Headphone Jack and Electronic Device

Abstract

The present application discloses a headphone socket and an electronic device, belonging to the technical field of headphone devices. Among them, the headphone socket includes: a circuit board and a first terminal disposed on the circuit board; wherein, a receiving groove is provided on the circuit board; the first terminal includes: a pin connected to the circuit board, an elastic member connected to the pin, and an end portion connected to the elastic member; the receiving groove and the end portion of the first terminal enclose a receiving space, and the receiving space can accommodate a headphone plug; when the headphone plug is located in the receiving space, the elastic member of the first terminal is in an elastically deformed state.

Description

Technical Field

[0001] This application belongs to the technical field of headphone devices, and particularly relates to a headphone socket and an electronic device. Background Art

[0002] Generally, a headphone socket body is soldered on the circuit board of an electronic device, and at least one terminal electrically connected to the circuit board is arranged in the headphone socket body. In this way, a user can insert the headphone plug of a headphone into the headphone socket body so that the at least one terminal is electrically connected to the plug, and thus the user can listen to the audio in the electronic device through the headphone.

[0003] However, since the size (such as thickness) of the headphone socket body is large, the headphone socket body occupies a large space inside the electronic device, and thus the size of the electronic device is large. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide a headphone socket and an electronic device, which can solve the problem of the large size of the electronic device.

[0005] In a first aspect, the embodiments of this application provide a headphone socket, which includes: a circuit board and a first terminal arranged on the circuit board; wherein, a receiving groove is arranged on the circuit board; the first terminal includes: a pin connected to the circuit board, an elastic member connected to the pin, and an end portion connected to the elastic member; the receiving groove and the end portion of the first terminal enclose a receiving space, and the receiving space can accommodate a headphone plug; when the headphone plug is located in the receiving space, the elastic member of the first terminal is in an elastically deformed state.

[0006] In a second aspect, the embodiments of this application provide an electronic device, which includes the headphone socket as described in the first aspect.

[0007] In the embodiments of this application, the headphone socket of the electronic device includes: a circuit board and a first terminal arranged on the circuit board, and the first terminal includes: a pin connected to the circuit board, an elastic member connected to the pin, and an end portion connected to the elastic member. Thus, the receiving groove arranged on the circuit board and the end portion of the first terminal can enclose a receiving space that can accommodate a headphone plug, and when the headphone plug is located in the receiving space, the elastic members of the first terminal are all in an elastically deformed state. Since the receiving groove of the circuit board of the headphone socket and the end portion of the first terminal can enclose a receiving space that can accommodate a headphone plug, and the elastic member of the first terminal can apply an elastic restoring force to the headphone plug through the end portion of the first terminal to fix the headphone plug, without the need to arrange a headphone socket body, the space inside the electronic device occupied by the headphone socket can be reduced. In this way, the size of the electronic device can be reduced. Description of the Drawings

[0008] Figure 1 is one of the schematic structural diagrams of the headphone socket provided by the embodiments of the present application;

[0009] Figure 2 is one of the schematic structural diagrams of the first terminal of the headphone socket provided by the embodiments of the present application;

[0010] Figure 3 is the second of the schematic structural diagrams of the headphone socket provided by the embodiments of the present application;

[0011] Figure 4 is the schematic structural diagram of the second terminal of the headphone socket provided by the embodiments of the present application;

[0012] Figure 5 is the second of the schematic structural diagrams of the first terminal of the headphone socket provided by the embodiments of the present application;

[0013] Figure 6 is the schematic structural diagram of the second sub-terminal or the third sub-terminal of the headphone socket provided by the embodiments of the present application;

[0014] Figure 7 is the third of the schematic structural diagrams of the first terminal of the headphone socket provided by the embodiments of the present application;

[0015] Figure 8 is the third of the schematic structural diagrams of the headphone socket provided by the embodiments of the present application;

[0016] Figure 9 is one of the schematic structural diagrams of the clamping structure of the headphone socket provided by the embodiments of the present application;

[0017] Figure 10 is the second of the schematic structural diagrams of the clamping structure of the headphone socket provided by the embodiments of the present application;

[0018] Figure 11 is the schematic structural diagram of the first clamping unit and the second clamping unit of the headphone socket provided by the embodiments of the present application;

[0019] Figure 12 is the schematic structural diagram of the electronic device provided by the embodiments of the present application. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application belong to the scope of protection of the present application.

[0021] The terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of this application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same category, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally represents an "or" relationship between the associated objects before and after.

[0022] The following will combine the accompanying drawings to describe in detail the headphone jack and electronic device provided by the embodiments of this application through specific embodiments and their application scenarios.

[0023] Figure 1 The following shows a possible structural schematic diagram of a headphone jack provided by an embodiment of this application, as Figure 1 shown, the headphone jack 10 includes a circuit board 11 and a first terminal 12 disposed on the circuit board 11.

[0024] Optionally, in the embodiments of this application, the above-mentioned circuit board 11 may specifically be: a rigid printed circuit board (PCB) board.

[0025] In the embodiments of this application, in combination with Figure 1 , a receiving groove 13 is provided on the above-mentioned circuit board 11.

[0026] Optionally, in the embodiments of this application, the shape of the above-mentioned receiving groove 13 may include any one of the following: rectangle, circle, semicircle, triangle, polygon, irregular shape, etc. The size of the receiving groove 13 is greater than or equal to the size of the headphone plug.

[0027] Further optionally, in the embodiments of this application, the groove width of the receiving groove 13 (that is, the distance between two non-adjacent edge lines of the receiving groove 13) is greater than or equal to the diameter of the headphone plug; the groove depth of the receiving groove 13 (that is, the distance from the groove opening to the groove bottom of the receiving groove 13) is greater than or equal to the length of the headphone plug.

[0028] Optionally, in the embodiments of this application, in combination with Figure 1 , the above-mentioned first terminal 12 may include at least one sub-terminal, and the at least one sub-terminal may include at least one of the following: left channel terminal, right channel terminal, ground terminal, microphone terminal, switch terminal, etc. Each of the at least one sub-terminals is different. It should be noted that Figure 1 shows an example where the first terminal 12 includes three sub-terminals.

[0029] It should be noted that for the description of the "left channel terminal, right channel terminal, ground terminal, microphone terminal, switch terminal", reference can be made to the specific description in the related art, and the embodiments of the present application will not elaborate herein.

[0030] Optionally, in the embodiments of the present application, the above-mentioned first terminal 12 can be made of an elastic metal material.

[0031] Optionally, in the embodiments of the present application, the above-mentioned first terminal 12 can be soldered to the circuit board 11.

[0032] In the embodiments of the present application, the above-mentioned first terminal 12 includes: a pin connected to the circuit board 11, an elastic member connected to the pin, and an end portion connected to the elastic member.

[0033] Optionally, in the embodiments of the present application, the first terminal 12 can be soldered to the circuit board 11 through the pin.

[0034] It should be noted that in order to more clearly illustrate the structure of the headphone socket 10, Figure 2 the structural schematic diagram of the first terminal 12 of the headphone socket 10 provided by the embodiments of the present application is shown. As Figure 2 shown, the first terminal 12 includes: a pin 14 connected to the circuit board 11, an elastic member 15 connected to the pin 14, and an end portion 16 connected to the elastic member 15.

[0035] Optionally, in the embodiments of the present application, the pin 14, elastic member 15 and end portion 16 of the first terminal 12 can be made of any one of the following materials: elastic metal material, alloy material, conductive plastic material, etc.

[0036] Optionally, in the embodiments of the present application, the elastic member 15 of the first terminal 12 can be made of an elastic metal material.

[0037] Optionally, in the embodiments of the present application, the pin 14 of the first terminal 12 can be soldered to the circuit board 11.

[0038] In the embodiments of the present application, in combination with Figure 1 , the above-mentioned accommodation groove 13 and the end portion 16 of the first terminal 12 enclose an accommodation space 17, and the accommodation space 17 can accommodate a headphone plug; when the headphone plug is located in the accommodation space 17, the elastic member 15 of the first terminal 12 is in an elastically deformed state.

[0039] It can be understood that when the headphone plug is located in the accommodation space 17, the end 16 of the first terminal is electrically connected to the headphone plug, so that the user can listen to the audio in the electronic device through the headphones; and further, the elastic member 15 of each first terminal 12 can apply an elastic restoring force to the headphone plug through the end 16 of the first terminal 12, so that the headphone plug is not easily shaken and the end 16 of the first terminal 12 can be in close contact with the headphone plug.

[0040] Optionally, in the embodiment of the present application, when the first terminal 12 includes a plurality of sub-terminals, the plurality of sub-terminals may include one type of sub-terminal (for example, the first sub-terminal in the following embodiment) and / or another type of sub-terminal (for example, the second sub-terminal and the third sub-terminal in the following embodiment). Among them, the one type of sub-terminal may include one elastic member, and the another type of sub-terminal may include a plurality of elastic members; when the headphone plug is located in the accommodation space 17, the plurality of elastic members of the another type of sub-terminal are in contact with each other.

[0041] It can be understood that the first terminals 12 may all be of one type of sub-terminal; or all of another type of sub-terminal; or, a part is of one type of sub-terminal and another part is of another type of sub-terminal.

[0042] Specifically, in the embodiment of the present application, the another type of sub-terminal may include at least one of the following: a microphone terminal, a switch terminal, etc.

[0043] Optionally, in the embodiment of the present application, in combination with Figure 1 , as Figure 3 shown, the above-mentioned headphone socket 10 further includes: a second terminal 18 disposed on the circuit board 11; wherein, the accommodation groove 13, the end 16 of the first terminal 12 and the second terminal 18 enclose an accommodation space 17.

[0044] Further optionally, in the embodiment of the present application, the above-mentioned second terminal 18 may include at least one of the following: a left channel terminal, a right channel terminal, a ground terminal, a microphone terminal, a switch terminal, etc. Among them, the second terminal 18 is different from the first terminal 12.

[0045] Further optionally, in the embodiment of the present application, the above-mentioned second terminal 18 may be made of an elastic metal material.

[0046] Further optionally, in the embodiment of the present application, the above-mentioned second terminal 18 may be soldered to the circuit board 11.

[0047] Further optionally, in the embodiment of the present application, the above-mentioned second terminal 18 is disposed at a position on either side of the circuit board 11 where the accommodation groove 13 is located.

[0048] It should be noted that the "position on either side of the receiving groove 13" mentioned above can be understood as: the position within the preset range of any one of the two non-adjacent edge lines of the receiving groove 13.

[0049] Optionally, in the embodiments of the present application, in combination with Figure 3 , as Figure 4 shown, the above-mentioned second terminal 18 includes: a first pin 19 and a third elastic member 20; wherein, the above-mentioned first pin 20 is connected to the first surface of the circuit board 11; the above-mentioned third elastic member 20 is parallel to the first surface, and the third elastic member 20 is connected to the first pin 19; when the headphone plug is located in the receiving space 17, the third elastic member 20 is in an elastically deformed state.

[0050] It can be understood that when the headphone plug is located in the receiving space 17, the third elastic member 20 is electrically connected to the headphone plug, so that the user can listen to the audio in the electronic device through the headphones; and further, the third elastic member 20 can apply an elastic restoring force to the headphone plug, so that the headphone plug is not easily shaken, and the third elastic member 20 can be in close contact with the headphone plug.

[0051] The headphone socket provided by the embodiments of the present application includes: a circuit board and a first terminal provided on the circuit board. The first terminal includes: a pin connected to the circuit board, an elastic member connected to the pin, and an end connected to the elastic member. Thus, the receiving groove provided on the circuit board and the end of the first terminal can enclose a receiving space for accommodating the headphone plug, and when the headphone plug is located in the receiving space, the elastic members of the first terminal are all in an elastically deformed state. Since the receiving groove of the circuit board of the headphone socket and the end of the first terminal can enclose a receiving space for accommodating the headphone plug, and the elastic members of the first terminal can apply an elastic restoring force to the headphone plug through the end of the first terminal to fix the headphone plug, without setting a headphone seat body, therefore, the space occupied by the headphone socket inside the electronic device can be reduced, and thus, the size of the electronic device can be reduced.

[0052] Next, taking the first terminal 12 including the above-mentioned another sub-terminal as an example, an example will be given for the position structure of the first terminal 12.

[0053] Optionally, in the embodiments of the present application, the above-mentioned first terminal 12 includes another sub-terminal. Specifically, as Figure 5 shown, the above-mentioned first terminal 12 includes: a second sub-terminal 21 and a third sub-terminal 22; wherein, the above-mentioned second sub-terminal 21 and the third sub-terminal 22 are symmetrically arranged at positions on both sides of the circuit board 11 where the receiving groove 13 is located.

[0054] It should be noted that the "positions on both sides of the receiving groove 13" mentioned above can be understood as: the positions within the preset range of the first edge line of the receiving groove 13 and the positions within the preset range of the second edge line of the receiving groove 13. Wherein, the first edge line and the second edge line are two non-adjacent edge lines of the receiving groove 13.

[0055] Further optionally, in the embodiment of the present application, the distance between the second sub-terminal 21 and the third sub-terminal 22 is less than or equal to the diameter of the headphone plug.

[0056] It can be understood that when the headphone plug is located in the receiving space 17, both the second sub-terminal 21 and the third sub-terminal 22 are electrically connected to the headphone plug, so that the user can listen to the audio in the electronic device through the headphones; and, both the second sub-terminal 21 and the third sub-terminal 22 are in an elastically deformed state, so that the second sub-terminal 21 and the third sub-terminal 22 can apply an elastic restoring force to the headphone plug, so that the headphone plug is not easy to shake, and the second sub-terminal 21 and the third sub-terminal 22 can be in close contact with the headphone plug.

[0057] Thus, it can be seen that since the first terminal includes the second sub-terminal and the third sub-terminal, and the second sub-terminal and the third sub-terminal are symmetrically arranged at the positions on both sides of the circuit board located in the receiving groove, in this way, when the headphone plug is located in the receiving space, the second sub-terminal and the third sub-terminal are also symmetrically located on both sides of the headphone plug and apply an elastic restoring force to the headphone plug to better clamp the headphone plug. Therefore, the stability of the headphone socket for fixing the headphone plug can be improved.

[0058] Hereinafter, taking any one of the second sub-terminal and the third sub-terminal as an example, the structures of the second sub-terminal and the third sub-terminal will be exemplified.

[0059] Optionally, in the embodiment of the present application, in combination with Figure 5 , as Figure 6 shown, the elastic members of the fourth sub-terminal include: a first elastic member 23 and a second elastic member 24; the end portion 25 of the fourth sub-terminal is arranged on the second elastic member 24; wherein, the pin 26 of the fourth sub-terminal is connected to the first surface of the circuit board 11; the first elastic member 23 is parallel to the first surface, the first end of the first elastic member 23 is connected to the pin 26 of the fourth sub-terminal, and the second end of the first elastic member 23 is connected to the second elastic member 24; the second elastic member 24 is parallel to the first elastic member 23; when the headphone plug is located in the receiving space 17, both the first elastic member 23 and the second elastic member 24 are in an elastically deformed state, and the second elastic member 24 is in contact with the first elastic member 23.

[0060] In the embodiment of the present application, the fourth sub-terminal is: the second sub-terminal 21 or the third sub-terminal 22.

[0061] Further optionally, in the embodiments of the present application, the pin 26 of the fourth sub-terminal and the second elastic member 24 may both be made of a conductive material.

[0062] Exemplarily, the first elastic member 23 and the second elastic member 24 may both be made of an elastic metal material.

[0063] It can be understood that when the headphone plug is located in the accommodation space 17, the first elastic member 23 is electrically connected to the headphone plug through the second elastic member 24, so that the user can listen to the audio in the electronic device through the headphones; and, the first elastic member 23 and the second elastic member 24 can apply an elastic restoring force to the headphone plug, so that the headphone plug is not easily shaken, and the second elastic member 24 can be in close contact with the headphone plug.

[0064] Thus, it can be seen that since the elastic member of any sub-terminal includes a first elastic member and a second elastic member, in this way, when the headphone plug is located in the accommodation space, the first elastic member and the second elastic member can apply an elastic restoring force to the headphone plug. Therefore, the stability of the headphone socket for fixing the headphone plug can be improved.

[0065] Next, taking the first terminal 12 including the above-mentioned one type of sub-terminal as an example, the position structure of the first terminal 12 will be illustrated by way of example.

[0066] Optionally, in the embodiments of the present application, in combination with Figure 1 , as Figure 7 shown, the first terminal 12 includes a plurality of first sub-terminals 27, and the plurality of first sub-terminals 27 are symmetrically arranged at positions on both sides of the circuit board 11 where the accommodation groove 13 is located.

[0067] Thus, it can be seen that since the plurality of first sub-terminals are symmetrically arranged at positions on both sides of the circuit board where the accommodation groove is located, in this way, when the headphone plug is located in the accommodation space, the plurality of first sub-terminals are also symmetrically located on both sides of the headphone plug and apply an elastic restoring force to the headphone plug to better clamp the headphone plug. Therefore, the stability of the headphone socket for fixing the headphone plug can be improved.

[0068] Optionally, in the embodiments of the present application, the pin 14 is connected to the first surface; the first end of the elastic member 15 is connected to the pin 14; the second end of the elastic member 15 passes through the accommodation groove 13 and is connected to the end portion 16.

[0069] It can be understood that the pin 14 and the end portion 16 are located on different sides of the circuit board 11. When the first terminal 12 includes a plurality of sub-terminals (i.e., a plurality of first sub-terminals, or second sub-terminals and third sub-terminals), different elastic members 15 can apply elastic restoring forces in different directions to the headphone plug through the different end portions 16, thereby improving the stability of the headphone socket for fixing the headphone plug.

[0070] Thus, it can be seen that since the elastic member and the end portion are located on different sides of the circuit board, in this way, elastic restoring forces in different directions can be applied to the headphone plug through the elastic member and the end portion. Therefore, the stability of the headphone socket for fixing the headphone plug can be improved.

[0071] Optionally, in the embodiments of the present application, in order to further improve the stability of the headphone socket 10 for fixing the headphone plug, a clamping device (such as the clamping structure in the following embodiments) may also be provided on the circuit board 11, so that when the headphone plug is located in the accommodation space 17, the clamping device can clamp the headphone plug.

[0072] Next, an example will be given for the position structure of the clamping structure.

[0073] Optionally, in the embodiments of the present application, as Figure 8 shown, the headphone socket 10 further includes: a clamping structure 28 provided on the circuit board 11.

[0074] In the embodiments of the present application, the above-mentioned clamping structure 28 encloses a clamping space for clamping the headphone plug, and the clamping space is provided at a first position of the accommodation space 17; the first position includes any one of the following: a position at the notch of the accommodation groove 13, a position at the bottom of the accommodation groove 13, and a position between the notch and the bottom of the accommodation groove 13.

[0075] Further optionally, in the embodiments of the present application, the clamping structure may be made of a metal material.

[0076] Further optionally, in a possible implementation manner of the present application, the above-mentioned clamping structure includes at least one clamping unit. The first end of the first clamping unit in the at least one clamping unit is fixedly connected to the first surface (or the second surface) of the circuit board 11, and the second end of the first clamping unit is fixedly connected to the first end of the second clamping unit; the second end of the second clamping unit is fixedly connected to the first end of the third clamping unit, and the second end of the third clamping unit is fixedly connected to the first end of the fourth clamping unit, and so on, until the second end of the last clamping unit is fixedly connected to the first surface (or the second surface) of the circuit board 11.

[0077] It can be understood that at least one clamping unit is fixedly connected end to end in sequence, and both the first clamping unit and the last clamping unit are fixedly connected to the same surface of the circuit board 11 to enclose a clamping space.

[0078] Specifically, for each clamping unit among at least one clamping unit, a clamping unit can specifically be: a fixing piece.

[0079] Specifically, one end of the first clamping unit is connected to a position on one side of the receiving groove 13 on the first surface (or the second surface), and the other end of the first clamping unit is connected to a position on the other side of the receiving groove 13 on the first surface (or the second surface).

[0080] Further optionally, in another possible implementation manner of the present application, both ends of the first clamping unit of the clamping structure 28 are fixedly connected to the first surface (or the second surface) of the circuit board 11, both ends of the second clamping unit are fixedly connected to the first surface (or the second surface) of the circuit board 11, and so on, until both ends of the last clamping structure are fixedly connected to the first surface (or the second surface) of the circuit board 11.

[0081] It can be understood that both the head and the tail of each clamping unit of the clamping structure are fixedly connected to the same surface of the circuit board 11 to enclose a clamping space.

[0082] Further optionally, in yet another possible implementation manner of the present application, both ends of the i-th clamping unit of the clamping structure 28 are fixedly connected to one surface of the circuit board 11, and both ends of the (i + 1)-th clamping unit are fixedly connected to the other surface of the circuit board 11, where i is a positive odd number.

[0083] It can be understood that both ends of a part of the clamping units of the clamping structure 28 are fixedly connected to one surface of the circuit board 11, and both ends of another part of the clamping units are fixedly connected to the other surface of the circuit board 11 to enclose a clamping space.

[0084] Thus, it can be known that since there is also a clamping structure on the circuit board that encloses a clamping space for clamping the headphone plug, and this clamping space is set at the position of the notch of the receiving groove 13 (or at the bottom of the receiving groove 13, or at the position between the notch and the bottom of the receiving groove 13) in the receiving space, in this way, when the headphone plug is located in the receiving space and the clamping space, the headphone plug can be fixed by this receiving space and the clamping space, and there is no need to set up a headphone socket body. Therefore, the space occupied by the headphone socket inside the electronic device can be reduced.

[0085] Hereinafter, taking the i-th clamping unit as the first clamping unit and the (i + 1)-th clamping unit as the second clamping unit as an example, the position structure of the clamping structure will be exemplified.

[0086] Optionally, in the embodiments of the present application, asFigure 9 As shown, the above clamping structure 28 includes: a first clamping unit 29 and a second clamping unit 30; wherein, the first clamping unit 29 includes: a first connecting portion 31 and a first clamping portion 32; the second clamping unit 30 includes: a second connecting portion 33 and a second clamping portion 34.

[0087] In the embodiment of the present application, in combination with Figure 9 , as Figure 10 shown, the first clamping unit 29 is connected to the first surface 35 of the circuit board 11 through the first connecting portion 31, and the second clamping unit 30 is connected to the second surface 36 of the circuit board 11 through the second connecting portion 33. The second surface 36 is: the surface of the circuit board 11 far from the first surface 35; the first clamping portion 32 and the second clamping portion 34 enclose a clamping space 37.

[0088] Further optionally, in the embodiment of the present application, the first connecting portion 31 may specifically be: a metal fixing piece.

[0089] Optionally, in the embodiment of the present application, the first clamping portion 32 is bent along a first direction to form an arc surface, and the first direction is: the direction from the second surface 36 to the first surface 35; wherein, the second clamping portion 34 is bent along a second direction to form an arc surface, and the second direction is opposite to the first direction.

[0090] It should be noted that, in order to more clearly illustrate the structure of the clamping structure 28, Figure 11 the structural schematic diagrams of the first clamping unit and the second clamping unit of the clamping structure 28 provided in the embodiment of the present application are shown. As Figure 11 shown, the first clamping portion 32 of the first clamping unit 29 is bent along a first direction 38 to form an arc surface, and the second clamping portion 34 of the second clamping unit 30 is bent along a second direction 39 to form an arc surface. The second direction 39 is opposite to the first direction 38, so that the clamping space can clamp the headphone plug 40 in different directions.

[0091] Thus, it can be seen that since the clamping structure includes a first clamping unit and a second clamping unit connected to different surfaces of the circuit board, and the first clamping portion of the first clamping unit and the second clamping portion of the second clamping unit can enclose a clamping space, in this way, the clamping space can clamp the headphone plug in different directions. Therefore, the stability of the headphone socket for fixing the headphone plug can be improved.

[0092] Figure 12 The possible structural schematic diagram of an electronic device provided in the embodiment of the present application is shown. As Figure 12 shown, the electronic device 50 includes the headphone socket 10 as described in the above embodiment.

[0093] Optionally, in the embodiments of the present application, the first terminal of the headphone socket 10 may be connected to the bracket (or the rear case) of the electronic device 50, thereby improving the stability of the first terminal.

[0094] The electronic device provided by the embodiments of the present application includes a headphone socket. Since the accommodation groove of the circuit board of the headphone socket and the end of the first terminal can enclose an accommodation space for accommodating the headphone plug, and the elastic member of the first terminal can apply an elastic restoring force to the headphone plug through the end of the first terminal to fix the headphone plug, without the need to provide a headphone seat body, therefore, the space inside the electronic device occupied by the headphone socket can be reduced, and thus, the size of the electronic device can be reduced.

[0095] It should be noted that in this article, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, article or device. Without more limitations, an element defined by the statement "including a..." does not exclude the presence of additional identical elements in the process, article or device including that element. In addition, it should be pointed out that the scope of the device in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in a reverse order according to the functions involved, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0096] The embodiments of the present application have been described above in conjunction with the accompanying drawings, but the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them belong to the protection scope of the present application.

Claims

1. A headphone socket, characterized in that, The headphone socket includes: a circuit board and a first terminal disposed on the circuit board; Wherein, a receiving groove is provided on the circuit board; the first terminal includes: a pin connected to the circuit board, an elastic member connected to the pin, and an end portion connected to the elastic member; The receiving groove and the end portion of the first terminal enclose a receiving space, and the receiving space can accommodate a headphone plug; when the headphone plug is located in the receiving space, the elastic member of the first terminal is in an elastically deformed state; The headphone socket further includes: a clamping structure disposed on the circuit board; Wherein, the clamping structure encloses a clamping space for clamping the headphone plug, and the clamping space is disposed at a first position of the receiving space; The first position includes any one of the following: a position at the notch of the receiving groove, a position at the bottom of the receiving groove, and a position between the notch and the bottom of the receiving groove.

2. The headphone socket according to claim 1, characterized in that, The first terminal includes a plurality of first sub-terminals, and the plurality of first sub-terminals are symmetrically disposed at positions on both sides of the circuit board where the receiving groove is located.

3. The headphone socket according to claim 1, characterized in that, Wherein, The pin is connected to the first surface of the circuit board; the first end of the elastic member is connected to the pin; the second end of the elastic member passes through the receiving groove and is connected to the end portion.

4. The headphone socket according to claim 1, characterized in that, The first terminal includes: a second sub-terminal and a third sub-terminal; Wherein, the second sub-terminal and the third sub-terminal are symmetrically disposed at positions on both sides of the circuit board where the receiving groove is located.

5. The headphone socket according to claim 4, characterized in that, The elastic member of the fourth sub-terminal includes: a first elastic member and a second elastic member; the end portion of the fourth sub-terminal is disposed on the second elastic member; Wherein, the pin of the fourth sub-terminal is connected to the first surface of the circuit board; the first elastic member is parallel to the first surface, the first end of the first elastic member is connected to the pin of the fourth sub-terminal, and the second end of the first elastic member is connected to the second elastic member; The second elastic member is parallel to the first elastic member; when the headphone plug is located in the receiving space, both the first elastic member and the second elastic member are in an elastically deformed state, and the second elastic member contacts the first elastic member; The fourth sub-terminal is: the second sub-terminal or the third sub-terminal.

6. The headphone socket according to claim 1, characterized in that, The clamping structure includes: a first clamping unit and a second clamping unit; Wherein, the first clamping unit includes: a first connecting portion and a first clamping portion; the second clamping unit includes: a second connecting portion and a second clamping portion; The first connecting portion is connected to the first surface of the circuit board, the second connecting portion is connected to the second surface of the circuit board, and the second surface is: the surface of the circuit board away from the first surface; The first clamping portion and the second clamping portion enclose the clamping space.

7. The headphone socket according to claim 6, characterized in that, The first clamping portion is bent along a first direction to form an arc surface, and the first direction is: the direction from the second surface to the first surface; The second clamping portion is bent along a second direction to form an arc surface, and the second direction is opposite to the first direction.

8. The headphone socket according to claim 1, characterized in that The earphone socket further includes: a second terminal disposed on the circuit board; Wherein, the accommodation groove, the end of the first terminal, and the second terminal enclose the accommodation space.

9. The headphone socket according to claim 8, characterized in that, The second terminal includes: a first pin and a third elastic member; Wherein, the first pin is connected to the first surface of the circuit board; the third elastic member is parallel to the first surface, and the third elastic member is connected to the first pin; When the earphone plug is located in the accommodation space, the third elastic member is in an elastically deformed state.

10. An electronic device, characterized in that, The electronic device includes the earphone socket according to any one of claims 1 to 9.

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