Display module and assembly method thereof, and display device

Abstract

Some embodiments of the present disclosure provide a display module and an assembly method thereof, and a display device, which relate to the field of flexible display and are used to improve the heat dissipation effect of the display device. The display module includes a display panel, a driver chip, a support component, a heat dissipation layer and a thermally conductive spacer. The display panel includes a display portion, a bending portion and a binding portion connected in sequence. The driver chip is arranged on a side of the binding portion away from the display portion and is electrically connected to the binding portion. The support component is arranged on the backlight side of the display portion. The heat dissipation layer is arranged on a side of the support component away from the display portion. When the binding portion is bent to the backlight side of the display portion, the thermally conductive spacer is located between the binding portion and the heat dissipation layer; the orthographic projection of the thermally conductive spacer on the heat dissipation layer at least partially overlaps with the orthographic projection of the driver chip on the heat dissipation layer. The display module and the assembly method thereof, and the display device provided in some embodiments of the present disclosure are applied to image display.

Description

Technical Field

[0001] The present disclosure relates to the field of flexible displays, and in particular to a display module and an assembly method thereof, and a display device. Background Art

[0002] With the development of display technology, display devices (such as mobile phones, tablets, wearable bracelets or TVs, etc.) have been widely used. Heat dissipation has always been an important problem faced by display devices. If the heat dissipation effect of the display device is poor, the internal temperature of the display device will be high. The high temperature environment will affect the normal operation of the electronic components inside the display device, thereby affecting the display effect of the display device. In addition, the high temperature environment will also affect the service life of the electronic components and reduce the service life of the display device. Summary of the invention

[0003] An object of some embodiments of the present disclosure is to provide a display module and an assembly method thereof, and a display device, so as to improve the heat dissipation efficiency of the display module and thereby increase the service life of the display device.

[0004] To achieve the above objectives, some embodiments of the present disclosure provide the following technical solutions:

[0005] On the one hand, a display module is provided. The display module includes a display panel, a driver chip, a support component, a heat dissipation layer and a thermally conductive spacer. The display panel includes a display portion, a bending portion and a binding portion connected in sequence; the display portion has a light emitting side and a backlight side; the bending portion can be bent so that the binding portion is bent to the backlight side of the display portion. The support component is arranged on the backlight side of the display portion. The heat dissipation layer is arranged on the side of the support component away from the display portion. In the case where the binding portion is bent to the backlight side of the display portion, the driver chip is arranged on the side of the binding portion away from the display portion and is electrically connected to the binding portion; the thermally conductive spacer is located between the binding portion and the heat dissipation layer, and the orthographic projection of the thermally conductive spacer on the heat dissipation layer at least partially overlaps with the orthographic projection of the driver chip on the heat dissipation layer.

[0006] In some embodiments, the orthographic projection of the driving chip on the heat dissipation layer is located within the range of the orthographic projection of the thermal conductive spacer on the heat dissipation layer.

[0007] In some embodiments, the thermally conductive spacer includes a first thermally conductive layer. The first thermally conductive layer is disposed between the heat dissipation layer and the binding portion and is configured to connect the heat dissipation layer and the binding portion.

[0008] In some embodiments, the thermally conductive spacer further comprises a first heat sink and a second heat conductive layer. The first heat sink is disposed on a side of the first heat conductive layer away from the heat dissipation layer. The second heat conductive layer is disposed between the first heat sink and the binding portion to connect the first heat sink to the binding portion.

[0009] In some embodiments, the material used for the first thermal conductive layer includes at least one of thermal conductive glue, thermal conductive paste and thermal conductive grease; and / or, the material used for the second thermal conductive layer includes at least one of thermal conductive glue, thermal conductive paste and thermal conductive grease.

[0010] In some embodiments, the display portion includes a first sub-display portion and a second sub-display portion; the first sub-display portion is bendable; the second sub-display portion is located between the first sub-display portion and the bending portion and is connected to the bending portion; the orthographic projection of the heat dissipation layer on the plane where the display portion is located is located within the range of the second sub-display portion.

[0011] In some embodiments, the heat dissipation layer includes a second heat sink and a first adhesive layer. The second heat sink is disposed on a side of the support component away from the display portion. The first adhesive layer is disposed between the second heat sink and the support component and is configured to connect the second heat sink to the support component.

[0012] In some embodiments, the material used for the second heat sink includes at least one of copper, silver, gold, graphite and boron nitride.

[0013] In some embodiments, the support assembly includes a first support member and a second support member. The first support member is disposed on the backlight side of the display portion, and the orthographic projection of the first support member on the plane where the display portion is located overlaps with the display portion. The second support member is disposed on a side of the first support member away from the display portion, and the orthographic projection of the second support member on the plane where the display portion is located overlaps with the second sub-display portion. The orthographic projection of the heat dissipation layer on the plane where the second support member is located is located within the range of the second support member.

[0014] In some embodiments, when the display portion, the bending portion, and the binding portion are located in the same plane, the display module further comprises a spacer layer. The spacer layer is disposed on a side of the support assembly and the heat dissipation layer away from the display panel, and a surface of the spacer layer away from the display panel is parallel to the display panel.

[0015] In some embodiments, the spacer layer includes a first protective layer, a second protective layer and a buffer layer. The first protective layer is disposed on a side of the first support member away from the display panel, and its orthographic projection on the display panel covers the portion of the first support member exposed by the second support member; the surface of the first protective layer away from the display panel is flush with the surface of the second support member away from the display panel. The second protective layer is disposed on a side of the first protective layer away from the display panel, and its orthographic projection on the display panel covers the portion of the first protective layer and the second support member exposed by the heat dissipation layer; the surface of the second protective layer away from the display panel is flush with the surface of the heat dissipation layer away from the display panel. The buffer layer is disposed on a side of the second protective layer and the heat dissipation layer away from the display panel, and covers the second protective layer and the heat dissipation layer.

[0016] In some embodiments, the first protective layer and the second protective layer are made of rigid materials.

[0017] The display module provided by the embodiment of the present disclosure includes a display panel. The display panel has a bendable bending portion, that is, the display panel is a flexible display panel, and the display panel itself can be bent. The display panel includes a display portion, a bending portion, and a binding portion connected in sequence. When the bending portion is bent and the binding portion is bent to the backlight side of the display portion, the driver chip is arranged on the side of the binding portion away from the display portion, and the thermally conductive spacer is arranged on the side of the binding portion close to the display portion, that is, the driver chip and the thermally conductive spacer are respectively arranged on the opposite sides of the binding portion. In this way, the heat generated by the driver chip can be transferred to the thermally conductive spacer through the binding portion of the display panel. Moreover, since the orthographic projection of the thermally conductive spacer on the heat dissipation layer overlaps at least partially with the orthographic projection of the driver chip on the heat dissipation layer, the efficiency of transferring the heat generated by the driver chip to the thermally conductive spacer can be improved. Furthermore, the thermally conductive spacer is connected to the heat dissipation layer, and the heat transferred to the thermally conductive spacer can be transferred to the heat dissipation layer, and the heat is dissipated by the heat dissipation layer. Based on the above process, the heat generated by the driver chip can be efficiently transferred to the heat dissipation layer for heat dissipation, thereby improving the heat dissipation efficiency of the driver chip and thus improving the heat dissipation effect of the display module.

[0018] The display module provided by any of the above embodiments can be applied to a rollable display device (such as a ring watch and a rollable mobile phone, etc.). In the rollable display device, the display module includes a display panel, a first support member and a second support member, the first support member is used to support the display panel, and the second support member is used to define a non-rolling area. The non-rolling area includes a first support member and a second support member that are stacked, and the rolling area only includes the first support member, that is, the area in the display module where the first support member and the second support member are both provided is the non-rolling area, and the area where only the first support member is provided is the rolling area. There is a step difference between the first support member and the second support member, and the step difference depends on the thickness of the second support layer. Based on this, in the process of using roller rolling to increase the adhesion between the film layers of the display module, the roller rolling the area where the step difference is located will generate a large stress, and the stress will cause the corresponding area of ​​the display panel to produce a film print, affecting the flatness of the display panel surface, thereby reducing the product yield of the display module.

[0019] In order to solve the above problems, an embodiment of the present disclosure also provides an assembly method of a display module. The assembly method includes: bonding a first support member, a second support member and a heat dissipation layer in sequence on the backlight side of a display panel; wherein the display panel includes a first sub-display portion, a second sub-display portion, a bending portion and a binding portion connected in sequence; the orthographic projection of the first support member on the display panel overlaps with the display portion, and the display portion includes the first display panel and the second display portion. The orthographic projection of the second support member on the display panel overlaps with the second sub-display portion. The heat dissipation layer is arranged on the side of the second support member away from the display panel. A first protective layer is arranged in the area where the first support member is exposed by the second support member; wherein the side wall of the first protective layer close to the second support member abuts against the second support member, and the surface of the first protective layer away from the display panel is flush with the surface of the second support member away from the display panel. A second protective layer is arranged on the side of the first protective layer away from the display panel and in the area where the second support member is exposed by the heat dissipation layer; wherein the side wall of the second protective layer close to the heat dissipation layer abuts against the heat dissipation layer, and the surface of the second protective layer away from the display panel is flush with the surface of the heat dissipation layer away from the display panel. A buffer layer is provided on a side of the second protection layer away from the display panel and a side of the heat dissipation layer away from the display panel, and a roller is used to roll the surface of the buffer layer away from the display panel.

[0020] In some embodiments, after rolling the surface of the buffer layer away from the display part with a roller, the assembly method further includes: arranging a thermally conductive spacer on the side of the binding part away from the plane where the light emitting side of the display part is located. Binding a driver chip on the side of the binding part away from the thermally conductive spacer; wherein the orthographic projection of the driver chip on the binding part at least partially overlaps with the orthographic projection of the thermally conductive spacer on the binding part. The buffer layer, the second protective layer and the first protective layer are removed in sequence. The bent part is bent, and the binding part is connected to the heat dissipation layer through the thermally conductive spacer.

[0021] The assembly method of the display module provided by the embodiment of the present disclosure is based on the structure of bonding the first support member and the second support member to the display panel, and bonding the first protective layer to eliminate the step difference generated by the second support member at the junction of the sliding area and the non-sliding area. Further, the heat dissipation layer is bonded to the side of the second support member away from the display panel. Since the positive projection of the heat dissipation layer on the plane where the second support member is located is located within the range of the second support member, that is, the coverage range of the heat dissipation layer is smaller than the coverage range of the second support member, there is a step difference between the heat dissipation layer and the second support member, and the step difference depends on the thickness of the heat dissipation layer. Therefore, after bonding the first protective layer, the second protective layer is bonded to eliminate the step difference generated by the part of the heat dissipation layer that exposes the second support member and the first protective layer. Then, the buffer layer is bonded, and the buffer layer can provide a buffering effect for the rolling of the roller, avoiding the rigid contact between the roller and the second protective layer and the heat dissipation layer, thereby reducing the adverse effect of the poor surface flatness of the second protective layer and / or the heat dissipation layer on the surface flatness of the display panel.

[0022] In another aspect, a display device is provided, comprising the display module in the above embodiment in a bent state, that is, the display module comprises a display panel, a driving chip, a supporting structure, a heat dissipation layer and a thermally conductive spacer, but does not include a spacer layer.

[0023] The display device provided by the embodiment of the present disclosure adopts the display module in the above embodiment, which can improve the heat dissipation efficiency of the display module, thereby reducing the temperature inside the display device, improving the working environment of various electronic components of the display device, and increasing the service life of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The drawings described herein are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the embodiments of the present disclosure. The illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation on the present disclosure. In the drawings:

[0025] Figure 1A A structural diagram of a display device provided in an embodiment of the present disclosure;

[0026] Figure 1B A top view of a display device provided by an embodiment of the present disclosure in a normal use state;

[0027] Figure 2 A structural diagram of a display module provided in an embodiment of the present disclosure;

[0028] Figure 3 A structural diagram of a display module provided in an embodiment of the present disclosure in an unbent state;

[0029] Figure 4 for Figure 2 A cross-sectional view of the display module along section line AA is shown;

[0030] Figure 5 for Figure 2 Another cross-sectional view of the display module along section line AA is shown;

[0031] Figure 6 for Figure 2 Another cross-sectional view of the display module along section line AA;

[0032] Figure 7 A structural diagram of another display module provided by an embodiment of the present disclosure in an unbent state;

[0033] Figure 8 A step diagram of an assembly method of a display module provided in an embodiment of the present disclosure;

[0034] Fig. 9 A flow chart of an assembly method of a display module provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0035] For ease of understanding, the technical solutions provided by some embodiments of the present disclosure are described in detail below in conjunction with the accompanying drawings of the specification. Obviously, the described embodiments are only some embodiments of the proposed technical solutions, rather than all embodiments. Based on some embodiments of the present disclosure, all other embodiments that can be obtained by those skilled in the art belong to the scope of protection of the present disclosure.

[0036] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0037] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0038] “At least one of A, B and C” has the same meaning as “at least one of A, B or C”, and both include the following combinations of A, B and C: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B and C. “A and / or B” includes the following three combinations: only A, only B, and a combination of A and B.

[0039] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0040] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0041] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0042] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0043] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0044] like Figure 1A and Figure 1B As shown, some embodiments of the present disclosure provide a display device 1000. The display device 1000 is a device or equipment for visually displaying electronic information. Exemplarily, the display device 1000 can be any product or component with a display function, such as a smart phone, a tablet computer, a television, a monitor, a laptop computer, and other wearable electronic devices (such as a watch).

[0045] In some embodiments, the display device 1000 may be a flexible OLED display device, which may be applied to a folding screen display device and a roll-up display device. Figure 1A and Figure 1B As shown, the flexible OLED display device is a roll-up display device, which includes a roll-up area 1001 and a non-roll-up area 1002; the roll-up area 1001 can be bent or curled; and the non-roll-up area 1002 cannot be bent.

[0046] The display device 1000 includes a display module 100, such as Figure 3 As shown, the display module 100 includes a display panel 1 , a driving chip 11 , a supporting component 101 , a heat dissipation layer 102 and a thermally conductive spacer 103 .

[0047] The display panel 1 includes a pixel driving circuit (not shown in the figure), which is coupled to the driving chip 11 and is configured to transmit signals under the control of the driving chip 11 so that the display panel 1 displays images. The display panel 1 included in the display module 100 is a flexible display panel. For example, Figure 3 As shown, in the case where the display panel 1 is a flexible display panel, the flexible display panel 1 includes a display portion 01, a bending portion 02 and a binding portion 03 connected in sequence. The display portion 01 has a light emitting side 001 and a backlight side 002, and the display portion 01 is configured to display an image. The bending portion 02 can be bent so that the binding portion 03 is bent to the backlight side 002 of the display portion 01. The side of the binding portion 03 away from the display portion 01 is bound to the driver chip 11.

[0048] It is understandable that the driver chip 11 includes at least one of a source driver chip, a timing controller, a gamma circuit, and other microchips. The embodiment of the present disclosure does not limit the driver chip 11. For example, the driver chip 11 is a source driver chip, which is disposed on the backlight side 002 of the display panel 1 to reduce the width of the peripheral area of ​​the display panel 1 and realize a narrow frame of the display device 1000.

[0049] In some embodiments, Figure 4 As shown, the display portion 01 includes a first sub-display portion 011 and a second sub-display portion 012 connected in sequence. The first sub-display portion 011 is bendable. The second sub-display portion 012 is located between the first sub-display portion 011 and the bending portion 02 and is connected to the bending portion 02.

[0050] For example, the first sub-display portion 011 can be scrolled, while the second sub-display portion 012 cannot be scrolled. That is, the first sub-display portion 011 corresponds to the scrolling area 1001 of the display module 100 , and the second sub-display portion 012 corresponds to the non-scrolling area 1002 of the display module 100 .

[0051] In some embodiments, Figure 3 As shown, the supporting assembly 101 is disposed on the backlight side 002 of the display panel 1 and is configured to support the flexible display panel 1 .

[0052] In some examples, such as Figure 4As shown, the support assembly 101 includes a first support member 3 and a second support member 5. The first support member 3 is arranged on the backlight side 002 of the display unit 01, and the orthographic projection of the first support member 3 on the plane where the display unit 01 is located overlaps with the display unit 01, and is configured to support the display panel 1. The first support member 3 can be bonded to the display unit 01 through the second adhesive layer 2. The material used in the second adhesive layer 2 includes optically clear adhesive (OCA) or pressure sensitive adhesive (PSA). For example, the second adhesive layer 2 uses OCA adhesive.

[0053] The second support member 5 is arranged on a side of the first support member 3 away from the display unit 01, and the orthographic projection of the second support member 5 on the plane where the display unit 01 is located overlaps with the second sub-display unit 012. The second support member 5 is bonded to the display unit 01 through the third adhesive layer 4. The material used in the third adhesive layer 4 includes OCA adhesive or PSA adhesive. For example, the second support member 5 and the second sub-display unit 012 have the same area and completely overlap. The third adhesive layer 4 uses OCA adhesive.

[0054] The first support member 3 and the second support member 5 can be made of stainless steel. When the thickness of stainless steel is relatively thin, stainless steel has a certain flexibility. For example, the first support member 3 covers the surface of the backlight side 002 of the display unit 01 in an entire layer to provide support for the display panel 1. The thickness H1 of the first support member 3 is approximately 0.1 mm ± 0.05 mm. For example, the thickness H1 of the first support member 3 is 0.1 mm, so that the display panel 1 arranged on the first support member 3 is still flexible to ensure that the first sub-display unit 011 of the display unit 01 can be bent.

[0055] Furthermore, the second support member 5 is disposed on the backlight side 002 of the second sub-display portion 012 of the display portion 01, and the thickness H2 of the second support member 5 is approximately 0.2 mm ± 0.05 mm. For example, the thickness H2 of the second support member 5 is 0.2 mm. In this way, the total thickness H1 + H2 of the first support member 3 and the second support member 5 disposed on the backlight side 002 of the second sub-display portion 012 is 0.3 mm, so that the second sub-display portion 012 of the display panel 1 cannot be bent.

[0056] In some embodiments, Figures 4 to 6 As shown, when the binding portion 03 is bent to the backlight side 002 of the display portion 01, the thermally conductive spacer 103 is located between the binding portion 03 and the second support member 5, and the thermally conductive spacer 103 is configured to connect the binding portion 03 to the second support member 5 to transfer the heat generated by the driver chip 11 to the second support member 5. In this way, when the second support member 5 is made of stainless steel, the second support member 5 can dissipate heat for the driver chip 11.

[0057] For example, Figure 3 As shown, the thermally conductive spacer 103 includes a first thermally conductive layer 6. The material used in the first thermally conductive layer 6 includes at least one of thermally conductive glue, thermally conductive paste, and thermally conductive grease. For example, the material used in the first thermally conductive layer 6 includes thermally conductive glue. In this way, when the binding portion 03 is bent to the backlight side 002 of the display portion 01, the binding portion 03 is connected to the second support member 5 through the first thermally conductive layer 6.

[0058] In some embodiments, Figure 5 and Figure 6 As shown, the heat dissipation layer 102 is disposed on a side of the support assembly 101 away from the display portion 01 , and the orthographic projection of the heat dissipation layer 102 on the plane where the display portion 01 is located is located within the range of the second sub-display portion 012 .

[0059] It can be understood that when the orthographic projection of the second support member 5 on the plane where the display unit 01 is located overlaps with the second sub-display unit 012, that is, when the area of ​​the second support member 5 is equal to the area of ​​the second sub-display unit 012, the orthographic projection of the heat dissipation layer 102 on the plane where the second support member 5 is located is located within the range of the second support member 5.

[0060] The area of ​​the heat dissipation layer 102 is approximately 80% to 100% of the area of ​​the second support member 5. Figure 2 As shown, the area of ​​the heat dissipation layer 102 is smaller than the area of ​​the second support member 5, and the area of ​​the heat dissipation layer 102 is 80% of the area of ​​the second support member 5. In this way, a larger area of ​​the heat dissipation layer 102 is conducive to improving the heat dissipation efficiency.

[0061] In addition, since the area of ​​the heat dissipation layer 102 is 80% of the area of ​​the second support member 5, a small amount of space is left to facilitate the connection between the display panel 1 and other components in the display device 1000, for example, enough space is left to facilitate the clamping of the display panel 1 and the housing in the display device 1000; or a sealing glue is set to fix other components on the display panel 1. In addition, the area of ​​the heat dissipation layer 102 is also related to the size of the battery in the display device 1000, so as to dissipate the heat generated by the battery. For example, the battery contacts the area of ​​the heat dissipation layer 102 exposed by the thermal conductive spacer 103, and the orthographic projection of the battery on the plane where the heat dissipation layer 102 is located is located in the heat dissipation layer 102.

[0062] In some embodiments, Figure 5As shown, the heat dissipation layer 102 includes a second heat sink 7 and a first adhesive layer 8. The second heat sink 7 is arranged on the side of the support component 101 away from the display unit 01, and the orthographic projection of the second heat sink 7 on the plane where the display unit 01 is located is located within the range of the second sub-display unit 012. The material used for the second heat sink 7 includes at least one of copper, silver, gold, graphite and boron nitride. For example, the material used for the second heat sink 7 includes graphite. The heat dissipation coefficient of graphite is relatively high, which is conducive to improving the heat dissipation efficiency of the driver chip 11.

[0063] The first adhesive layer 8 is disposed between the second heat sink 7 and the support assembly 101, and is configured to connect the second heat sink 7 to the support assembly 101. The material used in the first adhesive layer 8 includes pressure sensitive adhesive (PSA) or optical adhesive (OCA). For example, the first adhesive layer 8 uses PSA adhesive.

[0064] In some embodiments, Figure 5 and Figure 6 As shown, when the binding portion 03 is bent to the backlight side 002 of the display portion 01, the thermally conductive spacer 103 is located between the binding portion 03 and the heat dissipation layer 102, and the orthographic projection of the thermally conductive spacer 103 on the heat dissipation layer 102 overlaps at least partially with the orthographic projection of the driver chip 11 on the heat dissipation layer 102. The thermally conductive spacer 103 is configured to connect the binding portion 03 with the heat dissipation layer 102 to transfer the heat generated by the driver chip 11 located on the binding portion 03 to the heat dissipation layer 102, and the heat is dissipated by the heat dissipation layer 102. In addition, at least part of the heat on the heat dissipation layer 102 will also be transferred to the support component 101 (such as the second support member 5), and the support component 101 will dissipate the heat. In this way, the display module 100 dissipates heat through the heat dissipation layer 102 and the support component 101, which is conducive to improving the heat dissipation efficiency.

[0065] For example, Figure 2 and Figure 5 As shown, the orthographic projection of the driver chip 11 on the heat dissipation layer 102 is located within the range of the orthographic projection of the thermal conductive spacer 103 on the heat dissipation layer 102, so as to transfer almost all the heat generated by the driver chip 11 to the heat dissipation layer 102, thereby improving the heat dissipation efficiency of the driver chip 11.

[0066] In some examples, such as Figure 5 As shown, the thermally conductive spacer 103 includes a first thermally conductive layer 6. When the binding portion 03 is bent to the backlight side 002 of the display portion 01, the first thermally conductive layer 6 is disposed between the second heat sink 7 and the binding portion 03 and is configured to connect the second heat sink 7 to the binding portion 03.

[0067] In other examples, such as Figure 6As shown, the thermally conductive spacer 103 includes a first thermally conductive layer 6, a first heat sink 9 and a second thermally conductive layer 10. When the binding portion 03 is bent to the backlight side 002 of the display portion 01, the first heat sink 9 is arranged on the side of the first thermally conductive layer 6 away from the second heat sink 7. The material used for the first heat sink 9 includes at least one of copper, silver, gold and boron nitride. For example, the material used for the first heat sink 9 includes copper. Copper has a high thermal conductivity, which is conducive to improving thermal conductivity efficiency.

[0068] When the binding portion 03 is bent to the backlight side 002 of the display portion 01, the second heat conducting layer 10 is disposed between the second heat sink 9 and the binding portion 03 to connect the first heat sink 9 to the binding portion 03. The material used in the second heat conducting layer 10 includes at least one of a thermally conductive adhesive, a thermally conductive paste, and a thermally conductive grease. For example, the material used in the second heat conducting layer 10 includes a thermally conductive adhesive.

[0069] The material used for the first heat sink 9 includes copper. Copper has high density and is not prone to splitting or delamination under stress. Therefore, by coating adhesive on both sides of the copper to fix the binding part 03 to the backlight side 002 of the display part 01, it is beneficial to stably bond the binding part 03 to the backlight side 002 of the display part 01, thereby preventing the first heat sink 9 from warping or delamination.

[0070] It should be noted that the number of film layers stacked by the thermally conductive spacer 103 is related to the bending degree of the bending portion 02 of the display panel 1. For example, Figure 6 As shown, the diameter D of the bending surface of the bending portion 02 is 6 mm. The thickness of the thermally conductive spacer 103 is set based on the total thickness of the supporting component 101 and the heat dissipation layer 102 to ensure that the total thickness of the supporting component 101, the heat dissipation layer 102 and the thermally conductive spacer 103 stacked along the thickness direction of the display portion 01 is approximately 6 mm.

[0071] In addition, when the thickness of the thermally conductive spacer 103 to be set is relatively thin, for example, Figure 5 As shown, the thickness of the thermally conductive spacer 103 is in the range of 0.08 mm to 0.1 mm, and only one first thermally conductive layer 6 may be provided. In the case where the thickness of the thermally conductive spacer 103 to be provided is relatively thick, for example, Figure 6 As shown, the thickness of the thermally conductive spacer 103 is in the range of 0.1 mm to 0.15 mm, and a multilayer laminated structure of a first thermally conductive layer 6, a first heat sink 9 and a second thermally conductive layer 10 can be provided, wherein the addition of the first heat sink 9 can improve the supporting stability of the thermally conductive spacer 103 while achieving a thermal conductive effect.

[0072] In some embodiments, Figure 7As shown, when the display portion 01, the bending portion 02 and the binding portion 03 are located in the same plane, the display module 100 further includes a spacer layer 104. The spacer layer 104 is disposed on a side of the support assembly 101 and the heat dissipation layer 102 away from the display panel 1, and the surface of the spacer layer 104 away from the display panel 1 is parallel to the display panel 1.

[0073] For example, Figure 7 As shown, the spacer layer 104 includes a first protective layer 12, a second protective layer 13 and a buffer layer 14 which are stacked in sequence. The first protective layer 12 is disposed on the side of the first support member 2 away from the display panel 1, and its orthographic projection on the display panel 1 covers the portion of the first support member 2 exposed by the second support member 5. In addition, the surface of the first protective layer 12 away from the display panel 1 is flush with the surface of the second support member 5 away from the display panel 1, so as to fill the step H2 generated at the side wall of the second support member 5 away from the bending portion 02.

[0074] The second protective layer 13 is disposed on a side of the first protective layer 2 away from the display panel 1, and its orthographic projection on the display panel 1 covers the first protective layer 12 and the portion of the second support member 5 exposed by the heat dissipation layer 102. The surface of the second protective layer 13 away from the display panel 1 is flush with the surface of the heat dissipation layer 102 away from the display panel 1. Based on the structure of the first protective layer 12, the second protective layer 13 fills the step H3 generated at the side wall of the heat dissipation layer 102 away from the bent portion 02.

[0075] The buffer layer 14 is disposed on the side of the second protective layer 12 and the heat dissipation layer 102 away from the display panel 1, and covers the second protective layer 12 and the heat dissipation layer 102. The material used for the buffer layer 14 is elastic to provide a buffering effect, so as to avoid rigid contact between the roller and the second protective layer 12 and the heat dissipation layer 102 in the subsequent process of rolling the buffer layer 14 with a roller, thereby reducing the adverse effect of the poor surface flatness of the second protective layer 12 and / or the heat dissipation layer 102 on the surface flatness of the display panel 1. For example, the material used for the buffer layer 14 is foam.

[0076] The materials used for the first protective layer 12 and the second protective layer 13 are rigid materials to provide support for the buffer layer 14. For example, the rigid material includes thermoplastic polyester, such as PET (Polyethylene terephthalate) plastic or PBT (Polybutylene terephthalate) plastic. In this way, in the subsequent process of rolling the buffer layer 14 with a roller, the rigid first protective layer 12 and the second protective layer 13 can play a supporting role, so that the roller can roll smoothly from the first sub-display part 011 to the second sub-display part 012, thereby solving the problem that the corresponding area of ​​the display panel 1 produces film prints under the action of the extrusion force due to the roller extrusion of the area where the step difference H1 and H2 are located, affecting the flatness of the surface of the display panel 1, thereby improving the flatness of the display panel 1 and the product yield of the display module 100.

[0077] It should be explained that before the binding portion 03 of the display panel 1 is bent to the backlight side 002 of the display portion 01, the spacer layer 104 needs to be removed. The spacer layer 104 is configured to protect the surface flatness of the display panel 1 and improve the product yield of the display module. After removing the spacer layer 104, the binding portion 03 of the display panel 1 is bent to the backlight side 002 of the display portion 01, and the heat generated by the driver chip 11 is transferred to the heat dissipation layer 102 through the thermally conductive spacer 103 for heat dissipation.

[0078] The present disclosure also provides a display module assembly method, which is used to assemble the display module 100 provided by any of the above embodiments. Figure 8-Figure 9 As shown, the assembly method includes S10 to S80.

[0079] S10, sequentially bond the first support member 3, the second support member 5 and the heat dissipation layer 102 on the backlight side of the display panel 1. The display panel 1 includes a display portion 01, a bending portion 02 and a binding portion 03 connected in sequence. The display portion 01 includes a first sub-display portion 011 and a second sub-display portion 012; the second sub-display portion 012 is located between the first sub-display portion 011 and the bending portion 02, and is connected to the bending portion 02.

[0080] The above-mentioned S10 includes S11 to S12.

[0081] S11, such as Figure 8 As shown in (a) of FIG. 1 , a support assembly 101 is provided on the backlight side of the display unit 01. Figure 6 As shown, the support assembly 101 includes a first support member 3 and a second support member 5. Wherein, S11 includes S111-S114.

[0082] S111 , applying adhesive on the backlight side 002 of the display part 01 to form a second adhesive layer 2 .

[0083] S112, bonding the first support member 3 to the side of the second adhesive layer 2 away from the display unit 01, so as to fix the first support member 3 to the backlight side 002 of the display unit 01. The orthographic projection of the first support member 3 on the display panel 1 overlaps with the display unit 01, providing support for the display unit 01.

[0084] S113 , applying adhesive on a side of the first support member 3 away from the display portion 01 to form a third adhesive layer 4 .

[0085] S114, bonding the second support member 5 to the side of the third adhesive layer 4 away from the first support member 3, so as to fix the second support member 5 to the side of the first support member 3 away from the display part 01. The orthographic projection of the second support member 5 on the display panel 1 overlaps with the second sub-display part 012. In this way, the second support member 5 is only arranged on the backlight side 002 of the second sub-display part 012, and the first support member 3 and the second support member 5 jointly provide a rigid support for the second sub-display part 012, so as to facilitate the subsequent bonding of the binding part 03 to the backlight side 002 of the second sub-display part 012.

[0086] S12, such as Figure 8 As shown in (b), the heat dissipation layer 102 is disposed on the side of the second support member 5 away from the display panel 1. The heat dissipation layer 102 includes a second heat sink 7 and a first adhesive layer 8. Wherein, S12 includes S121-S122.

[0087] S121 , applying adhesive on a side of the second support member 5 away from the display panel 1 to form a first adhesive layer 8 .

[0088] S122 , bonding the second heat sink 7 to the side of the first adhesive layer 8 away from the support assembly 101 . The orthographic projection of the second heat sink 7 on the display panel 1 is within the orthographic projection range of the second support member 5 on the display panel 1 .

[0089] The area of ​​the second heat sink 7 is related to the area of ​​the second support member 5 and also to the area of ​​the battery in the display device 1000 , and only needs to ensure a good heat dissipation effect of the display panel 1 .

[0090] S20, such as Figure 8 As shown in (c) in FIG. 1 , a first protective layer 12 is provided in the area where the first support member 3 is exposed by the second support member 5. The first protective layer 12 is close to the side wall of the second support member 5 and abuts against the second support member 5, and the surface of the first protective layer 12 away from the display panel 1 is flush with the surface of the second support member 5 away from the display panel 1. In this way, based on the thickness H2 of the second support member 5, the first protective layer 12 fills the step H2 generated at the side wall of the second support member 5 away from the bending portion 02. The thickness of the second adhesive layer 4 can be ignored.

[0091] S30, such as Figure 8 As shown in (c), a second protective layer 13 is provided on the side of the first protective layer 12 away from the display panel 1 and in the area where the second support member 5 is exposed by the heat dissipation layer 102. The side wall of the second protective layer 13 close to the heat dissipation layer 102 abuts against the heat dissipation layer 102, and the surface of the second protective layer 13 away from the display panel 1 is flush with the surface of the heat dissipation layer 102 away from the display panel 1. In this way, based on the thickness H3 of the heat dissipation layer 102, the second protective layer 13 fills the step H3 generated at the side wall of the heat dissipation layer 102 away from the bending portion 02. The thickness of the first adhesive layer 8 can be ignored.

[0092] S40, such as Figure 8 As shown in (c), a buffer layer 14 is disposed on a side of the second protection layer 13 away from the display panel 1 and a side of the heat dissipation layer 102 away from the display panel 1. The buffer layer 14 is elastic and provides a buffering effect for subsequent processes.

[0093] S50, such as Figure 8 As shown in (c), a roller 15 is used to roll the surface of the buffer layer 14 away from the display panel 1, so that the stacked display panel 1, the support assembly 101 and the heat dissipation layer 102 covered by the buffer layer 14 are firmly bonded. Moreover, based on the filling effect of the first protective layer 12 and the second protective layer 13 on the step differences H2 and H3, the stress of the roller 15 rolling the buffer layer 14 corresponding to the step difference area is reduced, and the flatness of the display panel 1 is improved.

[0094] S60, such as Figure 8 As shown in (d) in FIG. 1 , a heat-conducting spacer 103 is disposed on a side of the binding portion 03 away from the plane where the light-emitting side 001 of the display portion 01 is located, including S61 to S63.

[0095] S61 , applying adhesive to a side of the binding portion 03 away from the plane where the light emitting side 001 of the display portion 01 is located, to form a first heat conducting layer 6 .

[0096] S62 , bonding the first heat sink 9 to a side of the first heat conducting layer 6 away from the binding portion 03 .

[0097] S63, coating adhesive on the side of the first heat sink 9 away from the binding portion 03 to form a second heat conducting layer 10. A release film is attached to the side of the second heat conducting layer 10 away from the first heat sink 9. The release film protects the second heat conducting layer 10 from being polluted by the external environment.

[0098] S70, such as Figure 8As shown in (e), the driver chip 11 is bound to the side of the binding portion 03 away from the thermally conductive spacer 103. The orthographic projection of the driver chip 11 on the binding portion 03 at least partially overlaps with the orthographic projection of the thermally conductive spacer 103 on the binding portion 03. For example, the orthographic projection of the driver chip 11 on the binding portion 03 is within the range of the orthographic projection of the thermally conductive spacer 103 on the binding portion 03.

[0099] It is understandable that the driver chip 11 is coupled to the pixel driving circuit in the display panel 1 to perform signal transmission and realize image display. The driver chip 11 includes at least one of the microchips such as the source driver chip, the timing controller, and the gamma circuit. For example, the positive projections of all the microchips on the binding part 03 are located within the range of the positive projections of the thermally conductive spacer 103 on the binding part 03, so as to transfer the heat generated by all the microchips to the thermally conductive spacer 103, thereby improving the thermal conductivity efficiency.

[0100] S80, such as Figure 8 As shown in (f) in FIG. 1 , the buffer layer 14, the second protective layer 13 and the first protective layer 12 are removed in sequence. Also, the release film on the second heat-conducting layer 10 is removed. Then, the bending portion 02 is bent, and the binding portion 03 is connected to the heat-dissipating layer 102 through the heat-conducting spacer 103. Among them, the second heat-conducting layer 10 is bonded to the second heat sink 7. In this way, all the heat generated by the microchip is transferred to the second heat sink 7 through the heat-conducting spacer 103, thereby improving the heat conduction efficiency.

[0101] It should be noted that the order of the steps of the assembly method provided in the above embodiment can be adaptively adjusted according to actual conditions, and the present disclosure does not limit this.

[0102] Based on this, Figure 7As shown, the assembly method of the display module 100 provided by the embodiment of the present disclosure is based on the structure of bonding the first support member 3 and the second support member 5 on the backlight side 002 of the display panel 1, and bonding the first protective layer 12 to eliminate the step difference H2 generated by the second support member 5 at the junction of the first sub-display part 011 and the second sub-display part 012. Further, the heat dissipation layer 102 is bonded to the side of the second support member 5 away from the display panel 1. Since the orthographic projection of the heat dissipation layer 102 on the plane where the second support member 5 is located is located within the range of the second support member 5, that is, the coverage range of the heat dissipation layer 102 is smaller than the coverage range of the second support member 5, there is a step difference H3 between the heat dissipation layer 102 and the second support member 5, and the step difference H3 depends on the thickness of the heat dissipation layer 102. Therefore, after bonding the first protective layer 12, the second protective layer 13 is bonded to eliminate the step difference H3 generated by the part of the heat dissipation layer 102 that exposes the second support member 5 and the first protective layer 12. Then, the buffer layer 14 is bonded. The buffer layer 14 can provide a buffering effect for the rolling of the roller to avoid rigid contact between the roller and the second protective layer 13 and the heat dissipation layer 102, thereby reducing the adverse effect of the poor surface flatness of the second protective layer 13 and / or the heat dissipation layer 102 on the surface flatness of the display panel 1.

[0103] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display module, characterized in that: include: The display panel comprises a display portion, a bending portion and a binding portion which are connected in sequence; the display portion has a light emitting side and a backlight side; The bending portion is bendable so that the binding portion is bent to the backlight side of the display portion; the display portion includes a first sub-display portion and a second sub-display portion, the first sub-display portion is bendable; the second sub-display portion is located between the first sub-display portion and the bending portion, and is connected to the bending portion; A driving chip is disposed on a side of the binding portion away from the display portion and is electrically connected to the binding portion; A supporting assembly, arranged on the backlight side of the display unit; The support assembly comprises: A first support member is disposed on the backlight side of the display portion, and an orthographic projection of the first support member on the plane where the display portion is located overlaps with the display portion; A second support member is disposed on a side of the first support member away from the display portion, and an orthographic projection of the second support member on the plane where the display portion is located overlaps with the second sub-display portion; A heat dissipation layer is arranged on a side of the support component away from the display portion; the orthographic projection of the heat dissipation layer on the plane where the second support member is located is located within the range of the second support member; a heat-conductive spacer, wherein when the binding portion is bent to the backlight side of the display portion, the heat-conductive spacer is located between the binding portion and the heat-dissipating layer; and an orthographic projection of the heat-conductive spacer on the heat-dissipating layer at least partially overlaps with an orthographic projection of the driving chip on the heat-dissipating layer; In the case where the display portion, the bending portion and the binding portion are located in the same plane, the display module further includes: The spacer layer is arranged on a side of the support assembly and the heat dissipation layer away from the display panel, and a surface of the spacer layer away from the display panel is parallel to the display panel.

2. The display module according to claim 1, characterized in that: The orthographic projection of the driving chip on the heat dissipation layer is located within the range of the orthographic projection of the thermal conductive spacer on the heat dissipation layer.

3. The display module according to claim 1, characterized in that: The thermally conductive spacer comprises: The first heat-conducting layer is disposed between the heat-dissipating layer and the binding portion, and is configured to connect the heat-dissipating layer and the binding portion.

4. The display module according to claim 3, characterized in that: The thermally conductive spacer further comprises: A first heat sink is arranged on a side of the first heat conducting layer away from the heat dissipation layer; The second heat-conducting layer is disposed between the first heat sink and the binding portion to connect the first heat sink and the binding portion.

5. The display module according to claim 4, characterized in that: The material used for the first heat-conducting layer includes at least one of thermally conductive glue, thermally conductive paste and thermally conductive grease; and / or, The material used for the second heat-conducting layer includes at least one of thermally conductive glue, thermally conductive paste and thermally conductive grease.

6. The display module according to any one of claims 1 to 5, characterized in that: The orthographic projection of the heat dissipation layer on the plane where the display portion is located is located within the range of the second sub-display portion.

7. The display module according to claim 6, characterized in that: The heat dissipation layer comprises: A second heat sink is arranged on a side of the support assembly away from the display portion; The first adhesive layer is disposed between the second heat sink and the support assembly and is configured to connect the second heat sink and the support assembly.

8. The display module according to claim 7, characterized in that: The material used for the second heat sink includes at least one of copper, silver, gold, graphite and boron nitride.

9. The display module according to claim 6, characterized in that: The orthographic projection of the heat dissipation layer on the plane where the second support member is located is located within the range of the second support member.

10. The display module according to claim 1, characterized in that: The spacer layer comprises: A first protective layer is disposed on a side of the first supporting member away from the display panel, and its orthographic projection on the display panel covers a portion of the first supporting member exposed by the second supporting member; a surface of the first protective layer away from the display panel is flush with a surface of the second supporting member away from the display panel; A second protective layer is disposed on a side of the first protective layer away from the display panel, and its orthographic projection on the display panel covers the first protective layer and the portion of the second supporting member exposed by the heat dissipation layer; a surface of the second protective layer away from the display panel is flush with a surface of the heat dissipation layer away from the display panel; The buffer layer is arranged on a side of the second protection layer and the heat dissipation layer away from the display panel, and covers the second protection layer and the heat dissipation layer.

11. The display module according to claim 10, characterized in that: The first protective layer and the second protective layer are made of rigid materials.

12. A method for assembling a display module, characterized in that: The assembly method comprises: A first support member, a second support member and a heat dissipation layer are sequentially bonded to the backlight side of the display panel; wherein the display panel comprises a display portion, a bending portion and a binding portion which are sequentially connected; an orthographic projection of the first support member on the display panel overlaps with the display portion, and the display portion comprises a first sub-display portion and a second sub-display portion; an orthographic projection of the second support member on the display panel overlaps with the second sub-display portion; and the heat dissipation layer is arranged on a side of the second support member away from the display panel; A first protective layer is disposed in an area of ​​the first supporting member exposed by the second supporting member; wherein the first protective layer abuts against the second supporting member near a side wall of the second supporting member, and a surface of the first protective layer away from the display panel is flush with a surface of the second supporting member away from the display panel; A second protective layer is disposed on a side of the first protective layer away from the display panel and in an area of ​​the second support member exposed by the heat dissipation layer; wherein a side wall of the second protective layer close to the heat dissipation layer abuts against the heat dissipation layer, and a surface of the second protective layer away from the display panel is flush with a surface of the heat dissipation layer away from the display panel; Disposing a buffer layer on a side of the second protective layer away from the display panel and a side of the heat dissipation layer away from the display panel; A roller is used to roll the surface of the buffer layer away from the display panel.

13. The assembly method according to claim 12, characterized in that: After rolling the surface of the buffer layer away from the display portion with a roller, the assembly method further includes: A heat-conducting spacer is arranged on a side of the binding portion away from the plane where the light-emitting side of the display portion is located; A driver chip is bound to the side of the binding portion away from the heat-conducting spacer; wherein the orthographic projection of the driver chip on the binding portion at least partially overlaps with the orthographic projection of the heat-conducting spacer on the binding portion; removing the buffer layer, the second protective layer and the first protective layer in sequence; The bending portion is bent, and the binding portion is connected to the heat dissipation layer through the thermally conductive spacer.

14. A display device, characterized in that: It comprises the display module as claimed in any one of claims 1 to 11.

Images