The satellite signal receiving component further includes a signal amplifying circuit, which is connected to the signal filtering circuit and the satellite signal receiving chip respectively.

4. The smart card according to claim 3, wherein: The satellite signal receiving component further includes a matching circuit, which is connected to the signal amplifying circuit and the satellite signal receiving chip respectively.

5. The smart card according to any one of claims 1 to 4, characterized in that: The satellite signal receiving component further includes a clock chip, which is connected to the satellite signal receiving chip.

6. The smart card according to claim 1, wherein: The satellite signal receiving chip further includes a power input port, and the satellite signal receiving chip is connected to a power source through the power input port.

7. The smart card according to claim 1, wherein: The smart card further comprises a plurality of pads and a memory chip. The plurality of pads are respectively connected to the pins of the substrate in a one-to-one correspondence, and the memory chip is connected to the satellite signal receiving chip.

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