Semiconductor package

Abstract

Embodiments of the present invention provide a semiconductor package including an electronic element, a lens positioned on the electronic element, the lens contacting the electronic element, and a fixing element positioned in a receiving area of the lens to fix the lens and the electronic element. The present invention aims to provide a semiconductor package to optimize performance of the semiconductor package.

Description

Technical Field

[0001] Embodiments of this application relate to semiconductor packages. Background Technology

[0002] With the evolution of packaging technology, various packaging structures have emerged, and the overall packaging size has become smaller and smaller. For traditional complementary metal oxide semiconductor (CMOS) image sensors, a lens and a lid are usually combined to form a lens module to facilitate the transmission of external light to the sensor. Summary of the Invention

[0003] In view of the problems existing in related technologies, the purpose of this invention is to provide a semiconductor package to optimize the performance of the semiconductor package.

[0004] To achieve the above objectives, embodiments of the present invention provide a semiconductor package comprising: an electronic component; a lens located on the electronic component and in contact with the electronic component; and a fixing element located in the receiving area of ​​the lens to fix the lens and the electronic component.

[0005] In some embodiments, the lens contacts the sensing area of ​​the electronic component.

[0006] In some embodiments, the top surface of the fixing element is recessed relative to the top surface of the lens.

[0007] In some embodiments, the lens does not contact the sensing area of ​​the electronic component.

[0008] In some embodiments, a cavity exists between the sensing area and the lens.

[0009] In some embodiments, the top surface of the fixing element is flush with the top surface of the lens.

[0010] In some embodiments, a fixed element surrounds the sensing area.

[0011] In some embodiments, the receiving area is the entire circle surrounding the sensing area, such that the lens is divided into an inner circle lens and an outer circle lens, which are separated by the receiving area.

[0012] In some embodiments, the receiving area includes a plurality of channels surrounding the sensing area, the channels being non-interconnected, such that the lens is a single, non-separable piece.

[0013] In some embodiments, multiple trenches surround the entire circumference of the sensing area.

[0014] In some embodiments, the fixing element is light-blocking adhesive.

[0015] In some embodiments, the fixing element is a conductive adhesive and is electrically connected to electronic components.

[0016] In some embodiments, the system further includes: a substrate on which electronic components are disposed; and a molding compound encapsulating the substrate, electronic components, and lens.

[0017] In some embodiments, the molding compound is a light-blocking material.

[0018] In some embodiments, the device further includes: leads electrically connected from the upper surface of the electronic component to the substrate.

[0019] In some embodiments, molded compounds encapsulate the leads.

[0020] In some embodiments, the lower part of the contact electronic component of the fixing element has a first dimension in the horizontal direction, and the upper part of the fixing element has a second dimension in the horizontal direction, wherein the first dimension is larger than the second dimension.

[0021] In some embodiments, the first dimension of the lower portion has a maximum value at the location where it contacts the electronic component.

[0022] In some embodiments, starting from the upper surface of the electronic component, the lower first dimension first increases and then decreases in a direction away from the electronic component.

[0023] In some embodiments, the lens is glass.

[0024] In some embodiments, the electronic component is a chip. Attached Figure Description

[0025] The various aspects of the invention will be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard industrial practice, the components are not drawn to scale. In fact, for clarity of discussion, the dimensions of the components may be arbitrarily increased or decreased.

[0026] Figure 1 A schematic diagram of the structure of a semiconductor package according to an embodiment of this application is shown.

[0027] Figures 2A to 7 The process of forming a semiconductor package according to an embodiment of this application is illustrated.

[0028] Figures 8 to 10 The steps for forming a semiconductor package according to different embodiments of this application are illustrated.

[0029] Figure 11 Intermediate processes for forming semiconductor packages according to different embodiments of this application are illustrated. Detailed Implementation

[0030] To better understand the spirit of the embodiments of this application, the following description is based on some preferred embodiments of this application.

[0031] Embodiments of this application will be described in detail below. Throughout this specification, identical or similar components and components having identical or similar functions are indicated by similar reference numerals. The embodiments described herein with reference to the accompanying drawings are illustrative and diagrammatic in nature and are intended to provide a basic understanding of this application. The embodiments of this application should not be construed as limiting this application.

[0032] As used herein, the terms “approximately,” “generally,” “substantially,” and “about” are used to describe and indicate small variations. When used in conjunction with an event or situation, the terms may refer to examples in which the event or situation occurred precisely and examples in which the event or situation occurred very approximately. For example, when used in conjunction with numerical values, the terms may refer to a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values ​​is less than or equal to ±10% of the average of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then the two values ​​can be considered "substantially" the same.

[0033] In this specification, unless otherwise specified or limited, relative terms such as “central,” “longitudinal,” “lateral,” “front,” “rear,” “right,” “left,” “inner,” “outer,” “lower,” “higher,” “horizontal,” “vertical,” “above,” “below,” “above,” “below,” “top,” “bottom,” and their derivatives (e.g., “horizontally,” “downward,” “upward,” etc.) should be interpreted as referring to the directions described in the discussion or depicted in the accompanying drawings. These relative terms are used for descriptive convenience only and do not require that this application be constructed or operated in a particular orientation.

[0034] Additionally, quantities, ratios, and other numerical values ​​are sometimes presented in range format in this document. It should be understood that such range format is for convenience and brevity and should be interpreted flexibly to include not only the numerical values ​​explicitly specified as range limits, but also all individual numerical values ​​or subranges covered within the range, as if each numerical value and subrange were explicitly specified.

[0035] Furthermore, for ease of description, "first," "second," "third," etc., can be used in this article to distinguish different components of a figure or a series of figures. "First," "second," "third," etc., are not intended to describe the corresponding components.

[0036] Current semiconductor packaging structures suffer from uneven internal component height control, leading to yield losses in subsequent molding processes. When the glass substrate is mounted onto the application-specific integrated circuit (ASIC) chip, there is a risk of adhesive overflow, causing the sensing area or wire bonding area to be covered with adhesive, resulting in yield losses. Furthermore, adhesive overflow caused by capillary action is difficult to control, and the height tolerance of the uneven bond line thickness (BLT) depends on the force applied during component bonding. Even with advancements in process technology, the issue of uneven bond line thickness persists, and the thickness of the package itself cannot be reduced.

[0037] The semiconductor package of this application will now be described in detail with reference to the accompanying drawings.

[0038] join Figure 1 An embodiment of the present invention provides a semiconductor package 100, comprising: an electronic component 10; a lens 12 located on the electronic component 10 and in contact with the electronic component 10; and a fixing element 14 located in a receiving area of ​​the lens 12 to fix the lens 12 and the electronic component 10. In some embodiments, the electronic component 10 is a wafer (e.g., an application-specific integrated circuit (ASIC) chip).

[0039] In some embodiments, the lens 12 contacts the sensing area 16 of the electronic component 10. In some embodiments, the top surface of the fixing element 14 is recessed relative to the top surface of the lens 12. In some embodiments, the fixing element 14 surrounds the sensing area 16. In some embodiments, the fixing element 14 is a light-blocking adhesive. In some embodiments, the fixing element 14 is a conductive adhesive and is electrically connected to the electronic component 10. Other electronic components (including passive or active components, such as those used for fingerprint recognition) may be formed on the lens 12 and electrically connected to the fixing element 14, which is a conductive adhesive. The diameter of the conductive adhesive may be, for example, between 100 μm and 200 μm. In some embodiments, the system further includes: a substrate 18 on which the electronic component 10 is disposed; and a molding compound 20 encapsulating the substrate 18, the electronic component 10, and the lens 12. In some embodiments, the molding compound 20 is a light-blocking material. In some embodiments, the system further includes: a lead 22 electrically connected from the upper surface of the electronic component 10 to the substrate 18. In some embodiments, the molding compound 20 encapsulates the lead 22. In some embodiments, the lower portion 141 of the fixing element 14 that contacts the electronic element 10 has a first dimension in the horizontal direction, and the upper portion 142 of the fixing element 14 has a second dimension in the horizontal direction, wherein the first dimension is larger than the second dimension. In some embodiments, the first dimension of the lower portion 141 has a maximum value at the position where it contacts the electronic element 10. In some embodiments, the lens 12 is glass.

[0040] The embodiments of this application solve the BLT problem of glass arrangements with adhesive layers by placing the lens 12 directly on the electronic component 10 without BLT. This application directly uses the lens 12 to abut against the electronic component 10 and then fixes it by a fixing element 14, wherein the fixing element 14 can be disposed within the lens by creating an opening in the lens 12 (e.g., through an etching process). The fabrication process of the semiconductor device 100 of this application is described in detail below.

[0041] See Figures 2A to 2C ,in, Figure 2A yes Figure 2B and Figure 2C Top view, Figure 2B and Figure 2C Different embodiments are shown. An opening is made in the lens 12 to form a receiving region 22. In some embodiments, the receiving region 22 includes a plurality of non-intersecting slots 24, such that the lens 10 is a single, non-separable piece. In some embodiments, the lower portion of the receiving region 22 is larger than its upper portion. Figure 2B In the illustrated embodiment, the lens 12 has the same thickness both inside and outside the receiving region 22. Figure 2CIn the illustrated embodiment, the lens 12 has different thicknesses inside and outside the receiving region 22. In some embodiments, the lens 12 can be perforated using an etching process, including dry etching and wet etching. Dry etching produces more regular shapes, while wet etching is faster and can etch multiple lenses at once, but the shapes are more irregular compared to dry etching. In the embodiments of this application, dry etching is preferably used to form the upper part of the receiving region 22, while either dry or wet etching can be used to form the lower part of the receiving region 22.

[0042] See each corresponding to Figures 2A to 2C of Figures 3A to 3C Lens 12 is placed on tape 30.

[0043] See each corresponding to Figures 2A to 2C and Figures 3A to 3C of Figures 4A to 4C The fixing element 14 is placed in the receiving area 22 of the lens 12.

[0044] See each corresponding to Figures 2A to 2C , Figures 3A to 3C and Figures 4A to 4C of Figures 5A to 5C The lens 12 and the fixing element 14 within the lens 12 are transferred to the electronic component 10 located on the substrate 18. The lens 12 and the electronic component 10 are in direct contact, and the fixing element 14 simultaneously contacts both the lens 12 and the electronic component 10. A lead 22 is electrically connected from the upper surface of the electronic component 10 to the substrate 18. Figure 5B In the illustrated embodiment, the lens 12 and the sensing area 16 of the electronic component 10 are in direct contact. Figure 5C In the embodiment shown, the lens 12 and the sensing area 16 of the electronic component 10 are separated to avoid damage to the sensing area 16 by the lens 12, and a cavity 50 exists between the sensing area 16 and the lens 12.

[0045] join Figure 6 , Figure 1 and Figure 7 , Figure 6 Corresponding to Figure 2A , Figure 3A , Figure 4A and Figure 5A , Figure 1 Corresponding to Figure 2B , Figure 3B , Figure 4B and Figure 5B , Figure 7 Corresponding to Figure 2C , Figure 3C , Figure 4C and Figure 5CA molding compound 20 is formed to cover the electronic component 10, the lens 12, and the substrate 18. In some embodiments, the lens 12 does not contact the sensing area 16 of the electronic component 10. In some embodiments, the first dimension of the lower portion 141 of the fixing element 14 increases and then decreases in a direction away from the electronic component 10, starting from the upper surface of the electronic component 10. In some embodiments, the top surface of the fixing element 14 is flush with the top surface of the lens 12.

[0046] In some embodiments, see Figure 8 In the illustrated embodiment, lens 12 is first placed on tape 30. See also Figure 9 The lens 12 is etched to form the receiving region 22. In this embodiment, the receiving region 22 can be a complete circle surrounding the sensing area, such that the lens 12 is divided into an inner ring lens and an outer ring lens by the receiving region 22. See also Figure 10 A fixing element 14 is formed in the accommodating area 22. When combined with the electronic component 10, the fixing element 14 is slightly melted upon initial contact with the electronic component 10, so that the fixing element 14 adheres to the chip to prevent displacement.

[0047] See Figure 11 In some embodiments, when forming the plurality of grooves 24, the plurality of grooves 24 are formed in a complete circle around the center of the lens 12, such that after the subsequent formation of the fixing element 14, the fixing element surrounds the entire circumference of the sensing area 16, and the fixing element 14 may be a light-blocking adhesive. In embodiments where the fixing element 14 is a light-blocking adhesive surrounding the entire circumference of the sensing area 16, the molding compound 20 may be a material with poor light-blocking properties or even transparent.

[0048] In this application, the accommodating area is etched, and the pattern of this accommodating area can be varied according to product requirements. This area can be a closed pattern or multiple overlapping pattern areas to accommodate light-blocking adhesive and block stray light from entering. Alternatively, it can be used in conjunction with conductive adhesive for electrical connection paths, thus allowing for patterned circuitry tailored to circuit requirements, facilitating connections with other components. In this application, the embodiment utilizes photoresist or conductive adhesive formed in trenches to prevent adhesive diffusion. There is no adhesive present in the electronic component 10 and lens 12, avoiding BLT (bulk adhesion time) and adhesive overflow problems. Therefore, the semiconductor package of this application does not require an additional reserved adhesive overflow area, reducing package size and eliminating the need for BLT control, thus increasing process stability.

[0049] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A semiconductor package, characterized in that, include: Electronic components, with sensing areas; A lens is located on the electronic component, and the lens contacts the electronic component; A fixing element surrounds the sensing area and is located within the receiving area of ​​the lens to fix the lens and the electronic component, wherein the fixing element is disposed within the lens, and the side of the fixing element remote from the sensing area is in complete contact with and completely enveloped by the lens. The lens contacts the sensing area of ​​the electronic component, and the top surface of the fixing element is recessed relative to the top surface of the lens. In this embodiment, along the direction away from the electronic component, the size of the lower part of the fixing element first increases and then decreases, and in this embodiment, the receiving area includes a plurality of through slots surrounding the sensing area, the plurality of through slots being non-interconnected, so that the lens is a single piece that cannot be separated, and the receiving area is composed of multiple overlapping patterned areas to configure light-blocking adhesive to block stray light from entering, and is also used in conjunction with conductive adhesive for electrical connection paths.

2. The semiconductor package according to claim 1, characterized in that, The plurality of through slots surround the entire circumference of the sensing area.

3. A semiconductor package, characterized in that, include: Electronic components, with sensing areas; A lens is located on the electronic component, and the lens contacts the electronic component; A fixing element surrounds the sensing area and is located within the receiving area of ​​the lens to fix the lens and the electronic component, wherein the fixing element is disposed within the lens, and the side of the fixing element remote from the sensing area is in complete contact with and completely enveloped by the lens. The lens contacts the sensing area of ​​the electronic component, and the top surface of the fixing element is recessed relative to the top surface of the lens. In this embodiment, along the direction away from the electronic component, the size of the lower part of the fixing element first increases and then decreases, and the accommodating area is a complete circle surrounding the sensing area, such that the lens is divided into an inner circle lens and an outer circle lens by the accommodating area, and the accommodating area is configured with light-blocking adhesive to block stray light from entering, and is used in conjunction with conductive adhesive for electrical connection path.

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