Method for manufacturing an evaporator device, evaporator device and inhaler, preferably an electronic cigarette product

Abstract

The present invention relates to a method for manufacturing an evaporator device (1) for an inhaler (10), preferably for an electronic cigarette product, having at least one electrical evaporator (60), at least one electrical circuit (105a, 105b) for supplying an electric current to the evaporator (60), and a carrier (4) for carrying the evaporator (60), the method comprising applying an electrically conductive adhesive (2) between the evaporator (60) and the carrier (4) in order to establish an electrical connection between the evaporator (60) and the circuit (105a, 105b), wherein an additional full heating step is carried out to achieve a eutectic connection between the evaporator (60) and the adhesive (2).

Description

Field of the Invention

[0001] The present invention relates to a method for manufacturing an evaporator device for an inhaler, preferably for an electronic cigarette product, having at least one electrical evaporator, at least one electrical circuit for supplying current to the evaporator, and a carrier for carrying the evaporator. The present invention also relates to an evaporator device and an inhaler, preferably an electronic cigarette product. Background Art

[0002] Conventional electronic cigarette products or inhalers are based on the wick coil technology (Docht-Wendel-Technologie). By capillary force, the liquid is transported from the liquid reservoir along the wick until the liquid is heated by an electrically heatable coil and then evaporated. The wick is used as a connection for conducting the liquid between the liquid reservoir and the heating coil used as an evaporator.

[0003] The disadvantage of the wick coil technology is that insufficient liquid supply leads to local overheating, which may generate harmful substances. This so-called "dry puff" needs to be avoided. In addition, such evaporator units are often non-sealed due to manufacturing conditions, so that the liquid may overflow in an undesirable manner, for example, via air intake and / or steam outlet.

[0004] To avoid the problems of the wick coil technology, a generic evaporator is used, which uses the technology disclosed in DE102017111119A1. Here, the liquid is transported from the liquid reservoir to the inlet side of the evaporator by capillary force by a wick structure. The evaporator evaporates the liquid and the evaporated liquid can be added to the air stream as steam and / or aerosol. The evaporator can be connected to an energy storage via an electrical circuit to supply electrical energy. However, the electrical and / or mechanical connection or contact of the evaporator on, for example, the electrical circuit and / or the carrier is not described in the cited prior art. Summary of the Invention

[0005] The object of the present invention is to provide an improved, especially high-temperature stable and as low-ohmic as possible evaporator contact.

[0006] The present invention solves this task by the following features: An electrically conductive adhesive is applied between the evaporator and the carrier in order to establish an electrical connection between the evaporator and the electrical circuit, wherein an additional full heating step is carried out to achieve a eutectic connection between the evaporator and the adhesive, wherein, before the additional full heating step, the adhesive is thermally hardened at a temperature in the range of at least 30 minutes and / or between 150 °C and 290 °C, the adhesive contains metal, and the adhesive contains a plastic-containing adhesive matrix.

[0007] According to the present invention, the method includes applying an electrically conductive adhesive between the evaporator and the carrier in order to establish an electrical connection between the evaporator and the electrical circuit, wherein an additional complete heating step (Ausheizschritt) is performed to form a eutectic connection between the evaporator and the adhesive. The present invention recognizes that the electrically conductive adhesive between the evaporator and the carrier not only supports or provides a mechanical coupling of the evaporator to the carrier in the case of thermal alternating stress, but also simultaneously establishes an electrical connection to the electrical circuit. Here, the electrically conductive adhesive enables an efficient manufacture of the evaporator device.

[0008] By means of the additional complete heating step according to the present invention, the adhesive achieves a eutectic connection in the contact area with the evaporator, which eutectic connection is lower-ohmic than the connection established only by adhesion and possible hardening. The eutectic connection between the evaporator and the adhesive is a connection in which the materials forming the evaporator and the adhesive form a eutectic alloy with each other. The resistance of the eutectic connection can be adjusted in a targeted manner via its composition, which enables a repeatable electrical connection of the evaporator to the electrical circuit (Heizerchipbondig). The complete heating step according to the present invention can in particular be added to the typical heating steps for hardening the adhesive.

[0009] Preferably, the additional complete heating step is performed at a temperature of at least 400 °C, preferably at least 550 °C, more preferably at least 700 °C, such that a eutectic connection can be reliably established, the eutectic point of which corresponds to a temperature that is higher than the temperature present during evaporation and at the same time is low enough that no components of the evaporator device are damaged during this complete heating step. In an embodiment having a silicon-containing evaporator and a silver-containing adhesive, the additional complete heating step is performed at a temperature of at least 800 °C, for example approximately 845 °C. The temperature corresponding to the eutectic point for forming the eutectic connection, which is used in the complete heating step, can be influenced by the metal layer applied to the evaporator.

[0010] Preferably, before the additional complete heating step, the adhesive is thermally hardened at a temperature of at least 30 minutes, preferably at least 60 minutes and / or in the range between 150 °C and 290 °C, so that the evaporator can be electrically connected to the electrical circuit or the electrical connection between the evaporator and the electrical circuit can be prepared before establishing the eutectic connection. This can in particular ensure the positioning of the evaporator before establishing the eutectic connection. In this way, the mechanical stress determined by the temperature conditions, which may arise between the evaporator, the carrier and / or the electrical circuit during the manufacture of the evaporator device, can be minimized. The temperature used for hardening can be clearly delimited according to the adhesive and / or the evaporator material and learned from advantageous embodiments with respect to the complete heating step.

[0011] The invention also relates to an evaporator device for an inhaler, preferably for an electronic cigarette product, comprising at least one electrical evaporator for evaporating a liquid supplied to the evaporator, at least one electrical circuit for supplying an electric current to the evaporator, and a carrier which holds the evaporator and in which or on which the electrical circuit is arranged.

[0012] According to the invention, an electrically conductive adhesive is provided between the evaporator and the carrier, the adhesive establishing an electrical connection between the evaporator and the electrical circuit. The adhesive provided between the evaporator and the carrier reduces the problem of mechanical stress determined by temperature conditions between the evaporator and the electrical circuit or the carrier, which may occur when the evaporator is heated to the operating temperature and cooled to room temperature due to the different coefficients of thermal expansion of the different materials on which the evaporator, the electrical circuit or the carrier are based.

[0013] According to the invention, a eutectic connection is formed between the evaporator and the adhesive. Thereby, the electrical connection between the evaporator and the electrical circuit is of low ohmic value, while the electrical contact between the evaporator and the electrical circuit through an adhesive without a eutectic connection may be of high ohmic value. The high ohmic contact resistance or transition resistance between the evaporator and the adhesive can be avoided by means of the eutectic connection. The eutectic connection is stable at high temperatures compared to the temperatures present in an electronic cigarette during liquid evaporation, since the temperature corresponding to the eutectic point of the eutectic connection is higher than the evaporation temperature of the liquid.

[0014] Advantageously, the adhesive contains a metal to provide an electrically conductive and cost-effective adhesive. In particular, silver is advantageous here. The silver-containing or metal-containing adhesive is temperature-stable, which is advantageous for applications with an evaporator, since the evaporator is heated during operation to evaporate the liquid. The metal and in particular silver promotes the formation of the eutectic connection and can be effectively provided and applied as an electrically conductive adhesive with a matrix of an adhesive containing in particular plastic.

[0015] Preferably, the eutectic connection has more than 50 weight percent, advantageously more than 65 weight percent, and even more advantageously more than 80 weight percent of metal, since the eutectic connection becomes lower in ohmic value with an increasing metal share. The eutectic connection can also include more than 95 weight percent of metal, for example, a eutectic connection composed of silver and silicon includes approximately 97 weight percent of silver, which means a particle number share of approximately 89% silver.

[0016] Preferably, the electrical circuit is at least partially composed of a conductive adhesive, thereby providing the carrier with an electrical circuit in an effective manner. In particular, the section of the electrical circuit facing the evaporator can be composed of a conductive adhesive, and in particular, the section facing away from the evaporator, which is provided for contacting external components such as an energy storage, can be composed of a material different from the conductive adhesive. Preferably, the section facing away from the evaporator can be composed of gold, copper, and / or other metals or alloys composed of them and is electrically conductively connected to the section of the electrical circuit composed of the adhesive and facing the evaporator. The carrier and / or in particular its surface can be pre-structured so that the adhesive for constructing the electrical circuit can be applied.

[0017] In an advantageous embodiment, an additional metal layer, such as an aluminum-based metal layer, is applied to the evaporator in the contact area between the evaporator and the electrical circuit, so that an electrical contact surface can be prepared for the evaporator, and this electrical contact surface can be particularly effectively connected to the electrical circuit in the contact area. The evaporator can, for example, basically comprise a doped silicon block, which has a metal layer on its surface. The metal layer can promote eutectic bonding and / or simplify the electrical contact and / or material mating contact between the evaporator and the adhesive and / or the electrical circuit. The application of the metal layer can be carried out by depositing the metal in the contact area onto the evaporator, which particularly comprises silicon.

[0018] Preferably, the carrier is composed of ceramic raw materials to thermally stably construct the carrier for holding the evaporator and / or possibly minimize the thermal coupling between the evaporator and the carrier. The ceramic carrier is chemically and mechanically stable with respect to the temperatures presented during the operation of the evaporator, such as up to 300 °C, and the thermal load changes occurring during the life cycle of the evaporator, such as approximately 200 to 100,000 times. The carrier is in contact with liquids and / or aerosols or vapors and must therefore be food-compatible or biocompatible, especially at the temperatures presented during evaporation, which can be promoted by the ceramic raw materials. The carrier can be made of a ceramic matrix at least in the area of the evaporator. Other sections of the carrier that do not hold and / or do not contact the evaporator can be made of other materials, such as plastics. Description of the Drawings

[0019] The present invention will be described in detail below with reference to preferred embodiments of the drawings, wherein:

[0020] Figure 1 A schematic diagram of an inhaler is shown;

[0021] Figure 2 A perspective sectional view through the evaporator reservoir unit is shown;

[0022] Figure 3 A schematic perspective view of the evaporator is shown;

[0023] Figure 4 Schematic perspective view showing an evaporator with a metal coating;

[0024] Figure 5 Schematic perspective view showing a carrier;

[0025] Figure 6 Schematic perspective view showing an evaporator device; and

[0026] Figure 7 Schematic perspective view showing a carrier in another embodiment of the present invention. Detailed Description

[0027] Figure 1 The inhaler 10 or the electronic cigarette product is schematically shown. The inhaler 10 includes a housing 11, and an air passage 30 or a chimney is provided between at least one air inlet opening 231 and an air outlet opening 24 at the mouth end 32 of the cigarette product 10 in the housing. The mouth end 32 of the inhaler 10 herein represents an end at which a consumer sucks in order to inhale, and thereby applies a negative pressure to the inhaler 10 and generates an air flow 34 in the air passage 30.

[0028] The inhaler 10 advantageously consists of a base member 16 and an evaporator cartridge unit 20, which includes an evaporator device 1 having an evaporator 60 and a liquid reservoir 18, and in particular can be configured in the form of a replaceable cartridge. The liquid reservoir 18 can be refilled by the user of the inhaler 10. The air inhaled through the air inlet opening 231 is guided in the air passage 30 towards at least one evaporator 60. The evaporator 60 is connected or connectable to the liquid reservoir 18 in which at least one liquid 50 is stored. For this purpose, a porous and / or capillary, liquid-conducting core structure 19 is advantageously arranged at the inlet side 61 of the evaporator 60.

[0029] The evaporator 60 evaporates the liquid 50, which is transported from the liquid reservoir 18 to the evaporator 60 by the wick structure 19 by means of capillary force, and adds the evaporated liquid as an aerosol / vapor to the air flow 34 at the outlet side 64.

[0030] The electronic cigarette 10 further includes an electrical energy storage 14 and an electronic control device 15. The energy storage 14 is generally arranged in the base member 16 and in particular can be an electrochemical disposable battery or a rechargeable electrochemical accumulator, such as a lithium-ion battery. The evaporator cartridge unit 20 is arranged between the energy storage 14 and the mouth end 32. In the base member 16 (as Figure 1 shown) and / or in the evaporator cartridge unit 20, the electronic control device 15 includes at least one digital data processing device, in particular a microprocessor and / or a microcontroller.

[0031] A sensor, such as a pressure sensor, a pressure switch, or a fluid switch, is advantageously arranged in the housing 11. The control device 15 can determine, based on the sensor signal given by the sensor, that the consumer sucks at the mouth end 32 of the cigarette product 10 for inhalation. In this case, the control device 15 controls the evaporator 60 so that the liquid 50 is added to the air stream 34 as an aerosol / vapor from the liquid reservoir 18.

[0032] At least one evaporator 60 is arranged in a part of the evaporator reservoir unit 20 facing away from the mouth end 32. Thus, effective electrical coupling and control of the evaporator 60 can be achieved, especially with the base component 16. The air stream 34 is advantageously guided to the air outlet opening 24 through an air passage 30 that axially passes through the liquid reservoir 18.

[0033] The liquid 50 to be metered and dispensed stored in the liquid reservoir 18 is a mixture, for example, composed of 1,2 - propylene glycol, glycerol, water, and preferably at least one flavoring agent (Flavour) and / or at least one active substance, especially nicotine. However, the given composition of the liquid 50 is not mandatory. In particular, the flavoring agent and / or the active substance, especially nicotine, can be dispensed with.

[0034] In Figure 2 A perspective cross - section through a schematic evaporator reservoir unit 20 is shown. The evaporator reservoir unit 20 includes a massive, preferably monolithic heating body, or an evaporator 60 preferably made of an electrically conductive material, especially a semiconductor material, preferably silicon. It is not necessary for the entire evaporator 60 to be made of an electrically conductive material. For example, it is sufficient if the surface of the evaporator 60 is electrically or metallically coated or preferably appropriately doped. In this case, it is not necessary to coat the entire surface. For example, a metallic, or preferably non - metallic, or non - metallic laminated metallic conductor circuit can be provided on a non - conductive or semi - conductive substrate. It is also not mandatory for the entire evaporator 60 to generate heat; for example, it is sufficient if a section of the evaporator 60 or a heating layer generates heat in the region of the discharge side 64. The evaporator 60 is heated by electrical energy by means of its resistance and can thus be referred to as a resistance heater.

[0035] The evaporator 60 is advantageously equipped with a plurality of micro - channels or liquid channels 62 that conductively connect the inlet side 61 of the evaporator 60 to the outlet side 64 of the evaporator 60 for liquid.

[0036] The average diameter of the liquid channels 62 is preferably in the range between 5 μm and 200 μm, more preferably in the range between 30 μm and 150 μm, and even more preferably in the range between 50 μm and 100 μm. Capillary action advantageously occurs based on this dimension, such that the liquid infiltrating into the liquid channels 62 at the inlet side 61 rises through the liquid channels 62 until the liquid channels 62 are filled with liquid. The number of liquid channels 62 is preferably in the range between four and 1000. In this way, the heat input into the liquid channels 62 can be optimized and a reliable, high evaporation power and a sufficiently large vapor discharge area can be achieved.

[0037] The liquid channels 62 are advantageously arranged in an array. The array can be configured in the form of a matrix having s columns and z rows, where s is advantageously in the range between 2 and 50, more advantageously in the range between 3 and 30, and / or z is advantageously in the range between 2 and 50, more advantageously in the range between 3 and 30. In this way, an effective and simply established arrangement of the liquid channels 62 with a reliably high evaporation efficiency can be achieved.

[0038] The evaporator tank unit 20 includes a carrier 4 having a through-opening 104 for conductively connecting the evaporator 60 and the liquid reservoir 18. The carrier 4 and the evaporator 60 are components of the evaporator device 1, which realizes the electrical and mechanical connection of the evaporator 60. To supply the liquid 50 to the evaporator 60, a core structure 19 is arranged in the through-opening 104.

[0039] The inlet side 61 of the evaporator 60 is conductively connected to the liquid reservoir 18 via the core structure 19. The core structure 19 is used to passively transport the liquid 50 from the liquid reservoir 18 to the evaporator 60 by means of capillary force. The core structure 19 advantageously contacts the inlet side 61 of the evaporator 60 in a planar manner and covers all the liquid channels 62 of the evaporator 60 at the inlet side. On the side opposite to the evaporator 60, the core structure 19 is conductively connected to the liquid reservoir 18.

[0040] The advantageous volume of the liquid reservoir 18 is in the range between 0.1 ml and 5 ml, preferably between 0.5 ml and 3 ml, and more preferably between 0.7 ml and 2 ml or 1.5 ml.

[0041] The evaporator reservoir unit 20 is preferably connected and / or connectable to a heating voltage source 71 that can be controlled by the control device 15. The heating voltage source is connected to the evaporator at the contact areas 131 at the opposite edge sections of the evaporator 60 via electrical lines 105a, 105b, such that the voltage Uh generated by the heating voltage source 71 induces a current through the evaporator 60. Based on the ohmic resistance of the electrically conductive evaporator 60, the current causes the evaporator 60 to heat up and thus causes the liquid contained in the liquid channel 62 to evaporate. The vapor / aerosol generated in this way escapes from the liquid channel 62 to the outlet side 64 and mixes with the air flow 34. When it is determined that there is an air flow 34 through the air channel 30 caused by the consumer's puffing, the control device 15 more precisely controls the heating voltage source 71, where the liquid located in the liquid channel 62 is expelled from the liquid channel 62 in the form of vapor / aerosol by spontaneous heating.

[0042] The evaporation temperature is preferably in the range between 100 °C and 400 °C, more preferably between 150 °C and 350 °C, and even more preferably between 190 °C and 290 °C.

[0043] Advantageously, the evaporator 60 can be made of wafer segments using thin-film layer technology. The wafer has a layer thickness that is preferably less than or equal to 1000 μm, more preferably 750 μm, and even more preferably less than or equal to 500 μm. Advantageously, the surface of the evaporator 60 can be hydrophilic.

[0044] The evaporator reservoir unit 20 is arranged such that, for each puff of the consumer, a metered amount of liquid in the range between preferably 1 μl and 20 μl, more preferably between 2 μl and 10 μl, and even more preferably between 3 μl and 5 μl, typically 4 μl, is dispensed. Preferably, the evaporator reservoir unit can be adjusted with respect to the liquid amount / vapor amount per puff, i.e., the liquid amount / vapor amount for a puff duration of every 1 s to 3 s.

[0045] Advantageously, the operating frequency of the evaporator 60 generated by the heating voltage source 71 is generally in the range between 1 Hz and 50 kHz, preferably between 30 Hz and 30 kHz, and even more advantageously between 100 Hz and 25 kHz.

[0046] Preferably, the evaporator 60 is based on MEMS technology, especially made of silicon and thus advantageously is a microelectromechanical system.

[0047] Figure 3A schematic perspective view of the evaporator 60 is shown. The evaporator 60 has an inlet side 61 and an outlet side 64. A plurality of liquid channels 62 extend between the inlet side 61 and the outlet side 64. Advantageously, the liquid channels 62 are arranged between spaced-apart edge sections of the evaporator 60, in which contact areas 131 are provided for electrically contacting and / or mechanically contacting the evaporator 60 in particular. The evaporator 60 is block-shaped or square and the liquid channels 62 are in turn arranged between two contact areas 131, which are provided on one of the sides of the square evaporator 60 and form edge sections. The contact areas 131 are provided on the inlet side 61 in the edge sections in this example. Thereby, the evaporator 60 can be connected to the carrier 4 on the inlet side 61 and / or an electrical connection can be established with the electrical lines 105a, 105b. In other embodiments, however, the contact areas 131 can also be provided on other sides of the evaporator 60, in particular on the outlet side 64 opposite the inlet side 61 in this example. It is also conceivable to provide the contact areas 131 on one or more sides perpendicular to the inlet side 61 and / or the outlet side 64.

[0048] Figure 4 A schematic perspective view of the evaporator 60 with a metal coating 133 is shown. Figure 4 The embodiment shown in view of Figure 3 The embodiment shown is explained. In the contact area 131, the evaporator has a metal layer 133 to improve the connection with Figure 4 the adhesive 2 not shown in the figure, increase the electrical conductivity of the contact area 131 and / or facilitate the eutectic connection to be formed in subsequent process steps. The metal layer 133 can be deposited on the surface of the evaporator 60 during the manufacturing process. Thereby, the electrical connection between the evaporator 60 and the electrical lines 105a, 105b can be established more reproducibly with lower ohms and more effectively.

[0049] Figure 5 A schematic perspective view of the carrier 4 is shown. The electrical lines 105a, 105b are arranged on the carrier 4. The electrical lines 105a, 105b are arranged such that the evaporator 60 is connected to the electrical lines 105a, 105b in the contact area 131 in the installed state. In this embodiment, the electrical lines 105a, 105b are arranged on the carrier 4. In other embodiments, the electrical lines 105a, 105b can also at least partially run inside the carrier 4, wherein the electrical lines 105a, 105b must be arranged at the surface of the carrier 4 in the section provided for contacting the evaporator 60.

[0050] In Figure 5In the example shown, an adhesive 2 is applied to both electrical lines 105a, 105b. The electrical lines 105a, 105b are arranged on the surface of the carrier 4 in this example. Thereby, the adhesive 2 is arranged between the carrier 4 and the evaporator 60 in the installed state (see Figure 6 ). The adhesive 2 is arranged on the electrical lines 105a, 105b such that the evaporator 60 can be connected to the electrical lines 105a, 105b via the adhesive 2 in the contact area 131. The spacing between these positions where the adhesive 2 is applied on the carrier 4 corresponds to the spacing of the contact area 131 of the evaporator 60.

[0051] In this embodiment, a through-opening 104 is provided between the electrical lines 105a, 105b and especially between them and the carrier 4, which enables the inlet side 61 of the evaporator 60, in particular, to be conductively contacted by the core structure 19.

[0052] The adhesive can especially be a silver-filled, one-component polyimide adhesive, for example of the type Panacol Ecolite 237. However, adhesives with other plastics and filled with other metals are also conceivable.

[0053] The electrical lines 105a, 105b can be applied to the carrier 4 or the carrier 4 can be arranged to already have the electrical lines 105a, 105b pre-structured on the carrier 4. The advantageously pre-structured electrical lines 105a, 105b can consist of different materials or a layered combination of different materials, making them temperature-stable, inert, wire-bondable, and / or solderable. Electrical lines 105a, 105b made of gold are preferably used.

[0054] Especially in the region of the through-opening 104 and / or in the section of the carrier 4 that contacts the evaporator 60 or is heated by the evaporator 60 during operation, the carrier 4 can be made of a ceramic matrix.

[0055] Figure 6 A schematic perspective view of the evaporator device 1 is shown, including the carrier 4 as described with respect to Figure 5 and the evaporator 60 as described with respect to Figure 3 or 4.

[0056] The electrical lines 105a, 105b are conductively connected to the evaporator 60 via the electrically conductive adhesive 2.

[0057] An additional full heating step achieves a eutectic connection for a low-ohmic electrical connection between the evaporator 60 and the electrical lines 105a, 105b.

[0058] For example, a silicon-containing evaporator 60 and a silver-containing adhesive 2 are provided. It is known to those skilled in the art that silver and silicon have a phase diagram that has a eutectic point at a temperature of approximately 845 °C and a silver content of approximately 89 atomic percent or 89 particle number percent, which corresponds to an approximately 97 weight percent silver content. Therefore, an additional full heating step must heat the adhesive 2 to a temperature corresponding to the eutectic point to establish a eutectic connection between the evaporator 60 and the adhesive 2.

[0059] Figure 7 A schematic perspective view of the carrier 4 is shown in another embodiment of the invention, wherein the electrical lines 105a, 105b are partially formed by the conductive adhesive 2. The carrier 4 can be pre-structured in such a way that the carrier 4 has one or more recesses 107, and the adhesive 4 for constructing the electrical lines 105a, 105b can be applied in these recesses. The recesses 107 are filled with the adhesive 2 and then the evaporator 60 can be placed on the adhesive 2. The recesses 107 can facilitate the retention of the evaporator 60. The adhesive 2 in the recesses 107 forms the sections of the electrical lines 105a, 105b that contact the evaporator 60 and are conductively connected to the sections of the electrical lines 105a, 105b that face away from or do not contact the evaporator 60. The sections of the electrical lines 105a, 105b that do not contact the evaporator 60 can protrude from the carrier 4, for example, to provide contacts and / or plugs (not shown) for the electrical connection of the evaporator device 1 to external parts.

[0060] The pre-structuring of the carrier 4 can include surface treatment in other embodiments, such that the adhesive 2 achieves a better connection with the carrier 4 and / or the electrical lines 105a, 105b. In this embodiment, the recesses 107 are not necessary.

[0061] Reference numerals

[0062] 1 Evaporator device

[0063] 2 Adhesive

[0064] 4 Carrier

[0065] 10 Inhaler

[0066] 11 Housing

[0067] 14 Energy storage

[0068] 15 Control device

[0069] 16 Base component

[0070] 18 Liquid storage

[0071] 19 Core structure

[0072] 20 Evaporator tank unit

[0073] 24 Air outlet opening

[0074] 30 Air passage

[0075] 32 Mouth end

[0076] 34 Air flow

[0077] 50 Liquid

[0078] 60 Evaporator

[0079] 61 Inlet side

[0080] 62 Liquid passage

[0081] 64 Outlet side

[0082] 71 Heating voltage source

[0083] 104 Through-opening

[0084] 105a, 105b Electric circuit lines

[0085] 107 Depression

[0086] 131 Contact area

[0087] 133 Metal layer

[0088] 231 Air inlet opening

Claims

1. A method for manufacturing an evaporator device (1) for an inhaler (10), the evaporator device having at least one silicon-containing evaporator (60), at least one electrical circuit (105a, 105b) for supplying an electric current to the evaporator (60), and a carrier (4) for carrying the evaporator (60). Characterized in that an electrically conductive adhesive (2) is applied between the evaporator (60) and the carrier (4) to establish an electrical connection between the evaporator (60) and the electrical circuit (105a, 105b), wherein an additional full heating step is performed to achieve a eutectic connection between the evaporator (60) and the adhesive (2), wherein, prior to the additional full heating step, the adhesive (2) is thermally hardened at a temperature in the range of at least 30 minutes and / or between 150 °C and 290 °C. the adhesive (2) contains a metal the adhesive (2) contains a plastic-containing adhesive matrix.

2. The method according to claim 1 Characterized in that the additional full heating step is performed at a temperature of at least 400 °C.

3. The method according to any one of the preceding claims Characterized in that prior to the additional full heating step, the adhesive (2) is thermally hardened for at least 60 minutes.

4. The method according to claim 1 Characterized in that the inhaler (10) is an electronic cigarette product.

5. The method according to claim 2 Characterized in that the additional full heating step is performed at a temperature of at least 550 °C.

6. The method according to claim 2 Characterized in that the additional full heating step is performed at a temperature of at least 700 °C.

7. An evaporator device (1) for an inhaler (10) comprising at least one silicon-containing evaporator (60) for evaporating a liquid (50) supplied to the evaporator (60), at least one electrical circuit (105a, 105b) for supplying an electric current to the evaporator (60), and a carrier (4) that holds the evaporator (60) and in which or on which the electrical circuit (105a, 105b) is arranged, Characterized in that an electrically conductive adhesive (2) is provided between the evaporator (60) and the carrier (4), the adhesive establishing an electrical connection between the evaporator (60) and the electrical circuit (105a, 105b), wherein the electrical circuit (105a, 105b) is at least partially constituted by the electrically conductive adhesive (2), wherein a eutectic connection is formed between the evaporator (60) and the adhesive (2), the adhesive (2) contains a metal the adhesive (2) contains a plastic-containing adhesive matrix.

8. The evaporator device (1) according to claim 7 Characterized in that the adhesive (2) contains silver.

9. The evaporator device (1) according to claim 7 or 8 Characterized in that The eutectic joint has more than 50 weight percent of metal.

10. The evaporator device (1) according to claim 7, wherein, the inhaler (10) is an electronic cigarette product.

11. The evaporator device (1) according to claim 7 or 8, wherein, an additional metal layer (133) is applied to the evaporator (60) in a contact area (131) between the evaporator (60) and the electrical lines (105a, 105b).

12. The evaporator device (1) according to claim 7 or 8, wherein, the carrier (4) is made of ceramic raw materials.

13. The evaporator device (1) according to claim 9, wherein, the eutectic joint has more than 65 weight percent of metal.

14. The evaporator device (1) according to claim 9, wherein, the eutectic joint has more than 80 weight percent of metal.

15. The evaporator device (1) according to claim 11, wherein, an additional aluminum-based metal layer (133) is applied to the evaporator (60) in a contact area (131) between the evaporator (60) and the electrical lines (105a, 105b).

16. An inhaler (10) comprising the evaporator device (1) according to any one of claims 7 to 15.

17. The inhaler (10) according to claim 16, wherein, the inhaler (10) is an electronic cigarette product.

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